KR20060035347A - ABS molded product plating system and plating solution control method of the plating system - Google Patents

Abstract

The present invention is to configure the chemical plating line and electroplating line to chromium-plated ABS molded parts used for automotive parts, ABS metal plating system for forming a copper, nickel, chromium layer on the surface of the ABS molded product and its plating solution control Provide a method. In the ABS molded product plating system, the electroplating line is provided with copper plating bath, nickel plating bath and chrome plating bath which are arranged in a row to form copper, nickel and chromium layers sequentially on the surface of the ABS molded product which has undergone chemical plating line. The nickel plating bath of the electroplating line further includes a weak electrolytic bath connected to the nickel plating bath by a discharge circulation line and a supply circulation line to continuously circulate the plating liquid in the nickel plating bath. The plating solution control method of the plating system removes the suspended solids through the primary filter installed on the discharge circulation line and transfers the plating solution to the first chamber of the weak electrolytic bath, and operates the stirrer to supply the chemical while stirring the plating solution. To adjust the concentration of the plating liquid. Then, an electric pole is connected to the plating liquid moved to the second chamber to remove metal ions on the plating liquid, and organic impurities in the plating liquid are removed through a third filter and transferred to the nickel plating bath.

Description

ABS FORMS PLATING SYSTEM AND PLATING SOLUTION CONTROL METHOD OF THE SYSTEM}

1 is a block diagram illustrating a conventional ABS molded product plating system;

2 is a block diagram for explaining an ABS molded product plating system according to the present invention;

Figure 3 is a flow chart for explaining a plating liquid control method of the ABS molded product plating system according to a preferred embodiment of the present invention;

4 and 5 are views for explaining an ABS molded product plating system according to a preferred embodiment of the present invention;

6 is a perspective view showing a tank of a weak electrolytic bath in an ABS molded product plating system according to a preferred embodiment of the present invention;

7 and 8 are views for explaining the intermediate membrane filter in detail in the ABS molded product plating system according to a preferred embodiment of the present invention;

9 is a view for explaining a negative electrode plate in the electrode stand of the ABS molded product plating system according to a preferred embodiment of the present invention;

10 is a view for explaining a positive electrode plate in the electrode stand of the ABS molded product plating system according to a preferred embodiment of the present invention;

11 is a view for explaining a modification of the positive electrode plate in the electrode stand of the ABS molded product plating system according to a preferred embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: ABS molding product plating system 20: Chemical plating line

30: electroplating line 32: copper plating bath

34: nickel plating bath 36: chrome plating bath

40: weak electrolyte tank 42: tank

44: first room 46: second room

50: discharge circulation line 52, 62: pump

54: primary filter 60: supply circulation line

70: interlayer filter 72: frame

73: handle 74: flexure

76: net 78: filter cloth

80: interlayer filter supporter 92: blower

94, 96: diffuser 100: stirrer

110: electrode bar 112: electrode support stand

120: positive electrode plate 130: negative electrode plate

132: metal mesh 134: iron

136: main part 140: third filter

The present invention relates to an ABS molded product plating system and a plating solution control method of the plating system, and more particularly, an ABS molded product for effectively managing a plating solution in a plating line for chrome plating an ABS molded product used as an automotive part. A plating system and a plating liquid adjusting method of the plating system.

Products molded using synthetic resin are widely used in automobiles. In this case, products molded of synthetic resin are coated with a surface plated product to improve mechanical properties such as corrosion resistance, weather resistance, abrasion resistance, etc. in addition to painting, and to make the appearance the same as metal or improve aesthetics. In particular, ABS molded products formed by injection molding ABS (Acrylonitrile-Butadiene Styrene) resin or ABS-based synthetic resins (hereinafter referred to as 'ABS') such as ABS-PC are easily oxidized butadiene components from the surface by etching. Since it can be eluted, it is widely used in automobile parts such as radiator grilles that require plating.

1 is a block diagram illustrating a plating system of a conventional ABS molded article.

