[go: up one dir, main page]

KR102713186B1 - Grounding structure of printed circuit board - Google Patents

Grounding structure of printed circuit board Download PDF

Info

Publication number
KR102713186B1
KR102713186B1 KR1020220135804A KR20220135804A KR102713186B1 KR 102713186 B1 KR102713186 B1 KR 102713186B1 KR 1020220135804 A KR1020220135804 A KR 1020220135804A KR 20220135804 A KR20220135804 A KR 20220135804A KR 102713186 B1 KR102713186 B1 KR 102713186B1
Authority
KR
South Korea
Prior art keywords
pcb
bolt member
metal case
grounding
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020220135804A
Other languages
Korean (ko)
Other versions
KR20240055479A (en
Inventor
김봉기
유동현
Original Assignee
암페놀센싱코리아 유한회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 암페놀센싱코리아 유한회사 filed Critical 암페놀센싱코리아 유한회사
Priority to KR1020220135804A priority Critical patent/KR102713186B1/en
Publication of KR20240055479A publication Critical patent/KR20240055479A/en
Application granted granted Critical
Publication of KR102713186B1 publication Critical patent/KR102713186B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

본 발명은 소정의 금속케이스 내에 결합 고정되는 PCB를 볼트부재로 체결 고정하되, 상기 PCB의 그라운드(GND)가 상기 볼트부재를 통해 금속케이스와 통전되도록 함으로써, 상기 금속케이스를 통해 상기 PCB의 GND가 접지될 수 있도록 한 인쇄회로기판의 접지 구조에 관한 것으로, 적어도 하나 이상의 접지공을 포함하는 PCB; 상기 접지공을 통해 PCB를 금속케이스부에 고정하는 전도성 재질의 볼트부재; 및 상기 PCB가 상기 볼트부재를 통해 안착 고정되며, 외부 구조물에 장착되는 금속케이스부를 포함하되, 상기 접지공의 PCB 상부면 둘레에는 일정한 폭으로 GND 패턴부가 노출되도록 형성되어, 상기 볼트부재 체결 시 상기 GND 패턴부와 볼트부재가 서로 접촉되도록 구성된 것을 특징으로 한다.The present invention relates to a grounding structure for a printed circuit board, which fastens a PCB fixedly coupled to a predetermined metal case by means of a bolt member, so that the ground (GND) of the PCB is electrically conductive with the metal case through the bolt member, thereby allowing the GND of the PCB to be grounded through the metal case, the structure comprising: a PCB including at least one grounding hole; a bolt member made of a conductive material that fastens the PCB to the metal case through the grounding hole; and a metal case portion to which the PCB is stably fastened through the bolt member and which is mounted on an external structure, wherein a GND pattern portion is formed around an upper surface of the PCB of the grounding hole to be exposed with a constant width, such that when the bolt member is fastened, the GND pattern portion and the bolt member are configured to come into contact with each other.

Description

인쇄회로기판의 접지 구조{GROUNDING STRUCTURE OF PRINTED CIRCUIT BOARD}GROUNDING STRUCTURE OF PRINTED CIRCUIT BOARD

본 발명은 인쇄회로기판(PCB)의 접지 구조에 관한 것으로, 더욱 상세하게는 소정의 금속케이스 내에 결합 고정되는 PCB를 볼트부재로 체결 고정하되, 상기 PCB의 그라운드(GND)가 상기 볼트부재를 통해 금속케이스와 통전되도록 함으로써, 상기 금속케이스를 통해 상기 PCB의 GND가 접지될 수 있도록 한 인쇄회로기판의 접지 구조에 관한 것이다.The present invention relates to a grounding structure of a printed circuit board (PCB), and more specifically, to a grounding structure of a printed circuit board in which a PCB is fixedly fastened within a predetermined metal case by a bolt member, and the ground (GND) of the PCB is electrically connected to the metal case through the bolt member, thereby allowing the GND of the PCB to be grounded through the metal case.

일반적으로, 예를 들어 압력센서와 같은 센서가 실장된 PCB는 전자파에 대한 내성 강화를 위하여 PCB 회로의 GND를 접지시켜 주게 된다.Typically, a PCB with a sensor, such as a pressure sensor, mounted on it has the GND of the PCB circuit grounded to enhance its resistance to electromagnetic waves.

