KR102764689B1 - Method for setting setting information used for substrate processing monitoring, method for monitoring substrate processing device, and substrate processing device - Google Patents

Abstract

A method for setting setup information used for substrate processing monitoring comprises: a setup recipe process (S12) for controlling a moving mechanism for moving a first surveillance object in a substrate processing device to move the first surveillance object to a first stop position; a setup imaging process, which is executed in parallel with the setup recipe process (S12) and in which a camera captures an image of the first surveillance object; first image data including the first surveillance object stopped at the first stop position, acquired by the camera in the setup imaging process; and a setting process (S16) for detecting a position of the first surveillance object in the first image data based on first reference image data representing at least a part of the first surveillance object, and setting the position as an appropriate position with respect to the first stop position.

Description

Method for setting setting information used for substrate processing monitoring, method for monitoring substrate processing device, and substrate processing device

The present invention relates to a method for setting setting information used for substrate processing monitoring, a method for monitoring a substrate processing device, and a substrate processing device.

Conventionally, in the manufacturing process of semiconductor devices, etc., various processing solutions such as pure water, photoresist solution, and etching solution are supplied to the substrate to perform various substrate processing such as cleaning treatment and resist coating treatment. As a substrate processing device that performs such processing, a substrate processing device that rotates the substrate in a horizontal position and ejects the processing solution onto the surface of the substrate from a nozzle is widely used.

The nozzle is connected to a treatment liquid supply source through a pipe, and a valve is installed in the pipe. When the valve is opened, the treatment liquid is discharged from the nozzle, and when the valve is closed, the treatment liquid is discharged from the nozzle.

In addition, the substrate processing device is provided with a nozzle moving mechanism for moving the nozzle. The nozzle moving mechanism moves the nozzle between a processing position above the substrate and a waiting position outside the substrate.

When the valve is opened while the nozzle is stopped at the processing position, the processing liquid is supplied from the nozzle to the main surface of the substrate. Accordingly, the substrate is processed. When the prescribed discharging time has elapsed from the start of discharging the processing liquid, the valve closes and the supply of the processing liquid stops.

In such a substrate processing device, there are cases where monitoring is performed to determine whether or not the processing liquid is discharged from the nozzle. In other words, there are cases where the discharge status of the processing liquid from the nozzle is monitored. For example, patent document 1 proposes directly monitoring the discharge of the processing liquid from the nozzle by installing an imaging means such as a camera.

Japanese Patent Publication No. 2008-135679

In addition to the discharge status of the treatment liquid discharged from the nozzle, the position of the nozzle may also be adopted as a target of monitoring in substrate processing. That is, the substrate processing device may also determine whether the nozzle position is appropriate based on image data acquired by an imaging means.

Specifically, the substrate processing device detects the coordinate position of the nozzle in the image data by image processing on the image data including the nozzle stopped at the processing position, and determines whether the coordinate position of the nozzle is appropriate based on the coordinate position of the nozzle and a preset appropriate position (set coordinate position).

This setting coordinate position is the coordinate position of the nozzle in the captured image data when the nozzle is stopped at an appropriate position. This setting coordinate position is manually set by an operator, for example, when installing a substrate processing device. Specifically, first, the nozzle moving mechanism moves the nozzle to the processing position, and the image data is acquired by the imaging means. The substrate processing device displays the image data on the display of the user interface. Next, the operator recognizes the image data displayed on the display and inputs the coordinate position of the area including the nozzle in the image data into the user interface. The substrate processing device sets the coordinate position input into the user interface as the setting coordinate position of the nozzle. Accordingly, the appropriate position of the nozzle in the image data can be set.

However, manual settings like this increase the work time and may result in differences in settings depending on the operator's level of familiarity.

Therefore, the present invention was made in consideration of the above-mentioned tasks, and aims to provide a technology capable of automatically setting an appropriate location of a surveillance target used for surveillance processing.

A first aspect of a method for setting setting information used in substrate processing monitoring is a method for setting setting information used in substrate processing monitoring, comprising: a setup recipe process for controlling a moving mechanism for moving a first monitoring target in a substrate processing device to move the first monitoring target to a first stop position; a setup imaging process for imaging the first monitoring target with a camera, which is executed in parallel with the setup recipe process; and a setting process for detecting a position of the first monitoring target in the first image data based on first image data acquired by the camera in the setup imaging process and including the first monitoring target stopped at the first stop position, and first reference image data representing at least a part of the first monitoring target, and setting the position as an appropriate position with respect to the first stop position.

A second aspect of a method for setting setting information used for substrate processing monitoring is a method for setting setting information used for substrate processing monitoring according to the first aspect, wherein in the setting step, among a plurality of image data sequentially acquired by the camera in the setup imaging step, the first image data including the first surveillance target stopped at the first stop position is specified based on a control signal to the moving mechanism.

A third aspect of a method for setting setup information used for substrate processing monitoring is a method for setting setup information used for substrate processing monitoring according to the first or second aspect, wherein in the setup recipe process, a nozzle for supplying a processing liquid to a main surface of a substrate held in the substrate processing device is moved to the first stop position as the first monitoring object.

A fourth aspect of a method for setting setting information used for substrate processing monitoring is a method for setting setting information used for substrate processing monitoring according to the third aspect, wherein in the setup recipe process, the nozzle is sequentially moved to the first stop position and a second stop position different from the first stop position at least in the depth direction as viewed from the camera, and the setting process includes: a detection process for detecting the position and size of the nozzle in the second image data based on second image data acquired by the camera in the setup imaging process and including the nozzle stopped at the second stop position, and the first reference image data; and a judgment area setting process for setting a second relative relationship for defining the position and size of the discharge judgment area for the nozzle in the second image data based on a first relative relationship in which the position and size of the nozzle in the first image data are defined in advance, and a magnification of the size of the nozzle in the second image data with respect to the size of the nozzle in the first image data.

A fifth aspect of a method for setting setting information used for substrate processing monitoring is a method for setting setting information used for substrate processing monitoring according to the first or second aspect, wherein in the setup recipe process, a processing cup surrounding a substrate holding portion in the substrate processing device is moved in a vertical direction as the first monitoring object and stopped at the first stop position.

A sixth aspect of a method for setting setting information used for substrate processing monitoring is a method for setting setting information used for substrate processing monitoring according to any one of the first to third and fifth aspects, wherein, in the setup recipe process, the first monitoring target is sequentially moved to the first stop position and a second stop position different from the first stop position, and, in the setting process, based on second image data acquired in the setup imaging process and including the first monitoring target stopped at the second stop position, and the first reference image data, the position of the first monitoring target in the second image data is detected, and the position is set as an appropriate position with respect to the second stop position.

A seventh aspect of a method for setting setting information used for substrate processing monitoring is a method for setting setting information used for substrate processing monitoring according to any one of the aspects 1 to 6, wherein in the setup recipe process, a second surveillance object, different from the first surveillance object in the substrate processing device, is moved to a third stop position, and in the setting process, based on third image data acquired in the setup imaging process and including the second surveillance object stopped at the third stop position, and second reference image data indicating at least a part of the second surveillance object, a position of the second surveillance object in the third image data is detected, and the position is set as an appropriate position with respect to the third stop position of the second surveillance object.

A first aspect of a monitoring method for a substrate processing apparatus comprises: a setup step for performing a method of setting setting information used for substrate processing monitoring according to any one of aspects 1 to 7; a holding step in which a substrate holding unit in the substrate processing apparatus holds a substrate; a processing recipe step in which the moving mechanism is controlled in a state in which the substrate holding unit holds the substrate to move the first monitoring target to the first stop position; and, in parallel with the processing recipe step, a processing imaging step in which the camera captures an image of the first monitoring target; fourth image data acquired by the camera in the processing imaging step and including the first monitoring target stopped at the first stop position; and a position monitoring step in which the position of the first monitoring target in the fourth image data is detected based on the first reference image data, and whether or not the position is appropriate is judged based on the appropriate position with respect to the first stop position.

A first aspect of a substrate processing device is a substrate processing device that performs processing on a substrate, comprising: a chamber; a moving mechanism that moves a surveillance target within the chamber to a predetermined stop position; a camera that photographs an area including the surveillance target and acquires image data; a storage medium storing reference image data representing at least a part of the surveillance target; the image data acquired by the camera and including the surveillance target stopped at the stop position; and a control unit that detects a position of the surveillance target in the image data based on the reference image data and sets the position as an appropriate position with respect to the stop position.

According to a method for setting setting information used for substrate processing monitoring and a substrate processing device, an appropriate position can be automatically set.

Figure 1 is a diagram schematically showing an example of the overall configuration of a substrate processing device.
Figure 2 is a plan view schematically showing an example of the configuration of a processing unit.
Figure 3 is a side view schematically showing an example of the configuration of a processing unit.
Figure 4 is a plan view schematically showing an example of the movement path of the nozzle.
Figure 5 is a functional block diagram showing an example of the internal configuration of a control unit.
Figure 6 is a flowchart showing an example of the operation of the processing unit.
Figure 7 is a flowchart showing an example of setup processing.
Figure 8 is a diagram schematically showing an example of captured image data.
Figure 9 is a flowchart showing a specific example of surveillance processing.
Figure 10 is a diagram schematically showing an example of captured image data.
Figure 11 is a diagram schematically showing the size of the first nozzle within the captured image data.
Fig. 12 is a diagram schematically showing an example of an ejection judgment area (R1) within captured image data.
Figure 13 is a flowchart showing an example of check processing.

