KR102745646B1 - Display apparatus - Google Patents

Abstract

The present specification relates to a display device, and may include a display area and a bezel area surrounding the display area, wherein the bezel area may include a flexible substrate including a pad area, a link area disposed between the display area and the pad area, and a bending area disposed between the pad area and the link area, a data pad disposed in a central portion of the pad area of the bezel area, second power supply pads disposed on both sides of the data pad, and dummy pads disposed on both sides of the second power supply pad, a data link wiring disposed in the central portion of the bezel area and connected to the data pad, a second link power supply line disposed on both sides of the data link wiring in the bezel area and connected to the second power supply pad, and a dummy pad line disposed on both sides of the second link power supply line in the bezel area and connected to the dummy pad. In addition, one end of the dummy pad line may be connected to the dummy pad, and the other end of the dummy pad line may be connected to the second link power supply line.

Description

DISPLAY APPARATUS

The present specification relates to a display device, and more specifically, to a display device in which each of a plurality of bend detection patterns for detecting bending of the display device is arranged in different areas within a bending area.

Recently, flexible display devices that are manufactured by forming display sections and wiring on a substrate made of flexible materials such as plastics so that they can display images even when bent like paper are attracting attention as next-generation display devices. The application range of flexible display devices is expanding from computer monitors and TVs to personal mobile devices. In addition, research is being conducted on flexible display devices that have a large display area while having a reduced volume and weight.

Meanwhile, there is concern that internal components may be damaged when the flexible display device is bent or folded, and thus there is a demand for detecting the degree to which the user is bending or folding the flexible display device. Accordingly, research is being conducted on manufacturing a flexible display device by attaching a separately manufactured bending sensor to the flexible display device.

[Related technical literature]

1. Electronic devices and methods for controlling electronic devices (Korean Patent Application No. 10-2011-0077585)

The inventor of the present specification determines the bending degree by arranging a sensor for detecting the bending degree in a bending area to detect the bending degree of a display device, applying voltage to both ends of the sensor, and measuring the resistance value of the sensor based on the current flowing in the sensor. If one bending sensor is arranged in the entire bending area, it is impossible to detect the bending degree at each position in the bending area. In addition, since the change in resistance value due to bending of the bending sensor is small, it is difficult to detect the exact bending degree in the bending sensor arranged in the entire bending area.

Accordingly, the inventor of the present specification invented a display device having a novel structure capable of measuring the degree of bending at each position within a bending area.

Accordingly, the problem that this specification seeks to solve is to provide a display device having a plurality of bend-detecting patterns arranged along a bending direction in a bending area.

In addition, the problem that this specification seeks to solve is to provide a display device in which a bending region is divided in a direction perpendicular to the bending direction and a plurality of bending detection patterns are respectively arranged in each region.

In addition, the problem that this specification seeks to solve is to provide a display device in which a flattening layer covering a bend detection pattern and a flattening layer covering wiring are separated from each other to prevent the propagation of cracks.

The inventor of the present specification invented a display device capable of detecting damage to an element of the display device due to temperature by measuring a change in the resistance value of the display device. Accordingly, the problem to be solved by the present specification is to provide a display device having a temperature monitoring pattern arranged on the display device.

In addition, the inventor of the present specification invented a display device capable of reducing the area of a bezel area where a temperature monitoring pattern and a bending monitoring pattern are arranged in the display device. Accordingly, the problem to be solved by the present specification is to provide a display device in which a temperature monitoring pattern and a bending monitoring pattern arranged in a bezel area share one of a plurality of pads. In addition, the present specification provides a display device designed to have a different shape from the bending monitoring pattern so as to reduce the area where the temperature monitoring pattern is formed.

The tasks of this specification are not limited to those mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

In order to solve the problem as described above, according to one embodiment of the present specification, a display device may include a display area and a bezel area surrounding the display area, the bezel area including a pad area, a link area disposed between the display area and the pad area, and a bending area disposed between the pad area and the link area, a flexible substrate, a data pad disposed in a central portion of the pad area of the bezel area, second power supply pads disposed on both sides of the data pad, and dummy pads disposed on both sides of the second power supply pad, a data link wiring disposed in the central portion of the bezel area and connected to the data pad, a second link power supply line disposed on both sides of the data link wiring in the bezel area and connected to the second power supply pad, and a dummy pad line disposed on both sides of the second link power supply line in the bezel area and connected to the dummy pad. In addition, one end of the dummy pad line may be connected to the dummy pad, and the other end of the dummy pad line may be connected to the second link power supply line.

In order to solve the problem as described above, a display device according to one embodiment of the present specification may include a display area including a plurality of data wires transmitting a data signal and a plurality of pixels electrically connected to the plurality of data wires, and a bezel area surrounding the display area, wherein the bezel area may include a flexible substrate including a pad area, a bending area arranged between the pad area and the display area, and a link area arranged between the bending area and the display area, a plurality of data link wires positioned in the center of the bezel area and each connected to the data wires, a 2a power supply line arranged in the bezel area and arranged on a first side of the plurality of data link wires, a 2b power supply line arranged on the second side, and a first dummy pad line arranged in the bezel area and arranged on the first side of the plurality of data link wires, and a second dummy pad line arranged on the second side. In addition, one end of the first dummy pad line may be connected to the 2a power supply line, and one end of the second dummy pad line may be connected to the 2b power supply line.

Specific details of other embodiments are included in the detailed description and drawings.

The present specification has the effect of more accurately detecting the degree of bending and whether or not each area constituting a bending area is bent accurately by using a plurality of bending detection patterns arranged according to the bending direction.

In addition, the present specification has the effect of enabling more precise detection of the degree of bending by making the density of bending detection patterns arranged in a bending area with a large radius of curvature greater than the density of bending detection patterns arranged in a bending area with a small radius of curvature.

This specification can detect damage to elements of a display device due to temperature by measuring changes in the resistance value of the display device by placing a temperature monitoring pattern in a pad area of a bezel area.

In addition, the present specification has an effect of reducing the area of the bezel area in the display device by allowing a temperature monitoring pattern arranged in a pad area of the bezel area and a bending monitoring pattern arranged in a bending area of the bezel area to share one of a plurality of pads.

In addition, the temperature monitoring pattern can be formed to have a different shape from the bending monitoring pattern in which the pattern must be formed in the same direction as the direction in which the display device is bent. Accordingly, by designing the shape so as to reduce the area in which the temperature monitoring pattern is formed, there is an effect of reducing the area of the bezel area in the display device.

The effects according to this specification are not limited to the contents exemplified above, and more diverse effects are included in this specification.

FIG. 1 is a schematic plan view of a display device according to one embodiment of the present specification.
Figure 2 is an enlarged view of area A of Figure 1.
Figure 3 is a schematic cross-sectional view according to IIIa-IIIa' and IIIb-IIIb' of Figure 2.
Figure 4 is a schematic cross-sectional view of the display device illustrated in Figure 1 in a bent state.
FIG. 5 is an enlarged plan view of a portion of a bending area of a display device according to another embodiment of the present specification.
FIG. 6a is a schematic plan view of a display device according to another embodiment of the present specification.
FIG. 6b is an enlarged plan view of part B of the display device according to another embodiment of the present specification illustrated in FIG. 6a.
FIG. 7a is a cross-sectional view of a bent display device according to another embodiment of the present specification.
FIG. 7b is an enlarged cross-sectional view of a portion of a bending area of a display device according to another embodiment of the present specification.
FIG. 8 is a schematic cross-sectional view of a portion of a bending area of a display device according to another embodiment of the present specification.
FIG. 9a is an enlarged plan view of a portion of a bending area of a display device according to another embodiment of the present specification.
Fig. 9b is a schematic cross-sectional view along IX-IX' of Fig. 9a.
FIG. 10 is an enlarged plan view of a display device according to another embodiment of the present specification.
FIG. 11 is an enlarged plan view of a portion of a bending area of a display device according to another embodiment of the present specification.
FIG. 12 is an enlarged plan view of a display device according to another embodiment of the present specification.
FIG. 13 is a plan view of a display device according to another embodiment of the present specification.
FIGS. 14A and 14B are enlarged plan views of a display device according to another embodiment of the present specification.

The advantages and features of the present specification and the method for achieving them will become clear with reference to the embodiments described in detail below together with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, but may be implemented in various different forms, and the embodiments are provided only to make the disclosure of the present specification complete and to fully inform a person having ordinary skill in the art to which the present specification belongs of the scope of the invention, and the present specification is defined only by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present specification are illustrative and therefore the present specification is not limited to the matters illustrated. The same reference numerals refer to the same components throughout the specification. In addition, in describing the present specification, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present specification, the detailed description will be omitted. When the terms “includes,” “has,” “consists of,” etc. are used in the present specification, other parts may be added unless “only” is used. When a component is expressed in the singular, it includes a case where the plural is included unless there is a specifically explicit description.

When interpreting a component, it is interpreted as including the error range even if there is no separate explicit description.

When describing a positional relationship, for example, when the positional relationship between two parts is described as 'on ~', 'upper ~', 'lower ~', 'next to ~', etc., one or more other parts may be located between the two parts, unless 'right' or 'directly' is used.

When an element or layer is referred to as being "on" another element or layer, it includes both instances where the other element is directly on top of the other element or layer, or instances where there is another layer or element intervening therebetween.

Although the terms first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Thus, a first component referred to below may also be a second component within the technical scope of this specification.

Throughout the specification, identical reference numerals refer to identical components.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and this specification is not necessarily limited to the size and thickness of the components shown.

The individual features of the various embodiments of the present specification may be partially or wholly combined or combined with each other, and various technical connections and operations are possible, as can be fully understood by those skilled in the art, and the individual embodiments may be implemented independently of each other or may be implemented together in a related relationship.

Hereinafter, various embodiments of the present specification will be described in detail with reference to the attached drawings.

FIG. 1 is a schematic plan view illustrating a display device according to one embodiment of the present specification.

Referring to FIG. 1, the display device (100) includes a flexible substrate (110), a COF (120) (Chip on Flim), and a printed circuit board (130).

The flexible substrate (110) is a substrate for supporting and protecting various components of the display device (100). The flexible substrate (110) may be composed of an insulating material having flexibility. For example, the flexible substrate (110) may be made of a plastic such as polyimide, but is not limited thereto.

The flexible substrate (110) may include a display area (AA) and a bezel area (ZA) surrounding the display area (AA).

The display area (AA) is an area in which an image is displayed on the display device (100), and display elements and various driving elements for driving the display elements are arranged in the display area (AA).

The bezel area (ZA) is an area surrounding the display area (AA). The bezel area (ZA) is an area in the display device (100) where no image is displayed, and where wiring or circuitry is formed. The bezel area (ZA) includes a link area (LA), a bending area (BA), and a pad area (PA).

The link area (LA) extends from one side of the display area (AA). The link area (LA) is an area where link wires for transmitting signals to wires arranged in the display area (AA) are arranged, and various link wires can be arranged. For example, data link wires (DLL), high-potential voltage supply wires, etc. can be arranged in the link area (LA).

The bending area (BA) may be an area where the flexible substrate (110) is bent. The bending area (BA) extends from one side of the link area (LA). The flexible substrate (110) may be configured such that it is not bent but remains flat in an area excluding the bending area (BA), and only the bending area (BA) is bent. Accordingly, the display device (100) may be bent such that two non-bending areas excluding the bending area (BA) of the flexible substrate (110) face each other.

The pad area (PA) is an area where no image is displayed and where multiple pads (P) are formed. The pad area (PA) extends from one side of the bending area (BA). The pad area (PA) is an area where multiple pads (P) and external modules, such as COF (120), are bonded.

COF (120) is a film in which various components are arranged on a flexible base film (121), and is a component for supplying signals to pixels (PX) of a display area (AA). COF (120) is arranged in a pad area (PA) of a bezel area (ZA) and supplies power voltage, data voltage, etc. to pixels (PX) of a display area (AA) through a pad (P) arranged in the pad area (PA). COF (120) includes a base film (121) and a driving IC (122), and various components may be arranged in addition to these.