Referring to FIG. 1, a plating system 200 for an ABS molded article generally includes a chemical plating line 210 and an electroplating line 220. The chemical plating line 210 performs processes such as etching, washing, neutralizing, activating, and accelerator to impart hydrophilicity to the surface of the ABS molded product and to create a bonding area for adhesion. After the electroplating line 220 is appropriately processed through the chemical plating line 210, the surface of the electroplating is electroplated so that the copper plating bath 222 and the nickel plating bath 224 can be used to strengthen the thickness of the plating film. ), The metal plating layer of copper, nickel, and chromium are sequentially formed on the surface of the ABS molded article in which the bonding region is formed in the chemical plating line 210 through the chromium plating bath 226 to form a plated product.

In general, the ABS molded product plating system is composed of a plurality of tanks in series to perform the essential process to obtain a good chromium plating layer. At this time, each group is made of a different process using a different plating solution, and proceeds sequentially. Therefore, in such an ABS molded product plating system, it is required to stably maintain and manage the plating solution of each group in order to maintain the quality of plating. In the conventional ABS molded product plating system 200 as described above, the electroplating line 220 is used. The nickel plating bath 224 of the copper plating tank 222 is a copper (copper) component that is transmitted by the molded article moved after the process is completed is a problem. If nickel plating proceeds in a state where impurities such as copper, suspended solids, and organic impurities are distributed in the nickel plating tank 224, the corrosion resistance of the plated product may be drastically degraded and the surface may be roughened. In particular, when the structure of the product to be plated is complicated, such as a radiator grille, the defective rate of the nickel plated layer due to impurities such as copper components is higher.

Accordingly, the present invention has been proposed to improve such a conventional problem, and a new type ABS molded product plating system capable of managing the concentration of the plating liquid constantly while effectively removing copper components and various impurities introduced into the nickel plating bath and its It is to provide a plating liquid control method of the plating system.

According to a feature of the present invention for achieving the above object, the present invention comprises a chemical plating line and an electroplating line to chromium-plated ABS molded parts used for automotive parts, copper, nickel, In the ABS molded product plating system for forming a chromium layer, the electroplating line is provided with a copper plating bath, a nickel plating bath and a chromium plating bath which are arranged in a row on the surface of the ABS molded product passed through the chemical plating line. Copper, nickel, and chromium layers are sequentially formed, and the nickel plating bath of the electroplating line is a weak electrolytic bath connected to the nickel plating bath by a discharge circulation line and a supply circulation line to continuously circulate the plating liquid in the nickel plating bath. Further comprising, it is possible to remove the impurities on the plating liquid in the nickel plating bath and to adjust the concentration of the plating liquid. The.

In the ABS molded product plating system according to claim 1 of the present invention, the weak electrolyzer includes a tank formed so that an upper surface thereof is opened; An intermediate membrane filter for dividing the tank into a first chamber and a second chamber across the middle of the tank and filtering the flowing plating liquid with a filter cloth; A stirrer installed in the first chamber to stir a plating liquid; An diffuser installed at the bottom of the first chamber and the second chamber for aeration of air supplied from the outside in the plating liquid; An electrode stand installed in the second chamber to remove metal ions on the plating liquid, and a pump is installed on the discharge circulation line to transfer the plating liquid in the nickel plating bath to the first chamber of the tank. The concentration of the liquid crystal may be controlled, and a pump may be installed on the supply circulation line so that the plating liquid of the second room, which is removed from the first chamber through the interlayer membrane filter, from which metal ions are removed, may be transferred into the nickel plating bath. have. In addition, the weak electrolyzer is provided on the discharge circulation line and provided with a filter medium having a higher degree of filtration than the filter cloth of the interlayer filter and the primary filter for removing the suspended solids in the plating liquid transferred to the first chamber; It may further include a tertiary filter coupled to the electrode stage and provided with a filter material made of activated carbon to remove organic impurities on the plating liquid of the second room.

In the ABS molded article plating system according to claim 2 or 3 of the present invention, the electrode stands are supported by electrode stand supports respectively installed at both sides of the tank across the top of the second seal, and are supplied from the outside. At least two electrode bars to which one pole of the anode and the cathode of the power supply are separately connected; A positive electrode plate having one side coupled to an electrode bar to which a positive power is input among the at least two electrode bars, and the other side being installed to be immersed into the plating solution of the second chamber; One side of the at least two electrode bars may be provided with a negative electrode plate is coupled to the electrode bar to which the power of the negative electrode is input, the other side is to be locked into the plating solution of the second chamber.

