KR20020035930A - Composition of soft polyvinylchloride resin compound for electric wire and method for preparing the same - Google Patents
Composition of soft polyvinylchloride resin compound for electric wire and method for preparing the same Download PDFInfo
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- KR20020035930A KR20020035930A KR1020000065743A KR20000065743A KR20020035930A KR 20020035930 A KR20020035930 A KR 20020035930A KR 1020000065743 A KR1020000065743 A KR 1020000065743A KR 20000065743 A KR20000065743 A KR 20000065743A KR 20020035930 A KR20020035930 A KR 20020035930A
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- Prior art keywords
- plasticizer
- vinyl chloride
- resin compound
- chloride resin
- heat stabilizer
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- 229920005989 resin Polymers 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 title claims abstract description 32
- 150000001875 compounds Chemical class 0.000 title claims abstract description 25
- 239000000203 mixture Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 21
- 229920000915 polyvinyl chloride Polymers 0.000 title 1
- 239000004800 polyvinyl chloride Substances 0.000 title 1
- 239000004014 plasticizer Substances 0.000 claims abstract description 42
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000012760 heat stabilizer Substances 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000003017 thermal stabilizer Substances 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 6
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical group CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 23
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 claims description 22
- 239000004593 Epoxy Substances 0.000 claims description 22
- 235000012424 soybean oil Nutrition 0.000 claims description 19
- 239000003549 soybean oil Substances 0.000 claims description 19
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 15
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 claims description 9
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 7
- 230000000052 comparative effect Effects 0.000 description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 230000032683 aging Effects 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 235000021355 Stearic acid Nutrition 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000006084 composite stabilizer Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000007033 dehydrochlorination reaction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- XUYKQQDSTGNPFV-UHFFFAOYSA-N 1-oxidooxiran-1-ium Chemical compound [O-][O+]1CC1 XUYKQQDSTGNPFV-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexanol Substances CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- DJDSLBVSSOQSLW-UHFFFAOYSA-N mono(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(O)=O DJDSLBVSSOQSLW-UHFFFAOYSA-N 0.000 description 1
- CABDEMAGSHRORS-UHFFFAOYSA-N oxirane;hydrate Chemical compound O.C1CO1 CABDEMAGSHRORS-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 염화비닐수지 컴파운드에 관한 것으로, 특히 가열 후 신장잔율이 우수한 전선용 연질 염화비닐수지 컴파운드 조성물 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vinyl chloride resin compound, and more particularly, to a flexible vinyl chloride resin compound composition for an electric wire having excellent elongation remaining after heating, and a method of manufacturing the same.
본 발명은 이를 위하여, 열안정제 함유 가소제를 포함하는 전선용 연질 염화비닐수지 컴파운드 조성물을 제공하며, 또한 전선용 연질 염화비닐수지 컴파운드의 제조방법에 있어서, a) 가소제를 50 내지 100 ℃의 온도로 가열한 후 열안정제를 첨가하고 교반시켜서 열안정제 함유 가소제를 제조하는 단계; 및 b) 상기 열안정제 함유 가소제를 염화비닐수지 컴파운드의 가소제로 첨가하는 단계를 포함하는 제조방법을 제공한다.To this end, the present invention provides a flexible vinyl chloride resin compound composition for electric wires comprising a heat stabilizer-containing plasticizer, and in the method for producing a flexible vinyl chloride resin compound for electric wires, a) a plasticizer at a temperature of 50 to 100 ℃ Preparing a heat stabilizer-containing plasticizer by adding and stirring the heat stabilizer after heating; And b) adding the thermal stabilizer-containing plasticizer to the plasticizer of the vinyl chloride resin compound.
본 발명에 따르면 열안정제를 함유하는 가소제를 포함하는 전선용 연질 염화비닐수지 컴파운드 조성물은 가열 후 신장잔율이 우수하다.According to the present invention, the flexible vinyl chloride resin compound composition for an electric wire including a plasticizer containing a heat stabilizer is excellent in elongation remaining after heating.
