KR20050064583A - Fabrication method for printing plate and fabrication method for lcd - Google Patents

Abstract

A first embodiment of a printing plate manufacturing method according to the present invention includes the steps of depositing a metal film on a printed board; Forming a photoresist layer on the metal film, and performing exposure and development to form a predetermined fine pattern on the photoresist layer; Performing wet etching on the resultant to pattern a metal film and removing the photoresist layer; And performing dry etching on the resultant image to form patterned fine grooves on the printed board, and removing the patterned metal film. It includes.

Further, after removing the patterned metal film, forming a photoresist layer on the resultant, and performing exposure and development to form a relatively wide pattern on the photoresist layer; Performing wet etching on the resultant to further form a relatively wide pattern on the printed board, and removing the photoresist layer; It is further provided.

In addition, a second embodiment of the printing plate manufacturing method according to the present invention comprises the steps of: depositing a film for the mask on the printing substrate; Forming a photoresist layer on the mask film, and performing exposure and development to form a predetermined pattern on the photoresist layer; Etching the resultant to pattern the mask film, and removing the photoresist layer; And sandblasting the patterned mask film to form patterned grooves in the printed board, and removing the patterned mask film. It includes.

Description

Manufacturing method and manufacturing method for liquid crystal display {Fabrication method for printing plate and fabrication method for LCD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display, and more particularly, to a printing plate manufacturing method and a liquid crystal display manufacturing method capable of forming various patterns together with a fine precision pattern.

Recently, as the information society has changed rapidly, the necessity of a flat panel display having excellent characteristics such as thinness, light weight, and low power consumption has emerged. Among them, liquid crystal display devices having excellent color reproducibility, etc. are actively active. Is being developed.

As is known, a liquid crystal display is formed by arranging two substrates each having electrodes formed on one side thereof so that the surfaces on which the two electrodes are formed face each other and injecting a liquid crystal material between the two substrates. In addition, the liquid crystal display device is a device for representing an image by changing the transmittance of light by moving the liquid crystal molecules by an electric field generated by applying a voltage to the two electrodes.

The lower substrate of the liquid crystal display is a TFT substrate including a thin film transistor for applying a signal to a pixel electrode, and is formed by repeating the process of forming and etching a metal film and an insulating film. In addition, the upper substrate of the liquid crystal display device is a color filter substrate including a color filter, in which three colors of red (R), green (G), and blue (B) are sequentially arranged.

1 is a diagram schematically illustrating a configuration of a general liquid crystal display device.

Referring briefly to FIG. 1, a general liquid crystal display device includes a TFT substrate on which a TFT array is formed, a color filter substrate on which a color filter is arranged, a liquid crystal and an image injected between the TFT substrate and the color filter substrate. And a back light for supplying light for display.

Here, the TFT array formed on the TFT substrate serves to transmit and control the electrical signal, and the liquid crystal controls the degree of light transmission by changing the molecular arrangement according to the applied voltage. The light controlled through the above process passes through the color filter substrate and appears in a desired color and image.

In the process of manufacturing such a liquid crystal display device, a sealing material enters between the color filter substrate and the TFT substrate. Such a sealing material bonds the color filter substrate and the TFT substrate, and also seals the liquid crystal injected between the color filter substrate and the TFT substrate so as not to leak out.

In forming the TFT substrate and the color filter substrate, the TFT substrate and the color filter substrate are each formed by stacking a plurality of layers, and each layer is formed by patterning a predetermined shape. In this case, in order to form each layer in a predetermined shape, the target layer may be patterned into a predetermined shape by patterning and forming a resist layer on the target layer, and performing etching in a state where the resist layer is formed. In this case, a photoresist, a dry film resist, or a printing resist may be used as a material for forming the resist layer.

Meanwhile, various methods may be used to form the resist layer. As an example, FIGS. 2A to 2C illustrate a method of forming a resist layer on a substrate using a gravure offset technique.

First, as shown in FIG. 2A, the printing resist 207 is placed on the printing plate 201. Then, the printing resist 207 is filled into the pattern groove 205 using the doctor blade 203 (inject).

Thereafter, as shown in FIG. 2B, the printing resist 207 filled in the pattern groove 205 is transferred to the surface of the blanket 209.

Subsequently, by rotating the Blanccat 209 on the substrate 211, the transferred printing resist 207 can be formed on the substrate 211 (printing).

Meanwhile, in order to form a resist layer using the gravure offset technique, a printing plate having a desired pattern groove is first manufactured. In general, as a method of forming a printing plate, after forming a photoresist layer on a printing substrate, a predetermined pattern is formed on the photoresist layer through an exposure and development process. Then, by performing wet etching on the resultant to form a predetermined pattern on the printed board, it is possible to manufacture a printed plate on which a desired predetermined pattern is formed.