In the ABS molded product plating system according to claim 4 of the present invention, the negative electrode plate may be formed to have a concave portion and a recessed portion with respect to the positive electrode plate when the negative electrode plate is coupled to the electrode bar.

According to another feature of the present invention for achieving the above object, the present invention includes a copper plating bath, nickel plating bath and chromium plating bath to sequentially the copper, nickel, chromium layer on the surface of the ABS molded article subjected to the chemical plating line ABS molded article which is connected to the nickel plating tank, the discharge circulation line and the supply circulation line in the electroplating line for forming the metal to continuously remove the impurities in the plating solution and adjust the concentration of the plating liquid while continuously circulating the plating liquid in the nickel plating tank. A plating solution control method of a plating system, comprising: removing a floating material through a primary filter installed on the discharge circulation line and transferring the plating solution of the nickel plating bath to a first chamber of the weak electrolytic bath; Operating a stirrer installed in the first chamber to supply a chemical while stirring the plating liquid to adjust the concentration of the plating liquid; Removing metal ions on the plating liquid by connecting an electric pole to the plating liquid moved from the weak electrolyte tank to the second chamber divided by an intermediate membrane filter for filtering the plating liquid flowing through the first chamber and the filter cloth; And removing the organic impurities in the plating liquid through a tertiary filter installed in the plating liquid of the second chamber and transferring the organic impurities to the nickel plating bath.

In the method of controlling the plating liquid of the ABS molded product plating system according to claim 4 of the present invention, adjusting the concentration of the plating liquid and removing the metal ions operate an diffuser installed at the bottom of the first chamber and the second chamber. And aeration of the air supplied from the outside into the plating liquid.

The present invention is to configure the chemical plating line and electroplating line to chromium-plated ABS molded parts used for automotive parts, ABS metal plating system for forming a copper, nickel, chromium layer on the surface of the ABS molded product and its plating solution control Provide a method.

2 is a block diagram illustrating an ABS molded product plating system according to the present invention.

2, the ABS molded article plating system 10 according to the present invention provides a specially configured electroplating line 30. That is, the ABS molded product plating system 10 according to the present invention includes a copper plating bath 32, a nickel plating bath 34, and a chromium plating bath 36 in which the electroplating lines 30 are continuously arranged. Copper, nickel and chromium layers are sequentially formed on the surface of the ABS molded article that has passed through the chemical plating line 20. At this time, the ABS molded product plating system 10 according to the present invention discharge circulating line and supply circulation line 50 to continuously circulate the plating liquid in the nickel plating bath 34 to the nickel plating bath 34 of the electroplating line 30 4 is connected to the weak electrolytic bath 40, characterized in that the installation. Of course, each of the copper plating bath 32, the nickel plating bath 34, and the chrome plating bath 36 constituting the electroplating line 30 of the present invention may be configured by combining a plurality of baths. For example, the nickel plating bath 34 may be composed of semi-gloss nickel plating bath, polished nickel plating bath, MP nickel plating bath, and the like, and the weak electrolytic bath 40 which is a feature of the present invention may be continuously connected to the last copper plating bath. It can be configured by applying to nickel plating bath or all nickel plating bath. In addition, the weak electrolytic bath 40, which is a feature of the present invention, may be provided with various configurations according to a preferred embodiment of the present invention described below.

As described above, according to the ABS molded product plating system 10 and the plating solution management method thereof, the plating solution of the plating solution is circulated while the plating solution of the nickel plating bath 34 is circulated through the weak electrolytic bath 40 connected to the nickel plating bath 34. By adjusting the concentration and removing impurities in the plating liquid, it is possible to effectively remove the impurities in the plating liquid while the normal plating process is carried out, and the concentration of the plating liquid can be managed conveniently, thus maintaining the plating liquid in the nickel plating bath stably. It is possible to produce a plated product of excellent quality. In addition, even when the plating operation is performed, impurities in the plating liquid of the nickel plating bath can be removed and the concentration of the plating liquid can be managed, so that productivity can be effectively managed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 3 to 11, and like reference numerals denote like elements for performing the same functions in FIGS. 2 to 11. Meanwhile, the drawings and detailed descriptions of the technical contents, such as manufacturing processes, peripheral devices for manufacturing, and conditions, which are easily understood from the general ABS molded product plating system and its plating solution control method in each drawing, are easily understood by those skilled in the art. Since the parts that can be simplified or omitted, and shown in the center of the parts related to the present invention.