Hereinafter, the embodiment will be described with reference to the attached drawings. In addition, the drawings are schematic representations, and for the convenience of explanation, appropriately, the configuration is omitted or simplified. In addition, the mutual relationship between the size and position of the configurations shown in the drawings is not necessarily described accurately, and may be appropriately changed.

In addition, in the descriptions given below, identical components are depicted with the same symbols, and their names and functions are also identical. Therefore, detailed descriptions of these may be omitted in order to avoid duplication.

In addition, in the description described below, even if ordinal numbers such as “first” or “second” are used, these terms are used for convenience in order to facilitate understanding of the contents of the embodiment, and are not limited to the order that may occur by these ordinals.

Expressions expressing relative or absolute positional relationships (e.g., “in one direction,” “along one direction,” “parallel,” “orthogonal,” “centered,” “concentric,” “coaxial,” etc.) are intended to strictly express the positional relationship, unless otherwise specified, as well as to express a state of relative angular or distance displacement within a range in which tolerance or the same level of function is obtained. Expressions expressing the same state (e.g., “identical,” “same,” “homogeneous,” etc.) are intended to express not only a quantitatively strictly identical state, unless otherwise specified, but also a state in which there is a difference in which tolerance or the same level of function is obtained. Expressions expressing a shape (e.g., “rectangular shape” or “cylindrical shape”) are intended to express the shape geometrically strictly, unless otherwise specified, as well as to express a shape having, for example, unevenness or chamfering, within a range in which the same level of effect is obtained. The expressions "provide," "equip," "include," or "have" a component are not exclusive expressions that exclude the presence of other components. The expression "at least one of A, B, and C" includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

＜Overall configuration of the substrate processing device＞

Fig. 1 is a schematic plan view for explaining an example of the layout of the inside of a substrate processing device (100) according to the present embodiment. As shown in the example in Fig. 1, the substrate processing device (100) is a single-wafer processing device that processes substrates (W) as processing targets one at a time.

The substrate processing device (100) according to the present embodiment performs a cleaning process on a substrate (W), which is a silicon substrate in the shape of a circular thin plate, using a rinsing solution such as a chemical solution or pure water, and then performs a drying process.

Examples of the above-mentioned medicinal solutions used include a mixture of ammonia and hydrogen peroxide solution (SC1), a mixture of hydrochloric acid and hydrogen peroxide solution (SC2), or dihydrofluoric acid (DHF) solution.

In the following description, chemicals, rinses, and organic solvents are collectively referred to as “treatment liquids.” In addition, chemicals for removing unnecessary films, or chemicals for etching, as well as cleaning treatments, are also included in the “treatment liquids.”

The substrate processing device (100) is equipped with a plurality of processing units (1), a load port (LP), an indexer robot (102), a main transport robot (103), a control unit (9), and a user interface (90).

As illustrated in Fig. 1, a plurality of load ports (LP) are arranged in a row. A carrier (C) is loaded into each load port (LP). As the carrier (C), a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical InterFace) pod that stores a substrate (W) in a sealed space, or an OC (Open Cassette) that exposes the substrate (W) to the outside air may be employed. In addition, the indexer robot (102) transports the substrate (W) between the carrier (C) and the main transfer robot (103).

The processing unit (1) performs liquid treatment and drying treatment on one substrate (W). In the substrate processing device (100) according to the present embodiment, 12 processing units (1) having the same configuration are arranged.

Specifically, four towers, each including three processing units (1) stacked vertically, are arranged to surround the main transport robot (103).

In Fig. 1, one processing unit (1) overlapping in three stages is schematically shown. In addition, the number of processing units (1) in the substrate processing device (100) is not limited to 12, but may be appropriately changed.

The main transfer robot (103) is installed in the center of four towers where the processing units (1) are stacked. The main transfer robot (103) loads the substrate (W) to be processed, which is received from the indexer robot (102), into each processing unit. In addition, the main transfer robot (103) removes the substrate (W) whose processing has been completed from each processing unit (1) and hands it over to the indexer robot (102). The control unit (9) controls the operation of each component of the substrate processing device (100).

The user interface (90) includes a display unit such as a liquid crystal display, and an input device such as a mouse and a keyboard. An operator can input various information into the user interface (90). The user interface (90) outputs the input information to the control unit (9).

Below, one of the 12 processing units (1) mounted on the substrate processing device (100) will be described, but other processing units (1) have the same configuration except that the arrangement relationship of the nozzles is different.

＜Processing Unit＞

Fig. 2 is a plan view schematically showing an example of the configuration of a processing unit (1). Also, Fig. 3 is a longitudinal cross-sectional view schematically showing an example of the configuration of a processing unit (1).

The processing unit (1) includes, within the chamber (10), a spin chuck (20), which is an example of a substrate holding unit, a first nozzle (30), a second nozzle (60), a third nozzle (65), a processing cup (40), and a camera (70).

The chamber (10) includes a side wall (11) extending in a vertical direction, a ceiling wall (12) that closes the upper side of the space surrounded by the side wall (11), and a bottom wall (13) that closes the lower side. The space surrounded by the side wall (11), the ceiling wall (12), and the bottom wall (13) becomes a processing space. In addition, a portion of the side wall (11) of the chamber (10) is provided with an entrance/exit for a main transport robot (103) to load/unload a substrate (W), and a shutter for opening/closing the entrance/exit (both not shown).

A fan filter unit (FFU) (14) is mounted on the ceiling wall (12) of the chamber (10) to further purify the air inside the clean room where the substrate processing device (100) is installed and supply it to the processing space inside the chamber (10). The fan filter unit (14) is equipped with a fan and a filter (e.g., a HEPA (High Efficiency Particulate Air) filter) to introduce air inside the clean room and send it out into the chamber (10), thereby forming a downflow of clean air in the processing space inside the chamber (10). In order to evenly distribute the clean air supplied from the fan filter unit (14), a punching plate having a plurality of blowing holes formed therein may be installed directly below the ceiling wall (12).

The spin chuck (20) maintains the substrate (W) in a horizontal position. The horizontal position is a position in which the normal line of the substrate (W) follows the vertical direction. The spin chuck (20) is provided with a disc-shaped spin base (21) fixed in a horizontal position at the upper end of a rotation axis (24) extending along the vertical direction. A spin motor (22) that rotates the rotation axis (24) is installed below the spin base (21). The spin motor (22) rotates the spin base (21) in a horizontal plane via the rotation axis (24). In addition, a cylindrical cover member (23) is installed to surround the spin motor (22) and the rotation axis (24).

The outer diameter of the disc-shaped spin base (21) is slightly larger than the diameter of the circular substrate (W) held on the spin chuck (20). Therefore, the spin base (21) has an upper surface (21a) facing the entire lower surface of the substrate (W) to be held.

A plurality of chuck pins (26) (four in this embodiment) are installed erectly on the periphery of the upper surface (21a) of the spin base (21). The plurality of chuck pins (26) are arranged at equal intervals (90° intervals in the case of four chuck pins (26) as in this embodiment) along a circumference corresponding to the periphery of a circular substrate (W). Each chuck pin (26) is installed so as to be drivable between a holding position in contact with the periphery of the substrate (W) and an open position away from the periphery of the substrate (W). The plurality of chuck pins (26) are driven in conjunction with a link mechanism (not shown) accommodated in the spin base (21). The spin chuck (20) can maintain the substrate (W) in a horizontal position close to the upper surface (21a) above the spin base (21) by stopping the plurality of chuck pins (26) at their respective contact positions (see FIG. 3), and can release the holding of the substrate (W) by stopping the plurality of chuck pins (26) at their respective open positions.

The cover member (23) covering the spin motor (22) has its lower end fixed to the bottom wall (13) of the chamber (10) and its upper end reaching just below the spin base (21). A flange-shaped member (25) is installed on the upper end of the cover member (23) so as to protrude outwardly almost horizontally from the cover member (23) and extend downwardly. With the spin chuck (20) holding the substrate (W) by the gripping by the plurality of chuck pins (26), the spin motor (22) rotates the rotation axis (24), thereby rotating the substrate (W) around the rotation axis line (CX) along the vertical direction passing through the center of the substrate (W). In addition, the driving of the spin motor (22) is controlled by the control unit (9).

The first nozzle (30) is configured by mounting a discharge head (31) on the tip of a nozzle arm (32). The base side of the nozzle arm (32) is fixedly connected to a nozzle base (33). The nozzle base (33) is rotatable around an axis in the vertical direction by a motor (not shown). As the nozzle base (33) rotates, the first nozzle (30) moves in an arc shape within the space above the spin chuck (20), as indicated by arrow AR34 in Fig. 2. These nozzle arm (32), nozzle base (33), and motor are examples of a nozzle moving mechanism (37) that moves the first nozzle (30).

Fig. 4 is a plan view schematically showing an example of a movement path of the first nozzle (30). As illustrated in Fig. 4, the discharge head (31) of the first nozzle (30) moves along a circumferential direction centered on the nozzle base (33) by the rotation of the nozzle base (33). The first nozzle (30) can stop at an appropriate stop position. In the example of Fig. 4, the first nozzle (30) can stop at each of the central position (P31), the peripheral position (P32), and the standby position (P33).

