KR20070092619A - Tape polishing method and apparatus - Google Patents

Abstract

A method for grinding a tape, and a device thereof are provided to adjust the force exerting on a projection unit by a head pin, adequately and to process the projection unit with high accuracy by limiting the variation of the force on exerted on the projection unit. A device for grinding a tape comprises a head pin, a tape grinding unit, a measuring unit, and a control unit. The front end portion of the head pin contacts with the other surface of the tape and moves along the vertical coordinate shaft of a substrate surface. The tape grinding unit is installed to grind a projection unit(22) by the surface of the grinding tape. The measuring unit is installed to measure the height of the projection unit. The control unit is installed to divide the height of the projection unit into the process range over two step and to vary the force exerting on the projection unit.

Description

Tape polishing method and apparatus

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows the whole structure of the tape grinding | polishing apparatus by embodiment of this invention.

FIG. 2 is a cross-sectional view showing the configuration of a polishing head included in the tape polishing unit shown in FIG. 1. FIG.

Fig. 3 is a perspective view showing the structure of the back glass substrate of the plasma display panel and the protrusions formed on the ribs.

4 is a schematic diagram showing the relationship between the Z coordinate perpendicular to the surface of the substrate and the force that the head pin presses the protrusions.

5 is a flowchart illustrating the entire tape polishing method.

6 is a flowchart for explaining protrusion height measurement process.

7 is a flowchart for explaining a rough polishing process.

8 is a flowchart for explaining a machining surface height measuring process after rough polishing;

9 is a flowchart for explaining a projection finish polishing step.

10 is a schematic diagram showing the position and operation of the head pin tip with respect to the protrusion on the substrate surface.

The schematic diagram which shows the structure and operation | movement of an inclination-angle adjustment member.

(Explanation of symbols for the main parts of the drawing)

1: substrate 2: XY table

3: Z table 4: observation optical system

5: tape polishing unit 6: monitor

7 controller 8 cutting powder discharge mechanism

9: polishing tape 10: head pin

11: sliding member 12: head case

13: air supply 14: exhaust

15: lid member 16: connecting rod

17: displacement sensor 18: air supply

19: substrate 20: rib

21: normal top surface 22: protrusion

23: rough polishing range 24: finish polishing range

25: Motion to detect Z coordinate of normal top surface

26: Z coordinate of normal top surface

27: projection vertex 28: operation of detecting the Z coordinate of the projection vertex

29: Z coordinate of protrusion vertex

Z coordinate of the position away from the substrate by a predetermined distance (h) along the Z direction from the projection apex,

3l: the operation of sending the tape polishing unit quickly,

32: operation of polishing the protrusions

33: Motion to detect Z coordinate of machining surface after finishing polishing

34: Z coordinate of the machining surface after finishing polishing

35: Z coordinate of the position away from the substrate by a predetermined distance (h) along the Z direction from the machining surface after finishing polishing

36: recording or fast forwarding of the tape polishing unit

37: operation to finish polishing the projection

38: supply reel 39: reel reel

40a, 40b: secondary reel 41a, 41b: nut

42a, 42b: adjusting screw 43: adjusting shaft

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a tape polishing method and apparatus, and more particularly, to a tape polishing method and apparatus for processing a projection on a substrate surface using an abrasive tape.

(Background technology)

DESCRIPTION OF RELATED ART Conventionally, the method of correct | amending the protrusion part which arises on the surface of a color filter by adhesion of a foreign material in a manufacturing process by tape grinding | polishing is disclosed (for example, refer patent document 1).

In this correction method, the air microsensor is attached to the tape polishing unit, the tape polishing unit is lowered from above, and the air microsensor is brought into contact with the top surface of the color filter surface in contact with the surface of the polishing tape bonded to the tip of the head pin. Measure the distance a between the sensor and the color filter surface. Next, the distance b between the air microsensor and the color filter surface is measured in a state where the position of the tape polishing unit is changed and the surface of the polishing tape is positioned near the projection apex. The height of the projection is calculated by b-a, and the polishing tape is pressed against the projection to polish based on the height of the projection.

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-234660

The shape of the projection formed on the surface of the substrate is generally in the shape of a mountain, and the cross-sectional area parallel to the substrate surface of the projection is small at its apex and increases as it approaches the top face of the top of the substrate surface. For this reason, when processing a projection part using an abrasive tape, when a head pin makes grinding with the force which presses a projection part constant through an abrasive tape, since a cross-sectional area is small in a projection part vertex, it is per unit area applied to a projection part. The force to pressurize becomes large. For this reason, problems such as collapse of the apex of the protrusion, crack generation to the surface of the substrate due to stress concentration in the vicinity of the protrusion, and so on, adversely affect the processing accuracy. In addition, the closer to the normal top surface, the larger the cross-sectional area, and therefore, the pressing force per unit area applied to the protrusions becomes smaller. As a result, the polishing efficiency is lowered.

In addition, when the gap between the table surface on which the substrate is placed and the door between the substrate is generated due to deformation of the substrate to be processed or the like, elastic deformation occurs on the substrate due to the pressing portion of the head pin during polishing. Unevenness occurs in the normal top surface and the processing surface, and it is difficult to process the protrusions with high precision.

Therefore, the main object of this invention is to provide the tape grinding | polishing method and apparatus which can perform the grinding | polishing process of the processus | protrusion of the surface of a board | substrate with high precision and efficiently.

(Means to solve the task)

A tape polishing apparatus according to the present invention is a tape polishing apparatus for processing a projection on a substrate surface using an abrasive tape, and includes a tape polishing unit, a measuring mechanism, and a control means. The tape polishing unit includes a head pin that is attached to the rear surface of the polishing tape and movable along a coordinate axis perpendicular to the substrate surface, and the projection is polished by the surface of the polishing tape. The measuring mechanism measures the height of the projection. The control means divides the height of the projection part into two or more steps of processing ranges, and makes the variable force of the head pin pressing the projection parts through the polishing tape for each processing range.

