KR200177818Y1 - Assembly structure of heat sink - Google Patents
Assembly structure of heat sink Download PDFInfo
- Publication number
- KR200177818Y1 KR200177818Y1 KR2019970029884U KR19970029884U KR200177818Y1 KR 200177818 Y1 KR200177818 Y1 KR 200177818Y1 KR 2019970029884 U KR2019970029884 U KR 2019970029884U KR 19970029884 U KR19970029884 U KR 19970029884U KR 200177818 Y1 KR200177818 Y1 KR 200177818Y1
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- South Korea
- Prior art keywords
- heat sink
- chip
- circuit board
- printed circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 고안은 히트싱크(Heat Sink)의 조립구조에 관한 것으로, 인쇄회로기판에 배설된 칩(Chip)과 히트싱크를 밀착시켜 칩에서 발생되는 열을 외부로 방열시키는데 용이한 히트싱크의 조립구조를 제공하는 것을 목적으로 한다. 본 고안은 인쇄회로기판(10)의 양면에 배설된 칩(12)에 접촉되도록 한쌍의 히트싱크(30c,30d)를 조립하는데 있어서, 일측의 히트싱크(30c)에는 내주면에 걸림턱(34)이 구비된 축공(32)을 배열 형성시키고, 타측의 히트싱크(30d)에는 상기 축공(32)과 대응되는 나사구멍(35)을 형성하여 상기 축공(32)에 삽입되고 외주면에 스프링(50)이 개재된 보스(40)와 상기 나사구멍(35)에 삽입된 나사(60)를 체결시켜 스프링의 탄성력에 의해 히트싱크와 칩의 밀착력을 강화시킬 수 있도록 구성되어 있다.The present invention relates to an assembly structure of a heat sink, and a heat sink assembly structure that is easy to dissipate heat generated from a chip to the outside by closely contacting a chip disposed on a printed circuit board and a heat sink. It aims to provide. The present invention assembles a pair of heat sinks 30c and 30d so as to be in contact with the chip 12 disposed on both sides of the printed circuit board 10, and one side of the heat sink 30c has a locking projection 34 on its inner circumferential surface. The provided shaft holes 32 are arranged in an array, and screw holes 35 corresponding to the shaft holes 32 are formed in the heat sink 30d on the other side, and are inserted into the shaft holes 32 and the springs 50 are formed on the outer circumferential surface thereof. The interposed boss 40 and the screw 60 inserted into the screw hole 35 are fastened so that the adhesive force between the heat sink and the chip can be strengthened by the elastic force of the spring.
Description
본 고안은 히트싱크(Heat Sink)의 조립구조에 관한 것으로, 더욱 상세하게는 인쇄회로기판에 실장된 칩(Chip)과 히트싱크를 밀착시켜 칩에서 발생되는 열을 방열시키는데 용이한 히트싱크의 조립구조에 관한 것이다.The present invention relates to an assembly structure of a heat sink, and more particularly, an assembly of a heat sink that is easy to dissipate heat generated from a chip by bringing a chip mounted on a printed circuit board into close contact with a heat sink. It's about structure.
일반적으로, 각종 전기전자 제품속에는 제품의 기능을 수행하기 위한 회로와 그와 관련된 소자들이 인쇄회로기판상에 배열되어 있다. 이러한 소자들 중에는 집적회로와 같이 비교적 고가인 소자들도 포함되어 있는데, 집적회로(Integrated Circuit)는 전기적인 동작시 내부에서 고온의 열이 발생되기 때문에 이를 냉각시키기 위하여 히트싱크를 이용하는 경우가 많다. 이러한 히트싱크를 제작할 때 압출에 의해 다수개의 방열핀을 포함하여 공기와의 접촉면적을 넓힌 구조로 길게 뽑아낸 후 이를 적당한 길이로 잘라 형성시킨 압출형 히트싱크와, 또 단순한 판재에 방열핀을 형성한 판형 히트싱크로 구분되는데 이 두 종류의 히트싱크 모두 열전도가 잘 이루어지는 알루미늄재로 이루어져 있다.In general, in various electrical and electronic products, circuits and related elements for performing the functions of the product are arranged on a printed circuit board. Among these devices, relatively expensive devices such as integrated circuits are included. Since integrated circuits generate high temperature heat during electrical operation, heat sinks are often used to cool them. When manufacturing such a heat sink, an extrusion type heat sink including a plurality of heat dissipation fins, including a plurality of heat dissipation fins, having a long contact area with air, and then cut and formed into a suitable length, and a plate shape having heat dissipation fins formed on a simple plate. It is divided into heat sinks, and both types of heat sinks are made of aluminum which has good thermal conductivity.
