KR102883172B1 - Display apharatus, manufacturing method thereof, and electronic device - Google Patents

Abstract

A display device may include a base substrate, a circuit layer, a display element layer, and an encapsulation layer. The base substrate may define a module hole penetrating the front and back surfaces, and may define an active area, a peripheral area adjacent to the active area, and a margin area surrounding the module hole. The circuit layer may include a driving element including a thin film transistor. The display element layer may include a light emitting element including a first electrode connected to the thin film transistor, a light emitting pattern disposed on the first electrode, a second electrode disposed on the light emitting pattern, and a deposition prevention pattern. The encapsulation layer may be disposed on the display element layer and may seal the light emitting element. The second electrode and the deposition prevention pattern may be disposed on the same layer and may not overlap each other.

Description

Display device, manufacturing method thereof, and electronic device {DISPLAY APHARATUS, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE}

The present invention relates to a display device and a method for manufacturing the same, and more particularly, to a display device having a module hole in an active area and a method for manufacturing the same.

A display device is activated by an electrical signal. A display device may include devices composed of various electronic components, such as a display unit that displays an image or an input detection unit that detects external input. The electronic components may be electrically connected to each other via variously arranged signal lines.

Research is underway to reduce the non-display area of display devices, and research is underway to improve the performance of electronic components included in display devices.

In an embodiment of the present invention, an object is to provide a display device for solving a problem of deterioration in the performance of an electronic module arranged corresponding to a module hole.

According to an embodiment of the present invention, a display device may include a base substrate, a circuit layer, a display element layer, and an encapsulation layer.

The base substrate includes a front surface and a back surface facing each other, a module hole penetrating the front surface and the back surface is defined, and an active area, a peripheral area adjacent to the active area, and a margin area surrounding the module hole can be defined on a plane.

The circuit layer may be disposed on the base substrate and may include a driving element including a thin film transistor.

The display element layer may include a light-emitting element including a first electrode connected to the thin film transistor, a light-emitting pattern disposed on the first electrode, a second electrode disposed on the light-emitting pattern, and a deposition prevention pattern.

The above sealing layer is disposed on the display element layer and can seal the light-emitting element.

The second electrode and the deposition prevention pattern may be disposed on the same layer and may not overlap each other.

The above deposition prevention pattern may include ABH113 (Sun Fine Chemicals).

The above deposition prevention pattern may overlap the margin area, and the second electrode may overlap the active area.

The above deposition prevention pattern may have a thickness greater than that of the second electrode.

The second electrode may include magnesium (MG), silver (AG), or a combination thereof.

The above deposition prevention pattern can be exposed by the module hole.

The above-mentioned sealing layer may include a sealing substrate and a sealing member. The sealing member may be bonded between the sealing substrate and the display element layer and may overlap the margin area.

The above sealing member and the above deposition prevention pattern can be in contact with each other.

The light-emitting element may further include a control layer disposed between the light-emitting pattern and the second electrode. The second electrode and the deposition prevention pattern may be in contact with the control layer.

The above-mentioned encapsulating layer may include a first inorganic layer, an organic layer, and a second inorganic layer sequentially arranged on the display element layer.

The above base substrate may be provided with a recessed pattern that surrounds the module hole on a plane and overlaps the margin area.

The organic pattern may further include an organic pattern disposed within the above-described depression pattern, wherein the organic pattern may include ABH113 (Sun Fine Chemicals).

A display device according to an embodiment of the present invention may include a base substrate, a circuit layer, a display element layer, and an encapsulation layer.

The base substrate includes a front surface and a back surface facing each other, a module hole penetrating the front surface and the back surface is defined, and an active area, a peripheral area adjacent to the active area, and a margin area surrounding the module hole can be defined on a plane.

The circuit layer may be disposed on the base substrate and may include a driving element including a thin film transistor.

The display element layer may include a light-emitting element including a first electrode connected to the thin film transistor, a light-emitting pattern disposed on the first electrode, a second electrode disposed on the light-emitting pattern, and a deposition prevention pattern.

The above sealing layer is disposed on the display element layer and can seal the light-emitting element.

The above deposition prevention pattern overlaps the above margin area and may include ABH113 (Sun Fine Chemicals).

The above deposition prevention pattern may be arranged on the same layer as the second electrode.

The second electrode may include magnesium (MG), silver (AG), or a combination thereof.

A method for manufacturing a display device according to an embodiment of the present invention may include the steps of: providing a base substrate including front and rear surfaces facing each other, and defining an active area, a peripheral area adjacent to the active area, and a hole area surrounded by the active area on a planar surface; forming a first electrode, a light-emitting pattern, and a control layer on the base substrate; forming a deposition prevention layer overlapping the hole area on the control layer; forming a second electrode overlapping the active area and non-overlapping the deposition prevention layer on the control layer on which the deposition prevention layer is formed; forming an encapsulation layer on the second electrode; and forming a module hole overlapping the hole area and penetrating the base substrate.

The step of forming the above deposition prevention layer can be performed by depositing and patterning ABH113 (Sun Fine Chemicals).

The step of forming the second electrode may be performed by depositing magnesium (MG) or silver (AG) on the entire surface of the control layer on which the deposition prevention layer is formed.

An electronic device according to an embodiment of the present invention may include a base layer, a deposition prevention pattern, and an electrode pattern. The deposition prevention pattern may be disposed on the base layer and may include ABH113 (Sun Fine Chemicals). The electrode pattern may be disposed on the same layer as the deposition prevention pattern, may include a metal material, and may not overlap with the deposition prevention pattern.

The above metal material may include magnesium (MG), silver (AG), or a combination thereof.

An electronic device according to an embodiment of the present invention comprises a display panel including an electronic module, a first display area, and a second display area adjacent to and overlapping the first display area, and a display element layer including a circuit layer including a driving element including thin film transistors, first electrodes connected to the thin film transistors, light-emitting elements including light-emitting patterns arranged on the first electrodes, a second electrode arranged on the light-emitting patterns, and a deposition prevention pattern arranged on the same layer as the second electrode, wherein the second electrode is arranged in the first display area and the second display area, and the deposition prevention pattern is arranged in the second display area.

The above deposition prevention pattern may have ABH113 (Sun Fine Chemicals).

The above deposition prevention pattern may have a thickness greater than that of the second electrode.

The second electrode may include magnesium (MG), silver (AG), or a combination thereof.

The light-emitting patterns per unit area may be arranged in smaller numbers in the second display area than in the first display area.

The second display area may include a light-emitting area in which the light-emitting patterns are arranged and a transmissive area in which the deposition prevention pattern is arranged.

The second electrode may be disposed in the light-emitting region, and the deposition prevention pattern may be disposed in the transmission region.

The display element layer may include a pixel defining film having a display opening that exposes at least a portion of each of the first electrodes, the second electrode may be disposed on first electrodes that overlap the light-emitting area among the first electrodes, and the deposition prevention pattern may be disposed on first electrodes that overlap the transmission area among the first electrodes.

The first display area and the second display area are arranged along the one direction, and the second display area can extend in a direction perpendicular to the one direction.

The above electronic module may include at least one of an audio output module, a light emitting module, a light receiving module, and a camera module.

According to the display device according to the embodiment of the present invention, since the second electrode is not placed in the margin area, the problem of light incident or emitted around the module hole being reflected and the performance of the electronic module being deteriorated can be solved.

According to an embodiment of the present invention, the deposition prevention pattern is arranged within a margin area and is in direct contact with the sealing member, so that the sealing member can be firmly bonded to the deposition prevention pattern.

FIG. 1 is a perspective view illustrating a display device according to one embodiment of the present invention.
Figure 2 is an exploded perspective view of the display device illustrated in Figure 1.
Figure 3 is a block diagram of the display device shown in Figure 1.
Figure 4 is an equivalent circuit diagram showing pixels of a display panel.
Fig. 5 is a cross-sectional view taken along line II` of the display panel illustrated in Fig. 2.
Figure 6 is a photograph showing the results of an experiment to determine whether a second electrode is deposited at a location where a deposition prevention pattern is formed.
FIG. 7 is a cross-sectional view taken along line II` of the display panel illustrated in FIG. 2 in another embodiment of the present invention.
FIGS. 8A to 8E are drawings illustrating a process for manufacturing a display device according to an embodiment of the present invention described with reference to FIG. 5.
Figure 9 is an exploded perspective view of a display device according to one embodiment of the present invention.
FIG. 10A is a plan view schematically illustrating a display panel according to one embodiment of the present invention.
FIG. 10b is a schematic plan view of a display panel according to one embodiment of the present invention.
FIG. 11A is an enlarged plan view of an area of a display panel according to one embodiment of the present invention.
FIG. 11b is an enlarged plan view of an area of a display panel according to one embodiment of the present invention.
Fig. 12 is a cross-sectional view of a display device according to one embodiment of the present invention.
Fig. 13 is a cross-sectional view of a display device according to one embodiment of the present invention.