The central position (P31) is a position where the discharge head (31) is vertically opposite to the center of the substrate (W) held on the spin chuck (20). The first nozzle (30) located at the central position (P31) discharges the treatment liquid onto the upper surface of the rotating substrate (W), thereby supplying the treatment liquid to the entire upper surface of the substrate (W). Accordingly, treatment can be performed on the entire upper surface of the substrate (W).

The standby position (P33) is a position where the discharge head (31) does not face the substrate (W) held on the spin chuck (20) in the vertical direction. A standby pod that accommodates the discharge head (31) of the first nozzle (30) may be installed in the standby position (P33).

The peripheral position (P32) is a position between the central position (P31) and the standby position (P33), and is a position where the discharge head (31) faces the peripheral portion of the substrate (W) held on the spin chuck (20) in the vertical direction. The first nozzle (30) may discharge the processing liquid onto the upper surface of the rotating substrate (W) when positioned at the peripheral position (P32). Accordingly, the processing liquid can be discharged only onto the peripheral portion of the upper surface of the substrate (W), so that only the peripheral portion of the substrate (W) can be processed (so-called bevel processing).

In addition, the first nozzle (30) can also reciprocate between the central position (P31) and the peripheral position (P32) to spray the treatment liquid onto the upper surface of the rotating substrate (W). In this case, the entire upper surface of the substrate (W) can be treated.

The peripheral position (P34) is located on the opposite side of the peripheral position (P32) with respect to the central position (P31), so that the discharge head (31) is positioned in the vertical direction opposite to the peripheral portion of the substrate (W) held on the spin chuck (20). The first nozzle (30) may discharge the processing liquid onto the upper surface of the rotating substrate (W) when positioned at the peripheral position (P34). This also enables the processing liquid to be discharged only onto the peripheral portion of the upper surface of the substrate (W), so that only the peripheral portion of the substrate (W) can be processed (so-called bevel processing).

In addition, the first nozzle (30) can also reciprocate between the central position (P31) and the peripheral position (P34) to spray the treatment liquid onto the upper surface of the rotating substrate (W). In this case, the entire upper surface of the substrate (W) can be treated.

In addition, the nozzle base (33) may include a nozzle lifting mechanism (not shown) that lifts the first nozzle (30). The nozzle lifting mechanism includes, for example, a lifting mechanism such as a ball screw mechanism or an air cylinder. When the nozzle lifting mechanism is installed, the first nozzle (30) can stop at different stop positions in the vertical direction. For example, the first nozzle (30) can stop at a stop position that is vertically higher than the center position (P31).

As illustrated in FIG. 3, the first nozzle (30) is connected to a treatment liquid supply source (36) through a supply pipe (34). A valve (35) is installed in the supply pipe (34). The valve (35) opens and closes the flow path of the supply pipe (34). When the valve (35) is opened, the treatment liquid supply source (36) supplies the treatment liquid to the first nozzle (30) through the supply pipe (34). In addition, the first nozzle (30) may be configured so that a plurality of types of treatment liquids (including at least pure water) are supplied.

In addition, in the processing unit (1) of the present embodiment, in addition to the first nozzle (30), a second nozzle (60) and a third nozzle (65) are installed. The second nozzle (60) and the third nozzle (65) of the present embodiment have the same configuration as the first nozzle (30). That is, the second nozzle (60) is configured by mounting a discharge head (61) on the tip of a nozzle arm (62). The second nozzle (60) moves in an arc shape in the space above the spin chuck (20), as indicated by arrow AR64, by a nozzle base (63) connected to the base side of the nozzle arm (62). The relative positional relationship of the central position (P61), the main position (P62), the standby position (P63), and the main position (P64) located on the movement path of the second nozzle (60) is the same as the relative positional relationship of the central position (P31), the main position (P32), the standby position (P33), and the main position (P34).

Likewise, the third nozzle (65) is configured by mounting a discharge head (66) at the tip of a nozzle arm (67). The third nozzle (65) moves in an arc shape in the space above the spin chuck (20), as indicated by arrow AR69, by a nozzle base (68) connected to the base side of the nozzle arm (67). It moves in an arc shape between the processing position and the standby position outside the processing cup (40). The relative positional relationship of the central position (P66), the peripheral position (P67), the standby position (P68), and the peripheral position (P69) located on the movement path of the third nozzle (65) is the same as the relative positional relationship of the central position (P31), the peripheral position (P32), the standby position (P33), and the peripheral position (P34).

In addition, the second nozzle (60) and the third nozzle (65) may be raised and lowered. For example, the second nozzle (60) and the third nozzle (65) are raised and lowered by a nozzle raising mechanism (not shown) built into the nozzle base (63) and the nozzle base (68).

Each of the second nozzle (60) and the third nozzle (65) is connected to a treatment liquid supply source (not shown) through a supply pipe (not shown) similar to the first nozzle (30). A valve (not shown) is installed in each supply pipe, and the supply/stop of the treatment liquid is switched by opening and closing the valve.

In addition, each of the first nozzle (30), the second nozzle (60), and the third nozzle (65) may be configured to supply multiple types of treatment liquids. In addition, at least one of the first nozzle (30), the second nozzle (60), and the third nozzle (65) may be a two-fluid nozzle that mixes a cleaning liquid such as pure water and a pressurized gas to generate droplets, and sprays the mixed fluid of the droplets and the gas onto the substrate (W). In addition, the number of nozzles installed in the treatment unit (1) is not limited to three, and may be one or more.

The processing cup (40) surrounding the spin chuck (20) includes an inner cup (41), a middle cup (42), and an outer cup (43) that can be independently raised and lowered. The inner cup (41) surrounds the spin chuck (20) and has a shape that is nearly rotationally symmetrical with respect to a rotational axis (CX) passing through the center of a substrate (W) held on the spin chuck (20). This inner cup (41) integrally includes, when viewed in a plan view, a circular bottom portion (44), a cylindrical inner wall portion (45) extending upward from the inner periphery of the bottom portion (44), a cylindrical outer wall portion (46) extending upward from the outer periphery of the bottom portion (44), a first guide portion (47) extending obliquely upward from between the inner wall portion (45) and the outer wall portion (46) and having an upper end that draws a smooth arc toward the center (in the direction approaching the rotational axis (CX) of the substrate (W) held on the spin chuck (20), and a cylindrical middle wall portion (48) extending upward from between the first guide portion (47) and the outer wall portion (46).

The inner wall portion (45) is formed to a length that can be accommodated while maintaining an appropriate gap between the cover member (23) and the flange-shaped member (25) when the inner cup (41) is in the most elevated state. The middle wall portion (48) is formed to a length that can be accommodated while maintaining an appropriate gap between the second guide portion (52) described later of the middle cup (42) and the treatment liquid separation wall (53) when the inner cup (41) and the middle cup (42) are in the closest state.

The first guide section (47) has an upper portion (47b) that extends obliquely upward toward the center (in the direction approaching the rotation axis (CX) of the substrate (W)) while drawing a smooth arc. In addition, a disposal groove (49) for collecting and discarding used treatment liquid is formed between the inner wall section (45) and the first guide section (47). An annular inner recovery groove (50) is formed between the first guide section (47) and the middle wall section (48) for collecting and recovering used treatment liquid. In addition, an annular outer recovery groove (51) is formed between the middle wall section (48) and the outer wall section (46) for collecting and recovering a treatment liquid of a different type from the inner recovery groove (50).

In the waste groove (49), an exhaust mechanism (not shown) is connected for discharging the treatment liquid collected in the waste groove (49) and forcibly exhausting the inside of the waste groove (49). For example, four exhaust mechanisms are installed at equal intervals along the circumferential direction of the waste groove (49). In addition, in the inner recovery groove (50) and the outer recovery groove (51), a recovery mechanism (not shown) is connected for recovering the treatment liquid collected in the inner recovery groove (50) and the outer recovery groove (51), respectively, to a recovery tank installed outside the treatment unit (1). In addition, the bottoms of the inner recovery groove (50) and the outer recovery groove (51) are inclined at a small angle with respect to the horizontal direction, and the recovery mechanism is connected at the lowest position. Accordingly, the treatment liquid flowing into the inner recovery groove (50) and the outer recovery groove (51) is smoothly recovered.

The intermediate cup (42) has a shape that is almost rotationally symmetrical with respect to the rotation axis (CX) that surrounds the spin chuck (20) and passes through the center of the substrate (W) held on the spin chuck (20). This intermediate cup (42) integrally includes a second guide member (52) and a cylindrical treatment liquid separation wall (53) connected to the second guide member (52).