Description
[산업상 이용분야][Industrial use]
본 발명은 염화비닐수지 컴파운드에 관한 것으로, 특히 가열 후 신장잔율이 우수한 전선용 연질 염화비닐수지 컴파운드 조성물 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vinyl chloride resin compound, and more particularly, to a flexible vinyl chloride resin compound composition for an electric wire having excellent elongation remaining after heating, and a method of manufacturing the same.
[종래 기술][Prior art]
연질 염화비닐전선은 특성에 따라 일반용과 내열용으로, 용도에 따라 시즈용(Sheath) 및 절연용(Insulation)으로 구분된다. 일반적으로 시즈용은 전선의 외장부문을, 절연용은 도체를 접하고 있는 내장부문을 의미한다.Soft vinyl chloride wire is classified into general use and heat-resistance according to its characteristics, and sheath and insulation according to its use. In general, sheath refers to the sheath of wires and insulation refers to the interior of the conductor.
일반적으로 전선용 연질 염화비닐 컴파운드 조성물은 열 및 산소에 의해 분해를 일으켜 열안정성, 내노화성, 내후성 등의 품질저하를 일으키며, 이러한 과정의 품질 저하는 두 가지 이론으로 설명할수 있다.In general, the flexible vinyl chloride compound composition for electric wire is degraded by heat and oxygen, resulting in deterioration of thermal stability, aging resistance, weather resistance, and the like. The degradation of this process can be explained by two theories.
첫째는 열 및 산소에 의한 산화과정으로, 열, 및 빛에 의해 폴리머라디칼(R·)이 형성된 후 산소가 삽입되어 하이드로퍼옥사이드(R-O-O-H)가 생성된다. 불안정한 하이드로퍼옥사이드는 알콕시 라디칼(RO·)과 하이드록시 라디칼(HO·)로 분해되어 연쇄반응을 일으킨다. 열, 및 산소에 의해 개시(Initiation), 산소에 의한 성장(Propagation)을 거친 후 라디칼끼리의 정지(Termination)반응이 연속적으로 일어나게 되어 폴리머를 분해시킨다. 이러한 열에 의한 산화를 방지하기 위하여 산화방지제를 사용한다.First, the oxidation process by heat and oxygen, polymer radical (R ·) is formed by heat and light, and then oxygen is inserted to generate hydroperoxide (R-O-O-H). Unstable hydroperoxides decompose into alkoxy radicals (RO.) And hydroxy radicals (HO.), Resulting in a chain reaction. After initiation by heat and oxygen and propagation by oxygen, termination reactions between radicals occur continuously to decompose the polymer. An antioxidant is used to prevent such heat oxidation.
둘째는 염화비닐수지의 열분해 과정으로 염화비닐수지가 열, 및 빛에 의해 활성화(Activation) 되며, 이 활성화는 염화수소(HCl)의 발생과 폴리머 내 이중결합이 생성되는 것을 의미한다. 탈염화수소화는 염화비닐수지 가공온도인 155 내지 230 ℃의 범위에서 일어나며, 이때 탈염화수소에 의해 이중결합 구조가 연쇄적으로 형성된다(Zipper 반응).Second, the vinyl chloride resin is activated by heat and light as a thermal decomposition process of the vinyl chloride resin, which means that hydrogen chloride (HCl) is generated and a double bond in the polymer is generated. Dehydrochlorination takes place in the range of 155 to 230 ° C., the processing temperature of vinyl chloride resin, in which a double bond structure is formed in series by dehydrochlorination (Zipper reaction).
그러므로 일반적인 전선의 내노화성(가열 후 신장잔율)은 가소제의 종류에 의해 결정되는 것이며, 즉, 가소제의 분자량이 클수록 가열 후 신장잔율은 향상되며, 이는 알코올의 종류에 따라 좌우된다.Therefore, the aging resistance (extension residual after heating) of general wires is determined by the kind of plasticizer, that is, the higher the molecular weight of the plasticizer, the better the residual residual after heating, depending on the type of alcohol.
