KR20050111860A - Transfer device for semi-conductor manufacture device - Google Patents

Abstract

The present invention manufactures semiconductor components such as wafer, FPD (Flayer Panel Displayer), PDDP (Plasma Display Pannel), Liquid Crystal Display (LCD), etc. In particular, the present invention relates to a conveying apparatus for a semiconductor manufacturing apparatus which allows to float and convey parts manufactured by air, water, and chemical liquid injected at a predetermined pressure.

The present invention is a fixed body made of one side is open to have a space of a predetermined size, and made of a ceramic or engineering plastics (Engineering Plastics) material, the porous body in the form of a multi-porous, multi-hole, coupled to one side of the fixture As the semiconductor component is transported and supplied in the injured state by the upper and lower floating means composed of the inlet which is formed and the supply pipe which is coupled to supply and spray air, water and washing water having a predetermined pressure through the inlet, In the transfer process, the failure rate due to contact can be suppressed as much as possible, and while being transported and supplied in an injured state, the washing, cleaning and drying processes are simultaneously performed by air, water, or chemical liquid.

Description

Transfer device for semi-conductor manufacturing device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer apparatus for a semiconductor manufacturing apparatus, and more particularly, to a wafer, a FPD (Flayer Panel Displayer), a PDP (Plasma Display Pannel), and a liquid crystal display (LCD). In the manufacture of semiconductor components such as the present invention, the present invention relates to a conveying apparatus for conveying components in each process, and in particular, to allow floating and conveying of components manufactured by air, water, washing water, etc. injected at a predetermined pressure. A transfer apparatus for a semiconductor manufacturing apparatus.

In addition, the present invention allows the semiconductor parts to be floated and moved by air, water, washing water, etc. sprayed at a high pressure, thereby making contactless during the transfer process, and at the same time in a floating and moving state. It is possible to use it in inspection equipment by enabling the change of direction to.

In general, a semiconductor is a substance in which electrical conduction is composed of electrons and holes, and its electrical resistivity, that is, the specific resistivity of which takes the intermediate value between the conductor and the insulator resistivity. will be.

In the semiconductor manufacturing process, single crystal growth → silicon rod cutting → substrate surface polishing → circuit design → MASK (RETICLE) fabrication → OXIDATION process → photoresist (PR) coating → chemical vapor deposition (Chemical Vapor Deposition) → metallization → substrate automatic screening → substrate cutting → chip bonding → gold wire connection → molding → final inspection.

In a semiconductor manufacturing process including a plurality of processes, a conveying apparatus having a conveying roller is used to sequentially convey the semiconductor parts.

Therefore, the semiconductor parts to be manufactured are transported through the respective processes by a plurality of transport rollers rotated by the transmission means, wherein the semiconductor parts are transported by being placed in surface contact with the transport rollers.

As described above, in the transfer apparatus used in the conventional semiconductor manufacturing apparatus, the surface is transported in a state of being in surface contact with the transfer roller in the process of transferring the semiconductor parts in each process, so that the contacted portion is damaged during the transfer process. Or contaminated by foreign matter, etc., to increase the defect rate of semiconductor components.

In addition, workability due to the manufacture and installation of the transfer roller rotated by the transmission means is poor and has a complicated structure. In particular, in the process of transferring by the transfer device, the process of etching, stripping, cleaning and cleaning, polishing, etc. There was a problem that the efficiency is reduced.

The present invention is to solve the above-mentioned conventional closed and problems, the object is to manufacture a variety of semiconductor parts using a semiconductor manufacturing apparatus, the transfer device for transporting and supplying semiconductor components in each process is installed However, the semiconductor parts to be manufactured are floated to be brought into contactless state to be transported and supplied, so as to minimize the defect rate due to contact, and to be transported and supplied in an injured state to air, water, or washing water. The present invention seeks to provide a transfer device for a new type of semiconductor manufacturing apparatus in which washing, washing and drying processes are performed efficiently at the same time.

The present invention can freely adjust and set the arrangement and installation direction and the transfer direction according to the installation of the transfer device which floats and supplies the semiconductor parts, and injects and blows the air, water, and washing water under high pressure to transfer and supply the floating parts. Since it has a simple structure to be made, it is to provide a transport device that is easy to manufacture, install and disassemble, easy and easy to trouble-free.

In order to achieve the above object, the present invention is a fixed body made of one side is opened and has a predetermined size space therein, and made of a ceramic or engineering plastics (Polymer), porous and multi-porous porous body, The semiconductor part is injured by the upper and lower floating means consisting of an injection hole coupled to one side of the fixture and a supply pipe coupled to supply and spray air, water and washing water having a predetermined pressure through the injection hole. While being transported and supplied to the washing machine, the washing unit, the washing unit, the drying unit, the turning unit, and the manufacturing unit are characterized by being passed through.