The second guide portion (52) has a lower portion (52a) that forms a cylindrical shape coaxial with the lower portion of the first guide portion (47) on the outer side of the first guide portion (47) of the inner cup (41), an upper portion (52b) that extends obliquely upward from the upper end of the lower portion (52a) in a smooth arc toward the center (in the direction approaching the rotational axis (CX) of the substrate (W)), and a folded portion (52c) that is formed by folding the tip of the upper portion (52b) downward. The lower portion (52a) is accommodated in the inner recovery groove (50) while maintaining an appropriate gap between the first guide portion (47) and the middle wall portion (48) when the inner cup (41) and the middle cup (42) are in the closest proximity. In addition, the upper portion (52b) is installed so as to overlap with the upper portion (47b) of the first guide portion (47) of the inner cup (41) in the vertical direction, and approaches the upper portion (47b) of the first guide portion (47) while maintaining a very small gap when the inner cup (41) and the middle cup (42) are in the closest proximity. In addition, the folded portion (52c) formed by folding the tip of the upper portion (52b) downward is of a length such that the folded portion (52c) horizontally overlaps with the tip of the upper portion (47b) of the first guide portion (47) when the inner cup (41) and the middle cup (42) are in the closest proximity.

In addition, the upper part (52b) of the second guide part (52) is formed so that the thickness increases toward the bottom, and the treatment liquid separation wall (53) has a cylindrical shape installed so as to extend downward from the lower outer periphery of the upper part (52b). The treatment liquid separation wall (53) is accommodated in the outer recovery groove (51) by maintaining an appropriate gap between the middle wall part (48) and the outer cup (43) while the inner cup (41) and the middle cup (42) are in the closest proximity.

The outer cup (43) has a shape that is almost rotationally symmetrical with respect to the rotational axis (CX) passing through the center of the substrate (W) held on the spin chuck (20) and surrounding the spin chuck (20) on the outside of the second guide portion (52) of the middle cup (42). This outer cup (43) functions as a third guide portion. The outer cup (43) has a lower portion (43a) that forms a cylindrical shape coaxial with the lower portion (52a) of the second guide portion (52), an upper portion (43b) that extends obliquely upward from the upper end of the lower portion (43a) in a smooth arc toward the center (in the direction approaching the rotational axis (CX) of the substrate (W)), and a bent portion (43c) that is formed by bending the tip of the upper portion (43b) downward.

The lower portion (43a) is accommodated in the outer recovery groove (51) while maintaining an appropriate gap between the treatment liquid separation wall (53) of the middle cup (42) and the outer wall (46) of the inner cup (41) when the inner cup (41) and the outer cup (43) are in the closest proximity. In addition, the upper portion (43b) is installed so as to overlap with the second guide portion (52) of the middle cup (42) in the vertical direction, and is brought into close proximity while maintaining a very small gap with respect to the upper portion (52b) of the second guide portion (52) when the middle cup (42) and the outer cup (43) are in the closest proximity. In addition, the bending portion (43c) formed by bending the tip of the upper portion (43b) downward is formed so that the bending portion (43c) overlaps horizontally with the bending portion (52c) of the second guide portion (52) when the middle cup (42) and the outer cup (43) are closest to each other.

In addition, the inner cup (41), the middle cup (42), and the outer cup (43) are independently liftable. That is, the inner cup (41), the middle cup (42), and the outer cup (43) are each individually provided with a cup moving mechanism (59), and thus are lifted separately and independently. As such a cup moving mechanism (59), various known mechanisms such as a ball screw mechanism or an air cylinder can be employed, for example.

The partition plate (15) is installed to divide the inner space of the chamber (10) into upper and lower parts around the processing cup (40). The partition plate (15) may be a single plate-shaped member surrounding the processing cup (40), or may be a plurality of plate-shaped members joined together. In addition, the partition plate (15) may have a through hole or a cut formed therein in the thickness direction, and in the present embodiment, a through hole is formed to pass through a support shaft for supporting the nozzle base (33) of the first nozzle (30), the nozzle base (63) of the second nozzle (60), and the nozzle base (68) of the third nozzle (65).

The outer circumference of the partition plate (15) is connected to the side wall (11) of the chamber (10). In addition, the end portion surrounding the treatment cup (40) of the partition plate (15) is formed to have a circular shape with a diameter larger than the outer diameter of the outer cup (43). Therefore, the partition plate (15) does not obstruct the lifting and lowering of the outer cup (43).

In addition, an exhaust duct (18) is installed in a part of the side wall (11) of the chamber (10) and near the bottom wall (13). The exhaust duct (18) is connected to an exhaust mechanism (not shown). Among the clean air supplied from the fan filter unit (14) and flowing through the chamber (10), the air that passes between the treatment cup (40) and the partition plate (15) is discharged outside the device through the exhaust duct (18).

The camera (70) is installed inside the chamber (10) and above the partition plate (15). The camera (70) includes, for example, a CCD (Charge Coupled Device), which is one of the solid-state imaging elements, and an optical system such as a lens. The camera (70) is installed to monitor a surveillance target inside the chamber (10), which will be described later. A specific example of the surveillance target will be described in detail later. The camera (70) is positioned at a position that includes the surveillance target in the imaging area. This imaging area includes, for example, a substrate (W) and a space above the substrate (W). The camera (70) captures an imaging area to acquire imaging image data, and sequentially outputs the acquired imaging image data to the control unit (9).

As shown in Fig. 3, a lighting unit (71) is installed in the chamber (10) at a position higher than the partition plate (15). If the chamber (10) is a dark room, the control unit (9) may control the lighting unit (71) so that the lighting unit (71) irradiates light when the camera (70) takes a picture.

The hardware configuration of the control unit (9) installed in the substrate processing device (100) is the same as that of a general computer. That is, the control unit (9) is configured to include a processing unit such as a CPU that performs various types of arithmetic processing, a temporary storage medium such as a ROM (Read Only Memory) that is a read-only memory that stores a basic program, a RAM (Random Access Memory) that is a read-write memory that stores various types of information, and a non-transitory storage medium such as a magnetic disk that stores control software or data, etc. When the CPU of the control unit (9) executes a predetermined processing program, each operating mechanism of the substrate processing device (100) is controlled by the control unit (9), and processing in the substrate processing device (100) progresses. In addition, the control unit (9) may be realized by a dedicated hardware circuit that does not require software to realize its function.

Fig. 5 is a functional block diagram schematically showing an example of the internal configuration of a control unit (9). The control unit (9) includes a monitoring processing unit (91), a setup unit (92), and a processing control unit (93).

The processing control unit (93) controls each component within the chamber (10). Specifically, the processing control unit (93) controls the spin motor (22), various valves such as valves (35, 82), the motor of the nozzle base (33, 63, 68), the nozzle lifting mechanism, the cup moving mechanism (59), and the fan filter unit (14). By the processing control unit (93) controlling these components according to a predetermined sequence, the processing unit (1) can perform processing on the substrate (W).

The surveillance processing unit (91) performs surveillance processing on the surveillance target based on the captured image data acquired by the camera (70) by capturing the inside of the chamber (10). The surveillance processing unit (91) monitors the position of the surveillance target. As the surveillance target, various nozzles such as the first nozzle (30), the second nozzle (60), and the third nozzle (65) can be employed. In addition, the surveillance processing unit (91) may monitor the discharge status of the treatment liquid from various nozzles. A specific example of the surveillance processing will be described in detail later.

The setup unit (92) sets processing information used for monitoring processing. For example, the setup unit (92) sets the appropriate position of the monitoring target in the captured image data (hereinafter referred to as the set coordinate position). In addition, the setup unit (92) can also set a judgment area for monitoring the discharge status of the processing liquid of each nozzle in the captured image data. An example of a specific setting method will be described in detail later.

＜Example of the flow of substrate processing＞

＜Overall Flow＞

Fig. 6 is a flow chart showing an example of the flow of substrate processing. First, the main transfer robot (103) loads an unprocessed substrate (W) into the processing unit (1) (step S1: loading process). Next, the spin chuck (20) maintains the substrate (W) in a horizontal position (step S2: holding process). Specifically, the plurality of chuck pins (26) move to their respective contact positions, so that the plurality of chuck pins (26) maintain the substrate (W).

Next, the spin motor (22) starts to rotate the substrate (W) (step S3: rotation process). Specifically, the spin motor (22) rotates the spin chuck (20), thereby rotating the substrate (W) held on the spin chuck (20). Next, the cup lifting mechanism raises the processing cup (40) (step S4: cup lifting process). Accordingly, the processing cup (40) stops at the upper position.

Next, the treatment liquid is sequentially supplied to the substrate (W) (step S5: treatment recipe process). In addition, in this treatment recipe process (step S5), the cup moving mechanism (59) switches the cup to be raised appropriately depending on the type of the treatment liquid supplied to the substrate (W), but for the sake of simplicity, the explanation thereof is omitted below.

In the treatment recipe process (step S5), the first nozzle (30), the second nozzle (60), and the third nozzle (65) sequentially eject the treatment liquid onto the upper surface of the rotating substrate (W), as needed. Here, as an example, the first nozzle (30) and the second nozzle (60) eject the treatment liquid in sequence. First, the nozzle moving mechanism (37) moves the first nozzle (30) from the standby position (P33) to the central position (P31). Next, the valve (35) opens, thereby ejecting the treatment liquid onto the upper surface of the substrate (W) from the first nozzle (30). The treatment liquid that has landed on the upper surface of the substrate (W) spreads under centrifugal force and flies outward from the periphery of the substrate (W). Accordingly, treatment according to the treatment liquid can be performed on the upper surface of the substrate (W). For example, when a predetermined time has elapsed since the start of supply of the treatment liquid, the valve (35) closes. Accordingly, the discharge of the treatment liquid from the first nozzle (30) stops. Next, the nozzle moving mechanism (37) moves the first nozzle (30) from the central position (P31) to the standby position (P33).

