KR102742364B1 - Ultra-pure water manufacturing apparatus for ultra-fine semiconductor processing with real-time monitoring - Google Patents

Abstract

The present invention comprises a first filter unit for filtering supplied raw water to remove foreign substances contained in the raw water, a reverse osmosis membrane unit for removing foreign substances contained in water filtered by the first filter unit, a storage tank for storing water filtered by the reverse osmosis membrane unit, a second filter unit for removing foreign substances contained in water supplied from the storage tank, a degasser for removing gas present in water from which foreign substances have been removed by the second filter unit, an EDI (Electrodeionization) device for removing ionic substances from water from which gases have been removed by the degasser, a UV lamp unit for irradiating ultraviolet rays to sterilize water from which ionic substances have been removed by the EDI device and decompose organic substances, and a third filter unit for removing foreign substances in water irradiated with ultraviolet rays by the UV lamp unit, wherein the reverse osmosis membrane unit is respectively connected to the first filter unit and comprises a first reverse osmosis membrane for primarily removing foreign substances contained in water filtered by the first filter unit. The present invention provides an ultrapure water manufacturing device including a first reverse osmosis membrane unit having a second reverse osmosis membrane, and a second reverse osmosis membrane unit having a third reverse osmosis membrane that is connected to the first reverse osmosis membrane unit and secondarily removes foreign substances contained in water from which foreign substances have been firstly removed in the first reverse osmosis membrane unit.
Therefore, it has the advantage of being able to quickly produce high-purity ultra-pure water, including double reverse osmosis membranes, dual UV lamps and double UF filters.

Description

Ultra-pure water manufacturing apparatus for ultra-fine semiconductor processing with real-time monitoring

The present invention relates to an ultrapure water manufacturing device, and more specifically, to an ultrapure water manufacturing device having improved production of high-purity ultrapure water per unit time.

The semiconductor (memory) industry is an essential field for almost all fields, including home appliances, automobiles, data centers, and mobile phones. Recently, due to shortages in semiconductor supply, automobile and electronic product factories are shutting down, and the demand for semiconductors is expanding.

Semiconductor processes are becoming finely patterned for high integration and high-speed operation, and are also developing into larger diameter devices for yield improvement. In the "pre-process" stage, which accounts for 77% of the entire semiconductor manufacturing process, the "cleaning process" is a key process, accounting for 31%.

The technological trend of system semiconductors and DRAM memory semiconductors is that circuits are becoming increasingly miniaturized, and the technological trend of NAND memory semiconductors is that vertical stacking technology is important. The most important process for this miniaturization and stacking is the "cleaning" process, which affects each major process, and as the diffusion process → etching process → cleaning process → deposition process is repeated, the demand for related equipment and parts is continuously increasing.

In the semiconductor process, the cleaning process is a process of removing impurities on the wafer surface through chemical treatment, gas, and physical methods. In the case of semiconductor processes that handle very fine processes, even trace impurities such as particles, metals, organic substances, and natural oxide films on the wafer surface can have negative effects on semiconductor yield and reliability, such as pattern defects and electrical characteristic deterioration. Therefore, the "cleaning process" is a very important process, and it takes about twice as long as other processes because it is repeatedly performed in the middle of the process, such as before the diffusion process and after the etching process.

The semiconductor cleaning process is utilized throughout the entire semiconductor process, and the key chemicals utilized in each major process are H2SO4, NH4OH, HCL, and HF, and ultrapure water for semiconductor processes is used together with these key chemicals. Ultrapure water, which is used as applied water in advanced industries, is used as essential water in medical, pharmaceutical, bio, and semiconductor process fields, and the ultrapure water manufacturing equipment that produces this water goes through several stages of purification processes using tap water and groundwater as raw water. The purification method varies depending on the application field of the water, and the required water quality also differs. Ultrapure water refers to extremely pure water with almost no contaminants, with a resistivity in the range of 10 to 18 MΩ cm.

Semiconductor production involves many processes that require washing wafers and the like with water. If the water contains a lot of impurities or has high electrical conductivity, the defect rate increases. In particular, ultrapure water is an essential element in semiconductor production that requires nanometer-level ultrafine processes. Therefore, it is necessary to develop technology that can produce a large amount of high-purity ultrapure water in a short period of time.

Republic of Korea Patent No. 10-1291325

The purpose of the present invention is to provide an ultrapure water manufacturing device with improved production volume of high-purity ultrapure water per unit time.