In this case, the projections are adjusted more than the case where the head pin presses the projections through the polishing tape to an optimal force in accordance with the respective processing range, and the pressures applied in the entire range of the projection height direction are the same. The fluctuation | variation of the pressurizing force per unit area applied to can be suppressed small. Therefore, the processing precision of a projection part can be raised.

Preferably, the control means maintains the pressing force in one processing range at a constant set value, and makes the setting value of the pressing force for each processing range variable. In this case, it is good to change the setting value of the force which a head pin presses a projection part through each grinding | polishing tape for each processing range, and adjustment of the pressing force per unit area applied to a projection part can be implement | achieved easily. Therefore, the control can be simplified, and further, the manufacturing cost of the device can be reduced.

Further, preferably, the control means sets the value of the force to be pressed in the processing range including the position of the projection apex so as to be smaller than the value of the force to be pressed in the processing range including the position of the top surface that is normal to the substrate surface. In this case, since the pressing force per unit area applied to the protrusion is prevented from becoming extremely large as the apex of the protrusion, problems such as collapse of the apex and cracking of the substrate surface due to stress concentration near the protrusion are caused. The protrusions can be processed with high accuracy without generating. Moreover, in the processing range including the position of the top surface which is the top of a board | substrate surface, the grinding | polishing efficiency can be improved by increasing the force to press according to increase of a cross-sectional area.

Also preferably, the control means controls at least one of the elastic body and the compressed gas to control the pressing force. In this case, it can adjust with the optimal press force according to the material, hardness, etc. of a projection part. Moreover, by the elastic force of an elastic body or a compressed gas, the impact which arises at the time of a contact of a head pin and a board | substrate can be absorbed, and it can prevent that a head pin and a board | substrate are destroyed.

Moreover, preferably a measuring mechanism is a sensor which can detect that a head pin moves in the direction which falls away from a board | substrate, or receives the force of the direction which falls from a board | substrate according to the said coordinate axis rather than the reference position of a polishing head. In this case, by detecting the movement of the head pin or the force applied to the head pin with the sensor, it is possible to measure the height when the polishing tape actually processed contacts the substrate surface. Therefore, the height measurement of the surface of a board | substrate can be performed correctly.

Further preferably, the control means moves the tape polishing unit toward the top surface of the substrate surface normal, and the head pin moves in the direction away from the substrate and starts or moves away from the substrate according to the coordinate axis rather than the reference position of the polishing head. When using the sensor to detect the start of reception of the sensor and setting the coordinates in the coordinate axis direction of the normal saw surface based on the detection result, the force of the head pin pressing the normal saw surface through the polishing tape and the polishing tape on the normal saw surface While the protrusions are polished using, the head pin is set to the same set value of the force that presses the protrusions through the polishing tape. In this case, since the amount of elastic deformation of the substrate can be made the same as when the coordinates of the normal top surface are detected and when the finish is polished, the machining surface at the end of polishing can be accurately provided on the normal top surface.

Further, preferably, the recording tape polishing apparatus includes an inclination angle adjustment member for adjusting the inclination angle with respect to the substrate surface of the cross section facing the substrate surface of the head pin. In this case, the inclination angle of the head pin can be finely adjusted so that the cross section facing the substrate surface of the head pin is parallel to the substrate surface. If the cross section of the head pin is made to be perpendicular to the sliding member outer surface provided coaxial with the head pin, the head pin becomes perpendicular to the substrate when the head pin cross section is angled in parallel to the substrate. Therefore, it is possible to measure the high accuracy of the load at the time of processing, and to prevent the polishing tape pressed by the inclined head pin from polishing to the top surface of the substrate, which is normal. It can be realized. When the height of the projection is measured by detecting the movement of the head pin or the force applied to the head pin by setting the coordinates of the normal top surface and the projection vertex, the coordinates of the normal top surface and the projection vertex are more accurate. Can be detected. Therefore, the height of the projection can be measured more accurately.

Moreover, preferably, the head pin has a tip of a diameter equal to or greater than the maximum length of the protrusion. In this case, when the projection is polished, by moving the head pin toward the projection only once, all the projections can be processed, so that the time required for polishing can be shortened and the polishing efficiency can be improved. In addition, when detecting the movement of the head pin or the force applied to the head pin by setting the coordinates of the projection vertex, the projection vertex always comes into contact with the end face of the head pin when the tape polishing unit is moved toward the projection. In this case, the projection peak can be detected more accurately.

The tape grinding | polishing method which concerns on this invention is a tape grinding | polishing method of processing the processus | protrusion part of a board | substrate surface using an abrasive tape, Comprising: The process of measuring the height of a processus | protrusion part, and the processus | protrusion part using an abrasive tape based on the height of the measured processus | protrusion part A process to process is provided. In the process of processing, the height of the projection part is divided into two or more steps of processing ranges, and for each processing range, the head pin is attached to the back surface of the polishing tape and provided to be movable along a coordinate axis perpendicular to the substrate surface. The force which presses a projection part through an abrasive tape is made variable.

In this case, than the case where the head pin adjusts the force which presses the protrusion part through the polishing tape to an optimal force according to each processing range, and makes the force which presses in the whole range of the height direction of a protrusion part equal, The fluctuation | variation of the pressing force per unit area applied to a projection part can be suppressed small. Therefore, the processing precision of a projection part can be raised.

Preferably, the step of processing includes a moving step and a polishing step. The moving step means that the tape polishing unit including the head pin and polishing the protrusion by the surface of the polishing tape reaches the tip portion of the head pin from a vertex of the protrusion to a position in which the predetermined distance is separated from the substrate by the coordinate axis. , Moving toward the protrusion along the coordinate axis. The polishing step is a step of moving the tape polishing unit further toward the substrate surface along the coordinate axis after the moving step to polish the protrusions using the polishing tape. And the movement speed of a tape polishing unit in a movement process is larger than the movement speed of a tape polishing unit in a polishing process. In this case, since the tape polishing unit can be quickly approached by the projection, it is possible to prevent waste of the consumed tape and to shorten the processing time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the whole structure of the tape grinding | polishing apparatus by one Embodiment of this invention. In FIG. 1, the tape polishing apparatus includes a substrate 1 serving as a processing target, mounted on the surface thereof, and moving in the XY direction parallel to the surface of the substrate 1. Z table 3 moving in the Z direction perpendicular to the surface of

The Z table 3 is provided with the observation optical system 4 which observes the surface of the board | substrate 1, and the tape polishing unit 5 which processes the protrusion part of the board | substrate surface. The tape polishing unit 5 is positioned at an arbitrary position relative to the substrate 1 by the movement of the XY table 2 and the Z table 3.