4 and 5 are views for explaining an ABS molded product plating system according to a preferred embodiment of the present invention, Figure 6 is a perspective view showing a tank of the weak electrolytic bath in the ABS molded product plating system according to a preferred embodiment of the present invention, 7 and 8 are views for explaining the intermediate membrane filter in detail in the ABS molded product plating system according to a preferred embodiment of the present invention.

4 and 5, the ABS molded product plating system 10 according to the preferred embodiment of the present invention is connected to the nickel plating bath 34 to circulate the plating liquid in the nickel plating bath 34 while circulating the plating liquid impurities. It has a weak electrolytic cell 40 to remove and adjust the concentration of the plating liquid. The weak electrolyzer 40 is composed of a primary filter 54, a tank 40, an intermediate membrane filter 70, an agitator 100, an diffuser 94 and 96, electrode strips 110 and 120, and a tertiary filter ( 140).

The tank 40 is formed so that the upper surface is opened, and is divided into the first chamber 44 and the second chamber 46 by the interlayer membrane filter 70. Such a tank 40 is formed of a material such as PVC, CPVC in consideration of corrosion resistance and durability as a storage tank for accommodating the plating liquid. And the tank 40 according to a preferred embodiment of the present invention is formed so that the upper surface is open, which is convenient when you put the chemical (nickel compound, etc.) to adjust the concentration of the plating liquid, the operator conveniently to the state of the plating liquid This is to make the maintenance easy by observing and accessing. At this time, as shown in Figure 6, the part to put the drug to install the cover 43 to open and close when administering the drug, to prevent the drug from splashing to the outside during stirring and aeration. In particular, due to the structure of the tank 40 configured in such an open form, the electrode stand described later becomes more convenient for the exchange and management of the electrode plate.

Such a tank 40 is installed across the middle of the tank 40, the membrane filter 70, the first to divide the inside of the tank 40 into the first chamber 44 and the second chamber 46, the first Agitator 100 for agitating the plating liquid at the top of the chamber 44, and an acid for allowing air supplied from an external blower 92 to aeration in the plating solution at the bottom of the first chamber 44 and the second chamber 46. In the engine 94, 96 and the second chamber 46, electrode stands 110, 120, 130 for removing metal ions on the plating liquid are provided.

The weak electrolytic bath 40 allows the plating liquid to be transferred from the nickel plating bath 34 to the first chamber 44 through the discharge circulation line 50, and the plating liquid is transferred to the second chamber through the supply circulation line 60. 46 to the nickel plating bath 34. At this time, pumps 52 and 62 are respectively installed on the discharge circulation line 50 and the supply circulation line 60 to force the plating liquid to be transferred. In addition, the weak electrolytic bath 40 and the nickel plating bath 34 are connected to the overflow line 140 so that the nickel plating bath 34 through the overflow line 140 when the plating solution is excessively received in the weak electrolytic bath 40. ), The plating liquid on the weak electrolytic cell 40 is prevented from overflowing to the outside.

Meanwhile, the ABS molded product plating system 10 according to a preferred embodiment of the present invention effectively removes suspended substances and organic impurities in the plating liquid through various filtrations, and removes metal ions on the plating liquid through electrolysis. That is, in the ABS molded product plating system 10 according to the preferred embodiment of the present invention, the suspended solids (SS) in the plating liquid are removed through the primary filter 54 installed on the discharge circulation line 50 so that the weak electrolyte tank 40 Is moved to the first chamber (44). In addition, the chemicals added in the first chamber 44 are not dissolved by allowing the plating solution of the first chamber 44 to move to the second chamber 46 through the interlayer membrane filter 70 corresponding to the secondary filter. The second chamber 46 is prevented from coming over. In addition, the electrode ions provided in the second chamber 46 remove metal ions in the plating liquid, and unnecessary metals such as copper in the plating liquid are removed, and organic impurities are removed through the tertiary filter 140.

