KR102720251B1 - Passive grip module for anti-sway of wafer on end-effector - Google Patents

Abstract

An invention is disclosed for a passive grip module for fixing a wafer of an end effector. The disclosed passive grip module for fixing a wafer of an end effector is characterized by including: a plurality of fixing pads which are provided at a set position of the end effector and elastically deformed by the weight of the wafer and fix and support along an edge of the wafer; and a grip member which protrudes from the fixing pads in a corresponding direction of the surface of the wafer and increases a coefficient of friction and a gripping force for the surface of the wafer while being linked to the elastic deformation of the fixing pad.

Description

{PASSIVE GRIP MODULE FOR ANTI-SWAY OF WAFER ON END-EFFECTOR}

The present invention relates to a passive grip module for fixing a wafer of an end effector, and more specifically, to a passive grip module for fixing a wafer of an end effector, which comprises a fixing pad fixedly mounted on an end effector and capable of elastically deforming, and a plurality of protruding-type grip members formed on a surface of the fixing pad that supports a wafer, thereby increasing a lateral frictional force with respect to the surface of the wafer through the grip members that are linked to the elastic deformation of the fixing pad due to the self-weight of the wafer, thereby firmly gripping the wafer even when the end effector moves (instantaneous) in a horizontal or vertical direction.

In general, semiconductor devices are manufactured by forming multilayer films according to a desired circuit pattern on a single-crystal silicon wafer. To this end, a number of unit processes, such as deposition processes, photolithography processes, oxidation processes, etching processes, ion implantation processes, and metal wiring processes, are repeatedly performed in stages.

In order for each of these unit processes to proceed according to procedure, after each process is completed, the wafer is moved to the equipment where the subsequent process will be performed. At this time, the wafers may be individually transported, or multiple wafers may be loaded and transported in equipment such as a cassette or a hoop.

In the process of loading or transporting multiple wafers loaded onto equipment one by one to a specific equipment, a wafer transport robot can generally be used.

Conventional wafer transfer robots are equipped with end effectors that directly handle wafers, and these end effectors are equipped with anti-slip pads to prevent the wafer from slipping. The wafer comes into direct contact with these anti-slip pads.

In particular, anti-slip pads are adopted for end effectors that utilize passive grip.

The maximum acceleration thresholds achievable by the end effector of a passive phage depend largely on the choice of material used to passively contact the wafer.

Related prior art includes Korean Patent Publication No. 10-2016-0055010 (Title of the invention: Wafer transfer robot and control method thereof).

The above-mentioned technical configuration is background technology to help understanding of the present invention and does not mean a conventional technology widely known in the technical field to which the present invention belongs.

The anti-slip pads of existing end effectors tend to have high adhesive strength that can be detrimental to the alignment accuracy of the wafer and the cleanliness of the process when made of a material such as rubber, making it difficult to stably mount the wafer, and there is a problem in that the wafer is detached from the blade due to movement and rotational inertia during the transport process.

In addition, existing anti-slip pads may have lower adhesive strength than materials such as rubber when made of materials such as alumina and quartz, but compared to materials such as rubber, the acceleration threshold or coefficient of friction is reduced, which causes a problem in that centering setting errors occur during instantaneous movement of the end effector.

Therefore, there is a need to improve this.

The present invention has been made to improve the above problems, and the purpose of the present invention is to provide a passive grip module for fixing a wafer of an end effector, which comprises a fixing pad fixedly mounted on an end effector that is elastically deformable, and a plurality of protruding type grip members formed on the surface of the fixing pad that supports a wafer, thereby increasing a lateral frictional force on the surface of the wafer through the grip members that are linked to the elastic deformation of the fixing pad due to the self-weight of the wafer, thereby firmly gripping the wafer even when the end effector moves in the horizontal or vertical direction.

The passive grip module for wafer fixing of an end effector according to the present invention comprises: a plurality of settling pads which are provided at set positions of the end effector, are elastically deformed by the weight of the wafer, and are configured to settling and support along an edge of the wafer; and a grip member which protrudes from the settling pads in a corresponding direction of the surface of the wafer, and increases a coefficient of friction and a gripping force for the surface of the wafer while being linked to the elastic deformation of the settling pad.

The above-described settling pad includes: an elastically deformable bridge, the axial direction of which is arranged to be inclined with respect to the tangential direction of the wafer, the grip member being formed on a surface facing the wafer; a first fixing member provided on one side of the bridge along the axial direction and fixedly mounted at a set position of the end effector; and a second fixing member provided on the other side of the bridge along the axial direction and fixedly mounted at a set position of the end effector.