In this specification, when it is said that a component (or region, layer, portion, etc.) is “on,” “connected to,” or “coupled to” another component, it means that it can be directly disposed/connected/coupled to the other component, or a third component may be disposed between them.

Identical drawing numbers indicate identical components. Furthermore, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the purpose of effectively illustrating the technical content.

“And/or” includes any combination of one or more of the associated constructs that can be defined.

While terms such as "first" and "second" may be used to describe various components, these components should not be limited by these terms. These terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a "second component," and similarly, a second component may also be referred to as a "first component." Singular expressions include plural expressions unless the context clearly indicates otherwise.

Additionally, terms such as "below," "lower," "above," and "upper" are used to describe the relationships between components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the relevant technical context, and unless interpreted in an idealized or overly formal sense, they are explicitly defined herein.

Terms such as "include" or "have" should be understood to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view illustrating a display device according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of the display device illustrated in FIG. 1. FIG. 3 is a block diagram of the display device illustrated in FIG. 1. Hereinafter, a display device according to one embodiment of the present invention will be described with reference to FIGS. 1 to 3.

An electronic device (EA) may be a device activated by an electrical signal. The electronic device (EA) may include various embodiments. For example, the electronic device (EA) may include a tablet, a laptop, a computer, a smart television, etc. In this embodiment, the electronic device (EA) is exemplarily illustrated as a smartphone.

As illustrated in FIG. 1, an electronic device (EA) can display an image (IM) on its front surface. The front surface can be defined as being parallel to a plane defined by a first direction (DR1) and a second direction (DR2). The front surface includes a transmissive area (TA) and a bezel area (BZA) adjacent to the transmissive area (TA).

An electronic device (EA) displays an image (IM) in a transparent area (TA). An Internet search box is illustrated as an example of the image (IM) in FIG. 1. The transparent area (TA) may have a rectangular shape parallel to each of the first direction (DR1) and the second direction (DR2). However, this is merely an example, and the transparent area (TA) may have various shapes and is not limited to any one embodiment.

The bezel area (BZA) is adjacent to the transmissive area (TA). The bezel area (BZA) may surround the transmissive area (TA). However, this is merely an example, and the bezel area (BZA) may be positioned adjacent to only one side of the transmissive area (TA), or may be omitted. The display device according to an embodiment of the present invention may include various embodiments and is not limited to any one embodiment.

The normal direction of the front surface may correspond to the thickness direction (DR3, hereinafter referred to as the third direction) of the electronic device (EA). In the present embodiment, the front surface (or front) and the back surface (or bottom surface) of each member are defined based on the direction in which the image (IM) is displayed. The front surface and the back surface are opposite to each other in the third direction (DR3).

Meanwhile, the directions indicated by the first to third directions (DR1, DR2, DR3) are relative concepts and can be converted into other directions. Hereinafter, the first to third directions refer to the same drawing symbols as the directions indicated by the first to third directions (DR1, DR2, DR3), respectively.

Meanwhile, the electronic device (EA) according to the present invention can detect a user input (TC) applied from the outside. The user input (TC) includes various forms of external input, such as a part of the user's body, light, heat, or pressure. In the present embodiment, the user input (TC) is illustrated as the user's hand applied to the front. However, this is merely an example, and as described above, the user input (TC) can be provided in various forms, and further, the electronic device (EA) can detect a user input (TC) applied to the side or back of the electronic device (EA) depending on the structure of the electronic device (EA), and is not limited to any one embodiment.

As illustrated in FIGS. 1 and 2, the electronic device (EA) includes a display panel (DP), a window member (WM), an electronic module (EM), and a storage member (BM). Meanwhile, as illustrated in FIG. 3, the electronic device (EA) may further include, in addition to the display panel (DP), a first electronic module (EM1), a second electronic module (EM2), and a power supply module (PM). Some of the components illustrated in FIG. 3 are omitted in FIG. 2. Hereinafter, the electronic device (EA) will be described in detail with reference to FIGS. 1 to 3.

A display panel (DP) can display an image (IM) and detect an external input (TC). For example, the display panel (DP) can include a display unit (DPU) that displays an image (IM) and a detection unit (220) that detects an external input. In the present embodiment, the input detection unit (ISU) can detect an input applied to a window member (WM).

A display panel (DP) may include an active area (AA), a peripheral area (NAA), and a hole area (HA) that are distinct on a plane. The active area (AA) may be an area that is activated according to an electrical signal.

In the present embodiment, the active area (AA) may be an area where an image (IM) is displayed and, at the same time, an area where an external input (TC) is detected. However, this is merely an example, and the area where the image (IM) is displayed and the area where an external input (TC) is detected may be separated within the active area (AA), and the present invention is not limited to any one embodiment.

The peripheral area (NAA) may be an area covered by the bezel area (BZA). The peripheral area (NAA) is adjacent to the active area (AA). The peripheral area (NAA) may surround the active area (AA). The peripheral area (NAA) may house driving circuits or driving wiring for driving the active area (AA).

In the present embodiment, the display panel (DP) is assembled in a flat state with the active area (AA) and the peripheral area (NAA) facing the window member (WM). However, this is merely an example, and a portion of the peripheral area (NAA) of the display panel (DP) may be curved. In this case, a portion of the peripheral area (NAA) may face the back of the electronic device (EA), so that the bezel area (BZA) on the front of the electronic device (EA) may be reduced. Alternatively, the display panel (DP) may be assembled in a state in which a portion of the active area (AA) is also curved. Alternatively, the peripheral area (NAA) may be omitted in the display panel (DP) according to an embodiment of the present invention.

The edge of the hole area (HA) may be surrounded by the active area (AA). In the plane, the hole area (HA) may be spaced apart from the surrounding area (NAA) with the active area (AA) interposed therebetween.

The hole area (HA) may be an area in which a module hole (MH) is defined. Accordingly, the module hole (MH) may be surrounded on a plane by an active area (AA) in which an image (IM) is displayed.

According to one embodiment of the present invention, a display panel (DP) may be defined with at least one module hole (MH) penetrating the display panel (DP) along a third direction (DR3). The module hole (MH) may be a through hole connected from the front surface to the back surface of the display panel (DP). A configuration that is arranged on the back surface of the display panel (DP) and overlaps the module hole (MH) may be visible through the module hole (MH) from the front surface of the display panel (DP). Meanwhile, in the present embodiment, the module hole (MH) is illustrated as a cylindrical shape having a height in the third direction (DR3), but is not limited thereto, and the module hole (MH) may be provided in various shapes such as a polygonal column, an elliptical column, a cone-shaped column, etc., and is not limited to any one embodiment.

The module hole (MH) overlaps the electronic module (EM) on a plane. The electronic module (EM) can receive external inputs through the module hole (MH). The electronic module (EM) receives signals input through the module hole (MH) and provides them to the display panel (DP). The electronic module (EM) may be a module having a size that can be accommodated within the module hole (MH) or including a receiving portion having a size at least similar to that of the module hole (MH). A detailed description of the electronic module (EM) will be provided below.

A window member (WM) provides a front surface of an electronic device (EA). The window member (WM) may be disposed on the front surface of a display panel (DP) to protect the display panel (DP). For example, the window member (WM) may include a glass substrate, a sapphire substrate, or a plastic film. The window member (WM) may have a multilayer or single-layer structure. For example, the window member (WM) may have a laminated structure of a plurality of plastic films bonded together with an adhesive, or may have a laminated structure of a glass substrate and a plastic film bonded together with an adhesive.

The window member (WM) can be divided into a transmissive area (TA) and a bezel area (BZA). The transmissive area (TA) can be an area that transmits incident light. The transmissive area (TA) can have a shape corresponding to the active area (AA). For example, the transmissive area (TA) overlaps the entire surface or at least a portion of the active area (AA). An image (IM) displayed in the active area (AA) of the display panel (DP) can be viewed from the outside through the transmissive area (TA).

The bezel area (BZA) may be an area with relatively low light transmittance compared to the transmissive area (TA). The bezel area (BZA) defines the shape of the transmissive area (TA). The bezel area (BZA) is adjacent to the transmissive area (TA) and may surround the transmissive area (TA).

The bezel area (BZA) may have a predetermined color. The bezel area (BZA) may cover the peripheral area (NAA) of the display panel (DP) to block the peripheral area (NAA) from being viewed from the outside. This is merely an example, and in the window member (WM) according to one embodiment of the present invention, the bezel area (BZA) may be omitted.

