KR20090013366A - 연마패드용 컨디셔닝 디스크 - Google Patents
연마패드용 컨디셔닝 디스크 Download PDFInfo
- Publication number
- KR20090013366A KR20090013366A KR1020070077425A KR20070077425A KR20090013366A KR 20090013366 A KR20090013366 A KR 20090013366A KR 1020070077425 A KR1020070077425 A KR 1020070077425A KR 20070077425 A KR20070077425 A KR 20070077425A KR 20090013366 A KR20090013366 A KR 20090013366A
- Authority
- KR
- South Korea
- Prior art keywords
- disk
- conditioning
- polishing
- cutting
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 70
- 230000003750 conditioning effect Effects 0.000 title claims abstract description 58
- 238000005520 cutting process Methods 0.000 claims abstract description 46
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 18
- 239000010432 diamond Substances 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 229910052582 BN Inorganic materials 0.000 claims abstract description 10
- -1 boron nitride compound Chemical class 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 150000002222 fluorine compounds Chemical class 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical class N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- 239000011858 nanopowder Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (11)
- 디스크 몸체와, 상기 디스크 몸체의 일면에 돌출된 다수의 절삭돌기를 포함하는 연마패드용 컨디셔닝 디스크에 있어서,세라믹, 다이아몬드 및 질화붕소화합물의 나노 분말이 소결되어 이루어진 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항에 있어서,상기 세라믹이 산화알루미늄(Al2O3), 지르코니아(ZrO2), 텅스텐카바이드(WC) 및 실리콘카바이드(SiC)로 이루어지는 군에서 선택되는 하나 이상인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,절삭돌기 표면을 코팅하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 3 항에 있어서,상기 코팅이 세라믹, 테프론 또는 불소화합물에 의해 이루어지는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,상기 절삭돌기가 다각뿔형상인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,상기 절삭돌기가, 폭이 큰 다각뿔대 부분과 상기 다각뿔대 부분 위에 놓인 폭이 작은 다각뿔 형상으로 이루어지는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,상기 절삭돌기가 돌출된 디스크 몸체의 일면에 복수의 이물질 배출홈이 방사형으로 형성되는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 2 항에 있어서,상기 세라믹을 700-3,000℃ 정도의 온도에서 소결하여 제조되는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,상기 다이아몬드 또는 질화붕소화합물이 10㎛ 이하의 분말로서 함유되는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 1 항 또는 제 2 항에 있어서,디스크 중심에서부터 디스크 외주까지 연장되는 돌출부가 디스크 표면에 형성되어 있는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
- 제 10 항에 있어서,상기 돌출부의 높이가 절삭돌기의 높이보다 낮은 것을 특징으로 하는 연마패드용 컨디셔닝 디스크.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070077425A KR20090013366A (ko) | 2007-08-01 | 2007-08-01 | 연마패드용 컨디셔닝 디스크 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070077425A KR20090013366A (ko) | 2007-08-01 | 2007-08-01 | 연마패드용 컨디셔닝 디스크 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090013366A true KR20090013366A (ko) | 2009-02-05 |
Family
ID=40683817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070077425A Ceased KR20090013366A (ko) | 2007-08-01 | 2007-08-01 | 연마패드용 컨디셔닝 디스크 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20090013366A (ko) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011028700A3 (en) * | 2009-09-01 | 2011-05-26 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
KR101236163B1 (ko) * | 2012-07-23 | 2013-02-22 | 주식회사 제우스 | 패드 컨디셔닝 디스크, 패드 컨디셔너, 패드 컨디셔닝 방법 |
CN104029125A (zh) * | 2013-03-08 | 2014-09-10 | 鑫晶钻科技股份有限公司 | 蓝宝石抛光垫修整器及其制造方法 |
US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
US9022840B2 (en) | 2009-03-24 | 2015-05-05 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
EP3313614A4 (en) * | 2015-06-25 | 2019-05-15 | 3M Innovative Properties Company | GLASS-BONDED GRINDING AND METHOD OF MANUFACTURING THEREOF |
-
2007
- 2007-08-01 KR KR1020070077425A patent/KR20090013366A/ko not_active Ceased
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9022840B2 (en) | 2009-03-24 | 2015-05-05 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
WO2011028700A3 (en) * | 2009-09-01 | 2011-05-26 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
CN102612734A (zh) * | 2009-09-01 | 2012-07-25 | 圣戈班磨料磨具有限公司 | 化学机械抛光修整器 |
US8951099B2 (en) | 2009-09-01 | 2015-02-10 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
KR101236163B1 (ko) * | 2012-07-23 | 2013-02-22 | 주식회사 제우스 | 패드 컨디셔닝 디스크, 패드 컨디셔너, 패드 컨디셔닝 방법 |
CN104029125A (zh) * | 2013-03-08 | 2014-09-10 | 鑫晶钻科技股份有限公司 | 蓝宝石抛光垫修整器及其制造方法 |
EP3313614A4 (en) * | 2015-06-25 | 2019-05-15 | 3M Innovative Properties Company | GLASS-BONDED GRINDING AND METHOD OF MANUFACTURING THEREOF |
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