KR102713115B1 - Manufacturing method of encapsulation member for organic electronic device - Google Patents

Abstract

The present invention relates to an encapsulating material for organic electronic devices and a method for manufacturing the same. More specifically, the present invention relates to an encapsulating material for organic electronic devices and a method for manufacturing the same, manufactured by introducing a mechanical cutting method that improves productivity while solving problems of an encapsulating material for organic electronic devices manufactured by conventional laser cutting.

Description

{Manufacturing method of encapsulation member for organic electronic device}

The present invention relates to an encapsulating material for organic electronic devices manufactured through a mechanical cutting method that improves productivity while solving problems of encapsulating materials for organic electronic devices manufactured through conventional laser cutting, and a method for manufacturing the same.

Organic light-emitting diodes (OLEDs) are light-emitting diodes in which the light-emitting layer is made of a thin film of organic compounds, and they use the electroluminescence phenomenon to generate light by passing electric current through a fluorescent organic compound. These organic light-emitting diodes generally implement main colors through three-color (Red, Green, Blue) independent pixel method, chemical conversion (CCM), and color filter method, and are classified into low-molecular organic light-emitting diodes and high-molecular organic light-emitting diodes depending on the amount of organic matter contained in the light-emitting material used. In addition, they can be classified into passive driving methods and active driving methods depending on the driving method.

These organic light-emitting diodes have the advantages of being able to express high-definition video because they have the characteristics of high efficiency due to self-luminescence, low-voltage operation, and simple operation. In addition, applications to flexible displays and organic electronic devices utilizing the flexible properties of organic materials are also expected.

Organic light-emitting diodes are manufactured by laminating organic compounds as light-emitting layers in the form of thin films on a substrate. However, organic compounds used in organic light-emitting diodes are very sensitive to impurities, oxygen, and moisture, and thus have a problem in that their characteristics are easily deteriorated by external exposure or moisture and oxygen penetration. This deterioration of organic substances affects the light-emitting characteristics of organic light-emitting diodes and shortens their lifespan. In order to prevent this phenomenon, a thin film encapsulation process is required to prevent oxygen, moisture, etc. from entering the interior of the organic electronic device.

In the past, metal cans or glass were processed into a cap shape with a groove and a desiccant in powder form was loaded into the groove to absorb moisture. However, this method had the problem that it was difficult to simultaneously remove moisture permeation into the sealed organic electronic device to the desired level, block moisture, impurities, and other substances that cause defects from approaching the organic electronic device, prevent delamination that may occur when moisture is removed, and have excellent moisture resistance and heat resistance.

In addition, when manufacturing a conventional encapsulating material for organic electronic devices, the encapsulating resin layer and the release layer were first cut using a CO2 _laser cutting method, and then the metal layer was cut a second time using a fiber laser to manufacture the encapsulating material. However, this conventional laser cutting method has a complex and multi-step production process, which takes a long time to produce, and there are problems such as a thermal deformation area (formation of a blunt surface on the upper side of the release layer and residue generation on the cut surface of the encapsulating resin layer and the release layer) occurring between the encapsulating resin layer and the release layer, making it difficult to remove the release layer, and a burr occurring on the cut surface and an off-set area occurring during the second cutting, which shortens the lifespan of the organic electronic device by the amount of the offset area.

Korean Publication Patent No. 2006-0030718 (Publication Date: 2006.04.11) Japanese Patent Publication No. 2016-24240 (Published on February 8, 2016)

The present invention has been made to solve the above problems, and aims to provide a method for manufacturing a packaging material that improves the problems of a packaging material manufactured through a conventional laser cutting process, and a packaging material manufactured through the method.

The present invention for solving the above problems relates to a method for manufacturing a sealing material for an organic electronic device, comprising: a 1st step of preparing a composite sheet including a metal layer, a sealing resin layer, and a release layer; a 2nd step of performing slitting cutting on both sides of the composite sheet in the long direction; and a 3rd step of performing shearing cutting on the composite sheet that has undergone slitting cutting in the short direction. The 2nd and 3rd steps can be performed as a continuous process.

As a preferred embodiment of the present invention, the first-stage composite sheet may further include a layer having a different component from the metal layer and the encapsulating resin layer, and may further include a layer having a different component from the encapsulating resin layer and the releasing layer, between the encapsulating resin layer and the releasing layer.

As a preferred embodiment of the present invention, the slitting cutting can be performed by a slitting cutting machine in which the upper knife is a circular knife and the lower knife is formed with an insertion portion into which the upper knife is inserted.

As a preferred embodiment of the present invention, the lateral pressure applied to the top knife during the slitting cutting may be 0.5 to 2.5 kgf/cm2.

As a preferred embodiment of the present invention, in the slitting cutting, each of the upper knife and the lower knife used for the slitting cutting may independently have a knife land value of 0.10 to 0.30 mm.

As a preferred embodiment of the present invention, the shearing cutting can be performed using a shearing cutting machine including an upper knife having a blade angle (slope) of 0.140° to 0.300° and a lower knife having a blade angle of 0.005° or less.

As a preferred embodiment of the present invention, the land value of the cutting knife used for shear cutting is 0.10 to 2.0 mm.

As a preferred embodiment of the present invention, when performing shear cutting, the gap between the upper knife and the lower knife may be 0.5 ㎛ to 50 ㎛.

As a preferred embodiment of the present invention, during the shear cutting, the cutting speed may be 150 to 300 mm/sec.

As a preferred embodiment of the present invention, after the slitting cutting in the second step, a process of continuously wet cleaning the slitting-cut long side portion of the composite sheet can be further performed.

As a preferred embodiment of the present invention, the above-mentioned third step may further include performing a dry surface washing process on the composite sheet that has been continuously shear-cut after shear cutting.

