KR20050068691A - Equipment for preventing short in ribon cable - Google Patents
Equipment for preventing short in ribon cable Download PDFInfo
- Publication number
- KR20050068691A KR20050068691A KR1020030100412A KR20030100412A KR20050068691A KR 20050068691 A KR20050068691 A KR 20050068691A KR 1020030100412 A KR1020030100412 A KR 1020030100412A KR 20030100412 A KR20030100412 A KR 20030100412A KR 20050068691 A KR20050068691 A KR 20050068691A
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- South Korea
- Prior art keywords
- ribbon cable
- ring
- short circuit
- short
- prevention device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000002265 prevention Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 리본 케이블의 쇼트 방지 장치에 관한 것으로, 보다 자세하게는 쇼트 방지를 하기 위해 홈을 파서 오링을 보호하는 리본 케이블의 쇼트 방지 장치에 관한 것이다.The present invention relates to a short circuit prevention device of a ribbon cable, and more particularly, to a short circuit prevention device of a ribbon cable that protects an O-ring by digging a groove to prevent the short.
본 발명의 리본 케이블의 쇼트 방지 장치는 전자기 척의 어셈블리인 플라튼과 연결되는 리본 케이블과 상기 리본 케이블의 리크 방지를 위한 오링으로 구성된 쇼트 방지 장치에 있어서, 상기 오링의 외부에 홈을 파 소정 형상의 오링을 더 추가하여 구성됨에 기술적 특징이 있다.The short prevention device of the ribbon cable of the present invention comprises a ribbon cable connected to a platen, which is an assembly of an electromagnetic chuck, and an o-ring for preventing leakage of the ribbon cable. It is a technical feature because it is configured by adding more O-rings.
따라서, 본 발명의 리본 케이블의 쇼트 방지 장치는 전자기 척의 어셈블리에 누수의 방지를 위해 소정 모양의 홈을 파고 오링을 삽입함으로써 합선이나 쇼트를 방지하는 효과가 있다. Therefore, the short circuit prevention device of the ribbon cable of the present invention has an effect of preventing a short circuit or a short circuit by digging a groove having a predetermined shape and inserting an O-ring to prevent leakage in the assembly of the electromagnetic chuck.
Description
본 발명은 리본 케이블의 쇼트 방지 장치에 관한 것으로, 보다 자세하게는 쇼트 방지를 하기 위해 홈을 파서 오링을 보호하는 리본 케이블의 쇼트 방지 장치에 관한 것이다.The present invention relates to a short circuit prevention device of a ribbon cable, and more particularly, to a short circuit prevention device of a ribbon cable that protects an O-ring by digging a groove to prevent the short.
반도체 제조설비에서 식각 공정을 진행하는데 있어 고려되어야 할 주요사항은 웨이퍼의 균일성을 유지시켜 주어야 한다는 점이다. 상기 웨이퍼의 균일성은 웨이퍼가 올려지고 공정진행 시간 동안 고정시켜 주는 역할을 하는 전자기 척(Chuck)의 능력에 따라 달라지게 된다.The main consideration in the etching process in semiconductor manufacturing facilities is to maintain wafer uniformity. The uniformity of the wafer will depend on the ability of the electromagnetic chuck to serve to hold the wafer up and hold it for the duration of the process.
도 1은 종래의 반도체 제조설비의 식각공정에 적용되는 식각장치 구조를 도시한 도면이다. 도 1을 살펴보면, 종래는 고정된 전자기 척(10) 위에 웨이퍼가 올려지고 상부에서 실리콘 캐소드(Silicon Cathode)(20)를 통한 RF 파워를 받는 구조로 공정이 진행된다. 만약, 'A'라고 표시된 곳에 상기 실리콘 캐소드(20)나 RF 파워의 이상으로 다른 포인트보다 웨이퍼의 식각이 많이 되었다면 그 웨이퍼는 불량으로 남을 확률이 많아진다. 1 is a view illustrating an etching apparatus structure applied to an etching process of a conventional semiconductor manufacturing facility. Referring to FIG. 1, the process proceeds to a structure in which a wafer is mounted on a fixed electromagnetic chuck 10 and receives RF power through a silicon cathode 20 from the top. If the wafer is etched more than other points due to the abnormality of the silicon cathode 20 or the RF power where 'A' is marked, the wafer is more likely to remain defective.