The tape polishing apparatus further includes a monitor 6 for displaying an observation image by the observation optical system 4, a controller 7 as a control means for controlling the movement of the entire apparatus, and cutting powder generated during polishing. And a cutting powder discharging mechanism 8 for discharging the same.

2 is a cross-sectional view showing the configuration of a polishing head included in the tape polishing unit 5. In FIG. 2, this polishing head is provided coaxially with the head pin 10 and the head pin 10 provided so that the front end portion is joined to the back surface of the polishing tape 9 and movable in the Z direction, and the head is centered on the bottom surface. The sliding member 11 which the upper end of the pin 10 is fixed to, and the head part case 12 which supports the sliding member 11 are provided. The sliding member 11 is accommodated in Kawabe of the head case 12. The groove bottom is formed on a cylinder so as to guide the sliding member 11 in the Z direction. A through hole is formed in the center of the bottom of the head case 12, and the tip end of the head pin 10 protrudes out of the head case 12 through the through hole.

The air supply passage 13 and the exhaust passage 14 are formed in the head case 12. The compressed air is supplied to the outer circumferential surface of the sliding member 11 via the air supply passage 13 and a plurality of small holes provided in the inner circumferential surface of the head case l2, and is formed above the outer circumferential surface of the sliding member 11. It exhausts via the groove | channel and the exhaust path 14. This compressed air serves as a bearing and smoothly moves the sliding member 11 in the Z direction.

Moreover, the opening part of the upper end of the head part case 12 is closed by the lid member 15. The through hole is formed in the center of the lid member 15, and the connecting rod 16 is inserted in the cylindrical hole. As for the connecting rod 16, the lower end is fixed to the center of the upper surface of the sliding member 11, and the upper end is couple | bonded with the displacement sensor 17. As shown in FIG.

In addition, the air supply unit 18 is formed in the lid member 15, and air is supplied to the outside in a space formed by the upper surface of the sliding member 11, the lower surface of the lid member 15, and the inner circumferential surface of the head case 12. Compressed air is supplied via the furnace 18. This compressed air is exhausted via the exhaust path 14 while being throttled by a gap between the upper surface of the sliding member 11 and the inner peripheral surface of the head case 12, and the outer peripheral surface of the connecting rod 16 and the lid member 15. Is throttled by the gap with the inner circumferential surface of the through hole and exhausted. To this end, air pressure is generated in the space, and a force for pushing the sliding member 11 downward is generated by this pressure. By setting this air pressure arbitrarily, the force which presses the head pin 10 downward can be made into the optimal force matched with the material, hardness, etc. of a process object. In addition, due to the air pressure and the elastic force of the elastic member (not shown), the shock generated when the head pin 10 is in contact with the substrate 1 can be absorbed, so that the head pin 10 and the substrate 1 It can be prevented from being destroyed. For example, a spring made of metal or resin or an elastic body such as resin can be used as the elastic member. Such an elastic member may be arranged, for example, on the upper surface of the sliding member 11, and the sliding member 11 may be pressed by the elastic member.

Next, as an example of the processus | protrusion part processed by this invention, the processus | protrusion part which arises in a rib in the manufacturing process of a plasma display panel is demonstrated. FIG. 3A is a perspective view illustrating the configuration of the back glass substrate 19 of the plasma display panel. The plasma display panel is composed of two glass substrates (front glass substrate and back glass substrate) that face each other. Referring to Fig. 3A, on the back glass substrate 19 of the plasma display panel, ribs (bulges) 20 having a width of about 40 to 80 mu m are formed at several hundred mu m pitch. In the process of manufacturing the plasma display panel, when the ribs 20 are formed on the back glass substrate 19, protrusions may occur on the ribs 20 due to the mixing of foreign matters and abnormalities in the manufacturing process.

FIG. 3B is a perspective view illustrating the protrusions generated on the ribs 20. With reference to Fig. 3B, both the projections and the dents do not exist, and with respect to the top surface 21 of the top surface of the rib 20 having a predetermined shape, the projection 22 that is higher than the normal top surface 21 is present. have. Thus, if the rib part 20 has the protrusion part 22, a gap may arise at the time of sticking together the front glass substrate and the back glass substrate, and the abnormality which the press part 22 presses may be broken. In order to improve productivity, it is necessary to shave and fix the protrusion part 22 to the same height as the top surface 21 which is normal, before affixing a glass substrate together.

Hereinafter, the control which makes the force which the head pin which is the feature of Embodiment 1 pressurize a protrusion part variable is demonstrated. FIG. 4: is a schematic diagram which shows the relationship between the Z coordinate perpendicular | vertical to the surface of a board | substrate, and the force which the head pin 10 presses the projection part 22 via the polishing tape 9. FIG. In Fig. 4, the vertical axis represents the force that the head pin 10 presses the protrusion 22 via the polishing tape 9, and the horizontal axis is the Z axis perpendicular to the substrate surface, and the height direction position of the protrusion 22 is shown. The Z coordinate of. Here, the projection 22 is divided into two processing ranges, the rough polishing range 23 including the position of the projection vertex in the height direction, and the finish polishing range 24 including the position of the top surface that is normal to the substrate surface. An example is shown. Herein, the projection peak refers to a position away from the top surface 21 that is most normal along the Z direction among the surfaces of the projection 22 to be polished. Moreover, the process surface during the grinding | polishing of the protrusion part 22 set as the boundary of the roughening range 23 and the finish polishing range 24 is made into the process surface after finishing polishing. If the Z coordinates of the normal saw face, the protrusion vertex and the finish surface after finishing polishing are Z1, Z2 and Z3, respectively, the range of Z2 to Z3 is the rough polishing range (23) and the range of Z3-Z1 is the finish polishing range (24). to be.