In the present invention, the side stopper is installed at both ends of the transfer means corresponding to the washing unit, the cleaning unit, the drying unit, the side stopper is a bearing is installed by the connecting link, the connecting link is a hinge shaft and tension It is characterized by being connected to the spring force by the spring.

In the present invention as described above, the porous body of the upper and lower conveying means has a plurality of through-holes formed to face the conveying direction.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 to 6, the fixed body 12, 12 'constituting the upper and lower floating means (10, 10') of the conveying apparatus 1 according to the present invention is open on one surface and predetermined inside It is made to have a size of space, the porous body (14, 14 ') is made of a porous or multi-hole form of ceramic or engineering plastics (Engineering Plastics) material, the injection hole on one side of the fixing body (12, 12') (16) is combined, and air, water, washing water, etc. which have predetermined pressure are comprised so that it may be couple | bonded and supplied by the supply pipe 18. As shown in FIG.

Therefore, while the semiconductor parts are transported and supplied in the state of being floated by the upper and lower floating means 10 and 10 ', the washing unit 20, the washing unit 30, the drying unit 40, and the turning unit ( 50) will be manufactured through the transfer unit 60.

In this case, the porous bodies 14 and 14 'are coupled in close contact with the fixing bodies 12 and 12' by rivets or adhesives, and the washing unit 20, the washing unit 30, and the drying unit 40 are provided. Bearing 73 is installed at both sides of the upper and lower floating means (10, 10 ') corresponding to the connection link 72, the connection link 72 is a hinge shaft 74 and the tension spring (75) The side stopper 70 is connected to the fixing piece 76 so as to have a resilience force, and the porous bodies 14 and 14 'of the upper and lower conveying means 10 and 10' are provided to face the conveying direction. A plurality of through holes 11 inclined at an angle are formed.

1 is a schematic plan view showing a transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, Figure 2 is a side schematic view showing a transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, the upper and lower floating means (10, 10 ') Installed in a plurality of rows to be installed to form a room-type washing unit 20, the washing unit 30 and the drying unit 40, the washing unit 20 from the lower floating means (10 ') It is installed so that air having a predetermined pressure is supplied and sprayed, and water having a predetermined pressure is supplied and sprayed by the upper and lower floating means 10 and 10 'at a position spaced apart from the side by a predetermined distance.

At this time, the fixing body (12, 12 ') of the upper and lower floating means (10, 10') to which the water is supplied and sprayed is provided with an ultrasonic vibrator (13) for imparting ultrasonic vibration of the supplied water.

In addition, the cleaning unit 30, the upper and lower floating means (10, 10 ') is installed at a position spaced apart a predetermined distance from the cleaning unit 20, the acid and alkaline chemicals through the supply pipe (18) The chemicals mixed with the chemicals are installed to be supplied and sprayed with a predetermined pressure, and the fixing bodies 12 and 12 'are provided with an ultrasonic vibrator 13 for imparting ultrasonic vibrations of the chemicals to be injected. The lateral direction corresponding to the direction indicates that the high pressure air and water are sprayed by the injection pipe 32 and the injection nozzle 34.

In addition, the drying unit 40 having three stages is installed on the side spaced apart from the washing unit 30 by a predetermined distance, and the drying unit 40 is provided by the air injector 42 installed at the upper and lower portions in the first stage. Firstly, water or chemical liquid remaining on the surface of the semiconductor component transferred through the cleaning unit 20 and the cleaning unit 30 is first removed, and cold air is applied to the upper and lower floating means 10 and 10 'in two steps. Secondary drying is performed by supplying and spraying, and the third drying is performed by supplying and spraying hot air to the upper and lower floating means in three stages.

As such, while the cleaning unit 20, the cleaning unit 30, and the drying unit 40 are transported in an injured state, the semiconductor component, which has been cleaned, cleaned, and dried, is injured in the direction changing unit 50. It is conveyed and is converted to the front, rear and left and right directions, and after the direction change is made, it is conveyed by the conveying unit 60.

At this time, the transfer unit 60 is the upper and lower floating means (10, 10 ') for transferring the semiconductor parts in the injured state is made of a vertical method, according to the transfer direction, by freely selecting the horizontal method or vertical method Can be used.

Figure 3 is an enlarged perspective view of the main portion of the transfer device for a semiconductor manufacturing apparatus according to the present invention, showing the lower floating means (10, 10 ') according to the present invention, the upper surface is open in the form of a rectangular frame 12, 12' The porous body 14, 14 'made of a porous material and a multi-porous material is coupled to shield an open part, and air having a predetermined pressure is supplied to the fixed body 12, 12' by a supply pipe 18. It indicates what is possible.

