KR19990041452A - Electronic component mounting unit - Google Patents

Abstract

An electronic component mounting apparatus is disclosed. According to the present invention, a head frame member, a plurality of adsorption heads installed on one side of the head frame member and having a liftable suction nozzle, a camera transfer frame member installed on the other side of the head frame and movable along the head frame member, There is provided an electronic component mounting apparatus including a camera provided on the camera transfer frame member and reflecting means provided on a bottom surface of the camera transfer frame member to reflect a component adsorbed on the suction nozzle to the camera. In the electronic component mounting apparatus according to the present invention, the camera module is movably installed with respect to the head frame on which the suction head is installed, so that the imaging of the components sucked by the suction nozzle can be performed more quickly and accurately.

Description

Electronic component mounting unit

The present invention relates to an electronic component mounting apparatus, and more particularly, to an electronic component mounting apparatus in which a fixed camera can be relatively moved with respect to a head frame so that a part recognition operation by imaging of the fixed camera can be performed quickly. It is about.

In general, an electronic component mounting apparatus is a device for mounting a semiconductor chip or other electronic components on a printed circuit board. In the component mounting apparatus, the printed circuit board is transferred to the mounting position by the conveyor apparatus, and an adsorption nozzle installed in the mounting head which is lifted and plane-moved by the robot mounts the electronic component placed on the component tray at a predetermined position on the printed circuit board. The operation is repeated. Since the component mounting work requires a very precise position control between the instruments, the position control is performed by using one or more cameras. In general, a fixed camera fixed to the main frame is used for position control using a camera.

1 shows a schematic explanatory diagram of a general component mounting apparatus.

Referring to the drawings, the X-axis frame 120a and the Y-axis frame 120b that are orthogonal to each other are installed on the robot, and the head 130 may be planarly moved by the axes. The adsorption nozzle 140 installed in the head 130 may be mounted on the printed circuit board S by absorbing the electronic component from the component tray 190 through the lifting motion. The printed circuit board S is transferred to the component mounting position by the conveyor 150, and when the mounting work is completed, the printed circuit board S is moved back to the next step by the conveyor 150. The fixed camera 160 may control the relative positions of the suction nozzle 140, the substrate S, and other components in the electronic component mounting apparatus by imaging the bottom shape of the jig sucked by the suction nozzle 140. To be. The plane motion and the lifting motion of the nozzle 140 and the transfer of the printed circuit board S by the conveyor 150 are controlled by the controller 170. An image recognition processing apparatus 180 is provided to provide data necessary for position control of the controller 170, and the image recognition processing apparatus 180 processes image information recognized from the fixed camera 160.

The most important element of such an electronic component mounting apparatus is the precision and speed of lifting a component from a tray and mounting it on a substrate. However, the apparatus having the above configuration has a disadvantage in that the suction nozzle cannot move by selecting the shortest path when moving for mounting the component.

In more detail, the suction nozzle 140 first moves on the component tray 190 to absorb the component, and then moves to the upper portion of the fixed camera 160. As the image of the bottom of the component is captured by the fixed camera 160, the suction nozzle 140 moves to the upper portion of the substrate S to mount the component only after the position control information about the component is input. That is, no matter where the substrate S and the component tray 190 are located, the suction nozzle 140 must go through the process of repeatedly moving to the upper portion of the fixed camera 160. Since this moving method extends the moving path of the suction nozzle 140, even if the speed of the driving component is improved, there is a limit situation in the increase of the mounting speed, and thus there is a problem in that it does not satisfy the requirement of rapidity.

The present invention has been made to solve the above problems, it is an object of the present invention to provide a component mounting apparatus capable of rapid mounting operation.

Another object of the present invention is to provide a component mounting apparatus in which the movement path of the suction nozzle can be made at the shortest distance.

Another object of the present invention is to provide a component mounting apparatus in which a fixed camera can perform image pickup of a component by making a relative movement with respect to a head frame, thereby improving the speed of component mounting.

1 is a schematic perspective view of a general electronic component mounting apparatus.

2 is a schematic exploded perspective view of a head assembly of an electronic component mounting apparatus according to the present invention.

3 is a front view showing the apparatus of FIG. 2 in an assembled state;

4 and 5 are plan views of FIG. 3 in different positions.

Brief description of the main symbols in the drawings

120a. X axis frame 120b. Y axis frame

130.Head 140.Conveyor

160. Fixed Camera 170. Controller

180. Image Recognition Processing Means 20. Head Frame

21.22.23.24. Head 25.26.27.28. Adsorption nozzle

29. Drive motor 30. Ball screw

31. Sensor member 32. Guide

33. Guide block 35. Nut part

36. Camera 37. Lighting

40. Camera feed frame

In order to achieve the above object, according to the present invention, the head frame member, a plurality of adsorption heads installed on one side of the head frame member and having a liftable suction nozzle, installed on the other side of the head frame and the head frame member An electronic component mounting apparatus including a camera transfer frame member which is movable along, a camera installed on the camera transfer frame member, and reflecting means provided on a bottom surface of the camera transfer frame member to reflect a component adsorbed on the suction nozzle to the camera. Is provided.