The above grip member is characterized by being formed of a plurality of members extending in a normal direction from a corresponding surface of the above mounting pad, and increasing a transverse frictional force with respect to the surface of the wafer by being linked to the above mounting pad which is elastically deformed nonlinearly according to the pressurized position of the wafer.

The above grip member is characterized by protruding in a direction perpendicular to the surface of the mounting pad in the initial state and being elastically deformable.

The second fixing member or the bridge located on the outer side of the wafer is characterized by forming a stopper in a protruding manner.

The above bridge is characterized in that it is supported by support ribs that are connected to both sides along the axial direction or are connected to corresponding first fixing members and second fixing members.

The above grip member is characterized by forming a recessed portion on a cross-section facing the wafer.

As described above, the passive grip module for fixing a wafer of an end effector according to the present invention, unlike the prior art, comprises a fixing pad that is fixedly mounted on the end effector in an elastically deformable manner, and forms a plurality of protrusion-type grip members on the surface of the fixing pad that supports a wafer so as to increase a lateral frictional force on the surface of the wafer through the grip members that are linked to the elastic deformation of the fixing pad due to the self-weight of the wafer, thereby firmly gripping the wafer even when the end effector moves in a horizontal or vertical direction.

FIG. 1 is a perspective view of an end effector equipped with a passive grip module for fixing a wafer according to a first embodiment of the present invention.
FIG. 2 is a partially enlarged view of an end effector equipped with a passive grip module for fixing a wafer according to the first embodiment of the present invention.
FIG. 3 is an exploded perspective view of a passive grip module separated from an end effector according to the first embodiment of the present invention.
FIG. 4 is a bottom exploded perspective view of a passive grip module separated from an end effector according to the first embodiment of the present invention.
FIG. 5 is a cross-sectional view of a passive grip module mounted on an end effector according to the first embodiment of the present invention.
Figure 6 is a state diagram of placing a wafer on a passive grip module according to the first embodiment of the present invention.
FIG. 7 is a cross-sectional view of a passive grip module mounted on an end effector according to a second embodiment of the present invention.
FIG. 8 is a cross-sectional view of passive grip modules mounted on an end effector according to a third embodiment of the present invention.
FIG. 9 is a cross-sectional view of passive grip modules mounted on an end effector according to a fourth embodiment of the present invention.
Figure 10 is simulation data showing the gripping power of a wafer by a grip member of a passive grip module mounted on an end effector according to the present invention.

Hereinafter, embodiments of a passive grip module for wafer fixation of an end effector according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines and the size of components illustrated in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are terms defined in consideration of functions in the present invention, and these may vary depending on the intention or custom of the user or operator. Therefore, the definitions of these terms should be made based on the contents throughout this specification.

FIG. 1 is a perspective view of an end effector equipped with a passive grip module for fixing a wafer according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged view of an end effector equipped with a passive grip module for wafer fixation according to the first embodiment of the present invention, FIG. 3 is an exploded perspective view of the passive grip module separated from the end effector according to the first embodiment of the present invention, and FIG. 4 is a bottom exploded perspective view of the passive grip module separated from the end effector according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view of a passive grip module mounted on an end effector according to a first embodiment of the present invention, FIG. 6 is a diagram showing a state of mounting a wafer on a passive grip module according to the first embodiment of the present invention, and FIG. 10 is simulation data showing the gripping force of a wafer by a grip member of a passive grip module mounted on an end effector according to the present invention.

Referring to FIGS. 1 to 6 and 10, a passive grip module (100) for fixing a wafer (10) of an end effector (20) according to the first embodiment of the present invention includes a fixing pad (110) and a grip member (120).

At this time, the end effector (20) plays a role in transporting (returning) the wafer (10) and can be installed on a return robot (not shown).

In addition, the end effector (20) has at least a portion where the wafer (10) is mounted in a flat shape. Of course, the end effector (20) can be applied in various shapes and various materials.

In particular, the end effector (20) according to the present invention can securely seat a wafer (10) in a passive type, an active-passive type, or an active type.

Meanwhile, the settling pad (110) is provided at the set position of the end effector (20), is elastically deformed by the weight of the wafer (10), and supports the settling along the edge of the wafer (10).

Therefore, a plurality of settling pads (110) are provided along the edge trajectory of the wafer (10) to be settling on the end effector (20).

