KR20020089832A - 웨이퍼 이송용 핑거 - Google Patents
웨이퍼 이송용 핑거 Download PDFInfo
- Publication number
- KR20020089832A KR20020089832A KR1020010028762A KR20010028762A KR20020089832A KR 20020089832 A KR20020089832 A KR 20020089832A KR 1020010028762 A KR1020010028762 A KR 1020010028762A KR 20010028762 A KR20010028762 A KR 20010028762A KR 20020089832 A KR20020089832 A KR 20020089832A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- vacuum forming
- vacuum
- finger
- seating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007666 vacuum forming Methods 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 10
- 239000011521 glass Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (5)
- 이송용 로봇의 아암에 설치되는 몸체부와;상기 몸체부에 연장 형성되며, 웨이퍼가 안착되는 일측이 개방된 형태의 웨이퍼 안착부와;상기 웨이퍼 안착부의 제1 및 제2아암의 소정 부위에 형성되며, 일측이 경사면으로 형성되어 웨이퍼가 슬라이딩되어 센터링될 수 있도록 하는 사각 형태의 센터링 가이드와;상기 몸체부의 하측에 형성되어 상기 웨이퍼의 하면을 진공상태로 만들기 위한 진공형성부재를 구비하는 것을 특징으로 하는 웨이퍼 이송용 핑거.
- 제 1 항에 있어서, 상기 웨이퍼 안착부는원형 또는 사각 형태로 구성됨을 특징으로 하는 웨이퍼 이송용 핑거.
- 제 1 항에 있어서, 상기 진공형성부재는그 일측 단부에 웨이퍼 하면의 진공을 위한 공기가 출력되는 진공형성공이 형성되며, 그 내측에는 상기 진공형성공에 연이어 진공형성기기로부터 공급되는 공기를 상기 진공형성공에 공급하기 위한 통로인 진공형성통로가 형성되는 것을 특징으로 하는 웨이퍼 이송용 핑거.
- 제 3 항에 있어서, 상기 진공형성부재는세라믹 재질로 형성되는 것을 특징으로 하는 웨이퍼 이송용 핑거.
- 제 1 항에 있어서, 상기 제1 및 제2아암에 형성된 웨이퍼의 낙하를 방지하기 위한 웨이퍼 가이드를 더 포함하는 것을 특징으로 하는 웨이퍼 이송용 핑거.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0028762A KR100442778B1 (ko) | 2001-05-24 | 2001-05-24 | 웨이퍼 이송용 핑거 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0028762A KR100442778B1 (ko) | 2001-05-24 | 2001-05-24 | 웨이퍼 이송용 핑거 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020089832A true KR20020089832A (ko) | 2002-11-30 |
KR100442778B1 KR100442778B1 (ko) | 2004-08-04 |
Family
ID=27706336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0028762A Expired - Lifetime KR100442778B1 (ko) | 2001-05-24 | 2001-05-24 | 웨이퍼 이송용 핑거 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100442778B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7349060B2 (en) | 2003-12-02 | 2008-03-25 | Lg.Philips Lcd Co., Ltd. | Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof |
CN113675132A (zh) * | 2021-10-22 | 2021-11-19 | 西安奕斯伟材料科技有限公司 | 一种手持式晶圆吸附装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW321192U (en) * | 1995-12-23 | 1997-11-21 | Samsung Electronics Co Ltd | A arm of robot for transporting semiconductor wafer |
KR100187439B1 (ko) * | 1996-02-29 | 1999-04-15 | 김광호 | 반도체 웨이퍼의 이송을 위한 진공척 |
KR19980037830U (ko) * | 1996-12-18 | 1998-09-15 | 문정환 | 반도체 서프스캔장비의 웨이퍼 척킹장치 |
KR19990017355A (ko) * | 1997-08-22 | 1999-03-15 | 윤종용 | 반도체 웨이퍼 이송용 진공척 |
KR19980059204U (ko) * | 1997-12-30 | 1998-10-26 | 김종인 | 반송용 핑거 |
KR20000028303A (ko) * | 1998-10-30 | 2000-05-25 | 윤종용 | 진공을 이용한 웨이퍼 흡착식 메인 암 시스템 |
-
2001
- 2001-05-24 KR KR10-2001-0028762A patent/KR100442778B1/ko not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7349060B2 (en) | 2003-12-02 | 2008-03-25 | Lg.Philips Lcd Co., Ltd. | Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof |
CN113675132A (zh) * | 2021-10-22 | 2021-11-19 | 西安奕斯伟材料科技有限公司 | 一种手持式晶圆吸附装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100442778B1 (ko) | 2004-08-04 |
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