The storage member (BM) can be combined with the window member (WM). The storage member (BM) provides a back surface of the electronic device (EA). The storage member (BM) is combined with the window member (WM) to define an interior space.

The housing member (BM) may include a material having relatively high rigidity. For example, the housing member (BM) may include a plurality of frames and/or plates made of glass, plastic, or metal. The housing member (BM) can reliably protect the components of the electronic device (EA) housed within its internal space from external impact. The internal space provided by the housing member (BM) can accommodate a display panel (DP) and various components as illustrated in FIG. 3.

Referring to FIG. 3, the electronic device (EA) may include a power supply module (PM), a first electronic module (EM1), and a second electronic module (EM2). The power supply module (PM) supplies power required for the overall operation of the electronic device (EA). The power supply module (PM) may include a conventional battery module.

The first electronic module (EM1) and the second electronic module (EM2) include various functional modules for operating the electronic device (EA). The first electronic module (EM1) may be directly mounted on a motherboard electrically connected to a display panel (DP), or may be mounted on a separate substrate and electrically connected to the motherboard via a connector (not shown).

The first electronic module (EM1) may include a control module (CM), a wireless communication module (TM), an image input module (IIM), an audio input module (AIM), memory (MM), and an external interface (PMIF). Some of the above modules may not be mounted on the motherboard, but may be electrically connected to the motherboard via a flexible printed circuit board.

The control module (CM) controls the overall operation of the electronic device (EA). The control module (CM) may be a microprocessor. For example, the control module (CM) activates or deactivates the display panel (DP). The control module (CM) may control other modules, such as the image input module (IIM) or the audio input module (AIM), based on touch signals received from the display panel (DP).

The wireless communication module (TM) can transmit and receive wireless signals with other terminals using Bluetooth or Wi-Fi lines. The wireless communication module (TM) can transmit and receive voice signals using general communication lines. The wireless communication module (TM) includes a transmitter (TM1) that modulates and transmits a signal to be transmitted, and a receiver (TM2) that demodulates the received signal.

The Image Input Module (IIM) processes image signals and converts them into image data that can be displayed on the Display Panel (DP). The Audio Input Module (AIM) receives external audio signals from a microphone in recording mode, voice recognition mode, etc., and converts them into electrical voice data.

The external interface (PMIF) serves as an interface to connect to external chargers, wired/wireless data ports, card sockets (e.g., memory cards, SIM/UIM cards), etc.

The second electronic module (EM2) may include an audio output module (AOM), a light emitting module (LM), a light receiving module (LRM), and a camera module (CMM). The above components may be mounted directly on the motherboard, mounted on a separate substrate and electrically connected to the display panel (DP) via a connector (not shown), or electrically connected to the first electronic module (EM1).

The audio output module (AOM) converts audio data received from the wireless communication module (TM) or audio data stored in the memory (MM) and outputs it externally.

A light-emitting module (LM) generates and outputs light. The light-emitting module (LM) can output infrared light. The light-emitting module (LM) can include an LED element. A light-receiving module (LRM) can detect infrared light. The light-receiving module (LRM) can be activated when infrared light above a predetermined level is detected. The light-receiving module (LRM) can include a CMOS sensor. After the infrared light generated by the light-emitting module (LM) is output, it can be reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the light-receiving module (LRM). A camera module (CMM) captures an image of the outside.

The electronic module (EM) illustrated in FIG. 2 can receive an external input transmitted through a module hole (MH) or provide an output through the module hole (MH). The electronic module (EM) may be any one of the modules constituting the first electronic module (EM1) and the second electronic module (EM2). For example, the electronic module (EM) may be a camera, a speaker, or a sensor for detecting light or heat, etc. The electronic module (EM) may detect an external subject received through the module hole (MH) or provide a sound signal, such as a voice, to the outside through the module hole (MH). At this time, the remaining components of the first electronic module (EM1) and the second electronic module (EM2) may be arranged in different locations and not shown. However, this is merely an example, and the electronic module (EM) may include a plurality of modules constituting the first electronic module (EM1) and the second electronic module (EM2), and is not limited to any one embodiment. Meanwhile, although not shown, the electronic device (EA) according to an embodiment of the present invention may further include a transparent member disposed between the electronic module (EM) and the display panel (DP). The transparent member may be an optically transparent film so that an external input transmitted through the module hole (MH) passes through the transparent member and is transmitted to the electronic module (EM). The transparent member may be attached to the back surface of the display panel (DP) or may be disposed between the display panel (DP) and the electronic module (EM) without a separate adhesive layer. The electronic device (EA) according to an embodiment of the present invention may have various structures and is not limited to any one embodiment.

In the present invention, since the display panel (DP) includes a module hole (MH), a separate space provided for an electronic module (EM) outside the peripheral area (NAA) can be omitted. In addition, by defining the module hole (MH) in the hole area (HA) surrounded by the active area (AA), the electronic module (EM) can be arranged to overlap the transmission area (TA) rather than the bezel area (BZA). Accordingly, the area of the bezel area (BZA) is reduced, so that an electronic device (EA) having a narrow bezel can be implemented. In addition, when the electronic module (EM) is accommodated within the module hole (MH), a thin electronic device (EA) can be implemented.

Figure 4 is an equivalent circuit diagram showing pixels of a display panel.

Referring to FIG. 4, one pixel (PX) according to one embodiment of the present invention may include a plurality of transistors (T1 to T7), a storage capacitor (Cst), and a light-emitting element (organic light emitting diode, OD).

Meanwhile, in the present invention, the remaining components of the pixel (PX) except for the light-emitting element (OD), the plurality of transistors (T1 to T7) and the storage capacitor (Cst) can be defined as driving elements.

The thin film transistors (T1 to T7) include a driving transistor (T1), a switching transistor (T2), a compensation transistor (T3), an initialization transistor (T4), a first light-emitting control transistor (T5), a second light-emitting control transistor (T6), and a bypass transistor (T7).

A pixel (PX) includes a first gate line (14) for transmitting an n-th scan signal (Sn) to a switching transistor (T2) and a compensation transistor (T3), a second gate line (24) for transmitting an n-1-th scan signal (Sn-1) to an initialization transistor (T4), a third gate line (34) for transmitting an n+1-th scan signal (Sn+1) to a bypass transistor (T7), a light emitting line (15) for transmitting an light emitting control signal (En) to a first light emitting control transistor (T5) and a second light emitting control transistor (T6), a data line (16) for transmitting a data signal (Dm), a power line (26) for transmitting a power voltage (ELVDD), and an initialization voltage line (22) for transmitting an initialization voltage (Vint) for initializing a driving transistor (T1).

The gate electrode (G1) of the driving transistor (T1) is connected to the first electrode (C1) of the storage capacitor (Cst). The source electrode (S1) of the driving transistor (T1) is connected to the power line (26) via the first light-emitting control transistor (T5). The drain electrode (D1) of the driving transistor (T1) is electrically connected to the anode of the light-emitting element (OLED) via the second light-emitting control transistor (T6). The driving transistor (T1) receives a data signal (Dm) according to the switching operation of the switching transistor (T2) and supplies a driving current (Id) to the light-emitting element (OD).

The gate electrode (G2) of the switching transistor (T2) is connected to the first gate line (14). The source electrode (S2) of the switching transistor (T2) is connected to the data line (16). The drain electrode (D2) of the switching transistor (T2) is connected to the source electrode (S1) of the driving transistor (T1) and is connected to the power line (26) via the first light-emitting control transistor (T5). The switching transistor (T2) is turned on according to the first scan signal (Sn) received through the first gate line (14) and performs a switching operation of transmitting the data signal (Dm) transmitted to the data line (16) to the source electrode (S1) of the driving transistor (T1).

The gate electrode (G3) of the compensation transistor (T3) is connected to the first gate line (14). The source electrode (S3) of the compensation transistor (T3) is connected to the drain electrode (D1) of the driving transistor (T1) and to the anode of the light-emitting element (OLED) via the second light-emitting control transistor (T6). The drain electrode (D3) of the compensation transistor (T3) is connected to the first electrode (C1) of the storage capacitor (Cst), the source electrode (S4) of the initialization transistor (T4), and the gate electrode (G1) of the driving transistor (T1). The compensation transistor (T3) is turned on according to the n-th scan signal (Sn) received through the first gate line (14) to connect the gate electrode (G1) and the drain electrode (D1) of the driving transistor (T1) to each other, thereby diode-connecting the driving transistor (T1).