According to an aspect of the present invention, a driving motor provided on one side of the head frame member, and a ball screw to be rotated by the drive motor, so that the camera transfer frame can be relatively transferred relative to the head frame member. And a nut to which the ball screw is fastened to the camera transfer frame member.

According to another feature of the present invention, the reflecting means comprises: a first mirror capable of reflecting a component adsorbed to the adsorption nozzle by being disposed below any one of the plurality of adsorption heads according to the position of the camera transfer frame member; And a second mirror for reflecting an image of the component reflected by the first mirror to the camera.

According to another feature of the present invention, there is further provided a sensor member provided over the head frame member so as to detect a relative position of the camera transfer frame member with respect to the head frame member, and a sensor provided in the camera transfer frame member. .

According to another feature of the invention, the guide member provided over the head frame member to guide the transfer of the camera transfer frame member relative to the head frame member, and the camera transfer frame member to be guided along the guide member It further comprises a guide block member installed in.

According to another feature of the invention, the head frame member is capable of plane motion by a rectangular coordinate robot.

According to another feature of the invention, the camera transfer frame member moves so as to prevent the reflecting means from causing interference during the lifting movement of the suction nozzle.

According to another feature of the invention, the drive motor provided on one side of the head frame member, the drive motor is provided on the axis of the drive motor and the camera transfer frame member so that the camera transfer frame can be relatively transferred relative to the head frame member And pulleys and a belt interconnecting the pulleys.

Hereinafter, the present invention will be described in more detail with reference to an embodiment shown in the accompanying drawings.

2 is a schematic exploded perspective view of a head frame and a camera frame of the electronic component mounting apparatus according to the present invention.

Referring to the drawings, the head frame 20 may be provided with one or more suction heads, in the embodiment shown in the drawings, the first head 21, the second head 22, the third head 23, The fourth head 24 is provided. Each head is provided with suction nozzles 25, 26, 27 and 28, respectively. The suction nozzles 25, 26, 27, 28 can be lifted up and down by a conventionally well-known method, and can raise a component from a tray or mount them on a board | substrate through such a lift up motion.

The head frame 20 may be installed in a robot (not shown) to move in Cartesian coordinates. For example, the upper end of the head frame 20 is installed in the frames 120a and 120b of the XY Cartesian coordinate robot as shown in FIG. 1 to move along the Cartesian coordinates, and thus the component tray 190 (FIG. 1). It may be possible to lift the components arranged on the mounting circuit board (s).

The camera module is installed on the other side of the head frame 20. The camera module includes a camera transfer frame 40, a mirror box 39, a camera body 36, a camera head 37, and the like. The camera module is installed to be movable in the horizontal direction on the other side of the head frame 20. Various means can be taken for the movement of the camera module, and in the embodiment shown in the figure, a nut formed at the upper end of the camera transfer frame 40 has a ball screw 30 that is controlably rotated by the drive motor 29. The transfer is made by fastening to the part 35. Although not shown in the drawings, other transfer means may be applied, for example a belt drive or a transfer means using a linear motor may be applied. In the case of belt driving, the motor is mounted on the head frame 20, and a pulley (not shown) is installed on the rotational axis of the motor and the camera transfer frame 40, so as to separate between the rotational axis of the motor and the pulley of the transfer frame 40. It is connected by a belt.

The sensor 34 and the guide block 33 are installed on the front surface of the camera transfer frame 40. Moreover, the sensor member 31 and the guide 32 are provided in the back surface of the head frame 20 corresponding to the sensor 34 and the guide block 33. The sensor member 31 and the guide 32 preferably extend over the entire horizontal length of the head frame 20. The guide 32 of the head frame 20 is coupled to the guide block 33 of the camera transfer frame 40 and guides it while the camera transfer frame 40 is transported along the rear surface of the head frame 20. Do it. In addition, the sensor member 31 and the sensor 34 make it possible to detect and control the position of the camera transfer frame 40 with respect to the head frame 20.

A mirror box 39 is installed at the bottom of the camera transfer frame 40. In addition, the camera 36 and the illumination 37 is installed on one side of the camera transfer frame 40. One end portion of the mirror box 39 extends from the rear surface of the head frame 20 to the front surface thereof, and thus an upper portion thereof may be positioned under the suction heads 25, 26, 27, 28 according to the transfer of the head frame 20. have. The mirror box 39 is provided with one or a plurality of mirrors, and an image of a component adsorbed on the bottom surface of the adsorption nozzles 25, 26, 27, 28 by the reflection action of the mirror can be captured by the camera 36. have. This will be described in more detail later.

FIG. 3 is a front view of the head frame and the camera transfer frame illustrated in FIG. 2 assembled together.

