KR20050022366A - Heat-Releasing Member - Google Patents

Abstract

The present invention relates to a heat generating electronic component in a heat conductive member used for heat dissipation of an integrated circuit element such as a LSI and a CPU of a thermal conductive sheet used in a general power supply, an electronic device, and an electronic device such as a personal computer or a digital video disk drive. Heat generated from the heat dissipated to the heat dissipation component with good efficiency, and greatly improves the lifespan of the heat generating electronic component, the electronic apparatus using the same, and the like.

The present invention

(A) 100 parts by weight of a thermoplastic silicone resin,

(B) 500 to 2000 parts by weight of a thermally conductive filler having an average particle diameter of 0.1 to 5.0 μm, provided that the content of the material having a maximum particle size of more than 15 μm is 1% by weight or less.

It provides a heat radiation member characterized in that the thermosoftening thermal conductive composition comprising a molded in a sheet form.

Description

Heat dissipation member {Heat-Releasing Member}

The present invention relates to a heat transfer material interposed between a heat generating electronic component and a heat dissipating component such as a heat sink or a metal case for cooling the electronic component. In particular, viscosity decreases, softens, or fuses at a temperature within an operating temperature range of the electronic component, thereby improving adhesion to the thermal boundary surface and improving heat transfer from the heat generating electronic component to the heat radiating component.

In recent years, the circuit design of electronic devices such as televisions, videos, computers, medical devices, office machines, communication devices, etc. has increased in complexity, and integrated circuits containing hundreds of thousands of transistors have been manufactured. With the miniaturization and high performance of electronic devices, the number of these electronic parts assembled into increasingly smaller areas increases, and the shape of the electronic parts itself continues to be miniaturized. For this reason, the heat which generate | occur | produces from each electronic component increases, and since the failure or malfunction occurs by this heat, the mounting technique which dissipates heat effectively becomes important.

 Many heat dissipation methods and heat dissipation members are proposed to remove heat generated by the improvement of density in electronic parts such as CPU, driver IC, and memory used in electronic devices such as personal computers, digital video discs, and mobile phones. It is.

Conventionally, in order to suppress the temperature rise of an electronic component in an electronic device etc., the method of directly heat-transferring to the heat-dissipating plate using metal with high thermal conductivity, such as aluminum, copper, brass, is taken. The heat dissipation plate conducts heat generated from the electronic component and emits the heat from the surface by the temperature difference with the outside air. In order to transfer the heat generated from the electronic component to the heat dissipation plate with good efficiency, the heat dissipation plate and the electronic component need to be closely adhered to each other without voids, and the flexible low hardness thermal conductive sheet or the thermal conductive grease is used to It is interposed between the diverging plates.

However, the low hardness thermally conductive sheet has excellent handling workability, but it is difficult to reduce the thickness, and because it cannot follow the minute unevenness on the surface of the electronic component or the heat dissipation plate, the contact thermal resistance is increased, and heat can be efficiently conducted. There is no problem.

On the other hand, since the thermally conductive grease can be made thin, the distance between the electronic component and the heat dissipation plate can be reduced, and the thermal resistance can be greatly reduced by embedding minute unevenness on the surface. However, thermally conductive greases have a problem in that they are poor in handling and contaminate the surroundings, or oil components are separated (pumped out) by thermal cycles, thereby degrading thermal characteristics.

A thermally conductive member having both characteristics of recent low hardness thermally conductive sheets and low thermal resistance of thermally conductive greases, which have a good handleability at room temperature and are softened or melted by heat generated from electronic components. Many materials have been proposed.

Japanese Unexamined Patent Publication No. 2000-509209 proposes a thermally conductive material composed of an acrylic pressure-sensitive adhesive, an α-olefin thermoplastic and a thermally conductive filler, or a thermally conductive material composed of a paraffin wax and a thermally conductive filler.

Japanese Patent Laid-Open No. 2000-336279 proposes a thermally conductive composition composed of a thermoplastic resin, a wax, and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2001-89756 proposes a thermal mediation material comprising a polymer such as acryl, a melting point component such as an alcohol having 12 to 16 carbon atoms, a petroleum wax, and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2002-121332 proposes a thermosoftening heat dissipating sheet composed of a polyolefin and a thermally conductive filler.

However, these are all based on organic matter and are not materials aimed at flame retardancy. Moreover, when these members are assembled in an automobile etc., deterioration by high temperature is feared.

On the other hand, silicon is known as a material excellent in heat resistance, weather resistance, and flame retardancy, and many of the same thermosoftening materials based on silicon have also been proposed.