9 is a view for explaining the negative electrode plate in the electrode plate of the ABS molded product plating system according to a preferred embodiment of the present invention, Figure 10 is a view illustrating the positive electrode plate in the electrode plate of the ABS molded product plating system according to a preferred embodiment of the present invention 11 is a view for explaining a modification of the positive electrode plate in the electrode stand of the ABS molded product plating system according to a preferred embodiment of the present invention.

4, 9 to 10, in the ABS molded product plating system according to a preferred embodiment of the present invention, the electrode bar is composed of an electrode bar 110, a positive electrode plate 120, a negative electrode plate 130. The electrode bar 110 is supported by electrode stand support 112 which is installed at both sides of the tank 42 across the upper side of the second chamber 46, respectively, of the positive and negative poles of the power supplied from the outside. At least two poles are provided in which one pole is connected to each other separately. The electrode bar 110 is preferably arranged to be alternately connected to each terminal of the rectifier for supplying low voltage power (usually 0.02 to 0.5 A / dcm 2) from the outside. The positive electrode plate 120 is installed such that one side is coupled to the electrode bar to which the positive power is input, and the other side of the electrode bar 110 is locked into the plating solution of the second chamber 46. In addition, one side of the negative electrode plate 130 is coupled to the electrode bar to which the negative power is input, and the other side of the electrode bar 110 is installed to be locked into the plating solution of the second chamber 46.

Such an electrode stand is designed to remove metal components on the plating liquid by applying a conventional electrolytic principle. Therefore, in the ABS molded product plating system according to a preferred embodiment of the present invention, since the purpose of removing copper components from the plating solution for nickel plating, the positive electrode plate 120 applies a nickel or titanium material, the negative electrode plate 130 Apply stainless steel material. At this time, the negative electrode plate 130 according to the preferred embodiment of the present invention, as shown in Figure 9, when the portion is locked in the plating liquid when coupled to the electrode bar 110, the convex portion 132 with respect to the positive electrode plate 120 ) And the positive electrode plate 120 is composed of a flat nickel plate 122 made of nickel, and effectively removes copper from the plating solution. Keep the extraction of ingredients as small as possible. That is, when the positive electrode plate 120 and the negative electrode plate 130 are coupled to the electrode bar 110 and installed on the plating solution, the metal mesh 132 of the negative electrode plate 130 is a nickel plate in an area where electrolysis occurs. By having a portion (recess portion 134) relatively close to the outer surface (convex portion 132) of the outer surface of the 122 (122), so that zinc, lead, etc. are extracted from the iron portion 132 having a relatively small area In addition, the copper component is separated from the positive electrode plate 130 and relatively wider than the convex portion 132 and the copper component is extracted in a wide region (the region from the convex portion 132 to the recess 134). In this case, as shown in FIG. 11, the positive electrode plate 130 may be formed by filling the nickel sphere 122 ′ having a ball shape in the titanium network 124.

As described above, the weak electrolytic bath 40 according to the present invention effectively removes impurities in the plating liquid through the primary filter 54, the intermediate membrane filter 70, the tertiary filter 140, and the electrode blocks 110, 120, and 130. Then, the concentration of the plating liquid is adjusted to be supplied back to the nickel plating bath 34. At this time, the interlayer membrane filter 70 functions as a secondary filter and prevents the chemicals supplied to the plating liquid from the first chamber 44 from flowing into the second chamber 46 without melting. As shown in FIG. 7 and FIG. 8, the interlayer membrane filter 70 includes a web 76 made of PP material on both sides of a filter cloth 78 having a mesh of about 30 μm, and the flexible base 74 is disposed between the intermediate membrane filters 70. The frame is constituted by the filter frame (72). Such an interlayer filter 70 is installed across the middle of the tank 42 by the interlayer filter support 80. And the interlayer membrane filter 70 is configured to be conveniently detachable at the time of cleaning and maintenance of the filter cloth 78 by having a handle on the top. And the primary filter 54 is installed on the discharge circulation line 50 to remove the suspended matter in the plating liquid. Such a primary filter 54 can be used to effectively remove the suspended solids by using a filter medium having a higher degree of filtration than the filter cloth 78 of the interlayer membrane filter 70, in this embodiment synthetic resin to have a mesh of about 2㎛ The cartridge filter manufactured and manufactured by the filter medium, such as a fiber, was applied.