상기 PCB의 GND 접지 방법으로는 PCB에 접지 터미널이나 접지 스프링 또는 소자 등을 적용하여 상기 PCB가 고정되는 금속케이스와 회로적으로 접촉 연결하여 주는 방식이 많이 사용된다.As a GND grounding method for the above PCB, a method is often used in which a ground terminal, ground spring, or element is applied to the PCB to make a circuit-wise contact connection with the metal case to which the PCB is fixed.

그런데, 이와 같은 접지 구조 및 방법은 접지 터미널 또는 접지 스프링 등과 같은 부품이 소요되고, 이어서 상기 PCB를 금속케이스에 고정할 때에는 접착제(에폭시)를 이용하여 부착 고정하여야 하는 등 작업 공정이 추가되고 시간이 소요되는 문제점이 있어 왔다.However, such grounding structures and methods have had the problem that they require parts such as grounding terminals or grounding springs, and then additional work processes and time are required, such as attaching and fixing the PCB to a metal case using adhesive (epoxy).

등록특허공보 10-0625971 (등록일자 2006년09월13일)Patent Publication No. 10-0625971 (Registration Date: September 13, 2006) 공개특허공보 10-2005-0036267 (공개일자 2005년04월20일)Publication date of patent publication 10-2005-0036267 (published on April 20, 2005)

본 발명은 상기한 문제점을 해결하기 위하여 창안된 것으로, 본 발명의 목적은 소정의 금속케이스 내에 결합 고정되는 PCB를 볼트부재로 체결 고정하되, 상기 PCB의 그라운드(GND)가 상기 볼트부재를 통해 금속케이스와 통전되도록 함으로써, 상기 금속케이스를 통해 상기 PCB의 GND가 접지될 수 있도록 한 인쇄회로기판의 접지 구조를 제공하는 것에 있다.The present invention has been created to solve the above-mentioned problems, and an object of the present invention is to provide a grounding structure for a printed circuit board in which a PCB is fixedly fastened within a predetermined metal case by a bolt member, and the ground (GND) of the PCB is electrically connected to the metal case through the bolt member, thereby allowing the GND of the PCB to be grounded through the metal case.

또한 본 발명의 다른 목적은 PCB를 볼트부재를 통해 금속 케이스에 고정시킴과 동시에 상기 PCB의 GND가 접지되는 구조를 구현함으로써, 제품의 가격 경쟁력과 품질 향상을 도모할 수 있는 인쇄회로기판의 접지 구조를 제공하는 것에 있다.In addition, another object of the present invention is to provide a grounding structure for a printed circuit board that can improve the price competitiveness and quality of a product by implementing a structure in which the PCB is fixed to a metal case through a bolt member while the GND of the PCB is grounded at the same time.

이와 같은 목적을 달성하기 위한 본 발명은 적어도 하나 이상의 접지공을 포함하는 PCB; 상기 접지공을 통해 PCB를 금속케이스부에 고정하는 전도성 재질의 볼트부재; 및 상기 PCB가 상기 볼트부재를 통해 안착 고정되며, 외부 구조물에 장착되는 금속케이스부를 포함하되,In order to achieve the above object, the present invention comprises a PCB including at least one grounding hole; a bolt member made of a conductive material for fixing the PCB to a metal case through the grounding hole; and a metal case part in which the PCB is fixedly fixed through the bolt member and is mounted on an external structure,

상기 접지공의 PCB 상부면 둘레에는 일정한 폭으로 GND 패턴부가 노출되도록 형성되어, 상기 볼트부재 체결 시 상기 GND 패턴부와 볼트부재가 서로 접촉되도록 구성된 것을 특징으로 한다.The above grounding hole is characterized in that a GND pattern portion is formed to be exposed with a constant width around the upper surface of the PCB, so that when the bolt member is fastened, the GND pattern portion and the bolt member are configured to come into contact with each other.

또한 본 발명에 따르면 상기 접지공은 원형으로 구성된 것을 특징으로 한다.In addition, according to the present invention, the grounding hole is characterized by having a circular shape.

또한 본 발명에 따르면 상기 PCB에는 압력센서 패키지를 구성하기 위해 압력센서가 실장되는 것을 특징으로 한다.In addition, according to the present invention, a pressure sensor is mounted on the PCB to form a pressure sensor package.