특히, 통신기기와 같은 시스템에는 각종 모듈이 장착될 수 있는 인쇄회로기판에는 집적회로 등이 내장된 다수의 칩들이 밀집되게 배치되어 있기 때문에 다수의 집적회로를 방열시키기 위해 다수의 집적회로를 동시에 커버하도록 판형의 히트싱크가 결합하는 경우가 많다.In particular, in a system such as a communication device, since a plurality of chips including integrated circuits are densely arranged in a printed circuit board on which various modules can be mounted, a plurality of integrated circuits are simultaneously covered to dissipate a plurality of integrated circuits. In many cases, plate-shaped heat sinks are combined.
이와 같이 종래의 판형의 히트싱크가 결합된 인쇄회로기판을 첨부된 도면을 참조하여 살펴보면 다음과 같다.As described above, referring to the accompanying drawings, a conventional printed circuit board having a plate-shaped heat sink is as follows.
도 1은 종래의 히트싱크가 인쇄회로기판에 결합된 상태를 분해하여 도시한 분리사시도로서, 참조번호 10은 집적회로 등이 내장된 칩(12)이 배열된 인쇄회로기판이고, 30a,30b는 칩에서 발생되는 열을 방열시키기 위한 히트싱크이다.1 is an exploded perspective view illustrating a state in which a conventional heat sink is coupled to a printed circuit board, and reference numeral 10 denotes a printed circuit board on which chips 12 incorporating integrated circuits and the like are arranged. It is a heat sink to dissipate heat generated from the chip.
인쇄회로기판(10)은 판형상으로 양측에는 집적회로 등이 내장된 칩(12)등이 배설되고, 각 칩(12) 사이에는 체결구멍(14)이 형성되어 있다. 그리고 각 칩(12)들은 표면에 실장된 회로와 전기적인 접속을 이루고 있고, 각 칩(12)의 단면에는 열전도율이 높은 써멀패드(Thermal Pad)(20)가 개재된다.The printed circuit board 10 has a plate shape, and chips 12 and the like in which integrated circuits and the like are embedded on both sides thereof, and fastening holes 14 are formed between the chips 12. Each chip 12 is electrically connected to a circuit mounted on a surface thereof, and a thermal pad 20 having a high thermal conductivity is interposed in a cross section of each chip 12.
히트싱크(30a,30b)는 박판형 판재 즉, 다수개의 체결공(31)이 배열된 알루미늄 판재로 일측면에는 표면적을 넓히기 위해 날개(36)가 형성되어 있다.The heat sinks 30a and 30b are thin plates, that is, aluminum plates in which a plurality of fastening holes 31 are arranged, and wings 36 are formed on one side to increase the surface area.
이상에서 설명한 구성으로 종래의 인쇄회로기판에 히트싱크의 조립을 살펴보면 다음과 같다.Looking at the assembly of the heat sink to the conventional printed circuit board as described above is as follows.
인쇄회로기판(10)의 양면에 히트싱크(30a,30b)를 위치시킨 후에 체결구멍(14)을 통해 나사(60)를 결합시킨다. 이때, 나사(60)는 인쇄회로기판(10)의 체결공(14)에 관통된 후에 나사(60)의 끝단이 타측의 히트싱크(30b)의 체결공(31)에 삽입된다.After placing the heat sinks 30a and 30b on both sides of the printed circuit board 10, the screws 60 are coupled through the fastening holes 14. At this time, the screw 60 is penetrated through the fastening hole 14 of the printed circuit board 10, and the end of the screw 60 is inserted into the fastening hole 31 of the heat sink 30b of the other side.