At this time, the anchoring pad (110) can be applied with various materials such as silicone having a set elastic strain rate.

In addition, the grip member (120) protrudes from the mounting pad (110) toward the surface of the corresponding wafer (10), thereby increasing the friction coefficient (friction force) and the grip force [tangential grip-force] for the surface of the wafer (10) while being linked to the elastic deformation of the mounting pad (110).

At this time, the grip member (120) can be formed in various shapes, such as a pillar shape. In addition, the grip member (120) is formed of a plurality of micro pillars of small size (thickness) in order to minimize contact with the wafer (10) to be placed.

In detail, the anchoring pad (110) includes a bridge (112), a first fixing member (114), and a second fixing member (116).

The bridge (112) is arranged so that its axis direction is inclined with respect to the tangent direction of the wafer (10) while having a roughly rectangular shape on a plane. For convenience, the bridge (112) is installed so that its axis direction is perpendicular (normal direction) to the tangent line of the wafer (10) that is seated on the end effector (20). This is to ensure that the bridge (112) stably supports the wafer (10). Of course, the bridge (112) can be applied in various shapes on a plane. That is, each of the bridges (112) that are roughly rectangular on a plane is provided so that it is inclined downward from the edge of the wafer (10) that is seated on the upper side toward the center, thereby stably seating the corresponding wafer (10). (Refer to FIGS. 1 and 2)

And, the bridge (112) supports the wafer (10) to be installed toward the center of the wafer (10), and is installed with a downward slope (θ) toward the center of the wafer (10) so as to be elastically deformable while minimizing the contact area with the wafer (10).

At this time, one side of the bridge (112) is positioned on the lower side of the wafer (10) along the axial direction, and the other side is positioned on the outer side of the wafer (10) that does not overlap with the wafer (10).

In addition, the bridge (112) forms a grip member (120) on the surface, i.e., the upper surface, facing the wafer (10). At this time, the grip member (120) is formed on the entirety or part of the upper surface of the bridge (112) facing the wafer (10) to be seated.

In addition, the bridge (112) is made of a material and thickness that can be elastically deformed by the wafer (10) on which it is mounted. In particular, when the corresponding edge of the wafer (10) is mounted on the corresponding bridge (112), the elastic deformation rate of the bridge (112) in the area pressed by the wafer (10) becomes large.

Accordingly, the bridge (112) undergoes elastic deformation non-linearly when the wafer (10) is pressurized.

The first fixing member (114) is provided on one side of the bridge (112) along the axial direction and is fixedly mounted at the set position of the end effector (20).

In particular, the first fixing member (114) is configured to protrude from the lower portion of one side of the bridge (112) along the axial direction. The first fixing member (114) may be manufactured integrally with the bridge (112) or may be detachably coupled to the bridge (112). Of course, the first fixing member (114) may be applied in various shapes.

The end effector (20) is formed by recessing a first fixing member (24) to fit and fix a corresponding first fixing member (114). The first fixing member (24) may be formed in a hole or groove shape.

In addition, the second fixing member (116) is provided on the other side of the bridge (112) along the axial direction and is fixedly mounted at the set position of the end effector (20).

At this time, the second fix member (116) is configured to protrude from the lower portion of the other side of the bridge (112) along the axial direction. The second fix member (116) may be manufactured integrally with the bridge (112) or may be detachably coupled to the bridge (112). Of course, the second fix member (116) may be applied in various shapes.

In addition, the end effector (20) forms a second fixing member (26) in a recessed manner to fit and fix a corresponding second fixing member (116). The second fixing member (26) may be formed in a hole or groove shape.

Meanwhile, the grip member (120) is provided in the form of a number of small protrusions [micro pillars] extending in the normal direction from the corresponding surface of the mounting pad (110).

And, the grip member (120) is linked to the settling pad (110) that is elastically deformed nonlinearly depending on the pressurized position of the wafer (10).

Accordingly, the multiple individual grip members (120) are formed to protrude parallel to each other from the bridge (112) that is not deformed in its initial state, and are tilted at different angles depending on the position provided due to the bridge (112) that is deformed nonlinearly. (See Fig. 5)

That is, the bridge (112) causes a concentrated downward deformation to occur at the corresponding area due to the edge of the wafer (10) that is in contact with and pressurized. Therefore, the adjacent grip members (120) located on both sides along the axial direction of the bridge (112) based on the concentrated downward deformation area are bent in opposite directions.