또한 본 발명에 따르면 상기 볼트부재는 체결공구가 결합되는 머리부와, 상기 머리부의 하부로 PCB의 접지공에 삽입되는 끼움부와, 상기 끼움부의 하부로 금속케이스부에 체결되는 체결부로 구성된 것을 특징으로 한다.In addition, according to the present invention, the bolt member is characterized by comprising a head portion to which a fastening tool is coupled, a fitting portion inserted into a grounding hole of a PCB through a lower portion of the head portion, and a fastening portion fastened to a metal case portion through a lower portion of the fitting portion.

또한 본 발명에 따르면 상기 금속케이스부는 상기 PCB를 수용하는 수용부와, 상기 수용부의 저면으로 돌출 형성되어 외부 구조물에 고정되는 결합부와, 상기 수용부의 바닥부에 형성되어 상기 볼트부재가 체결되는 체결공과, 상기 수용부의 중앙으로 관통 형성되는 압력감지홀로 구성된 것을 특징으로 한다.In addition, according to the present invention, the metal case portion is characterized by comprising a receiving portion for receiving the PCB, a connecting portion protruding from the bottom surface of the receiving portion and fixed to an external structure, a fastening hole formed on the bottom of the receiving portion and through which the bolt member is fastened, and a pressure sensing hole formed penetrating through the center of the receiving portion.

이와 같이 본 발명은 소정의 금속케이스 내에 결합 고정되는 PCB를 볼트부재로 체결 고정하되, 상기 PCB의 그라운드(GND)가 상기 볼트부재를 통해 금속케이스와 통전되도록 함으로써, 상기 금속케이스를 통해 상기 PCB의 GND가 접지될 수 있는 효과를 제공한다.In this way, the present invention provides an effect in which a PCB, which is fixedly joined and secured within a predetermined metal case, is fastened with a bolt member, and the ground (GND) of the PCB is electrically connected to the metal case through the bolt member, thereby enabling the GND of the PCB to be grounded through the metal case.

또한 본 발명은 PCB를 볼트부재를 통해 금속 케이스에 고정시킴과 동시에 상기 PCB의 GND가 접지되는 구조를 구현함으로써, 제품의 가격 경쟁력과 품질 향상을 도모할 수 있는 효과를 제공한다.In addition, the present invention provides an effect of improving the price competitiveness and quality of a product by implementing a structure in which a PCB is fixed to a metal case through a bolt member while the GND of the PCB is grounded at the same time.

도 1은 본 발명의 일실시예에 따른 인쇄회로기판의 접지구조가 적용된 압력센서 패키지의 구성도,
도 2는 상기 도 1의 측단면도,
도 3은 상기 도 1의 분해사시도,
도 4는 본 발명에 따른 PCB의 상세 구성도이다.Figure 1 is a configuration diagram of a pressure sensor package to which a grounding structure of a printed circuit board is applied according to one embodiment of the present invention.
Figure 2 is a cross-sectional view of the above Figure 1;
Figure 3 is an exploded perspective view of the above Figure 1.
Figure 4 is a detailed configuration diagram of a PCB according to the present invention.

이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시 예를 보다 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings.

우선, 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 한해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 그리고 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.First, when adding reference signs to components of each drawing, it should be noted that identical components are given the same signs as much as possible even if they are shown on different drawings. In addition, when describing the present invention, if it is determined that a specific description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description is omitted.

도 1은 본 발명의 일실시예에 따른 인쇄회로기판의 접지구조가 적용된 압력센서 패키지의 구성도, 도 2는 상기 도 1의 측단면도, 도 3은 상기 도 1의 분해사시도이다.FIG. 1 is a configuration diagram of a pressure sensor package to which a grounding structure of a printed circuit board according to an embodiment of the present invention is applied, FIG. 2 is a side cross-sectional view of FIG. 1, and FIG. 3 is an exploded perspective view of FIG. 1.

도시된 바와 같이, 본 발명 인쇄회로기판의 접지구조는, As illustrated, the grounding structure of the printed circuit board of the present invention is

일례로, 압력센서가 실장된 PCB를 포함하는 압력센서 패키지에 적용될 수 있는 것으로, For example, it can be applied to a pressure sensor package including a PCB on which a pressure sensor is mounted.