The gate electrode (G4) of the initialization transistor (T4) is connected to the second gate line (24). The drain electrode (D4) of the initialization transistor (T4) is connected to the initialization voltage line (22). The source electrode (S4) of the initialization transistor (T4) is connected to the first electrode (C1) of the storage capacitor (Cst), the drain electrode (D3) of the compensation transistor (T3), and the gate electrode (G1) of the driving transistor (T1). The initialization transistor (T4) is turned on according to the n-1th scan signal (Sn-1) received through the second gate line (24) to transmit the initialization voltage (Vint) to the gate electrode (G1) of the driving transistor (T1), thereby initializing the voltage of the gate electrode (G1) of the driving transistor (T1).

The gate electrode (G5) of the first light-emitting control transistor (T5) is connected to the light-emitting line (15). The first light-emitting control transistor (T5) can be connected between the power line (26) and the driving transistor (T1). The source electrode (S5) of the first light-emitting control transistor (T5) is connected to the power line (26). The drain electrode (D5) of the first light-emitting control transistor (T5) is connected to the source electrode (S1) of the driving transistor (T1) and the drain electrode (D2) of the switching transistor (T2). When the light-emitting control signal (En) is applied to the gate electrode (G5) of the first light-emitting control transistor (T5), the first light-emitting control transistor (T5) is turned on, and the driving current (Id) flows to the light-emitting element (OD). The first light-emitting control transistor (T5) can determine the timing at which the driving current (Id) flows to the light-emitting element (OD).

The gate electrode (G6) of the second light-emitting control transistor (T6) is connected to the light-emitting line (15). The second light-emitting control transistor (T6) can be connected between the driving transistor (T1) and the light-emitting element (OD). The source electrode (S6) of the second light-emitting control transistor (T6) is connected to the drain electrode (D1) of the driving transistor (T1) and the source electrode (S3) of the compensation transistor (T3). The drain electrode (D6) of the second light-emitting control transistor (T6) is electrically connected to the anode of the light-emitting element (OD). The first light-emitting control transistor (T5) and the second light-emitting control transistor (T6) are turned on according to the light-emitting control signal (En) received through the light-emitting line (15). When the light-emitting control signal (En) is applied to the gate electrode (G6) of the second light-emitting control transistor (T6), the second light-emitting control transistor (T6) is turned on, and the driving current (Id) flows to the light-emitting element (OD). The second light-emitting control transistor (T6) can determine the timing at which the driving current (Id) flows to the light-emitting element (OD).

The gate electrode (G7) of the bypass transistor (T7) is connected to the third gate line (34). The source electrode (S7) of the bypass transistor (T7) is connected to the anode of the light-emitting element (OD). The drain electrode (D7) of the bypass transistor (T7) is connected to the initialization voltage line (22). The bypass transistor (T7) is turned on according to the n+1th scan signal (Sn+1) received through the third gate line (34) to initialize the anode of the light-emitting element (OD).

The second electrode (C2) of the storage capacitor (Cst) is connected to the power line (26). The first electrode (C1) of the storage capacitor (Cst) is connected to the gate electrode (G1) of the driving transistor (T1), the drain electrode (D3) of the compensation transistor (T3), and the source electrode (S4) of the initialization transistor (T4).

The cathode of the light-emitting element (OD) receives a reference voltage (ELVSS). The light-emitting element (OD) receives a driving current (Id) from the driving transistor (T1) and emits light. The light-emitting element (OD) includes a light-emitting material. The light-emitting element (OD) can generate light of a color corresponding to the light-emitting material. The color of the light generated from the light-emitting element (OD) can be any one of red, green, blue, and white.

In another embodiment of the present invention, the number and connection relationship of transistors (T1 to T7) constituting a pixel (PX) can be variously changed.

Fig. 5 is a cross-sectional view taken along line I-I` of the display panel (DP) illustrated in Fig. 2.

In this embodiment, the area outside the module hole (MH) within the hole area (HA) may be defined as a margin area (LA). The margin area (LA) may be an area for securing the margin of the module hole (MH). Images may not be displayed in the margin area (LA). Wires may be placed in the margin area (LA) to bypass the module hole (MH).

As illustrated in FIG. 4, the display panel (100) includes a base substrate (BS), an auxiliary layer (BL), a pixel (PX), a plurality of insulating layers (10, 20, 30, 40), an encapsulation substrate (ECG), and a detection unit (220).

The base substrate (BS) may be an insulating substrate. For example, the base substrate (BS) may include a plastic substrate or a glass substrate. The auxiliary layer (BL) is disposed on the base substrate (BS) to cover the entire surface of the base substrate (BS). The auxiliary layer (BL) includes an inorganic material. The auxiliary layer (BL) may include a barrier layer and/or a buffer layer. Accordingly, the auxiliary layer (BL) may prevent oxygen or moisture flowing through the base substrate (BS) from penetrating into the pixel (PX) or reduce the surface energy of the base substrate (BS) so that the pixel (PX) is stably formed on the base substrate (BS).

The pixel (PX) may be arranged in the active area (AA). In the present embodiment, the pixel (PX) is exemplarily illustrated as including a thin film transistor (TR, hereinafter, thin film transistor) and a light emitting element (OD). Each of the first to fourth insulating layers (10, 20, 30, 40) may include an organic material and/or an inorganic material, and may have a single-layer or laminated structure.

A thin film transistor (TR) includes a semiconductor pattern (SP), a control electrode (CE), an input electrode (IE), and an output electrode (OE). The semiconductor pattern (SP) is disposed on a secondary layer (BL). The semiconductor pattern (SP) may include a semiconductor material. The control electrode (CE) is spaced apart from the semiconductor pattern (SP) with a first insulating layer (10) therebetween.

The input electrode (IE) and the output electrode (OE) are separated from the control electrode (CE) with a second insulating layer (20) therebetween. The input electrode (IE) and the output electrode (OE) of the thin film transistor (TR) penetrate the first insulating layer (10) and the second insulating layer (20) and are connected to one side and the other side of the semiconductor pattern (SP), respectively.

The third insulating layer (30) is disposed on the second insulating layer (20) and covers the input electrode (IE) and the output electrode (OE). Meanwhile, in the thin film transistor (TR), the semiconductor pattern (SP) may be disposed on the control electrode (CE). Alternatively, the semiconductor pattern (SP) may be disposed on the input electrode (IE) and the output electrode (OE). Alternatively, the input electrode (IE) and the output electrode (OE) may be disposed on the same layer as the semiconductor pattern (SP) and may be directly connected to the semiconductor pattern (SP). The thin film transistor (TR) according to one embodiment of the present invention may be formed in various structures and is not limited to any one embodiment.

The light emitting element (OD) is disposed on the third insulating layer (30). The light emitting element (OD) includes a first electrode (E1), a light emitting pattern (EP), a control layer (EL), and a second electrode (E2).

The first electrode (E1) can be connected to the thin film transistor (TR) by penetrating the third insulating layer (30). Meanwhile, although not shown, the display panel (DP) may further include a separate connection electrode disposed between the first electrode (E1) and the thin film transistor (TR), and in this case, the first electrode (E1) can be electrically connected to the thin film transistor (TR) through the connection electrode.

The fourth insulating layer (40) is disposed on the third insulating layer (30). The fourth insulating layer (40) may include organic and/or inorganic materials and may have a single-layer or laminated structure. An opening may be defined in the fourth insulating layer (40). The opening exposes at least a portion of the first electrode (E1). The fourth insulating layer (40) may be a pixel defining film.

The light-emitting pattern (EP) is disposed in the opening and is disposed on the first electrode (E1) exposed by the opening. The light-emitting pattern (EP) may include a light-emitting material. For example, the light-emitting pattern (EP) may be composed of at least one material that emits red, green, and blue, and may include a fluorescent material or a phosphorescent material. The light-emitting pattern (EP) may include an organic light-emitting material or an inorganic light-emitting material. The light-emitting pattern (EP) may emit light in response to a potential difference between the first electrode (E1) and the second electrode (E2).

The control layer (EL) is disposed between the first electrode (E1) and the second electrode (E2). The control layer (EL) is disposed adjacent to the light-emitting pattern (EP). The control layer (EL) controls the movement of charges to improve the light-emitting efficiency and lifespan of the light-emitting element (OL). The control layer (EL) may include at least one of a hole transport material, a hole injection material, an electron transport material, and an electron injection material.

In this embodiment, the control layer (EL) is illustrated as being disposed between the light-emitting pattern (EP) and the second electrode (E2). However, this is merely an example, and the control layer (EL) may be disposed between the light-emitting pattern (EP) and the first electrode (E1), or may be provided as a plurality of layers laminated along the third direction (DR3) with the light-emitting pattern (EP) interposed therebetween.