Japanese Unexamined Patent Application Publication No. 2000-327917 proposes a composition comprising a thermoplastic silicone resin, a wax-like modified silicone resin and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2001-291807 proposes a thermally conductive sheet composed of a binder resin such as silicone gel, a wax and a thermally conductive filler.

Japanese Unexamined Patent Application Publication No. 2002-234952 proposes a thermal softening heat dissipation sheet composed of a polymer gel such as silicone, a modified silicone, wax, or the like, which becomes a liquid when heated, and a thermally conductive filler.

However, since these use organic substances, such as wax, and the wax which modified | denatured silicone other than silicone, there existed a fault that they are inferior to flame retardance and heat resistance than a silicone single piece.

The present invention has been conducted in earnest in view of the above problems, and as a result, it is disposed between a heat generating electronic component and a heat dissipating component (boundary) capable of reaching a temperature higher than room temperature by operation, and is non-flowable at a room temperature state before the electronic component operation. In the heat dissipation member which is filled substantially without gaps in the boundary between the electronic component and the heat dissipation component by heating, heating, or actively applying heat at the time of arrangement, or lowering the viscosity, softening or melting, the thickness is substantially reduced. Thereby, the heat resistance of the composition itself is remarkably reduced, and the following heat dissipation members (1) to (5) excellent in heat dissipation performance are provided.

(1) (A) 100 parts by weight of a thermoplastic silicone resin,

(B) 500 to 2000 parts by weight of a thermally conductive filler having an average particle diameter of 0.1 to 5.0 μm, provided that the content of the material having a maximum particle size of more than 15 μm is 1% by weight or less.

A heat dissipating member, comprising: forming a thermosoftening thermal conductive composition comprising a sheet.

(2) The thermoplastic silicone resin as the component (A) is _composed of R ¹ SiO _3/2 units (T units) and R ¹ ₂ SiO _2/2 units (D units) (wherein R ¹ has 1 to 10 carbon atoms) Ring or substituted monovalent hydrocarbon).

(3) The silicone oil according to claim 1 or 2, wherein the silicone oil having a viscosity at 25 ° C. of 0.1 to 100 Pa · s in the thermosoftening thermally conductive composition containing the component (A) and the component (B), and ( Or) silicone raw rubber is further added.

(4) A heat dissipation member having a thermal conductivity of 0.5 W / mK or more and a viscosity at 80 ° C. of 1 × 10 ² to 1 × 10 ⁵ Pa · s.

(5) The heat radiation member whose thickness is 20-80 micrometers in the heat radiation member which shape | molded the said thermosoftening heat conductive composition in the sheet form.

Best Mode for Carrying Out the Invention

Hereinafter, the present invention will be described in detail.

(A component: thermoplastic silicone resin)

As the thermoplastic silicone resin which can be a medium (matrix) of the heat dissipation member of the present invention, the heat dissipation member is substantially a solid (non-flowable) at room temperature and has a constant temperature, preferably 40 ° C. or higher, to prevent heat generation of the heat generating electronic component. Below the maximum attained temperature, specifically, it may be any type of fluidized by heat softening, low viscosity or melting in the temperature range of about 40 to 150 ℃, in particular about 40 to 120 ℃. This medium is a factor that causes thermal softening and also serves as a binder for providing processability and workability to a filler that imparts thermal conductivity.

Here, the temperature of heat softening, low viscosity, or melting is as a heat radiating member, and the silicone resin itself may have a melting point below 40 degreeC.

The softening medium may be any one as long as it is selected from the silicone resin as described above, but in order to maintain non-flowability at room temperature, R ¹ SiO _3/2 units (hereinafter referred to as T units) and / or SiO ₂ units ( Polymers including Q units), copolymers of these with R ¹ ₂ SiO _2/2 units (hereinafter referred to as D units), and the like. Alternatively, silicone oil or silicone raw rubber containing D units may be added. Among these, a combination of a silicone resin containing a T unit and a D unit, a silicone resin containing a T unit, and a silicone oil having a viscosity of 0.1 to 100 Pa · s and / or silicone raw rubber at 25 ° C. is preferable. The resin may be blocked in R ¹ ₃ SiO _1/2 units (M units).

