KR200253559Y1 - 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 - Google Patents
회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 Download PDFInfo
- Publication number
- KR200253559Y1 KR200253559Y1 KR2020010023128U KR20010023128U KR200253559Y1 KR 200253559 Y1 KR200253559 Y1 KR 200253559Y1 KR 2020010023128 U KR2020010023128 U KR 2020010023128U KR 20010023128 U KR20010023128 U KR 20010023128U KR 200253559 Y1 KR200253559 Y1 KR 200253559Y1
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- South Korea
- Prior art keywords
- antenna
- chamber
- plasma
- inductively coupled
- coupled plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009616 inductively coupled plasma Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000009826 distribution Methods 0.000 description 21
- 230000006698 induction Effects 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 7
- 239000007789 gas Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (3)
- 일단에 RF전원이 인가되는 파워드 엔드가 형성되고 타단은 접지된 유도결합형 플라즈마 발생장치의 안테나에 있어서,상기 안테나는 적어도 2개의 루프형 안테나가 전기적으로 병렬로 설치되고, 각 안테나의 파워드 엔드와 그라운드 엔드는 안테나의 중심에 대하여 대칭위치에 배치되며, 각 안테나의 파워드 엔드와 그라운드 엔드는 챔버에서 먼 위치에 배치되고 각 안테나의 중간부분은 챔버에서 가까운 위치에 오도록 상호 평행하게 교차설치되는 것을 특징으로 하는 회전방향으로 균일한 플라즈마 밀도를 발생시키는 유도결합형 플라즈마 발생장치의 안테나구조.
- 청구항 1에 있어서,상기 각 안테나는 상하로 교차설치되는 것을 특징으로 하는 회전방향으로 균일한 플라즈마 밀도를 발생시키는 유도결합형 플라즈마 발생장치의 안테나구조.
- 청구항 1에 있어서,상기 각 안테나는 내,외로 동심원상에서 교차설치되는 것을 특징으로 하는 회전방향으로 균일한 플라즈마 밀도를 발생시키는 유도결합형 플라즈마 발생장치의 안테나구조.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020010023128U KR200253559Y1 (ko) | 2001-07-30 | 2001-07-30 | 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 |
PCT/KR2002/001407 WO2003013198A1 (en) | 2001-07-30 | 2002-07-26 | Antenna structure for inductively coupled plasma generator |
JP2003518235A JP3987033B2 (ja) | 2001-07-30 | 2002-07-26 | 誘導結合型プラズマ発生装置のアンテナ構造 |
EP02753262A EP1437035A4 (en) | 2001-07-30 | 2002-07-26 | ANTENNA STRUCTURE FOR AN INDUCTIVE COUPLED PLASMA AGENER |
CNB028150341A CN1230043C (zh) | 2001-07-30 | 2002-07-26 | 感应耦合等离子体发生器天线结构 |
US10/766,665 US7079085B2 (en) | 2001-07-30 | 2004-01-27 | Antenna structure for inductively coupled plasma generator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020010023128U KR200253559Y1 (ko) | 2001-07-30 | 2001-07-30 | 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0044546A Division KR100488363B1 (ko) | 2002-07-29 | 2002-07-29 | 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 |
Publications (1)
Publication Number | Publication Date |
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KR200253559Y1 true KR200253559Y1 (ko) | 2001-11-22 |
Family
ID=19708831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020010023128U Ceased KR200253559Y1 (ko) | 2001-07-30 | 2001-07-30 | 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7079085B2 (ko) |
EP (1) | EP1437035A4 (ko) |
JP (1) | JP3987033B2 (ko) |
KR (1) | KR200253559Y1 (ko) |
CN (1) | CN1230043C (ko) |
WO (1) | WO2003013198A1 (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420533B1 (ko) * | 2001-12-05 | 2004-03-02 | 주성엔지니어링(주) | 플라즈마 공정장치 및 이를 이용한 플라즈마 식각방법 |
KR100478106B1 (ko) * | 2001-12-10 | 2005-03-24 | (주)울텍 | 고밀도 플라즈마 발생 장치 |
KR100486712B1 (ko) * | 2002-09-04 | 2005-05-03 | 삼성전자주식회사 | 복층 코일 안테나를 구비한 유도결합 플라즈마 발생장치 |
KR100488362B1 (ko) * | 2002-05-20 | 2005-05-11 | 주식회사 플라즈마트 | 저주파형 유도결합 플라즈마 발생장치 |
KR100488360B1 (ko) * | 2002-07-29 | 2005-05-11 | 주식회사 플라즈마트 | 평판표시장치의 표면처리를 위한 유도결합형 플라즈마발생장치의 안테나구조 |
Families Citing this family (29)
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KR100625319B1 (ko) | 2005-02-03 | 2006-09-20 | 세메스 주식회사 | 유도 결합 플라즈마 처리 장치 |
KR100824974B1 (ko) * | 2006-08-17 | 2008-04-28 | (주)아이씨디 | 플라즈마 처리장치의 안테나 |
JP5277473B2 (ja) | 2006-11-28 | 2013-08-28 | サムコ株式会社 | プラズマ処理装置 |
KR101118492B1 (ko) * | 2007-02-16 | 2012-03-12 | 램 리써치 코포레이션 | 유도 코일, 플라즈마 발생 장치 및 플라즈마 발생 방법 |
