KR200171479Y1 - Device heat protection apparatus for semiconductor device tester - Google Patents

Abstract

The present invention relates to an element heat dissipation device of a semiconductor device inspector that emits a large amount of heat generated instantaneously from an element when inspecting electrical characteristics of a manufactured device in a test part of a handler. It is to maximize the area of the heat radiation member.

To this end, in the test section of the device inspector configured to connect the lead 3a of the device 3 suspended from the carrier module 10 to the socket pin 4 as the lifting plate 11 descends, the lifting plate 11. The guide block 12 fixed to the), the pusher 14 is elastically installed by the elastic member 15 so as to be lifted and lowered to the guide block, and coupled to the pusher and elasticity with the upper surface of the device by the pressing force of the pusher during the test In this case, the first and second heat dissipation members 18 and 20 are directly connected to the upper surface of the device, so that the heat dissipation can be rapidly achieved.

Description

Device radiator of semiconductor device tester

The present invention relates to a device heat dissipation device of a semiconductor device inspector that emits a lot of instantaneous heat generated from the device to the outside when inspecting the electrical characteristics of the manufactured device in the test section of the handler. The upper surface of the device is to maximize the area of the heat radiation member is connected.

In recent years, the thickness of semiconductor devices has gradually become thinner according to the trend of lighter and shorter parts, and a representative one of them is a thin small outline package (TSOP).

The TSOP has a thickness of about 1 mm, and when the impact is applied to the upper or lower surface due to carelessness or the like during the test process for inspecting the electrical characteristics of the device manufactured in the manufacturing process, the characteristics of the device are deteriorated and the impact is applied. In extreme cases, the molded chip is broken, so care must be taken not to impact the device during transfer or testing within the handler.

In addition, since the high temperature heat is generated in the center of the device (where the chip is located) during the test, there is a concern that the electrical characteristics may be changed. Since a problem that needs to be implemented again occurs, a means for quickly dissipating heat generated from the device to the outside during the test should be taken.

1A to 2B are longitudinal cross-sectional views for explaining the operation of the conventional apparatus, in which a pusher 2 made of stainless steel is fixed to the lifting plate 1, and the leads 3a of the element 3 are attached to both sides of the pusher. Sapphire (5) is pressed to the socket pin (4) side is fixed, the upper side of the pusher (2) is formed with a plurality of heat dissipation fins 6 made of aluminum for heat dissipating heat generated from the device to the outside It is.

Therefore, when the element 3 is loaded in the cavity 7a of the carrier module 7 and moved to the upper portion of the socket 8 as shown in FIGS. 1A and 1B, the socket 8 rises and the lifting plate (1) is lowered by the lifting means as shown in Figs. 2A and 2B.

Accordingly, when the sapphire 5 fixed to both sides of the pusher 2 presses the lead 3a of the element 3, the lead 3a of the element is closely connected while deforming the socket pin 4, so that the electrical Characteristic inspection becomes possible.

In the above operation, the guide pin 9 fixed to the elevating plate 1 is inserted into the guide hole 7b formed in the carrier module 7 to position the sapphire 5 so that the lead of the element 3 can be positioned. Press (3a) correctly.

However, this conventional apparatus has the following problems.

First, the bottom surface of the pusher 2 must be closely connected to the top surface of the element 3 so that heat transfer for heat dissipation is easily performed to the heat dissipation fin 6 side, but the lead 3a of the element 3 is connected to the socket pin 4. Since the sapphire 5 is connected to the lead 3a at the time of contact, the upper surface of the element cannot be closely connected with the bottom surface of the pusher 2.

That is, when the bottom surface of the pusher 2 is configured to be connected to the top surface of the device 3, the pusher may pressurize the device to damage the device, so that the heat generated by the device during the test cannot be quickly dissipated to the outside. Therefore, the case where the good product was judged to be a defective product frequently occurred, and accordingly, the retesting of the element determined as the defective product had to be repeated, thus the productivity was lowered.

Second, when the pusher 2 is precisely processed and the bottom surface of the pusher is closely connected to the top surface of the device 3, the heat transfer path is long with the heat dissipation fins 6 formed on the top of the device and the pusher, thereby reducing heat dissipation efficiency.

Third, since it is determined that the defective device 3 produced through various processes is a defective product, the yield is lowered.

The present invention devised to solve such a problem in the prior art, the heat dissipation member is configured to be directly connected to the upper surface of the device when the lead and the socket pin of the device is electrically connected to the heat generated during the test to the outside quickly Its purpose is to enable heat dissipation.