PCB(110)와, 상기 PCB(110)를 금속케이스부(130)에 고정하는 볼트부재(120)와, 상기 PCB(110)가 안착 고정되는 금속케이스부(130)를 포함한다.It includes a PCB (110), a bolt member (120) that secures the PCB (110) to a metal case (130), and a metal case (130) to which the PCB (110) is fixedly secured.

상기 PCB(110)는 본 발명의 특징적 구성요소로, 도 4에서와 같이 적어도 하나 이상의 접지공(111)을 포함한다.The above PCB (110) is a characteristic component of the present invention and includes at least one ground hole (111) as shown in FIG. 4.

상기 접지공(111)은 볼트부재(120)가 삽입되는 구멍으로 상기 볼트부재(120)에 의해 상기 PCB(110)는 금속케이스부(130)에 고정된다.The above grounding hole (111) is a hole into which a bolt member (120) is inserted, and the PCB (110) is fixed to the metal case part (130) by the bolt member (120).

상기 접지공(111)은 원형으로 구성되는 것이 바람직하나 반드시 이에 한정되지 않는다.It is preferable that the above grounding hole (111) be configured in a circular shape, but it is not necessarily limited thereto.

상기 접지공(111)은 PCB(110)의 상부면(113) 측으로 둘레에는 일정한 폭으로 GND 패턴부(112)가 노출되도록 형성된다.The above ground hole (111) is formed so that a GND pattern portion (112) is exposed with a constant width around the upper surface (113) of the PCB (110).

상기 GND 패턴부(112)는 상기 PCB(110) 상에 인쇄된 회로 패턴 중 GND 패턴에 해당되는 것으로, 상기 접지공(111)의 상단 둘레에 형성되어 상기 접지공(111)에 삽입되는 볼트부재(120)와 접촉되도록 구성된다.The above GND pattern portion (112) corresponds to a GND pattern among the circuit patterns printed on the PCB (110), and is formed around the upper perimeter of the ground hole (111) and configured to come into contact with a bolt member (120) inserted into the ground hole (111).

상기 PCB(110)는 원형으로 구성될 수 있으나 반드시 이에 한정되지는 않는다.The above PCB (110) may be configured in a circular shape, but is not necessarily limited thereto.

또한 상기 PCB(110)는 압력센서 패키지를 구성하기 위해 압력센서(미도시)가 실장될 수 있다.Additionally, a pressure sensor (not shown) can be mounted on the PCB (110) to form a pressure sensor package.

상기 볼트부재(120)는 상기 PCB(110)를 금속케이스부(130)에 고정하는 구성요소로, 체결공구가 결합되는 머리부(121)와, 상기 머리부(121)의 하부로 PCB(110)의 접지공(111)에 삽입되는 끼움부(122)와, 상기 끼움부(122)의 하부로 금속케이스부(130)에 체결되는 체결부(123)로 구성된다.The above bolt member (120) is a component that fixes the PCB (110) to the metal case part (130), and is composed of a head part (121) to which a fastening tool is coupled, a fitting part (122) that is inserted into the ground hole (111) of the PCB (110) through the lower part of the head part (121), and a fastening part (123) that is fastened to the metal case part (130) through the lower part of the fitting part (122).

상기 볼트부재(120)는 전도성 재질로 구성된다.The above bolt member (120) is made of a conductive material.

상기 볼트부재(120)는 PCB(110)의 접지공(111)에 삽입되어 금속케이스부(130)의 체결공(134)에 체결되는 데, 이와 같은 체결 상태가 되면 도 2에서와 같이 PCB(110)의 GND 패턴부(112)는 볼트부재(120)의 머리부(121)와 접촉되고, 상기 볼트부재(120)의 체결부(123)는 금속케이스부(130)의 체결공(134)에 접촉되어 상기 PCB(110)의 GND는 금속케이스부(130)로 연결(통전)되어 진다.The above bolt member (120) is inserted into the ground hole (111) of the PCB (110) and is fastened to the fastening hole (134) of the metal case part (130). When this fastening state is achieved, as shown in FIG. 2, the GND pattern part (112) of the PCB (110) comes into contact with the head part (121) of the bolt member (120), and the fastening part (123) of the bolt member (120) comes into contact with the fastening hole (134) of the metal case part (130), so that the GND of the PCB (110) is connected (powered) to the metal case part (130).