As a preferred embodiment of the present invention, the encapsulating material for an organic electronic device of the present invention includes a composite sheet having a long side slit-cut and a short side shear-cut, and the long side cut surface of the slit-cut composite sheet and the short side cut surface of the shear-cut composite sheet can have a taper angle satisfying the following equation 1.

[Equation 1]

Average taper angle of short-side cross-section ≤ Average taper angle of long-side cross-section

In Equation 1, the taper angle means the angle formed between the lowermost surface end of the lowermost layer of the cut surface and the uppermost surface end of the uppermost layer of the cut surface when viewed from the side direction of the cut surface to be measured for taper.

As a preferred embodiment of the present invention, the short-side cut surface of the shear-cut composite sheet includes a first short-side cut surface and a second short-side cut surface, and in the case of the composite sheet including a metal layer, a sealing resin layer, and a release layer, the first short-side cut surface and the second short-side cut surface may have a taper angle of 73˚ to 90˚.

As a preferred embodiment of the present invention, the short-side cut surface of the shear-cut composite sheet includes a first short-side cut surface and a second short-side cut surface, and in the case of the composite sheet including a metal layer and a sealing resin layer from which a release layer has been removed, the first short-side cut surface and the second short-side cut surface may have a taper angle of 67˚ to 90˚.

The term used in the present invention The term "taper angle" means the angle formed between the end of the lowermost surface of the cut surface of the composite sheet lower layer (or lower sheet) and the end of the uppermost surface of the cut surface of the composite sheet upper layer (or upper sheet) when viewed from the side direction of the cut surface to be measured for taper (see Fig. 7).

The term "comb pattern" used in the present invention means a pattern formed in a diagonal direction.

The term "taper length" used in the present invention means the difference in length between the lowermost surface end of the lower layer (or lower sheet) and the uppermost surface end of the upper layer (or upper sheet) of the composite sheet cut surface when viewed from the side direction of the cut surface to be measured for taper (see Fig. 7).

The encapsulating material for organic electronic devices of the present invention is manufactured by a mechanical cutting method rather than a conventional laser cutting method, and thus, compared to laser cutting with a complicated production process, the cutting process time can be shortened by 30% to 50%, and since there are no problems of conventional laser cutting, such as the occurrence of a blunt in the cut surface of the release layer due to thermal deformation of the cut portion, the occurrence of residues and burrs on the cut surface, and the occurrence of an off-set area, the reliability is excellent, the initial peeling force of the release layer (or release film) is low, and since there is no space loss due to the blunt on the surface of the release layer when a large amount of encapsulating materials is stacked and stored (or stored), it is advantageous for product storage, and the dimensional tolerance of the short side is small.

FIGS. 1A and 1B are schematic cross-sectional views of an organic electronic device encapsulating material according to a preferred embodiment of the present invention.
Figure 2 is a schematic diagram of slitting cutting.
Figures 3a and 3b are schematic diagrams of shear cutting and the upper and lower knives used therefor, and Figure 3c is a schematic diagram for explaining the cross-section of a composite sheet.
Figure 4 is a SEM measurement image of the slit-cut long side cross-section.
Figure 5 is a SEM measurement image of the cross-section cut by the upper and lower knives.
Figure 6 shows an SEM image and schematic diagram of the cross-section of a laser-cut composite sheet.
Figure 7 is a schematic diagram illustrating the explanation of taper length and taper angle.
Figure 8 shows the equipment and photographs used to measure the initial peel strength of a composite sheet in Experimental Example 2.
Figure 9 shows the results of measuring the initial peel strength of the composite sheet in Experimental Example 2.
Figures 10a to 10f are optical microscope measurement images of the longitudinal cross-section of a composite sheet slit-cut by varying the lateral pressure of a flat knife.
Figure 11a is a SEM image of a cross-section by a shearing cutting knife, and Figure 11b is an image confirming the occurrence of PET lifting inward from the end of the heteromorphic sheet.

The present invention is described in more detail below.

The encapsulating material for an organic electronic device of the present invention is manufactured by manufacturing a composite sheet, and then cutting the long side of the composite sheet through slitting cutting and cutting the short side of the composite sheet through shearing cutting using a mechanical cutting method.

As a preferred embodiment, the encapsulating material for an organic electronic device of the present invention (hereinafter referred to as “encapsulating material”) may include a composite sheet (10) including a metal layer (14), an encapsulating resin layer (15), and a release layer (13), as schematically illustrated in FIG. 1A, or may include a composite sheet including a metal layer (14) and an encapsulating resin layer (15) from which the release layer is peeled off.

And, the composite sheet is a sheet having cut surfaces formed at multiple ends, and preferably, it can be a sheet including four ends and having cut surfaces formed at each end.

Between the metal layer and the encapsulating resin layer of the above composite sheet, a layer (or sheet) having a different component and/or function from the metal layer and the encapsulating resin layer may be further included, and between the encapsulating resin layer and the release layer, a layer (or sheet) having a different component and/or function from the encapsulating resin layer and the release layer may be further included.

And, as schematically illustrated in A and B of FIG. 1, the sealing resin layer may include a single-layer pressure-sensitive adhesive layer or two or more multi-layer pressure-sensitive adhesive layers, and when the sealing resin layer is composed of multi-layer pressure-sensitive adhesive layers, each layer of the pressure-sensitive adhesive layers may be composed of pressure-sensitive adhesive components having different compositions and/or composition ratios.

In the bagging material of the present invention, the cut surface is a cut surface formed by a mechanical cutting method, and the bagging material of the present invention may have four cut surfaces, and two of the four cut surfaces may be long-side cut surfaces that are slitting cut, and the other two cut surfaces may be short-side cut surfaces that are shearing cut.

The above cross-section may have two long-side cross-sections (slitting cutting cross-sections) and two short-side cross-sections (shearing cutting cross-sections) satisfying the following equation 1.