이와 같이 결합된 상태에서 칩(12)에서 발생된 열은 열전도율이 높은 써멀패드(20)를 통해 히트싱크(30a,30b)로 전도되면서 칩(12)에서 발생된 열을 외부로 방열시키게 된다.In this coupled state, the heat generated from the chip 12 is conducted to the heat sinks 30a and 30b through the thermal pad 20 having high thermal conductivity, thereby dissipating heat generated from the chip 12 to the outside.
그러나, 히트싱크(30a,30b)와 인쇄회로기판(10)에 나사(60)가 체결되더라도 나사(60)가 체결된 부분의 가압력과 나사(60)의 체결공(31)이 형성된 원거리에서 접촉된 칩(12)은 히트싱크(30a,30b)와의 밀착력이 적어진다. 즉, 인쇄회로기판(10)에 다수개의 칩(12)이 배설됨에 따라 나사(20)의 체결력이 히트싱크(30a,30b)와 균일하게 절단되지 못하고 나사(60)가 결합된 부분은 체결력이 강하지만 나사와 나사사이의 중간부분에서 설치된 칩(12)은 히트싱크(30a,30b)와의 밀착력이 강하지 못하여 칩(12)과 히트싱크(30a,30b)와의 이격된 틈이 발생된다. 따라서, 써멀패드(20)와 히트싱크(30a,30b)와의 접촉면이 이격되는 현상이 발생된다. 이와 같이 칩(12)에 개재된 써멀패드(20)가 이격되는 경우가 발생되므로써 칩(12)에서 발생된 열이 히트싱크(30a,30b)에 효과적으로 전도되지 못한다. 이러한 문제는 칩(12)에서 발생된 고온의 열이 인쇄회로기판(10)상에 실장된 회로등이 열에 의해 단락되거나 납땜 등이 분리되어 회로적인 단절을 야기시킨다.However, even when the screw 60 is fastened to the heat sinks 30a and 30b and the printed circuit board 10, the pressing force of the part where the screw 60 is fastened and the fastening hole 31 of the screw 60 are formed in contact with each other. The adhered chip 12 becomes less in close contact with the heat sinks 30a and 30b. That is, as the plurality of chips 12 are disposed on the printed circuit board 10, the fastening force of the screw 20 is not uniformly cut with the heat sinks 30a and 30b, and the fastening force of the screw 60 is coupled. Although strong, the chip 12 installed in the middle portion between the screw and the screw does not have strong adhesion between the heat sinks 30a and 30b, so that a space between the chip 12 and the heat sinks 30a and 30b is generated. Therefore, a phenomenon occurs in which the contact surfaces between the thermal pad 20 and the heat sinks 30a and 30b are spaced apart. As such, the thermal pads 20 interposed between the chips 12 may be spaced apart, and thus heat generated from the chips 12 may not be effectively conducted to the heat sinks 30a and 30b. Such a problem causes a high temperature heat generated in the chip 12 to cause a circuit break because a circuit lamp mounted on the printed circuit board 10 is short-circuited by heat or solder is separated.
따라서 본 고안은 상술된 문제점을 해결하기 위해 안출된 것이다.Therefore, the present invention is devised to solve the above-mentioned problem.
본 고안의 목적은 인쇄회로기판과 히트싱크를 결합시킬 때 탄성부재를 이용하여 히트싱크와 칩과의 밀착력을 강화시킬 수 있는 히트싱크의 조립구조를 제공하는데 있다.An object of the present invention is to provide an assembly structure of a heat sink that can enhance the adhesion between the heat sink and the chip by using an elastic member when bonding the printed circuit board and the heat sink.
도 1은 종래의 히트싱크가 결합된 인쇄회로기판을 분해하여 도시한 분리사시 도,1 is an exploded perspective view illustrating an exploded printed circuit board coupled to a conventional heat sink;
도 2는 본 고안에 따른 히트싱크가 결합된 인쇄회로기판을 분해하여 도시한 분리사시도,Figure 2 is an exploded perspective view showing an exploded printed circuit board coupled to the heat sink according to the present invention,
도 3은 본 고안에 따른 히트싱크가 결합된 인쇄회로기판을 도시한 단면도이 다.3 is a cross-sectional view showing a printed circuit board coupled to a heat sink according to the present invention.