TW200845833A (en) * | 2007-05-01 | 2008-11-16 | Delta Electronics Inc | Plasma generating device |
US8933595B2 (en) | 2007-10-24 | 2015-01-13 | Nassim Haramein | Plasma flow interaction simulator |
US8073094B2 (en) * | 2007-10-24 | 2011-12-06 | Nassim Haramein | Device and method for simulation of magnetohydrodynamics |
US20100060541A1 (en) * | 2008-09-08 | 2010-03-11 | Smartant Telecom Co., Ltd. | Antenna |
KR101029557B1 (ko) * | 2008-11-05 | 2011-04-15 | 주식회사 아토 | 플라즈마 발생 장치 및 플라즈마 처리 장치 |
TWI498053B (zh) * | 2008-12-23 | 2015-08-21 | Ind Tech Res Inst | 電漿激發模組 |
CN102056395B (zh) | 2009-10-27 | 2014-05-07 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
JP5592098B2 (ja) | 2009-10-27 | 2014-09-17 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
KR101757921B1 (ko) | 2009-10-27 | 2017-07-14 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
KR101757922B1 (ko) | 2009-10-27 | 2017-07-14 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 |
SG184568A1 (en) * | 2010-04-20 | 2012-11-29 | Lam Res Corp | Methods and apparatus for an induction coil arrangement in a plasma processing system |
JP5851682B2 (ja) * | 2010-09-28 | 2016-02-03 | 東京エレクトロン株式会社 | プラズマ処理装置 |
KR101202957B1 (ko) | 2010-10-19 | 2012-11-20 | 주성엔지니어링(주) | 플라즈마 발생용 안테나 및 이를 포함하는 기판처리장치 |
JP5781349B2 (ja) * | 2011-03-30 | 2015-09-24 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US9282624B2 (en) | 2011-09-16 | 2016-03-08 | Semes Co., Ltd. | Antenna structure and plasma generating device |
JP2013077715A (ja) * | 2011-09-30 | 2013-04-25 | Tokyo Electron Ltd | 誘導結合プラズマ用アンテナユニットおよび誘導結合プラズマ処理装置 |
US10271416B2 (en) | 2011-10-28 | 2019-04-23 | Applied Materials, Inc. | High efficiency triple-coil inductively coupled plasma source with phase control |
US8933628B2 (en) * | 2011-10-28 | 2015-01-13 | Applied Materials, Inc. | Inductively coupled plasma source with phase control |
TWI523316B (zh) * | 2012-03-14 | 2016-02-21 | 宏碁股份有限公司 | 通訊裝置 |
JP2016530699A (ja) * | 2013-05-31 | 2016-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | プラズマ処理システムのためのアンテナアレイ構成 |
JP6053881B2 (ja) * | 2015-07-15 | 2016-12-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
WO2019108855A1 (en) * | 2017-11-30 | 2019-06-06 | Corning Incorporated | Atmospheric pressure linear rf plasma source for surface modification and treatment |
KR102071509B1 (ko) * | 2018-06-05 | 2020-01-30 | 인베니아 주식회사 | 안테나 유닛 및 이를 포함하는 플라즈마 처리장치 |
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-
2001
- 2001-07-30 KR KR2020010023128U patent/KR200253559Y1/ko not_active Ceased
-
2002
- 2002-07-26 WO PCT/KR2002/001407 patent/WO2003013198A1/en active Application Filing
- 2002-07-26 CN CNB028150341A patent/CN1230043C/zh not_active Expired - Fee Related
- 2002-07-26 EP EP02753262A patent/EP1437035A4/en not_active Withdrawn
- 2002-07-26 JP JP2003518235A patent/JP3987033B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-27 US US10/766,665 patent/US7079085B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420533B1 (ko) * | 2001-12-05 | 2004-03-02 | 주성엔지니어링(주) | 플라즈마 공정장치 및 이를 이용한 플라즈마 식각방법 |
KR100478106B1 (ko) * | 2001-12-10 | 2005-03-24 | (주)울텍 | 고밀도 플라즈마 발생 장치 |
KR100488362B1 (ko) * | 2002-05-20 | 2005-05-11 | 주식회사 플라즈마트 | 저주파형 유도결합 플라즈마 발생장치 |
KR100488360B1 (ko) * | 2002-07-29 | 2005-05-11 | 주식회사 플라즈마트 | 평판표시장치의 표면처리를 위한 유도결합형 플라즈마발생장치의 안테나구조 |
KR100486712B1 (ko) * | 2002-09-04 | 2005-05-03 | 삼성전자주식회사 | 복층 코일 안테나를 구비한 유도결합 플라즈마 발생장치 |
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US20040223579A1 (en) | 2004-11-11 |
EP1437035A1 (en) | 2004-07-14 |
JP3987033B2 (ja) | 2007-10-03 |
US7079085B2 (en) | 2006-07-18 |
CN1537405A (zh) | 2004-10-13 |
WO2003013198A1 (en) | 2003-02-13 |
EP1437035A4 (en) | 2007-06-20 |
JP2004537839A (ja) | 2004-12-16 |
CN1230043C (zh) | 2005-11-30 |
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