[Equation 1]

Average taper angle of short-side cross-section ≤ Average taper angle of long-side cross-section

In Equation 1, the taper angle means the angle formed between the lowermost surface end of the lowermost layer of the cut surface and the uppermost surface end of the uppermost layer of the cut surface when viewed from the side direction of the cut surface to be measured for taper.

The above two longitudinal cross-sections are cross-sections formed by slitting cutting, and the surfaces of the longitudinal cross-sections have a comb-like pattern formed.

Each of the two long-side cut surfaces may have taper angles that are equal to or different from each other, and further, each of the two short-side cut surfaces may have taper angles that are equal to or different from each other, and preferably, the two long-side cut surfaces and the two short-side cut surfaces may satisfy the following equation 2.

[Equation 2]

Taper angle deviation of long side cross section < Taper angle deviation of short side cross section

In Equation 2, the taper angle deviation of the long-side cross-section means the taper angle difference between each of the two long-side cross-sections, and the taper angle deviation of the short-side cross-section means the taper angle difference between each of the two short-side cross-sections.

In the bag material of the present invention, the taper angle of the longitudinal cross-section formed by the slitting cutting may be 80˚ to 90˚, preferably 82˚ to 90˚.

More specifically, in the case of a composite sheet including a metal layer, an encapsulating resin layer, and a release layer, the taper angle of the slitting-cut cross-section may be 83˚ to 90˚, preferably 85˚ to 90˚. In addition, in the case of a composite sheet including a metal layer and an encapsulating resin layer from which the release layer has been removed, the taper angle of the slitting-cut cross-section may be 80˚ to 90˚, preferably 81˚ to 89˚.

In addition, the taper length of the longitudinal cross-section is 20㎛ or less, and the cut scrap of the longitudinal cross-section can be removed through a scrap winder.

And, in the case of the composite sheet (encapsulating material) including the metal layer, the encapsulating resin layer, and the release layer, the shearing-cut cut surface may have a first cut surface formed by the lower knife of the shearing cutting knife and a second cut surface formed by the upper knife of the shearing cutting knife, and the first cut surface may have a taper angle of 73˚ to 90˚ (or 0˚ to -17˚), and the second cut surface may have a taper angle of 73˚ to 90˚. And, at this time, the taper length of the first cut surface may be 0 to +60㎛, preferably 0 to +50㎛, and the taper length of the second cut surface may be 0 to +60㎛ (or 0 to -60㎛), preferably 0 to +50㎛ (or 0 to -50㎛).

In addition, in the case of a composite sheet (encapsulating material) including a metal layer and an encapsulating resin layer from which a heterogeneous layer has been removed, the first cut surface may have a taper angle of 67˚ to 90˚ (or 0˚ to -23˚), and the second cut surface may have a taper angle of 68˚ to 88˚. At this time, the taper length of the first cut surface may be 0 to +60㎛, preferably 0 to +50㎛, and the taper length of the second cut surface may be 0 to +60㎛ (or 0 to -60㎛), preferably 0 to +50㎛ (or 0 to -50㎛).

The taper angle and taper length of the long-side cut surface and the short-side cut surface are relatively high taper angles and low taper lengths compared to cut surfaces formed by a laser cutting method. This is because the off-set region formed by the laser cutting method does not occur in the cut surface of the mechanical cutting method or is very low.

As a preferred example, in order to process a composite sheet (10) including a metal layer (14), a sealing resin layer (15), and a release layer (13) into an appropriate size, when mechanically cutting, that is, a slitting cut is performed in the long-side direction (length direction) and a shearing cut is performed in the short-side direction, the sealing material manufactured in this way has four end portions and four cut surfaces, and the long-side cut surfaces and the short-side cut surfaces have different cut surface surface shapes, taper angles, and taper lengths, and the first short-side cut surface formed by the lower knife of the shearing cutting knife of the short-side cut surface and the second short-side cut surface formed by the upper knife of the shearing cutting knife may have different taper angles and taper lengths.

And, the metal layer may have a thickness of 60 ㎛ to 150 ㎛, preferably 70 ㎛ to 120 ㎛, and more preferably 75 ㎛ to 105 ㎛.

And, the encapsulating resin layer may have a thickness of 30 ㎛ to 100 ㎛, preferably 40 ㎛ to 80 ㎛, and more preferably 45 ㎛ to 75 ㎛.

And, the heteromorphic layer may have a thickness of 15 ㎛ to 75 ㎛, preferably 25 ㎛ to 60 ㎛, and more preferably 35 ㎛ to 55 ㎛.

The sealing material of the present invention may have an overall thickness of 120 ㎛ to 280 ㎛, preferably 125 ㎛ to 220 ㎛, and more preferably 128 ㎛ to 200 ㎛.

The encapsulating material of the present invention manufactured by this method can have an initial peel force of 200 to 400 gf, preferably 250 to 380 gf, and more preferably 300 to 370 gf at the edge of the release layer when measured by the UTM method under the conditions of a jig lowering speed and rising speed of 1.0 mm/sec, a dwell force of 800 gf, and a dwell time of 10.0 sec. The initial peel force value of this encapsulating material is a relatively very low value compared to an encapsulating material manufactured by laser cutting having an initial peel force of 500 gf or more, and this is because of the difference in the presence or absence of a residue generated and formed on the cut surface of the release layer and the encapsulating resin layer during laser cutting.

The sealing material of the present invention has a height deviation of 0 to 4 ㎛, preferably 0 to 2 ㎛, and more preferably 0 to 1.5 ㎛ on the surface of the release layer according to the following mathematical formula 1, and thus has almost no height deviation. Here, the height of the height deviation refers to the height in the vertical direction from the lower surface of the release layer at the joint portion of the sealing resin layer and the release layer to the upper surface corresponding to the lower surface of the release layer.