In addition, the porous bodies 14 and 14 'are provided with a plurality of through holes 11 in an inclined shape so as to face one direction, that is, a direction in which the semiconductor components are transferred.

At this time, since the porous body 14, 14 'is made of a material of a multi-pore and a multi-hole, the air supplied into the fixed body 12, 12' through the supply pipe 18 is dispersed and discharged, in this process, Some of the air supplied is dispersed and discharged in the inclined direction through the through holes 11.

4 is an exploded perspective view illustrating main parts of a transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, in which air, water, and chemical liquid having a predetermined pressure are injected by upper and lower floating means 10 and 10 'through a supply pipe 18. In the process of floating and conveying the semiconductor component, the side stopper 70 is installed to prevent the semiconductor component conveyed for washing, cleaning, and drying in the injured state from being pushed out to the side.

The side stopper 70 has a bearing 73 coupled to one end of the connection link 72, the other end is coupled to the fixed piece 76 by a hinge shaft 74 and the tension spring 75. As such, the connection link 72 to which the bearing 73 is coupled has a predetermined elasticity by the tension spring 75.

5 is a cross-sectional view taken along the line A-A of Figure 1, showing the direction change section 50 of the conveying device 1 according to the present invention, the porous body in the fixed body (12, 12 ') of the rectangular frame shape having a certain size 14 and 14 'are coupled to each other, and the upper and lower floating means 10 and 10' are formed so as to form a plurality of rows so that air, water, chemical liquid, etc. are supplied by the supply pipe 18 and sprayed.

In this case, the porous bodies 14 and 14 ′ show that the through holes 11 for changing the transfer direction of the semiconductor parts to be transferred and supplied are inclined at a predetermined angle.

6 (a) and 6 (b) are schematic views showing that the semiconductor components are lifted and transferred by the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, Figure 6 (a) is the upper and lower floating means (10, 10) (B) shows that the semiconductor component is floated by the injection pressure in the air, water or the chemical liquid injected in the vertical direction from the porous bodies 14 and 14 'of FIG. 6, and FIG. 6 (b) shows the upper and lower floating means 10 10'. It is conveyed in the state of being floated by the through-hole 11 formed in the porous body (14, 14 ') of.

At this time, the through hole 11 is inclined at a predetermined angle so as to face the direction in which the semiconductor component is to be transported, and thus air, water, or chemical liquid sprayed through the hole 11 is inclined.

7 (a), 7 (b) and 7 (c) are plan views showing other embodiments of the upper and lower floating means of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, and FIG. And a plurality of concatenations in the transverse direction to form a unitary structure in which the fixing bodies 12 and 12 'to which the porous bodies 14 and 14' are coupled to the open portion are easily separated and joined. Fig. 7 (b) shows that the upper and lower floating means 10, 10 'each have a unitary structure that is easy to disassemble and combine, and are installed to have a double row double structure, and Fig. 7 (c). Denotes that the fixing bodies 12, 12 'and the porous bodies 14, 14' of the upper and lower floating means 10, 10 'are made long to have a predetermined length in the transverse direction, and are installed to have three rows of double castings. will be.

At this time, in the fixed body (12, 12 ') according to the embodiment of Figure 7 (a) through the coupling hole 15 is communicated with each other in a connected state through the supply pipe 18 for supplying air, water or chemical liquid, etc. In the embodiment of FIGS. 7 (b) and 7 (c), a separate supply pipe 18 is installed in each of the fixed bodies 12 and 12 'installed in a double-row and three-row doubled structure, thereby providing air and water. Or chemical liquids.

8 (a), 8 (b) and 8 (c) are side cross-sectional views showing still another embodiment of the upper and lower floating means of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention. The porous bodies 14 and 14 'are coupled to the fixed bodies 12 and 12' with open surfaces, and the high-pressure air, water or chemical liquid is supplied into the fixed bodies 12 and 12 'by the supply pipe 18. The upper surface (lower surface) partially cuts both ends of the lower end of the upper and lower floating means 10, 10 'equipped with the ultrasonic vibrator 13, and the fixing bodies 12, 12' in FIG. And a portion of both ends of the lower ends of the porous bodies 14 and 14 'are rounded (R). In FIG. 8 (b), portions of both the lower ends of the fixing bodies 12 and 12' and the porous bodies 14 and 14 'are positioned. The chamfering process is shown, and FIG. 8 (c) shows that a portion of both the lower ends of the fixed bodies 12 and 12 'and the porous bodies 14 and 14' is cut out in a 'C' shape.