According to an aspect of the present invention for achieving the above object, in the test section of the device inspector configured to be connected to the socket pin of the lead of the element suspended on the carrier module as the lifting plate is lowered, the guide block fixed to the lifting plate, and Provided is a device heat dissipation device of a semiconductor device inspector consisting of a pusher elastically installed by an elastic member so as to be able to move up and down in a guide block, and a first heat dissipation member coupled to the pusher and elastically connected to an upper surface of the device by a pressing force of the pusher during a test. do.

1A to 2B are longitudinal cross-sectional views for explaining the operation of the conventional apparatus.

1A and 1B are diagrams illustrating a state in which a device is loaded in a carrier module

2a and 2b is a state in which the pusher is lowered to contact the lead of the device to the socket pin

3 is an exploded perspective view showing the main part of the present invention

4a and 4b is a longitudinal cross-sectional view for explaining the operation of the present invention,

4A is a state diagram in which a device is loaded in a carrier module

Figure 4b is a state in which the pusher is lowered to contact the lead of the device to the socket pin

Explanation of symbols for main parts of the drawings

10 carrier module 12 guide block

14 pusher 18 first heat dissipation member

18a, 20b: heat dissipation fin 20: second heat dissipation member

Hereinafter, the present invention will be described in more detail with reference to FIGS. 3 to 4B showing one embodiment as follows.

Figure 3 is an exploded perspective view showing the main portion of the present invention and Figures 4a and 4b is a longitudinal cross-sectional view for explaining the operation of the present invention, the carrier module 10 applied to the present invention is a cavity (cavity) (10a) formed on the bottom In the patent application No. 60,662 filed by the applicant in 1996 as a type (type) in which the element (3) is suspended in the process between, the detailed structure and description thereof will be omitted.

According to the present invention, the guide block 12 is fixed to the elevating plate 11 by the bolt 13 and the pusher 14 is elastically installed by the elastic member 15 such as a coil spring so that the pusher 14 can be lifted and lowered. In this case, the pusher 14 is not separated from the guide block 12 by the support piece 17 fixed to the pusher with the bolt 16.

In the pusher 14 elastically installed in the guide block 12, the first heat dissipation member 18, which is connected to the upper surface of the element 3 by its own weight by the pressing force of the pusher according to the lowering of the elevating plate 11, is a guide block. It is coupled to the upper and lower flow by the bolt 19 fastened to (12).

This is to prevent the phenomenon in which the first heat dissipation member 18 is connected while impacting the upper surface of the element 3 when the pusher 14 is lowered to check the electrical characteristics of the element.

A plurality of heat dissipation fins 18a are vertically or horizontally formed on the first heat dissipation member 18 connected to the upper surface of the element 3 during the test, which is a high temperature generated instantaneously at the center of the element 3 during the test. This is to allow heat to be quickly dissipated to the outside.

In the present invention, in order to more quickly dissipate the high temperature heat generated in the center of the device 3 to the outside during the test, in the present invention, the first heat dissipation member 18 is exposed to the inside of the cavity 10a. The formed second heat dissipation member 20 is fixed in the recess 10b of the carrier module 10 so that the bottom surface is exposed to the inside of the cavity 10a and the heat dissipation fin 20b formed at the top is exposed to the outside.

The materials of the first and second heat dissipation members 18 and 20 applied to the present invention are made of aluminum (Al) having good thermal conductivity and relatively low cost.

Referring to the operation of the present invention configured as described above are as follows.

First, in the state where the elevating plate 11 is located at the top dead center, the pusher 14 is pulled out downward by the elastic force of the elastic member 15 to the maximum, and the first pusher 14 is fastened by the bolt 19 to the pusher 14. The upper surface of the heat dissipation member 18 is not connected to the bottom of the pusher and is spaced apart by "T".

In this state, when the element 3 for the performance test is loaded on the bottom surface of the carrier module 10, the top surface of the device is in close contact with the bottom surface of the second heat dissipation member 20 fixed to expose the inside of the cavity 10a. .

In this state, when the carrier provided with the plurality of carrier modules 10 reaches the upper portion of the socket 8 which is the test point as shown in FIG. 4A, the lead 3a of the element 3 is contacted with the socket pin 4. The elevating plate 11 is lowered.

When the elevating plate 11 is lowered in this way, the lower portion of the first heat dissipation member 18 installed as the bolt 19 on the pusher 14 is disposed through the through hole 20a formed in the second heat dissipation member 20. It is connected smoothly by the upper surface and its own weight.

