KR200310597Y1 - 유기물 증착장치의 기판이송장치 - Google Patents
유기물 증착장치의 기판이송장치 Download PDFInfo
- Publication number
- KR200310597Y1 KR200310597Y1 KR20-2003-0001964U KR20030001964U KR200310597Y1 KR 200310597 Y1 KR200310597 Y1 KR 200310597Y1 KR 20030001964 U KR20030001964 U KR 20030001964U KR 200310597 Y1 KR200310597 Y1 KR 200310597Y1
- Authority
- KR
- South Korea
- Prior art keywords
- transfer
- substrate
- chamber
- robot
- chambers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 230000008021 deposition Effects 0.000 title abstract description 14
- 238000005401 electroluminescence Methods 0.000 title description 4
- 238000000034 method Methods 0.000 claims abstract description 60
- 239000011368 organic material Substances 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004040 coloring Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Robotics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (2)
- 프로세스용 챔버(20)상에는 소형 이송용 로봇(30)이 설치되고, 이 챔버(20)와 로봇(30)외 다른 프로세스용 챔버(21 - 25)와 이송용 로봇(31 - 35)이 순차적으로 배치되며, 이들 프로세스용 챔버(20 - 25)들과 이송용 로봇(30 - 35)들사이에는 이송모듈(40)과 레일이 각기 설치된 것을 특징으로 하는 유기물 증착장치의 기판이송장치.
- 제 1 항에 있어서,상기 이송모듈(40)에서의 기판이송에서 가로방향은 레일을 따라 기판이 이동되고, 세로방향의 이동은 각 프로세스용 챔버로의 이동으로 소형 로봇에 의해 이송된 것을 특징으로 하는 유기물 증착장치의 기판이송장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20-2003-0001964U KR200310597Y1 (ko) | 2003-01-22 | 2003-01-22 | 유기물 증착장치의 기판이송장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20-2003-0001964U KR200310597Y1 (ko) | 2003-01-22 | 2003-01-22 | 유기물 증착장치의 기판이송장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR200310597Y1 true KR200310597Y1 (ko) | 2003-04-23 |
Family
ID=49404894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20-2003-0001964U Expired - Fee Related KR200310597Y1 (ko) | 2003-01-22 | 2003-01-22 | 유기물 증착장치의 기판이송장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200310597Y1 (ko) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220015138A (ko) | 2020-07-30 | 2022-02-08 | 주식회사 선익시스템 | 자기 부상 기판 이송시스템 및 증착 시스템 |
KR20220015139A (ko) | 2020-07-30 | 2022-02-08 | 주식회사 선익시스템 | 증착 시스템 |
KR20230003835A (ko) | 2021-06-30 | 2023-01-06 | 주식회사 선익시스템 | 냉각 제어 유닛이 구비된 기판 캐리어 및 이를 포함하는 인라인 증착 시스템 |
KR20240012982A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 쉴드판이 구비된 인라인 증착 시스템 |
KR20240012984A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 증착 쉴드 유닛이 구비된 인라인 증착 시스템 |
KR20240012985A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 인라인 증착 시스템 |
-
2003
- 2003-01-22 KR KR20-2003-0001964U patent/KR200310597Y1/ko not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220015138A (ko) | 2020-07-30 | 2022-02-08 | 주식회사 선익시스템 | 자기 부상 기판 이송시스템 및 증착 시스템 |
KR20220015139A (ko) | 2020-07-30 | 2022-02-08 | 주식회사 선익시스템 | 증착 시스템 |
KR20230003835A (ko) | 2021-06-30 | 2023-01-06 | 주식회사 선익시스템 | 냉각 제어 유닛이 구비된 기판 캐리어 및 이를 포함하는 인라인 증착 시스템 |
KR20240012982A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 쉴드판이 구비된 인라인 증착 시스템 |
KR20240012984A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 증착 쉴드 유닛이 구비된 인라인 증착 시스템 |
KR20240012985A (ko) | 2022-07-21 | 2024-01-30 | 주식회사 선익시스템 | 인라인 증착 시스템 |
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Legal Events
Date | Code | Title | Description |
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UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 20030122 |
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REGI | Registration of establishment | ||
UR0701 | Registration of establishment |
Patent event date: 20030402 Patent event code: UR07011E01D Comment text: Registration of Establishment |
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UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 1 Payment date: 20030123 |
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T201 | Request for technology evaluation of utility model | ||
UT0201 | Request for technical evaluation |
Patent event date: 20030414 Comment text: Request for Technology Evaluation of Utility Model Patent event code: UT02011R01D |
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UG1601 | Publication of registration | ||
LAPS | Lapse due to unpaid annual fee | ||
UC1903 | Unpaid annual fee | ||
T601 | Decision to invalidate utility model after technical evaluation | ||
UT0601 | Decision on revocation of utility model registration |
Comment text: Notice of Reason for Refusal during Technology Evaluation Patent event date: 20031028 Patent event code: UT06011S01I |