4A illustrates a control function of a force for the head pin 10 to press the protrusion 22 through the polishing tape 9 in the rough polishing range 23 and the finish polishing range 24. It is a schematic diagram of an example to change. As the mountainous protrusion 22 is polished from the vertex toward the normal top surface 21, the cross-sectional area parallel to the substrate surface of the protrusion 22 increases. By increasing the force that the head pin 10 presses the projection 22 with this increase in the cross-sectional area, the fluctuation of the pressing force per unit area applied to the projection 22 is suppressed small. At this time, the maximum value of the force which the head pin 10 presses the projection part 22 in the rough polishing range 23 is set so that it may become smaller than the minimum value of the force which presses in the finishing polishing range 24. This prevents the pressurizing force per unit area applied to the protrusions 22 from becoming extremely large as the protrusion apex, so that the protrusion apex and the crack on the substrate surface due to the stress concentration in the vicinity of the protrusions are prevented. It is possible to increase the processing accuracy of the projections without causing problems such as occurrence. In addition, in the vicinity of the top surface 21 which is the top of the substrate surface, the force of the head pin 10 to press the protrusions 22 increases with the increase in the cross-sectional area, so that the polishing efficiency can be improved.

4B, in the rough polishing range 23 and the finish polishing range 24, the head pin 10 presses the projection 22 through the polishing tape 9 within one processing range. It is an example in which the set value of the force to pressurize for each processing range is maintained, maintaining the force to be set to a fixed set value. Here, the set value of the force to be pressed in the rough polishing range 23 is made smaller than the set value in the finish polishing range 24. In this example, since the set value of the force that the head pin presses the protrusions in each processing range may be changed, the control can be simplified, and further, the manufacturing cost of the device can be reduced.

Here, although the Z coordinate Z1 of the normal top surface 21 can be detected using what makes the back surface contact the normal top surface 21 with the polishing tape 9 bonded to the head pin 10 as mentioned later, At this time, the head pin 10 presses the normal top surface 21 through the polishing tape 9 and the head pin 10 presses the final top portion 21 while polishing the projection 22 on the normal top surface 21. You can set the force set to the same value. Thereby, the board | substrate is mounted by the deformation | transformation of the board | substrate 1 of a process object, etc. Even if the clearance gap arises between the surface of the XY table 2 and the board | substrate 1, the normal top surface 21 is detected. Since the amount of elastic deformation of the substrate 1 due to the pressing portion of the head pin 10 at the time of finishing polishing the protrusion 22 at the same time can be equalized, the machining surface at the end of polishing is precisely matched to the normal top surface 21. I can do it. For example, (A) of FIG. 4 shows the maximum value of the force which the head pin 10 presses the projection 22 in the finish polishing range 24, and FIG. 4B shows the finish polishing range. What is necessary is just to set the predetermined value of the force to press on (24) so that it may become equal to the force which presses the top surface 21 with which the head pin 10 is normal at the time of Z coordinate Z1 detection, respectively. Not only this example but also the case where the arbitrary pressurizing force is set in the rough polishing range 23 or the finishing polishing range 24, the projection part 9 uses the abrasive tape 9 in the normal top surface 21, and is used. While setting (22), the set value of the force that the head pin 10 presses the protrusion 22 via the polishing tape 9 is set to the top surface 21 where the head pin 10 is normal at the time of Z coordinate Z1 detection. If it is set to be equal to the pressing force, the effect of accurately equipping the top surface 21 with a normal working surface at the end of polishing is similarly obtained.

Next, with reference to FIGS. 5-10, the tape grinding | polishing method of processing the processus | protrusion part of a board | substrate surface using an abrasive tape is demonstrated.

5 is a flowchart for explaining the entire tape polishing method. First, in step S100, the surface of the board | substrate 1 is observed using the observation optical system 4, and the protrusion part which exists on the surface of the board | substrate 1 is found. Next, in step S200, the height of the protrusion is measured. Next, in step S300, projection roughening is performed. Next, in step S400, the machining surface height measurement is performed after finishing polishing finishes. Next, in step S500, the projection finish polishing is performed. These steps (S200), (S300), (S400) and (S500) will be described later in detail. Next, in step S600, the Z table 3 is moved in the direction away from the substrate 1 as a post-treatment to prepare for processing the next protrusion.

6 is a flowchart for explaining a protrusion height measuring step. Fig. 10 is a schematic diagram showing the position and operation of the head pin tip with respect to the protrusion on the substrate surface. The projection height measurement process will be described with reference to FIGS. 6 and 10. First, in process step S201, the XY coordinates of the tip of the head pin 10 are aligned with the XY coordinates of the top surface 21 which is normal near the projection 22 of the polishing object observed by the observation optical system 4, Positioning to move the XY table 2 is performed. Next, in step S202, the Z table 3 is moved along the Z direction toward the top surface 21, which is the top of the substrate surface, as indicated by the arrow 25 in FIG. 10 on the positioned XY coordinates. With the movement of the Z table 3, the tape polishing unit 5 provided in the Z table 3 also moves. By the movement of the tape polishing unit 5, the head pin 10, which is included in the tape polishing unit 5 and whose tip is joined to the back surface of the polishing tape 9, approaches the substrate surface. Next, in step S203, the surface of the polishing tape 9 is brought into contact with the top surface 21, which is the top of the substrate surface, at which time the head pin 10 is moved from the hard plate along the Z direction rather than the reference position of the polishing head. The displacement sensor 17 detects that it starts to move in the falling direction, and stops the Z table 3 at that position. Here, the relative position with respect to the grinding | polishing of the head pin 10 on the condition that the force is not applied to the head pin 10 is called a reference position. Next, in step S204, the Z coordinate 26 of the surface position of the polishing tape 9 at the time of bringing the surface of the polishing tape 9 into contact with the top surface 21 that is the top of the substrate surface. It detects by the position ZT1 of the Z table 3, and sets the Z coordinate 26 as Z coordinate Z1 of the normal top surface. Hereinafter, the position ZT1 of the Z table 3 is called the position of the Z table 3 corresponding to the normal top surface 2l.