Here, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms. Specific examples of such R ¹ include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, de Aralkyl groups such as alkyl groups such as alkyl groups, phenyl groups, tolyl groups, xylyl groups, naphthyl groups, benzyl groups, phenylethyl groups, and phenylpropyl groups such as aralkyl groups, vinyl groups, allyl groups, propenyl groups, isopropenyl groups, and butenyl groups , Alkenyl groups such as hexenyl group, cyclohexynyl group, octenyl group, and a part or all of the hydrogen atoms of these groups substituted with halogen atoms such as fluorine, bromine, chlorine, cyano group, etc., for example, chloro Methyl group, chloropropyl group, bromoethyl group, trifluoropropyl group, cyanoethyl group, etc. are mentioned. Among these, a methyl group, a phenyl group, and a vinyl group are especially preferable.

The silicone resin as the component (A) will be described in more detail. The silicone resin used in the present invention includes a T unit and / or a Q unit, and is designed in M unit and T unit, or M unit and Q unit. do. In particular, it is effective to introduce a T unit to improve the fragility at the time of solidification and to make it excellent in toughness that can prevent breakage during handling, and it is preferable to further use the D unit. Here, the substituent of T units (R ¹⁾ Examples of the methyl group and phenyl group are preferred, and a methyl group as the substituent of D units, preferably a phenyl group and a vinyl group. Moreover, it is preferable that the ratio of said T unit and D unit is 10: 90-90: 10, and it is especially preferable to set it as 20: 80-80: 20.

In addition, the silicone resin synthesize | combined by M unit and T unit, or M unit and Q unit which are normally used also consists of silicone unit oil of viscosity 0.1-100 Pa.s which mainly consists of D unit, and the terminal is M unit, and / or ) Vulnerability is improved by mixing silicone raw rubber. Therefore, when the silicone resin to be softened contains T units and no D units, the silicone oil or silicone raw rubber containing D units as a main component may be added to provide excellent handleability.

In this case, the addition amount of the silicone oil and / or silicone raw rubber containing D unit as a main component is 1 to 100 parts by weight, in particular based on 100 parts by weight of the silicone resin (A) component having a softening point or melting point at a temperature higher than room temperature. It is preferable to set it as 2-10 weight part. If it is less than 1 part by weight, the handleability may not be improved, and if it exceeds 100 parts by weight, the moldability and supportability of the sheet or the like may deteriorate.

As above-mentioned, the silicone resin which is (A) component can produce the viscosity fall to some extent, and can also become a binder of a filler. It is preferable that the molecular weight of the silicone resin which is this (A) component is 500-20000, especially 1000-10000. If the molecular weight of the silicone resin is less than 500, the viscosity at the time of thermal softening may be too low to be pumped out by a thermal cycle, and if it exceeds 20000, on the contrary, the viscosity at the time of thermal softening may be too high and the adhesiveness with an electronic component or a heat dissipation component will fall. There is a concern.

Moreover, it is preferable that the silicone resin used by this invention gives flexibility and adhesiveness to the heat conductive member of this invention. In this case, although a polymer having a single molecular weight may be used, two or more kinds of polymers having different molecular weights and the like may be mixed and used.

(Component B: Thermal Conductive Filler)

The thermally conductive filler, which is a B component used in the present invention, is for imparting thermal conductivity to the heat dissipating member, but is a thermally conductive filler having an average particle diameter of 0.1 to 5.0 µm, and a material having a maximum particle diameter of more than 15 µm (B). It is necessary that the ratio which occupies for all the components is 1 weight% or less. When the average particle diameter is smaller than 0.1 µm, the viscosity of the composition obtained becomes too high, so that the stretchability is insufficient and molding to a sheet or a film is difficult. On the other hand, when the average particle diameter is larger than 5.0 µm, the surface of the sheet or film becomes rough, and the gap between the electronic component and the heat dissipation part becomes large, so that there is a fear that sufficient heat dissipation performance cannot be expressed. Therefore, the average particle diameter thereof needs to be in the range of 0.1 to 5.0 µm, and particularly preferably 1.0 to 3.5 µm.

Moreover, when the ratio of the substance whose maximum particle diameter exceeds 15 micrometers exceeds 1 weight% with respect to the whole thermally conductive filler, the clearance gap between an electronic component and a heat radiating component may become large, and sufficient heat dissipation performance will not be expressed. It may be 0.5 weight% or less, It is good to set it as 0.1 weight% or less more preferably.

The thermally conductive filler as the component (B) is not particularly limited as long as the thermal conductivity is good and the melting point exceeds 250 ° C., for example, aluminum powder, zinc oxide powder, alumina powder, boron nitride powder, aluminum nitride powder, and silicon nitride powder. , Copper powder, silver powder, diamond powder, nickel powder, zinc powder, stainless powder, carbon powder and the like, but are not limited thereto. These may be spherical or indefinite, may be used alone, or may be used by mixing two or more kinds. When two or more types are mixed and used, heat dissipation performance, sheet workability, workability, etc. can be improved.

