KR20020075004A - Method of inking to defective chips - Google Patents

Abstract

The present invention provides an inking method for defective chips that may be present on a wafer in a multichip test. According to the present invention, after identifying an identification point on a chip at a specific location in a wafer manufacturing process, the method of inking based on the identification point in an off-line inking process, and after marking an identification point on a chip at a specific location in a wafer inspection process A method of inking based on the identification point in the off-line inking process is presented.

Description

INKING METHOD FOR BAD CHIPS {METHOD OF INKING TO DEFECTIVE CHIPS}

The present invention relates to a wafer inspection method, and more particularly, to an inking method for defective chips that may be present on a wafer in a multi-chip test.

A wafer inspection process that checks for defects that may be present on chips on a wafer typically identifies ink defects (INK DOT) on the surface of the chip where the defect occurs, in the case of a single chip. .

On the other hand, when testing a multi chip (MULTI CHIP), it is impossible to mark the ink point on the surface of each defective chip in the test step. Therefore, in the case of testing the multi-chip, a method of storing the result data generated in the test step in a computer file once and inking the result data generated in the test step at the same time at the end of the test for all the chips.

In the case of the multi-chip test, the off-line inking refers to a method of marking the ink dots on the defective chips at the same time after the test is finished without taking the ink dots on the respective defective chips in the test step.

Conventionally, in the case of a multi-chip test, a test is performed by specifying a specific coordinate value as the start point of an off-line inking operation during wafer inspection based on the XY coordinate value on the wafer without indicating the start point, and the test result data is a computer file. In the off-line inking process, a series of multi-chip test procedures were performed in which ink points for chips from the corresponding coordinate values were marked.

As described above, the conventional multi-chip test method using the specific coordinate value as a starting point causes a problem that the setting of the coordinate value becomes inaccurate when the size of a single chip is small or when a specific equipment for positioning of the specific coordinate value is insufficient.

An object of the present invention is to provide an inking method for a defective chip to mark the starting point during the wafer manufacturing process or wafer inspection process to smoothly set the coordinate values for the defective chips during the off-line inking process of the multi-chip test.

1 shows a first embodiment of an inking process for defective chips according to the invention;

2 shows a second embodiment of an inking process for defective chips in accordance with the present invention;

* Explanation of symbols for the main parts of the drawings

11, 21: wafer 13, 23: starting point

15, 25: ink dot

(Configuration)

In order to solve the conventional drawbacks, the present invention provides an inking method for smoothly setting the coordinate values for the defective chips during the off-line inking process of the multi-chip test by marking the starting point during the wafer manufacturing process or the wafer inspection process. .

The first inking method for the defective chips according to the invention comprises a first step, a second step and a third step.

The first step marks the starting point on a particular chip surface on the wafer during the wafer fabrication process.

The second step stores the test results for the multiple chips on the wafer in a computer file during the wafer inspection process.

The third step uses the test results stored in the computer file during the wafer inking process to ink spot the defective chips based on the starting point.

The second inking method for the defective chips according to the invention comprises a first step and a second step.

The first step marks the starting point on the surface of a particular chip during the wafer inspection process and stores the test results for the multiple chips on the wafer from the starting point in a computer file.

The second step uses the test results stored in the computer file during the wafer inking process to ink dots for the defective chips based on the starting point.

(Action)

According to these methods, it is possible to smoothly set and confirm coordinate values in the off-line inking process.

(Example)

Hereinafter, the detailed description of the present invention related to the claims will be described in detail through preferred embodiments.

The accompanying drawings are included to provide a further understanding of the invention and are part of this specification.

1 is a view showing a first embodiment of an inking process for defective chips according to the present invention.

Referring to FIG. 1, in step 10 of an inking method for defective chips according to the present invention, a starting point is marked on a surface of a specific chip 13 during a wafer 11 manufacturing process. In step 12, a wafer inspection process is performed. In step 12, a multi-chip test is performed on the chips on the wafer 11 marked with the starting point in step 10. This step saves the test results for all the chips in a computer file. In step 14 the inking process is performed. In step 14, the ink points 15 for the defective chips are photographed based on the identification point on the wafer marked in step 10 using the test result stored in the computer file in step 12.

2 is a view illustrating a second embodiment of an inking process for defective chips according to the present invention.

Referring to FIG. 2, in step 20 of the inking method for the defective chips according to the present invention, a starting point is not marked on a surface of a specific chip during the wafer 21 manufacturing process. In step 22 a wafer inspection process is performed. In step 22, the starting point 23 is marked on a specific chip on the wafer 21 manufactured from step 20. Further, in step 22, a multi-chip test is performed on all the chips on the wafer 21 manufactured from step 20, and the test results are stored in a computer file. In step 24, inking fixing is performed. In step 24, the ink points 25 for the defective chips are taken out based on the starting point 23 indicated in step 22 using the test result stored in the computer file in step 22.

In summary, the essence of the present invention is to mark an identifiable starting point on a wafer. The specific methods include marking a starting point on a wafer during wafer manufacturing and marking a starting point on a wafer during wafer inspection. .

The method of marking the starting point on the wafer during wafer fabrication is, for example, a chip corresponding to the starting point during the fabrication of a mask for wafer processing, which is a tag chip or a blank chip.

The method of marking the starting point on the wafer during wafer inspection is, for example, by marking an ink dot on the surface of the starting chip during wafer testing.

As described above, if the inking method for the defective chips presented in the present invention is applied to the semiconductor wafer inspection process, the starting point can be easily identified by the operator or the inking equipment during the off-line inking operation, thereby testing the defective chips. There is an advantage to increase the efficiency.

Claims (2)

In the semiconductor wafer test method, A first step of marking a starting point on a specific chip surface on the wafer during a wafer fabrication process; A second step of storing test results for multiple chips on the wafer in a computer file during a wafer inspection process; And a third step of using the test results stored in the computer file during the wafer inking process to draw ink spots on the defective chips based on the starting point. In the semiconductor wafer test method, A first step of marking a starting point on the surface of a specific chip during a wafer inspection process and storing test results of the multiple chips on the wafer from the starting point in a computer file; And a second step of using the test results stored in the computer file during the wafer inking process to draw ink spots for the defective chips based on the starting point.