According to one aspect of the present invention, the present invention comprises a first filter unit for filtering supplied raw water to remove foreign substances contained in the raw water, a reverse osmosis membrane unit for removing foreign substances contained in water filtered by the first filter unit, a storage tank for storing water filtered by the reverse osmosis membrane unit, a second filter unit for removing foreign substances contained in water supplied from the storage tank, a degasser for removing gas present in water from which foreign substances have been removed by the second filter unit, an EDI (Electrodeionization) device for removing ionic substances from water from which gases have been removed by the degasser, a UV lamp unit for irradiating ultraviolet rays to sterilize water from which ionic substances have been removed by the EDI device and decompose organic substances, and a third filter unit for removing foreign substances in water irradiated with ultraviolet rays by the UV lamp unit, wherein the reverse osmosis membrane unit is respectively connected to the first filter unit and primarily removes foreign substances contained in water filtered by the first filter unit. An ultrapure water manufacturing device is provided, comprising a first reverse osmosis membrane section having a first reverse osmosis membrane and a second reverse osmosis membrane, and a second reverse osmosis membrane section communicating with the first reverse osmosis membrane section and having a third reverse osmosis membrane for secondarily removing foreign substances contained in water from which foreign substances have been firstly removed in the first reverse osmosis membrane section.

The ultrapure water manufacturing device according to the present invention has the following effects.

First, it has the advantage of being able to quickly produce high-purity ultra-pure water by including double reverse osmosis membranes, dual UV lamps and double UF filters.

Second, there is an advantage in that inorganic ions and organic substances can be efficiently removed using an EDI device.

Third, it has the advantage of being able to efficiently remove gases dissolved in a fluid, including a degasser using a Hollow Fiber Membrane.

Fourth, there is an advantage in that residual fine metal components can be removed using a metal filter.

Fifth, if the concentration of ultrapure water falls below the set value during the ultrapure water manufacturing process, the ultrapure water can be recycled to maintain the concentration of ultrapure water at an appropriate level.

Sixth, there is an advantage in that it can stably produce ultra-pure water suitable for use in ultra-fine semiconductor processes by controlling each component included in the device in an integrated manner and monitoring it in real time from the control unit.

Figure 1 is a configuration diagram of an ultrapure water manufacturing device according to one embodiment of the present invention.
Figure 2 is a block diagram showing each component controlled by the control unit of the ultrapure water manufacturing device according to Figure 1.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the attached drawings.

Referring to FIGS. 1 and 2, an ultrapure water manufacturing device (100) according to one embodiment of the present invention includes a first filter unit (110), a reverse osmosis membrane unit (120), a storage tank (130), a second filter unit (140), a degasser (150), an EDI (electrodeionization) device (160), a UV lamp unit (170), a third filter unit (180), a recirculation line (190), and a control unit (C). The ultrapure water manufacturing device (100) is used for producing ultrapure water for an ultrafine semiconductor process as an example, but can also be used for producing ultrapure water used in other fields. The ultrapure water manufacturing device (100) has an ultrapure water production capacity of 1,000 L/h or more. The first filter unit (110), the reverse osmosis membrane unit (120), the storage tank (130), the second filter unit (140), the degasser (150), the EDI (Electrodeionization) device (160), the UV lamp unit (170), and the third filter unit (180) are sequentially arranged along the path (direction) along which the raw water is supplied, but the arrangement structure can be changed. The first filter unit (110) serves to remove (filter) foreign substances (large particles) contained in the raw water supplied from the raw water source through the first valve (V1), which is an inlet valve. A pressure switch (PS) and a first pressure gauge (PG1) are sequentially installed between the first valve (V1) and the first filter unit (110). The above first filter unit (110) includes a micro filter (111) and a carbon filter (112).

The above micro filter (111) and carbon filter (112) are sequentially arranged along the direction in which the raw water proceeds. That is, the raw water supplied from the raw water supply source proceeds to the carbon filter (112) through the micro filter (111). Water from which foreign substances have been removed (hereinafter referred to as “first filtered raw water”) is supplied to the reverse osmosis membrane unit (120) by the first pressure pump (P1). The first pressure pump (P1) is arranged between the first filter unit (110) and the reverse osmosis membrane unit (120). The first pressure pump (P1) provides the pressure necessary for smooth filtration in the reverse osmosis membrane unit (120). In addition, a second valve (V2), which is a first solenoid valve, is installed between the first filter unit (110) and the first pressure pump (P1).