일반용 전선의 경우 시즈 및 절연용으로 일반 범용가소제인 디2-에틸헥실프탈레이트(DEHP)를 가소제로 주로 사용하고 있다. 그러나 디2-에틸헥실프탈레이트(DEHP)는 전선에서 중요한 품질인 상기 내노화성(가열 후 신장잔율)이 떨어져 일부 업체의 경우 디이소노닐프탈레이트(DINP)를 사용하기도 한다. 디이소노닐프탈레이트(DINP)는 종래의 디2-에틸헥실프탈레이트(DEHP)과 비교하여 가열 후 신장잔율, 절연저항 등의 품질이 우수하지만 작업성이 떨어지고, 냄새가 심하며, 특히, 가격이 고가인 단점으로 사용은 극히 일부에 지나지 않는다.In the case of general electric wires, di2-ethylhexyl phthalate (DEHP), a general purpose plasticizer, is mainly used as a plasticizer for sheath and insulation. However, di2-ethylhexyl phthalate (DEHP) has a low quality of aging resistance (extension residual after heating), which is an important quality in the electric wire, and some companies use diisononyl phthalate (DINP). Diisononyl phthalate (DINP) is superior to conventional di2-ethylhexyl phthalate (DEHP) in terms of quality, such as elongation and residual resistance after heating, but is poor in workability, has a bad smell, and is particularly expensive. Disadvantages are only a few.
디2-에틸헥실프탈레이트(DEHP)의 알코올은 탄소가 8 개인 2-에틸헥실프탈레이트(2-EH)이며, 탄소가 9 개인 디이소노닐알콜(INA)을 사용하는 디이소노닐프탈레이트(DINP) 보다 분자량이 작고 브렌치(Branch)한 구조이기 때문에 가열 후 신장잔율이 떨어진다.The alcohol of di2-ethylhexylphthalate (DEHP) is 2-ethylhexylphthalate (2-EH) with 8 carbons, and is higher than diisononylphthalate (DINP) using diisononyl alcohol (INA) with 9 carbons. Since the molecular weight is small and branched (branch) structure, the elongation remaining after heating falls.
이러한 구조적인 문제점을 해결하기 위하여 전선용 염화비닐수지 컴파운드에 첨가되는 가소제의 내노화성(가열 후 신장잔율) 개선이 요구되고 있다.In order to solve this structural problem, it is required to improve the aging resistance (extension residual after heating) of the plasticizer added to the vinyl chloride resin compound for the wire.
따라서 본 발명은 상기 종래기술의 문제점을 고려하여, 가열 후 신장잔율이 우수한 전선용 연질 염화비닐수지 컴파운드 조성물 및 그 제조방법을 제공하는 것을 목적으로 한다.Accordingly, an object of the present invention is to provide a flexible vinyl chloride resin compound composition for an electric wire having excellent elongation and residual ratio after heating, and a method of manufacturing the same.
본 발명의 다른 목적은 염화비닐 조성물의 분해억제 및 가소제의 열에 의한 분해방지를 할 수 있는 첨가제를 함유한 가소제를 포함하는 가열 후 신장율의 경시변화율이 개선된 전선용 연질 염화비닐수지 컴파운드 조성물 및 그 제조방법을 제공하는 것이다.Another object of the present invention is a flexible vinyl chloride resin compound composition for an electric wire having an improved rate of change in elongation after heating, including a plasticizer containing an additive capable of inhibiting decomposition of the vinyl chloride composition and preventing decomposition by heat of the plasticizer, and a composition thereof It is to provide a manufacturing method.
[과제를 해결하기 위한 수단][Means for solving the problem]
본 발명은 상기 목적을 달성하기 위하여, 열안정제 함유 가소제를 포함하는 전선용 연질 염화비닐수지 컴파운드 조성물을 제공한다.In order to achieve the above object, the present invention provides a soft vinyl chloride resin compound composition for electric wires comprising a heat stabilizer-containing plasticizer.
또한 본 발명은 전선용 연질 염화비닐수지 컴파운드의 제조방법에 있어서,In addition, the present invention is a method for producing a flexible vinyl chloride resin compound for electric wire,
a) 가소제를 50 내지 100 ℃의 온도로 가열한 후 열안정제를 첨가하고 교반a) heating the plasticizer to a temperature of 50 to 100 ℃ and then adding a thermal stabilizer and stirring
시켜서 열안정제 함유 가소제를 제조하는 단계; 및To prepare a heat stabilizer-containing plasticizer; And
b) 상기 열안정제 함유 가소제를 염화비닐수지 컴파운드의 가소제로 첨가b) The heat stabilizer-containing plasticizer is added as a plasticizer of the vinyl chloride resin compound.