However, in the case of manufacturing the printing plate through such wet etching, isotropic etching as shown in FIG. 3 is performed. 3 is a view for explaining the problem of the printing plate used in the conventional gravure offset printing technique.

In this case, the pattern groove 305 formed in the printed circuit board 301 has a disadvantage in that its width is difficult to form in a fine pattern of less than 5 μm. In FIG. 3, reference numeral 303 denotes a photoresist layer laminated on the printed board 301 to form a pattern.

In addition, although the edge portion of the pattern must be formed at right angles to obtain a sharp pattern after printing, when the wet etching is performed, the edge of the pattern is formed in a round shape. Accordingly, there is a disadvantage in that the pattern on which printing is performed using such a printing plate is not good in shape.

An object of the present invention is to provide a printing plate manufacturing method that can form a variety of patterns in addition to the fine precision pattern.

In addition, another object of the present invention is to provide a method for manufacturing a liquid crystal display device which can reduce the number of manufacturing processes required.

In order to achieve the above object, a first embodiment of a printing plate manufacturing method according to the present invention comprises the steps of: depositing a metal film on a printing substrate; Forming a photoresist layer on the metal film, and performing exposure and development to form a predetermined fine pattern on the photoresist layer; Performing wet etching on the resultant to pattern the metal layer and removing the photoresist layer; And performing dry etching on the resultant image to form patterned microgrooves on the printed board, and removing the patterned metal film. Its features are to include.

According to the present invention, the metal film is characterized by being selected from a single metal or a double metal such as Cu, Ni, Cr, Mo, AlNd or the like.

In addition, according to the present invention, there is a feature in that the anisotropic etching is performed using a fluorine-based gas in performing the dry etching.

Further, according to the present invention, the predetermined fine pattern formed on the photoresist layer is characterized in that its width is formed to be 10 mu m or less.

According to the present invention, after the step of removing the patterned metal film, forming a photoresist layer on the resultant, and performing exposure and development to form a relatively wide pattern on the photoresist layer; Performing wet etching on the resultant to further form a relatively wide pattern on the printed board, and removing the photoresist layer; Its features are further provided.

In addition, according to the present invention, the wide pattern formed on the photoresist layer is characterized in that its width is formed to be 100 μm or more.

In addition, in order to achieve the above object, a second embodiment of the method for manufacturing a printing plate according to the present invention comprises the steps of: depositing a mask film on the printing substrate; Forming a photoresist layer on the mask film, and performing exposure and development to form a predetermined pattern on the photoresist layer; Etching the resultant to pattern the mask film, and removing the photoresist layer; And sandblasting the patterned mask film to form patterned grooves in the printed circuit board, and removing the patterned mask film. Its features are to include.

According to the present invention, the mask film is characterized in that it is formed by being selected from a DFR (Dry Film Resist), a metal, a polymer (polymer).

In addition, according to the present invention, the predetermined pattern formed by performing the sand blast is characterized in that the width is formed to 50㎛ or more.

In addition, the liquid crystal display device manufacturing method according to the present invention in order to achieve the above another object, the gate electrode and the gate wiring, the gate insulating film, the active layer, the source / drain electrode and the data wiring, the protective film, the pixel electrode in sequence In manufacturing a liquid crystal display by patterning and laminating, a resist layer patterned into a predetermined shape is formed by using a printing plate manufactured by the printing plate manufacturing method according to the present invention, and an etching process is performed on the resultant. The characteristics are that the gate electrode, the gate wiring, the active layer, the source / drain electrodes, the data wiring, and the pixel electrode are respectively formed.

According to the present invention as described above, there is an advantage in that a variety of patterns can be formed in addition to the fine precision pattern in manufacturing the printing plate. In addition, according to the present invention, there is an advantage that can reduce the number of manufacturing process in manufacturing a liquid crystal display device.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4A to 4F are process flowcharts illustrating a process of forming a printing plate having a fine precision pattern by the printing plate manufacturing method according to the present invention. A first embodiment of a printing plate manufacturing method according to the present invention will be described with reference to FIGS. 4A to 4F as follows.

First, a metal film 403 is deposited on the printed board 401 (FIG. 4A). Here, the metal film 403 may be formed by selecting from metals such as Cu, Ni, and Cr. In addition, the printed board 401 may be glass, plastic, wafer, or the like.

Then, a photoresist layer 405 is formed on the metal film 403 (FIG. 4B). Thereafter, the photoresist layer 405 is exposed and developed to form a predetermined fine pattern on the photoresist layer 405 (FIG. 4C). Here, the predetermined fine pattern formed on the photoresist layer may have a width of 10 μm or less.