상기 금속케이스부(130)는 상기 PCB(110)가 상기 볼트부재(120)를 통해 안착 고정되는 구성요소로, 상기 PCB(131)를 수용하는 수용부(131)와, 상기 수용부(131)의 저면으로 돌출 형성되어 외부 구조물(140)에 고정되는 결합부(132)와, 상기 수용부(131)의 바닥부(133)에 형성되어 상기 볼트부재(120)가 체결되는 체결공(134)과, 상기 수용부(131)의 중앙으로 관통 형성되는 압력감지홀(135)로 구성된다.The above metal case part (130) is a component in which the PCB (110) is fixedly secured through the bolt member (120), and is composed of a receiving part (131) for receiving the PCB (131), a joining part (132) that protrudes from the bottom surface of the receiving part (131) and is fixed to an external structure (140), a fastening hole (134) formed in the bottom part (133) of the receiving part (131) and to which the bolt member (120) is fastened, and a pressure sensing hole (135) that penetrates the center of the receiving part (131).

여기서 상기 압력감지홀(135)이 위치한 상부의 PCB(110) 측에는 미도시된 압력센서가 실장되며, 상기 압력센서는 압력감지홀(135)을 통해 유입되는 압력을 감지하게 된다.Here, a pressure sensor (not shown) is mounted on the upper PCB (110) side where the pressure detection hole (135) is located, and the pressure sensor detects the pressure flowing in through the pressure detection hole (135).

또한 상기 금속케이스부(130)는 외부의 기기(140)와 결합되어 상기 PCB(110)의 GND를 외부 구조물(140)로 접지하도록 구성된다.In addition, the metal case portion (130) is configured to be coupled with an external device (140) and ground the GND of the PCB (110) to an external structure (140).

상기 외부 구조물(140)는 압력센서 패키지를 이루는 금속케이스(130)를 고정 또는 장착하는 구조물로, 내측으로 상기 금속케이스부(130)의 결합부(132)와 체결되는 결합공(141)이 형성될 수 있다.The above external structure (140) is a structure for fixing or mounting a metal case (130) forming a pressure sensor package, and a joining hole (141) that is connected to a joining portion (132) of the metal case portion (130) can be formed on the inside.

이와 같이 구성된 본 발명 인쇄회로기판의 접지 구조의 조립, 작동 및 작용을 이하 설명한다.The assembly, operation, and function of the grounding structure of the printed circuit board of the present invention configured as described above are described below.

먼저, PCB(110)를 금속케이스부(120)의 수용부(131)에 넣어 바닥부(133)에 안착 시킨 후, 볼트부재(120)를 이용하여 PCB(110)를 금속케이스부(130)의 바닥부(133)에 고정 시켜준다.First, the PCB (110) is placed into the receiving portion (131) of the metal case portion (120) and secured to the bottom portion (133), and then the PCB (110) is fixed to the bottom portion (133) of the metal case portion (130) using a bolt member (120).

이와 같은 고정이 완료되면, 상기 PCB(110)는 도 2에서와 같이 접지공(111) 상단의 GND 패턴부(112)가 볼트부재(120)의 머리부(121)에 접촉 고정되고, 상기 볼트부재(120)의 끼움부(122)는 접지공(111) 내부에 위치하며, 볼트부재(120)의 체결부(123)는 금속케이스부(130)의 체결공(134)에 접촉 고정되는 구조가 된다.When this fixation is completed, the PCB (110) is structured so that the GND pattern portion (112) on the top of the ground hole (111) is in contact with and fixed to the head portion (121) of the bolt member (120), as shown in FIG. 2, the fitting portion (122) of the bolt member (120) is located inside the ground hole (111), and the fastening portion (123) of the bolt member (120) is in contact with and fixed to the fastening hole (134) of the metal case portion (130).

즉 상기 PCB(110)는 상기 볼트부재(120)를 통해 금속케이스부(130)에 고정됨과 동시에 GND 패턴부(112)가 금속케이스부(130)와 통전되는 구조가 된다.That is, the PCB (110) is fixed to the metal case part (130) through the bolt member (120) and at the same time, the GND pattern part (112) is structured to be electrically connected to the metal case part (130).