Therefore, the corresponding grip member (120) increases the lateral frictional force on the surface of the wafer (10), thereby increasing the gripping force (bonding force) on the edge surface of the wafer (10).

In particular, the grip member (120) tilts in a direction opposite to the surface of the bridge (112) at different angles depending on the position where the wafer (10) presses the bridge (112) and is settled. Accordingly, the corresponding grip members (120) tilt at different angles so that the axial direction faces the center point (C). In other words, referring to the simulation experiment results of Fig. 10, a plurality of grip members (120) protruding from one side (upper side) surface of the bridge (112) or the bridge (112) and the first fixing member (114) in the form of micro-pillars protrude in the normal direction with respect to the corresponding surfaces of the bridge (112) and the first fixing member (114) corresponding to the instantaneous acceleration force due to the contact of the wafer (10), and naturally bend in the opposite direction due to the elastic nonlinear deformation of the bridge (112), thereby increasing the gripping force for the wafer (10) across the edge and the other side (lower side) surface of the wafer (10) on which it is settled.

In addition, the plurality of individual grip members (120) may have the same height from the surface of the bridge (112), or may be different depending on the position where they are provided. In addition, the plurality of individual grip members (120) may be made of the same material, or may be made of different materials, particularly having different elastic strain rates.

At this time, each of the grip members (120) protrudes in a direction perpendicular to the surface of the bridge (112) of the anchoring pad (110) in the initial state, and may be elastically deformable separately from the bridge (112).

Of course, each grip member (120) is formed in a state where elastic deformation is impossible, and can be tilted at different inclination angles by the bridge (112) that is elastically deformed nonlinearly.

In addition, the wafer (10) mounted on the bridge (112) of the mounting pad (110) and the grip member (120) can be moved relative to the bridge (112) by the instantaneous movement of the end effector (20).

At this time, in order to prevent the wafer (10) from being dislodged to the outside of the corresponding bridge (112), the second fixing member (116) or the bridge (112) located on the outside of the wafer (10) may form a stopper (130) to protrude. When the wafer (10) is fixedly seated on the bridge (112), the position may be moved due to a moving force greater than the grip force of the grip member (120) due to an instantaneous movement of the end effector (20), but in this case, the wafer (10) can be maintained in a state of being seated on the bridge (112), particularly the grip member (120), by coming into contact with a specific stopper (130).

For convenience, the stopper (130) is configured to extend upward from the second fixing member (116). Of course, the second stopper (130) can be transformed into various shapes.

FIG. 7 is a cross-sectional view of a passive grip module mounted on an end effector according to a second embodiment of the present invention.

Referring to FIG. 1 and FIG. 7, a passive grip module (100) for fixing a wafer (10) of an end effector (20) according to a second embodiment of the present invention includes a fixing pad (110) and a grip member (120).

Here, the settling pad (110) is replaced with the one described above in one embodiment.

In addition, the grip member (120) is formed of small-sized protrusions [micro pillars], and a plurality of them are formed on the upper surface of the bridge (112).

Additionally, each grip member (120) can form a rough portion (140) on the cross-section facing the wafer (10).

The uneven portion (140) serves to increase friction on the surface of the wafer (10) and prevent surface contamination of the wafer (10) by reducing contact with the wafer (10).

Of course, the uneven portion (140) can be applied in various shapes.

Any drawing symbols not described herein are replaced with those described above.

FIG. 8 is a cross-sectional view of passive grip modules mounted on an end effector according to a third embodiment of the present invention.

Referring to FIG. 1 and FIG. 8, a passive grip module (100) for fixing a wafer (10) of an end effector (20) according to a third embodiment of the present invention includes a fixing pad (110) and a grip member (120).

At this time, referring to FIG. 8a, the anchoring pad (110) may include a bridge (112) and a first fixing member (114).

The first fixing member (114) is fixedly fitted into the set position of the end effector (20) as described above.

Of course, depending on the size of the bridge (112), multiple first fixing members (114) may be provided.

And, the bridge (112) is spaced apart from the surface of the end effector (20) so that it can be deformed in a non-linear shape or a linear shape.

In this case, the bridge (112) may be excessively deformed (momentarily) when the end effector (20) moves, and the wafer mounted on the grip member (120) may shake severely, resulting in poor centering.

To prevent this, both sides of the bridge (112) can be connected with a support rib (113).