The base film (121) is a layer that supports the COF (120). The base film (121) may be made of an insulating material, and for example, may be made of an insulating material having flexibility.

The driving IC (122) is a component that processes data for displaying an image and a driving signal for processing the data. In Fig. 1, the driving IC (122) is illustrated as being mounted in a COF (120) manner, but is not limited thereto, and the driving IC (122) may be mounted in a COG (Chip On Glass), TCP (Tape Carrier Package), or the like.

A control unit such as an IC chip, a circuit unit, etc. may be mounted on the printed circuit board (130). In addition, a memory, a processor, etc. may also be mounted on the printed circuit board (130). The printed circuit board (130) is configured to transmit a signal for driving a display element from the control unit to the display element, and to have a measurement pad (131) and a measurement wire (132) for detecting a bending angle of the display device (100) arranged thereon. A plurality of pads (P) of the pad area (PA) may be connected to a plurality of measurement wires (132) and a plurality of measurement pads (131) of the printed circuit board (130) through the COF (120). The bending angle of the bending area (BA) may be detected through some of the measurement pads (131) connected to the bending detection pattern. A bending detection wire (150) connected to the bending detection pattern may be connected to the measurement pad (131). Accordingly, a voltage can be applied to the measurement pad (131) to measure the flowing current, and accordingly, the bending angle can be detected as the resistance value of the bending detection wire (150) is measured.

Hereinafter, reference will be made to FIGS. 2 and 3 together for a more detailed description of a display device (100) according to one embodiment of the present specification.

Fig. 2 is an enlarged view of area A of Fig. 1. Fig. 3 is a schematic cross-sectional view along lines IIIa-IIIa' and IIIb-IIIb' of Fig. 2. For convenience of explanation, Fig. 2 illustrates the display device (100) before the COF (120) is bonded.

Referring to FIGS. 2 and 3, the display area (AA) includes a plurality of pixels (PX). The plurality of pixels (PX) are arranged in the display area (AA) and include elements such as thin film transistors (160). Each of the plurality of pixels (PX) is connected to a data line (DL). The data line (DL) refers to a line that transmits a data signal to the plurality of pixels (PX).

Referring to FIG. 3 and examining the display area (AA), a thin film transistor (160) is arranged on a flexible substrate (110). A gate electrode (162) is formed on the flexible substrate (110), and a gate insulating layer (111) is formed on an active layer (161). The gate insulating layer (111) is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be a single layer or a plurality of layers. An active layer (161) in which a channel of the thin film transistor (160) is formed is arranged on the gate insulating layer (111). A source electrode (163) and a drain electrode (164) are formed on the active layer (161). In FIG. 3, the thin film transistor (160) is illustrated as a bottom gate type thin film transistor (160), but the stacked structure of the thin film transistor (160) is not limited thereto.

A first planarization layer (112) is arranged on the thin film transistor (160). The first planarization layer (112) is an insulating layer for planarizing the upper portion of the thin film transistor (160). The first planarization layer (112) may be made of an organic material. For example, the first planarization layer (112) may be made of an acrylic-based organic material, but is not limited thereto.

A connection electrode (170) is arranged on the first planarization layer (112). The connection electrode (170) is an electrode for electrically connecting the thin film transistor (160) and the organic light-emitting element (180). The connection electrode (170) is electrically connected to the drain electrode (164) of the thin film transistor (160) through a contact hole formed in the first planarization layer (112). The connection electrode (170) may be made of the same material as the source electrode (163) and the drain electrode (164) of the thin film transistor (160), but is not limited thereto.

A second planarization layer (113) is arranged on the connecting electrode (170) and the first planarization layer (112). The second planarization layer (113) is an insulating layer for planarizing the upper portion of the connecting electrode (170). The second planarization layer (113) may be made of an organic material. For example, the second planarization layer (113)(234) may be made of an acrylic-based organic material, but is not limited thereto. In addition, the first planarization layer (112) may be made of the same material as the first planarization layer (112), but is not limited thereto.

An anode (181) of a light-emitting element (180) is disposed on the second planarization layer (113). The anode (181) is disposed on the second planarization layer (113) and is electrically connected to a connection electrode (170) through a contact hole formed in the second planarization layer (113). The anode (181) may be made of a conductive material having a high work function in order to supply holes to the organic light-emitting layer (182). The anode (181) may be made of a transparent conductive material, such as, for example, indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO). If the display device (100) is of the top emission type, the anode (181) may be configured to further include a reflector.

A bank (114) is arranged on the anode (181) and the second flattening layer (113). The bank (114) is an insulating layer that separates a plurality of adjacent pixels (PX). The bank (114) is arranged to cover at least a portion of both sides of the anode (181) to expose a portion of the upper surface of the anode (181). The bank (114) may be made of an acrylic resin, a benzocyclobutene (BCB) resin, or polyimide, but is not limited thereto.

An emitting layer (182) is arranged on the anode (181) and the bank (114). The emitting layer (182) may be any one of emitting layers (182) that emit red light, green light, blue light, and white light. In addition to the emitting layer that emits light, the emitting layer (182) may further include at least one layer of a hole transport layer, an electron transport layer, a hole blocking layer, an electron blocking layer, a hole injection layer, and an electron injection layer. In FIG. 3, the emitting layer (182) is illustrated as a common layer formed on a plurality of pixels (PX), but is not limited thereto, and the emitting layer (182) may be patterned for each of a plurality of pixels (PX).

The cathode (183) is arranged on the light-emitting layer (182). The cathode (183) supplies electrons to the light-emitting layer (182). The cathode (183) may be made of a transparent conductive oxide of the series of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (TO), or an ytterbium (Yb) alloy. Alternatively, the cathode (183) may be made of a metal material.

Referring to FIG. 2, data link wiring (DLL) is arranged in a link area (LA), a bend area (BA), and a pad area (PA) to connect a data wiring (DL) of a display area (AA) and a pad (P) of a pad area (PA). The data link wiring (DLL) may have various shapes, such as a zigzag shape, a diamond shape, etc., in order to minimize cracking of the data link wiring (DLL) as the bend area (BA) is bent. For example, as illustrated in FIG. 2, the data link wiring (DLL) may have a zigzag shape in the bend area (BA).

Referring to FIG. 3, a plurality of data link wires (DLLs) may be arranged in different layers. That is, some of the data link wires (DLLs) may be arranged on the flexible substrate (110), and the remaining portions may be arranged on the first planarization layer (112). As the display device is designed to have a high resolution, the number of data link wires (DLLs) arranged in the bezel area (ZA) must also increase. However, if the data link wires (DLLs) are arranged on one layer, the space where the data link wires (DLLs) can be arranged becomes very narrow, which may cause difficulties in design. Accordingly, in the display device (100) according to one embodiment of the present specification, some of the data link wires (DLLs) are arranged on the flexible substrate (110), and the remaining portions are arranged on the first planarization layer (112), so that the design for the arrangement of the data link wires (DLLs) can be made more smoothly, and the size of the bezel area (ZA) can be minimized.

In some embodiments, some of the data link wires (DLLs) may be electrically connected to each other. For example, one of the data link wires (DLLs) disposed on the flexible substrate (110) and one of the data link wires (DLLs) disposed on the first planarization layer (112) may be electrically connected to each other, so that the two data link wires (DLLs) may be connected in parallel. Alternatively, two data link wires (DLLs) disposed on the same layer may be electrically connected to each other. Accordingly, the resistance of the data link wires (DLLs) may be reduced, and even if a crack occurs in one of the two data link wires (DLLs) that are connected to each other, a signal may be transmitted normally.

Referring to FIG. 2, the bending area (BA) may include a plurality of sub-bending areas (SBA1, SBA2, SBA3). For example, the bending area (BA) may include a first sub-bending area (SBA1), a second sub-bending area (SBA2), and a third sub-bending area (SBA3). The plurality of sub-bending areas (SBA1, SBA2, SBA3) may be sequentially arranged from one side to the other side of the bending area (BA). That is, the third sub-bending area (SBA3), the second sub-bending area (SBA2), and the first sub-bending area (SBA1) may be sequentially arranged from the link area (LA) of the bending area (BA). However, the number of sub-bending areas included in the bending area (BA) is not limited thereto.

Referring to FIG. 2, the display device (100) may include a plurality of bending detection patterns (140) arranged in the bending area (BA). The plurality of bending detection patterns (140) are patterns for detecting the degree to which the bending area (BA) of the display device (100) is bent. As the bending area (BA) of the display device (100) is bent, the resistance of the plurality of bending detection patterns (140) changes, and the degree to which the display device (100) is bent can be detected according to the measured resistance value. That is, the plurality of bending detection patterns (140) may be configured to detect a stress deviation in each of the plurality of sub-bending areas (SBA1, SBA2, SBA3) that occurs as the bending area (BA) is bent. When the bending area (BA) is bent, the degrees of bending of the plurality of sub-bending areas (SBA1, SBA2, SBA3) may be different from each other. Accordingly, there may be a deviation in the stress received by each of the plurality of sub-bending areas (SBA1, SBA2, SBA3), and the plurality of bending detection patterns (140) are arranged in each of the plurality of sub-bending areas (SBA1, SBA2, SBA3) to detect the stress received by each of the plurality of sub-bending areas (SBA1, SBA2, SBA3), and thus the deviation in stress can be obtained.

For example, as illustrated in FIG. 2, the plurality of bending detection patterns (140) may include a first bending detection pattern (141), a second bending detection pattern (142), and a third bending detection pattern (143). At this time, each of the plurality of bending detection patterns (140) may be arranged in a different region among the plurality of sub-bending areas (SBA1, SBA2, SBA3). That is, the first bending detection pattern (141) may be arranged in the first sub-bending area (SBA1), the second bending detection pattern (142) may be arranged in the second sub-bending area (SBA2), and the third bending detection pattern (143) may be arranged in the third sub-bending area (SBA3).

A plurality of bend detection patterns (140) may be arranged on both sides of a plurality of data link wires (DLLs). That is, a plurality of data link wires (DLLs) may be arranged in the central portion of the bending area (BA), and the plurality of bend detection patterns (140) may be arranged on the left and right sides of the central portion where the plurality of data link wires (DLLs) are arranged. However, the present invention is not limited thereto, and the plurality of bend detection patterns (140) may be arranged in the central portion of the bending area (BA), or may be arranged on only one side of the left and right sides of the central portion.

A plurality of bend detection patterns (140) can be connected to a plurality of bend detection wires (150). A plurality of bend detection wires (150) are wires that are connected to a plurality of pads (P) so that a plurality of bend detection patterns (140) and a plurality of pads (P) can be electrically connected.

A plurality of bending detection patterns (140) may be arranged diagonally along the bending direction of the bending area (BA). That is, as illustrated in FIG. 2, the first bending detection pattern (141), the second bending detection pattern (142), and the third bending detection pattern (143) may be arranged diagonally based on the direction in which the bending area (BA) is bent.

The plurality of bending detection patterns (140) may be composed of a plurality of sub-patterns extending in different directions. Referring to FIG. 2, the plurality of bending detection patterns (140) include sub-patterns extending in a direction parallel to the bending direction of the bending area (BA) and sub-patterns extending in a direction different from the bending direction, for example, a direction perpendicular to the bending direction.

At this time, at least some of the plurality of sub-patterns may be parallel to the bending direction of the bending area (BA). When at least some of the plurality of sub-patterns are arranged parallel to the bending direction of the bending area (BA), the plurality of bending detection patterns (140) can effectively detect the degree of bending of the display device (100). When the plurality of sub-patterns are arranged parallel to the bending direction of the bending area (BA), the stress received by the plurality of bending detection patterns (140) may increase compared to when they are arranged not parallel. Accordingly, when the bending area (BA) is bent, the magnitude of the stress received by the plurality of sub-patterns may increase, and thus the amount of change in resistance of the plurality of bending detection patterns (140) due to the bending of the bending area (BA) may also increase. Accordingly, the display device (100) according to one embodiment of the present specification can more effectively detect the degree of bending.