Referring to the figure, two mirrors M are provided in the mirror box 39. One of the two mirrors, the first mirror M1, is inclined at an angle of 45 degrees with respect to the plane at the bottom of the adsorption nozzle, and the other second mirror M2 is at an angle of 45 degrees with respect to the plane at the bottom of the camera 36. It is installed inclined at an angle. Therefore, the bottom surface of the component P adsorbed on one of the adsorption nozzles 25, 26, 27, 28 provided on the adsorption heads 21, 22, 23, and 24 provided on one side of the head frame 20 is a mirror box. By reflecting through the two mirrors M provided in the 39, it can be picked up by the camera 36. The light path on which the image of the part P is projected is indicated by the letter A.

4 and 5 show plan views of the camera transport frame 40 in different positions.

Referring to FIG. 4, the camera transfer frame 40 is set to be at a position corresponding to the rear surface of the fourth head 24 among the four suction heads. That is, by the action of the drive motor 29 and the ball screw 30 is set so that the position of the camera transfer frame 40 is on the back of the fourth head 24, wherein the mirror of the mirror box 39 is fourth Imaging is possible by reflecting the components adsorbed by the suction nozzle of the head 24 to the cameras 36 (FIG. 2, FIG. 3).

Meanwhile, referring to FIG. 5, the camera transfer frame 40 is moved to a position corresponding to the rear surface of the third head 24 among the four suction heads. As described above, the mirror of the mirror box 39 enables imaging by reflecting the component adsorbed on the adsorption nozzle of the third head 23 to the camera head.

As can be seen from the above, the camera module including the mirror box 39 can be controlled to move along the rear surface of the head frame 20 so that the bottom surface of the component adsorbed to each suction head nozzle can be imaged. have. Also, while the adsorption nozzles 25, 26, 27, 28 move up or down to lift the component P from the tray or onto the substrate, the mirror box 39 may be moved to another position so as not to interfere with the adsorption nozzles. Will move. For example, in FIG. 4, the camera module including the camera moving frame 40 is moved to a position corresponding to the fourth head 24 while performing the adsorption and mounting of the parts at the suction nozzle of the third head 23. Maintain the state. Next, after the adsorption work on the third head 23 is completed, the camera module moves to a position corresponding to the third head 23 to perform imaging as shown in FIG. 5. The transfer and imaging operations of the camera module can be equally applied to all the first to fourth heads. On the other hand, when four heads simultaneously adsorb components, the camera module can be stopped at a separate position (denoted by K).

In the exemplary embodiment shown in the drawings, the component mounting apparatus having four heads has been described, but the component mounting apparatus of the present invention may be variously applied regardless of the number of heads. For example, even in the case of a component mounting apparatus having only one suction head, the camera module can be transferred between an imaging position where the mirror box is disposed under the suction nozzle and a standby position deviating from the imaging position. have.

In the electronic component mounting apparatus according to the present invention, the camera module is movably installed with respect to the head frame on which the suction head is installed, so that the imaging of the components sucked by the suction nozzle can be performed more quickly and accurately. In addition, the movement path of the head frame can be minimized, and since the apparatus of the present invention can be applied to an electronic component mounting apparatus having a plurality of suction heads, the versatility and utility of the apparatus can be increased.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (8)

Head frame member, One or a plurality of adsorption heads installed on one side of the head frame member and having an adsorption nozzle that can be lifted and lowered, A camera transfer frame member installed at the other side of the head frame and movable along the head frame member; A camera installed in the camera transfer frame member; And a reflecting means provided on a bottom surface of said camera transfer frame member and reflecting a component adsorbed by said suction nozzle to said camera. According to claim 1, further comprising a drive motor provided on one side of the head frame member, the ball screw to be rotated by the drive motor so that the camera transfer frame can be relatively transferred relative to the head frame member, And the nut to which the ball screw is fastened is formed in the camera transfer frame member. 2. The apparatus of claim 1, wherein the reflecting means comprises: a first mirror capable of reflecting a component adsorbed to the adsorption nozzle by being disposed below any one of the plurality of adsorption heads according to the position of the camera transfer frame member; And a second mirror for reflecting an image of the component reflected by the first mirror on the camera. 2. The apparatus according to claim 1, further comprising a sensor member provided over said head frame member so as to detect a relative position of said camera conveyance frame member with respect to said head frame member, and a sensor provided in said camera conveyance frame member. Electronic component mounting apparatus. 2. A guide member provided over the head frame member and provided in the camera transfer frame member to guide along the guide member so as to guide the transfer of the camera transfer frame member to the head frame member. An electronic component mounting apparatus further comprising a guide block member. The electronic component mounting apparatus according to claim 1, wherein the head frame member is capable of plane motion by a rectangular coordinate robot. The electronic component mounting apparatus according to claim 1, wherein the camera transfer frame member moves so as to prevent the reflecting means from causing interference during the lifting movement of the suction nozzle. The driving motor of claim 1, wherein the driving motor is disposed on one side of the head frame member, the shaft of the driving motor, and the pulleys are installed on the camera feeding frame member so that the camera transfer frame can be relatively moved relative to the head frame member. And a belt for interconnecting the pulleys.