The control layer (EL) may have an integral shape extending from the active area (AA) to the peripheral area (NAA). The control layer (EL) may be provided in common to a plurality of pixels.

The second electrode (E2) is placed on the light-emitting pattern (EP). The second electrode (E2) may face the first electrode (E1).

The second electrode (E2) may have an integral shape disposed in a portion of the active area (AA) and a peripheral area (NAA). The second electrode (E2) may be provided in common to a plurality of pixels. Each light-emitting element (OD) disposed in each of the pixels receives a common power supply voltage (hereinafter, referred to as the second power supply voltage) through the second electrode (E2).

The second electrode (E2) may not be placed in the hole area (HA), specifically, the margin area (LA). That is, the second electrode (E2) is not exposed by the module hole (MH).

The second electrode (E2) may include a transmissive conductive material or a semi-transmissive conductive material. For example, the second electrode (E2) may include magnesium (MG), silver (AG), or a combination thereof. Accordingly, light generated in the light-emitting pattern (EP) can be easily emitted toward the third direction (DR3) through the second electrode (E2). However, this is merely an example, and the light-emitting element (OD) according to an embodiment of the present invention may be driven in a back-emitting manner in which the first electrode (E1) includes a transmissive or semi-transmissive material, or may be driven in a double-sided emission manner in which light is emitted toward both the front and back, depending on the design, and is not limited to any one embodiment.

The second electrode (E2) includes a material having a relatively high reflectivity. Therefore, when the electronic module (EM) is an audio output module (AOM), a light emitting module (LM), a light receiving module (LRM), or a camera module (CMM) as described with reference to FIG. 3, light emitted from the lower portion of the base substrate (BS) or light incident toward the lower portion of the base substrate (BS) may be reflected by the second electrode (E2), thereby degrading the performance of the electronic module (EM).

In an embodiment of the present invention, since the second electrode (E2) is not placed in the margin area (LA), the problem of light incident or emitted around the module hole (MH) being reflected and thus the performance of the electronic module (EM) being degraded can be solved.

The second electrode (E2) may have a thickness of less than 100 angstroms.

The display panel (DP) may further include a deposition prevention pattern (PD). The deposition prevention pattern (PD) may be disposed in a hole area (HA), specifically, a margin area (LA). The deposition prevention pattern (PD) is not disposed in the active area (AA). The deposition prevention pattern (PD) may be exposed by a module hole (MH). The deposition prevention pattern (PD) may be in contact with a control layer (EL) disposed in the margin area (LA).

The deposition barrier pattern (PD) may include ABH113 (Sun Fine Chemicals), which is used as a blue organic light-emitting material.

The deposition prevention pattern (PD) may be arranged on the same layer as the second electrode (E2). The deposition prevention pattern (PD) may have a thickness greater than that of the second electrode (E2). The deposition prevention pattern (PD) may have a thickness of 5 μm to 10 μm.

Figure 6 is a photograph showing the results of an experiment to determine whether a second electrode is deposited at a location where a deposition prevention pattern is formed.

Referring to Fig. 6, after ABH113 (Sun Fine Chemicals) was deposited in the experimental area (XA), magnesium or silver forming the second electrode (E2) was deposited using a mask for forming a grid-shaped pattern. At this time, the adhesion between ABH113 (Sun Fine Chemicals) and Mg/Ag was very weak, and it was confirmed that Mg/Ag was not deposited at the location where ABH113 (Sun Fine Chemicals) was placed. That is, when the deposition prevention pattern (PD) was formed before the second electrode (E2), it was confirmed that the material for forming the second electrode (E2) was not deposited at the location where the deposition prevention pattern (PD) was formed.

Therefore, according to an embodiment of the present invention, by arranging a deposition prevention pattern (PD) in a margin area (LA) within a hole area (HA), a second electrode (E2) can be formed within an active area (AA) excluding the hole area (HA).

The encapsulation substrate (ECG) may include an insulating material. For example, the encapsulation substrate (ECG) may include a glass substrate or a plastic substrate. A display panel (DP) according to an embodiment of the present invention may have improved reliability against external impacts by including the encapsulation substrate (ECG).

The encapsulation substrate (ECG) may be positioned at a predetermined distance from the second electrode (E2) in the third direction (DR3). The space (GP) between the encapsulation substrate (ECG) and the second electrode (E2) may be filled with air or an inert gas.

The encapsulation substrate (ECG) is connected to the base substrate (BS) through a sealing member (PSL) and seals the pixel (PX). The encapsulation substrate (ECG) can be placed on the base substrate (BS) while maintaining a predetermined gap through the sealing member (PSL).

The sealing member (PSL) may be a component defining the inner surface of the module hole (MH). The sealing member (PSL) may include an organic material such as a photocurable resin or a photoplastic resin, or an inorganic material such as a frit seal, but is not limited to any one embodiment.

The sealing member (PSL) can come into contact with the deposition prevention pattern (PD).

If the deposition prevention pattern (PD) does not exist, the second electrode (E2) may extend to the margin area (LA) and come into contact with the sealing member (PSL). In this case, the adhesive strength between the material forming the second electrode (E2) including metal and the sealing member (PSL) may be weak, and the sealing member (PSL) may not be firmly fixed.

According to an embodiment of the present invention, the deposition prevention pattern (PD) is arranged within the margin area (LA) and is in direct contact with the sealing member (PSL), so that the sealing member (PSL) can be firmly bonded to the deposition prevention pattern (PD).

The sensing unit (220) is placed on the sealing substrate (ECG). The sensing unit (220) may be implemented in a capacitive manner. Specifically, the input sensing unit (ISU) may extract touch coordinates based on the capacitance change amount of a capacitor formed by two types of touch lines extending in different directions and being insulated.

The sensing unit (220) may include conductive layers and a touch insulating layer composed of multiple layers.

The module hole (MH) penetrates the display panel (DP). In the present embodiment, the inner surface (MHE1) of the module hole (MH) can be defined by the cross-sections of the base substrate (BS), the auxiliary layer (BL), the first insulating layer (10), the sealing member (PSL), the encapsulation substrate (ECG), and the detection unit (220).

FIG. 7 is a cross-sectional view taken along line I-I` of the display panel illustrated in FIG. 2 in another embodiment of the present invention.

The display panel (DP-1) described with reference to FIG. 7 differs from the display panel (DP) described with reference to FIG. 5 in that the encapsulation substrate (ECG) of FIG. 5 is removed and an encapsulation layer (ECL) is included. Hereinafter, the differences between the display panel (DP-1) of FIG. 7 and the display panel (DP) of FIG. 5 will be primarily described, and any configurations not described will follow the description of FIG. 5.

The display panel (DP-1) may include an encapsulation layer (ECL).

An encapsulating layer (ECL) is disposed on the light emitting element (OD) to encapsulate the light emitting element (OD). The encapsulating layer (ECL) may be provided in common to a plurality of pixels. Meanwhile, although not shown, a capping layer covering the second electrode (E2) may be further disposed between the second electrode (E2) and the encapsulating layer (ECL) and between the deposition prevention pattern (PD) and the encapsulating layer (ECL).

The encapsulation layer (ECL) may include a first inorganic layer (IOL1), an organic layer (OL), and a second inorganic layer (IOL2) sequentially laminated along the third direction (DR3). However, the present invention is not limited thereto, and the encapsulation layer (ECL) may further include a plurality of inorganic layers and organic layers.

The first inorganic layer (IOL1) can cover the second electrode (E2) and the deposition prevention pattern (PD). In the embodiment of FIG. 7, the first inorganic layer (IOL1) can be in contact with the second electrode (E2) and the deposition prevention pattern (PD).

The first inorganic layer (IOL1) can prevent external moisture or oxygen from penetrating into the light-emitting element (OD). For example, the first inorganic layer (IOL1) may include silicon nitride, silicon oxide, or a compound comprising these. The first inorganic layer (IOL1) may be formed through a deposition process.

An organic layer (OL) is disposed on a first inorganic layer (IOL1) and can be in contact with the first inorganic layer (IOL1). The organic layer (OL) can provide a flat surface on the first inorganic layer (IOL1). Curves formed on the upper surface of the first inorganic layer (IOL1) or particles existing on the first inorganic layer (IOL1) are covered by the organic layer (OL), thereby blocking the influence of the surface state of the upper surface of the first inorganic layer (IOL1) on structures formed on the organic layer (OL). In addition, the organic layer (OL) can relieve stress between layers in contact. The organic layer (OL) can include an organic material and can be formed through a solution process such as spin coating, slit coating, or an inkjet process.