이와 같이 압력센서 패키지가 완료되면, 상기 압력센서 패키지가 설치되어야할 외부 구조물(140)에 상기 금속케이스부(130)를 장착하여 준다.When the pressure sensor package is completed in this manner, the metal case part (130) is mounted on the external structure (140) where the pressure sensor package is to be installed.

즉 상기 금속케이스부(140)의 결합부(132)를 외부 구조물(140)의 결합공(141)에 체결하여 고정한다.That is, the joining part (132) of the metal case part (140) is fixed by being connected to the joining hole (141) of the external structure (140).

따라서 상기 압력센서 패키지는 압력센서 기능을 수행함과 동시에, 압력센서가 실장된 PCB(110)의 GND가 금속케이스부(130)를 통해 외부 구조물(140)로 접지되는 기능을 수행하게 되는 것이다.Accordingly, the above pressure sensor package performs the function of a pressure sensor while also performing the function of grounding the GND of the PCB (110) on which the pressure sensor is mounted to an external structure (140) through the metal case portion (130).

따라서 본 발명은 압력센서가 실장된 PCB(110)의 노이즈 및 전자파 내성에 장점을 발휘하게 된다.Accordingly, the present invention has advantages in noise and electromagnetic wave resistance of a PCB (110) on which a pressure sensor is mounted.

이상에서는 본 발명에 대한 한정된 실시예들을 설명한 것이나, 본 발명은 이에 한정되는 것은 아니고 다양한 실시예가 예상됨을 당업자는 주의해야 한다.Although the above has described limited embodiments of the present invention, it should be noted by those skilled in the art that the present invention is not limited thereto and various embodiments are anticipated.

110: PCB 111: 접지공
112: GND 패턴부 113: 상부면
120: 볼트부재 121: 머리부
122: 끼움부 123: 체결부
130: 금속케이스부 131: 수용부
132: 결합부 133: 바닥부
134: 체결공 135: 압력감지홀
140: 외부 구조물110: PCB 111: Grounding hole
112: GND pattern part 113: Top surface
120: Bolt member 121: Head member
122: Fitting part 123: Fastening part
130: Metal case part 131: Receiving part
132: Joint 133: Bottom
134: Fastening hole 135: Pressure sensing hole
140: External structures

Claims (5)

적어도 하나 이상의 접지공을 포함하는 PCB;
상기 접지공을 통해 PCB를 금속케이스부에 고정하는 전도성 재질의 볼트부재; 및
상기 PCB가 상기 볼트부재를 통해 안착 고정되며, 외부 구조물에 장착되는 금속케이스부를 포함하되,
상기 접지공의 PCB 상부면 둘레에는 일정한 폭으로 GND 패턴부가 노출되도록 형성되어, 상기 볼트부재 체결 시 상기 GND 패턴부와 볼트부재가 서로 접촉되도록 구성되고,
상기 볼트부재는 체결공구가 결합되는 머리부와, 상기 머리부의 하부로 PCB의 접지공에 삽입되는 끼움부와, 상기 끼움부의 하부로 금속케이스부에 체결되는 체결부로 구성된 것을 특징으로 하는 인쇄회로기판의 접지구조.
A PCB comprising at least one grounding hole;
A conductive material bolt member that secures the PCB to the metal case through the above grounding hole; and
The above PCB is fixedly secured through the above bolt member and includes a metal case part mounted on an external structure,
The GND pattern portion is formed to be exposed with a certain width around the upper surface of the PCB of the above grounding hole, so that when the bolt member is fastened, the GND pattern portion and the bolt member are configured to come into contact with each other.
A grounding structure for a printed circuit board, characterized in that the bolt member comprises a head portion to which a fastening tool is coupled, a fitting portion inserted into a grounding hole of a PCB through the lower portion of the head portion, and a fastening portion fastened to a metal case portion through the lower portion of the fitting portion.
 청구항 1에 있어서,
상기 접지공은 원형으로 구성된 것을 특징으로 하는 인쇄회로기판의 접지구조.
In claim 1,
A grounding structure of a printed circuit board, characterized in that the above grounding hole is configured in a circular shape.
 청구항 1에 있어서,
상기 PCB에는 압력센서 패키지를 구성하기 위해 압력센서가 실장되는 것을 특징으로 하는 인쇄회로기판의 접지구조.In claim 1,
A grounding structure of a printed circuit board, characterized in that a pressure sensor is mounted on the above PCB to form a pressure sensor package. 삭제delete 청구항 1에 있어서,
상기 금속케이스부는 상기 PCB를 수용하는 수용부와, 상기 수용부의 저면으로 돌출 형성되어 외부 구조물에 고정되는 결합부와, 상기 수용부의 바닥부에 형성되어 상기 볼트부재가 체결되는 체결공과, 상기 수용부의 중앙으로 관통 형성되는 압력감지홀로 구성된 것을 특징으로 하는 인쇄회로기판의 접지구조.In claim 1,
A grounding structure for a printed circuit board, characterized in that the metal case portion comprises a receiving portion that receives the PCB, a connecting portion that protrudes from the bottom surface of the receiving portion and is fixed to an external structure, a fastening hole formed on the bottom of the receiving portion and into which the bolt member is fastened, and a pressure sensing hole formed through the center of the receiving portion.
KR1020220135804A 2022-10-20 2022-10-20 Grounding structure of printed circuit board Active KR102713186B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220135804A KR102713186B1 (en) 2022-10-20 2022-10-20 Grounding structure of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020220135804A KR102713186B1 (en) 2022-10-20 2022-10-20 Grounding structure of printed circuit board