Subsequently, the metal film 403 is patterned by wet etching the resultant, and the patterned photoresist layer 405 is removed (FIG. 4D). Then, dry etching is performed on the resultant image to form patterned fine grooves 407 in the printed circuit board 401 (FIG. 4E).

At this time, in performing the dry etching, by performing anisotropic etching using a fluorine-based gas, the boundary of the pattern groove 407 can be formed in a rectangular shape. In this case, as the fluorine-based gas, gases such as CF ₄ and SF ₆ may be used. That is, when wet etching is performed, the isotropic etching is performed, so that the width becomes wider as the depth is deeper, so that the etching is performed in a round shape. Can be formed.

Subsequently, by removing the patterned metal film 403, the printing plate according to the present invention can be manufactured (FIG. 4F). The predetermined fine pattern formed on the printing plate manufactured through such a series of processes can be formed to a width of 10㎛ or less.

Meanwhile, according to the present invention, a pattern having a wider width may be additionally formed on the printed plate of the fine pattern manufactured as described above.

That is, after removing the patterned metal film, a photoresist layer is formed on the resultant, and exposure and development are performed to form a relatively wide pattern on the photoresist layer. At this time, the pattern formed on the photoresist layer may be formed so that the width is 100㎛ or more.

Subsequently, wet etching is performed on the resultant to further form a relatively wide pattern on the printed board and to remove the photoresist layer. Accordingly, one portion may be formed in a fine pattern on one printing plate, and the other portion may be formed in a relatively wide pattern.

Here, the case where the fine pattern and the wide pattern are formed together on one printing plate has been described. However, in actual application, a printed plate having a fine pattern and a printed plate having a wide pattern may be separately manufactured and then used in combination.

The printing plate manufactured through such a process may be usefully used in manufacturing a large area liquid crystal display device. For example, the array portion of a large area liquid crystal display device requires a fine circuit having a width of 10 μm or less, but the circuit in the outer circuit portion is formed with a wide width of 100 μm or more.

As such, a large difference in line width required by the array unit and the outer circuit unit of the large area liquid crystal display device is generated. Therefore, as in the present invention, the printing plate corresponding to the microcircuit unit is manufactured by using dry etching, and the printing plate corresponding to the outer circuit unit is manufactured by using wet etching. It can be produced effectively. If the pattern is formed using only one method of dry etching or wet etching, it is possible to form a pattern having a small line width, but the side etching may be performed because the etching must be performed for a long time to increase the depth and width. There may occur a problem that the shape of the fine pattern changes.

Further, in manufacturing a liquid crystal display device, in the case of forming a resist layer for an etching process using a printing plate manufactured by the printing plate manufacturing method of the present invention, the cost is further reduced compared to the conventional photolithography method. In addition, the process time can be shortened by simplifying the process. This may be more usefully applied as the liquid crystal display becomes larger.

As described above, the printing plate manufactured by the printing plate manufacturing method according to the present invention can be usefully used in manufacturing the TFT substrate constituting the liquid crystal display device.

In other words, in order to manufacture a liquid crystal display device by sequentially patterning and stacking a gate electrode and a gate wiring, a gate insulating film, an active layer, a source / drain electrode and a data wiring, a protective film, and a pixel electrode on a substrate, A resist layer patterned into a predetermined shape is formed by using a printing plate manufactured by a manufacturing method, and an etching process is performed on the resulting product to form the gate electrode, the gate wiring, the active layer, the source / drain electrode, the data wiring, and the pixel electrode. Each can be formed efficiently.

In addition, the printing plate manufactured by the printing plate manufacturing method according to the present invention may be usefully used when manufacturing the color filter substrate constituting the liquid crystal display device. That is, in forming the red (R), green (G) and blue (B) filters or patterning the black matrix, it is possible to easily form using a printing plate manufactured by the above method.

In addition, the printing plate manufactured by the printing plate manufacturing method according to the present invention may be usefully applied to a column spacer forming process.

On the other hand, the present invention further proposes another embodiment of a printing plate manufacturing method that can form a variety of shapes of the pattern. 5A to 5G are process flowcharts illustrating a process of forming a printing plate having a wide pattern by a printing plate manufacturing method according to the present invention.

First, a mask film 503 is deposited on the printed board 501 (FIG. 5A). The mask layer 503 may be formed by being selected from a dry film resist (DFR), a metal, and a polymer. In addition, glass, plastic, wafer, or the like may be used as the printed board 501.

Thereafter, a photoresist layer 505 is formed on the mask film 503 (FIG. 5B), and exposure and development are performed to form a predetermined pattern on the photoresist layer 505 (FIG. 5C).