*** 도면의 주요 부분에 대한 부호 설명 ****** Explanation of symbols on the main parts of the drawing ***
10 : 인쇄회로기판 12 : 칩10: printed circuit board 12: chip
14 : 체결구멍 20 : 써멀패드14: fastening hole 20: thermal pad
30a,30b,30c,30d : 히트싱크 32 : 축공30a, 30b, 30c, 30d: Heat sink 32: Shaft hole
34 : 걸림턱 36 : 날개34: jam jaw 36: wings
40 : 보스 42 : 축부40: boss 42: shaft
44 : 체결홈 50 : 스프링44: fastening groove 50: spring
60 : 나사60: screw
본 고안의 목적을 달성하기 위한 수단은 인쇄회로기판의 양면에 실장된 각각의 칩을 방열시킴에 있어서,Means for achieving the object of the present invention in the heat dissipation of each chip mounted on both sides of the printed circuit board,
각각의 칩의 상부에 중첩되되, 인쇄회로기판에 형성된 체결구멍과 서로 통하도록 축공과 나사구멍을 갖는 히트싱크와,A heat sink superimposed on an upper portion of each chip, the heat sink having a shaft hole and a screw hole to communicate with a fastening hole formed in the printed circuit board;
일측단부에는 체결홈이 형성되고 타측단은 에지부가 구비되어 상기 축공에 삽입되는 보스와,A fastening groove is formed at one end portion and the other end is provided with an edge portion boss that is inserted into the shaft hole,
일측단은 상기 축공에 위치되고, 타측단은 상기 보스의 에지부에 위치되어 상기 보스를 부세시키는 스프링과,One end is located in the shaft hole, the other end is located on the edge of the boss to spring the boss and,
상기 나사구멍에 삽입되어 체결홈에 체결된 나사로 달성될 수 있다.It can be achieved by a screw inserted into the screw hole and fastened to the fastening groove.
본 고안에 의하면 인쇄회로기판의 양측면에 히트싱크를 재치시킨 후에 축공으로 스프링이 개재된 보스를 결합시키고 나사구멍으로 나사를 체결시켜 보스의 체결홈에 나사가 삽입되면 스프링의 가압력에 의해 인쇄회기판에 배열된 칩과 히트싱크와 밀착력이 강화됨에 따라서 칩에서 발생된 열이 히트싱크로 열전달 이루어지므로써 칩에서 발생된 열을 외부로 용이하게 방열시킬 수 있다.According to the present invention, after the heat sinks are placed on both sides of the printed circuit board, the bosses with springs are engaged with the shaft holes, and the screws are screwed into the screw holes to insert the screws into the fastening grooves of the bosses. As the adhesion between the chip and the heat sink is increased, heat generated from the chip is transferred to the heat sink, thereby easily dissipating heat generated from the chip to the outside.
이하, 본 고안의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 고안에 따른 히트싱크가 결합된 상태에 인쇄회로기판을 분해하여 도시한 분리사시도로서, 참조번호 10은 집적회로등이 내장된 칩(12) 등이 설치된 인쇄회로기판이고, 30c,30d는 방열을 용이하게 할 수 있는 날개등이 부착된 히트싱크이며, 40은 인쇄회로기판과 히트싱크을 체결시키고 외주면에는 스프링이 개재된 보스이다.FIG. 2 is an exploded perspective view illustrating a disassembled printed circuit board in a state in which a heat sink is coupled according to the present invention. Reference numeral 10 denotes a printed circuit board on which a chip 12 having an integrated circuit, etc. is installed. 30d is a heat sink with wings etc. to facilitate heat dissipation, and 40 is a boss in which a heat sink is connected to a printed circuit board and a spring is disposed on an outer circumferential surface thereof.