Publications (2)

Publication Number Publication Date
KR20240055479A KR20240055479A (en) 2024-04-29
KR102713186B1 true KR102713186B1 (en) 2024-10-11

Family

ID=90883722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220135804A Active KR102713186B1 (en) 2022-10-20 2022-10-20 Grounding structure of printed circuit board

Country Status (1)

Country Link
KR (1) KR102713186B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018017588A (en) * 2016-07-27 2018-02-01 日本精機株式会社 Pressure sensor device and electric pump

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100625971B1 (en) 2003-10-10 2006-09-20 삼성에스디아이 주식회사 Plasma display device with improved coupling and grounding structure of circuit board
KR20050036267A (en) 2003-10-15 2005-04-20 삼성에스디아이 주식회사 Plasma display device having structures for coupling and grounding of circuit board
KR20150131439A (en) * 2014-05-14 2015-11-25 주식회사 현대케피코 Device for measuring pressure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018017588A (en) * 2016-07-27 2018-02-01 日本精機株式会社 Pressure sensor device and electric pump

Also Published As

Publication number Publication date
KR20240055479A (en) 2024-04-29

Similar Documents

Publication Publication Date Title
EP1237400A3 (en) Printed circuit board mounting facility
US20180206340A1 (en) Component module
JP2003015150A (en) Conductive connecting structure for liquid crystal panel
KR100348227B1 (en) Printed-circuit board module
KR102713186B1 (en) Grounding structure of printed circuit board
KR20210041877A (en) Holder for surface mounted device
JP4380036B2 (en) Electronic component and manufacturing method thereof
US6399893B1 (en) Electronic device
US20090161324A1 (en) Shielding case, wiring board and electronic module
KR950035544A (en) Circuit Module Manufacturing Method
US20050085101A1 (en) Filter insert for an electrical connector assembly
KR200232746Y1 (en) Erth structure for printed circuit board and shield case
JP4692085B2 (en) Electronic components
CN210157541U (en) Electronic control unit
US20040248437A1 (en) Reinforced substrates having edge-mount connectors
JP2003115679A (en) Information equipment with earth structure and earth plate
JPH04307988A (en) Electronic unit
KR200185461Y1 (en) Automotive Circuit Board Mounting Structure
TWI708478B (en) Surface mount type device and manufacturing method for the same
JP2000013077A (en) Electronic apparatus
JP3102360B2 (en) Electronic components with lead terminals
US20040248438A1 (en) Reinforced substrates with face-mount connectors
KR200146567Y1 (en) Modular Fixed Structure
KR200154806Y1 (en) A smd package
JPH0617130U (en) Electronic components for wiring board mounting

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20221020

PA0201 Request for examination
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20231120

Patent event code: PE09021S01D

PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240829

PG1601 Publication of registration