[Mathematical formula 1]

Height deviation = (maximum height of the edge of the heteromorphic layer) - (height of the center of the heteromorphic layer)

In mathematical expression 1, the edge of the heteromorphic layer means a portion of the surface of the heteromorphic layer extending 1 mm from the cut surface toward the inside of the heteromorphic layer.

Compared to the sealing material manufactured by laser cutting, which has a large height deviation due to the formation of a blunt protrusion at the end of the release layer by thermal fusion, the sealing material of the present invention has a very low or no height deviation because such a blunt protrusion hardly occurs.

[Metal layer]

In the encapsulating material for an organic electronic device of the present invention, the metal layer may include at least one selected from iron (Fe), bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), aluminum (Al), cobalt (Co), manganese (Mn), titanium (Ti), molybdenum (Mo), silicon (Si), magnesium (Mg), tungsten (W), and alloys thereof.

A preferred example is a metal sheet made of stainless steel containing bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), and more preferably a metal sheet containing an alloy containing 34 to 38 wt% of nickel and the remainder of iron (Fe) (including essential impurities in addition to nickel and iron).

[Bagjisuji layer]

In addition, in the sealing material for organic electronic devices of the present invention, the sealing resin layer can be manufactured from an adhesive composition including a polyolefin-based adhesive resin, and the polyolefin-based resin can include one or more selected from among poly(C ₂ to C ₆ ) alkylene resins such as polyethylene, polypropylene, polypropylene, and polyisobutylene; and random copolymer resins in which ethylene, propylene, and/or diene-based compounds are copolymerized.

As a preferred example, the polyolefin-based adhesive resin may include a compound represented by the following chemical formula 1.

[Chemical Formula 1]

In the chemical formula 1, R ¹ is a hydrogen atom or a C ₃ to C ₁₀ straight-chain alkenyl group or a C ₄ to C ₁₀ branched alkenyl group, and preferably, R ¹ may be a hydrogen atom, a C ₄ to C ₈ straight-chain alkenyl group or a C ₄ to C ₈ branched alkenyl group. In addition, n is a rational number that satisfies the weight average molecular weight of the compound represented by the chemical formula 1 of 10,000 to 2,000,000, preferably a rational number that satisfies the weight average molecular weight of 30,000 to 1,550,000, and more preferably a rational number that satisfies the weight average molecular weight of 40,000 to 1,500,000. If the weight average molecular weight is less than 10,000, panel sagging may occur due to a decrease in modulus, heat resistance may be reduced, reliability may be reduced due to a decrease in the filling property of the desiccant, mechanical properties may be reduced, and a lifting phenomenon with respect to the substrate may occur due to expansion of the desiccant volume due to a decrease in elasticity. In addition, if the weight average molecular weight exceeds 2,000,000, adhesive strength with the substrate may be reduced due to a decrease in wettability, and bonding to the panel may be reduced as the modulus increases.

The compound represented by the above chemical formula 1 can have a crystallization temperature of 100°C to 140°C, preferably 110 to 130°C, and more preferably 115°C to 125°C, when measured by the following measuring method.

[measurement method]

The crystallization temperature (T _c ) was measured by peak analysis of the cooling curve of the heat flow measured using a differential scanning calorimeter (DSC) while cooling from 200℃ to -150℃ at a rate of 10℃.

In addition, the polyolefin-based adhesive resin may include a random copolymer in which ethylene, propylene, and a diene-based compound are copolymerized. At this time, ethylene and propylene may be randomly copolymerized in a weight ratio of 1:0.3 to 1.4, preferably in a weight ratio of 1:0.5 to 1.2. If the weight ratio of the copolymerized ethylene and propylene is less than 1:0.3, it may cause poor panel bonding due to an increase in modulus and hardness, and problems such as decreased adhesion with a substrate and decreased physical properties at low temperatures may occur, and it may adversely affect volume expansion of the moisture absorbent due to decreased elasticity, and if the weight ratio exceeds 1:1.4, panel sagging may occur due to a decrease in modulus and hardness, and the decrease in mechanical properties may lead to a decrease in the mechanical properties of the product, and a problem such as decreased reliability may occur due to difficulty in high filling of the moisture absorbent. In addition, the diene compound may be included in an amount of 2 to 15 wt%, preferably 7 to 11 wt%, based on the total weight of the random copolymer in which ethylene, propylene, and the diene compound are copolymerized. If the diene compound is included in an amount of less than 2 wt%, the panel may sag due to a decrease in modulus caused by a low curing speed and curing density, and heat resistance may be reduced. In addition, a lifting phenomenon with respect to the substrate may occur due to expansion of the volume of the moisture absorbent caused by a decrease in elasticity. If the diene compound is included in an amount of more than 15 wt%, the adhesive strength with the substrate may be reduced due to insufficient wettability caused by high curing density, compatibility between resins may be reduced, and panel bonding may be reduced due to high modulus. In addition, yellowing may occur due to heat.

The above polyolefin-based adhesive resin may be used by mixing two types of adhesive resins in order to improve physical properties such as increased elasticity, and a preferred example thereof may include a random copolymer (first adhesive resin) in which the ethylene, propylene, and diene-based compounds are copolymerized, and a compound represented by the above chemical formula 1 (second adhesive resin). Preferably, the first adhesive resin and the second adhesive resin may be included in a weight ratio of 1:0.1 to 10, preferably a weight ratio of 1:1 to 9, and more preferably a weight ratio of 1:1.1 to 5. At this time, if the weight ratio exceeds 1:10, a problem of reduced elasticity may occur, and therefore, when the first adhesive resin and the second adhesive resin are mixed and used, it is preferable to use them within the above range.