Referring to the cross-sectional view according to IIIa-IIIa' of FIG. 3, some of the plurality of data link wires (DLLs) are arranged on the flexible substrate (110). Some of the plurality of data link wires (DLLs) may be formed of the same material as the source electrode (163) or the drain electrode (164) of the thin film transistor (160). That is, some of the plurality of data link wires (DLLs) may be formed simultaneously with the source electrode (163) or the drain electrode (164) in the same process. Although FIG. 3 illustrates that some of the plurality of data link wires (DLLs) are in direct contact with the flexible substrate (110), one or more insulating layers may be arranged on the flexible substrate (110) and some of the plurality of data link wires (DLLs) may be arranged.

A first planarization layer may be disposed on some of the plurality of data link wires (DLLs), and a third bending detection pattern (143) and other parts of the plurality of data link wires (DLLs) may be disposed on the first planarization layer (112). That is, the plurality of bending detection patterns (140) and other parts of the plurality of data link wires (DLLs) may be disposed on the same layer. The plurality of bending detection patterns (140) and other parts of the plurality of data link wires (DLLs) may be simultaneously formed of the same material as the connection electrode (170) in the same process. At this time, the plurality of data link wires (DLLs) are divided and disposed between the flexible substrate (110) and the first planarization layer (112) and between the first planarization layer (112) and the second planarization layer (113), thereby minimizing the area occupied by the plurality of data link wires (DLLs).

The plurality of bending detection patterns (140) may be formed as the uppermost conductive layer among the conductive layers arranged in the bending area (BA). The display device (100) according to one embodiment of the present specification can effectively detect bending by forming the plurality of bending detection patterns (140) as the uppermost conductive layer among the conductive layers arranged in the bending area (BA). Specifically, when the bending area (BA) of the display device (100) is bent, the stress received by the uppermost conductive layer among the conductive layers arranged in the bending area (BA) may be the largest. Accordingly, the resistance variation of the uppermost conductive layer among the conductive layers arranged in the bending area (BA) may be the largest. Accordingly, the display device (100) according to one embodiment of the present specification can effectively perform bending detection by using the uppermost conductive layer among the conductive layers arranged in the bending area (BA) as the plurality of bending detection patterns (140).

A second planarization layer (113) is disposed on the third bend detection pattern (143) and some other portion of the plurality of data link wires (DLLs). The second planarization layer (113) can planarize the upper portion of the third bend detection pattern (143) and the plurality of data link wires (DLLs).

A micro coating layer (MCL) (115) may be arranged on the second flattening layer (113). The micro coating layer (115) is a layer made of an insulating material such as an organic material. For example, the micro coating layer (115) may be made of an acrylic material or may be made of urethane acrylate. The micro coating layer (115) may play a role in controlling a neutral plane in the bending area (BA), thereby preventing wires arranged in the bending area (BA) from cracking during bending.

Various wires, etc., arranged in the bending area (BA) of the display device (100) may be damaged as the bending area (BA) is bent. For example, if excessive stress is applied to some of the plurality of data link wires (DLL) as the bending area (BA) is bent, causing cracks or increased resistance, some of the plurality of bending detection patterns (140) corresponding to the location where the cracks occurred may also cause cracks or increased resistance. Accordingly, in the display device (100) according to one embodiment of the present specification, whether the wires arranged in the bending area (BA) are damaged may be determined by measuring a change in resistance for a plurality of bending detection patterns (140) arranged in each of the plurality of sub-bending areas (SBA1, SBA2, SBA3). That is, when a specific voltage is applied to a plurality of measuring pads (131) on a printed circuit board (130) electrically connected to a plurality of bending detection patterns (140) arranged in each of a plurality of sub-bending areas (SBA1, SBA2, SBA3), and a flowing current is measured, a resistance value of each bending detection pattern can be calculated. At this time, if the calculated resistance value deviates significantly from the expected resistance value or exceeds a specific reference value, it can be confirmed that the wiring arranged in the bending area (BA) is cracked or excessively stressed. In particular, in the display device (100) according to one embodiment of the present specification, a single bending detection pattern is not arranged to correspond to the entire bending area (BA), but a plurality of bending detection patterns (140) are arranged in the bending area (BA) so that the degree of stress applied to each sub-bending area can be measured, and therefore, an abnormal area can be determined more precisely. Accordingly, the process of bending the bending area (BA) in the manufacturing process of a display device (100) manufactured after the display device (100) in which cracks and/or excessive stress in the wiring are confirmed can be quickly and accurately corrected.

Meanwhile, in the process of bending the bending area (BA) of the display device (100), the bending area (BA) may be bent in a manner that is different from the design. For example, in the process of bending the display device (100), the display device (100) may not be bent exactly based on the boundary between the bending area (BA) and the link area (LA), but may be bent in a diagonal direction of the boundary between the bending area (BA) and the link area (LA). In this case, the corresponding plurality of bending detection patterns (140) arranged on both sides of the plurality of data link wires (DLL) may have different resistance values. When the display device (100) is bent exactly, the corresponding bending detection patterns based on the plurality of data link wires (DLL) have substantially the same degree of bending, and therefore, the resistance values of the respective bending detection patterns may be substantially the same. However, if the display device (100) is bent misaligned, the difference in resistance values between the bend detection pattern disposed on the left side of the data link wiring (DLL) and the bend detection pattern disposed on the right side may be very large. Accordingly, it is possible to determine whether the display device (100) is bent accurately by comparing the resistance values of the bend detection patterns disposed in corresponding sub-bending areas. Accordingly, in the display device (100) according to one embodiment of the present specification, by disposing a plurality of bend detection patterns (140) in a plurality of sub-bending areas (SBA1, SBA2, SBA3), it is also possible to determine whether the display device (100) is bent accurately. Furthermore, if it is determined that the display device (100) is not bent accurately, the process of bending the bending area (BA) in the manufacturing process of the display device (100) manufactured after the display device (100) can be quickly and accurately corrected.

Fig. 4 is a schematic cross-sectional view of the display device illustrated in Fig. 1 in a bent state. For convenience of explanation, Fig. 4 illustrates a flexible substrate (110), a micro-coating layer (115), a COF (120), and a printed circuit board (130) of the display device (100).

Referring to FIG. 4, the bending area (BA) of the flexible substrate (110) can be bent. The bending area (BA) can be bent to form a semicircle. As the flexible substrate (110) is bent, the COF (120) and the printed circuit board (130) can be arranged to face the display area (AA).

A display unit (DU) may be arranged on the display area (AA) of the flexible substrate (110). The display unit (DU) is a configuration for displaying an image from the display device (100) and may include a thin film transistor (160) and an organic light emitting element (180) as shown in FIG. 3. A polarizing plate (171) may be arranged on the display unit (DU). The polarizing plate (171) may suppress external reflection of the display device (100). In addition, the micro-coating layer (115) may be formed on a part of the bezel area (ZA) of the flexible substrate (110). That is, the micro-coating layer (115) may be formed on the link area (LA), the bending area (BA), and the pad area (PA) of the bezel area (ZA).

A first back plate (172) and a second back plate (173) are arranged at the bottom of a non-bending area of a flexible substrate (110) excluding a bending area (BA). Specifically, the first back plate (172) is arranged at the bottom of a display area (AA) and a link area (LA) of the flexible substrate (110), and the second back plate (173) is arranged at the bottom of a pad area (PA) of the flexible substrate (110). When the flexible substrate (110) is made of a plastic material such as polyimide (PI), a manufacturing process of the display device (100) is performed in a situation where a support substrate made of glass is arranged at the bottom of the flexible substrate (110), and after the manufacturing process of the display device (100) is completed, the support substrate can be released. However, since a component for supporting the flexible substrate (110) is required even after the support substrate is released, a first back plate (172) and a second back plate (173) for supporting the flexible substrate (110) may be placed under the flexible substrate (110). The first back plate (172) and the second back plate (173) may be placed in another area of the flexible substrate (110) other than the bending area (BA) so as to be adjacent to the bending area (BA). The back plate may be made of a plastic film formed of polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), other suitable polymers, a combination of these polymers, or the like.

A support member (174) is disposed between the first back plate (172) and the second back plate (173), and the support member (174) can be bonded to each of the first back plate (172) and the second back plate by an adhesive layer. The support member (174) can be formed of a plastic material, such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), other suitable polymers, combinations of these polymers, and the like. The strength of the support member (174) formed of such plastic materials can also be controlled by providing additives to increase the thickness and/or strength of the support member (174). The support member (174) can be formed in a desired color (e.g., black, white, etc.). Additionally, the support member (174) can be formed of glass, ceramic, metal, or other rigid materials, or combinations of the aforementioned materials.

Fig. 5 is an enlarged plan view of a portion of a bending area of a display device according to another embodiment of the present specification. The display device (500) illustrated in Fig. 5 differs in the arrangement of a plurality of bending detection patterns (540) compared to the display device (100) illustrated in Figs. 1 and 2, and other descriptions are substantially the same, so redundant descriptions are omitted.

Referring to FIG. 5, a plurality of bending detection patterns (540) are arranged in a row along the bending direction of the bending area (BA). For example, a plurality of bending detection patterns (540) are respectively arranged in different areas among a plurality of sub-bending areas (SBA1, SBA2, SBA3), and at this time, the plurality of bending detection patterns (540) may be arranged in a row in a direction parallel to the bending direction of the bending area (BA). For example, the plurality of bending detection patterns (540) may include a first bending detection pattern (541), a second bending detection pattern (542), and a third bending detection pattern (543). The first bending detection pattern (541), the second bending detection pattern (542), and the third bending detection pattern (543) may be arranged in the first sub-bending area (SBA1), the second sub-bending area (SBA2), and the third sub-bending area (SBA3), respectively. And, the first bending detection pattern (541), the second bending detection pattern (542), and the third bending detection pattern (543) may be sequentially arranged in a row in a direction parallel to the bending direction of the bending area (BA). Accordingly, in the display device (500) according to another embodiment of the present specification, the size of the bending area (BA) where the plurality of bending detection patterns (540) are arranged may be reduced or minimized. That is, the area of the bending area (BA) where the plurality of bending detection patterns (540) are arranged may be further reduced. Accordingly, the area of the area where other components of the display device (500) can be arranged may be increased, so that the space within the display device (500) may be utilized more efficiently, and the width of the bezel may also be reduced.

Fig. 6a is a schematic plan view of a display device according to another embodiment of the present specification. Fig. 6b is an enlarged plan view of a portion B of a display device (600) according to another embodiment of the present specification illustrated in Fig. 6a. The display device (600) illustrated in Figs. 6a and 6b differs from the display device (100) illustrated in Figs. 1 to 5 in the position of the bending area (BA), and since other descriptions are substantially the same, a duplicate description will be omitted.

Referring to FIGS. 6A and 6B, the bending area (BA) of the display device (600) may be a portion of the display area (AA) and both sides of the portion. For example, a portion of the display area (AA) and a bezel area (ZA) arranged on both sides of the portion may be defined as the bending area (BA) and may be bent. At this time, a plurality of bending detection patterns (640) are arranged in the bending area (BA) on both sides of the portion of the display area (AA). The bending area (BA) may include a plurality of sub-bending areas (SBA1, SBA2, SBA3), and for example, the bending area (BA) may include a first sub-bending area (SBA1), a second sub-bending area (SBA2), and a third sub-bending area (SBA3). However, the number of sub-bending areas is not limited to the number illustrated in FIG. 6B.

