KR19990012352A - Implementation method of abnormal alarm of key phone system - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method and apparatus for an integrated circuit, and more particularly, in a process of soldering an integrated circuit having a plurality of leads, alternately using two holding blocks for absorbing the integrated circuit to improve soldering efficiency. It relates to an improved light beam soldering method and apparatus.

The integrated circuit soldering method of the present invention includes the steps of transferring a printed circuit board, which is cut and formed in a process and formed on a corresponding pad, to an integrated circuit having a lead formed thereon, by a conveyor to a soldering position; A holding block pick-up unit adsorbing the holding block with air and setting it down on the integrated circuit; Irradiating a light beam on a lead of the integrated circuit for a predetermined time; Cooling the integrated circuit and the holding block deteriorated due to high temperature light beam irradiation in the irradiation step; And the holding block pick-up unit sucks another holding block with air, puts it on another integrated circuit in the printed circuit board, and repeats the irradiation step and the cooling step.

As described above, according to the soldering apparatus and method of the integrated circuit of the present invention, it is possible to ensure high quality soldering and solder the array printed circuit board by alternately using two holding blocks for protecting the integrated circuit during light beam irradiation. By drastically reducing the time, the productivity is greatly improved.

Description

Integrated circuit soldering device and method

The present invention relates to a soldering method for an integrated circuit, and more particularly, in a process of soldering an integrated circuit having a plurality of leads, an optical beam having improved soldering efficiency by alternately using two holding blocks for absorbing the integrated circuit. It relates to a soldering method.

For the purpose of description herein, a case of a Pentium processor of a tape carrier package (TCP) type with an integrated circuit having a plurality of leads will be described as an example. The TCP-type Pentium processor consists of 320 PINs and is a very fine component with 0.25 millimeters between leads. In addition, since the TCP type integrated circuit has no wire bonding part used in a general semiconductor chip, its size is relatively small, and thus the printed circuit board on which the component is mounted can be miniaturized.

Figure 1a is a perspective view showing the external structure of the TCP type integrated circuit, Figure 1b is a top view of the integrated circuit excluding the plastic carrier in Figure 1a, Figure 1c is a cutaway cross-sectional view seen from the AA 'of Figure 1b.

As shown in Fig. 1, a TCP type integrated circuit has a film tape type package and is stored in a square plastic carrier 101 and supplied from a chip manufacturer to avoid external scratches. Looking at the internal structure of the TCP-type integrated circuit, a rectangular chip 102 having a substantial function of the integrated circuit is located in the center of the upper surface of the integrated circuit 100, the upper surface of the integrated circuit except for the chip portion and the portion to be used as a lead pattern In order to protect the pattern of the lead 108 connected to the pad in the chip 102 and to maintain insulation, a polyimide film 103 is coated. As shown in FIG. 1B, the four edge portions 104, 105, 106, and 107, which are used as actual lead patterns, are in the form of slots in which the polyimide film is not coated. In addition, in the bottom of the integrated circuit 100, a portion of the chip 102 in the center protrudes up and down as shown in FIG. 1C, and gold-plated lead patterns are exposed on the remaining portion.

Korean Patent Application No. P96-8470 integrated circuit mounting method filed by the present applicant has been disclosed in detail a conventional mounting method for mounting a TCP type integrated circuit having a plurality of leads.

In this paper, we discuss the soldering process during the various stages of mounting a TCP-type integrated circuit having such a plurality of leads on a printed circuit board.

Firstly, there is a soldering method using a hot bar.

Figure 2 is an exemplary view showing a conventional hot bar soldering method.

As shown in FIG. 2, when the integrated circuit 100 cut and formed to form a lead is placed on a corresponding pad of a printed circuit board, the heated hot bar 120 is positioned on the integrated circuit 100 and then lowered. The bottom square edge of the hot bar has been done in such a way that soldering is carried out collectively by direct contact with the leads 104, 105, 106, 107 of the integrated circuit and thermal compression.

However, in such a hot bar method, since the hot bar 120 directly presses the leads and pads to the lead and the pad, when the pressure of the hot bar 120 is pushed downward, the lead contacting the hot bar 120 is damaged or is caused by high temperature. Breakage of the pads may cause solder failure.

In addition, due to the pressing of the hot bar 120, the lead may slide on the pad, causing a short with the side lead, which may cause a solder failure.

In addition, for the work efficiency during soldering, an array PCB 110 in which four integrated circuit PCBs are arranged in series is usually used. As a high temperature hot bar 120 as described above, soldering four PCBs consecutively is performed by the third and fourth. In the case of the first PCB, a large amount of short defects is generated. This occurs because foreign matters on the hot bar 120 are not completely removed after soldering of the first and second PCBs.

Another conventional soldering method is a light beam soldering method in which soldering is performed in a non-contact manner.

3 is an exemplary view showing a conventional light beam soldering method,

4 is an exemplary view showing the structure of a holding block used in the light beam soldering method.