The adhesive composition used in the manufacture of the sealing resin layer may further contain additives such as a tackifier, a moisture absorbent, a curing agent, a photoinitiator, and an antioxidant in addition to the polyolefin-based adhesive resin described above.

Among the additives, the tackifier may include, without limitation, any adhesive resin typically used in adhesive compositions for encapsulating organic electronic devices, and preferably may include at least one selected from hydrogenated petroleum resins, hydrogenated rosin resins, hydrogenated rosin ester resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, polymerized rosin resins, and polymerized rosin ester resins. In addition, the amount of the tackifier used is preferably 50 to 300 parts by weight, and preferably 80 to 280 parts by weight, per 100 parts by weight of the polyolefin-based adhesive resin. If the amount of the tackifier is less than 50 parts by weight per 100 parts by weight of the mixed resin, moisture resistance may be insufficiently secured, and if it exceeds 300 parts by weight, durability and moisture resistance may be deteriorated due to brittleness.

Among the additives, the above-mentioned moisture absorbent may be used without limitation as long as it is a moisture absorbent commonly used in the packaging of organic electronic devices, and preferably, it may include at least one of a moisture absorbent including zeolite, titania, zirconia or montmorillonite as a component, a metal salt and a metal oxide, and more preferably, it may include a metal oxide.

The metal oxide may include at least one of a metal oxide such as silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO), an organic metal oxide, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salts _include sulfates such as lithium sulfate ( _Li2SO4 ), sodium sulfate ( _Na2SO4 ), calcium _sulfate ( _CaSO4 ), magnesium sulfate ( _MgSO4 ), cobalt sulfate ( _CoSO4 ), gallium sulfate ( _Ga2 ( _SO4 ) ₃ ), titanium sulfate (Ti( _SO4 ) ₂ ), or nickel sulfate ( _NiSO4 ), calcium chloride ( _CaCl2 ), magnesium chloride ( _MgCl2 ), strontium chloride ( _SrCl2 ), yttrium chloride ( _YCl3 ), copper chloride ( _CuCl2 ), cesium fluoride (CsF), tantalum fluoride ( _TaF5 ), niobium fluoride ( _NbF5 ), lithium bromide (LiBr), calcium bromide ( _CaBr2 ), cesium bromide ( _CeBr3 ), It may include at least one of metal halides such as selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ), and metal chlorates such as barium perchlorate (Ba(ClO ₄ ) ₂ ) or magnesium perchlorate (Mg(ClO ₄ ) ₂ ).

It is recommended to use a desiccant with a purity of 95% or higher. If the purity is less than 95%, not only will the moisture absorption function be reduced, but the substances contained in the desiccant may act as impurities, causing defects in the adhesive film and affecting organic electronic devices, but are not limited thereto.

When using a desiccant, the appropriate amount may include 10 to 550 parts by weight, preferably 20 to 520 parts by weight, per 100 parts by weight of the polyolefin-based adhesive resin. If the amount of the desiccant used is less than 10 parts by weight, the durability of the organic electronic device may deteriorate, the moisture removal effect may be significantly reduced, and the intended adhesive film may not be implemented. On the other hand, if the amount of the desiccant used exceeds 550 parts by weight, the reliability of the organic electronic device may deteriorate due to poor adhesion, such as adhesion between the adhesive film and the organic electronic device, due to insufficient wettability, and the lifespan of the organic electronic device may be shortened due to the occurrence of a lifting phenomenon caused by excessive volume expansion when absorbing moisture.

Among the additives, the curing agent may include, without limitation, any substance that can be typically used as a curing agent, and preferably may include a substance that can secure sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably may include at least one selected from a urethane acrylate-based curing agent having a weight average molecular weight of 100 to 1,500 and an acrylate-based curing agent having a weight average molecular weight of 100 to 1,500. If the weight average molecular weight of the curing agent is less than 100, the panel bonding property and the adhesive strength with the substrate may deteriorate due to an increase in hardness, and an outgas problem of unreacted curing agent may occur, and if the weight average molecular weight exceeds 1,500, the mechanical properties may deteriorate due to an increase in softness. In addition, the appropriate amount of the curing agent to be used is 2 to 50 parts by weight, and preferably 5 to 40 parts by weight, per 100 parts by weight of the polyolefin-based adhesive resin. If less than 2 parts by weight of the hardener is used, the desired gelation rate and modulus cannot be achieved, and problems such as reduced elasticity may occur. If more than 50 parts by weight is used, problems such as poor panel bonding and reduced adhesiveness due to reduced wettability may occur due to high modulus and hardness.

Among the additives, the photoinitiator may be included without limitation as long as it is a commonly used photoinitiator, and preferred examples thereof may include at least one selected from mono acyl phosphine, bis acyl phosphine, α-hydroxyketone, α-amino ketone, phenylglyoxylate, and benzyldimethyl-ketal. In addition, the appropriate amount of the photoinitiator to be used is 0.1 to 10 parts by weight, and preferably 0.5 to 8 parts by weight, per 100 parts by weight of the polyolefin-based adhesive resin. If the photoinitiator is used in an amount of less than 0.1 part by weight, poor heat resistance due to poor curing may occur, and if it is used in an amount of more than 10 parts by weight, poor heat resistance due to reduced curing density may occur.

The adhesive composition used in the manufacture of the sealing resin layer may have a viscosity of 100,000 to 300,000 Paㆍs (50℃), preferably 120,000 to 280,000 Paㆍs (50℃). If the viscosity is less than 100,000 Paㆍs (50℃), the processability may become poor due to increased tack, which may cause a problem in that the release layer (or release sheet) cannot be peeled off, and if the viscosity exceeds 300,000 Paㆍs (50℃), the adhesive strength with the substrate may become too low due to decreased tack.

The sealing resin layer can be manufactured as a single-layer or multi-layer pressure-sensitive adhesive layer using the adhesive composition as described above, and a preferred example is as follows. However, this is an example to help understand the present invention, and the present invention should not be limited thereto.

