KR20030057067A - 인쇄방식을 이용한 패턴형성방법 - Google Patents
인쇄방식을 이용한 패턴형성방법 Download PDFInfo
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- KR20030057067A KR20030057067A KR1020010087439A KR20010087439A KR20030057067A KR 20030057067 A KR20030057067 A KR 20030057067A KR 1020010087439 A KR1020010087439 A KR 1020010087439A KR 20010087439 A KR20010087439 A KR 20010087439A KR 20030057067 A KR20030057067 A KR 20030057067A
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- resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (13)
- 형성하고자 하는 패턴 위치에 대응하는 클리체의 홈내부에 레지스트를 충진하는 단계;전사롤을 상기 클리체와 접촉시킨 상태에서 회전하여 홈내에 충진된 레지스트를 전사롤의 표면으로 전사하는 단계;상기 전사롤을 기판의 피가공층에 접촉시킨 상태에서 회전하여 전사롤 표면의 레지스트를 상기 피가공층에 재전사하여 레지스트패턴을 형성하는 단계;상기 레지스트패턴이 형성된 기판위에 남아 있는 레지스트 잔존물을 플라즈마를 이용하여 에이싱하는 단계; 및레지스트패턴이 형성된 기판에 에천트를 작용하여 피가공층을 에칭하는 단계로 구성된 패턴형성방법.
- 제1항에 있어서, 상기 피가공층은 금속층을 포함하는 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 에이싱단계는,레지스트가 전사된 기판을 가스가 충진된 진공챔버에 설치하는 단계;상기 가스에 고전압을 인가하여 플라즈마상태로 만드는 단계; 및상기 플라즈마상태의 이온을 레지스트 잔존물에 충돌시켜 제거하는 단계로이루어진 것을 특징으로 하는 방법.
- 제3항에 있어서, 상기 가스는 O2인 것을 특징으로 하는 방법.
- 제4항에 있어서, 상기 가스에는 CF4또는 SF6가 첨가되는 것을 특징으로 하는 방법.
- 기판에 형성된 피가공층 위에 레지스트를 인쇄하여 레지스트패턴을 형성하는 단계;상기 레지스트패턴이 형성된 기판위에 남아 있는 레지스트 잔존물을 플라즈마를 이용하여 에이싱하는 단계; 및레지스트패턴이 형성된 기판에 에천트를 작용하여 피가공층을 에칭하는 단계로 구성된 패턴형성방법.
- 형성하고자 하는 패턴 위치에 대응하는 클리체의 홈내부에 레지스트를 충진하는 단계;전사롤을 상기 클리체와 접촉시킨 상태에서 회전하여 홈내에 충진된 레지스트를 전사롤의 표면으로 전사하는 단계;상기 전사롤을 기판의 피가공층에 접촉시킨 상태에서 회전하여 전사롤 표면의 레지스트를 상기 피가공층에 재전사하여 레지스트패턴을 형성하는 단계;플라즈마를 이용하여 상기 레지스트패턴의 양측면을 에칭하여 레지스트패턴의 선폭을 조절하는 단계; 및레지스트패턴이 형성된 기판에 에천트를 작용하여 피가공층을 에칭하는 단계로 구성된 패턴형성방법.
- 제7항에 있어서, 상기 에칭되는 레지스트패턴의 폭은 레지스트패턴의 두께 보다 작은 것을 특징으로 하는 방법.
- 제7항에 있어서, 상기 피가공층은 금속층을 포함하는 것을 특징으로 하는 방법.
- 제7항에 있어서, 상기 레지스트패턴을 에칭하는 단계는,레지스트가 전사된 기판을 가스가 충진된 진공챔버에 설치하는 단계;상기 가스에 고전압을 인가하여 플라즈마상태로 만드는 단계; 및상기 플라즈마상태의 이온을 레지스트패턴에 충돌시켜 에칭하는 단계로 이루어진 것을 특징으로 하는 방법.
- 제10항에 있어서, 상기 가스는 O2인 것을 특징으로 하는 방법.
- 제11항에 있어서, 상기 가스에는 CF4또는 SF6가 첨가되는 것을 특징으로 하는 방법.