9 (a) and 9 (b) are perspective views showing another embodiment of the side stopper of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, in which the semiconductor parts are transported in an injured state for cleaning, cleaning and drying. The side stopper 70 is installed to prevent it from being pushed away, and the side stopper 70 is installed to adjust a predetermined elasticity by the first and second connection links 70a and 70b.

The first and second connection links 70a and 70b are mutually coupled to each other by a hinge shaft 74 and a tension spring 75, and the second connection link 70b is a hinge shaft 74 and a tension spring. It is coupled to the fixed piece 76 by the (75) to be rotatable.

At this time, the tension spring 75 coupled between the first connection link 70a and the second connection link 70b to which the bearing 73 is coupled, and between the second connection link 70b and the fixing piece 76. The tension springs 75 coupled to each other have tension forces of different sizes, and the second connection links 70b than the tension forces of the tension springs 75 coupled between the first and second connection links 70a and 70b. ) And the tension spring 75 coupled between the fixing piece 76 has a large tension force.

And, in the embodiment according to Figure 9 (b) is connected to the bearing 73 used to prevent the separation of the semiconductor component in a multi-stage form using the first, second, third connection links (70a, 70b, 70c). It has a structure.

10 is a plan view showing another embodiment of the redirection unit of the transfer device for a semiconductor manufacturing apparatus according to the present invention, while the transfer direction of the semiconductor component to be transferred in a floating state, the front, rear and left, It is to be able to freely switch to the right direction.

The upper and lower floating means (10, 10 ') are installed to form a plurality of rows in the form of a checkerboard, that is, vertically and horizontally, to maintain the floating state of the semiconductor parts and to change the transfer direction. The porous bodies 14 and 14 'coupled to the stagnations 12 and 12' are provided with a plurality of through holes 11 which are inclined at a predetermined angle so that the semiconductor parts can be lifted and moved in the front, rear and left and right directions. Each of the through holes 11 is provided with supply pipes 18 for supplying air, water or chemical liquid having a predetermined pressure.

FIG. 11A is a cross-sectional view taken along the line BB of FIG. 10, FIG. 11B is a cross-sectional view taken along the line CC of FIG. 10, and FIG. 11C is a cross-sectional view taken along the line DD of FIG. 10. The lower floating means (10, 10 ') of the turning section 50 is installed for the turning of the direction.

First, FIG. 11 (a) shows that the through hole 11 is formed to be inclined at a predetermined angle toward the arrow direction, that is, the right direction, in the porous body 14 'coupled to the fixed body 12', and FIG. 11 (b). ) Indicates that the through hole 11 is formed to be inclined at a predetermined angle so as to face the arrow direction, that is, forward in the porous body 14 ′ coupled to the fixed body 12 ′, and FIG. 11 (c) shows the fixed body 12. It indicates that the through-hole 11 is formed to be inclined at a predetermined angle so as to face the arrow direction, that is to the rear in the porous body 14 'coupled to').

At this time, the inclination angle of each of the through holes 11 formed in the porous body 14 ′ is preferably within a range of about 15 to 60 ° with a predetermined angle in the direction to be transferred.

12 is a side schematic view showing another embodiment of the direction change unit of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, for switching the transfer direction of a semiconductor component conveyed in an injured state, the upper floating means ( 10, the air, water or chemical liquid supplied from the supply pipe 18 is injected downward with a predetermined pressure through the porous body 14 coupled to the fixed body 12, the lower floating means 10 'is one direction The fixed body 12 'to which the porous body 14' having the through-hole 11 inclined shape is coupled is fixed to be mounted on the rotating plate 17, and the rotating plate 17 is rotated by the rotating means M. Is coupled to the rotating shaft 17, which indicates that the lower floating means (10 ') made to rotate.

At this time, the supply pipe 18 for supplying air, water or chemical liquid into the fixed body 12 'of the lower floating means 10' bar is installed, the supply pipe 18 is lowered by the rotary shaft 17 In the process of rotating the floating means (10 '), it is made of a rubber tube having a flexibility to be interlocked together, or made of a cable form and a corrugated tube wound in the form of a coil to freely adjust the length.

In addition, since the lower floating means 10 'of the redirection unit 50 is rotated for the redirection by the rotation shaft 17, the through hole 11 formed in the porous body 14' is used for redirection. It is formed to be inclined only in one direction without being inclined toward the front, rear and left and right directions.

13 (a) and 13 (b) are a perspective view and a longitudinal sectional view showing a fixing jig for wafer transfer of a transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, in which various semiconductor components are floated using the transfer apparatus 1; In the process of carrying out the cleaning, cleaning, drying, and redirection by transferring, when manufacturing a wafer in the form of a disc, the fixing jig for wafers 80 used for stable transfer are shown.