When the sealing resin layer is a pressure-sensitive adhesive layer having a single-layer structure, the glass adhesion may be 1500 gf/25mm or more, preferably 1600 gf/25mm or more. At this time, the adhesion is measured by laminating an adhesion measuring tape (7475, TESA) on the upper surface of an adhesive film through a hand roller (2Kg Hand Roller), cutting the sample to a width of 25mm and a length of 120mm, laminating the lower surface of the adhesive film to the glass at 80℃, leaving the prepared sample at room temperature for 30 minutes, and measuring the glass adhesion at a speed of 300㎜/min.

And the adhesion of the sealing resin layer to the metal layer may be 1000 gf/25mm or more, preferably 1100 gf/25mm or more. At this time, the adhesion to the metal layer is measured by laminating the upper surface of the adhesive film to a Ni alloy having a thickness of 80㎛ at 80℃, laminating an adhesion measuring tape (7475, TESA) to the lower surface of the adhesive film through a hand roller (2Kg Hand Roller), cutting the sample to a width of 25mm and a length of 120mm, leaving the prepared sample at room temperature for 30 minutes, and measuring the adhesion at a speed of 300mm/min.

In addition, the sealing resin layer can be formed as a pressure-sensitive adhesive layer having a two-layer structure of a first pressure-sensitive adhesive layer (11) and a second pressure-sensitive adhesive layer (12), as schematically shown in B of FIG. 1.

The above first pressure-sensitive adhesive layer (11) is a layer that directly contacts the organic electronic device, and may be formed by including a first mixed resin (11b), an adhesive agent, and a first moisture absorbent (11a). At this time, the first mixed resin (11b) may include a first adhesive resin and a second adhesive resin, and the adhesive agent may include a first adhesive agent and may further include a second adhesive agent.

The polyolefin-based adhesive resin (11b) of the first pressure-sensitive adhesive layer may include the first adhesive resin and the second adhesive resin. In addition, the tackifier of the first pressure-sensitive adhesive layer (11) may include one or two tackifiers (first and second tackifiers). At this time, the tackifier may use the type described above, and preferably may include hydrogenated petroleum resins having different softening points. For example, when hydrogenated petroleum resins having different softening points are included, the softening point of the first tackifier may be lower than the softening point of the second tackifier, and the mixed usage amount of the first tackifier and the second tackifier may be included in a weight ratio of 1:0.5 to 1.5, preferably in a weight ratio of 1:0.6 to 1.4. If the weight ratio of the first tackifier and the second tackifier is less than 1:0.5, a problem of reduced heat resistance may occur, and if the weight ratio exceeds 1:1.5, a problem of reduced adhesion to the substrate may occur due to reduced adhesion and wettability.

And, the first moisture absorbent (11a) used in the manufacture of the first pressure-sensitive adhesive layer can be used without limitation as long as it is a material that can be commonly used as a moisture absorbent, and preferably silica having a BET specific surface area of 2 to 20 m ² /g, preferably a BET specific surface area of 3 to 14 m ² /g, and more preferably a BET specific surface area of 4 to 8 m ² /g can be used. By using silica as the first moisture absorbent (11a), moisture removal performance is excellent, separation of the organic electronic device and the sealing material can be prevented, and the durability of the organic electronic device can be significantly increased.

The adhesive composition used in the manufacture of the second pressure-sensitive adhesive layer (12) may include a polyolefin-based adhesive resin (12b), a tackifier, and a second moisture absorbent (12a). At this time, the polyolefin-based adhesive resin (12b) may include a first adhesive resin and a second adhesive resin, and, unlike the first pressure-sensitive adhesive layer that uses a mixture of two types of tackifiers, the first and second tackifiers, the tackifier may use only the first tackifier. In addition, the same moisture absorbent as the moisture absorbent used in the manufacture of the first pressure-sensitive adhesive layer may be used, and calcium oxide may be preferably used.

[Heterogeneity]

In the encapsulating material for an organic electronic device of the present invention, a release sheet material generally used in the art can be used as the release sheet material of the release layer, and a preferred example thereof may include one or more selected from PET (polyethylene terephthalate), paper, PI (poly imide), and PE (poly ester).

The method for manufacturing the encapsulating material for the organic electronic device of the present invention described above is as follows.

The encapsulating material for an organic electronic device of the present invention can be manufactured by performing a process including the following steps: 1) preparing a composite sheet; 2) performing slitting cutting on both sides in the long direction of the composite sheet; and 3) performing shearing cutting on the composite sheet that has undergone the slitting cutting in the short direction.

The above composite sheet of step 1 includes, as described above, a metal layer, a sealing resin layer, and a release layer, and in addition to these layers, a layer having a different component and/or a layer having a different function from the metal layer and the sealing resin layer may be further included between the metal layer and the sealing resin layer, and a layer having a different component and/or a layer having a different function from the sealing resin layer and the release layer may be further included between the sealing resin layer and the release layer. In addition, the composition, physical properties, characteristics, etc. of the metal layer, the sealing resin layer, and the release layer are as described above.

The composite sheet of the first step of the present invention may be a composite sheet manufactured by laminating using a general method used in the art, and preferably may be manufactured using a roll lamination machine equipped with a curling control system. The roll lamination machine may include a fixed roll, a supporting curl roll, a first curl roll, a second curl roll, an upper roll laminator, and a lower roll laminator, as schematically shown in Fig. 2.

And, based on the joining point of the upper roll laminator and the lower roll laminator, the height of the center of the supporting roll is positioned at a position equal to or lower than the height of the joining point, and the heights of the center of the first curl roll and the center of the second curl roll are positioned lower than the height of the center of the supporting roll, and when joining, the metal sheet can be supplied from the direction of the lower roll laminator, and the bag sheet can be supplied from the direction of the upper roll laminator.