The above reverse osmosis membrane unit (120) is communicated with the first filter unit (110) and removes foreign substances contained in the first filtered raw water filtered by the first filter unit (110). As an example, the reverse osmosis membrane unit (120) and the first filter unit (110) are communicated through a CPVC fluid flow pipe having a diameter of 15 mm, but the material and size of the fluid flow pipe can be changed. The reverse osmosis membrane unit (120) includes a first reverse osmosis membrane unit and a second reverse osmosis membrane unit. In addition, the first reverse osmosis membrane unit includes a first reverse osmosis membrane (121) and a second reverse osmosis membrane (122). And the above-mentioned second reverse osmosis membrane section includes a third reverse osmosis membrane (123).

The first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) are each connected to the first filter unit (110) and receive the first filtered raw water, respectively. The first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) are connected in series to the first filter unit (110), but the first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) are arranged (connected) in parallel to each other. Therefore, the first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) are not connected to each other, as an example. However, the present invention is not limited thereto, and the arrangement (connection) structure of the first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) may be changed to a structure in which they are connected to each other. The first reverse osmosis membrane (121) and the second reverse osmosis membrane (122) each primarily remove foreign substances contained in the first filtered raw water.

And the third reverse osmosis membrane (123) is connected to the first reverse osmosis membrane (121) and the second reverse osmosis membrane (122), respectively, so as to receive water (hereinafter referred to as “second filtered raw water”) from which foreign substances have been primarily removed by the first reverse osmosis membrane (121) and the second reverse osmosis membrane (122). The third reverse osmosis membrane (123) plays a role of secondarily removing foreign substances contained in the second filtered raw water. That is, the reverse osmosis membrane part (120) is arranged in a double membrane structure including the first reverse osmosis membrane part and the second reverse osmosis membrane part, so as to remove contaminants more precisely.

And in the reverse osmosis membrane section (120), a first sensor (S1) is arranged to measure the purity of water (hereinafter referred to as “third filtered raw water”) from which foreign substances have been removed by the third reverse osmosis membrane (123). The first sensor (S1) is an example of a sensor that uses an electrical conductivity measurement method, but the type of the first sensor (S1) can be changed.

And, in the third reverse osmosis membrane (123), a first outlet (D1) is formed to discharge the third filtered raw water having a value below the standard whenever necessary. At this time, a third valve (V3), which is a needle valve, and a fourth valve (V4), which is a second solenoid valve, are provided between the third reverse osmosis membrane (123) and the first outlet (D1) to control the drain discharged to the first outlet (D1). The first outlet (D1) is exemplified as a CPVC fluid flow pipe having a diameter of 20 mm, but the material and size of the fluid flow pipe forming the first outlet (D1) can be changed.

The above storage tank (130) is connected to the reverse osmosis membrane unit (120). The storage tank (130) receives the third filtered raw water that has passed through the reverse osmosis membrane unit (120) and stores it inside. The storage tank (130) is equipped with a second sensor (S2), which is a level sensor, to detect the water level of the third filtered raw water stored inside.

And the storage tank (130) is provided with a storage tank discharge port (131) for discharging the third filtered raw water to the outside for use. In addition, the storage tank (130) is provided with a fifth valve (V5) for controlling the flow rate of the third filtered raw water supplied to the second filter unit (140). And the storage tank (130) is provided with a sixth valve (V6) for draining the third filtered raw water.

The second filter unit (140) is connected to the storage tank (130). The second filter unit (140) serves to remove foreign substances contained in the third filtered raw water supplied from the storage tank (130). The type of filter used as the second filter unit (140) is not limited. In addition, between the second filter unit (140) and the degasser (150), a seventh valve (V7) is provided to control the amount of the fourth filtered raw water in the path through which the water from which foreign substances are removed in the second filter unit (140) (hereinafter referred to as “fourth filtered raw water”) proceeds to the degasser (150).

The above-described degasser (150) is connected to the second filter unit (140). The degasser (150) removes gas present in the fourth filtered raw water. Specifically, the degasser (150) removes dissolved oxygen and carbon dioxide present in the fourth filtered raw water, but can also remove other gases. The degasser (150) is, for example, a hydrophobic hollow fiber membrane for efficient removal of dissolved oxygen and carbon dioxide present in the fourth filtered raw water, but the type of the degasser (150) can be changed. In addition, the degasser (150) is equipped with an eighth valve (V8) for draining water from which gas has been removed by the degasser (150) (hereinafter referred to as “fifth filtered raw water”).