The compounding quantity of (B) component is mix | blended so that it may be 500-2000 weight part with respect to 100 weight part of silicone resin which is (A) component. In particular, it is preferable that it is 600-1500 weight part. If it is less than 500 weight part, the thermal conductivity of the composition obtained will become inferior, and if it exceeds 2000 weight part, workability and extension will worsen.

(Other additives)

It is more effective to use the alkoxysilane represented by following formula (1) as a component which improves the wettability of the thermally conductive filler which is (B) component and the thermoplastic silicone resin which is (A) component for this composition.

R ² _a R ³ _b Si (OR ⁴ ) _4-ab

R ² in the general formula (1) is an alkyl group having 6 to 15 carbon atoms, and specific examples thereof include a hexyl group, an octyl group, a nonyl group, a decyl group, a dodecyl group, and a tetradecyl group. When carbon number is less than 6, wettability with a thermally conductive filler is not enough, and when it is larger than 15, since it solidifies at normal temperature, handling is inconvenient and heat resistance and flame retardance of a composition fall. a is 1, 2 or 3, but it is preferable that it is especially 1. R ³ is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, specific examples include cycloalkyl groups such as alkyl groups such as methyl group, ethyl group, propyl group, hexyl group and octyl group, cyclopentyl group and cyclohexyl group, Alkenyl groups such as vinyl groups and allyl groups, aryl groups such as phenyl groups and tolyl groups, aralkyl groups such as 2-phenylethyl groups and 2-methyl-2-phenylethyl groups, 3,3,3-trifluoropropyl groups, 2 Halogenated hydrocarbon groups, such as-(nanofluorobutyl) ethyl group, 2- (heptadecafluorooctyl) ethyl group, and p-chlorophenyl group, are mentioned, Especially a methyl group and an ethyl group are preferable. b is 0, 1 or 2. R <^4> is a C1-C6 alkyl group, A methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, hexyl group, etc. are mentioned, A methyl group and an ethyl group are especially preferable.

The following are mentioned as a specific example of the alkoxysilane represented by the said chemical formula.

C ₆ H ₁₃ Si (OCH ₃ ) ₃

C ₁₀ H ₂₁ Si (OCH ₃ ) ₃

C ₁₂ H ₂₅ Si (OCH ₃ ) ₃

C ₁₂ H ₂₅ Si (OC ₂ H ₅ ) ₃

C ₁₀ H ₂₁ Si (CH ₃ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (C ₆ H ₅ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (CH ₃ ) (OC ₂ H ₅ ) ₂

C ₁₀ H ₂₁ Si (CH = CH ₂ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (CH ₂ CH ₂ CF ₃ ) (OCH ₃ ) ₂

 The addition amount is the range of 0.01-20 weight part with respect to 100 weight part of thermoplastic silicone resins, More preferably, it is the range of 0.1-10 weight part. If the amount of the organosilane is less than 0.1 part by weight, the wettability of the thermally conductive filler is insufficient, and workability is lowered, and even if it is more than 20 parts by weight, the effect is not increased.

As an optional component, the additive or filler normally used for a synthetic rubber can be further used for the heat radiation member of this invention in the range which does not impair the objective of this invention.

Specifically, a metal oxide such as a platinum catalyst, iron oxide, titanium oxide, and cerium oxide, or a metal hydroxide as a flame retardant, such as a silicone oil, a fluorine-modified silicone surfactant, a colorant, carbon black, titanium dioxide, iron red oxide, and the like as a release agent. A process oil, a reactive titanate catalyst, a reactive aluminum catalyst, etc. can also be added as an improver.

Further, fine powders such as precipitated or calcined silica, thixotropy-improving materials, and the like may be optionally added as the anti-settling agent at high temperatures of the thermally conductive filler.

(Thermal Conductivity and Melt Viscosity of the Heat Dissipation Member)

It is preferable that the thermal conductivity of the heat radiating member of this invention is 0.5 W / m * K or more. If thermal conductivity is less than 0.5 W / m * K, thermal conductivity of electronic components, a heat radiating component, etc. will become low, and there exists a possibility that sufficient heat radiation performance may not be exhibited.