Subsequently, the nozzle moving mechanism (nozzle base (63)) moves the second nozzle (60) from the standby position (P63) to the central position (P61). Next, the valve for the second nozzle (60) opens, so that the treatment liquid is discharged from the second nozzle (60) onto the upper surface of the substrate (W). The treatment liquid that has landed on the upper surface of the substrate (W) spreads under centrifugal force and flies outward from the periphery of the substrate (W). The treatment liquid is, for example, a rinse liquid such as pure water. In this case, the rinse liquid washes away the treatment liquid on the upper surface of the substrate (W), and the treatment liquid on the upper surface of the substrate (W) is replaced by the rinse liquid. For example, when a predetermined time has elapsed since the start of supplying the rinse liquid, the valve closes. Accordingly, the discharge of the rinse liquid from the second nozzle (60) stops. Next, the nozzle anticipation (63) moves the second nozzle (60) from the central position (P61) to the standby position (P63).

The first nozzle (30), the second nozzle (60), and the third nozzle (65) may sequentially move to predetermined stop positions as needed to discharge the treatment liquid. When discharge of the treatment liquid from the first nozzle (30), the second nozzle (60), and the third nozzle (65) is completed, the treatment recipe process (step S5) is completed.

Referring again to Fig. 6, after the end of the processing recipe process (step S5), the processing unit (1) dries the substrate (W) (step S6: drying process). For example, the spin motor (22) increases the rotation speed of the substrate (W) to dry the substrate (W) (so-called spin drying).

Next, the cup moving mechanism (59) lowers the processing cup (40) (step S7: cup lowering process).

Next, the spin motor (22) terminates the rotation of the spin chuck (20) and the substrate (W), and the spin chuck (20) releases the holding of the substrate (W) (step S8: holding release process). Specifically, the holding is released by moving a plurality of chuck pins (26) to their respective open positions.

Next, the main transport robot (103) removes the substrate (W) on which processing has been completed from the processing unit (1) (step S9: removal process).

In this manner, processing of the substrate (W) is performed.

＜Subject of surveillance＞

＜Nozzle location＞

In the above-described treatment recipe process (step S5), the first nozzle (30), the second nozzle (60), and the third nozzle (65) are appropriately moved as needed. For example, the first nozzle (30) moves from the standby position (P33) to the central position (P31). At this time, due to various factors such as a motor abnormality of the nozzle base (33), the first nozzle (30) may be deviated from the central position (P31) and stop. In this case, the treatment based on the treatment liquid from the first nozzle (30) may be improperly terminated.

So, the nozzle position is monitored. Below, the nozzle position monitoring is described.

＜Setup Processing＞

First, setup processing for setting setup information used for monitoring processing is described. This setup processing is performed, for example, when a substrate processing device (100) is installed at an installation location (e.g., a factory). Fig. 7 is a flowchart showing an example of setup processing.

First, the worker inputs necessary information into the user interface (90) (step S11: input process). For example, the worker inputs the first nozzle (30), the second nozzle (60), and the third nozzle (65) as the objects to be monitored, and inputs the multiple positions as the stop positions of each nozzle. For example, the worker inputs multiple stop positions, such as the center position (P31), the peripheral position (P32), and the peripheral position (P34), as the stop positions of the first nozzle (30). The same applies to the second nozzle (60) and the third nozzle (65). In addition, the number of stop positions may be changed as appropriate.

Next, the operator makes an input to the user interface (90) indicating the start of setup.

The processing control unit (93) causes the camera (70) to start shooting in response to the input of the instruction (step S12: start of setup shooting process). The camera (70) shoots a shooting area to acquire shooting image data, and outputs the shooting image data to the control unit (9).

In addition, the processing control unit (93) controls the nozzle movement mechanism in response to the input of the instruction to sequentially move the first nozzle (30), the second nozzle (60), and the third nozzle (65) to the respective stop positions (step S12: setup recipe process). For example, the nozzle movement mechanism (37) sequentially stops the first nozzle (30) at the peripheral position (P32), the central position (P31), and the peripheral position (P34). Specifically, first, the nozzle moving mechanism (37) moves the first nozzle (30) from the standby position (P33) to the peripheral position (P32), stops it at the peripheral position (P32) over a predetermined period of time, then moves the first nozzle (30) from the peripheral position (P32) to the central position (P31), stops it at the central position (P31) over a predetermined period of time, then moves the first nozzle (30) from the central position (P31) to the peripheral position (P34), and stops it at the peripheral position (P34) over a predetermined period of time. The nozzle moving mechanism (37) stops the first nozzle (30) at all input stop positions and then moves it to the standby position (P33). Then, the processing control unit (93) similarly stops the second nozzle (60) at all stop positions in sequence, and then stops the third nozzle (65) at all stop positions in sequence.

In addition, the processing control unit (93) may store in the storage medium the time at which each nozzle is stopped at each stop position in the setup recipe process. For example, the processing control unit (93) stores the time at which the control signal for stopping the first nozzle (30) at the center position (P31) is output to the nozzle moving mechanism (37). Similarly, the processing control unit (93) also stores in the storage medium the time at which the control signals for each of the peripheral position (P32) and the peripheral position (P34) are output. The same applies to the second nozzle (60) and the third nozzle (65).

When the setup recipe process is completed, the camera (70) ends shooting (step S14: end of setup shooting process).

Since the setup shooting process is performed in parallel with the setup recipe process, the camera (70) can capture images of the first nozzle (30), the second nozzle (60), and the third nozzle (65). That is, the plurality of captured image data acquired by the camera (70) include each of the first nozzle (30), the second nozzle (60), and the third nozzle (65) stopped at each stop position.

Fig. 8 is a diagram schematically showing an example of captured image data acquired in a setup shooting process. The captured image data of Fig. 8 includes the ejection head (31) of the first nozzle (30) that stops at the central position (P31). That is, Fig. 8 shows captured image data acquired when the first nozzle (30) stops at the central position (P31).

Next, the setup unit (92) specifies, from the plurality of captured image data, captured image data (hereinafter, referred to as setting image data) including each nozzle stopped at each stop position (step S15: setting image data specifying process). For example, the setup unit (92) specifies the setting image data including the first nozzle (30) stopped at the central position (P31) based on the control signal output to the nozzle moving mechanism (37). That is, the setup unit (92) reads, from the storage medium, the time at which the control signal for moving the first nozzle (30) to the central position (P31) is output, and, based on the time and the acquisition time of the captured image data by the camera (70), specifies the setting image data including the first nozzle (30) stopped at the central position (P31). Since the time from when the control signal is output until the first nozzle (30) stops at the central position (P31) is determined in advance, the setup unit (92) can obtain the period during which the first nozzle (30) stops at the central position (P31) based on the time at which the control signal is output. The setup unit (92) specifies the captured image data having the acquisition time included in the period as the setup image data.

The setup section (92) specifies setup image data including the first nozzle (30) stopped at each of the other stop positions, setup image data including the second nozzle (60) stopped at each of the stop positions, and setup image data including the third nozzle (65) stopped at each of the stop positions. If the number of stop positions for each nozzle is the same, in the setup image data specifying process, setup image data of (the number of nozzles) × (the number of stop positions) are specified.

In addition, in the setup recipe process (step S13), a substrate (W) for setting may be loaded into the processing unit (1). In the example of Fig. 8, the captured image data includes a substrate (W) for setting held by a spin chuck (20). However, in the setup recipe process, the substrate (W) for setting does not necessarily have to be loaded.

In addition, in the setup recipe process, the cup moving mechanism (59) may raise the processing cup (40). In the example of Fig. 8, the setup image data shows the processing cup (40) in an elevated state. However, in the setup recipe process, the processing cup (40) does not necessarily have to be raised.

Next, the setup unit (92) interprets the setting image data, detects the coordinate position of the nozzle in the setting image data, and sets the coordinate position as the setting coordinate position (step S17: position setting process). For example, the setup unit (92) detects the coordinate position of the first nozzle (30) in the setting image data by template matching of the setting image data (Fig. 8) including the first nozzle (30) stopped at the center position (P31) and the reference image data (RI1) indicating the first nozzle (30) (specifically, the ejection head (31)) stored in the storage medium in advance. In addition, in the example of Fig. 8, the reference image data (RI1) is schematically shown as a virtual line overlapping the captured image data.

The setup unit (92) sets the detected coordinate position as a set coordinate position for the central position (P31). Specifically, the setup unit (92) stores the set coordinate position for the central position (P31) in a storage medium.

In addition, the setup unit (92) detects the coordinate position of the first nozzle (30) in the setup image data by template matching of the setup image data including the first nozzle (30) stopped at each of the other stop positions and the reference image data (RI1), and sets the coordinate position as the setup coordinate position for the stop position. In addition, the setup unit (92) detects the coordinate position of the second nozzle (60) based on the setup image data including the second nozzle (60) stopped at each of the stop positions and the reference image data indicating a part of the second nozzle (60), and sets the coordinate position as the setup coordinate position for the stop position. In addition, the setup unit (92) also sequentially sets the setup coordinate positions for the respective stop positions of the third nozzle (65) in the same manner.

Accordingly, the set coordinate positions for each stop position of the first nozzle (30), the set coordinate positions for each stop position of the second nozzle (60), and the set coordinate positions for each stop position of the third nozzle (65) are set.