또한, PM(Periodic Management)시 마다 상기 전자기 척(10)과 실리콘 캐소드(20)의 갭(Gap)을 체크하고 있지만 외부의 물리적 힘이나 갭 조립(Gap Assembly)의 리드 스크류(Lead Screw)의 마모나 체인의 늘어짐 또는 끊어짐 등 불량 요인은 여러 가지로 산재하여 있다.In addition, the gap between the electromagnetic chuck 10 and the silicon cathode 20 is checked at every PM (Periodic Management), but external physical force or wear of the lead screw of the gap assembly is observed. There are various causes of failure such as sagging or breaking of the chain.
도 2는 종래의 전자기 척의 리본 케이블을 나타내는 구성도이다. 도 2에 도시된 바와 같이, 전자기 척의 어셈블리인 플라튼(Platen)(30)은 웨이퍼를 잡을 때 사용하는 척에 전류를 흘리게 된다. 이로 인하여 열이 발생하는데 이때 열이 더 이상 올라가지 않도록 플라튼(30)에 물을 공급해서 상기 플라튼(30)을 냉각시킨다.2 is a configuration diagram showing a ribbon cable of a conventional electromagnetic chuck. As shown in FIG. 2, the platen 30, which is an assembly of the electromagnetic chuck, flows current to the chuck used to hold the wafer. As a result, heat is generated. At this time, the platen 30 is cooled by supplying water so that the heat does not rise any more.
상기 플라튼(30)의 연결부위에는 물이 공급되는 부분에 오링(O-Ring)(40)이 3개가 있다. 상기 오링(40)은 물의 공급으로 인한 누수를 방지하지 위한 것이다. 또한, 상기 플라튼(30)은 자체가 고정된 것이 아니라 공정을 진행하기 위해 좌우로 움직인다. The connection portion of the platen 30 has three O-rings (40) in the water supply portion. The O-ring 40 is for preventing leakage due to the supply of water. In addition, the platen 30 is not fixed itself, but moves left and right to proceed with the process.
상기 플라튼(30)을 장기간 사용하면 물 즉, 수분이 상기 오링(40) 밖으로 누출된다. 결국 플라튼(30)에 연결되어 상기 플라튼(30)에 전류를 흘려주는 리본 케이블(Ribbon Cable)(50)에 미세한 수분 접촉으로 인해 상기 리본 케이블(50)이 합선된다. 즉, 케이블 쇼트가 발생하는 문제점이 있었다. When the platen 30 is used for a long time, water, that is, moisture, leaks out of the O-ring 40. Eventually, the ribbon cable 50 is short-circuited due to the minute moisture contact with the ribbon cable 50 connected to the platen 30 to flow current to the platen 30. That is, there was a problem that a short circuit occurs.
따라서, 본 발명은 상기와 같은 종래 기술의 제반 단점과 문제점을 해결하기 위한 것으로, 소정 모양의 홈을 파 오링을 삽입하여 리본 케이블의 쇼트 및 합선을 방지하는 리본 케이블의 쇼트 방지 장치를 제공함에 본 발명의 목적이 있다. Accordingly, the present invention is to solve the above-mentioned disadvantages and problems of the prior art, and to provide a short circuit prevention device of the ribbon cable to prevent short and short circuit of the ribbon cable by inserting a groove ring of a predetermined shape. There is an object of the invention.
본 발명의 상기 목적은 전자기 척의 어셈블리인 플라튼과 연결되는 리본 케이블과 상기 리본 케이블의 리크 방지를 위한 오링으로 구성된 쇼트 방지 장치에 있어서, 상기 오링의 외부에 홈을 파 소정 형상의 오링을 더 추가하여 구성된 리본 케이블의 쇼트 방지 장치에 의해 달성된다.The object of the present invention is a short prevention device consisting of a ribbon cable connected to a platen, which is an assembly of an electromagnetic chuck and an O-ring for preventing leakage of the ribbon cable, further comprising an O-ring having a predetermined shape that is grooved outside of the O-ring. Is achieved by means of a short prevention device of the configured ribbon cable.