인쇄회로기판(10)의 양측면에는 칩(12)등이 일정하게 배열되어 있고, 그 각칩(12)사이에는 체결구멍(14)이 배열 형성되어 있다. 그리고 각칩(12)의 상단면에는 열전율이 높은 재질로 제작된 써멀패드(20)가 개재되어 있다.Chips 12 and the like are constantly arranged on both side surfaces of the printed circuit board 10, and fastening holes 14 are arranged between the chips 12, respectively. And the upper surface of each chip 12 has a thermal pad 20 made of a high thermal conductivity material is interposed.
히트싱크(30c,30d)는 인쇄회로기판(10)의 양측면에 결합되도록 상하 한쌍으로 구비되고, 일측면에는 표면적을 확장시킬 수 있도록 굴곡된 면의 날개(36)가 형성되어 있다. 그리고 상측 히트싱크(30c)의 칩(12)들 사이에는 축공(32)이 형성되고, 그 축공(32)의 내주면에는 걸림턱(34)이 형성되어 있다. 또한 하측 히트싱크(30d)에는 축공(32)과 대응되는 나사구멍(35)이 형성되어 있다.The heat sinks 30c and 30d are provided in a pair of upper and lower sides to be coupled to both sides of the printed circuit board 10, and one side of the heat sinks 30 is formed with curved wings 36 to extend the surface area. A shaft hole 32 is formed between the chips 12 of the upper heat sink 30c, and a locking jaw 34 is formed on an inner circumferential surface of the shaft hole 32. Further, a screw hole 35 corresponding to the shaft hole 32 is formed in the lower heat sink 30d.
보스(40)는 상측 히트싱크(35c)에 형성된 축공(32)에 삽입되어 인쇄회로기판(10)을 관통하는 길이를 갖는 축부(42)와, 그 축부(42)의 내부에는 나사홈이 구비된 체결홈(44)이 형성되어 있다. 그리고 체결홈(44)의 타측 단부에는 에지부(41)가 형성된다. 에지부(41)는 축공(32)의 직경보다 작은 단면적을 가진다.The boss 40 has a shaft portion 42 having a length penetrating the printed circuit board 10 and inserted into the shaft hole 32 formed in the upper heat sink 35c, and a screw groove is provided inside the shaft portion 42. Fastening grooves 44 are formed. An edge portion 41 is formed at the other end of the fastening groove 44. The edge portion 41 has a cross-sectional area smaller than the diameter of the shaft hole 32.
스프링(50)은 일정길이가 코일형태로 다수회 감겨 보스(40)의 축부(42)가 삽입되는 내경을 갖는 원통형이다.The spring 50 has a cylindrical shape having an inner diameter in which a predetermined length is wound a plurality of times in the form of a coil and the shaft portion 42 of the boss 40 is inserted.
미설명부호 60은 상기 체결홈(44)에 체결되는 나사이다.Reference numeral 60 is a screw fastened to the fastening groove 44.
이상에서 설명한 구성으로 결합된 인쇄회로기판의 조립 및 그에 따른 작용상태를 살펴보면 다음과 같다.Looking at the assembly of the printed circuit board combined with the configuration described above and the resulting action state as follows.
도 3은 본 고안에 따른 히트싱크가 인쇄회로기판에 결합된 상태의 단면을 도시한 단면도로서, 인쇄회로기판(10)의 양측면에 배설된 칩(12)의 상면에 써멀패드(20)를 개재시킨 후에 상하 히트싱크(30c,30d)를 재치시킨다. 이때, 인쇄회로기판(10)에 배열된 체결구멍(14)과 상측 히트싱크(30c)에 형성된 축공(32)과, 하측 히트싱크(30d)의 나사구멍(35)이 일렬로 배열된다. 이와 같이 결합된 상태에서 보스(40)의 외주면에 스프링(50)을 개재시켜 축공(32)에 삽입시키면 보스(40)는 축공(32)을 관통하여 인쇄회로기판(10)의 체결구멍(14)을 통과하게 된다. 그리고 하측히트싱크(35d)의 나사구멍(35)에 나사(60)를 삽입시켜 보스(40)의 체결홈(44)에 결합시킨다.3 is a cross-sectional view showing a cross-sectional view of a heat sink coupled to a printed circuit board according to the present invention, with a thermal pad 20 interposed on an upper surface of a chip 12 disposed on both sides of the printed circuit board 10. After the top and bottom heat sinks 30c and 30d are placed. At this time, the fastening hole 14 arranged in the printed circuit board 10, the shaft hole 32 formed in the upper heat sink 30c, and the screw hole 35 of the lower heat sink 30d are arranged in a row. When the spring 40 is inserted into the shaft hole 32 through the spring 50 on the outer circumferential surface of the boss 40 in the coupled state, the boss 40 penetrates the shaft hole 32 and the fastening hole 14 of the printed circuit board 10. Will pass). Then, the screw 60 is inserted into the screw hole 35 of the lower heat sink 35d to be coupled to the fastening groove 44 of the boss 40.