The EDI device (160) is connected to the degasser (150). A ninth valve (V9) for controlling the amount of the fifth filtered raw water flowing from the degasser (150) toward the EDI device (160) is provided between the EDI device (160) and the degasser (150). The EDI device (160) serves to remove ionic substances from the fifth filtered raw water supplied from the degasser (150). The EDI device (160) is provided with a tenth valve (V10) for draining the water from which ionic substances have been removed by the EDI device (160) (hereinafter referred to as “sixth filtered raw water”).

The above UV lamp unit (170) irradiates ultraviolet rays to the sixth filtered raw water from which ionic substances have been removed in the EDI device (160) in order to sterilize and decompose organic substances. The UV lamp unit (170) includes a UV lamp (171), a first ionic substance removal device (172), and a second ionic substance removal device (173). The UV lamp (171) includes a plurality of UV lamps in order to improve sterilization and organic substance decomposition performance. The UV lamp (171) is arranged between the EDI device (160) and the third filter unit (180) as an example, but the arrangement location of the UV lamp (171) may be changed.

Specifically, the UV lamp (171) includes a first UV lamp (not shown) and a second UV lamp. As an example, the first UV lamp irradiates light with a wavelength of 185 nm, but the first UV lamp can irradiate light with a wavelength of 180 nm to 190 nm. In addition, as an example, the second UV lamp irradiates light with a wavelength of 254 nm, but the second UV lamp irradiates light with a wavelength of 250 nm to 260 nm. That is, the UV lamp unit (170) optimizes sterilization and total organic carbon (TOC) decomposition by using a plurality of UV lamps that irradiate ultraviolet rays with different wavelengths. In addition, in the ultrapure water manufacturing device (100), the organic matter decomposition performance can be optimized according to the flow rate of the sixth filtered raw water and the reflection amount design of the first UV lamp and the second UV lamp. However, the present invention is not limited thereto, and the UV lamp unit (170) can be changed to any means capable of sterilization.

The first ion substance removal device (172) is placed between the EDI device (160) and the UV lamp (171). The first ion substance removal device (172) primarily removes ion substances including inorganic ions present in the sixth filtered raw water before the UV lamp (171) irradiates the sixth filtered raw water with ultraviolet rays.

The second ion substance removal device (173) is arranged between the UV lamp (171) and the third filter unit (180). The second ion substance removal device (173) removes ion substances including inorganic ions present in the sixth filtered raw water secondarily irradiated with ultraviolet rays after the sixth filtered raw water is irradiated with ultraviolet rays by the UV lamp (171). That is, the ultrapure water production device (100) removes ion substances in three stages by the EDI device (160), the first ion substance removal device (172), and the second ion substance removal device (173), so the ion substance removal rate is high.

And a second pressurized pump (P2) is installed between the EDI device (160) and the first ion substance removal device (172). The sixth filtered raw water is supplied to the first ion substance removal device (173) by the second pressurized pump (P2). And an 11th valve (V11) for controlling the flow rate of the sixth filtered raw water is provided between the EDI device (160) and the second pressurized pump (P2). And a 12th valve (V12) for controlling the flow rate of the sixth filtered raw water is provided between the second pressurized pump (P2) and the first ion substance removal device (173). In addition, a 13th valve (V13) and a 14th valve (V14) for controlling the flow rate are provided between the first ion material removal device (172) and the UV lamp (171) and between the UV lamp (171) and the second ion material removal device (173).

The third filter unit (180) is connected to the UV lamp unit (170). The third filter unit (180) removes foreign substances existing in water (hereinafter referred to as “seventh filtered raw water”) irradiated with ultraviolet rays from the UV lamp unit (170). The third filter unit (180) includes a UF (Ultra Filtration) filter (181) and a metal filter (182). The UF filter (181) is formed by a structure in which two hollow fiber membranes having different pore sizes are connected in series. The UF filter (181) has a pore size of 0.005 ㎛ to 0.2 ㎛. However, the present invention is not limited thereto, and may be formed by a structure in which three or more hollow fiber membranes having different pore sizes are connected in series, and the pore size may also be changed. Through this, the particle and bacteria removal efficiency present in the seventh filtered raw water can be improved.