The second inorganic layer (IOL2) is disposed on the organic layer (OL) and covers the organic layer (OL). The second inorganic layer (IOL2) can be stably formed on a relatively flat surface compared to when disposed on the first inorganic layer (IOL1). The second inorganic layer (IOL2) seals moisture, etc. released from the organic layer (OL) and prevents them from flowing out. The second inorganic layer (IOL2) can include silicon nitride, silicon oxide, or a compound comprising a combination thereof. The second inorganic layer (IOL2) can be formed through a deposition process.

A planarization layer (PL) may be disposed on the encapsulation layer (ECL). The planarization layer (PL) covers the front surface of the encapsulation layer (ECL), which provides an uneven front surface, to provide a flat surface to the active area (AA). The sensing unit (220) may be disposed on the planarization layer (PL). In the present embodiment, the inner surface (MHE1) of the module hole (MH) may be defined by a cross-section of the base substrate (BS), the auxiliary layer (BL), the first insulating layer (10), the second insulating layer (20), the first inorganic layer (IOL1), the second inorganic layer (IOL2), the planarization layer (PL), and the sensing unit (220).

Meanwhile, in the display panel (DP-1) according to the present embodiment, a recessed pattern (GV) may be formed within the hole area (HA). The recessed pattern (GV) is a pattern recessed from the front surface of the display panel (DP-1) and may be formed by removing some of the components of the display panel (DP-1). Meanwhile, unlike the module hole (MH), the recessed pattern (GV) does not penetrate the display panel (DP-1). Accordingly, the back surface of the base substrate (BS) overlapping the recessed pattern (GV) is not opened by the recessed pattern (GV).

In this embodiment, the base substrate (BS) may have flexibility. For example, the base substrate (BS) may include a resin such as polyimide.

The recessed pattern (GV) may be formed by penetrating the components adjacent to the module hole (MH) among the remaining components arranged on the lower side of the encapsulation layer (ECL), leaving only a portion of the base substrate (BS). In the present embodiment, the recessed pattern (GV) may be formed by connecting a penetrating portion formed in the auxiliary layer (BL) and a recessed portion formed in the base substrate (BS). The inner surface of the recessed pattern (GV) may be formed by covering the penetrating portion formed in the auxiliary layer (BL) and the recessed portion formed in the base substrate (BS) by a first inorganic layer (IOL1) and a second inorganic layer (IOL2). In the present embodiment, the inner surface of the recessed pattern (GV) may be provided by the second inorganic layer (IOL2).

On a plane, the depression pattern (GV) can surround the module hole (MH). The depression pattern (GV) can overlap the margin area (LA).

The depression pattern (GV) may have an undercut shape. Specifically, the auxiliary layer (BL) may be formed closer to the depression pattern (GV) than the base substrate (BS).

The display panel (DP-1) may further include a predetermined organic pattern (EL-P) arranged within the recessed pattern (GV). The organic pattern (EL-P) may include the same material as the control layer (EL). Alternatively, the organic pattern (EL-P) may include the same material as the anti-deposition pattern (PD). The organic pattern (EL-P) may have a single-layer or multi-layer structure.

The organic pattern (EL-P) may be positioned within the recessed pattern (GV) and spaced apart from the control layer (EL) and the deposition prevention pattern (PD). The organic pattern (EL-P) may be covered by the first inorganic layer (IOL1) and may not be exposed to the outside.

According to the present invention, the recessed pattern (GV) blocks the continuity of the control layer (EL) that is connected from the module hole (MH) side to the active area (AA). The control layer (EL) may be disconnected in an area overlapping the recessed pattern (GV). The control layer (EL) may be a migration path for external contaminants such as moisture or air. The path through which moisture or air that may flow into the pixel (PX) through the hole area (MHA) that may be exposed by the module hole (MH), for example, the control layer (EL), may flow into the pixel (PX) may be blocked by the recessed pattern (GV). Accordingly, the reliability of the display panel (DP-1) in which the module hole (MH) is formed may be improved.

Meanwhile, in the display panel (DP-1) according to one embodiment of the present invention, a plurality of recessed patterns (GV) may be provided and arranged spaced apart from each other within the wiring area (LA). Alternatively, the recessed patterns (GV) may be filled by a portion of the organic layer (OL). Alternatively, in the display panel (DP) according to one embodiment of the present invention, the recessed patterns (GV) may be omitted, and the present invention is not limited to any one embodiment.

FIGS. 8A to 8E are drawings illustrating a process for manufacturing a display device according to an embodiment of the present invention described with reference to FIG. 5.

Referring to Fig. 8a, an auxiliary layer (BL), a thin film transistor (TR), a plurality of insulating layers (10, 20, 30, 40), a first electrode (E1), and a light-emitting pattern (EP) are formed on a base substrate (BS). A detailed description thereof is omitted. Thereafter, a control layer (EL) is formed on the light-emitting pattern (EP). The control layer (EL) may be formed entirely on the second insulating layer (20) and the fourth insulating layer (40).

Thereafter, referring to FIG. 8b, a deposition prevention layer (PD1) is formed on the control layer (EL). The deposition prevention layer (PD1) may be formed to overlap with the hole area (HA).

The deposition prevention layer (PD1) can be formed by depositing and patterning ABH113 (Sun Fine Chemicals), which is used as a blue organic light-emitting material. The deposition prevention layer (PD1) can have a thickness of 5 μm to 10 μm.

Thereafter, referring to FIG. 8c, a second electrode (E2) is formed on the control layer (EL). The second electrode (E2) may include a transparent conductive material or a semi-transparent conductive material. For example, the second electrode (E2) may include magnesium (MG), silver (AG), or a combination thereof.

The second electrode (E2) is formed by depositing a conductive material over the entire surface. At this time, the conductive material is not deposited at the location where the deposition prevention layer (PD1) is formed. Therefore, the second electrode (E2) can be positioned so as not to overlap with the hole area (HA) where the deposition prevention layer (PD1) is formed. By forming the second electrode (E2), the light-emitting element (OD) including the first electrode (E1), the light-emitting pattern (EP), the control layer (EL), and the second electrode (E2) is completed.

Thereafter, referring to FIG. 8d, the encapsulation substrate (ECG) is placed on the base substrate (BS) on which the light-emitting element (OD) is formed. Thereafter, the encapsulation substrate (ECG) and the base substrate (BS) on which the light-emitting element (OD) and the deposition prevention layer (PD1) are formed are bonded together through a sealing member (PSL). The sealing member (PSL) can be cured by irradiating laser light on the upper portion of the encapsulation substrate (ECG). The detection unit (220) may be attached to the upper portion of the encapsulation substrate (ECG) before bonding the encapsulation substrate (ECG) and the base substrate (BS), but is not limited thereto, and may be attached to the upper portion of the encapsulation substrate (ECG) after bonding the encapsulation substrate (ECG) and the base substrate (BS).

Thereafter, referring to FIG. 8e, a module hole (MH) is formed in the bonded encapsulation substrate (ECG) and base substrate (BS). The module hole (MH) can be formed through a laser cutting process. Through the process of FIG. 8e, a deposition prevention pattern (PD) can be formed, and a display panel (DP) can be formed.

Fig. 9 is an exploded perspective view of a display device according to an embodiment of the present invention. Fig. 10a is a plan view schematically illustrating a display panel according to an embodiment of the present invention. Fig. 10b is a plan view schematically illustrating a display panel according to an embodiment of the present invention. The same/similar reference numerals are used for the same/similar components as those in Figs. 1 to 7, and duplicate descriptions are omitted.

Referring to FIG. 9, the electronic device (EA-A) according to the present embodiment includes a display panel (DP-A), a window member (WM-A), an electronic module (EM-A), and a storage member (BM-A).

Unlike the display panel (DP) of FIG. 2, the display panel (DP-A) according to the present embodiment may omit the module hole (MH) physically penetrating the display panel (DP). Instead of the module hole (MH) of FIG. 2, the display panel (DP-A) according to the present embodiment may include an area overlapping the electronic module (EM-A) with a relatively high light transmittance compared to an adjacent area. Accordingly, the electronic module (EM-A) can be placed under the display panel (DP-A) without physically penetrating the display panel (DP-A).

FIG. 9 illustrates an example in which one electronic module (EM-A) is arranged at the center of the upper part of the electronic device (EA-A), but is not limited thereto, and the number, position, and shape of the electronic modules (EM-As) may be changed and are not limited to any one embodiment.

The display panels (DP1, DP2) illustrated in FIGS. 10A and 10B are simplified embodiments of the display panel (DP-A) illustrated in FIG. 9.

Referring to FIG. 10A, a display panel (DP1) according to one embodiment may be divided into a first display area (RA1) and a second display area (RA2). The first display area (RA1) may surround at least a portion of the second display area (RA2).