본 발명의 상기 목적과 기술적 구성 및 그에 따른 작용효과에 관한 자세한 사항은 본 발명의 바람직한 실시예를 도시하고 있는 도면을 참조한 이하 상세한 설명에 의해 보다 명확하게 이해될 것이다.Details of the above object and technical configuration of the present invention and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.
도 3은 본 발명에 따른 리본 케이블을 나타내는 구성도이다. 도 3에 도시된 바와 같이, 전자기 척의 어셈블리인 플라튼에 설치되어 있는 리본 케이블(120)의 단선으로 인한 상기 리본 케이블(120)이 합선되는 문제점을 오링(110)이 설치된 상기 오링(110)의 외부에 홈을 깎아 내어 소정의 형상인 오링(100)을 삽입하여 상기 오링(100)이 리본 케이블(120)의 물에 접촉되는 것을 막는다. 그러므로 2차로 쇼트와 합선을 예방할 수 있다. 상기 소정의 형상인 오링(100)은 바람직하게는 직사각형 또는 타원 모양이다.3 is a configuration diagram showing a ribbon cable according to the present invention. As shown in FIG. 3, the O-ring 110 has a problem in that the ribbon cable 120 is short-circuited due to disconnection of the ribbon cable 120 installed on the platen, which is an assembly of the electromagnetic chuck. The groove is cut out to insert an O-ring 100 having a predetermined shape to prevent the O-ring 100 from contacting the water of the ribbon cable 120. Therefore, it is possible to prevent shorts and short circuits in the second place. The predetermined shape of the o-ring 100 is preferably rectangular or elliptical.
본 발명에 따른 쇼트 방지를 위한 장치는 1차적으로 3개의 오링(110)이 누수를 방지하고, 2차적으로 직사각형 또는 타원 모양의 오링(100)이 누수를 방지하여 전자기 척에서 리본 케이블(120)의 쇼트와 합선을 방지할 수 있다.In the device for preventing shorts according to the present invention, three o-rings 110 primarily prevent leakage, and secondly, rectangular or oval-shaped o-rings 100 prevent leakage, so that the ribbon cable 120 in the electromagnetic chuck. Short and short circuit can be prevented.
본 발명은 이상에서 살펴본 바와 같이 바람직한 실시예를 들어 도시하고 설명하였으나, 상기한 실시 예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변경과 수정이 가능할 것이다. The present invention has been shown and described with reference to the preferred embodiments as described above, but is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.
따라서, 본 발명의 리본 케이블의 쇼트 방지 장치는 전자기 척의 어셈블리에 누수의 방지를 위해 소정 모양의 홈을 파고 오링을 삽입함으로써 합선이나 쇼트를 방지하는 효과가 있다.Therefore, the short circuit prevention device of the ribbon cable of the present invention has an effect of preventing a short circuit or a short circuit by digging a groove having a predetermined shape and inserting an O-ring to prevent leakage in the assembly of the electromagnetic chuck.
도 1은 종래의 반도체 제조설비의 식각공정에 적용되는 식각장치 구조를 도시한 도면이다.1 is a view illustrating an etching apparatus structure applied to an etching process of a conventional semiconductor manufacturing facility.
도 2는 종래의 전자기 척의 리본 케이블을 나타내는 구성도이다.2 is a configuration diagram showing a ribbon cable of a conventional electromagnetic chuck.
도 3은 본 발명에 따른 리본 케이블을 나타내는 구성도이다. 3 is a configuration diagram showing a ribbon cable according to the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030100412A KR20050068691A (en) | 2003-12-30 | 2003-12-30 | Equipment for preventing short in ribon cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030100412A KR20050068691A (en) | 2003-12-30 | 2003-12-30 | Equipment for preventing short in ribon cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050068691A true KR20050068691A (en) | 2005-07-05 |
Family
ID=37259228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030100412A Ceased KR20050068691A (en) | 2003-12-30 | 2003-12-30 | Equipment for preventing short in ribon cable |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20050068691A (en) |
-
2003
- 2003-12-30 KR KR1020030100412A patent/KR20050068691A/en not_active Ceased
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