In the heat dissipation member of the present invention, the chargeability to the electronic component and the heat dissipation component and the viscosity at 80 ° C are in the range of 1 × 10 ² to 1 × 10 ⁵ Pa · s, preferably 5 × 10 ² to 5 × It is preferable that it is 10 ⁴ Pa.s. If the viscosity is less than 1 × 10 ² Pa · s, it may leak out between the electronic components and heat-dissipating components such as heat sinks, and if it exceeds 1 × 10 ⁵ Pa · s, the gap between the electronic components and the heat-dissipating components will not be small. There is a possibility that sufficient heat dissipation performance cannot be expressed.

(Production method)

The thermosoftening thermal conductive composition used for the heat dissipation member of the present invention can be easily produced by compounding and kneading the above components using a rubber kneader such as a dough mixer (kneader), a gate mixer and a planetary mixer.

Next, the heat radiating member of this invention is used by shape | molding a thermosoftening thermal conductive composition. Here, a sheet form is used by the meaning containing a film form and a tape form. As a method of shaping | molding in a sheet form, the composition after the said kneading | mixing can be shape | molded by extrusion molding, calender shaping | molding, roll shaping | molding, melt | dissolving in a solvent, and coating. In addition, the thickness of the sheet may be 1 to 200 μm, but preferably 10 to 100 μm, particularly preferably 20 to 80 μm. If it is less than 1 µm, the handleability becomes poor, and if it exceeds 200 µm, the heat dissipation performance deteriorates.

Moreover, it is preferable to shape | mold in a sheet form between a peeling film form or two peeling films, and handling workability can be improved by processing and using it in the form like FIG. That is, the heat-softening thermally conductive member 3 of the present invention is a separation film between the separator film 1, which is easily peeled off on the continuous tape, and the separator film 2, which is slightly difficult to peel off in a certain shape. It is a form cut | disconnected in the same shape as (2), and arrange | positioned continuously. As a method of use, by pulling out the pull tab tape 4 adhered to the separation film 2, the heat-softening thermal conductive member is peeled off from the separation film 1 and shifted to the separation film 2 side. By sticking the surface of the thermally conductive member to the heat generating electronic component or the heat dissipating component, the pull tab tape 4 is pulled and the separation film 2 is peeled off, whereby the thermal softenable thermal conductive member can be easily installed at a predetermined place.

<Example>

(Examples 1 to 5 and Comparative Examples 1 to 5)

Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited by this.

 First, the following components which form the composition of this invention were prepared.

(A) thermoplastic silicone resin

A-1: D ₂₅ T ^Φ ₅₅ D ^Vi ₂₀ (molecular weight 3,300, softening point: 40 to 50 ° C.)

(B) thermally conductive filler

B-1: Aluminum powder with an average particle diameter of 1.5 micrometers (0.01% of content rate of a thing with a maximum particle diameter of 15 micrometers)

B-2: Aluminum powder with an average particle diameter of 2.0 micrometers (0.01% of content rate of a thing with a maximum particle diameter of 15 micrometers)

B-3: Zinc oxide powder of 1.0 micrometer of average particle diameters (0% of content of the thing with a maximum particle diameter of 15 micrometers)

B-4: Copper powder with an average particle diameter of 3.0 micrometers (0.01% of content rate of a thing with a maximum particle diameter of 15 micrometers)

B-5: Aluminum powder with an average particle diameter of 7.4 micrometer (content of 0.5% of thing of the largest particle diameter of 15 micrometers)

B-6: Aluminum powder with an average particle diameter of 1.5 micrometers (2.0% of content rate of a thing with a maximum particle diameter of 15 micrometers)

B-7: Copper powder with an average particle diameter of 3.0 micrometers (2.0% of content rate of a thing with a maximum particle diameter of 15 micrometers)

(C) Silicone oil: The phenyl group containing silicone oil KF-54 with a viscosity of 0.4 Pa.s at 25 degreeC (brand name, the Shin-Etsu Chemical Co., Ltd. make).

(Manufacturing method of a heat radiating member)

20 parts by weight of the thermoplastic silicone resin (A) component (C) and toluene were added to the planetary mixer in the formulation of Table 1 below, and stirred and mixed at room temperature for 20 minutes to obtain a uniform solution. Next, (B) component was added to the compound of Table 1, and it stirred and mixed at room temperature for 1 hour. The obtained composition solution was also diluted to 250 parts by weight of toluene and then coated on a separating film (2) made of PET (polyethylene terephthalate) to which a release agent slightly difficult to peel was applied using a comma coater. Next, the toluene was volatilized off by passing through a drying furnace at a temperature of 80 ° C. for 5 minutes, and then, the PET separation film 1 coated with a release agent, which was slightly easy to peel off, was pressed and adhered with a heat roll at a temperature of 90 ° C. . The thickness of the completed thermosoftening thermal conductive member was 60 µm (Example 2 was set to 40 µm).