Here, as the detection method of the Z coordinate 26, you may use the following method, for example. That is, the position of the Z table 3 moved to the predetermined position (for example, the origin position of the linear scale provided near the Z table 3, or the position of the origin sensor provided at the table stroke end) is called the origin of the Z coordinate. . Then, the surface of the polishing tape 9 included in the tape polishing unit 5 abuts on the top surface 21 of the substrate surface by moving the Z table 3 along the Z direction in the step S202. (Contact). And when the abrasive tape 9 by which the back surface was joined to the front-end | tip part of the head pin 10 contacted the normal top surface 21, the displacement sensor 17 detects the displacement of the head pin 10, and the Z table ( Movement of 3) (that is, movement of the tape polishing unit 5) stops. The movement amount ZT1 from the origin in the Z direction of the Z table 3 at this time is referred to as the position of the Z table 3 when the polishing tape 9 comes into contact with the normal top surface 21. Then, the specific value determined by the relative positional relationship between the head pin 10 and the Z table 3 (for example, in the state where the stress is not added to the head pin 10, of the origin of the Z table 3). By applying the distance in the Z direction from the reference position to the surface (surface opposite to the substrate) of the polishing tape 9 bonded to the distal end of the head pin 10 to the position ZT1 of the Z table 3, The Z coordinate 26 mentioned above can be obtained.

Next, in step S205, the Z table 3 is moved in the direction away from the substrate 1.

Next, in step S206, positioning to move the XY table 2 is performed so that the XY coordinates of the tip of the head pin 10 are aligned with the XY coordinates of the projection vertex 27 to be polished. Next, in step S207, the Z table 3 is moved along the Z direction toward the protrusion 22 as shown by the arrows 28 in FIG. 10 on the positioned XY coordinates. Next, in step S208, the surface of the polishing tape 9 is brought into contact with the projection apex 27, and the head pin 10 moves away from the substrate along the Z direction rather than the reference position of the polishing head. The displacement sensor 17 detects that it starts to start and stops the Z table 3 at that position. Next, in step S209, the Z coordinate 29 of the surface position of the polishing tape 9 at the time of bringing the surface of the polishing tape 9 into contact with the projection apex 27 is defined as the Z table at this time ( It detects by the position ZT2 of 3), and sets the Z coordinate 29 as Z coordinate Z2 of the protrusion part 27. Hereinafter, the position ZT2 of the Z table 3 is called the position of the Z table 3 corresponding to the protrusion vertex 27. Here, as the detection method of the specific Z coordinate 29, the method similar to the detection method of the Z coordinate 26 mentioned above can be used.

Next, in step S210, the absolute value of the difference between the Z coordinate Z1 and the Z coordinate Z2 is calculated as the height of the protrusion 22. In the calculation of the height of the projection 22, the difference between the position ZT1 at which the Z table 3 moves in the step S204 and the position ZT2 at which the Z table 3 moves in the step S209. The absolute value may be the height of the protrusion part 22. In addition, in order to calculate the height of the projection part 22, if the relative difference can be calculated | required about Z coordinate Z1 and Z coordinate Z2 mentioned above, arbitrary positions (for example, the position of Z coordinate Z1) are called origin. Coordinate system can be used.

Next, in step S211, the Z table 3 is moved along the Z direction in the direction away from the substrate.

Here, in the conventional tape grinding | polishing apparatus, the diameter of the tip part of the head pin 10 shown as D in FIG. 2 is smaller than the maximum length of the projection part 22 is used. Here, the maximum length of the projection part 22 is the maximum value of the length of the projection part 22 in the direction substantially parallel to the direction of the upper surface (normal top surface 21) of the rib 20 formed in the board | substrate 19. FIG. Indicates. In this case, in the step S209 of detecting the position ZT2 of the Z table corresponding to the protrusion vertex 27, the position control is performed so that the distal end portion of the head pin 10 exactly matches the XY coordinates of the protrusion vertex 27. Needs to be. If the tip of the head pin 10 deviates from the XY coordinates of the projection apex 27, even if the Z-direction contact position of the surface of the polishing tape 9 to the projection 22 is detected, it is different from the Z coordinate 29 of the projection apex. Since the height measurement of the projection part 22 cannot be performed correctly, high-precision position control is calculated | required. In addition, in order to process the protrusion larger than the diameter of the tip of the head pin 10, the protrusion 22 is polished while scanning the head pin 10, and the head pin 10 is pressed against the protrusion 22 repeatedly for a plurality of times. It is necessary to conduct research, such as to increase the working time required for polishing.

So, in this one embodiment, the head pin 10 whose tip part has diameter D or more of the maximum length of the projection part 22 is used. The diameter D (φ 0.1 to 5.0 mm) of the head pin 10 is changed depending on the maximum length of the projection 22. For example, when the maximum length of the projection part 22 is estimated to be about 2.5 mm, the diameter D = φ3.0 mm is used. As a result, when the Z table 3 is moved in the Z direction toward the projection 22, the surface of the polishing tape 9 always contacts the projection vertex 27, so that the height measurement of the projection 22 is measured. I can do it correctly. In addition, when grinding the projection part 22, since the head part 10 is moved only once toward the projection part 22 once, all the projection part 22 can be processed, and therefore the working time required for grinding | polishing process is made It can shorten and improve the polishing efficiency.