하는 단계Steps to
를 포함하는 제조방법을 제공한다.It provides a manufacturing method comprising a.
이하에서 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.
[작 용][Action]
본 발명은 연질 염화비닐수지 컴파운드 조성물의 노화방지를 위하여 종래의 가소제에 산화방지제를 사용하던 것을 사용하지 않고 대신에 열안정제를 사용함으로써 가열 후 신장잔율을 개선할 수 있도록 하였다.The present invention is to improve the elongation after elongation after heating by using a heat stabilizer instead of using an antioxidant in the conventional plasticizer to prevent the aging of the soft vinyl chloride resin compound composition.
본 발명의 가소제는 디2-에틸헥실프탈레이트(DEHP), 디이소노닐프탈레이트 (DINP), 디이소데실프탈레이트(DIDP), 및 트리옥틸트리메릴테이트(TOTM)로 이루어진 군으로부터 선택되는 것이 바람직하며, 이 가소제에 첨가되는 열안정제는 염화비닐의 분해에 의해 유리된 염화수소(HCl) 가스를 흡수 제거시킬 수 있는 에폭시 안정제를 사용하는 것이 바람직하다.The plasticizer of the present invention is preferably selected from the group consisting of di2-ethylhexylphthalate (DEHP), diisononylphthalate (DINP), diisodecylphthalate (DIDP), and trioctyltrimeryltate (TOTM) The heat stabilizer added to this plasticizer is preferably an epoxy stabilizer capable of absorbing and removing the hydrogen chloride (HCl) gas liberated by decomposition of vinyl chloride.
상기 에폭시안정제는 가소제 및 열안정제 역할을 하는 첨가제로, 에폭시소이빈오일(ESO)과 에폭시린시드오일(ELO)의 두 가지가 대표적으로 있다. 에폭시안정제는 분자 구조내에 이중결합 구조가 없어야 열, 및 광안정성이 좋기 때문에 이중결합의 척도인 요오딘(Iodine) 값(value)이 낮을수록 바람직하며, 또한 옥시란옥시전(Oxiran-oxygen) 함량(content)이 높을수록 내노화성(가열 후 신장잔율)은 향상된다.The epoxy stabilizer is an additive that acts as a plasticizer and a heat stabilizer, and there are two kinds of epoxy soybean oil (ESO) and epoxidine seed oil (ELO). Epoxy stabilizers are preferred because they have no double bond structure in their molecular structure, so that the heat and light stability are good, so the lower the Iodine value, which is a measure of the double bond, and the content of oxirane-oxygen The higher the content, the better the aging resistance (extension residual after heating).
일반적으로 에폭시소이빈오일의 옥시란옥시전 함량(content)은 6.6 중량%, 에폭시린시드오일은 9.0 중량%이나 실제 실험 결과 가열 후 신장잔율은 에폭시린시드오일보다 에폭시소이빈오일 사용할 때 가열 후 신장잔율이 향상된다.In general, the oxirane oxide content of epoxy soybean oil is 6.6% by weight, and the epoxy resin seed oil is 9.0% by weight, but the actual elongation after heating is higher than that of epoxy soybean oil. Elongation is improved.
본 발명은 에폭시소이빈오일, 또는 에폭시린시드오일과 같은 열안정제를 가소제에 직접 첨가, 용융시키는 방법을 사용하며, 이로부터 에폭시소이빈오일의 단점인 조기 저온응고를 방지할 수 있으며, 염화비닐과의 상용성, 분산성을 향상시키고 장기 저장 안정성도 향상시킬 수 있다.The present invention uses a method of directly adding and melting a heat stabilizer such as epoxy soybean oil or epoxidine seed oil to the plasticizer, thereby preventing premature low temperature coagulation, which is a disadvantage of epoxy soybean oil, and vinyl chloride. It can improve the compatibility and dispersibility with the long-term storage stability.