Subsequently, the resultant film is etched to pattern the mask film 503, and the photoresist layer is removed (FIG. 5D).

Then, sandblasting is performed on the patterned mask film 503 (FIG. 5E), and a patterned groove 511 is formed in the printed board 501 (FIG. 5F). Here, reference numeral 507 denotes a sandblaster, and reference numeral 509 denotes sand particles sprayed from the sandblaster 507, respectively.

At this time, the predetermined pattern 511 formed by performing the sand blast has a width of 50 μm or more, and a pattern having a desired line width at a desired position may be formed. In the sandblasting step, even when DFR is used as the mask film 503, the DFR has a thickness of 10 µm or more, so that other parts are not affected.

Thereafter, the patterned mask film 503 may be removed to manufacture a printing plate having various patterns.

As described above, according to the printing plate manufacturing method according to the present invention, a printing plate having a fine pattern formed by a dry etching process may be manufactured, and various patterns having a wider line width through a continuous wet etching process or a sandblast process are performed. This formed printing plate can be manufactured effectively.

According to the printing plate manufacturing method according to the present invention as described above, there is an advantage in that a variety of patterns can be formed in addition to the fine precision pattern in manufacturing the printing plate.

In addition, according to the manufacturing method of the liquid crystal display device according to the present invention, there is an advantage that can reduce the number of manufacturing process in manufacturing the liquid crystal display device.

1 is a view schematically showing a configuration of a general liquid crystal display device.

2A to 2C are diagrams for explaining printing by using a general gravure offset printing technique.

3 is a view for explaining the problem of the printing plate used in the conventional gravure offset printing technique.

Figures 4a to 4f is a process flow chart showing a process of forming a printing plate with a fine fine pattern by the printing plate manufacturing method according to the present invention.

5a to 5g is a process flow chart showing a process of forming a printing plate having a wide pattern by a printing plate manufacturing method according to the present invention.

<Explanation of symbols for the main parts of the drawings>

201 ... printing plate 203 ... doctor blade

205, 305, 407, 511 ... Pattern groove 207 ... Printable resist

209 ... blanket 211 ... Board

301, 401, 501 ... printed board

303, 405, 505 ... photo resist layer

403 ... metal film 503 ... mask film

507 ... sandblaster 509 ... sand

Claims (10)

Depositing a metal film on the printed board; Forming a photoresist layer on the metal film, and performing exposure and development to form a predetermined fine pattern on the photoresist layer; Performing wet etching on the resultant to pattern the metal layer and removing the photoresist layer; And Performing dry etching on the resultant image to form patterned microgrooves on the printed board, and removing the patterned metal film; Printing plate manufacturing method comprising a. The method of claim 1, The metal film is a printing plate manufacturing method, characterized in that formed from a single metal or a double metal of Cu, Ni, Cr, Mo, AlNd. The method of claim 1, The method of manufacturing a printing plate, characterized in that for performing the dry etching, anisotropic etching is performed using a fluorine-based gas. The method of claim 1, The predetermined fine pattern formed on the photoresist layer has a width of 10㎛ or less, characterized in that the printing plate manufacturing method. The method of claim 1, After removing the patterned metal film, Forming a photoresist layer on the resultant, performing exposure and development to form a relatively wide pattern on the photoresist layer; And Performing wet etching on the resultant to further form a relatively wide pattern on the printed board, and removing the photoresist layer; Printing plate manufacturing method characterized in that it further comprises. The method of claim 5, The wide pattern formed on the photoresist layer is a printing plate manufacturing method, characterized in that the width is formed to more than 100㎛. Depositing a film for a mask on a printed board; Forming a photoresist layer on the mask film, and performing exposure and development to form a predetermined pattern on the photoresist layer; Etching the resultant to pattern the mask film, and removing the photoresist layer; And Performing a sandblast on the patterned mask film to form patterned grooves in the printed board, and removing the patterned mask film; Printing plate manufacturing method comprising a. The method of claim 7, wherein The mask film is a printing plate manufacturing method, characterized in that formed by selecting from DFR (Dry Film Resist), metal, polymer (polymer). The method of claim 7, wherein The predetermined pattern formed by performing the sandblasting is a printing plate manufacturing method, characterized in that the width is formed to 50㎛ or more. In manufacturing a liquid crystal display by sequentially patterning and laminating a gate electrode and a gate wiring, a gate insulating film, an active layer, a source / drain electrode and a data wiring, a protective film, and a pixel electrode on a substrate, A resist layer patterned into a predetermined shape is formed by using the printing plate manufactured by any one of claims 1 to 9, and an etching process is performed on the resultant to form the gate electrode, the gate wiring, the active layer, and the source. And a drain electrode, a data wiring, and a pixel electrode, respectively.