In this case, since the movement of the head pin 10 is directly detected by the displacement sensor 17 provided coaxially with the head pin 10 in the polishing head, the head pin 10 is moved from the projection 22 during polishing. Due to the reaction force applied to the head, the head pin 10 is accurately moved without causing an error due to the principle of Abe in the detection of the amount of movement of the head pin 10 in the polishing head from the reference position in the direction away from the substrate in the Z direction. The movement amount of the pin 10 can be measured. In addition, since the height of the projection part 22 can be measured by one type of sensor, a measuring instrument is compared with the conventional tape polishing apparatus which required the sensor for measuring the height of the projection part 22, such as a laser displacement meter. Since the error due to is eliminated, more accurate height measurement can be realized and the manufacturing cost of the accident apparatus can be reduced. And by processing based on this measurement binding, the processing surface can be provided in the top surface 21 which is normal in the vicinity of the projection part 22, without the bad influence, such as the straightness of the XY table 2, and the like.

However, in the step (S209) of detecting the Z coordinate Z2 of the projection vertex 27 by the position XT2 of the Z table 3, the projection part 9 is joined to the surface of the polishing tape 9 bonded to the distal end of the head pin 10. In order to contact the vertex 27 and detect the position ZT2 of the Z table 3 at that time, the cross section facing the substrate surface of the head pin 10 needs to be exactly parallel to the substrate 1. have. If this cross section is inclined with respect to the substrate surface, accurate measurement of the position ZT2 of the Z table 3 corresponding to the projection apex 27 is difficult. Then, in the following embodiment, the inclination-angle adjustment member which adjusts the inclination-angle with respect to the board | substrate surface of the cross section facing the board | substrate surface of the said recording head pin 10 is provided. FIG. 11: (A), (B) is a schematic diagram which shows the structure and operation | movement of an inclination-angle adjustment member.

Referring to FIG. 11A, the supply reel 38 and the winding reel 39 are coin driven at a predetermined rotational speed arbitrarily adjusted, and the abrasive tape 9 is supported together with the auxiliary reels 40a and 40b. It is sent at a predetermined speed according to the tip of the head pin 10. It is fixed to the Z table 3 shown in FIG. 1 with the nuts 41a and 41b, and the adjustment screws 42a and 42b are fastened to the nuts 41a and 41b, respectively, and the end part has the adjustment shaft 43 It is prepared to sandwich. Moreover, the tape polishing unit 5 is provided in the Z table 3 shown in FIG. 1 so that the inclination-angle can also be adjusted.

The nuts 41a and 41b, the adjustment screws 42a and 42b, and the adjustment shaft 43 comprise the inclination-angle adjustment member. Cross section facing the substrate surface of the head pin 10 relative to the substrate 1, such as when the tape polishing unit 5 is inclined or when the XY table 2 on which the substrate 1 is placed is inclined. Even when this is inclined, the substrate surface of the head pin 10 is adjusted by adjusting the amount of screwing to the nuts 41a and 41b of the adjustment screws 42a and 42b and adjusting the inclination angle of the adjustment shaft 43. The inclination angle of the tape polishing unit 5 can be fine-adjusted so that the cross section which opposes to is parallel to the board | substrate 1 (refer FIG. 11 (B)). Moreover, the cross section of a head pin is produced so that it may become perpendicular | vertical with respect to the outer surface of the sliding member provided coaxially with a head pin. Therefore, when the head pin end surface is angled in parallel to the substrate, the head pin becomes perpendicular to the substrate, so that it is possible to accurately measure the load at the time of machining and to accurately detect the Z coordinate 29 of the projection vertex. In addition, since the polishing tape 9 pressed by the inclined head pin 10 can be prevented from being polished to the top surface 21 that is the top of the substrate surface, more accurate processing can be realized.

7 is a flowchart for explaining the projection roughening process. The process of roughening the protrusions will be described with reference to FIGS. 7 and 10. First, from the Z coordinate 29 of the projection apex in the Z direction, it corresponds to the Z coordinate 30 at a position separated from the substrate 1 by a predetermined distance h (for example, 10 to 20 μm) shown in FIG. 10. The position ZT2a of the Z table 3 is set. That is, the position away from the board | substrate 1 by the predetermined distance h along the Z direction from the position ZT2 of the Z table 3 corresponding to the projection part apex 27 is set to ZT2a. The projection roughening process is performed along the Z table 3 in the Z direction until the distal end portion of the head pin 10 reaches the Z coordinate 30, that is, until the Z table 3 reaches the ZT2a position. And a polishing step of moving the Z table 3 further toward the substrate surface along the Z direction to process the protrusions 22 using the polishing tape 9 after the moving step. do.

In step S301, as shown by the arrow 31 of FIG. 10, the Z table 3 is moved to the protrusion part 22 along a Z direction at the movement speed Vo. With the movement of the Z table 3, the tape polishing unit 5 provided in the Z table 3 also moves. By the movement of the tape polishing unit 5, the head pin 10 included in the tape polishing unit 5 and having its front end contacting the back surface of the polishing tape 9 approaches the projection apex 27. Next, in step S302, the polishing tape 9 is driven at the position where the Z table 3 reaches the ZT2a position, that is, the position where the tip of the head pin 10 reaches the Z coordinate 30. . Next, in step S303, the Z table 3 is moved toward the protrusion 22 along the Z direction at the movement speed V, as indicated by the arrow 32 in FIG. Next, in step S304, the surface of the polishing tape 9 is brought into contact with the projection apex 27. Next, in step S305, the projection is polished. Next, in step S306, the Z table 3 corresponds to the machining surface setting position after the finishing polishing finish which is set in advance as a boundary between the rough polishing range 23 and the finish polishing range 24. The Z table 3 is moved until the position ZT3b is reached. Here, the Z coordinate of the machining surface setting position after finishing polishing is set to a position apart from the substrate surface of 30 to 40 µm with respect to the Z coordinate Z1 of the normal top surface 21, for example. Set the value to Z3b. That is, with respect to the position ZT1 of the Z table 3 corresponding to the normal top surface 21, the position falling from the substrate surface by a predetermined distance (for example, 30 to 40 µm) corresponds to the machining surface setting position after finishing polishing. The position ZT3b of the Z table 3 is set. Next, in step S307, the Z table 3 is stopped at the ZT3b position. Next, in step S308, the polishing tape 9 is stopped. Next, in step S309, the Z table 3 is moved along the Z direction in the direction away from the substrate.