The fixing jig 80 has a rectangular shape in which a plurality of fixing pieces 82 protrude so that stable fixing is performed while the wafer is placed thereon, and an opening hole 84 having a diameter slightly smaller than the diameter of the wafer is formed at the center thereof. It consists of a transfer plate (86).

14 (a) and 14 (b) are a perspective view and a longitudinal sectional view showing another embodiment of a fixing jig for transferring a wafer of a transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, wherein the fixing jig 80 for transferring a wafer is shown. It is to indicate that the opening hole 84 is penetrated so that the locking step 83 and the seating groove 85 is formed in the center portion of the transfer plate 86 of the stepped form.

Such a state of use of the embodiment of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention is as follows.

1 to 6 (b), in the process of manufacturing the semiconductor component, the semiconductor component to be transported is floated and transferred using the upper and lower floating means 10 and 10 ', and the semiconductor component is Washing, cleaning and drying are simultaneously performed by air, water, or chemicals used to float and move, and the direction of transfer of the semiconductor parts to be transferred can be freely changed. First, as shown in FIG. A room for washing, cleaning and drying the parts is formed, and each room is provided with upper and lower floating means 10 and 10 'capable of injecting air, water, and chemical liquid at a predetermined pressure.

In this state, the semiconductor parts are transported while being washed, cleaned, and dried while passing through the respective rooms, and the supplied semiconductor parts are transported in the injured state by the upper and lower floating means 10 and 10 '. Will be.

At this time, the semiconductor component is floated, the porous body 14, 14 'coupled to the air, water or chemical liquid having a predetermined pressure through the supply pipe 18 is supplied to the fixed body 12, 12', and then coupled thereto. As the upper and lower parts are injected through the upper and lower parts, the semiconductor component is floated by the injection pressure, and in the injured state, the air, water and the chemical liquid supplied through the supply pipe 18 are porous bodies 14 and 14. In the process of spraying by '), it is sprayed to face in one direction (conveying direction) through the through hole 11 formed in the porous body 14, 14', it is sprayed to face the conveying direction through the through hole (11) It is transported in an injured state by the jetting force of air, water and chemical liquid.

In this way, while the air, water and the chemical liquid are injected by the upper and lower floating means 10 and 10 'at a predetermined pressure, the semiconductor parts are lifted and transported, and the respective rooms are lifted and moved. In addition, the dust and foreign substances caught between the surface and the gap of the semiconductor component are removed by the spraying force of the chemical liquid mixed with air and water, or acidic and alkaline chemicals.

Then, the semiconductor component is cleaned (washed) by air and water is dried by the cold and hot air while passing through the drying unit 40, the water is completely removed.

In this way, the semiconductor component, which has been cleaned, cleaned and dried, is changed and set in the conveying direction by the reverberation switching section 50, and the semiconductor component dried by the drying section 40 is oriented in a floating state. When transported to the switching unit 50, it is transported by the upper and lower floating means (10, 10 ') corresponding to the echo switching unit 50, as in the cleaning and cleaning unit (20, 30) and drying unit (40) In the state in which the semiconductor component is floated, it is transferred in a direction to be transferred, that is, in a forward, backward direction and left and right directions.

The upper and lower floating means (10, 10 ') provided in the redirection unit 50 is supplied with air or water or chemical liquid having a predetermined pressure through the supply pipe 18 into the fixed body (12, 12') At the same time as being injected through the 14 (14, 14 ') and the air, or water or chemical liquid through another supply pipe 18 is made to be injected through the through hole 11 formed in the porous body (14, 14'), in particular, the porous body The through holes 11 formed at 14 and 14 'face in different directions, namely, front, rear and left and right directions (see attached drawings 10 (a), 10 (b) and 10 (c)). Since it has a state inclined at a predetermined angle so that the air, water or chemical liquid to be supplied and sprayed through this is sprayed to face in different directions.

Therefore, when it is desired to transfer the semiconductor component transferred to the redirection unit 50 to the front, air or water only in the supply pipe 18 formed so that the through-hole 11 formed in the porous bodies 14 and 14 'faces forward. In order to transfer the liquid to the front, and to transfer in the left direction or the right direction, air, water or the chemical liquid is transferred to the through holes 11 of the porous bodies 14 and 14 'formed to face the respective directions. It is fed and sprayed to transfer in the desired direction.

In this way, the semiconductor component conveyed with the conveying direction set by the direction changing unit 50 is conveyed while maintaining the injured state through the conveying unit 60, and the semiconductor component is floated and conveyed in the conveying unit 60. The process is performed by the upper and lower floating means (10, 10 '), as in the cleaning and cleaning unit (20, 30).

