KR20020019017A - 바이어싱 자성층 구조를 갖는 자계 소자 - Google Patents
바이어싱 자성층 구조를 갖는 자계 소자 Download PDFInfo
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- KR20020019017A KR20020019017A KR1020017014198A KR20017014198A KR20020019017A KR 20020019017 A KR20020019017 A KR 20020019017A KR 1020017014198 A KR1020017014198 A KR 1020017014198A KR 20017014198 A KR20017014198 A KR 20017014198A KR 20020019017 A KR20020019017 A KR 20020019017A
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 237
- 230000005415 magnetization Effects 0.000 claims abstract description 40
- 230000008878 coupling Effects 0.000 claims abstract description 26
- 238000010168 coupling process Methods 0.000 claims abstract description 26
- 238000005859 coupling reaction Methods 0.000 claims abstract description 26
- 125000006850 spacer group Chemical group 0.000 claims abstract description 23
- 230000005294 ferromagnetic effect Effects 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 217
- 229910045601 alloy Inorganic materials 0.000 description 20
- 239000000956 alloy Substances 0.000 description 20
- 239000003302 ferromagnetic material Substances 0.000 description 13
- 230000005290 antiferromagnetic effect Effects 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 6
- 229910003321 CoFe Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000002885 antiferromagnetic material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910015136 FeMn Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 235000002595 Solanum tuberosum Nutrition 0.000 description 1
- 244000061456 Solanum tuberosum Species 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000009813 interlayer exchange coupling reaction Methods 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3909—Arrangements using a magnetic tunnel junction
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3263—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being symmetric, e.g. for dual spin valve, e.g. NiO/Co/Cu/Co/Cu/Co/NiO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B2005/3996—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
- Thin Magnetic Films (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (14)
- 제 1 자성층 구조, 고정된 자화 방향을 갖는 제 2 자성층 구조 및 그 제 1 자성층 구조와 그 제 2 자성층 구조를 서로 분리하는 스페이서층 구조를 갖는 스택으로 구성되고, 상기 제 1 자성층 구조에 종방향 바이어스 자계를 인가하는 바이어싱 수단을 더 구비하며, 상기 바이어싱 수단이 제 1 자성층 구조에 대향하여 위치된 바이어싱 자성층 구조를 구비하고, 상기 바이어싱 자성층 구조가 제 2 자성층 구조의 자화 방향에 수직한 자기 결합 자계 성분을 제공하고 비자성층 구조에 의해 제 1 자성층 구조로부터 분리됨으로써, 상기 제 1 자성층 구조가 그 바이어싱 자성층 구조에 강자성적으로 결합된 것을 특징으로 하는 자계 소자.
- 제 1 항에 있어서,상기 바이어싱 자성층 구조가, 제 2 자성층 구조의 자화 방향에 관하여 적어도 45°의 각도 및 최대 135°의 각도인 고정된 자화 방향을 갖는 것을 특징으로 하는 자계 소자.
- 제 2 항에 있어서,상기 바이어싱 자성층 구조의 자화 방향이 제 2 자성층 구조의 자화 방향에관하여 90°의 각도를 이루는 것을 특징으로 하는 자계 소자.
- 제 1 항에 있어서,상기 비자성층 구조는, Ta 층을 포함하는 것을 특징으로 하는 자계 소자.
- 제 1 항에 있어서,상기 바이어싱 자성층 구조는, 핀드 층 구조와, 그 핀드 층 구조를 고정하기 위한 피닝 층 구조를 포함하는 것을 특징으로 하는 자계 소자.
- 제 5 항에 있어서,상기 피닝 층 구조는, 교환 바이어싱 재료의 층을 포함하는 것을 특징으로 하는 자계 소자.
- 제 5 항에 있어서,상기 핀드 층 구조는, 비자성 재료로 이루어진 층에 의해 분리된 2개의 강자성층을 포함하는 것을 특징으로 하는 자계 소자.
- 제 1 항에 있어서,상기 바이어싱 자성층 구조는, 비자성 재료로 이루어진 층에 의해 분리된 2개의 강자성층을 포함하는 것을 특징으로 하는 자계 소자.