상기 열안정제를 가소제에 첨가할 때에는 에폭시소이빈오일과 같은 열안정제가 가소제인 DEHP보다 점도가 높기 때문에 혼합시 배합온도를 50 내지 100 ℃로 유지하는 것이 배합효과의 상승면에서 바람직하며, 특히 60 ℃ 정도가 바람직하다.When the heat stabilizer is added to the plasticizer, since the heat stabilizer such as epoxy soybean oil has a higher viscosity than DEHP, which is a plasticizer, it is preferable to maintain the mixing temperature at 50 to 100 ° C. during the mixing, in view of an increase in the compounding effect. C degree is preferable.
상기 열안정제 함유 가소제에 있어서, 에폭시소이빈오일, 또는 에폭시린시드오일과 같은 열안정제의 함량은 가소제 100 중량부에 대하여 1 내지 10 중량부가 바람직하다. 열안정제가 1 중량부 이하로 사용하면 열화 방지 효과를 충분히 기대할 수 없고, 10 중량부 이상을 사용할 경우 첨가량 만큼 효과를 기대할수 없을 뿐 아니라 과량 사용으로 원가부담이 높아진다.In the heat stabilizer-containing plasticizer, the content of a heat stabilizer such as epoxy soybean oil or epoxide seed oil is preferably 1 to 10 parts by weight based on 100 parts by weight of the plasticizer. When the heat stabilizer is used in an amount of 1 part by weight or less, the anti-degradation effect cannot be sufficiently expected, and when it is used in an amount of 10 parts by weight or more, the effect is not expected as much as the amount added, and the cost burden is increased due to the excessive use.
본 발명의 전선용 연질 염화비닐수지 컴파운드 조성물에 있어서, 열안정제가 첨가된 가소제의 함량은 40 내지 60 중량%가 바람직하다. 열안정제 함유 가소제를 40 중량% 이하로 사용하면 전선이 딱딱(Hard)하여 시공이 어렵고, 60 중량% 이상을 사용하면 절연성이 떨어지고 유기물 휘발이 많아져서 품질이 떨어지게 된다.In the flexible vinyl chloride resin compound composition for electric wires of the present invention, the content of the plasticizer to which the heat stabilizer is added is preferably 40 to 60% by weight. When the plasticizer containing the heat stabilizer is used at 40% by weight or less, the construction is difficult due to the hardening of the wire, and when 60% by weight or more is used, the insulation is deteriorated and the organic volatilization is increased.
이하의 실시예 및 비교예를 통하여 본 발명을 더욱 상세하게 설명한다. 단,실시예는 본 발명을 예시하기 위한 것이지 이들만으로 한정되는 것은 아니다.The present invention will be described in more detail with reference to the following examples and comparative examples. However, the examples are provided to illustrate the present invention, but are not limited thereto.
[실시예]EXAMPLE
실시예 1Example 1
디2-에틸헥실프탈레이트(DEHP)를 60 ℃로 가열하고 에폭시소이빈오일 3 중량%를 첨가하여 20 분간 교반 및 용융시켜 열안정제가 첨가된 DEHP-E1을 얻었다. 중합도 1000인 염화비닐수지(엘지화학 상품명: LS100) 100 중량부에 대하여 DEHP-E1 52 중량%, 복합안정제(단석산업 제조 KN900) 6 중량%, 탄산칼슘 48 중량%, 스테아린산 0.3 중량%를 배합한 후, 직경 8인치 테스트로울(Test roll)에서 165℃×3분 조건에서 혼련하여 두께 1 mm 이상의 시트를 제작하였다.Di2-ethylhexylphthalate (DEHP) was heated to 60 ° C. and 3% by weight of epoxy soybean oil was added and stirred and melted for 20 minutes to obtain DEHP-E1 with added heat stabilizer. 52 weight% of DEHP-E1, 6 weight% of complex stabilizers (KN900 manufactured by Danseok Industrial Co., Ltd., 48 weight% of calcium carbonate, and 0.3 weight% of stearic acid) with respect to 100 weight part of vinyl chloride resins (LG Chem .: LS100) of polymerization degree 1000. Then, the mixture was kneaded in a test roll of 8 inches in diameter at 165 ° C. for 3 minutes to produce a sheet having a thickness of 1 mm or more.