In this case, the moving speed Vo of the Z table 3 in the moving step is larger than the moving speed V of the Z table 3 in the polishing step. As a result, the tape polishing unit 5 can be brought close to the protruding portion 22 quickly, so that waste of the abrasive tape consumed can be prevented and the processing time can be shortened.

8 is a flowchart for explaining a machining surface height measuring step after finishing polishing is finished. Referring to FIGS. 8 and 10, the machining surface height measurement process after finishing polishing is explained. First, in step S401, as shown by arrow 33 in FIG. 10, the Z table 3 is moved along the Z direction toward the machining surface after finishing roughening of the projection part 22. As the Z table 3 moves, the tape polishing unit 5 provided on the Z table 3 also moves. By the movement of the tape polishing unit 5, the head pin 10 whose front end part abuts on the back surface of the polishing tape 9 approaches the processing surface after finishing polishing. Next, in step S402, the surface of the polishing tape 9 is brought into contact with the working surface after finishing polishing, in which the head pin 10 moves away from the substrate along the Z direction rather than the reference position of the polishing head. The displacement sensor 17 detects that the movement starts, and the Z table 3 is stopped at that position. Next, in step S403, the Z coordinate 34 at the surface position of the polishing tape 9 at the time of bringing the surface of the polishing tape 9 into contact with the processing surface after finishing polishing is finished. Is detected by the position ZT3, and the Z coordinate 34 is set as the Z coordinate Z3 of the machined surface after finishing polishing. Here, as the detection method of the specific Z coordinate 34, the method similar to the detection method of the Z coordinate 26 mentioned above can be used. Next, in step S404, the Z table 3 is moved along the Z direction in the direction away from the substrate.

In this case, the displacement sensor 17 detects the movement of the head pin 10 when the surface of the polishing tape 9 is brought into contact with the processing surface after finishing polishing, and the position of the Z table 3 at that time. The Z coordinate 34 of the surface position of the polishing tape 9 is detected by (ZT3), and it is set as the actual Z coordinate Z3 of the processed surface after finishing polishing. In the projection roughening step, the head pin 10 may move in the direction away from the substrate along the Z axis than the reference position of the polishing head due to the reaction force received from the projection 22 during polishing. Therefore, in some cases, the Z coordinate of the machining surface after the finish polishing finish when the Z table 3 reaches the ZT3b position may deviate from the Z coordinate Z3b of the machining surface setting position after the completion of the preset polishing finish. Even in that case, since the actual Z coordinate 73 of the finishing surface after finishing polishing can be detected by the machining surface height measuring process after finishing polishing, the actual height of the projection part after finishing polishing is accurately measured. can do.

9 is a flowchart for explaining a projection finish polishing step. 9 and 10, the process of finishing the protrusions will be described. First, the Z coordinate 35 at the position away from the substrate 1 by a predetermined distance h (for example, 10 to 20 μm) shown in FIG. 10 along the Z direction from the Z coordinate 34 of the processing surface after finishing polishing is finished. ), The position ZT3a of the Z table 3 is set. That is, the position away from the board | substrate 1 by the predetermined distance h along the Z direction from the position ZT3 of the Z table 3 corresponding to a process surface after completion of rough polishing is set to ZT3a. The projection finish polishing process moves the Z table 3 in the Z direction until the tip of the head pin 10 reaches the Z coordinate 35, that is, until the Z table 3 reaches the ZT3a position. Therefore, after the completion of the rough polishing, the moving step moves toward the machining surface, and after the moving step, the Z table 3 is further moved toward the substrate surface in the Z direction to process the protrusion part 22 using the polishing tape 9. And a polishing step.

In step S501, as indicated by the arrow 36 in FIG. 10, the Z table 3 is moved in the Z direction toward the machining surface after the finish polishing is finished at the movement speed Vo. With the movement of the Z table 3, the tape polishing unit 5 provided in the Z table 3 also moves. By the movement of the tape polishing unit 5, the head pin 10 having the front end portion included in the tape polishing unit 5 bonded to the back surface of the polishing tape 9 approaches the processing surface after finishing polishing. Next, in step S502, the polishing tape 9 is driven at the position where the Z table 3 reaches the ZT3a position, that is, the position where the tip of the head pin reaches the Z coordinate 35. Next, as shown in FIG. Next, in step S503, the Z table 3 is moved toward the protrusion 22 along the Z direction at the movement speed V, as indicated by the arrow 37 in FIG. Next, in step S504, the surface of the polishing tape 9 is brought into contact with the working surface after finishing polishing. Next, in step S505, the protrusion is polished. Next, in step S506, the Z table 3 is moved until the Z table 3 reaches the position ZT1 of the Z table 3 corresponding to the normal top surface 21. Next, in step S507, the Z table 3 is stopped at the ZT1 position. Next, in step S508, the polishing tape 9 is stopped.

In this case, similarly to the projection roughening step, the moving speed Vo of the Z table 3 is larger than the moving speed V of the Z table 3 in the polishing step in the moving step. As a result, since the tape polishing unit 5 can be quickly approached to the projection 22, waste of the tape consumed can be prevented and the feeding time can be shortened. In the step (S506), when the Z table 3 reaches the position ZT1 corresponding to the normal top surface 21, the head pin 10 polishes the protruding portion using the polishing tape 9. When the set value of the force for pressing the normal top surface 21 via the abrasive tape 9 is detected in the step S204, the Z pin Z1 of the normal top surface 21 is detected by the head pin 10. It sets so that it may be equal to the force which presses the normal top surface 21 through (9). As a result, even when a gap is generated between the surface of the XY table 2 and the substrate 1, the protrusion 22 and the time when the Z coordinate Z1 of the normal top surface 21 is detected. Since the amount of elastic deformation of the substrate 1 at the time of finish polishing can be made the same, the machining surface at the end of polishing can be provided on the normal top surface 21 accurately.