The plurality of bending detection patterns (640) may be arranged in different areas among the plurality of sub-bending areas (SBA1, SBA2, SBA3). For example, the first bending detection pattern (641) may be arranged in the first sub-bending area (SBA1), the second bending detection pattern (642) may be arranged in the second sub-bending area (SBA2), and the third bending detection pattern (643) may be arranged in the third sub-bending area (SBA3). The plurality of bending detection patterns (640) may be arranged in a diagonal direction with respect to the bending direction of the bending area (BA) as illustrated in FIGS. 6A and 6B , but are not limited thereto. For example, they may be arranged in a line along the bending direction, such as the arrangement of the plurality of bending detection patterns (640) illustrated in FIG. 5 . When a plurality of bending detection patterns (640) are arranged in a row along the bending direction, the size of the bending area (BA) can be reduced or minimized, and thus, the width of the bezel area (ZA) corresponding to the bending area (BA) can be reduced or minimized. In addition, the plurality of bending detection patterns (640) can be connected to the bending detection wiring (650). The bending detection wiring (650) can connect the plurality of bending detection patterns (640) and the pad (P).

A display device (600) according to another embodiment of the present specification can detect the degree of bending even when the display area (AA) is bent, since the bending area (BA) is formed as a part of the display area (AA) and on both sides of the part of the display area (AA). When the bending area (BA) is bent, the resistance values of the plurality of bending detection patterns (640) may change, and for example, the resistance values of the plurality of bending detection patterns (640) may increase as the bending angle increases. At this time, since the plurality of bending detection patterns (640) are arranged in each of the plurality of sub-bending areas (SBA1, SBA2, SBA3), the stress received by elements of the display area (AA) arranged in each of the plurality of sub-bending areas (SBA1, SBA2, SBA3) can be independently detected. Accordingly, each of the plurality of bending detection patterns (640) can measure the bending angle of the display device (600) more precisely by detecting the stress received by the display area (AA) corresponding to the bending area (BA) for each sub-bending area. Accordingly, in the display device (600) according to another embodiment of the present specification, the bending angle of the bending area (BA) in the display area (AA) can be measured more precisely, and the display device (600) can also perform correction work, etc. on an image to be displayed to the user according to the measured angle.

Fig. 7a is a cross-sectional view of a display device according to another embodiment of the present specification, when bent. Fig. 7b is an enlarged cross-sectional view of a portion of a bending area of a display device according to another embodiment of the present specification. The display device (700) according to the embodiment of the present specification illustrated in Figs. 7a and 7b has different widths in the bending direction of the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) and the plurality of bending detection patterns (740) compared to the display device (100) illustrated in Figs. 1 to 4, and since other descriptions are substantially the same, a duplicate description will be omitted.

Referring to FIG. 7a, the widths of the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) included in the bending area (BA) of the flexible substrate (110) with respect to the bending direction may be different from each other. For example, at least some of the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) may have different widths from each other. For example, the widths of some of the sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) may be smaller or larger than the widths of other sub-bending areas. As illustrated in FIG. 7a, the bending area (BA) may include a first sub-bending area (SBA1), a second sub-bending area (SBA2), a third sub-bending area (SBA3), a fourth sub-bending area (SBA4), and a fifth sub-bending area (SBA5), and widths in the bending direction of the first sub-bending area (SBA1) and the fifth sub-bending area (SBA5) may be larger than widths in the bending direction of the second sub-bending area (SBA2), the third sub-bending area (SBA3), and the fourth sub-bending area (SBA4).

The plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) included in the bending area (BA) of the flexible substrate (110) may have different radii of curvature. For example, some of the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) may have different radii of curvature. Depending on the design of the display device (700), all of the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) may be designed to have the same radii of curvature. However, due to process errors, etc., the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) may have different radii of curvature. Alternatively, the design of the display device (700) itself may be such that the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) have different radii of curvature. Accordingly, the bending area (BA) may be bent into a shape of a portion of a circle in the cross section of the bending area (BA), but may be bent into a shape of a portion of an ellipse, as illustrated in FIG. 7A. For example, when the bending area (BA) of the flexible substrate (110) is bent as illustrated in FIG. 7A, the smallest radii of curvature of the bending area (BA) may be R1 and R3, and the largest radii of curvature may be R2. Accordingly, the radii of curvature of the bending area (BA) may increase and then decrease within the bending area (BA). At this time, the width of a sub-bending area having a relatively large radii of curvature among the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, and SBA5) in the bending direction may be smaller than the width of a sub-bending area having a relatively small radii of curvature in the bending direction.

For example, among the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, and SBA5), the curvature radii of the second sub-bending area (SBA2), the third sub-bending area (SBA3), and the fourth sub-bending area (SBA4) may be larger than the curvature radii of the first sub-bending area (SBA1) and the fifth sub-bending area (SBA5). For example, the widths of the second sub-bending area (SBA2), the third sub-bending area (SBA3), and the fourth sub-bending area (SBA4) in the bending direction may be smaller than the widths of the first sub-bending area (SBA1) and the fifth sub-bending area (SBA5) in the bending direction.

Referring to FIG. 7b, each of the plurality of bending detection patterns (740) is arranged in a different region among the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5). The first bending detection pattern (741) is arranged in the first sub-bending area (SBA1), the second bending detection pattern (742) is arranged in the second sub-bending area (SBA2), the third bending detection pattern (743) is arranged in the third sub-bending area (SBA3), the fourth bending detection pattern (744) is arranged in the fourth sub-bending area (SBA4), and the fifth bending detection pattern (745) is arranged in the fifth sub-bending area (SBA5). The plurality of bending detection patterns (740) may be connected to bending detection wiring (750). The bend detection wiring (750) can connect a plurality of bend detection patterns (740) to the pad (P).

In addition, at least some of the plurality of bending detection patterns (740) may have different widths in the bending direction of the bending area (BA). That is, the widths in the bending direction of the first bending detection pattern (741) and the fifth bending detection pattern (745) may be larger than the widths in the bending direction of the second bending detection pattern (742), the third bending detection pattern (743), and the fourth bending detection pattern (744). For example, the first bending detection pattern (741) and the second bending detection pattern (742) of the plurality of bending detection patterns (740) may have different widths in the bending direction of the bending area (BA). For example, the width in the bending direction of the first bending detection pattern (741) may be larger than the width in the bending direction of the second bending detection pattern (742).

A display device (700) according to another embodiment of the present specification can adjust the width of the sub-bending areas as needed by making the width of some areas among the plurality of sub-bending areas (SBA1, SBA2, SBA3, SBA4, SBA5) different from the width of some areas among the bending directions. For example, the degree of bending of a specific area among the bending areas (BA) can be detected more precisely. Some areas among the bending areas (BA) can have a greater degree of bending than other areas, and therefore, some areas having a relatively greater degree of bending can have the degree of bending detected more precisely by arranging multiple bending detection patterns. Furthermore, the width of the bending direction of a sub-bending area having a relatively large radius of curvature among the bending areas (BA) can be set small, and the width of the bending direction of a sub-bending area having a relatively small radius of curvature can be set large, so that damage such as cracks can be precisely detected. In the case of a sub-bending region having a large radius of curvature, the probability that cracks will occur in the thin film transistors (160) or multiple wires arranged on the substrate as the flexible substrate (110) is bent may be higher than in a sub-bending region having a small radius of curvature. At this time, if the width of the sub-bending region having a large radius of curvature in the bending direction is relatively reduced, the density of the sub-bending region included in the region having a large radius of curvature among the bending regions (BA) may increase. Accordingly, among two regions having the same area, a relatively larger number of bending detection patterns may be arranged in the region having a large radius of curvature than in the region having a small radius of curvature, and more detailed bending detection may be possible. For example, if several bending detection patterns having small widths are arranged in some region of the bending region (BA) having a large radius of curvature, the location where a crack occurs due to bending can be determined more accurately. Accordingly, the location where an error occurred in the bending process of the display device (700) can be clearly identified, and thus, changes can be made quickly in the process.

FIG. 8 is a schematic cross-sectional view of a portion of a bending area of a display device according to another embodiment of the present specification. The cross-sectional view illustrated in FIG. 8 is a cross-sectional view along line IIIa-IIIa' of FIG. 3. The display device (800) according to the embodiment of the present specification illustrated in FIG. 8 differs in the structure of the second planarization layer (813) compared to the display device (100) illustrated in FIGS. 1 to 4, and other descriptions are substantially the same, so that redundant descriptions are omitted.

Referring to FIG. 8, the second flattening layer (813) includes a first flattening pattern (813a) and a second flattening pattern (813b). The first flattening pattern (813a) is a pattern that covers a plurality of bending detection patterns (140) including a third bending detection pattern (143), and the second flattening pattern (813b) is a pattern that covers a data link wiring (DLL) arranged on the same layer as the third bending detection pattern (143). Accordingly, the second flattening layer (813) can be divided into a first flattening pattern (813a), which is a flattening layer covering a plurality of bending detection patterns (140), and a second flattening pattern (813b), which covers wiring arranged on the same layer as the plurality of bending detection patterns (140), and the first flattening pattern (813a) and the second flattening pattern (813b) can be spaced apart from each other. That is, the second flattening layer (813) arranged to cover a plurality of bending detection patterns (140) can be separated from each other by the first flattening pattern (813a), which is a portion covering the plurality of bending detection patterns (140), and the second flattening pattern (813b), which covers wiring arranged on the same layer as the plurality of bending detection patterns (140).

In a display device (800) according to another embodiment of the present specification, the second planarization layer (813) includes a first planarization pattern (813a) covering a plurality of bend detection patterns (140) and a second planarization pattern (813b) covering wiring arranged on the same layer as the plurality of bend detection patterns (140), thereby reducing the propagation of cracks in the wiring covered by the second planarization pattern (813b). For example, as described above, in order to measure more accurate and wider range of resistance, the plurality of bend detection patterns (140) may have patterns extending in a direction parallel to the bending direction. However, since a pattern extending in a direction parallel to the bending direction receives more stress than a pattern extending in a different direction when the bending area (BA) is bent, cracks may not occur in the data link wiring (DLL) as the display device (800) is bent, but cracks may occur in the plurality of bend detection patterns (140). In addition, cracks occurring in the plurality of bending detection patterns (140) may also propagate to the data link wiring (DLL) through the second planarization layer (813). Therefore, in the display device (800) according to another embodiment of the present specification, a portion of the second planarization layer (813) covering the plurality of bending detection patterns (140) and a portion of the second planarization layer (813) covering the plurality of data link wirings (DLL) are separated from each other, so that cracks occurring in the plurality of bending detection patterns (140) can be minimized from propagating to the plurality of data link wirings (DLL).

FIG. 9A is an enlarged plan view of a portion of a bending area of a display device according to another embodiment of the present specification. FIG. 9B is a schematic cross-sectional view taken along line IX-IX' of FIG. 9A. The display device (900) of FIGS. 9A and 9B differs from the display device (100) of FIGS. 1 to 4 in the structure of the second planarization layer (913), and since other descriptions are substantially the same, a duplicate description will be omitted.

Referring to FIGS. 9a and 9b, the second planarization layer (913) can be separated into a plurality of spaced apart planarization patterns that cover each of the plurality of bending detection patterns (140). For example, the second planarization layer (913) includes a first planarization pattern (913a), a second planarization pattern (913b), and a third planarization pattern (913c). The first planarization pattern (913a) is a planarization layer that covers the first bending detection pattern (141), the second planarization pattern (913b) is a planarization layer that covers the second bending detection pattern (142), and the third planarization pattern (913c) is a planarization layer that covers the third bending detection pattern (143).