The above metal filter (182) serves to remove residual fine metal components from the seventh filtered raw water that has passed through the UF filter (181). At this time, the metal filter (182) may be a filter that removes only extremely small amounts of specific metal components.

And between the second ion material removal device (173) and the UF filter (181), a third sensor (S3) is arranged to measure the purity of the seventh filtered raw water. The third sensor (S3) is an example of a sensor that uses an electric resistance measurement method, but the type of the third sensor (S3) can be changed. And between the second ion material removal device (173) and the third sensor (S3), a 15th valve (V15) for controlling the flow rate of the seventh filtered raw water is arranged.

If the purity measured by the third sensor (S3) for the seventh filtered raw water is higher than the reference value, water from which foreign substances have been removed in the third filter unit (180) (hereinafter referred to as “eighth filtered raw water”) is discharged. At this time, a 16th valve (V16) is provided to control the flow rate of the eighth filtered raw water discharged. However, if the purity measured by the third sensor (S3) for the seventh filtered raw water is lower than the reference value, the eighth filtered raw water is recirculated to the storage tank (130) through the recirculation line (190). At this time, a 17th valve (V17) is provided to control the flow rate of the eighth filtered raw water being recirculated. The path through which the eighth filtered raw water is discharged or recirculated uses, for example, a CPVC fluid flow pipe having a diameter of 20 mm, but the material and size of the fluid flow pipe constituting the path through which the eighth filtered raw water is discharged or recirculated can be changed. And, unless specifically described, the first filter unit (110), reverse osmosis membrane unit (120), storage tank (130), second filter unit (140), degasser (150), EDI (Electrodeionization) device (160), third filter unit (180), and recirculation line (190) arranged on the path along which the above-mentioned raw water proceeds may have a structure in which they are connected to each other by a CPVC fluid flow pipe.

The above control unit (C) automatically controls the first valve (V1) to the seventeenth valve (V17), the first pump (P1) to the second pump (P2), the first sensor (S1) to the third sensor (S3), the degasser (150), the EDI device (160), and the UV lamp unit (170). However, the present invention is not limited thereto, and a user may manually operate the control unit (C). The control unit (C) can control the flow rate by controlling the first valve (V1) to the seventeenth valve (V17) installed in the path along which the supplied raw water proceeds. In addition, the control unit (C) can control the first pump (P1) to the second pump (P2) according to the flow of water to maintain an efficient flow of water. And the control unit (C) can selectively perform a gas removal operation by controlling the operation of the degasser (150), selectively perform an ion material removal operation by controlling the operation of the EDI device (160), and selectively perform a sterilization mechanism by controlling the operation of the UV lamp unit (170). In this way, the ultrapure water manufacturing device (100) has the advantage of improved efficiency because the selective mechanism by the control unit (C) is automatically performed. To this end, the control unit (C) may have a database (DB) built in advance regarding mechanism processors according to various situations. The ultrapure water manufacturing device (100) has the advantage of stably producing a required amount of ultrapure water that meets the standard by monitoring the ultrapure water production process in real time while the control unit (C) controls each component included in the ultrapure water manufacturing device (100).

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be determined by the technical idea of the appended patent claims.

100: Ultrapure water manufacturing equipment
110: 1st filter section
120: Reverse osmosis membrane section
121: First reverse osmosis membrane
122: Second reverse osmosis membrane
123: Third reverse osmosis membrane
130: Storage Tank
140: Second filter section
150: Digasser
160: EDI Device
170: UV lamp
180: 3rd filter section
190: Recirculation line
C: Control unit

Claims (5)