The second display area (RA2) may include a first transmission portion (LT1) and a second transmission portion (LT2). The first transmission portion (LT1) according to the present invention may be defined as an area overlapping the electronic module (EM-A) among the display panel (DP1). The second transmission portion (LT2) may surround the first transmission portion (LT1). The second transmission portion (LT2) may form a boundary with the first display area (RA1).

According to the present invention, the second display area (RA2) of the display panel (DP1) may be defined as an area having a relatively higher light transmittance than the first display area (RA1). Accordingly, the second display area (RA2) may include areas where one component of the display panel (DP1) is not arranged or where one component is omitted.

According to the present invention, since the light transmittance of the second display area (RA2) overlapping the electronic module (EM-A) among the display panels (DP1) is relatively higher than that of the adjacent first display area (RA1), the performance of the electronic module (EM-A) can be improved.

Referring to FIG. 10B, a display panel (DP2) according to one embodiment may be divided into a first display area (RA1-A) and a second display area (RA2-A). The second display area (RA2-A) may include a first transmission portion (LT1-A) and a second transmission portion (LT2-A). The first transmission portion (LT1-A) may include a first portion (SA1) and a second portion (SA2). The number and shape of the first portions (SA1) and the second portions (SA2) included in the first transmission portion (LT1-A) may be changed to correspond to the number and shape of the electronic modules (EM-A) arranged under the display panel (DP-A). The first portion (SA1) and the second portion (SA2) are illustrated as circles of different sizes, but are not limited thereto, and are not limited to any one shape such as a polygon or an ellipse.

The first display area (RA1-A) and the second display area (RA2-A) according to the present embodiment may be arranged along the second direction (DR2). In addition, the second display area (RA2-A) may have a bar shape extending along the first direction (DR1).

FIG. 11a is an enlarged plan view of a region of a display panel according to an embodiment of the present invention. FIG. 11b is an enlarged plan view of a region of a display panel according to an embodiment of the present invention. FIG. 12 is a cross-sectional view of a display device according to an embodiment of the present invention.

Referring to FIG. 11A, in a second display area (RA2) according to one embodiment, light-emitting areas (PA) and transmissive areas (TR) may be arranged alternately. The light-emitting areas (PA) and transmissive areas (TR) may be areas included in the first transmissive portions (LT1, LT1-A) and the second transmissive portions (LT2, LT2-A), respectively, illustrated in FIGS. 10A and 10B.

The light-emitting areas (PA) may be defined as areas overlapping with areas where light-emitting patterns (EP) to be described later are arranged, and the transmissive areas (TR) may include areas where one component of the display panel (DP-A) is not arranged or one component is omitted. Therefore, the transmissive areas (TR) may have relatively higher light transmittance than the light-emitting areas (PA).

In the second display area (RA2) according to the present embodiment, light-emitting areas (PA) and transmissive areas (TR) can be arranged alternately. In the present embodiment, two light-emitting areas (PA) and two transmissive areas (TR) arranged in a grid pattern can be defined as one unit area (UA1).

Therefore, in the present embodiment, the ratio of the light-emitting areas (PA) and the transmission areas (TR) per unit area (UA1) can be 50:50. The increase in the transmittance per unit area (UA1) can be changed by controlling the ratio of the light-emitting areas (PA) and the transmission areas (TR) included in the unit area (UA1).

The first display area (RA1, RA1-A) illustrated in FIGS. 10a and 10b may be an area composed only of light-emitting areas (PA).

Referring to FIG. 11B, each of the light-emitting areas (PA) of the second display area (RA2-1) according to one embodiment may be surrounded by transmissive areas (TR). The light-emitting areas (PA) and the transmissive areas (TR) may be areas included in the first transmissive portions (LT1, LT1-A) and the second transmissive portions (LT2, LT2-A), respectively, illustrated in FIGS. 10A and 10B.

In the present embodiment, the ratio of light-emitting areas (PA) and transmissive areas (TR) per unit area (UA2) may be 20:80. Accordingly, when a camera module (CMM, see FIG. 3) among electronic modules (EM-A) is arranged below the display panel (DP-A), the display panel (DP-A) can include a second display area (RA2-1) having a higher light transmittance than the adjacent area, thereby improving the efficiency of the electronic module (EM-A).

Referring to FIG. 12, a display panel (DP-A) according to the present embodiment includes a base substrate (BS), an auxiliary layer (BL), a pixel (PX), a plurality of insulating layers (10, 20, 30, 40), an encapsulation substrate (ECG), and a detection unit (220). A second display area (RA2) of the display panel (DP-A) includes a light-emitting area (PA) and a transmissive area (TR). The transmissive area (TR) may be an area having a relatively high light transmittance compared to the light-emitting area (PA). The first display areas (RA1, RA1-A) illustrated in FIGS. 10A and 10B may be areas composed only of light-emitting areas (PA).

Among the first electrodes, the first electrode (E1) disposed in the light-emitting area (PA) may be connected to the thin film transistor (TR) by penetrating the third insulating layer (30). In addition, among the first electrodes, the first electrode (E1) disposed in the transparent area (TR) may be disposed to be spaced apart from the thin film transistor (TR). At least some of the first electrodes disposed in the transparent area (TR) may be connected to the initialization voltage (Vint) and may receive the same voltage. Accordingly, the first electrodes disposed in the transparent area (TR) may be prevented from floating and charging of the peripheral current. Among the first electrodes, the first electrodes overlapping the light-emitting area (PA) may be exposed by the display opening (D-OP) defined in the fourth insulating layer (40).

The light-emitting pattern (EP) may be arranged in the display opening (D-OP). The fourth insulating layer (40) may be a pixel defining film. In the present embodiment, the light-emitting area (PA) may be defined as an area where the light-emitting pattern (EP) included in the pixel (PX) is arranged.

The control layer (EL) is disposed between the first electrode (E1) and the second electrode (E2). The control layer (EL) is disposed adjacent to the light-emitting pattern (EP). The control layer (EL) may be disposed on the entire surface of the light-emitting area (PA) and the transmission area (TR). However, this is not limited thereto, and the control layer (EL) may be disposed only on the light-emitting area (PA), and the control layer (EL) may not be disposed on the transmission area (TR).

In the present embodiment, the second electrode (E2) may be disposed only in the light-emitting area (PA) and not in the transmission area (TR). Accordingly, the second electrode (E2) may be disposed on the first electrodes that overlap the light-emitting area (PA) among the first electrodes (E1).

The second electrode (E2) includes a material having a relatively high reflectivity. Therefore, when the electronic module (EM) is an audio output module (AOM), a light emitting module (LM), a light receiving module (LRM), or a camera module (CMM) as described with reference to FIG. 3, light emitted from the lower portion of the base substrate (BS) or light incident toward the lower portion of the base substrate (BS) may be reflected by the second electrode (E2), thereby degrading the performance of the electronic module (EM).

In an embodiment of the present invention, since the second electrode (E2) is not disposed in the transmission area (TR), the problem of light incident or emitted into the second display area (RA2) being reflected and thus deteriorating the performance of the electronic module (EM) can be solved.

The second electrode (E2) may have a thickness of less than 100 angstroms.

In the present embodiment, the display panel (DP-A) may further include a deposition prevention pattern (PD-A). The deposition prevention pattern (PD-A) is disposed only in the transmission area (TR) and not in the emission area (PA). The deposition prevention pattern (PD-A) may be in contact with the control layer (EL) disposed in the transmission area (TR).

The deposition-prevention pattern (PD-A) may include ABH113 (Sun Fine Chemicals), which is used as a blue organic light-emitting material.

The deposition prevention pattern (PD-A) may be disposed on the same layer as the second electrode (E2). The deposition prevention pattern (PD-A) may be disposed only in the transmission region (TR). Accordingly, the deposition prevention pattern (PD-A) may be disposed on the first electrodes (E1) that overlap the transmission region (TZ).

The deposition prevention pattern (PD-A) may have a thickness greater than that of the second electrode (E2). The deposition prevention pattern (PD) may have a thickness of 5 um to 10 um.

According to the present embodiment, by arranging the deposition prevention pattern (PD-A) only in the transmission area (TR), the second electrode (E2) may not be arranged in the transmission area (TR) and may be arranged only in the emission area (PA). Accordingly, the second display area (RA2) includes the emission area (PA) that provides light generated from the emission pattern (EP) and the transmission area (TR) that has a relatively high light transmittance compared to the emission area (PA), so that even if the electronic module (EA-A, see FIG. 9) is arranged at the bottom of the display panel (DP), the performance of the electronic module (EA-A) can be improved and visibility can be enhanced.