A display device (900) according to another embodiment of the present specification may reduce the propagation of a crack generated in one of the plurality of bending detection patterns (140) by forming the second planarization layer (913) as a plurality of spaced apart planarization patterns that cover each of the plurality of bending detection patterns (140). For example, as the display device (900) is bent, a crack may occur in some of the plurality of bending detection patterns (140). The bending curvatures of each of the plurality of sub-bending areas (SBA1, SBA2, SBA3) in which the plurality of bending detection patterns (140) are positioned may be different, and a bending detection pattern positioned in a sub-bending area having a large bending curvature may be more likely to crack because it receives a greater stress compared to a bending detection pattern positioned in a sub-bending area having a small bending curvature. In addition, cracks that occur in some bending detection patterns may be propagated to other bending detection patterns or data link wiring (DLL) through the second planarization layer (913). If a crack that occurs in some bending detection patterns is propagated to other bending detection patterns, the resistance value of the bending detection pattern to which the crack has propagated may be significantly increased, and thus it may be measured that a crack has occurred. Accordingly, a problem may occur in which the bending detection pattern to which the crack has propagated is measured as the bending detection pattern in which a crack has occurred. Accordingly, in a display device (900) according to another embodiment of the present specification, the second planarization layer (913) covering the plurality of bending detection patterns (140) is separated from each other to cover each of the plurality of bending detection patterns (140), thereby minimizing cracks that occur in some of the plurality of bending detection patterns (140) from being propagated to other bending detection patterns. Accordingly, the sub-bending area in which the bending detection pattern in which the crack has occurred is arranged can be accurately determined.

Fig. 10 is an enlarged plan view of a display device according to another embodiment of the present specification. The display device (1000) illustrated in Fig. 10 includes a temperature resistance detection pattern (1090) compared to the display device (100) illustrated in Figs. 1 to 4, and other descriptions are substantially the same, so redundant descriptions are omitted.

Referring to FIG. 10, a display device (1000) according to an embodiment of the present specification includes a temperature resistance detection pattern (1090) that detects a resistance value of a pattern that changes according to a change in temperature of the display device (1000). The temperature resistance detection pattern (1090) may be located in a pad area (PA). However, the present invention is not limited thereto, and the temperature resistance detection pattern (1090) may be located in any area that is not bent, for example, except for a bending area (BA). For example, the temperature resistance detection pattern (1090) may be located in a link area (LA) or a bezel area (ZA) located on both sides of the display area (AA).

When the temperature of the display device (1000) rises or falls significantly, damage to the elements included in the display device (1000) may occur. Therefore, in the display device (1000) according to another embodiment of the present specification, damage to the elements due to temperature can be detected by measuring a change in the resistance value of the resistance detection pattern (1090) with respect to temperature.

Referring to FIG. 10, the resistance detection pattern (1090) for temperature may share a pad (P) with one of the plurality of bending detection patterns (140). For example, a resistance detection wire connected to one end of the resistance detection pattern (1090) for temperature may be connected to a bending detection wire (1050) connected to one end of the first bending detection pattern (141), and may be connected to the same pad (P). Since the tasks of measuring the resistance values for the resistance detection pattern (1090) for temperature and the first bending detection pattern (141) are performed separately, there is no problem in measuring the resistance values even if the resistance detection pattern (1090) for temperature and the first bending detection pattern (141) share a pad (P). Accordingly, in a display device (1000) according to another embodiment of the present specification, the temperature resistance detection pattern (1090) shares a pad (P) with one of a plurality of bending detection patterns (140), thereby minimizing the number of pads (P) and minimizing the area of the bezel area (ZA).

In addition, although not shown in FIG. 10, each of the plurality of bending detection patterns (140) may share a pad (P) with each other so that the number of pads (P) can be minimized and the area of the bezel area (ZA) can be minimized.

FIG. 11 is an enlarged plan view of a display device according to another embodiment of the present specification, and for convenience of explanation, the display device (1100) is illustrated before the COF (120) is bonded.

The display device (1100) according to the embodiment of the present specification illustrated in FIG. 11 is substantially the same as the components of the display device (100) illustrated in FIGS. 1 to 4, except for the temperature monitoring pattern (250) and the bending monitoring pattern (240). Therefore, a detailed description of components other than the temperature monitoring pattern (250) and the bending monitoring pattern (240) in FIG. 11 is omitted.

Referring to FIG. 11, a display device (1100) may include a display area (AA) in which display elements and various driving elements for driving the display elements are arranged as an area where an image is displayed, and a bezel area (ZA) in which wiring or circuitry is arranged as an area where an image is not displayed. The bezel area (ZA) may include a bending area (BA), a link area (LA), and a pad area (PA). In addition, the display area (AA) may include a plurality of pixels (PX) connected to a data wire (DL) that transmits a data signal. The data wire (DL) is electrically connected to a data link wire (DLL). The data link wire (DLL) electrically connected to the data wire (DL) may be arranged in the link area (LA), the bending area (BA), and the pad area (PA) to electrically connect a pad (P) of the pad area (PA) and the data wire (DL) of the display area (AA).

The bending area (BA) refers to an area where the flexible substrate (110) is bent. The bending area (BA) may be arranged adjacent to one side of the link area (LA). The link area (LA) may be located between the display area (AA) and the bending area (BA).

The pad area (PA) may be an area where a plurality of pads (P) are formed. The pad area (PA) may be arranged adjacent to one side of the bending area (BA). The bending area (BA) may be located between the pad area (PA) and the link area (LA).

As the flexible substrate (110) is bent, the data link wiring (DLL) may be formed in various shapes, such as a zigzag shape or a diamond shape, in order to reduce damage to the data link wiring (DLL) in the bending area (BA) of the flexible substrate (110). For example, as illustrated in FIG. 11, in order to prevent cracks from occurring in the data link wiring (DLL) corresponding to the bending area (BA) of the display device (1100), the data link wiring (DLL) may be formed to have a zigzag shape. The zigzag shape may be formed in the data link wiring (DLL) located in the area corresponding to the bending area (BA) among the data link wirings (DLL) formed in the bezel area (ZA).

Referring to FIG. 11, the display device (1100) may include a bending monitoring pattern (240) disposed in a bending area (BA) and a temperature monitoring pattern (250) disposed in a pad area (PA). The bending monitoring pattern (240) may be a pattern for monitoring a degree of bending of the bending area (BA) of the display device (1100). The temperature monitoring pattern (250) may be a pattern for monitoring a resistance value of a pattern that changes according to a temperature change of the display device (1100) of the display device (1100). The temperature monitoring pattern (250) may be disposed in an area other than the bending area (BA). For example, the temperature monitoring pattern (250) may be disposed in a link area (LA) or a bezel area (ZA) located on both sides of the display area (AA).

The resistance value of the bending monitoring pattern (240) may change depending on the degree to which the bending area (BA) is bent. By measuring the resistance value of the bending monitoring pattern (240) changed after bending compared to the initial resistance value of the bending monitoring pattern (240) before bending, the degree to which the display device (1100) is bent can be monitored.

The bending monitoring pattern (240) can be configured to detect stress in the bending area (BA) that occurs as the bending area (BA) of the bezel area (ZA) bends.

When the temperature of the display device (1100) rises or falls significantly, damage to the elements included in the display device (1100) may occur. Therefore, in the display device (1100) according to the embodiment of the present specification, damage to the elements due to temperature can be detected by measuring a change in the resistance value of the temperature monitoring pattern (250).

Referring to FIG. 11, the plurality of pads (P) may include a plurality of monitoring pads (MP) and a plurality of pixel pads (PP). The plurality of monitoring pads (MP) may be electrically connected to a temperature monitoring pattern (250) or a bending monitoring pattern (240) through a connection wire (310). In addition, the plurality of pixel pads (PP) may be electrically connected to a plurality of pixels (PX) of a display area (AA) through a plurality of data link wires (DLL).

The temperature monitoring pattern (250) may share one of the plurality of monitoring pads (MP) with the bending monitoring pattern (240). For example, as illustrated in FIG. 11, the temperature monitoring pattern (250) disposed in the pad area (PA) of the display device (1100) may be electrically connected to the first monitoring pad (MP1) and the second monitoring pad (MP2) of the plurality of monitoring pads (MP). In addition, the bending monitoring pattern (240) disposed in the bending area (BA) of the display device (1100) may be electrically connected to the second monitoring pad (MP2) and the third monitoring pad (MP3) of the plurality of monitoring pads (MP). The temperature monitoring pattern (250) and the bending monitoring pattern (240) may share the second monitoring pad (MP2).

One end of the temperature monitoring pattern (250) can be electrically connected to the first monitoring pad (MP1). And, the other end of the temperature monitoring pattern (250) can be electrically connected to the second monitoring pad (MP2). One end of the bending monitoring pattern (240) can be electrically connected to the third monitoring pad (MP3). And, the other end of the bending monitoring pattern (240) can be electrically connected to the second monitoring pad (MP2). The other end of the temperature monitoring pattern (250) and the other end of the bending monitoring pattern (240) can be connected together to the second monitoring pad (MP2).

The bending monitoring pattern (240) can be connected to the connecting wire (310). The connecting wire (310) can be connected to the pad (P). The connecting wire (310) is a wire that allows the bending monitoring pattern (240) and the pad (P) to be electrically connected. In addition, the temperature monitoring pattern (250) can be connected to the connecting wire (310). The connecting wire (310) is a wire that allows the temperature monitoring pattern (250) and the pad (P) to be electrically connected.

The connecting wire (310) may include a first connecting wire (311), a second connecting wire (312), and a third connecting wire (313). The first connecting wire (311) may electrically connect the temperature monitoring pattern (250) and the first monitoring pad (MP1). The second connecting wire (312) may electrically connect the temperature monitoring pattern (250) and the second monitoring pad (MP2). In addition, the second connecting wire (312) may electrically connect the bending monitoring pattern (240) and the second monitoring pad (MP2). The bending monitoring pattern (240) and the temperature monitoring pattern (250) may share the second connecting wire (312). The third connecting wire (313) may electrically connect the bending monitoring pattern (240) and the third monitoring pad (MP3).

One end of the temperature monitoring pattern (250) can be electrically connected to the first monitoring pad (MP1) through the first connection wire (311). Then, the other end of the temperature monitoring pattern (250) can be electrically connected to the second monitoring pad (MP2) through the second connection wire (312). One end of the bending monitoring pattern (240) can be electrically connected to the third monitoring pad (MP3) through the third connection wire (313). Then, the other end of the bending monitoring pattern (250) can be electrically connected to the second monitoring pad (MP2) through the second connection wire (312). The other end of the temperature monitoring pattern (250) and the other end of the bending monitoring pattern (240) can share the second connection wire (312). And, the other end of the temperature monitoring pattern (250) and the other end of the bending monitoring pattern (240) can be electrically connected to the second monitoring pad (MP2) through the second connecting wire (312).

The change in temperature can be monitored by measuring the change in resistance value in the temperature monitoring pattern (250) through the first monitoring pad (MP1) and the second monitoring pad (MP2). In addition, the degree to which the bending area (BA) of the display device (1100) is bent can be monitored by measuring the change in resistance value in the bending monitoring pattern (240) through the second monitoring pad (MP2) and the third monitoring pad (MP3).

As illustrated in FIG. 12, a plurality of data link wires (DLLs) each connected to a plurality of data wires (DL) may be positioned at the center of the flexible substrate (110). In addition, the bending monitoring pattern (240) may be positioned on both sides of the plurality of data link wires (DLLs). For example, the plurality of data link wires (DLLs) may be positioned at the center of the bending area (BA) of the display device (1100), and the bending monitoring pattern (240) may be positioned on the left and right sides of the plurality of data link wires (DLLs). However, the present invention is not limited thereto, and the bending monitoring pattern (240) may be positioned on only one of the left and right sides of the plurality of data link wires (DLLs) positioned at the center of the bending area (BA).