Additionally, in the example of Fig. 7, step S17 (judgment area setting process) is also executed, but this processing will be described later.

As described above, according to the setup processing, the setup unit (92) automatically specifies the setting image data from the plurality of captured image data, and automatically sets the setting coordinate position of the surveillance target within the setting image data. Therefore, the worker does not need to manually specify the setting image data by recognizing the plurality of captured image data, and also does not need to manually specify the coordinate position of the first nozzle (30) within the setting image data. Therefore, the burden on the worker can be reduced, and the work time required for setup can be shortened. In addition, the deviation of the setting due to the deviation of the proficiency level of the worker can also be avoided.

In addition, according to the setup processing, the setup unit (92) automatically and sequentially specifies all of the setting image data for each stop position of each nozzle in response to, for example, an input of a setup start instruction by a worker. For comparison, it is also conceivable that the input for specifying the setting image data is performed for each stop position of each nozzle. For example, it is also conceivable that the setup unit (92) specifies the setting image data including the first nozzle (30) stopping at the center position (P31) in response to an input for specifying the setting image data, and specifies the setting image data including the first nozzle (30) stopping at the peripheral position (P32) in response to an input for specifying the setting image data. However, such input is a burden to the worker and lengthens the work time. In contrast, in the above-described example, since all of the setting image data is specified with a single input, the number of inputs by the worker can be reduced, and the work time can be shortened. In addition, when the setup unit (92) performs a specific process of setting image data by triggering the end of the setup shooting process, the number of inputs by the operator can be further reduced.

In addition, the setup unit (92) sequentially sets all of the set coordinate positions for each stop position of each nozzle, for example, in response to a single input. Therefore, the number of inputs by the operator can be reduced, and the work time can be shortened. In addition, when the setup unit (92) performs the position setting process by triggering the end of a specific process of the set image data, the number of inputs by the operator can be further reduced.

In addition, in the setup process, it is okay to appropriately employ the input of the worker as a trigger. For example, the setup image data specific process may be started by using an input instruction by the worker as a trigger. For example, the setup unit (92) notifies the worker of the end of the setup imaging process through the user interface (90), and the worker, upon receiving the notification, inputs an instruction to start the setup image data specific process to the user interface (90). The setup unit (92) may perform the setup image data specific process in response to the input of the instruction.

In addition, the position setting process (step S16) may also be started by a trigger input instruction from a worker. For example, the setup unit (92) notifies the worker of the end of the setting image data specific process through the user interface (90), and the worker receives the notification and inputs an instruction to start the position setting process to the user interface (90). The setup unit (92) may perform the setting image data specific process in response to the input of the instruction.

＜Surveillance Processing＞

Next, an example of a monitoring process performed in parallel with the processing recipe process (step S5) will be described. Fig. 9 is a flowchart showing an example of the monitoring process. The camera (70) sequentially captures images of an imaging area in parallel with the processing recipe process to acquire captured image data (step S21: processing imaging process). In the above-described example, in the processing recipe process, the first nozzle (30) ejects the processing liquid onto the upper surface of the substrate (W) at the central position (P31), and then the second nozzle (60) ejects the processing liquid (e.g., rinse liquid) onto the upper surface of the substrate (W) at the central position (P61).

The monitoring processing unit (91) monitors the position of each nozzle based on the captured image data acquired by the processing imaging process (step S22: position monitoring process). Specifically, first, the monitoring processing unit (91) receives information indicating the processing sequence from the processing control unit (93) and specifies the period during which the first nozzle (30) moves from the standby position (P33) to the central position (P31) based on the information. The monitoring processing unit (91) detects the coordinate position of the first nozzle (30) in the captured image data by template matching of the captured image data acquired during the period and the reference image data (RI1) stored in the storage medium. If the coordinate position of the first nozzle (30) is substantially constant in the plurality of captured image data, it can be determined that the first nozzle (30) is stopped at the central position (P31), and the coordinate position corresponds to the stop coordinate position of the first nozzle (30).

Next, the monitoring processing unit (91) reads the set coordinate position for the central position (P31) from the storage medium, and determines whether the position of the first nozzle (30) is appropriate based on the detected stop coordinate position of the first nozzle (30) and the set coordinate position. Specifically, the monitoring processing unit (91) determines whether the difference between the stop coordinate position and the set coordinate position is less than or equal to a tolerance. The tolerance is, for example, set in advance and stored in the storage medium.

If the difference is less than the allowable value, the monitoring processing unit (91) determines that the first nozzle (30) is properly stopped at the center position (P31). On the other hand, if the difference is greater than the allowable value, the monitoring processing unit (91) determines that the first nozzle (30) is stopped at a position that is displaced from the center position (P31). In other words, the monitoring processing unit (91) detects a nozzle position abnormality for the first nozzle (30). The monitoring processing unit (91) may notify the worker of the nozzle position abnormality of the first nozzle (30) through the user interface (90). In addition, at this time, the processing control unit (93) may stop processing the substrate (W).

The monitoring processing unit (91) also monitors the position of the second nozzle (60) through the same processing as described above. In addition, in the processing recipe process (step S5), when the third nozzle (65) ejects the processing liquid onto the upper surface of the substrate (W), the monitoring processing unit (91) also monitors the position of the third nozzle (65) through the same processing.

As described above, the monitoring processing unit (91) can monitor the position of each nozzle in the processing recipe process.

＜Discharge Monitoring＞

In the example of Fig. 9, the monitoring processing unit (91) monitors the discharge status of the treatment liquid from each nozzle in the treatment recipe process (step S5) based on the captured image data (step S23: discharge monitoring process). Hereinafter, the first nozzle (30) will be described as an example.

First, the monitoring processing unit (91) sets a discharge determination area (R1) (see Fig. 8) in the captured image data. The discharge determination area (R1) is an area that includes an area lower than the tip of the first nozzle (30) in the captured image data, and is an area that includes the processing liquid discharged from the tip of the first nozzle (30).

The relative positional relationship of the discharge judgment area (R1) with respect to the coordinate position of the first nozzle (30) is preset and stored in a storage medium. In addition, the discharge judgment area (R1) is preset to a predetermined size, for example, in the shape of a rectangle extending in the vertical direction. The relative relationship (hereinafter referred to as the set relative relationship) representing such a positional relationship, shape, and size is stored in a storage medium.

The monitoring processing unit (91) sets the discharge determination area (R1) based on the stationary coordinate position of the first nozzle (30) detected by the template matching of the technology and the set relative relationship stored in the storage medium. Accordingly, even if the coordinate position of the first nozzle (30) slightly fluctuates within the captured image data, the discharge determination area (R1) is set according to the coordinate position. Accordingly, the discharge determination area (R1) is set so that the processing liquid discharged from the tip of the first nozzle (30) is appropriately included.

Fig. 10 is a diagram schematically showing another example of captured image data acquired in the processing imaging process (step S21). The captured image data of Fig. 10 includes the ejection head (31) of the first nozzle (30) ejecting the processing liquid at the central position (P31). That is, Fig. 10 shows captured image data acquired when the first nozzle (30) is ejecting the processing liquid at the central position (P31).

As can be understood from the comparison of FIGS. 8 and 10, the pixel values within the discharge determination area (R1) are different when the first nozzle (30) discharges the treatment liquid and when the first nozzle (30) is not discharged the treatment liquid. For example, the total sum of the pixel values within the discharge determination area (R1) when the first nozzle (30) is discharged the treatment liquid is greater than the total sum of the pixel values within the discharge determination area (R1) when the first nozzle (30) is not discharged the treatment liquid.

Therefore, the monitoring processing unit (91) determines whether the first nozzle (30) is discharging the treatment liquid based on the pixel values within the discharge determination area (R1). As a specific example, the monitoring processing unit (91) determines whether the total sum of the pixel values within the discharge determination area (R1) is equal to or greater than a predetermined discharge reference value, and determines that the first nozzle (30) is discharging the treatment liquid when the total sum is equal to or greater than the discharge reference value. In addition, the monitoring processing unit (91) determines that the first nozzle (30) is not discharging the treatment liquid when the total sum is less than the discharge reference value.

In addition, the determination of whether or not the treatment liquid is discharged based on the pixel values within the discharge determination area (R1) is not limited to this, and various methods can be adopted. For example, the dispersion of the pixel values within the discharge determination area (R1) when the first nozzle (30) is discharging the treatment liquid is larger than the dispersion when the first nozzle (30) is not discharging the treatment liquid. Therefore, the monitoring processing unit (91) may calculate the dispersion and determine whether or not the treatment liquid is discharged based on the size of the dispersion. In addition, it is also possible to adopt the standard deviation instead of the dispersion.

The monitoring processing unit (91) can detect the start timing at which the first nozzle (30) starts discharging the treatment liquid, and the end timing at which the first nozzle (30) ends discharging the treatment liquid, by performing the above-described processing on each of the captured image data sequentially acquired by the camera (70). In addition, the monitoring processing unit (91) can calculate the discharge time at which the treatment liquid is discharged based on the start timing and the end timing, and monitor whether the discharge time has reached a specified time. Specifically, when the difference between the discharge time and the specified time is an allowable time or longer, it is determined that a discharge abnormality has occurred. The allowable time is, for example, set in advance and stored in a storage medium.