Fig. 13 is a cross-sectional view of a display device according to one embodiment of the present invention. The same/similar reference numerals are used for the same/similar configurations as those in Figs. 1 to 12, and duplicate descriptions are omitted.

Referring to FIG. 13, a display panel (DP-B) according to the present embodiment includes a base substrate (BS), an auxiliary layer (BL), a pixel (PX), a plurality of insulating layers (10, 20, 30, 40), an encapsulation substrate (ECG), and a detection unit (220). A second display area (RA2) of the display panel (DP-B) includes a light-emitting area (PA) and a transmissive area (TR).

In the present embodiment, the second electrode (E2) may be disposed only in the light-emitting area (PA) and not in the transmissive area (TR). In addition, the deposition prevention pattern (PD-B) may be disposed in the transmissive area (TR). The deposition prevention pattern (PD-B) is disposed only in the transmissive area (TR) and not in the light-emitting area (PA).

In this embodiment, the display panel (DP-B) may include a transmission aperture (T-OP). The transmission aperture (T-OP) may include a first aperture (TO1) and a second aperture (TO2).

The first opening (TO1) may be defined by penetrating the third insulating layer (30) overlapping the transmission area (TZ), and the second opening (TO2) may be defined by penetrating the fourth insulating layer (40) overlapping the transmission area (TZ).

In the present embodiment, the deposition prevention pattern (PD-B) may be disposed on the fourth insulating layer and the transmission opening (T-OP) overlapping the transmission area (TR). FIG. 13 illustrates, by way of example, the control layer (EL) disposed on the entire surface of the light-emitting area (PA) and the transmission area (TZ), but is not limited thereto, and the control layer (EL) may be disposed only on the light-emitting area (PA). In this case, the deposition prevention pattern (PD-B) may cover the fourth insulating layer and the transmission opening (T-OP) disposed in the transmission area (TZ), and is not limited to any one embodiment. Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art or having ordinary knowledge in the art that various modifications and changes may be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims to be described later.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the patent claims.

EP: Display Panel DP: Display Panel
220: Detection Unit MH: Module Hall
HA: Hole area LA: Margin area
PD: Deposition prevention pattern OD: Light emitting element
E1: First electrode E2: Second electrode
EP: luminescent pattern EL: control layer

Claims (30)

A base substrate comprising a front surface and a back surface facing each other, a module hole penetrating the front surface and the back surface is defined, and an active area, a peripheral area adjacent to the active area, and a margin area surrounding the module hole are defined on a plane;
A circuit layer disposed on the base substrate and including a driving element including a thin film transistor;
A display element layer including a light-emitting element and a deposition prevention pattern, including a first electrode connected to the thin film transistor, a light-emitting pattern disposed on the first electrode, a second electrode disposed on the light-emitting pattern, and a control layer disposed between the second electrode and the light-emitting pattern; and
A sealing layer is disposed on the display element layer and seals the light emitting element,
The second electrode and the deposition prevention pattern are arranged on the same layer and do not overlap each other,
In the above margin area, the deposition prevention pattern is disposed on the control layer and is in contact with the control layer,
A display device wherein a first side of the above deposition prevention pattern is adjacent to the second electrode, and a second side opposite to the first side is exposed by the module hole. In the first paragraph,
The above deposition prevention pattern is a display device including ABH113 (Sun Fine Chemicals). In the first paragraph,
A display device in which the above deposition prevention pattern overlaps the margin area, and the second electrode overlaps the active area. In the first paragraph,
A display device in which the above deposition prevention pattern has a thickness greater than that of the second electrode. In the first paragraph,
The second electrode is a display device comprising magnesium (MG), silver (AG), or a combination thereof. In the first paragraph,
The above deposition prevention pattern is a display device exposed by the module hole. In the first paragraph,
The above encapsulation layer is,
Encapsulated substrate; and
A display device comprising a sealing member bonded between the above-mentioned sealing substrate and the above-mentioned display element layer and overlapping the above-mentioned margin area. In paragraph 7,
A display device in which the sealing member and the deposition prevention pattern are in contact with each other. delete In the first paragraph,
A display device in which the sealing layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially arranged on the display element layer. In the first paragraph,
A display device in which a recessed pattern is provided on the base substrate, the recessed pattern surrounding the module hole on a plane and overlapping the margin area. In Article 11,
A display device further comprising an organic pattern disposed within the above-described recessed pattern, wherein the organic pattern comprises ABH113 (Sun Fine Chemicals). A base substrate comprising a front surface and a back surface facing each other, a module hole penetrating the front surface and the back surface is defined, and an active area, a peripheral area adjacent to the active area, and a margin area surrounding the module hole are defined on a plane;
A circuit layer disposed on the base substrate and including a driving element including a thin film transistor;
A display element layer including a first electrode connected to the thin film transistor, a light-emitting element including a light-emitting pattern disposed on the first electrode, a second electrode disposed on the light-emitting pattern, and a deposition prevention pattern; and
A sealing layer is disposed on the display element layer and seals the light emitting element,
The above deposition prevention pattern overlaps the above margin area and the display device includes ABH113 (Sun Fine Chemicals). In the 13th paragraph,
A display device in which the above deposition prevention pattern is arranged on the same layer as the second electrode. In the 13th paragraph,
The second electrode is a display device comprising magnesium (MG), silver (AG), or a combination thereof. A step of providing a base substrate including front and back surfaces facing each other, and defining an active area, a peripheral area adjacent to the active area, and a hole area surrounded by the active area on a plane;
A step of forming a first electrode, a light-emitting pattern, and a control layer on the base substrate;
A step of forming a deposition prevention layer on the control layer overlapping the hole region;
A step of forming a second electrode that does not overlap with the deposition prevention layer on the control layer that overlaps with the active area;
A step of forming a sealing layer on the second electrode; and
Comprising a step of forming a module hole overlapping the above hole area and penetrating the base substrate,
In the above hole area, the control layer and the deposition prevention layer are in contact,
A method for manufacturing a display device, wherein a first side of the above-described deposition prevention pattern is adjacent to the second electrode, and a second side opposite to the first side is exposed by the module hole. In Article 16,
The step of forming the above deposition prevention layer is:
A method for manufacturing a display device by depositing and patterning ABH113 (Sun Fine Chemicals). In Article 16,
The step of forming the second electrode is as follows:
A method for manufacturing a display device in which magnesium (MG) or silver (AG) is deposited on the entire surface of a control layer on which the above-described deposition prevention layer is formed. base layer;
A deposition prevention pattern disposed on the base layer and comprising ABH113 (Sun Fine Chemicals); and
An electronic device comprising an electrode pattern disposed on the same layer as the deposition-preventing pattern, comprising a metal material, and non-overlapping with the deposition-preventing pattern. In Article 19,
An electronic device wherein the metal material comprises magnesium (MG), silver (AG), or a combination thereof. electronic modules; and
A display panel comprising a first display area, and a second display area adjacent to the first display area and overlapping the electronic module, the display panel comprising a circuit layer including a driving element including thin film transistors, light emitting elements including first electrodes each connected to the thin film transistors, light emitting patterns disposed on the first electrodes, a second electrode disposed on the light emitting patterns, and a control layer disposed between the light emitting patterns and the second electrode, and a display element layer including a deposition prevention pattern disposed on the same layer as the second electrode,
The second electrode is arranged in the first display area and the second display area,
The above deposition prevention pattern is arranged in the second display area,
In the second display area, the deposition prevention pattern and the control layer are in contact,
An electronic device wherein the thickness of the above deposition prevention pattern is greater than the thickness of the second electrode. In Article 21,
An electronic device characterized in that the above deposition prevention pattern has ABH113 (Sun Fine Chemicals). delete In Article 21,
An electronic device characterized in that the second electrode comprises magnesium (MG), silver (AG), or a combination thereof. In Article 21,
An electronic device characterized in that the light-emitting patterns per unit area are arranged in the second display area less than the first display area. In Article 21,
An electronic device characterized in that the second display area includes a light-emitting area in which the light-emitting patterns are arranged and a transmissive area in which the deposition prevention pattern is arranged. In Article 26,
The second electrode is placed in the light-emitting area,
An electronic device characterized in that the above deposition prevention pattern is arranged in a transmission area. In Article 27,
The second electrode is disposed on the first electrodes that overlap the light-emitting region among the first electrodes,
An electronic device characterized in that the above deposition prevention pattern is disposed on the first electrodes overlapping the transmission area among the first electrodes. In Article 27,
An electronic device characterized in that the first display area and the second display area are arranged along one direction, and the second display area extends in a direction perpendicular to the one direction. In Article 21,
The above electronic module,
An electronic device comprising at least one of an audio output module, a light emitting module, a light receiving module, and a camera module.