In the transfer apparatus 1 according to the present invention, the semiconductor is floated and transferred due to the center of gravity or the minute injection pressure difference in the process of floating and transferring the semiconductor component by the upper and lower floating means 10 and 10 '. There is a possibility that the component is pushed out to the side and separated, but as shown in the accompanying drawings, the two side ends are formed at equal intervals and a plurality of side stoppers 70 are installed, so that in the process of floating and transferring semiconductor components In other words, the phenomenon of being pushed out to the side does not occur at all.

At this time, the side stopper 70 is installed to prevent the side departure of the semiconductor component, is not fixed in a floating state, it is installed to have a predetermined elasticity, the bearing 73 in contact with the semiconductor component is fixed Connecting link 72 is pivotally connected to the fixed piece 76 by the hinge shaft 74, the connecting link 72 and the fixed piece 76 has a predetermined elastic force by the tension spring (75). Therefore, when the semiconductor parts to be lifted and transported are pushed to the side, they are absorbed while absorbing the impact caused by the contact, and are returned to their original positions by the elastic force of the tension spring 75.

Therefore, in the process of transferring the semiconductor component, even if it is pushed to the side, it is not separated by the side stopper 70, the normal transfer is made, and at the same time prevents the side departure of the semiconductor component, The shock is absorbed and buffered so that the impact of the contact is not applied to the semiconductor component at all.

The lateral stopper 70 for preventing lateral deviation of the semiconductor component can be used in other embodiments as shown in FIGS. 9 (a) and 9 (b). In the embodiment according to the present invention, a bearing 73 used to prevent lateral separation of the semiconductor component is coupled to the first connection link 70a, and a second connection between the first connection link 70a and the fixing piece 76 is performed. The link 70b has a structure in which the link 70b is connected, thereby improving the elasticity for preventing the detachment of the semiconductor component and reducing the load applied due to the impact caused by the contact. In the embodiment of FIG. The bearing 73 used to prevent the departure of the component is to have a structure that is connected in a multi-stage form using the first, second, third connection links (70a, 70b, 70c).

At this time, the second connecting link 70b and the fixing piece 76 than the elastic force of the tension spring 75 installed between the first and second connecting links 70a of the side stopper 70 according to FIG. 9 (a). The tension force of the tension spring 75 is installed between the) is made large, the tension spring 75 is installed between the first and second connection links (70a, 70b) of the side stopper 70 according to Figure 9 (b). The elastic force between the tension spring 75 installed between the second and third connection links 70 and the tension spring 75 installed between the third connection link 70c and the fixing piece 76 may include: The elastic force of the tension spring 75 installed between the second and third connection links 70b and 70c is greater than the elastic force of the tension spring 75 installed between the two connection links 70a and 70b. The elastic force of the tension spring 75 provided between the third connection link 70c and the fixing piece 76 is greater than the elastic force of the tension spring 75 provided between the 70b and 70c.

As such, when the elastic force of the tension springs 75 installed on each of the plurality of tension springs 75 is gradually increased, depending on the structure and weight of the semiconductor component, or the degree of deviation, the shock absorbing and buffering can be achieved and the smooth elasticity can be achieved. will be.

Another embodiment of the direction switching unit 50 of the transfer apparatus according to the present invention as shown in Figures 10 to 12, which can be variously implemented, first in the embodiment according to Figure 10 echo switching unit The fixing bodies 12 and 12 'of the upper and lower floating means 10 and 10' forming the 50 have a structure divided into a plurality of checker boards, and are coupled to the respective fixing bodies 12 and 12 '. A plurality of through holes 11 are formed to be inclined toward the front, rear, left, and right directions in the porous bodies 14 and 14 ', and the through holes 11 are formed by air, which are different from each other by the supply pipes 18, respectively. Alternatively, as the water or the chemical liquid is installed to be supplied and sprayed, the transferred semiconductor component can be freely converted in a desired direction by the user.

At this time, the fixed bodies 12, 12 'and the porous bodies 14, 14', through which the air, water, or chemical liquid is supplied and sprayed by the supply pipe 18, are different from each other depending on the direction to be switched and transported. It will have a slope inclined in the direction, which is in the range of about 15 to 60 degrees depending on the direction to be transferred, as shown in FIGS. 11 (a), 11 (b) and 11 (c). The angle of inclination is achieved.

As shown in FIG. 12, the lower floating means 10 ′ of the turning unit 50 is directly rotated using the rotating means M to change the conveying direction, and the rotating means M The rotating plate 19 is installed on the rotating shaft 17 rotated by the above, and the lower floating means 10 'is mounted on the upper surface of the rotating plate 19 to be coupled to rotate.