The tertiary filter 140 is composed of a filter material made of activated carbon, and absorbs and removes organic impurities in a plating solution. Such a tertiary filter 140 may be used in various forms, but in this embodiment, the third filter 140 may be used by being coupled to an electrode bar that is not connected to a power source among the electrode bars 110. Of course, the tertiary filter 140 may be configured to have a latch structure (for example, a structure caught on the side wall of the tank 42) that is configured separately from the present embodiment.

3 is a flowchart illustrating a plating liquid adjusting method of an ABS molded product plating system according to a preferred embodiment of the present invention.

3 and 4, the plating solution control method of the ABS molded product plating system according to the present invention, as described above, the nickel plating bath 34 and the weak electrolytic bath 40 discharge circulation line 50 and the supply circulation line (60), and while circulating the plating liquid in the nickel plating tank 34 continuously, impurities on the plating liquid are removed and the concentration of the plating liquid is adjusted.

More specifically, the plating liquid control method of the ABS molded product plating system according to a preferred embodiment of the present invention first floating the plating liquid of the nickel plating bath 34 through the primary filter 54 installed on the discharge circulation line 50. The material is removed and transferred to the first chamber 44 of the weak electrolytic cell 40 (S500). Next, by operating the stirrer 100 installed in the first chamber 44, while supplying a chemical (nickel compound, etc.) while stirring the plating liquid (S510). In this embodiment, the air is supplied from the blower 92 to the diffuser 94 installed at the bottom of the first chamber 44 to aeration the air into the plating solution so that the chemicals are dissolved and distributed effectively. In this way, the plating liquid into which the chemical is introduced into the first chamber 44 is flowed by the plating liquid (in this embodiment, by the pump 52 installed in the discharge circulation line 50 and the pump 62 installed in the supply circulation line 60). The plating liquid flows from the nickel plating bath 34 to the first chamber 44 of the weak electrolytic bath → the second chamber 46 of the weak electrolytic bath → the nickel plating bath 34, The second chamber 46 is moved (S520). The plating liquid moved to the second chamber 46 of the weak electrolytic bath is removed with metal ions on the plating liquid by the electric poles 110, 120, and 130 installed in the second chamber 46 (S530), and the second chamber 46. The organic impurities in the plating liquid are removed through the tertiary filter 140 installed in the plating liquid (S540). At this time, in the present embodiment, by supplying air from the blower 92 to the diffuser 96 installed at the bottom of the second chamber 46, aeration of the air into the plating liquid is performed so that the plating liquid is circulated to remove the organic impurities and the metal ions. Make the removal effective. Various impurities are removed by the above process and the plating liquid whose concentration is adjusted is repeated by transferring the nickel liquid to the nickel plating tank 34 through the supply circulation line 60, thereby forming the ABS molded product plating system 10 according to the present invention. While the silver plating process is in progress, it is effective to control the plating solution.

As described above, although the ABS molded article plating system according to a preferred embodiment of the present invention and a plating solution management method thereof are shown in accordance with the above description and drawings, this is only an example and is not limited to the scope of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made therein.

According to the ABS molded product plating system according to the present invention and the plating solution management method thereof, normal plating is performed by controlling the concentration of the plating solution and removing impurities in the plating solution while circulating the plating solution of the nickel plating bath through the weak electrolytic bath connected to the nickel plating bath. Since the impurity in the plating liquid can be effectively provided while the process is in progress, and the concentration of the plating liquid can be conveniently managed, it is possible to stably maintain the plating liquid in the nickel plating bath to manufacture a plated product having excellent quality. In addition, even when the plating operation is performed, impurities in the plating liquid of the nickel plating bath can be removed and the concentration of the plating liquid can be managed, so that productivity can be effectively managed.