The monitoring processing unit (91) monitors the discharge status of the treatment liquid from the second nozzle (60) and the third nozzle (65) as needed by the same processing. For example, in the treatment recipe process (step S5), when the second nozzle (60) also discharges the treatment liquid at the central position (P61), the monitoring processing unit (91) also monitors the discharge status of the treatment liquid from the second nozzle (60).

In addition, in the processing recipe process (step S5), there may be a case where the first nozzle (30) discharges the processing liquid at the peripheral position (P32). In this case, the monitoring processing unit (91) monitors the discharge status of the processing liquid of the first nozzle (30) at the peripheral position (P32). Specifically, first, the monitoring processing unit (91) specifies the period during which the first nozzle (30) moves to the peripheral position (P32) based on information indicating the processing sequence received from the processing control unit (93). The monitoring processing unit (91) specifies the captured image data that stops at the peripheral position (P32) from the captured image data acquired during the period, and detects the stop coordinate position of the first nozzle (30) within the captured image data. And, the monitoring processing unit (91) sets a discharge judgment area (R1) based on the stationary coordinate position of the first nozzle (30) and the set relative relationship stored in the storage medium, and monitors the discharge status of the processing liquid based on the pixel value within the discharge judgment area (R1).

Even when the second nozzle (60) and the third nozzle (65) each discharge the treatment liquid at an appropriate stop position, the monitoring processing unit (91) monitors the discharge status of the treatment liquid from each of the second nozzle (60) and the third nozzle (65) in the same manner.

＜Judgment Area＞

However, the sizes in the captured image data of the first nozzle (30) stopped at the first stop position and the second stop position may be different from each other. Specifically, when the first stop position and the second stop position are misaligned in the depth direction as viewed from the camera (70), the sizes in the captured image data of the first nozzle (30) are different from each other. For example, in the depth direction of the camera (70), the center position (P31), the peripheral position (P32), and the peripheral position (P34) are different from each other. Therefore, the sizes in the captured image data of the first nozzle (30) stopped at the center position (P31), the peripheral position (P32), and the peripheral position (P32) are different from each other.

Fig. 11 is a diagram showing the difference in size within the captured image data of the first nozzle (30). In Fig. 11, the first nozzle (30) on the right is larger than the first nozzle (30) on the left. That is, the first nozzle (30) on the right represents the first nozzle (30) stopped at a position closer to the camera (70) in the depth direction, and the first nozzle (30) on the left represents the first nozzle (30) stopped at a position farther from the camera (70) in the depth direction.

Since the first nozzle (30) on the left is stopped at a stationary position farther from the camera (70), the treatment liquid discharged from the tip of the first nozzle (30) on the left appears smaller in the captured image data. Conversely, since the first nozzle (30) on the right is stopped at a stationary position closer to the camera (70), the treatment liquid discharged from the tip of the first nozzle (30) on the right appears larger in the captured image data.

In such captured image data, if the position and size of the discharge judgment area (R1) are set regardless of the stop position, that is, regardless of the size of the first nozzle (30), the discharge judgment area (R1) may be deviated from the appropriate position for the processing liquid, or may be too large compared to the size of the processing liquid. In Fig. 11, the distance between the tip of the first nozzle (30) on the left and the upper end of the discharge judgment area (R1) is the same as the distance between the tip of the first nozzle (30) on the right and the upper end of the discharge judgment area (R1), and the sizes of both discharge judgment areas (R1) are also the same. In this case, the discharge judgment area (R1) on the left is deviated downward from the appropriate position for the processing liquid, and is also set to be large compared to the size of the processing liquid.

Therefore, it is desirable to set the setting relative relationship indicating the position and size of the discharge judgment area (R1) for the first nozzle (30) for each stop position.

＜Judgment Area Setting Process＞

In an example of the setup processing of Fig. 7, a judgment area setting process (step S17) is executed after a position setting process (step S16). In this judgment area setting process, the setup unit (92) sets a setting relative relationship representing a geometrical relative relationship (position and size) between the setting coordinate position of each nozzle and the discharge judgment area (R1) for each stop position of each nozzle.

However, the setting relative relationship with respect to the center position (P31) of the first nozzle (30) is set in advance and stored in the storage medium. This setting relative relationship is manually set by the operator, for example, as follows. For example, the operator makes an input for instructing display of setting image data including the first nozzle (30) stopped at the center position (P31) to the user interface (90). The control unit (9) responds to the input by causing the user interface (90) to display the setting image data. The operator recognizes the setting image data and makes an input for specifying the position and size of the ejection judgment area (R1) within the setting image data to the user interface (90). The setup unit (92) creates a setting relative relationship representing the geometric relative relationship between the setting coordinate position of the first nozzle (30) in the setting image data and the input ejection judgment area (R1), and stores the setting relative relationship in the storage medium.

The setup unit (92) automatically creates a setting relative relationship corresponding to the first nozzle (30) stopped at another stopping position based on the setting relative relationship with respect to the central position (P31) of the first nozzle (30). Specifically, first, the setup unit (92) detects the size of the first nozzle (30) included in the setting image data including the first nozzle (30) stopped at the peripheral position (P32). For example, the setup unit (92) performs template matching using the setting image data and the reference image data (RI1) of the first nozzle (30). In this template matching, the size of the reference image data (RI1) is sequentially changed to specify an area having a high similarity to the reference image data (RI1) within the setting image data. Accordingly, a magnification (M1) for the reference image data (RI1) of an area corresponding to the reference image data (RI1) in the setting image data can be obtained.

Fig. 12 schematically shows an example of a discharge judgment area (R1) at a central position (P31) and a peripheral position (P32). In Fig. 12, a magnification (M1) of the size of the first nozzle (30) at the peripheral position (P32) relative to the size of the first nozzle (30) at the central position (P31) (i.e., the size of the reference image data (RI1)) is schematically shown by block arrows.

In Fig. 12, since the size of the first nozzle (30) at the main position (P32) is smaller than the size of the first nozzle (30) at the central position (P31), the magnification (M1) is less than 1. However, when the main position (P32) is closer to the camera (70) than the central position (P31), the first nozzle (30) at the main position (P32) appears larger, so the magnification (M1) becomes greater than 1.

The setup unit (92) sets the size of the discharge judgment area (R1) for the main position (P32) to a value obtained by multiplying the size of the discharge judgment area (R1) for the central position (P31) by the magnification (M1). Accordingly, it is possible to set the discharge judgment area (R1) according to the size of the processing liquid in the captured image data.

In addition, the setup unit (92) may also adjust the relative position of the discharge judgment area (R1) with respect to the area of the first nozzle (30). For example, the smaller the magnification (M1), the closer the position of the discharge judgment area (R1) is set to the first nozzle (30). In other words, the smaller the magnification (M1), the higher the discharge judgment area (R1) is set. According to this, the setting relative relationship between the first nozzle (30) and the discharge judgment area (R1) can be appropriately set according to the magnification (M1). The setup unit (92) stores the setting relative relationship with respect to the peripheral position (P32) in a storage medium.

The same applies to other stopping positions of the first nozzle (30), and also to the second nozzle (60) and the third nozzle (65).

＜Check Processing＞

A check process may be performed to determine whether the setting information (setting coordinate position and setting relative relationship) set by the setup process is appropriate. Fig. 13 is a flowchart showing an example of the check process. First, the camera (70) starts capturing an image of the capturing area (step S31: check imaging process start). Next, the processing control unit (93) stops each of the first nozzle (30), the second nozzle (60), and the third nozzle (65) at their respective stop positions, and discharges the processing liquid at each of the stop positions (step S32: check recipe process). For example, the nozzle moving mechanism (37) moves the first nozzle (30) from the standby position (P33) to the peripheral position (P32) and stops it at the peripheral position (P32). When the first nozzle (30) is stopped at the peripheral position (P32), the valve (35) opens, causing the first nozzle (30) to discharge the processing liquid. Next, the valve (35) closes, so that the first nozzle (30) stops discharging the treatment liquid. Thereafter, the first nozzle (30) is stopped at each stop position, and the treatment liquid is discharged at each stop. The same applies to the second nozzle (60) and the third nozzle (65).

The processing control unit (93) stores the time at which each nozzle is positioned at each stop position and the time at which the processing liquid is discharged in a storage medium based on control signals output to the nozzle movement mechanism and valve.

Next, the camera (70) ends the shooting (step S33: end of the check shooting process). Since the check shooting process by the camera (70) is performed in parallel with the check recipe process, each nozzle that ejects the processing liquid at each stop position is included in the plurality of shooting image data.

Next, the setup unit (92) determines whether the setting coordinate position and the setting relative relationship are appropriately set (step S34: check process). First, the setup unit (92) specifies the captured image data including each nozzle stopped at each stop position based on the acquisition time and the time stored in the storage medium. In addition, the setup unit (92) specifies the captured image data including each nozzle that discharges the processing liquid at each stop position based on the acquisition time and the time stored in the storage medium.

Next, the setup unit (92) monitors the position of each nozzle and the discharge of the processing liquid in the check recipe process based on the captured image data. The monitoring of the position of each nozzle is performed by the same processing as the position monitoring process (step S22), and the monitoring of the discharge status of the nozzle is performed by the same processing as the discharge monitoring process (step S23).