Accordingly, as in the embodiment according to FIG. 10, without installing a plurality of through holes 11 and a plurality of supply pipes 18 corresponding to the porous bodies 12 and 12 ′ in respective directions for changing directions, respectively. In addition, it forms only the through-hole 11 of the inclined shape to face in one direction, freely set in the desired direction in all directions as well as front, rear, left and right directions, as well as transfer direction, easy, easy and efficient transfer. You can change direction.

Although not shown in the drawings in the present invention as described above, and separate storage tank for supplying air, water or chemical liquid through the supply pipe 18 to each of the upper and lower floating means (10, 10 ') and In order to collect and recover the water or chemicals sprayed for the floating and transporting, the water purifying and collecting trays are installed, and a supply device for supplying air, water and chemicals at a predetermined pressure is used. Since these are well-known components that are commonly used, detailed descriptions and drawings are omitted. As in the present invention, air, water, or chemicals are sprayed at a predetermined pressure to float and transport semiconductor components. As a means can be used in various modified embodiments in addition to the embodiment according to the accompanying drawings 1 to 13, which is intended to pursue in the present invention It will have to be determined to be within the scope of the purpose and the technical configuration.

As described above, according to the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention, the semiconductor parts can be floated to be transported and supplied so as to be in a non-contact state, and in the transfer process, the defective rate due to contact can be suppressed as much as possible. In addition, while being transported and supplied in an injured state, the washing, washing, and drying processes are simultaneously performed by air, water, or a chemical solution, thereby achieving an efficient and economical effect.

In addition, the present invention can freely adjust and set the arrangement and installation direction and the transfer direction according to the installation of the transfer device for floating and supplying the semiconductor components, and the transfer device has a simple structure as a whole, manufacturing, installation and disassembly It is easy and easy to assemble, almost no trouble, and easy to handle, maintain and manage.

1 is a schematic plan view showing a transfer device for a semiconductor manufacturing apparatus according to the present invention;

Figure 2 is a schematic side view showing a transfer device for a semiconductor manufacturing apparatus according to the present invention,

3 is an enlarged perspective view of main parts of a transfer device for a semiconductor manufacturing apparatus according to the present invention;

4 is an exploded perspective view of main parts of a transfer device for a semiconductor manufacturing apparatus according to the present invention;

5 is a cross-sectional view taken along the line A-A of FIG.

6 (a), 6 (b) is a schematic diagram showing that the semiconductor component is floated and transferred by the transfer device for a semiconductor manufacturing apparatus according to the present invention,

7 (a), 7 (b) and 7 (c) are plan views showing other embodiments of upper and lower floating means of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention;

8 (a), 8 (b) and 8 (c) are side cross-sectional views showing still another embodiment of upper and lower floating means of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention;

9 (a) and 9 (b) are perspective views showing another embodiment of the side stopper of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention;

10 is a plan view showing another embodiment of the redirection unit of the transfer device for a semiconductor manufacturing apparatus according to the present invention;

(A) is sectional drawing in the B-B line | wire of FIG.

(B) is sectional drawing C-C line | wire of FIG.

(C) is sectional drawing along the D-D line | wire of FIG.

12 is a side schematic view showing still another embodiment of the direction change unit of the transfer apparatus for a semiconductor manufacturing apparatus according to the present invention;

Figure 13 (a), 13 (b) is a perspective view and a longitudinal sectional view showing a fixing jig for wafer transfer of the transfer device for a semiconductor manufacturing apparatus according to the present invention;

14 (a) and 14 (b) are a perspective view and a longitudinal sectional view showing another embodiment of the fixing jig for wafer transfer of the transfer apparatus for semiconductor manufacturing apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

1: transfer unit 10: upper floating unit

10 ': Lower floating device 12, 12': Fixed body

14, 14 ': porous body 20: washing section

30: Tax administration 40: Drying department

50: direction change part 60: transfer part

70: side stopper 70a: first connecting link

70b: second connection link 70c: third connection link

72: connection link 73: bearing

74: hinge shaft 75: tension spring

80: fixed jig

Claims (17)