- 기판에 형성된 피가공층 위에 레지스트를 인쇄하여 레지스트패턴을 형성하는 단계;플라즈마를 이용하여 상기 레지스트패턴의 양측면을 에칭하여 레지스트패턴의 선폭을 조절하는 단계; 및레지스트패턴이 형성된 기판에 에천트를 작용하여 피가공층을 에칭하는 단계로 구성된 패턴형성방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010087439A KR20030057067A (ko) | 2001-12-28 | 2001-12-28 | 인쇄방식을 이용한 패턴형성방법 |
US10/325,841 US20030124865A1 (en) | 2001-12-28 | 2002-12-23 | Method for forming pattern using printing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010087439A KR20030057067A (ko) | 2001-12-28 | 2001-12-28 | 인쇄방식을 이용한 패턴형성방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20030057067A true KR20030057067A (ko) | 2003-07-04 |
Family
ID=19717851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010087439A Ceased KR20030057067A (ko) | 2001-12-28 | 2001-12-28 | 인쇄방식을 이용한 패턴형성방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20030124865A1 (ko) |
KR (1) | KR20030057067A (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100716304B1 (ko) * | 2005-06-30 | 2007-05-08 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치용 인쇄판 및 그의 제조 방법 |
US7441500B2 (en) | 2004-04-30 | 2008-10-28 | Lg Display Co., Ltd. | Method for forming printing roll patterns |
KR100975734B1 (ko) * | 2003-09-08 | 2010-08-12 | 엘지디스플레이 주식회사 | 횡전계방식 액정 표시 장치용 어레이 기판 및 그 제조 방법 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100825316B1 (ko) * | 2001-12-31 | 2008-04-28 | 엘지디스플레이 주식회사 | 액정표시소자 제조를 위한 인쇄 장비 및 인쇄 방법 |
KR100585871B1 (ko) * | 2002-12-18 | 2006-06-02 | 엘지.필립스 엘시디 주식회사 | 인쇄방식에 의한 패턴형성방법 |
JP2006202961A (ja) * | 2005-01-20 | 2006-08-03 | Nec Lcd Technologies Ltd | 印刷パターンを用いた処理方法及び印刷パターンの製造装置 |
KR101212151B1 (ko) * | 2005-12-29 | 2012-12-13 | 엘지디스플레이 주식회사 | 패턴 형성 방법을 이용한 액정표시소자 제조방법 |
JP6552357B2 (ja) * | 2015-09-28 | 2019-07-31 | 株式会社Screenホールディングス | 印刷方法および印刷装置 |
JP6546835B2 (ja) * | 2015-11-11 | 2019-07-17 | 株式会社Screenホールディングス | 印刷装置および印刷方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2706947C3 (de) * | 1977-02-18 | 1981-11-19 | Standex International Gmbh, 4150 Krefeld | Verfahren und Druckwalzeneinrichtung zur Herstellung von Prägegravuren auf großformatigen Preßplatten für Kunststoffplattenpressen durch Auftragen einer Ätzreserve |
US4181756A (en) * | 1977-10-05 | 1980-01-01 | Fergason James L | Process for increasing display brightness of liquid crystal displays by bleaching polarizers using screen-printing techniques |
US5147763A (en) * | 1988-10-19 | 1992-09-15 | Canon Kabushiki Kaisha | Process for producing molding stamper for data recording medium substrate |
JPH0580530A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Ltd | 薄膜パターン製造方法 |
DE69405451T2 (de) * | 1993-03-16 | 1998-03-12 | Koninkl Philips Electronics Nv | Verfahren und Vorrichtung zur Herstellung eines strukturierten Reliefbildes aus vernetztem Photoresist auf einer flachen Substratoberfläche |
KR0170456B1 (ko) * | 1993-07-16 | 1999-03-30 | 세끼사와 다까시 | 반도체 장치 및 그 제조방법 |
US6127202A (en) * | 1998-07-02 | 2000-10-03 | International Solar Electronic Technology, Inc. | Oxide-based method of making compound semiconductor films and making related electronic devices |
US6334960B1 (en) * | 1999-03-11 | 2002-01-01 | Board Of Regents, The University Of Texas System | Step and flash imprint lithography |
US6727047B2 (en) * | 1999-04-16 | 2004-04-27 | Applied Materials, Inc. | Method of extending the stability of a photoresist during direct writing of an image upon the photoresist |
US6736985B1 (en) * | 1999-05-05 | 2004-05-18 | Agere Systems Inc. | High-resolution method for patterning a substrate with micro-printing |
US6497928B1 (en) * | 1999-05-14 | 2002-12-24 | Canon Kabushiki Kaisha | Liquid crystal device, mesomorphic functional material and liquid crystal apparatus |
US6939587B1 (en) * | 1999-09-03 | 2005-09-06 | Kent State University | Fabrication of aligned crystal cell/film by simultaneous alignment and phase separation |
EP1289967B1 (en) * | 2000-06-12 | 2009-10-28 | LG Chemical Co. Ltd | Triazine-based compound comprising functionalized alkylthio groups, and photopolymerization initiator |
US6864041B2 (en) * | 2001-05-02 | 2005-03-08 | International Business Machines Corporation | Gate linewidth tailoring and critical dimension control for sub-100 nm devices using plasma etching |
KR100675624B1 (ko) * | 2001-10-30 | 2007-02-01 | 엘지.필립스 엘시디 주식회사 | 인쇄방식에 의한 액정표시소자의 패턴형성장치 및 이를 이용한 액정표시소자의 패턴형성방법 |
-
2001
- 2001-12-28 KR KR1020010087439A patent/KR20030057067A/ko not_active Ceased
-
2002
- 2002-12-23 US US10/325,841 patent/US20030124865A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100975734B1 (ko) * | 2003-09-08 | 2010-08-12 | 엘지디스플레이 주식회사 | 횡전계방식 액정 표시 장치용 어레이 기판 및 그 제조 방법 |
US7441500B2 (en) | 2004-04-30 | 2008-10-28 | Lg Display Co., Ltd. | Method for forming printing roll patterns |
KR100716304B1 (ko) * | 2005-06-30 | 2007-05-08 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치용 인쇄판 및 그의 제조 방법 |
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