That is, when the first fixing member (114) is inserted and fixed into the corresponding first fixing member (24) of the end effector (20), the support rib (113) forms a space between itself and the bridge (112), thereby allowing elastic deformation of the bridge (112), and can support the lower side of the bridge (112) in case of excessive deformation.

At this time, the support rib (113) can stably maintain its shape by coming into contact with the surface of the end effector (20).

Of course, the support rib (113) can be transformed into various shapes.

In addition, the anchoring pad (110), especially the bridge (112), can be transformed into various shapes, and as in this embodiment, can be formed into an arch shape that is convex in the upward direction so as to be elastically deformed nonlinearly.

That is, the bridge (112) may be spherical or dome-shaped, or may be arch-shaped.

In this case, the grip member (120) protrudes vertically in the normal direction from the surface of the initial bridge (112) which is an arch shape. Then, the bridge (112) is pressed nonlinearly or linearly by the pressing force of the wafer (10), and the grip member (120) can restrain the surface of the wafer (10) in the direction of frictional force generation as it tilts toward the center of the deformed bridge (112).

In particular, the grip member (120) of the bridge (112) exposed to the outside of the wafer (10), which corresponds to the area where the wafer (10) is not covered by the bridge (112), may press and apply pressure to the edge of the wafer (10) while tilting.

Alternatively, referring to FIG. 8b, the support rib (113) may be fixed to the surface of the end effector (20) by an adhesive layer (119).

Any drawing symbols not described herein are replaced with those described above.

Referring to FIG. 1 and FIG. 9, a passive grip module (100) for fixing a wafer (10) of an end effector (20) according to a fourth embodiment of the present invention includes a fixing pad (110) and a grip member (120).

At this time, referring to FIG. 8a, the anchoring pad (110) may include a bridge (112), a first fixing member (114), and a second fixing member (116).

That is, the bridge (112) is in an elastically deformable straight shape, and the grip member (120) can be provided over the entire upper surface of the bridge (112).

Alternatively, referring to FIG. 9b, the support rib (113) may be fixed to the surface of the end effector (20) by an adhesive layer (119).

Any drawing symbols not described herein are replaced with those described above.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the claims below.

10: Wafer 20: End effector
24: 1st fixing part 26: 2nd fixing part
100: Manual grip module 110: Settling pad
112: Bridge 113: Support rib
114: Absence of the first fix 116: Absence of the second fix
119: Adhesive layer 120: Grip member
130: Stopper 140: Rough part

Claims (6)

A plurality of settling pads provided at the set position of the end effector, elastically deformed by the weight of the wafer and supporting the wafer along the edge of the wafer; and
It includes a grip member that protrudes in the direction of the surface of the wafer corresponding to the above-mentioned settling pad and increases the coefficient of friction and grip force for the surface of the wafer while being linked to the elastic deformation of the above-mentioned settling pad.
The above-mentioned settling pad is formed in a rectangular shape on a plane and is provided with a downward slope from the edge of the wafer to be settling toward the center, forms the grip member on a surface facing the wafer, and includes a bridge that is elastically deformable and fixedly installed on the end effector.
The above grip member is composed of a plurality of members extending in a normal direction from the corresponding surface of the above mounting pad, and is linked to the above mounting pad, which elastically deforms nonlinearly according to the pressurized position of the wafer, thereby increasing the transverse frictional force against the surface of the wafer.
A passive grip module for fixing a wafer of an end effector, characterized in that each of the plurality of grips is formed of micro-pillar-shaped protrusions and tilts in opposite directions and at different angles in response to nonlinear elastic deformation of the bridge due to pressurization of the wafer, thereby binding the edge and lower surface of the corresponding wafer.
delete delete In paragraph 1,
A passive grip module for fixing a wafer of an end effector, characterized in that the grip member protrudes in a direction perpendicular to the surface of the fixing pad in an initial state and is elastically deformable.
In paragraph 1,
A passive grip module for fixing a wafer of an end effector, characterized in that the fixing pad includes a first fixing member that is provided on one side of the bridge along the axial direction and is fixedly mounted at a set position of the end effector.
In paragraph 5,
The above-mentioned fixing pad includes a second fixing member which is provided on the other side of the bridge along the axial direction and is fixedly mounted at the set position of the end effector.
The second fixing member or the bridge located on the outer side of the wafer protrudes to form a stopper,
A passive grip module for fixing a wafer of an end effector, characterized in that the above bridge is supported by support ribs connected on both sides along the axial direction.

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