In this state, when the elevating plate 11 is continuously lowered, the bottom surface of the first heat dissipation member 18 is connected to the top surface of the element 3 so that the first heat dissipation member no longer lowers and the bottom surface of the pusher 14 is not lowered. Only the lifting plate descends until it is connected with the upper surface of the first heat radiation member 18.

If the lifting plate is continuously lowered while the bottom surface of the pusher 14 is connected to the top surface of the first heat dissipation member 18, the carrier module 10 is lowered by the pusher 14, so that the element 3 as shown in FIG. 4B. Leads (3a) and the socket pin (4) is elastically connected, it is possible to check the electrical characteristics of the device.

At this time, the elastic member provided between the guide block 12 and the pusher 14 even if the elevating plate 11 is lowered more than the set amount so that the lead 3a of the element 3 is more closely connected with the socket pin 4. Since the 15 is compressed, the pusher 14 is no longer lowered and the carrier module 10 is further pressed toward the socket 8 by the restoring force of the elastic member 15.

As described above, when the lead 3a of the element 3 and the socket pin 4 are contacted by the pressing force of the pusher 14, as shown in FIG. 4B, between the top and bottom surfaces of the first heat dissipation member 18. FIG. The space portion is formed so that the pusher does not pressurize the first heat dissipation member, whereby the pressure by the first heat dissipation member 18 is not applied to the upper surface of the element 3.

In this operation, when the lead 3a of the device 3 is closely connected to the socket pin 4, when the electrical characteristics of the device are inspected, a high temperature is generated when instantaneous heat is generated at the center of the device. The heat is rapidly dissipated to the outside through the heat dissipation fins 18a and 20b of the first heat dissipation member 18 connected to the center of the upper surface and the second heat dissipation member 20 connected to the outer circumferential surface.

As described above, the present invention has the following advantages.

First, the first and second heat dissipation members 18 and 20 having good thermal conductivity are directly connected to the upper surface of the device when the electrical characteristics of the device 3 are inspected, and the high temperature heat generated during the test can be quickly discharged to the outside. Since the heat dissipation, it is possible to accurately determine the performance of the device in one test, thereby eliminating the need to repeat the device retest, thereby improving productivity.

Second, since heat transfer paths of the first and second heat dissipation members 18 and 20 are minimized, heat dissipation efficiency is maximized.

Third, as compared with the conventional apparatus, the possibility of judging a good device as a defective product is significantly reduced, so that the yield is improved.

Claims (8)

As the lifting plate 11 descends, the lid 3a of the element 3 suspended from the carrier module 10 is fixed to the lifting plate 11 in the test section of the device inspector configured to be connected to the socket pin 4. The guide block 12, the pusher 14 elastically installed by the elastic member 15 so as to be lifted and lowered to the guide block, and coupled to the pusher to be elastically connected to the upper surface of the element by the pressing force of the pusher during the test. An element heat dissipation device of a semiconductor device inspector composed of a first heat dissipation member (18). The method of claim 1, An element heat dissipation device of a semiconductor device inspector having a plurality of heat dissipation fins 18a vertically formed on a first heat dissipation member 18. The method of claim 1, A device heat dissipation device of a semiconductor device inspector having a plurality of heat dissipation fins (18a) horizontally formed on the first heat dissipation member (18). The method of claim 1, An element heat dissipation device for a semiconductor device tester, in which a first heat dissipation member (18) is provided on a pusher (14) with a plurality of bolts (19) so as to flow up and down. The method of claim 1, A through hole 20a is formed in the center to expose the first heat dissipation member 18 to the inside of the cavity 10a, and a bottom surface thereof is exposed to the inside of the cavity, and the heat dissipation fin 20b formed on the upper portion is exposed to the outside. An element heat dissipation device of a semiconductor device inspector, wherein the heat dissipation member 20 is fixed in the recessed groove 10b of the carrier module. The method of claim 5, A device heat dissipation device of a semiconductor device inspector having a plurality of heat dissipation fins (18a) horizontally formed on the first heat dissipation member (18). The method of claim 5, An element heat dissipation device for a semiconductor device tester, in which a first heat dissipation member (18) is provided on a pusher (14) with a plurality of bolts (19) so as to flow up and down. The method according to claim 1 or 5, The first and second heat dissipation members (18) (20) is an element heat dissipation device of a semiconductor device inspector is made of aluminum having good thermal conductivity.