Curls inevitably occur due to the tension, lamination, temperature, and pressure of the bag sheet and the metal sheet, and the direction of the curls occurs in the direction of the bag sheet due to the difference in the tensile strength of the bag sheet and the metal sheet. However, by controlling the curl through a roll lamination machine equipped with the curling control system, the occurrence of curls in the composite sheet can be minimized.

The slitting cutting in the second step can be performed by a slitting cutting machine including a rotary blade-shaped top knife and a lower knife having an insertion portion formed into which the top knife is inserted, as schematically illustrated in FIG. 2. In addition, it is preferable to use a high-speed steel material for the top knife and a carbide material for the lower knife in terms of cutting quality. In addition, it is preferable that the land value of the top knife of the slitting cutting machine be 0.10 to 0.30 mm, preferably 0.15 to 0.25 mm, and more preferably 0.18 to 0.22 mm, respectively. If the land value is less than 0.10 mm, there may be a problem with the durability of the knife, and if the land value exceeds 0.30 mm, there may be a problem with the cutting quality, such that there may be a problem with the taper angle increasing.

The lateral pressure applied to the cutting knife during slitting cutting is preferably 0.5 to 2.5 kgf/cm2, preferably 0.5 to 1.8 kgf/cm2, more preferably 0.8 to 1.2 kgf/cm2. At this time, if the lateral pressure is less than 0.5 kgf/cm2, there may be a problem with the uniformity of the cutting surface, and if the lateral pressure exceeds 2.5 kgf/cm2, there may be a problem with the increase in the offset occurrence area.

In addition, the insertion depth of the upper knife into the lower knife during the slitting cutting is preferably 0.3 to 2.0 mm, preferably 0.5 to 1.5 mm, and more preferably 0.6 to 1.3 mm. At this time, if the insertion depth is 0.3 mm, there may be a problem that an uncut portion occurs, and if the insertion depth exceeds 2.0 mm, there may be a problem that the pressure-sensitive adhesive layer collapses (becomes lumpy).

And, when performing slitting cutting, it is desirable that the rotation speed of the rotary blade, which is a cutting knife, rotates at the same speed as the progress speed of the composite sheet.

In addition, after the two-step slitting cutting, a process of continuously wet cleaning the slit-cut long side portion of the composite sheet can be further performed.

The above wet cleaning can be performed by a general wet cleaning method used in the art, and preferably, the edge cleaner process is performed by a wet cleaning system in which two wet cleaners constitute one set, and the wet cleaning system has clamps positioned at each of the upper and lower long sides of the composite sheet, and a cleaning paper is continuously supplied between the clamps and the composite sheet, and the supply direction of the cleaning paper can be supplied in a direction perpendicular to the direction in which the composite sheet advances.

The above-described three-step shearing cutting can be performed using a shearing cutter composed of an upper knife having a blade angle (slope) of 0.30° or less and a lower knife having a blade angle of 0.005° or less, as schematically illustrated in FIGS. 3a and 3b. The upper knife preferably has a blade angle of 0.140° to 0.300°, preferably 0.143° to 0.287°, and more preferably 0.143° to 0.225°. At this time, if the blade angle of the upper knife is less than 0.140°, there may be a problem of damage being applied to the composite sheet, and if the blade angle of the upper knife exceeds 0.300°, a pushing phenomenon of the cut surface may occur, which may cause a problem of dimensional uniformity.

In addition, the gap between the upper knife and the lower knife is suitably 0.5 ㎛ to 50 ㎛, preferably 1 ㎛ to 25 ㎛, and more preferably 2 ㎛ to 10 ㎛. If the gap exceeds 50 ㎛, there may be a problem of the release sheet being lifted.

In addition, the gap between the upper knife and the lower knife is suitably 0.5 ㎛ to 50 ㎛, preferably 1 ㎛ to 25 ㎛, and more preferably 2 ㎛ to 10 ㎛. If the gap exceeds 50 ㎛, there may be a problem of the release sheet being lifted.

And, the land value of the top surface knife used for sharing cutting is 0.10 to 3.00 mm, preferably, the land value of the top surface knife is 0.10 to 2.00 mm, more preferably, 0.15 to 2.00 mm, and even more preferably, the land value of the top surface knife is 0.18 to 1.80 mm. At this time, if the land value of the top surface knife is less than 0.10 mm, there may be a problem with the durability of the knife, and if the land value of the top surface knife exceeds 3.0 mm, there may be a problem with the cutting quality.

And, the sharing cutting speed can be adjusted according to the composite sheet progress speed and the size of the composite sheet to be manufactured, and is preferably about 150 to 300 mm/sec, more preferably about 180 to 250 mm/sec.

Next, after the three-step sharing cutting, a process of dry-cleaning the composite sheet can be performed continuously.

The above dry cotton cleaning can be performed using a general dry cleaning method used in the art, and preferably, the dry cotton cleaning can sequentially perform a static electricity removal process, an air shower process, a static electricity removal process, a whisking process, and a static electricity removal process, and preferably, a dry cotton cleaning machine configured as in the schematic diagram of Fig. 6 can be used. It is preferable that the dry cotton cleaning machine use a hurricane cleaner in which each of a cleaner equipped with an inonizer, an air knife, a rotating brush, and suction is installed above and below a composite sheet.

The above ionizer is a device for removing static electricity through physical friction between the ionizer and the sheet before the air shower process, before the whisking process, and after the whisking process.

And, the air knife is a device for performing the air shower process, and the rotary brush is a device for performing the whisking process. And, the suction is a device for discharging floating matters generated during the air shower process and whisking process to the outside.