이 시트를 압축기(Press)에서 초기 70 kgf/㎠으로 3 분간 예열한 후, 200 kgf/㎠ 로 승압하여 3 분간 압축(Pressing)하였다. 그 후, 50 ℃이하로 냉각시켜 최종시트를 얻었다.The sheet was preheated at an initial 70 kgf / cm 2 for 3 minutes in a compressor (Press), and then pressurized to 200 kgf / cm 2 for 3 minutes. Then, it cooled to 50 degrees C or less, and obtained the final sheet.
실시예 2Example 2
실시예 1에서 사용된 에폭시소이빈오일 대신에 에폭시린시드오일(ELO)를 3 중량% 첨가하여 제조된 DEHP-E2를 사용하는 것을 제외하고는 실시예 1과 동일한 방법으로 전선시트를 제조하였다.An electric wire sheet was manufactured in the same manner as in Example 1, except that DEHP-E2 prepared by adding 3 wt% of epoxidine seed oil (ELO) instead of the epoxy soybean oil used in Example 1 was used.
실시예 3Example 3
디이소노닐프탈레이트를 60 ℃로 가열하고, 여기에 에폭시소이빈오일 3 중량%를 첨가하여 20 분간 교반 및 용융시켜 열안정제가 첨가된 DINP-E을 얻었다.The diisononyl phthalate was heated to 60 ° C., and 3 wt% of epoxy soybean oil was added thereto, followed by stirring and melting for 20 minutes to obtain DINP-E to which a heat stabilizer was added.
중합도 1000인 염화비닐수지(엘지화학 제조 LS100) 100 중량부에 대하여DINP-E 52 중량%, 복합안정제(단석산업 제조 KN900) 6.4 중량%, 탄산칼슘 32 중량%, 스테아린산 0.3 중량%를 배합하며, 나머지 방법은 실시예 1과 동일한 방법으로 하여 전선시트를 얻었다.Based on 100 parts by weight of vinyl chloride resin (LS100 manufactured by LG Chem) having a degree of polymerization of 1000, 52 wt% of DINP-E, 6.4 wt% of composite stabilizer (KN900 manufactured by Danseok Industry), 32 wt% of calcium carbonate, and 0.3 wt% of stearic acid were mixed. The rest of the methods were obtained in the same manner as in Example 1 to obtain a wire sheet.
실시예 4Example 4
디이소데실프탈레이트를 60 ℃로 가열하여 에폭시소이빈오일 3 중량%를 첨가하여 20 분간 교반 및 용융시켜 열안정제가 첨가된 DIDP-E을 얻었다.The diisodecyl phthalate was heated to 60 ° C., and 3% by weight of epoxy soybean oil was added, followed by stirring and melting for 20 minutes to obtain DIDP-E to which a heat stabilizer was added.
중합도 1000인 염화비닐수지(엘지화학 제조 LS100) 100 중량부에 대하여 DIDP-E 52 중량%, 복합안정제(단석산업 제조 KN900) 6.4 중량%, 탄산칼슘 32 중량%, 스테아린산 0.3 중량%를 배합하며, 나머지 방법은 실시예 1과 동일한 방법으로 하여 전선시트를 얻었다.With respect to 100 parts by weight of vinyl chloride resin (LS100 manufactured by LG Chemical) having a degree of polymerization of 1000, DIDP-E 52% by weight, composite stabilizer (KN900 manufactured by Danseok Industry), 6.4% by weight, calcium carbonate 32% by weight, stearic acid 0.3% by weight are blended. The rest of the methods were obtained in the same manner as in Example 1 to obtain a wire sheet.
실시예 5Example 5
트리옥틸트리메리테이트를 60 ℃로 가열하여 에폭시소이빈오일 3 중량%를 첨가하여 20 분간 교반 및 용융시켜 열안정제가 첨가된 TOTM-E을 얻었다.The trioctyl trimellitate was heated to 60 ° C., 3 wt% of epoxy soybean oil was added, stirred and melted for 20 minutes, thereby obtaining TOTM-E having a thermal stabilizer added thereto.