Light beam soldering refers to soldering by irradiating a xenon (Xe) light beam over a lead of an integrated circuit to be soldered for a predetermined time. At this time, the xenon (Xe) light beam is soldered by generating a high temperature of about 300 ° C. When the light beam is irradiated to the leads and pads in the PCB 110, uniform soldering is performed by irradiating the lead and the pad to be soldered uniformly instead of partially. Since the light beam is irradiated to the entire pad as described above, the plastic cap portion of the integrated circuit except for the lead portion is covered with the holding block as shown in FIG. 4 to protect the plastic cap portion from the high temperature.

As shown in Fig. 3, when the integrated circuit 100, which has been cut and formed to form the leads 104, 105, 106, and 107, is placed on the corresponding pad of the printed circuit board and transferred to the soldering position, it is first placed in a predetermined position. The stored holding block 130 is transferred onto the integrated circuit 100 and lowered to cover the integrated circuit 100. Thereafter, the light beam is irradiated for a predetermined time to solder the lead of the integrated circuit 100 to the pad of the PCB. After a predetermined time, the holding block 130 deteriorated to a high temperature is raised to transfer to a predetermined position, and the soldered PCB is transferred to the next process.

Similarly, when the light beam soldering is performed on each sheet of the array PCB, the integrated circuit 100 is covered with the holding block 130. When the PCB is soldered, the holding block 130 deteriorates to a high temperature. In order to solder the next PCB, the holding block 130 should be cooled for a predetermined time and the cleaning residues generated during the soldering process should be washed. Therefore, since the periodic cleaning process and the cooling process of the predetermined time are included in the holding block 130, the production efficiency per unit time is reduced.

As described above, the conventional hot bar soldering method has a problem of causing soldering defects due to disconnection of leads or disconnection of PCB pads during soldering.

Accordingly, an object of the present invention is to provide a soldering apparatus and method for an improved integrated circuit that improves working time and soldering quality by alternately using two holding blocks for adsorbing an integrated circuit in consideration of such a conventional problem. In providing.

1A is a perspective view illustrating an external structure of a TCP type integrated circuit;

1B is a top view of an integrated circuit in FIG. 1A excluding the plastic carrier,

1C is a cross-sectional view taken along the line AA ′ of FIG. 1B;

2 is an exemplary view showing a conventional hot bar soldering method;

3 is an exemplary view showing a conventional light beam soldering method;

4 is an exemplary view showing a structure of a holding block used in a light beam soldering method;

5 is an exemplary view showing a soldering apparatus of an integrated circuit of the present invention;

6 is a flowchart illustrating a soldering method of an integrated circuit of the present invention.

Explanation of symbols for main parts of drawings>

100: integrated circuit 101: plastic carrier

102: chip 103: polyimide film

104, 105, 106, 107: slot 110: printed circuit board

130: holding block 140: hot air nozzle

Integrated circuit soldering method of the present invention for achieving the above object,

Transferring the printed circuit board on which the integrated circuit cut and formed in the previous process to form a lead is placed on a corresponding pad, by conveyer to a soldering position;

A holding block pick-up unit adsorbing the holding block with air and setting it down on the integrated circuit;

Irradiating a light beam generated by a predetermined xenon (Xe) lamp on a lead portion of the integrated circuit;

Cooling the integrated circuit and the holding block deteriorated due to high temperature light beam irradiation in the irradiation step; And

The holding block pick-up unit absorbs another holding block with air and puts it on another integrated circuit in the printed circuit board, and repeats the irradiation step and the cooling step.

Preferably, in the cooling step, the integrated circuit cools by blowing a predetermined amount of air to the bottom portion, and the holding block is sucked by the holding block pick-up part and then transferred to a holding block storage slot prepared at a predetermined position. It is characterized by cooling at room temperature by placing.

An integrated circuit soldering apparatus for an integrated circuit soldering method of the present invention is a soldering apparatus for soldering an integrated circuit having a plurality of leads to a printed circuit board: to protect the plastic cap of the integrated circuit from high temperature heat during soldering. A holding block on the integrated circuit; A holding block storage hole for storing the holding block; A holding block pick-up unit for absorbing from the holding block storage port and placing the integrated block on the integrated circuit; And a support unit for pressing the holding block on which the mounting block is pressed to fix the integrated circuit.

Preferably, the holding block is characterized by using the first holding block and the second holding block alternately.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

5 is an exemplary view showing a soldering apparatus of the integrated circuit of the present invention,

6 is a flowchart illustrating a soldering method of an integrated circuit of the present invention.

A soldering apparatus for soldering an integrated circuit having a plurality of leads to a printed circuit board, the method comprising: a holding on an integrated circuit 100 to protect the plastic cap of the integrated circuit 100 from high temperature heat during soldering Block 130; A holding block pick-up unit 140 for absorbing the holding block 130 from the holding block receiving opening 160 and placing the holding block 130 on the integrated circuit 100; A support unit 150 for pressing the mounted holding block to fix the integrated circuit 100; And a holding block receiving opening 160 for storing the deteriorated holding block 130 when soldering is completed.