Fixtures 12 and 12 'having one side open and having a predetermined size therein, and ceramics are made of Engineering Plastics and are made of porous and multi-porous porous bodies 14 and 14'. And an inlet 16 coupled to one side of the fixtures 12 and 12 ', and a supply pipe 18 to supply and spray air, water, and chemical liquid having a predetermined pressure through the inlet 16. The cleaning part 20, the cleaning part 30, the drying part 40, the direction change part 50, and the transfer part while the semiconductor parts are injured by the combined upper and lower floating means 10 and 10 ′. 60) A transfer device for a semiconductor manufacturing apparatus, characterized in that the transfer and supply to pass through. The method of claim 1, Transfer device for a semiconductor manufacturing apparatus, characterized in that the side stopper 70 is installed at both ends of the cleaning unit 20, the cleaning unit 30, the drying unit 40. The method of claim 1, Transfer device for a semiconductor manufacturing apparatus, characterized in that the porous body (14, 14 ') of the upper and lower transfer means (10, 10') is formed with a plurality of through holes (11) inclined to face the transfer direction. The method of claim 1, The fixed body 12, 12 'of the upper and lower floating means (10, 10') is composed of a unitary structure that is easy to separate and combine, respectively, characterized in that a plurality of joints in the transverse direction (결합) are combined Transfer device for semiconductor manufacturing apparatus. The method of claim 1, The fixing bodies 12 and 12 'of the upper and lower floating means 10 and 10' are each formed of a unitary structure that is easy to disassemble and combine, and are installed to have a double row double structure. Conveying device. The method of claim 1, The fixed body 12, 12 'of the upper and lower floating means 10, 10' is made long to have a predetermined length in the transverse direction, and the transfer apparatus for a semiconductor manufacturing apparatus, characterized in that it is installed to have three rows of double casting. . The method of claim 1, Fixtures 12, 12 'of the upper and lower floating means (10, 10') corresponding to the direction change section 50 is installed in the form of a checkerboard forming a plurality of rows in the longitudinal and transverse directions, each fixed body The porous bodies 14 and 14 'coupled to the 12 and 12' are formed with a plurality of through holes 11 inclined at a predetermined angle so that the semiconductor components can be lifted and moved in the front, rear, left and right directions. Each through-hole (11) is a transfer device for a semiconductor manufacturing apparatus, characterized in that the supply pipe (18) for supplying air, water or chemical liquid having a predetermined pressure, respectively is provided. The method of claim 1, The lower floating means 10 ′ corresponding to the turning part 50 is coupled to the rotating shaft 17 and the rotating plate 19 installed to be rotated by the rotating means M to change the transfer direction of the semiconductor component by rotation. Transfer device for a semiconductor manufacturing apparatus, characterized in that the installation is made. The method of claim 1, The fixing device (12, 12 ') of the upper and lower floating means (10, 10') is an ultrasonic vibrator (13), characterized in that the transfer device for a semiconductor manufacturing apparatus. The method of claim 1, A transfer device for a semiconductor manufacturing apparatus, characterized in that the upper and lower floating means (10, 10 ') and the fixed body (12, 12') and both ends of the lower end of the porous body (14, 14 ') are rounded (R). The method of claim 1, Transfer device for a semiconductor manufacturing apparatus, characterized in that the chamfered treatment on both the fixed body (12, 12 ') and the lower end of the porous body (14, 14') of the upper and lower floating means (10, 10 ').  The method of claim 1, For the semiconductor manufacturing apparatus, characterized in that the upper portion and the lower portion of the fixing body (12, 12 ') of the floating means (10, 10') and both of the lower end of the porous body (14, 14 ') in a' C 'shape Conveying device. The method of claim 1, The upper and lower floating means (10, 10 ') using a fixing jig 80 made of a conveying plate 86 of a rectangular shape with a plurality of fixing pieces 82 protruding, the opening hole 84 is formed in the center Transfer device for a semiconductor manufacturing apparatus, characterized in that configured to transfer a wafer (wafer). The method of claim 2, The side stopper 70 is a bearing 73 is installed by a connection link 72, the connection link 72 is characterized in that it is connected to have a resilient force by the hinge shaft 74 and the tension spring (75). Transfer device for semiconductor manufacturing apparatus. The method of claim 2, The side stopper 70 is installed so that a predetermined elastic force is adjusted by the first and second connection links (70a, 70b), The first and second connection links 70a and 70b are mutually coupled to each other by a hinge shaft 74 and a tension spring 75, and the second connection link 70b is a hinge shaft 74 and a tension spring. Transfer device for a semiconductor manufacturing device, characterized in that coupled to the fixed piece (76) by a rotation (75). The method of claim 2, The side stopper 70 is installed so that a predetermined elastic force is adjusted by the first, second, third connection links (70a, 70b, 70c), The first and second connection links 70a and 70b are coupled to each other by a hinge shaft 74 and a tension spring 75 so as to be elastically coupled, and the first and second connection links 70a and 70b are hinged to each other. It is elastically coupled by the shaft 74 and the tension spring 75, the third connecting link (70c) is rotatably coupled to the fixed piece 76 by the hinge shaft 74 and the tension spring (75). Transfer device for semiconductor manufacturing apparatus, characterized in that. The method of claim 13, The fixing jig 80 is a conveyance for a semiconductor manufacturing apparatus, characterized in that the opening hole 84 is penetrated so that the locking jaw 83 and the seating recess 85 are formed in the center portion of the transfer plate 86. Device.