중합도 1000인 염화비닐수지(엘지화학 제조 LS100) 100 중량부에 대하여 TOTM-E 50 중량%, 트리베직레드솔폰네이트(TLS) 5 중량%, 디베직레드포스파이트 (DBL) 1 중량%, 탄산칼슘 40 중량%, 스테아린산 0.3 중량%를 배합하며, 나머지 방법은 실시예 1과 동일한 방법으로 하여 전선시트를 얻었다.To 100 parts by weight of vinyl chloride resin (LS100 manufactured by LG Chemical) having a degree of polymerization of 1000, 50% by weight of TOTM-E, 5% by weight of tribesic red solphonate (TLS), 1% by weight of divenic red phosphite (DBL), calcium carbonate 40 weight% and 0.3 weight% of stearic acid were mix | blended, and the remainder was the same method as Example 1, and the electric wire sheet was obtained.
비교예 1Comparative Example 1
실시예 1에서 에폭시소이빈오일을 첨가하지 않은 DEHP를 사용하는 것을 제외하고는 나머지 방법은 실시예 1과 동일한 방법으로 하여 전선시트를 얻었다.Except for using DEHP without adding the epoxy soybean oil in Example 1, the remaining method was obtained in the same manner as in Example 1 to obtain a wire sheet.
비교예 2Comparative Example 2
실시예 1에서 에폭시소이빈오일을 첨가하지 않은 DEHP로, DEHP를 90 ℃로 가열하여 산화방지제인 비스페놀A를 0.5 중량% 첨가하고, 30 분간 교반 및 용융시켜 산화방지제가 첨가된 DEHP를 얻는다. 나머지 방법은 상기 실시예 1과 동일한 방법으로 하여 전선시트를 얻었다.With DEHP without adding epoxy soybean oil in Example 1, DEHP was heated to 90 ° C. to add 0.5% by weight of an antioxidant bisphenol A, followed by stirring and melting for 30 minutes to obtain DEHP added with antioxidant. The remaining method was carried out in the same manner as in Example 1 to obtain a wire sheet.
비교예 3Comparative Example 3
실시예 3에서 에폭시소이빈오일을 첨가하지 않은 DINP를 사용하는 것을 제외하고, 나머지 방법은 상기 실시예 3과 동일한 방법으로 하여 전선시트를 얻었다.Except for using DINP without the addition of epoxy soybean oil in Example 3, the rest of the method was obtained in the same manner as in Example 3 to obtain a wire sheet.
비교예 4Comparative Example 4
실시예 4에서 에폭시소이빈오일을 첨가하지 않은 DIDP를 사용하는 것을 제외하고는 나머지 방법은 상기 실시예 4와 동일한 방법으로 하여 전선시트를 얻었다.Except for using the DIDP in which the epoxy soybean oil is not added in Example 4, the remaining method was obtained in the same manner as in Example 4 to obtain a wire sheet.
비교예 5Comparative Example 5
실시예 5에서 에폭시소이빈오일을 첨가하지 않은 TOTM를 사용하는 것을 제외하고는 나머지 방법은 상기 실시예 5와 동일한 방법으로 하여 전선시트를 얻었다.Except for using TOTM without the addition of epoxy soybean oil in Example 5, the wire sheet was obtained in the same manner as in Example 5.
[실험예]Experimental Example
상기와 같이 제조된 실시예 1∼5 및 비교예 1∼5의 전선시트의 인장강도, 신장율, 가열후 인장잔율, 가열후 신장잔율을 하기의 방법으로 측정하였다.The tensile strength, the elongation rate, the tensile residual after heating, and the elongation after heating of the wire sheets of Examples 1 to 5 and Comparative Examples 1 to 5 prepared as described above were measured by the following method.
이때 상온 시편의 두께는 ±0.2 mm의 편차가 나지 않도록 하였으며, 오븐의 온도는 ±1 ℃의 편차가 나지 않도록 하였다.At this time, the thickness of the specimen at room temperature did not make a deviation of ± 0.2 mm, and the temperature of the oven did not make a deviation of ± 1 ℃.
1) 인장시험1) Tensile test
KS M-3156을 따라서 측정하였다.Measurement was made according to KS M-3156.
2) 가열 후 인장잔율2) Tensile residual rate after heating
KS M-3156의 시험방법에 따라서 시험편을 일정온도에서 일정시간 가열하고 항온조에 4 시간 이상 방치 후 인장강도를 측정하고 상온 데이타와의 변화율을 하기 수학식 1에 의하여 구하였다.According to the test method of KS M-3156, the test piece was heated at a constant temperature for a certain time, left in the thermostat for 4 hours or more, the tensile strength was measured, and the change rate with the room temperature data was calculated by the following Equation 1.