A first filter unit that filters the supplied raw water to remove foreign substances contained in the raw water;
A reverse osmosis membrane section that removes foreign substances contained in the water filtered in the first filter section;
A storage tank for storing water filtered in the above reverse osmosis membrane section;
A second filter unit that removes foreign substances contained in water supplied from the above storage tank;
A degasser that removes gases present in water from which foreign substances have been removed in the second filter section;
An EDI (Electrodeionization) device that removes ionic substances from water from which gas has been removed in the above degasser;
A UV lamp section for sterilizing water containing ionic substances and decomposing organic substances in the EDI device; and
Includes a third filter section that removes foreign substances from water irradiated with ultraviolet rays from the above UV lamp section,
The above reverse osmosis membrane part,
A first reverse osmosis membrane section having a first reverse osmosis membrane and a second reverse osmosis membrane, each of which is connected to the first filter section and primarily removes foreign substances contained in water filtered by the first filter section; and
A second reverse osmosis membrane unit is provided, which is connected to the first reverse osmosis membrane unit and has a third reverse osmosis membrane for secondarily removing foreign substances contained in water from which foreign substances have been firstly removed in the first reverse osmosis membrane unit.
The above first filter section receives raw water through the first valve, which is an inlet valve, and a pressure switch and a first pressure gauge are sequentially installed between the first valve and the first filter section.
Water from which foreign substances have been removed in the first filter section is supplied to the reverse osmosis membrane section by the first pressure pump, and a second valve, which is a first solenoid valve, is installed between the first filter section and the first pressure pump.
Each of the first reverse osmosis membrane and the second reverse osmosis membrane is connected in series with the first filter section,
The first reverse osmosis membrane and the second reverse osmosis membrane are arranged in parallel and are not connected to each other.
The above reverse osmosis membrane part,
A first sensor is placed to measure the purity of water from which foreign substances have been removed by the third reverse osmosis membrane.
In the above third reverse osmosis membrane,
In order to discharge water having foreign substances removed by the third reverse osmosis membrane and having a value below the standard, a first outlet is formed, and a third valve, which is a solenoid valve, and a fourth valve, which is a needle valve, are provided to control the drain discharged through the first outlet.
The above storage tank,
A second sensor for detecting the water level stored inside;
A fifth valve for controlling the amount of water supplied to the second filter; and
Includes a sixth valve for draining water stored in the above storage tank,
Between the second filter unit and the degasser, a seventh valve is provided to control the amount of water in the path through which water from which foreign substances have been removed in the second filter unit proceeds to the degasser.
The above degasser,
An eighth valve is provided for draining the water from which gas has been removed by the above degasser.
Between the above degasser and the EDI device, a ninth valve is provided to control the amount of water flowing from the degasser toward the EDI device.
The above EDI device,
A 10th valve is provided for draining water from which ionic substances have been removed by the above EDI device.
The above UV lamp part,
A first ion substance removal device for removing ion substances present in water from which ion substances have been removed in the above EDI device;
A plurality of UV lamps that irradiate ultraviolet rays to sterilize water from which ion substances have been removed and decompose organic substances in the first ion substance removal device; and
It includes a second ion substance removal device that removes ion substances existing in water irradiated with ultraviolet rays by the above UV lamps,
Between the EDI device and the first ion material removal device, an 11th valve is included to control the flow rate of water supplied from the EDI device to the first ion material removal device.
A 12th valve for controlling the flow rate of water is provided between the 11th valve and the first ion material removal device.
A 13th valve for controlling the flow rate of water is included between the first ion material removal device and the plurality of UV lamps.
A 14th valve for controlling the flow rate of water is further included between the plurality of lamps and the second ion material removal device.
Between the second ion material removal device and the third filter unit, a 15th valve for controlling the flow rate and a third sensor for measuring the purity of water passing through the UV lamp unit are further arranged.
If the purity measured by the third sensor is higher than the reference value, water from which foreign substances have been removed is discharged in the third filter unit, and if the purity measured by the third sensor is lower than the reference value, water passing through the third filter unit is recirculated to the storage tank through a recirculation line connected to the storage tank, and a 16th valve for controlling the flow rate of water to discharge water from which foreign substances have been removed in the third filter unit and a 17th valve for controlling the flow rate of water recirculated to the storage tank are further included.
Ultrapure water manufacturing equipment. In claim 1,
The above first filter part,
Contains micro filters and carbon filters,
The above micro filter and carbon filter are arranged sequentially along the direction in which the raw water flows.
Ultrapure water manufacturing equipment. In claim 1,
The above degasser,
Hydrophobic hollow fiber membrane for removing dissolved oxygen and carbon dioxide.
Ultrapure water manufacturing equipment. In claim 1,
Among the above multiple UV lamps,
The first UV lamp irradiates light with a wavelength of 180 nm to 190 nm, and the second UV lamp irradiates light with a wavelength of 250 nm to 260 nm.
Ultrapure water manufacturing equipment. In claim 1,
The above third filter part,
A UF (Ultra Filtration) filter having multiple hollow fiber membranes with different pore sizes connected in series; and
Including a metal filter that removes residual fine metal components contained in water passing through the UF filter.
Ultrapure water manufacturing equipment.

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