The both sides obtained by the above process were slitted to a tape shape by slitting the thermosoftening thermally conductive member 3 sandwiched between the separating film 1 that was slightly easy to peel and the separating film 2 that was slightly peeled to a width of 25 mm. While sticking the pull tab tape 4 to the separation film 2 which is slightly difficult to peel off, the pull tab tape, the separation film 2 and the thermosoftening thermally conductive member are cut at a position of 25 mm in length, and the peeling is slightly easy The film 1 was made into the product form of FIG. 1 by leaving it on tape.

<Evaluation method>

(1) thickness, heat resistance and thermal conductivity

The heat dissipation member was fitted to two standard aluminum plates, and heated at 25 ° C. for 120 minutes or at 125 ° C. for 10 minutes while applying a pressure of about 0.14 MPa. Next, the thickness was measured for every two standard aluminum plates, and the actual thickness of the sheet | seat was measured by subtracting the thickness of the standard aluminum plate which knows thickness previously. In addition, the micrometer (Mitsutoyo Corporation make, model: M820-25VA) was used for the thickness measurement. In addition, the thermal resistance and the thermal conductivity of the thermosoftening thermally conductive member were measured using a microflash measuring instrument (manufactured by NETZAGE RATEBAU CORPORATION).

(2) viscosity

The viscosity at 80 degreeC was measured using the dynamic-viscoelasticity measuring apparatus RDA3 (brand name by T. A. Instruments).

(3) handleability

The mountability to the heat dissipation plate in the form of the product of Figure 1 was manually evaluated.

◎: Very good ○: Good Δ: Almost good ×: Poor

These evaluation results are shown in Table 1.

Comparative Example

The composition was obtained by the method similar to Examples 1-5 using each component of following Table 2 instead of each component of Table 1. The result of having measured each item similarly to Examples 1-5 about the obtained composition is shown in Table 2.

Since the thermal softening thermally conductive member of the present invention has good thermal conductivity and good adhesion between the heat generating electronic component and the heat dissipating component, the heat softening thermal conductive member is interposed between the two components to dissipate heat generated from the heat generating electronic component with good efficiency. By dissipating into parts, it is possible to greatly improve the lifespan of a heat generating electronic part and an electronic device using the same.

1 is a view showing the product form of the heat radiation member of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: Separation film slightly easy to peel

2: separation film slightly difficult to peel

3: heat dissipation member

4: pull tab tape

Claims (5)

It is disposed between (heating) the heat generating electronic component and the heat dissipating component which can reach a temperature higher than room temperature by operating, and is non-flowable at the room temperature state before the electronic component operation, and generates heat during the operation of the electronic component or at the time of arrangement. In the heat dissipation member which is filled with substantially no voids at the boundary between the electronic component and the heat dissipation component by low viscosity, softening or melting by applying heat to (A) 100 parts by weight of a thermoplastic silicone resin, (B) 500 to 2000 parts by weight of a thermally conductive filler having an average particle diameter of 0.1 to 5.0 μm, provided that the content of the material having a maximum particle size of more than 15 μm is 1% by weight or less. A heat dissipating member, comprising: forming a thermosoftening thermal conductive composition comprising a sheet. The thermoplastic silicone resin as the component (A) according to claim 1, wherein the thermoplastic silicone resin as component (A) comprises R ¹ SiO _3/2 units (T units) and R ¹ ₂ SiO _2/2 units (D units) (wherein R ¹ has 1 to 10 carbon atoms). Unsubstituted or substituted monovalent hydrocarbon). The silicone resin and / or silicone raw rubber according to claim 1 or 2, wherein the thermosoftening thermal conductive composition comprising the component (A) and the component (B) has a viscosity at 25 ° C. of 0.1 to 100 Pa · s. Heat dissipation member, characterized in that it further adds. The heat radiation member according to claim 1 or 2, wherein the thermal conductivity is 0.5 W / mK or more, and the viscosity at 80 ° C. is in the range of 1 × 10 ² to 1 × 10 ⁵ Pa · s. The heat dissipation member according to claim 1 or 2, wherein the heat dissipation member obtained by molding the thermosoftening thermal conductive composition into a sheet form has a thickness of 20 to 80 µm.