In the process of bending the bending area (BA) of the display device (1100), the bending area (BA) may be bent in a manner that is different from the design. For example, in the process of bending the display device (1100), the bending may not be performed accurately based on the boundary between the bending area (BA) and the link area (LA), or the boundary between the bending area (BA) and the pad area (PA). If the bending is not performed accurately, the display device (1100) may be bent in a diagonal direction of the boundary between the bending area (BA) and the link area (LA) or the boundary between the bending area (BA) and the pad area (PA). In this way, if the bending is not performed accurately, the bending monitoring patterns (240) respectively arranged on both sides of the plurality of data link wires (DLL) may have different resistance values.

When the bending is done accurately, the central area (C) of the bending area (BA) can be formed in a first direction which is a horizontal direction. The first direction which is a horizontal direction can be a direction which is perpendicular to a plurality of data link lines (DLL). Alternatively, the first direction which is a horizontal direction can be a direction which is perpendicular to a second direction which is a direction in which the flexible substrate (110) of the display device (1100) is bent.

In a case where the flexible substrate (110) of the display device (1100) is not bent exactly in the first direction, the central area (C) of the bending area (BA) may be formed in a diagonal direction. The diagonal direction may be a direction tilted at a certain angle with respect to the first direction, which is a horizontal direction.

When the display device (1100) is bent diagonally with respect to the boundary between the bending area (BA) and the link area (LA), the bending monitoring patterns (240) respectively arranged on both sides of the plurality of data link wires (DLL) may have different resistance values. In this way, when the display device (1100) is bent misaligned, the difference between the resistance value of the first bending monitoring pattern (241) arranged on the left side of the data link wire (DLL) and the resistance value of the second bending monitoring pattern (242) arranged on the right side of the data link wire (DLL) may be very large. By comparing the resistance value of the first bending monitoring pattern (241) and the resistance value of the second bending monitoring pattern (242), it is possible to determine whether the display device (1100) is accurately bent.

When the display device (1100) is accurately bent, the first bending monitoring pattern (241) arranged on the left side of the plurality of data link wires (DLLs) and the second bending monitoring pattern (242) arranged on the right side of the data link wires (DLLs) have substantially the same bending degree, so that the resistance value of the first bending monitoring pattern (241) and the resistance value of the second bending monitoring pattern (242) can be substantially the same.

As illustrated in Fig. 12, the first bending monitoring pattern (241) and the second bending monitoring pattern (242) arranged in the bending area (BA) of the display device (1100) may have the same shape. In addition, the first temperature monitoring pattern (251) and the second temperature monitoring pattern (252) may have different shapes.

The bending monitoring pattern (240) may have a protrusion and a concave portion. In addition, the protrusion of the bending monitoring pattern (240) may protrude in a first direction, which is a horizontal direction, and a second direction, which is a vertical direction. In addition, the concave portion of the bending monitoring pattern (240) may be formed concavely in the second direction. The second direction may be the same direction as the direction in which the flexible substrate (1100) of the display device (1100) is bent. Since the bending monitoring pattern (240) is a pattern that monitors the degree to which the flexible substrate (110) is bent, the protrusion direction of the protrusion and the concave direction of the concave portion of the bending monitoring pattern (240) may be formed in the same direction as the direction in which the flexible substrate (110) is bent. Accordingly, the first bending monitoring pattern (241) arranged on the left side of the data link wiring (DLL) and the second bending monitoring pattern (242) arranged on the right side of the data link wiring (DLL) may have the same pattern shape.

Referring to FIG. 12, a plurality of data link lines (DLL) each connected to a plurality of data lines (DL) may be positioned at the center of the flexible substrate (110). In addition, the temperature monitoring patterns (250) may be arranged on both sides of the data link lines (DLL). The first temperature monitoring pattern (251) and the second temperature monitoring pattern (252) arranged in the pad area (PA) of the flexible substrate (110) of the display device (1100) may have different shapes. However, the present invention is not limited thereto, and the first temperature monitoring pattern (251) and the second temperature monitoring pattern (252) may have the same shape.

At least one of the first temperature monitoring pattern (251) and the second temperature monitoring pattern (252) may have a different shape from the bending monitoring pattern (240). For example, at least one of the first temperature monitoring pattern (251) and the second temperature monitoring pattern (252) may have a protrusion protruding in a first direction, which is a horizontal direction, and a concave portion recessed in the first direction. Referring to FIG. 12, among the first temperature monitoring pattern (251) and the second temperature monitoring pattern (252), the first temperature monitoring pattern (251) may have a different shape from the bending monitoring pattern (240). The first temperature monitoring pattern (251) may have a protrusion protruding in a first direction, which is a horizontal direction, and a concave portion recessed in the first direction. In addition, the second monitoring pattern (252) may have a protrusion protruding in a second direction, which is perpendicular to the first direction, and a concave portion recessed in the second direction, like the bending monitoring pattern (240). However, the present invention is not limited thereto. For example, a first temperature monitoring pattern (251) arranged on the left side of a plurality of data link wirings (DLLs) may have the same shape as the bending monitoring pattern (240), and a second temperature monitoring pattern (252) arranged on the right side of the data link wiring (DLL) may have a different shape from the bending monitoring pattern (240).

A plurality of pads (P) of a pad area (PA) may include a plurality of pixel pads (PP), and a plurality of monitoring pads (MP) positioned on the left and right sides of the plurality of pixel pads (PP). The plurality of pixel pads (PP) may be electrically connected to a plurality of pixels (PX) of a display area (AA) through a plurality of data link lines (DLL). Referring to FIG. 12, a first temperature monitoring pattern (251) and a first bending monitoring pattern (241) may share one of the plurality of monitoring pads (MP) formed on the left side of the plurality of pixel pads (PP). In addition, a second temperature monitoring pattern (252) and a second bending monitoring pattern (242) may share one of the plurality of monitoring pads (MP) formed on the right side of the plurality of pixel pads (PP).

Fig. 13 is a schematic plan view for explaining a display device according to one embodiment of the present specification. Referring to Fig. 13, the display device (300) may include an active area (AA) where information is displayed and a bezel area (ZA) where information is not displayed.

The active area (AA) may be an area where an input image is displayed and where multiple pixels (P) are arranged in a matrix type. In addition, the bezel area (ZA) may include a pad area (PA) where a pad part is arranged, a bending area (BA) where the substrate (310) is bent, and a link area (LA).

The link area (LA) may be arranged between the display area (AA) and the bezel area (BA). In addition, the link area (LA) is an area where link wires for transmitting signals to wires arranged in the display area (AA) are arranged, and various link wires may be arranged. For example, gate link wires (GLLa, GLLb), data link wires (DLL1 to DLLn), and first link power supply lines (VDL1 to VDLn), etc. may be arranged in the link area (LA).

The bending area (BA) may be an area where the substrate (310) is bent. The bending area (BA) may be arranged between the link area (LA) and the pad area (PA). The substrate (310) may be maintained in a flat state without being bent in an area excluding the bending area (BA), and may be configured such that only the substrate (310) in the bending area (BA) is bent. Accordingly, the display device (300) may be bent so that the substrate (310) in two non-bending areas excluding the bending area (BA) of the substrate (310) face each other.

The pad area (PA) may be an area where no image is displayed and where multiple pads are formed. The pad area (PA) may be an area extending from one side of the bending area (BA). The pad area (PA) may be an area where multiple pads are arranged. For example, it may be an area where first power supply pads (VDPa, VDPb), data pads (Data1 to Datan), gate pads (GIPa, GIPb), second power supply pads (VSPa, VSPb), and dummy pads (DPa, DPb) are arranged.

In the bezel area (ZA), gate driving circuit gate driving units (GIPDa, GIPDb), gate link wires (GLLa, GLLb), data link wires (DLL1 to DLLn), first link power supply lines (VDL1 to VDLn), second link power supply lines (VSL1, VSL2), and first power supply electrodes (VDL) may be arranged.

And, in the active area (AA), a plurality of data lines (DL1 to DLn) and a plurality of gate lines (GL1 to GLn) may be arranged to intersect each other. And, each of these intersecting areas may include pixels (PX) arranged in a matrix form.

Each pixel (PX) may include a light emitting diode (LED), a driving thin film transistor (hereinafter referred to as a driving TFT) for controlling the amount of current flowing through the light emitting diode (LED), and a programming section (SC) for setting a gate-source voltage of the driving TFT (DT). The pixels (PX) of the display device (300) may be supplied with a first power supply (Vdd), which is a high-potential voltage, through first power supply lines (VD1 to VDn), and may be supplied with a second power supply (Vss), which is a low-potential voltage, through second link power supply lines (VSL1, VSL2).

The first power lines (VD1 to VDn) can be supplied with the first power (Vdd) through the first power supply pads (VDPa, VDPb) and the first power supply electrode (VDL) arranged in the bezel area (ZA). The first power (Vdd) supplied through the first power supply electrode (VDL) can be supplied to the first power lines (VD1 to VDn) arranged in the active area (AA) through the first link power supply lines (VDL1 to VDLn). For example, the first power supply (Vdd) can be supplied to the first power supply electrode (VDL) of the link area (LA) through the first power supply pad (VDPa, VDPb) of the pad area (PA), and the first power supply (Vdd) supplied to the first power supply electrode (VDL) can be supplied to the first power line (VD1 to VDn) of the active area (AA) through the first link power supply line (VDL1 to VDLn) of the link area (LA).

Additionally, the second power supply (Vss) can be supplied to the second link power supply lines (VSL1, VSL2) through the second power supply pads (VSPa, VSPb) of the pad area (PA).

The programming section (SC) may include at least one switch TFT and at least one storage capacitor. The switch TFT may be turned on in response to a scan signal from the gate lines (GL1 to GLn), thereby applying a data voltage from the data lines (DL1 to DLn) to one electrode of the storage capacitor. The driving TFT (DT) may control the amount of current supplied to the light emitting diode (LED) according to the magnitude of the voltage charged in the storage capacitor, thereby controlling the light emission amount of the light emitting diode (LED). The light emission amount of the light emitting diode (LED) may be proportional to the amount of current supplied from the driving TFT (DT).

The TFTs constituting the pixel (PX) may be implemented as a p type or an n type. In addition, the semiconductor layer of the TFTs constituting the pixel (PX) may include at least one of amorphous silicon, polysilicon, or an oxide semiconductor material. The light emitting diode (LED) includes an anode electrode, a cathode electrode, and a light emitting structure interposed between the anode electrode and the cathode electrode. The anode electrode may be connected to a driving TFT (DT). The light emitting structure includes an emission layer (EML), and a hole injection layer (HIL) and a hole transport layer (HTL) may be disposed on one side of the emission layer, and an electron transport layer (ETL) and an electron injection layer (EIL) may be disposed on the other side, respectively.

The data voltage can be supplied to the data link wiring (DLL1 to DLLn) of the link area (LA) through the data pads (Data1 to Datan) of the pad area (PA). And, the data voltage supplied to the data link wiring (DLL1 to DLLn) can be supplied to the data lines (DL1 to DLn) of the active area (AA).

The gate driving voltage can be supplied to the gate link wiring (GLLa, GLLb) of the link area (LA) through the gate pad (GIPa, GIPb) of the pad area (PA). Then, the gate driving voltage supplied to the gate link wiring (GLLa, GLLb) can be supplied to the gate driving unit (GIPDa, GIPDb). Then, the gate driving voltage can be supplied to the gate lines (GL1 to GLn) of the active area (AA) through the gate driving unit (GIPDa, GIPDb). In addition to the gate driving voltage, the gate driving unit (GIPDa, GIPDb) can receive signals such as a start pulse, gate shift clocks, and a flicker signal. Then, the gate driving voltage such as a gate high voltage (VGH) and a gate low voltage (VGL) can be supplied. The start pulse, the gate shift clock, and the flicker signal can be signals swinging between approximately 0 V and 3.3 V. The gate shift clock may be n-phase clock signals having a predetermined phase difference. The gate high voltage (VGH) may be a voltage higher than the threshold voltage of a thin film transistor (TFT) formed in the thin film transistor array of the display device (300), and may be a voltage of approximately 28 V, and the gate low voltage (VGL) may be a voltage lower than the threshold voltage of a thin film transistor (TFT) formed in the thin film transistor array of the display device (300), and may be a voltage of approximately -5 V or so, but is not limited thereto.