As the holding block 130, a first holding block 131 and a second holding block 132 are alternately used for efficiency of soldering time. That is, when one holding block 130 is being soldered, the other deteriorated holding block 130 previously used is sufficiently cooled at room temperature to be ready for the next soldering sequence.

A soldering method of an integrated circuit using the soldering apparatus of the integrated circuit having such a configuration will be described with reference to FIGS. 5 to 6.

As shown in FIG. 5, the printed circuit board 110 in which the integrated circuit 100 cut and formed in the previous process to form the lead is placed on the corresponding pad is transferred to the soldering position by the conveyor 109 (step). S10). The printed circuit board 110 is an array printed circuit board having a PCB A 111, a PCB B 112, a PCB C 113, and a PCB D 114.

Thereafter, the holding block pick-up unit 140 sucks the first holding block 131 with air from the holding block receiving opening 160 and lowers it onto the PCB A 111 in the array PCB 110. The holding block storage port 160 stores two holding blocks, that is, the first holding block 131 and the second holding block 132, for use alternately. The holding block pick-up unit 140 that puts down the first holding block 131 rises in the state of removing air, and the support unit 150 descends to push the first holding block 131 from above to the integrated circuit 100. This is to prevent the disturbance (step S20).

After that, soldering is performed by irradiating the lead of the integrated circuit 100 of the PCB A 111 fixed by the support unit 150 for 16.8 seconds with a light beam generated by a predetermined xenon (Xe) lamp (not shown) ( Step S30).

The PCB A 111 and the first holding block 131 are very hot due to the irradiation of the light beam, and thus need to be cooled. To this end, a predetermined amount of air is blown to the bottom of the PCB A (111) after the soldering operation, and the holding block pick-up unit 140 is deteriorated on the integrated circuit 100 of the PCB A (111). The first holding block 131 is adsorbed, transferred to the holding block storage opening 160, and then lowered to cool the first holding block 131 (step S40).

Thereafter, the holding block pick-up unit 140 absorbs the second holding block 132 prepared at the holding block receiving opening 160 and lowers it onto the PCB B 112 in the array PCB 110, and repeats the above steps. The integrated circuit of B 112 is soldered. In this case, the irradiation time of the light beam is 16.7 seconds to receive less heat than in the case of the PCB A (111). As described above, the first holding block 131 placed on the holding block receiving opening 160 during the soldering operation for the PCB B 112 is sufficiently cooled at room temperature and used alternately in the next operation.

Likewise, the PCB C 113 and the PCB D 114 in the array PCB 110 may use the first holding block 131 and the second holding block 132 alternately to finish soldering. In this case, the irradiation time of the light beam is 16.7 seconds for the PCB C 113 and 16.6 seconds for the PCB D 114.

Thereafter, the array PCB 110 that has been soldered to the PCB A 111 to the PCB D 114 in this manner is transferred to the next process by the conveyor 109 (step S60).

Subsequently, when another array PCB 110 to be soldered is transferred from a previous process, the above operation is repeated to perform soldering.

As described above, according to the soldering apparatus and method of the integrated circuit of the present invention, an array printed circuit board can be guaranteed by using two holding blocks alternately to guarantee high quality soldering and to protect the integrated circuit during light beam irradiation. The productivity is greatly improved by significantly reducing the soldering time.

Claims (6)

Transferring the printed circuit board on which the integrated circuit cut and formed in the previous process to form a lead is placed on a corresponding pad, by conveyer to a soldering position; A holding block pick-up unit adsorbing the holding block with air and setting it down on the integrated circuit; Irradiating a light beam on a lead portion of the integrated circuit for a predetermined time; Cooling the integrated circuit and the holding block deteriorated due to high temperature light beam irradiation in the irradiation step; And And the holding block pick-up unit sucks another holding block with air, puts it on another integrated circuit in the printed circuit board, and repeats the irradiation step and the cooling step. The method of claim 1, In the cooling step, the integrated circuit cools by blowing a predetermined amount of air to the lower portion, and the holding block is sucked by the holding block pick-up part, and then transferred to the holding block storage slot prepared at a predetermined position, thereby lowering room temperature. Integrated circuit soldering method characterized in that cooled in. The method of claim 1, And xenon (Xe) is used as a source of the light beam in the irradiation step. The method of claim 1, The predetermined time in the irradiation step is an integrated circuit soldering method, characterized in that 16.8 seconds. In a soldering apparatus for soldering an integrated circuit having a plurality of leads to a printed circuit board: A holding block placed over the integrated circuit to protect the plastic cap of the integrated circuit from high temperature heat during soldering; A holding block storage hole for storing the holding block; A holding block pick-up unit for absorbing from the holding block storage and placing the integrated block on the integrated circuit; And And a support part for pressing the holding block on the integrated circuit to fix the integrated circuit. The method of claim 5, And the holding block alternately uses a first holding block and a second holding block.