- 제 6 항에 있어서,상기 바이어싱층 구조는 비자성 재료로 이루어진 층에 의해 분리된 2개의 강자성층을 포함하고, 그 강자성층 중의 하나는 교환 바이어싱 재료로 이루어진 층에 인접하는 것을 특징으로 하는 자계 소자.
- 선행하는 청구항 중 어느 한 항에 따른 자계 소자를 포함하고, 스페이서층 구조가 터널 장벽층을 구비한 것을 특징으로 하는 스핀 터널 접합장치.
- 제 1 항 내지 제 9 항 중 어느 한 항에 따른 자계 소자를 구비한 것을 특징으로 하는 거대 자기 저항 소자.
- 자기 정보매체로부터 정보를 판독하고, 제 1 항 내지 제 9 항 중 어느 한 항에 따른 자계 소자 또는 제 10 항 또는 제 11 항에 따른 장치를 구비한 것을 특징으로 하는 판독 시스템.
- 제 1 항 내지 제 9 항 중 어느 한 항에 따른 자계 소자를 구비한 것을 특징으로 하는 자기 메모리.
- 제 13 항에 따른 메모리를 구비한 것을 특징으로 하는 전자 회로.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00200830.8 | 2000-03-09 | ||
EP00200830 | 2000-03-09 | ||
PCT/EP2001/002133 WO2001067469A1 (en) | 2000-03-09 | 2001-02-23 | Magnetic field element having a biasing magnetic layer structure |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20020019017A true KR20020019017A (ko) | 2002-03-09 |
Family
ID=8171169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017014198A Ceased KR20020019017A (ko) | 2000-03-09 | 2001-02-23 | 바이어싱 자성층 구조를 갖는 자계 소자 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6438026B2 (ko) |
EP (1) | EP1200972A1 (ko) |
JP (1) | JP2003526913A (ko) |
KR (1) | KR20020019017A (ko) |
CN (1) | CN1242429C (ko) |
TW (1) | TW495745B (ko) |
WO (1) | WO2001067469A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100647319B1 (ko) * | 2005-02-05 | 2006-11-23 | 삼성전자주식회사 | 스핀 분극 전류를 이용한 멀티 비트 자기 메모리 소자와그 제조 및 구동 방법 |
Families Citing this family (69)
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JP3817399B2 (ja) * | 1999-12-24 | 2006-09-06 | 株式会社日立グローバルストレージテクノロジーズ | 磁気抵抗センサー |
US6791805B2 (en) * | 2001-05-03 | 2004-09-14 | Seagate Technology Llc | Current-perpendicular-to-plane spin valve reader with reduced scattering of majority spin electrons |
US6744086B2 (en) | 2001-05-15 | 2004-06-01 | Nve Corporation | Current switched magnetoresistive memory cell |
US6631055B2 (en) * | 2001-06-08 | 2003-10-07 | International Business Machines Corporation | Tunnel valve flux guide structure formed by oxidation of pinned layer |
WO2002103798A1 (fr) | 2001-06-19 | 2002-12-27 | Matsushita Electric Industrial Co., Ltd. | Memoire magnetique et procede de commande associe, ainsi qu'appareil de memoire magnetique comprenant celle-ci |
US6545906B1 (en) | 2001-10-16 | 2003-04-08 | Motorola, Inc. | Method of writing to scalable magnetoresistance random access memory element |
US6757144B2 (en) * | 2002-01-18 | 2004-06-29 | International Business Machines Corporation | Flux guide read head with in stack biased current perpendicular to the planes (CPP) sensor |
US6865062B2 (en) * | 2002-03-21 | 2005-03-08 | International Business Machines Corporation | Spin valve sensor with exchange biased free layer and antiparallel (AP) pinned layer pinned without a pinning layer |
US6741432B2 (en) * | 2002-03-21 | 2004-05-25 | International Business Machines Corporation | Current perpendicular to the planes (CPP) spin valve sensor with in-stack biased free layer and self-pinned antiparallel (AP) pinned layer structure |
US6856493B2 (en) * | 2002-03-21 | 2005-02-15 | International Business Machines Corporation | Spin valve sensor with in-stack biased free layer and antiparallel (AP) pinned layer pinned without a pinning layer |
