KR20030007346A - a process of computer cooling and electronic wave shield by Aluminum case - Google Patents

Abstract

The present invention relates to the cooling technology and electromagnetic shielding of an integrated and slim type computer which is different from the existing separate computer design.

In the trend of miniaturization and integration of computers, and the change of usage environment for each use (wall-mounted, arm type, stand type, etc.), in order to cope with such changes, the part that emits a large amount of heat generated in a small space most efficiently This is the most important issue. The most problematic is the shielding and the method of dissipating the heat inside the computer. The heat sink + fan method is used to change the thermal conductivity and strength. Significant improvement and easy electronic shielding.

Description

Manufacturing method of computer cooling device and electronic shield plate using aluminum case {a process of computer cooling and electronic wave shield by Aluminum case}

The present invention relates to a PC cooling device capable of most efficiently dissipating high capacity heat generated internal heat in a small space such as a slim and integrated computer, which is different from a conventional discrete computer design.

In general, when the computer is used for a long time, a lot of heat is generated inside. The higher the computer's specifications and functions, the greater the amount of heat generated. Furthermore, in narrow internal space structures, such as slim and integrated computers, where the circulation of internal airflow is difficult to space, the down and normal performance of the computer is difficult to achieve due to the fact that the internal heat becomes more stagnant and does not immediately cool the generated heat. Becomes difficult.

The present invention has been invented as a solution of the internal heat generation problem generated as described above.

The trend of miniaturizing and integrating computers to make them into various usages and structures (integrated type, slip type, wall type, stand type, arm type) of the use environment out of the framework of the structure and type of use (separate type with separate monitor and main body) In the limited space inside the computer, general technology cannot solve the problems of heat generation, noise, and electronic shielding, so it is easy to shield electronically, and heat sink and fan (fan) are made by using aluminum case with high thermal conductivity and strength and light weight. In addition, the heat generated inside the computer is effectively and efficiently released to the outside and the noise problem is minimized.

The present invention is a method of efficiently dissipating internal heat by incorporating an aluminum casing into a heat sink and fan system to solve the problems of internal heat generation, noise, and electronic shielding for integration, slimming, and wall hanging.

In the conventional cooling system, the higher the CPU specification, the larger the size of the cooling unit. Therefore, the integrated and slim computers have caused many problems in the application of the cooling device due to the limitation of the internal space limitation. Accordingly, the invention was invented to minimize the size of the cooling device and to maximize the range of application for integrated and slim computer applications by minimizing the internal space (see FIG. 1).

1 is a computer side perspective view of the present invention.

2 is a perspective view of a computer case of the present invention

3 is a perspective view of the heat sink structure and fan attachment.

4 is an electronic shielding perspective view

* Reference numbers and descriptions of the main parts of the drawings

11-LCD panel, 12-main chassis, 13-main B / D, 14-CPU in FIG.

15-heatsink, 16-CPU fan

31-CPU, 32-heatsink, 33-CPU fan, 34-Al Case in FIG.

41- LCD panel, 42-main chassis, 43-main B / D, 44-CPU in FIG.

45-heatsink, 46-Al Case

Description1

It is a method that naturally releases heat generated from CPU and IC elements and stagnant heat to the outside through an aluminum case. (See Figure 2)

Description2

The heatsink on top of the CPU minimizes the noise generated by installing a fan inside and enhances the cooling effect of the heat.

Description3

The cooling method of the present invention is free to the size of the cooling device, but maximizes the conductivity of the heat to the heat through the heat sink and the case. The cooling point should be distinguished from the general cooling system.

The present invention maximizes the conductivity of conducting heat generated from the CPU to the heat sink and the case through the copper copper plate in the center of the heat sink. This minimizes the heat lost inside and dissipates heat through the heat sink and case to efficiently cool the heat generated. In addition, the fan that circulates the airflow flows into the inside of the heat sink to minimize the noise and heat generated during rotation and to cool the heat conducted to the heat sink and the case to maximize the cooling performance. have. (See Figure 3)

Description4

Since the circuits such as the main board and inverter are located between the main chassis and the aluminum case, the heat generated can cool down the stagnant airflow that can be generated by being forced to the aluminum case, and the main chassis and the inverter generate electromagnetic waves. And the aluminum case itself serve as a shielding wall to facilitate electronic shielding (see FIG. 4).

-Effective for all-in-one slim design of limited internal space.

-Compact design can increase office environment and space utilization.

-Can be installed and used as a computer for various purposes (stand type, wall mount, arm)

Type, etc.)

-It replaces the existing fan-type cooling device that recently lifted the limit of performance

Cooling performance was optimized as efficiently as possible.

-It can be applied without being limited by the size of cooling system according to CPU performance.

-Ergonomic and free from electromagnetic waves.

-Can be designed with low noise.

Cost reduction

Claims (8)

A computer cooler that naturally releases heat from CPU and IC elements through an aluminum case. The apparatus of claim 1, wherein the cooling is performed by concave and convex holes in a part of the surface of the aluminum case. Computer cooling device that radiates and transfers heat generated from CPU and IC elements to aluminum case through heat sink A cooling device of a computer, which attaches a fan to the heat sink internal nozzle of claim 3 to generate heat to the outside air. The forced airflow conveying means of claim 4 is a fan (fan) characterized in that the fan (fan) A computer cooling device characterized in that heat transfer by intimate contact with the heat sink of claim 3. Cooling system that maximizes thermal conductivity from CPU to heat sink by incorporating a partial copper copper plate in the center part that is in contact with CPU between heat sink and aluminum heat sink. Computer rescue device with electronic case for easy electronic shielding