Moreover, in this one embodiment, the position sensor of the Z-direction of the head pin 10 is detected by the displacement sensor 17, and the surface of the abrasive tape 9 and the board | substrate 1 are based on the detection result. Although a contact state is detected, you may use the reaction force detection sensor like a load cell which detects the change of the force of the direction falling from the board | substrate provided to the head pin 10 instead of the displacement sensor 17. FIG. When the surface of the polishing tape 9 comes into contact with the substrate 1 during the movement of the Z table 3, the reaction force given by the substrate 1 to the head pin 10 in the direction away from the substrate begins to increase. Based on the detection result of the reaction force detection sensor, it is possible to detect that the surface of the polishing tape 9 is in contact with the substrate 1.

Moreover, in this one embodiment, the Z coordinate at the time of contacting the top surface 21 and the projection part apex 27 which the surface of the abrasive tape 9 is normal using the displacement sensor 17 is detected, and these Z coordinates are detected. Although the height of the projection part 22 was calculated by the absolute value of the difference of the difference, you may be provided with the measuring mechanism which measures the height of the projection part 22 unlike a sensor. For example, the height of the projection part 22 can be measured using a laser displacement meter, an air micro sensor, a capacitance sensor, or the like.

Moreover, in this one embodiment, although compressed air was supplied from the outside and the head pin 10 was pressurized to the projection part 22 using the expansion force, the force to pressurize by adjustment of air pressure was controlled, but it compressed other than air. You may use a gas. In addition, it is also possible to control the force which presses the head pin 10 to the projection part 22 using elastic bodies, such as a compression spring, instead of a compressed gas. In that case, the polishing head included in the tape polishing unit 5 has an elastic body and a member for controlling the pressing force by the elastic body to have an arbitrary value, and these are the head pin 10 or the head pin 10. It is coupled to a member fixed to the top of the head pin 10 is used for the control of the force to press the projection (22). It is also possible to use an elastic body and a compressed gas together.

Moreover, although this case showed the case where the processus | protrusion part 22 of the upper part of the rib 20 formed on the back glass substrate 19 of the plasma display panel was processed, it is not limited to this use, Plasma display It is also possible to process the protrusion part which generate | occur | produced on the board | substrate surface in board | substrate manufacturing processes other than a panel.

It is natural that the embodiment disclosed this time is considered to be illustrative in all respects and not restrictive. The scope of the present invention is shown by above-described not description but Claim, and it is intended that the meaning of a Claim and equality and all the changes within a range are included.

As mentioned above, in the tape grinding | polishing method which concerns on this invention, the height of a processus | protrusion part is divided into 2 or more steps of processing ranges, and the force which presses a processus | protrusion part through a polishing tape by a head pin for each processing range is made variable. The head pin can adjust the force to press the protrusion to an optimum force according to each processing range, and the fluctuation of the pressing force per unit area applied to the protrusion can be suppressed to be small, so that the protrusion can be processed with high precision. Has the effect.

Claims (10)

In the tape polishing apparatus which processes the projection part of the board | substrate surface using an abrasive tape, A tip end abutting the rear surface of the polishing tape and including a head pin installed to be movable along a coordinate axis perpendicular to the surface of the substrate, A tape polishing unit for polishing the protrusion by the surface of the polishing tape; A measuring mechanism for measuring the height of the protrusion, And a control means for dividing the height of the projection into two or more steps of processing, and for varying the force for pressing the projection by the head pin through the polishing tape for each processing range. Device. The method of claim 1, The control means maintains the pressing force at a constant set value within one processing range, and sets the setting value of the pressing force for each processing range to be variable. The method of claim 1, The control means is set such that the value of the pressing force in the machining range including the position of the projection apex is smaller than the value of the pressing force in the machining range including the position of the top surface that is normal to the substrate surface. Tape polishing apparatus, characterized in that. The method of claim 1, And the control means controls the pressing force by using at least one of an elastic body and a compressed gas. The method of claim 1, The measuring mechanism is a tape polishing apparatus which is capable of detecting that the head pin moves in a direction away from the substrate or receives a force in a direction away from the substrate according to the coordinate axis rather than a reference position of the polishing head. . The method of claim 5, The control means, Move the tape polishing unit toward a top surface normal to the substrate surface, Using the sensor to detect that the head pin starts to move in a direction away from the substrate along the coordinate axis rather than the reference position, or begins to receive a force in a direction away from the substrate, A force for pressing the normal top surface through the polishing tape through the polishing tape when setting the coordinates in the coordinate axis direction of the normal top surface based on the detection result; The said normal top surface WHEREIN: The tape grinding | polishing apparatus characterized by setting the set value of the force which the said head pin presses the said projection part through the said polishing tape, grinding | polishing the said projection part using the said polishing tape. The method of claim 1, And an inclination angle adjusting member for adjusting an inclination angle with respect to the substrate surface of a cross section of the head pin facing the substrate surface. The method of claim 1, And said head pin has a diameter leading end portion equal to or more than a maximum length of said projection. In the tape grinding | polishing method of processing the processus | protrusion part of a board | substrate surface using an abrasive tape, Measuring the height of the protrusion, And processing the protrusion using the polishing tape based on the measured height of the protrusion, In the process of processing, the height of the projection is divided into two or more stages of processing range, and for each processing range, the front end portion is abutted on the back surface of the polishing tape to be movable along a coordinate axis perpendicular to the substrate surface. The tape pinning method characterized in that the head pin is provided to vary the force for pressing the projection portion via the polishing tape. The method of claim 9, The process to process, The tip end portion of the head pin may reach a position where the tape polishing unit, including the head pin, polishes the protrusion by the surface of the polishing tape away from the substrate by a predetermined distance along the coordinate axis from the vertex of the protrusion. A moving step of moving toward the projection part along the coordinate axis until And, after the step of the movement, a polishing step of further moving the tape polishing unit toward the substrate surface along the coordinate axis, and polishing the protrusion using the polishing tape, A moving speed of the tape polishing unit in the moving step is larger than a moving speed of the tape polishing unit in the polishing step.

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