When the setup unit (92) detects an abnormality in the nozzle position, it determines that the set coordinate position for the nozzle that detected the abnormality in the nozzle position and the stop position are not set appropriately. At this time, the setup unit (92) notifies the operator through the user interface (90) that the set coordinate position for the stop position of the nozzle is not set appropriately.

In addition, when the setup unit (92) detects an abnormal discharge of the treatment liquid, it determines that the nozzle that detected the abnormal discharge of the treatment liquid and the set relative position for the stop position are not set appropriately. The setup unit (92) notifies the operator through the user interface (90) that the set relative relationship for the stop position of the nozzle is not set appropriately.

If the operator recognizes a notification indicating that the setting information is not set properly, the operator may reset the setting information by executing the setup process again. In this case, only the setting information that was not set properly may be reset. For example, in the input process, only the nozzle to be reset and the stop position may be input. Alternatively, the operator may manually reset only the setting information that was not set properly using the user interface (90).

＜Processing Cup＞

In the above-described example, the first nozzle (30), the second nozzle (60), and the third nozzle (65) are exemplified as examples of the surveillance target moving within the chamber (10). However, the treatment cup (40) may also be employed as the surveillance target. The inner cup (41), the middle cup (42), and the outer cup (43) of the treatment cup (40) are raised and lowered between the upper position and the lower position by the cup moving mechanism (59). In the following, for the sake of simplicity, the outer cup (43) will be described.

The surveillance processing unit (91) monitors the state of the processing cup (40) in the captured image data. Specifically, the camera (70) captures an image of an image area in advance in a state where the outer cup (43) is raised to an upper position to acquire captured image data, and a part of the outer cup (43) included in the captured image data (for example, a part of the upper end of the outer cup (43)) is stored in a storage medium as reference image data (RI2) (see also FIG. 8).

And, the monitoring processing unit (91) detects the coordinate position of the outer cup (43) by template matching of the captured image data acquired in the processing recipe process (step S5) and the reference image data (RI2). The monitoring processing unit (91) calculates the difference between the coordinate position of the outer cup (43) and the set coordinate position for the upper position of the outer cup (43), and detects an abnormality in the position of the cup when the difference is greater than or equal to the allowable value.

The setting coordinate position of the outer cup (43) is also set by the setup process. Specifically, in the setup recipe process (step S12), the cup moving mechanism (59) moves the outer cup (43) from the lower position to the upper position, and stops it at the upper position over a predetermined period of time. Then, in the position setting process (step S14), the setup unit (92) specifies the captured image data including the outer cup (43) stopped at the upper position based on a control signal to the cup moving mechanism (59), and detects the coordinate position of the outer cup (43) by template matching of the captured image data and reference image data (RI2). The setup unit (92) stores the coordinate position in the storage medium as the setting coordinate position for the upper position of the outer cup (43).

According to this, the setting coordinate position of the outer cup (43) can also be set automatically, thereby shortening the time required for setup processing. The same applies to the middle cup (42) and the inner cup (41).

As described above, the substrate processing method and the substrate processing device (100) have been described in detail, but the above description is, in all aspects, an example, and the substrate processing device is not limited thereto. It is interpreted that countless modified examples that have not been illustrated can be assumed without departing from the scope of this disclosure. Each configuration described in each of the above embodiments and each modified example can be appropriately combined or omitted, as long as they do not contradict each other.

In the above-described example, the setup process is performed when the substrate processing device (100) is installed. However, the setup process may also be performed even if, for example, a person's hand collides with the camera (70) and the posture of the camera (70) changes. This is because if the posture of the camera (70) changes, the coordinate position of each nozzle in the captured image data changes.

In addition, in the above-described example, although one first nozzle (30) is mounted on the tip of the nozzle arm (32), a plurality of first nozzles (30) may be mounted. In this case, the plurality of first nozzles (30) move as one. In this case, in the input process (step S11), the worker inputs information on the plurality of first nozzles (30) mounted on the nozzle arm (32) into the user interface (90). The setup unit (92) may detect the coordinate position of each first nozzle (30) in the setup image data including a plurality of first nozzles (30) stopped at the central position (P31), for example, and set each coordinate position as the set coordinate position. That is, the set coordinate position is set for each first nozzle (30) with respect to the central position (P13). The same applies to other stop positions. In addition, the set relative relationship may be set in the same way for each first nozzle (30). The second nozzle (60) and the third nozzle (65) are also the same.

In addition, in the setup processing described above, setting information for one processing unit (1) is set, but setting information may be set for a plurality of processing units (1) belonging to the substrate processing device (100).

1: Processing unit 10: Chamber
20: Substrate holding (spin chuck) 30, 60, 65: Monitoring target (nozzle)
37: Moving mechanism (nozzle moving mechanism) 40: Surveillance target (processing cup)
59: Moving mechanism (cup moving mechanism) 9: Control unit
70: Camera 100: Substrate Processing Unit
W: substrate

Claims (9)

A method for setting setting information used for substrate processing monitoring,
A setup recipe process for controlling a moving mechanism for moving a first surveillance object within a substrate processing device to move the first surveillance object to a first stop position;
A setup shooting process that is executed in parallel with the above setup recipe process, in which the camera captures the first surveillance object;
A setup process for detecting a position of the first surveillance object in the first image data based on first image data acquired by the camera in the setup imaging process and including the first surveillance object stopped at the first stop position, and first reference image data indicating at least a part of the first surveillance object, and setting the position as an appropriate position with respect to the first stop position.
Equipped with,
In the above setting process, a method for setting setting information used for substrate processing monitoring is provided, wherein, among a plurality of image data sequentially acquired by the camera in the above setup imaging process, the first image data including the first surveillance target stopped at the first stop position is specified based on the time at which a control signal is output to the moving mechanism and the acquisition time of the plurality of image data. In claim 1,
A method for setting setup information used for substrate processing monitoring, wherein in the above setup recipe process, a nozzle that supplies a processing liquid to the main surface of a substrate maintained in the substrate processing device is moved to the first stop position as the first monitoring target. In claim 2,
In the above setup recipe process, the nozzle is sequentially moved to the first stop position and a second stop position that is different from the first stop position at least in the depth direction as viewed from the camera,
The above setup process is,
In the above setup imaging process, the second image data is acquired by the camera and includes the nozzle stopped at the second stop position, and a detection process for detecting the position and size of the nozzle in the second image data based on the first reference image data;
A judgment area setting process for setting a first relative relationship in which the position and size of the discharge judgment area for the nozzle in the first image data are predefined, and a second relative relationship that defines the position and size of the discharge judgment area for the nozzle in the second image data based on a ratio of the size of the nozzle in the first image data to the size of the nozzle in the second image data.
A method for setting setting information used for substrate processing monitoring, including: In claim 1,
A method for setting setup information used for substrate processing monitoring, wherein in the above setup recipe process, a processing cup surrounding a substrate holding portion within the substrate processing device is moved in a vertical direction as the first monitoring object and stopped at the first stop position. In claim 1,
In the above setup recipe process, the first surveillance object is sequentially moved to the first stop position and a second stop position different from the first stop position,
In the above setting process, a method for setting setting information used for substrate processing monitoring, wherein the second image data including the first surveillance object stopped at the second stop position and the first reference image data are acquired in the above setup imaging process, and the position of the first surveillance object in the second image data is detected, and the position is set as an appropriate position with respect to the second stop position. In claim 1,
In the above setup recipe process, a second surveillance object different from the first surveillance object in the substrate processing device is moved to a third stop position,
In the above setting process, a method for setting setting information used in substrate processing monitoring, wherein, based on third image data acquired in the setup imaging process and including the second surveillance object stopped at the third stop position, and second reference image data indicating at least a part of the second surveillance object, the position of the second surveillance object in the third image data is detected, and the position is set as an appropriate position with respect to the third stop position of the second surveillance object. A setup process for performing a method of setting setup information used for substrate processing monitoring as described in claim 1,
A maintenance process in which a substrate maintenance unit within a substrate processing device maintains the substrate,
A processing recipe process in which the substrate holding unit controls the moving mechanism while holding the substrate, thereby moving the first surveillance target to the first stop position;
In parallel with the above processing recipe process, a processing imaging process in which the camera captures an image of the first surveillance object,
A position monitoring process in which the fourth image data, which is acquired by the camera in the above processing imaging process and includes the first surveillance object stopped at the first stop position, and the first reference image data, detects the position of the first surveillance object in the fourth image data, and determines whether the position is appropriate based on the appropriate position with respect to the first stop position.
A method for monitoring a substrate processing device, comprising: A substrate processing device that performs processing on a substrate,
Chamber and,
A moving mechanism that moves the surveillance object within the chamber to a predetermined stop position,
A camera that captures image data by capturing an area including the above surveillance target,
A storage medium storing reference image data representing at least a portion of the above surveillance object,
A control unit that detects the position of the surveillance object in the image data based on the image data acquired by the camera and including the surveillance object stopped at the stop position, and the reference image data, and sets the position as an appropriate position with respect to the stop position.
Equipped with,
A substrate processing device, wherein the control unit specifies, among a plurality of image data sequentially acquired by the camera, the image data including the surveillance target stopped at the stop position, based on the time at which a control signal is output to the moving mechanism and the acquisition time of the plurality of image data. delete