Although FIG. 13 illustrates a configuration in which gate drivers (GIPDa, GIPDb) are arranged on both sides outside the active area (AA) to supply gate pulses to gate lines (GL1 to GLn) from both ends of the active area (AA), the present specification is not limited thereto, and the gate drivers may be arranged only on one side of the active area (AA) to supply gate pulses to the gate lines (GL1 to GLn) from one side of the active area (AA). When the gate drivers (GIPDa, GIPDb) are arranged on both sides outside the active area (AA), gate pulses having the same phase and the same amplitude can be supplied to pixels (PXs) arranged in the same horizontal line through the gate lines.

Referring to FIG. 13, the display device (300) may include dummy pads (DPa, DPb) and dummy pad lines (DPLa, DPLb) arranged in the pad area (PA). The dummy pads (DPa, DPb) may serve to monitor the degree of bending of the bending area (BA) in the display device (300). The dummy pads (DPa, DPb) may be arranged on both sides of the pad area (PA). For example, as illustrated in FIG. 13, the first dummy pad (DPa) may be arranged on the left side of the pad area (PA), and the second dummy pad (DPb) may be arranged on the right side of the pad area (PA).

And, the dummy pad lines (DPLa, DPLb) can connect the second link power supply lines (VSL1, VSL2) and the dummy pads (DPa, DPb). The dummy pad lines (DPLa, DPLb) can include a first dummy pad line (DPLa) and a second dummy pad line (DPLb). The first dummy pad line (DPLa) can be arranged in the pad area (PA), and the first dummy pad line (DPLa) can be electrically connected to the seconda link power supply line (VSL1) in the pad area (PA). However, the present invention is not limited thereto, and the first dummy pad line (DPLa) can be electrically connected to the seconda link power supply line (VSL1) in the link area (LA). The first dummy pad line (DPLa) can electrically connect the seconda link power supply line (VSL1) and the first dummy pad (DPa).

The second dummy pad line (DPLb) may be arranged in the pad area (PA), and the second dummy pad line (DPLb) may be electrically connected to the secondb link power supply line (VSL2) in the link area (LA). However, the present invention is not limited thereto, and the second dummy pad line (DPLb) may be electrically connected to the secondb link power supply line (VSL2) in the link area (LA). The second dummy pad line (DPLb) may electrically connect the secondb link power supply line (VSL2) and the second dummy pad (DPb).

In FIG. 13, the first dummy pad line (DPLa) is electrically connected to the seconda link power supply line (VSL1) in the pad area (PA), and the second dummy pad line (DPLb) is electrically connected to the secondb link power supply line (VSL2) in the link area (LA), but is not limited thereto. For example, the first dummy pad line (DPLa) may be electrically connected to the seconda link power supply line (VSL1) in the link area (LA), and the second dummy pad line (DPLb) may be electrically connected to the secondb link power supply line (VSL2) in the pad area (LA). Alternatively, the first dummy pad line (DPLa) and the second dummy pad line (DPLb) may both be electrically connected to the seconda link power supply line (VSL1) and the secondb link power supply line (VSL2) in the pad area (PA), respectively. Alternatively, the first dummy pad line (DPLa) and the second dummy pad line (DPLb) may both be electrically connected to the seconda link power supply line (VSL1) and the secondb link power supply line (VSL2), respectively, in the link area (LA).

The resistance values of the second link power supply lines (VSL1, VSL2) may change depending on the degree to which the bending area (BA) is bent. By measuring the resistance values of the second link power supply lines (VSL1, VSL2) after bending compared to the initial resistance values of the second link power supply lines (VSL1, VSL2) before bending, the degree to which the display device (300) is bent can be monitored.

The dummy pads (DPa, DPb) can be configured to detect a change in the resistance value of the second link power supply lines (VSL1, VSL2) that occurs as the bending area (BA) of the bezel area (ZA) is bent by electrically connecting the dummy pad lines (DPLa, DPLb) to the second link power supply lines (VSL1, VSL2). In addition, the dummy pads (DPa, DPb) can be configured to detect a stress in the bending area (BA). For example, the dummy pads (DPa, DPb) can be electrically connected to the second link power supply line (VSL1) through the first dummy pad (DPa) and the first dummy pad line (DPLa). And, the degree to which the display device (300) is bent can be monitored by measuring the change in the resistance value of the second a link power supply line (VSL1) through the second a power supply pad (VSPa) electrically connected to the first dummy pad (DPa) and the second a link power supply line (VSL1).

In addition, the degree to which the display device (300) is bent can be monitored by measuring a change in the resistance value of the second b link power supply line (VSL2) through the second b power supply pad (VSPb) electrically connected to the second dummy pad (DPb) and the second b link power supply line (VSL2).

The data link wirings (DLL1 to DLLn) each connected to the data wirings (DL1 to DLn) and the data pads (Data1 to Datan) connected to the data link wirings (DLL1 to DLLn) may be located at the center of the substrate (310). In addition, the second link power supply lines (VSL1, VSL2) may be arranged on the left and right sides of the plurality of data link wirings (DLL1 to DLLn). In addition, the second power supply pads (VSPa, VSPb) connected to the second link power supply lines (VSL1, VSL2) may be arranged on the left and right sides of the data pads (Data1 to Datan).

In addition, dummy pad lines (DPLa, DPLb) electrically connected to the second link power supply lines (VSL1, VSL2) may be arranged on the left and right sides of the plurality of data link wirings (DLL1 to DLLn). In addition, dummy pads (DPa, DPb) electrically connected to the dummy pad lines (DPLa, DPLb) may be arranged on the left and right sides of the data pads (Data1 to Datan).

For example, the data link wirings (DLL1 to DLLn) each connected to the data wirings (DL1 to DLn) may be arranged in the central portion of a bezel area (ZA) located at an upper portion of the substrate (310). In addition, the data pads (Data1 to Datan) connected to the data link wirings (DLL1 to DLLn) may be arranged in the central portion of the bezel area (ZA) located at an upper portion of the substrate (310). In addition, the second a power supply pad (VSPa) may be arranged on the left side of the data pads (Data1 to Datan), and the second a link power supply line (VSL1) connected to the second a power supply pad (VSPa) may be arranged on the left side of the data link wirings (DLL1 to DLLn). Additionally, the second power supply pad (VSPb) may be arranged on the right side of the data pads (Data1 to Datan), and the second link power supply line (VSL2) connected to the second power supply pad (VSPb) may be arranged on the right side of the data link wiring (DLL1 to DLLn).

And, the first dummy pad (DPa) may be arranged on the left side of the seconda power supply pad (VSPa). In addition, the first dummy pad line (DPLa) connecting the first dummy pad (DPa) and the seconda link power supply line (VSL1) may be arranged on the left side of the seconda link power supply line (VSL1).

And, the second dummy pad (DPb) may be arranged on the right side of the secondb power supply pad (VSPb). In addition, the second dummy pad line (DPLb) connecting the second dummy pad (DPb) and the secondb link power supply line (VSL2) may be arranged on the right side of the secondb link power supply line (VSL2).

Referring to FIG. 13, the second dummy pad line (DPLb) may be formed in the same pattern as the second link power supply line (VSL1) corresponding to the bending area (BA). For example, the second dummy pad line (DPLb) may be formed in the same zigzag pattern as the pattern of the second link power supply line (VSL1) corresponding to the bending area (BA) in the bending area (BA). In addition, although FIG. 13 illustrates that only the second dummy pad line (DPLb) is formed in the zigzag pattern in the bending area (BA), the first dummy pad line (DPLa) may also be formed in the same zigzag pattern as the second dummy pad line (DPLb). However, the shapes of the dummy pad lines (DPLa, DPLb) are not limited thereto, and may be formed in a pattern having a protrusion portion and a concave portion.

FIGS. 14A and 14B are enlarged plan views of a display device according to another embodiment of the present specification. FIGS. 14A and 14B are enlarged plan views of area D in FIG. 13. Referring to FIGS. 14A and 14B, the second dummy pad line (DPLb) may have a protrusion and a concave portion in the bending area (BA). Further, the protrusion of the second dummy pad line (DPLb) may protrude in a second direction that is perpendicular to a first direction that is a horizontal direction. Further, the concave portion of the second dummy pad line (DPLb) may be formed to be concave in the second direction. The second direction may be the same direction as the direction in which the substrate (310) of the display device (300) is bent. In order to monitor the degree to which the substrate (310) is bent, the second dummy pad line (DPLb) may have a protrusion and a concave portion formed in the same direction as the direction in which the substrate (310) is bent in the bending area (BA). The first dummy pad line (DPLa) may have a shape of the same pattern as the second dummy pad line (DPLb). Accordingly, the first dummy pad line (DPLb) may have a protrusion and a concave portion in the bending area (BA).

And, referring to FIG. 14a, one end of the second dummy pad line (DPLb) may be connected to the secondb link power supply line (VSL2) in the link area (LA). In addition, the other end of the second dummy pad line (DPLb) may be connected to the second dummy pad (DPb) in the pad area (PA). And, in the bending area (BA), the substrate (310) may have a pattern of protrusions and recesses in the same direction as the bending direction. And, one end of the first dummy pad line (DPLb) may also be connected to the seconda link power supply line (VSL1) in the link area (LA). The other end of the first dummy pad line (DPLa) may be connected to the first dummy pad (DPa) in the pad area (PA). And, in the bending area (BA), the substrate (310) may have a pattern of protrusions and recesses in the same direction as the bending direction.

Referring to FIG. 14b, one end of the second dummy pad line (DPLb) may be connected to the secondb link power supply line (VSL2) in the pad area (PA). The other end of the second dummy pad line (DPLb) may also be connected to the second dummy pad (DPb) in the pad area (PA). In addition, one end of the first dummy pad line (DPLb) may be connected to the seconda link power supply line (VSL1) in the pad area (PA). The other end of the first dummy pad line (DPLa) may also be connected to the first dummy pad (DPa) in the pad area (PA). In addition, the substrate (310) may have a pattern of protrusions and recesses in the same direction as the direction in which it is bent in the bending area (BA).

In order to measure a resistance value, at least two pad terminals are required. The display device according to the embodiment of the present specification can measure the resistance value using the first dummy pad (DPa) and the seconda power supply pad (VSPa), for example, in order to measure the stress applied to the left side of the bezel area (ZA). In this way, by using the seconda power supply pad (VSPa) as one terminal without arranging a separate pad terminal, the area of the bezel area (ZA) can be reduced. In addition, in order to measure the stress applied to the right side of the bezel area (ZA), the resistance value can be measured using the second dummy pad (DPb) and the secondb power supply pad (VSPb). In this way, by using the secondb power supply pad (VSPb) as one terminal without arranging a separate pad terminal, the area of the bezel area (ZA) can be reduced.

A display device according to embodiments of the present specification can be described as follows.

A display device according to an embodiment of the present disclosure may include a display area and a bezel area surrounding the display area, wherein the bezel area includes a flexible substrate including a pad area, a link area disposed between the display area and the pad area, and a bending area disposed between the pad area and the link area, a data pad disposed in a central portion of the pad area of the bezel area, second power supply pads disposed on both sides of the data pad, and dummy pads disposed on both sides of the second power supply pad, a data link wiring disposed in the central portion of the bezel area and connected to the data pad, a second link power supply line disposed on both sides of the data link wiring in the bezel area and connected to the second power supply pad, and a dummy pad line disposed on both sides of the second link power supply line in the bezel area and connected to the dummy pad. In addition, one end of the dummy pad line may be connected to the dummy pad, and the other end of the dummy pad line may be connected to the second link power supply line.

According to an embodiment of the present specification, the pad area may further include a first power supply pad and a gate pad arranged on both sides of the data pad.