상술된 바와 같이 인쇄회로기판(10)은 보스(40)와 나사(60)가 결합될 때 스프링(50)의 탄성력 즉, 보스(40)의 에지부(41)와 축공(32)의 걸림턱(34)에 사이에서 가압되는 탄성력에 의해 히트싱크(30c,30d)와 칩(12)과의 밀착력이 강해지므로써 히트싱크(30c,30d)와 칩(12)과의 이격된 틈새를 방지하여 써멀패드(20)가 분리되거나 이탈되지 않는다. 따라서 칩(12)에서 발생된 고온의 열은 써멀패드(20)를 통해 히트싱크에 전도되어 외부로 방열된다.As described above, the printed circuit board 10 has the elastic force of the spring 50 when the boss 40 and the screw 60 are coupled, that is, the locking step of the edge portion 41 and the shaft hole 32 of the boss 40. The adhesive force between the heat sinks 30c and 30d and the chip 12 is strengthened by the elastic force pressed between the 34 to prevent the gap between the heat sinks 30c and 30d and the chip 12 to prevent thermal separation. The pad 20 does not separate or detach. Therefore, the high temperature heat generated by the chip 12 is conducted to the heat sink through the thermal pad 20 and radiated to the outside.
이상에서 설명한 바와 같이 본 고안에 따른 작용에 대한 효과를 살펴보면 다음과 같다.Looking at the effect on the action according to the present invention as described above are as follows.
도 3에 도시된 바와 같이 상하 히트싱크(30c,30d)를 스프링(50)이 개재된 보스(40)와 나사(60)의 체결력에 의해 칩(12)과의 히트싱크(30c,30d)가 이격된 틈을 방지하여 칩(12)에 개재된 써멀패드(20)의 이탈을 방지할 뿐만 아니라 칩(12)과 히트싱크(30c,30d)와의 이격된 틈새가 발생되지 않아 칩(12)에서 발생된 고온의 열을 외부로 방열시키는데 용이한 효과를 얻을 수 있다.As shown in FIG. 3, the heat sinks 30c and 30d of the upper and lower heat sinks 30c and 30d are formed by the fastening force of the boss 40 and the screw 60 with the spring 50 interposed therebetween. By preventing the spaced apart gap to prevent the separation of the thermal pad 20 interposed on the chip 12, as well as the gap between the chip 12 and the heat sink (30c, 30d) does not occur in the chip 12 An easy effect can be obtained for radiating the generated high temperature heat to the outside.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970029884U KR200177818Y1 (en) | 1997-10-28 | 1997-10-28 | Assembly structure of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970029884U KR200177818Y1 (en) | 1997-10-28 | 1997-10-28 | Assembly structure of heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990016461U KR19990016461U (en) | 1999-05-25 |
| KR200177818Y1 true KR200177818Y1 (en) | 2000-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970029884U Expired - Fee Related KR200177818Y1 (en) | 1997-10-28 | 1997-10-28 | Assembly structure of heat sink |
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| Country | Link |
|---|---|
| KR (1) | KR200177818Y1 (en) |
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1997
- 1997-10-28 KR KR2019970029884U patent/KR200177818Y1/en not_active Expired - Fee Related
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| KR19990016461U (en) | 1999-05-25 |
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