JP2003281705A (ja) * | 2002-03-25 | 2003-10-03 | Hitachi Ltd | 磁気ヘッド、磁気ヘッドジンバルアッセンブリ、磁気記録再生装置及び磁性メモリ |
US6801412B2 (en) | 2002-04-19 | 2004-10-05 | International Business Machines Corporation | Method and apparatus for improved pinning strength for self-pinned giant magnetoresistive heads |
US7170721B2 (en) * | 2002-06-25 | 2007-01-30 | Quantum Corporation | Method of producing flux guides in magnetic recording heads |
US6781798B2 (en) | 2002-07-15 | 2004-08-24 | International Business Machines Corporation | CPP sensor with dual self-pinned AP pinned layer structures |
US7095646B2 (en) | 2002-07-17 | 2006-08-22 | Freescale Semiconductor, Inc. | Multi-state magnetoresistance random access cell with improved memory storage density |
US6654278B1 (en) * | 2002-07-31 | 2003-11-25 | Motorola, Inc. | Magnetoresistance random access memory |
US6677631B1 (en) * | 2002-08-27 | 2004-01-13 | Micron Technology, Inc. | MRAM memory elements and method for manufacture of MRAM memory elements |
US6881993B2 (en) * | 2002-08-28 | 2005-04-19 | Micron Technology, Inc. | Device having reduced diffusion through ferromagnetic materials |
US6937448B2 (en) * | 2002-11-13 | 2005-08-30 | Hitachi Global Storage Technologies Netherlands, B.V. | Spin valve having copper oxide spacer layer with specified coupling field strength between multi-layer free and pinned layer structures |
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KR100499136B1 (ko) * | 2002-12-14 | 2005-07-04 | 삼성전자주식회사 | 전자 스핀의존 산란을 이용한 자성매체 및 자성매체정보재생장치 및 재생방법 |
US6829161B2 (en) * | 2003-01-10 | 2004-12-07 | Grandis, Inc. | Magnetostatically coupled magnetic elements utilizing spin transfer and an MRAM device using the magnetic element |
US6956763B2 (en) | 2003-06-27 | 2005-10-18 | Freescale Semiconductor, Inc. | MRAM element and methods for writing the MRAM element |
US6867953B2 (en) * | 2003-07-02 | 2005-03-15 | Hitachi Global Storage Technologies Netherlands B.V. | Self-pinned in-stack bias structure with improved pinning |
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-
2000
- 2000-11-16 TW TW089124262A patent/TW495745B/zh not_active IP Right Cessation
-
2001
- 2001-02-23 WO PCT/EP2001/002133 patent/WO2001067469A1/en not_active Application Discontinuation
- 2001-02-23 EP EP01927703A patent/EP1200972A1/en not_active Withdrawn
- 2001-02-23 KR KR1020017014198A patent/KR20020019017A/ko not_active Ceased
- 2001-02-23 CN CNB018004687A patent/CN1242429C/zh not_active Expired - Fee Related
- 2001-02-23 JP JP2001566149A patent/JP2003526913A/ja active Pending
- 2001-03-08 US US09/801,629 patent/US6438026B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100647319B1 (ko) * | 2005-02-05 | 2006-11-23 | 삼성전자주식회사 | 스핀 분극 전류를 이용한 멀티 비트 자기 메모리 소자와그 제조 및 구동 방법 |
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US20010026470A1 (en) | 2001-10-04 |
TW495745B (en) | 2002-07-21 |
CN1364300A (zh) | 2002-08-14 |
JP2003526913A (ja) | 2003-09-09 |
US6438026B2 (en) | 2002-08-20 |
CN1242429C (zh) | 2006-02-15 |
WO2001067469A1 (en) | 2001-09-13 |
EP1200972A1 (en) | 2002-05-02 |
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