According to an embodiment of the present specification, the first power supply pad can be supplied with a first power supply (Vdd) that is a high potential voltage.

According to an embodiment of the present specification, the second power supply pad can be supplied with a second power supply (Vss) that is a low potential voltage.

According to an embodiment of the present specification, the second power supply pad may include a 2a power supply pad disposed on a first side of the data pad and a 2b power supply pad disposed on a second side of the data pad, and the second link power supply line may include a 2a link power supply line disposed on a first side of the data link wiring and a 2b power supply line disposed on a second side of the data link wiring. In addition, the 2a link power supply line may be connected to the 2a power supply pad, and the 2b link power supply line may be connected to the 2b power supply pad.

According to an embodiment of the present specification, the dummy pad may include a first dummy pad arranged on a first side of the 2a power supply pad and a second dummy pad arranged on a second side of the 2b power supply pad, and the dummy pad line may include a first dummy pad line arranged on a first side of the 2a link power supply line and a second dummy pad line arranged on a second side of the 2b link power supply line. Then, one end of the first dummy pad line may be connected to the first dummy pad, the other end of the first dummy pad line may be connected to the 2a link power supply line, one end of the second dummy pad line may be connected to the second dummy pad, and the other end of the second dummy pad line may be connected to the 2b link power supply line.

According to an embodiment of the present specification, the other end of the first dummy pad line can be connected to the seconda link power supply line in the link region, and the other end of the second dummy pad line can be connected to the secondb link power supply line in the link region.

According to an embodiment of the present specification, the other end of the first dummy pad line can be connected to the seconda link power supply line in the pad area, and the other end of the second dummy pad line can be connected to the secondb link power supply line in the pad area.

According to an embodiment of the present specification, the first dummy pad line and the second dummy pad line may have a protrusion portion and a concave recess portion that protrude in the same direction as the direction in which the flexible substrate is bent in the bezel area.

According to an embodiment of the present specification, the first dummy pad line and the second dummy pad line may have the same pattern as the seconda link power supply line and the secondb link power supply line in the bezel area.

According to an embodiment of the present specification, the other end of the first dummy pad line can be connected to the seconda link power supply line in the pad region, and the other end of the second dummy pad line can be connected to the secondb link power supply line in the link region.

A display device according to an embodiment of the present specification may include a display area including a plurality of data wires transmitting data signals and a plurality of pixels electrically connected to the plurality of data wires, and a bezel area surrounding the display area, wherein the bezel area may include a flexible substrate including a pad area, a bending area arranged between the pad area and the display area, and a link area arranged between the bending area and the display area, a plurality of data link wires positioned at the center of the bezel area and each connected to the data wires, a seconda power supply line arranged in the bezel area and arranged on a first side of the plurality of data link wires, a secondb power supply line arranged on the second side, and a first dummy pad line arranged in the bezel area and arranged on the first side of the plurality of data link wires, and a second dummy pad line arranged on the second side. In addition, one end of the first dummy pad line may be connected to the 2a power supply line, and one end of the second dummy pad line may be connected to the 2b power supply line. According to another feature of the present specification, at least one of the 2-1 pattern and the 2-2 pattern may include a second protrusion protruding in a first direction perpendicular to the second direction and a second concave portion recessed in the first direction.

According to an embodiment of the present specification, the first dummy pad line and the second dummy pad line may include a protrusion and a concave recess that protrude in the same direction as the direction in which the flexible substrate is bent in the bending region.

According to an embodiment of the present specification, one end of the first dummy pad line can be connected to the seconda power supply line in the pad area, and one end of the second dummy pad line can be connected to the secondb power supply line in the link area.

According to an embodiment of the present specification, the pad area may include a first dummy pad connected to the other end of the first dummy pad line and a second dummy pad connected to the other end of the second dummy pad line.

According to an embodiment of the present specification, a data pad is included that is connected to a plurality of data link wires and is arranged in a central portion of a pad area, and a first dummy pad can be arranged on a first side of the data pad, and a second dummy pad can be arranged on a second side of the data pad.

According to an embodiment of the present specification, the pad region may include a seconda power supply pad disposed between the data pad and the first dummy pad and connected to the seconda power supply line, and a secondb power supply pad disposed between the data pad and the second dummy pad in the pad region and connected to the secondb power supply line.

According to an embodiment of the present specification, a first power supply pad may be disposed between a second power supply pad and a data pad in a pad region, and a first power supply pad may be disposed between a second power supply pad and a data pad in the pad region. In addition, the first power supply pad and the first power supply pad may be supplied with a first power supply (Vdd) that is a high-potential voltage, and the second power supply pad and the second power supply pad may be supplied with a second power supply (Vss) that is a low-potential voltage.

Although the embodiments of the present specification have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical idea of the present specification. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present specification but to explain it, and the scope of the technical idea of the present specification is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are exemplary in all aspects and not restrictive. The protection scope of this specification should be interpreted by the claims below, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of rights of this specification.

100, 500, 600, 700, 900, 800, 1000, 1100: Display Device
110: Flexible substrate
111: Gate insulation layer
112: 1st leveling layer
113, 813, 913: 2nd flattening layer
114: Bank
115: Micro coating layer
120: COF
121: Base Film
122: Drive IC
130: Printed Circuit Board
131: Measuring Pad
132: Measurement Wiring
140, 540, 640, 740: Multiple bend detection patterns
141, 541, 641, 741: First bend detection pattern
142, 542, 642, 742: Second bend detection pattern
143, 543, 643, 743: Third bend detection pattern
150, 650, 750, 1050: Bending detection wiring
160: Thin film transistor
161: Active layer
162: Gate electrode
163: Source electrode
164: Drain electrode
170: Connection electrode
180: Organic light emitting diode
181: Anode
182: Organic light-emitting layer
183: Cathode
171: Polarizing plate
172: 1st back plate
173: 2nd back plate
174: Absence of support
744: 4th bend detection pattern
745: Fifth bend detection pattern
813a, 913a: First flattening pattern
813b, 913b: Second Flattening Pattern
913c: Third Flattening Pattern
1090: Resistance detection pattern for temperature
ZA: Bezel Area
AA: Display Area
PA: Pad area
BA: Bending area
LA: Link Area
P: Pad
MP: Monitoring Pad
PP: Pixel Pad
250: Temperature monitoring pattern
240: Bending monitoring pattern
310: Connection Wiring
DLL: Data Link Wiring
PX: Pixel
DL: Data Wiring

Claims (18)

A flexible substrate comprising a display area and a bezel area surrounding the display area, the bezel area including a pad area, a link area disposed between the display area and the pad area, and a bending area disposed between the pad area and the link area;
A data pad disposed in the center of the pad area of the bezel area, a second power supply pad disposed on both sides of the data pad, and a dummy pad disposed on both sides of the second power supply pad;
Data link wiring disposed on the flexible substrate, disposed in the central portion of the bezel area, and connected to the data pad;
A second link power supply line disposed on the flexible substrate, disposed on both sides of the data link wiring in the bezel area, and connected to the second power supply pad; and
A dummy pad line is disposed on the flexible substrate, and is disposed on both sides of the second link power supply line in the bezel area and is connected to the dummy pad.
One end of the above dummy pad line is connected to make direct contact with the above dummy pad, and the other end of the above dummy pad line is connected to make direct contact with the second link power supply line.
A display device, wherein the above dummy pad line has a plurality of protrusions and a plurality of concave recesses that protrude in the same direction as the direction in which the flexible substrate is bent in the bezel area. In the first paragraph,
A display device further comprising a first power supply pad and a gate pad arranged on both sides of the data pad in the pad area. In the second paragraph,
The above first power supply pad is a display device, which is supplied with a first power supply (Vdd) which is a high potential voltage. In the first paragraph,
The second power supply pad is a display device supplied with a second power supply (Vss) which is a low-potential voltage. In paragraph 4,
The second power supply pad includes a seconda power supply pad arranged on a first side of the data pad and a secondb power supply pad arranged on a second side of the data pad.
The second link power supply line includes a second a link power supply line arranged on a first side of the data link wiring and a second b link power supply line arranged on a second side of the data link wiring,
A display device, wherein the second link power supply line is connected to the second link power supply pad, and the second link power supply line is connected to the second link power supply pad. In paragraph 5,
The above dummy pad includes a first dummy pad arranged on a first side of the seconda power supply pad and a second dummy pad arranged on a second side of the secondb power supply pad.
The above dummy pad line includes a first dummy pad line arranged on a first side of the 2a link power supply line and a second dummy pad line arranged on a second side of the 2b link power supply line,
One end of the first dummy pad line is connected to the first dummy pad, and the other end of the first dummy pad line is connected to the second a link power supply line.
A display device, wherein one end of the second dummy pad line is connected to the second dummy pad, and the other end of the second dummy pad line is connected to the secondb link power supply line. In Article 6,
The other end of the first dummy pad line is connected to the second a link power supply line in the link area,
A display device, wherein the other end of the second dummy pad line is connected to the secondb link power supply line in the link area. In Article 6,
The other end of the first dummy pad line is connected to the second a link power supply line in the pad area,
A display device, wherein the other end of the second dummy pad line is connected to the secondb link power supply line in the pad area. delete In Article 7,
A display device, wherein the first dummy pad line and the second dummy pad line have the same pattern as the seconda link power supply line and the secondb link power supply line in the bezel area. In Article 6,
The other end of the first dummy pad line is connected to the second a link power supply line in the pad area,
A display device, wherein the other end of the second dummy pad line is connected to the secondb link power supply line in the link area. A flexible substrate comprising a display area including a plurality of data wires transmitting data signals and a plurality of pixels electrically connected to the plurality of data wires, and a bezel area surrounding the display area, wherein the bezel area includes a pad area, a bending area arranged between the pad area and the display area, and a link area arranged between the bending area and the display area;
A plurality of data link wires arranged on the flexible substrate, positioned in the central portion of the bezel area, and each connected to the data wire;
A second power supply line disposed on the flexible substrate, disposed in the bezel area, and a second power supply line disposed on the first side of the plurality of data link wirings and a second power supply line disposed on the second side; and
A first dummy pad line is disposed on the flexible substrate, is disposed in the bezel area, and includes a first dummy pad line disposed on the first side of the plurality of data link wirings and a second dummy pad line disposed on the second side.
One end of the first dummy pad line is connected to be in direct contact with the second a power supply line, and one end of the second dummy pad line is connected to be in direct contact with the second b power supply line.
A display device, wherein the first dummy pad line and the second dummy pad line include a plurality of protrusions and a plurality of concave recesses that protrude in the same direction as the direction in which the flexible substrate is bent in the bending area. delete In Article 12,
The above one end of the above first dummy pad line is connected to the above 2a power supply line and the above pad area,
A display device, wherein one end of the second dummy pad line is connected to the secondb power supply line in the link area. In Article 14,
A display device, comprising: a first dummy pad arranged in the pad area and connected to the other end of the first dummy pad line; and a second dummy pad connected to the other end of the second dummy pad line. In Article 15,
A data pad connected to the plurality of data link wirings and positioned in the center of the pad area,
A display device, wherein the first dummy pad is placed on a first side of the data pad, and the second dummy pad is placed on a second side of the data pad. In Article 16,
A second power supply pad, which is positioned between the data pad and the first dummy pad in the pad area and is connected to a second power supply line; and
A display device comprising a secondb power supply pad, which is positioned between the data pad and the second dummy pad in the pad area and is connected to a secondb power supply line. In Article 17,
A first a power supply pad disposed between the second a power supply pad and the data pad in the pad area; and
In the above pad area, a first b power supply pad is disposed between the second b power supply pad and the data pad,
A display device, wherein the first power supply pad and the first power supply pad are supplied with a first power supply (Vdd) that is a high-potential voltage, and the second power supply pad and the second power supply pad are supplied with a second power supply (Vss) that is a low-potential voltage.

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