Claims (7)

In the ABS molded article plating system for forming a copper, nickel, chromium layer on the surface of the ABS molded article by forming a chemical plating line and an electroplating line for chromium plating ABS molded parts used for automotive parts, The electroplating line is provided with a copper plating bath, a nickel plating bath and a chromium plating bath which are arranged in series to sequentially form copper, nickel, and chromium layers on the surface of the ABS molded article that has passed through the chemical plating line. The nickel plating bath of the plating line further includes a weak electrolytic bath connected to the nickel plating bath by a discharge circulation line and a supply circulation line to continuously circulate the plating solution in the nickel plating bath, thereby removing impurities on the plating solution in the nickel plating bath. ABS molding product plating system, characterized in that to remove and adjust the concentration of the plating liquid. The method of claim 1, The weak electrolyzer comprises a tank formed so that an upper surface thereof is opened; An intermediate membrane filter for dividing the tank into a first chamber and a second chamber across the middle of the tank and filtering the flowing plating liquid with a filter cloth; A stirrer installed in the first chamber to stir a plating liquid; An diffuser installed at the bottom of the first chamber and the second chamber for aeration of air supplied from the outside in the plating liquid; An electrode stand installed in the second chamber to remove metal ions on the plating liquid, and a pump is installed on the discharge circulation line to transfer the plating liquid in the nickel plating bath to the first chamber of the tank. And a pump on the supply circulation line to move the plating solution in the second room from the first chamber through the interlayer membrane filter to remove metal ions into the nickel plating bath. ABS molded product plating system. The method of claim 2, The weak electrolyzer comprises a primary filter installed on the discharge circulation line and having a filter medium having a higher degree of filtration than the filter cloth of the interlayer filter to remove suspended solids in the plating liquid transferred to the first chamber. And a tertiary filter for removing organic impurities on the plating liquid of the second room, the filter material being coupled to the electrode stand and made of activated carbon. The method of claim 2 or 3, At least two of the electrode stands are supported by electrode stand supports respectively provided on both sides of the tank across the upper portion of the second chamber, and at least one of the positive and negative poles of the power supplied from the outside is separately connected to each other. The above electrode bars; A positive electrode plate having one side coupled to an electrode bar to which a positive power is input among the at least two electrode bars, and the other side being installed to be immersed into the plating solution of the second chamber; And a negative electrode plate having one side coupled to an electrode bar to which a negative power is input from the at least two electrode bars, and the other side of the second electrode bar being immersed into the plating solution of the second chamber. The method of claim 4, wherein And the negative electrode plate is formed to have a concave portion and a recessed portion with respect to the positive electrode plate when the negative electrode plate is coupled to the electrode bar. The nickel plating bath, the discharge circulation line, and the supply circulation in an electroplating line including copper plating bath, nickel plating bath, and chrome plating bath to form copper, nickel, and chromium layers on the surface of the ABS molded article through the chemical plating line in sequence. In the plating solution control method of the ABS molded product plating system connected to the line to remove the impurities in the plating liquid and to adjust the concentration of the plating liquid while continuously circulating the plating liquid in the nickel plating tank, Transferring the plating liquid of the nickel plating bath to a first chamber of the weak electrolytic bath by removing suspended solids through a primary filter installed on the discharge circulation line; Operating a stirrer installed in the first chamber to supply a chemical while stirring the plating liquid to adjust the concentration of the plating liquid; Removing metal ions on the plating liquid by connecting an electric pole to the plating liquid moved from the weak electrolyte tank to the second chamber divided by an intermediate membrane filter for filtering the plating liquid flowing through the first chamber and the filter cloth; And removing the organic impurities in the plating liquid through a tertiary filter installed in the plating liquid of the second chamber and transferring the organic impurities to the nickel plating bath. The method of claim 6, Adjusting the concentration of the plating liquid and removing the metal ions further comprises the step of aeration of air supplied from the outside in the plating liquid by operating the diffuser installed in the bottom of the first chamber and the second chamber Plating solution control method of the ABS molded article plating system.

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