[수학식 1][Equation 1]
3) 가열 후 신장잔율3) elongation remaining after heating
KS M-3156의 시험방법에 따라서 시험편을 일정온도에서 일정시간 가열하고 항온조에 4 시간 이상 방치 후 신장율을 측정하고 상온 데이타와의 변화율을 하기 수학식 2에 의하여 구하였다.According to the test method of KS M-3156, the test piece was heated at a constant temperature for a certain time, and left in a thermostat for 4 hours or more, the elongation rate was measured, and the change rate with the room temperature data was calculated by the following Equation 2.
[수학식 2][Equation 2]
상기 가열 조건은 하기 표 1에 따랐다.The heating conditions were in accordance with Table 1 below.
[표 1]TABLE 1
상기 실험결과를 하기 표 2에 나타내었다.The experimental results are shown in Table 2 below.
[표 2]TABLE 2
상기 표에서, 인장잔율 1은 시료를 100 ℃에서 48 시간 동안 가열한 후의 인장강도로부터 구하였고, 인장잔율 2는 시료를 100 ℃에서 168 시간 동안 가열한 후의 인장강도로부터 구하였고, 인장잔율 3은 시료를 121 ℃에서 168 시간 동안 가열한 후의 인장강도로부터 구하였고, 인장잔율 4는 시료를 136 ℃에서 168 시간 동안 가열한 후의 인장강도로부터 구하였다.In the table, the tensile residual ratio 1 was obtained from the tensile strength after heating the sample at 100 ° C. for 48 hours, and the tensile residual ratio 2 was calculated from the tensile strength after heating the sample at 100 ° C. for 168 hours, and the tensile residual ratio 3 was The sample was obtained from the tensile strength after heating at 121 ° C. for 168 hours, and the tensile residual ratio 4 was obtained from the tensile strength after heating the sample at 136 ° C. for 168 hours.
또한 신장잔율 1은 시료를 100 ℃에서 48 시간 동안 가열한 후의 신율로부터 구하였고, 신장잔율 2는 시료를 100 ℃에서 168 시간 동안 가열한 후의 신율로부터 구하였고, 신장잔율 3은 시료를 121 ℃에서 168 시간 동안 가열한 후의 신율로부터 구하였고, 신장잔율 4는 시료를 136 ℃에서 168 시간 동안 가열한 후의 신율로부터 구하였다.In addition, the elongation residual ratio 1 was obtained from the elongation after heating the sample at 100 ° C. for 48 hours, and the elongation residual ratio 2 was obtained from the elongation after heating the sample at 100 ° C. for 168 hours. It was calculated | required from the elongation after heating for 168 hours, and elongation residual rate 4 was calculated | required from the elongation after heating a sample for 168 hours at 136 degreeC.
상기 표의 결과로부터 실시예의 전선시트가 비교예의 시트들에 비하여 가열후 신장잔율이 매우 우수함을 알 수 있다.From the results of the table it can be seen that the wire sheet of the embodiment is very excellent in the residual elongation after heating compared to the sheets of the comparative example.
본 발명에 따르면 열안정제를 함유하는 가소제를 포함하는 전선용 연질 염화비닐수지 컴파운드 조성물은 가열 후 신장잔율이 우수하다.According to the present invention, the flexible vinyl chloride resin compound composition for an electric wire including a plasticizer containing a heat stabilizer is excellent in elongation remaining after heating.
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CN111286137A (en) * | 2020-04-09 | 2020-06-16 | 宁波尚瑞塑胶实业有限公司 | Modified PVC (polyvinyl chloride) particles and preparation method thereof |
CN112812472A (en) * | 2021-01-26 | 2021-05-18 | 浙江天原医用材料有限公司 | Environment-friendly low-precipitation soft PVC material and preparation method thereof |
KR20240047582A (en) | 2022-10-05 | 2024-04-12 | 애경케미칼주식회사 | Trimellitate plasticizer and polymer resin composition containing the same |
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