Also, the upper brush rotation direction is in the opposite direction of the sheet moving direction (rotation speed of approximately 200 to 400 rpm), the lower brush rotation direction is in the forward direction of the sheet moving direction (rotation speed of approximately 200 to 400 rpm), and the suction suction pressure is preferably approximately 5 to 20 CMM.

Hereinafter, the present invention will be described more specifically through examples. However, the following examples do not limit the scope of the present invention, and should be interpreted as helping to understand the present invention.

[Example]

Preparation Example 1-1: Manufacturing of adhesive sheet for organic electronic device packaging

(1) Manufacturing of polyolefin adhesive resin

A polyolefin adhesive resin was manufactured by mixing a random copolymer (first adhesive resin) in which ethylene, propylene, and a diene compound are copolymerized and a compound represented by the following chemical formula 1 (second adhesive resin) in a weight ratio of 1:2.33.

The above first adhesive resin was prepared by copolymerizing ethylene and propylene monomers in a weight ratio of 1:0.85 and copolymerizing a diene compound in an amount of 9 wt% based on the total weight of the random copolymer. The diene compound is a random copolymer having a weight average molecular weight of 500,000 prepared using ethylidene norbornene.

[Chemical Formula 1]

In the chemical formula 1 above, R ¹ is isoprene, and n is a rational number that satisfies the weight average molecular weight of 400,000 of the compound represented by the chemical formula 1.

The crystallization temperature (Tc) was measured by peak analysis of the cooling curve of the heat flow measured by differential scanning calorimetry (DSC) while cooling from 200℃ to -150℃ at a rate of 10℃ for each of the first and second adhesive resins. The crystallization temperature of the first adhesive resin was not measured, and that of the second adhesive resin was measured at 120℃.

(2) Manufacturing of adhesive sheets for packaging organic electronic devices

For 100 parts by weight of the polyolefin-based adhesive resin (first adhesive resin) manufactured above, 80 parts by weight of a first tackifier (SU-90, Kolon Industries), 50 parts by weight of a second tackifier (SU-100, Kolon Industries), 11 parts by weight of an acrylate (M200, Miwon Specialty Chemical) having a weight average molecular weight of 226 as a curing agent, 3 parts by weight of a photoinitiator (irgacure TPO, Ciba), and 24 parts by weight of silica having an average particle size of 0.5 ㎛ were added, and then stirred. After stirring, the mixture was passed through a capsule filter to remove foreign substances, and then applied to a 38 ㎛-thick, medium-release PET (REL382, Toray Advance Materials) using a slot die coater, and then dried at 120°C to remove the solvent, and a first pressure-sensitive adhesive layer having a final thickness of 10 ㎛ was formed.

Next, 150 parts by weight of a first tackifier (SU-90, Kolon Industries), 17 parts by weight of an acrylate (M200, Miwon Specialty Chemical) having a weight average molecular weight of 226 as a hardener, 3 parts by weight of a photoinitiator (irgacure TPO, Ciba), and 100 parts by weight of calcium oxide having an average particle size of 3 ㎛ were added to 100 parts by weight of the polyolefin-based adhesive resin (second adhesive resin) manufactured previously, and then stirred. After stirring, the mixture was adjusted to have a viscosity of 800 cps at 20°C and passed through a capsule filter to remove foreign substances, and then applied to a 36 ㎛ thick, light-release PET (TG65R, SKC) using a slot die coater, and then dried at 120°C to remove the solvent and form a second pressure-sensitive adhesive layer having a final thickness of 40 ㎛.

The first pressure-sensitive adhesive layer manufactured above is laminated with the second pressure-sensitive adhesive layer facing each other and passed through a lami-roll at 70°C to obtain an organic electronic device encapsulation material. An adhesive sheet was manufactured (see Fig. 1 b).

Preparation Example 1-2: Manufacturing of adhesive sheet for organic electronic device packaging

An adhesive sheet for an organic electronic device encapsulation material was manufactured using the same method as in Preparation Example 1-1, except that only the second adhesive resin was used to manufacture a polyolefin-based adhesive resin, which was used as the polyolefin-based adhesive resin for the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer. In addition, when manufacturing the first pressure-sensitive adhesive layer, the same calcium oxide used in the manufacture of the second pressure-sensitive adhesive layer was used instead of silica to form the first pressure-sensitive adhesive layer, which was then laminated with the second pressure-sensitive adhesive layer to manufacture an adhesive sheet for an organic electronic device encapsulation material.

Preparation Example 2: Preparation of metal sheet (Face Seal Metal) sheet

A metal sheet having an average thickness of 80 ㎛, containing approximately 36 wt% of nickel and the remainder of iron (Fe) (including essential impurities), a density (d) of 8.1, and a Vickers hardness of 200 HV was prepared.

Preparation Example 3-1: Manufacturing of composite sheet (FSPM sheet) 1

The sealing sheet of Preparation Example 1-1 and the metal sheet of Preparation Example 2 were laminated to manufacture a composite sheet, an FSPM sheet, and then the laminated sheet was wound into a roll to manufacture an FSPM sheet (composite sheet) having a three-layer structure (metal layer (80 μm) - sealing resin layer (50 μm) - release layer (38 μm)).

Preparation Example 3-2: Manufacturing of composite sheet (FSPM sheet) 2

A rolled composite sheet was manufactured in the same manner as in Preparation Example 3-1, but the bag sheet of Preparation Example 1-2 was used instead of the bag sheet of Preparation Example 1-1 to manufacture a rolled composite sheet (hereinafter referred to as “FSPM sheet”).

Example 1: Manufacturing of Organic Electronic Device Encapsulation Material through SSC (Slitting & Shearing Cutting) Process

The FSPM sheet, which is a rolled composite sheet of Preparation Example 3-1, includes a SSC (Slitting & Shearing Cutting) automated machine that includes a cutting target supply section, a slitting cutting section, an edge cleaner section, an automatic dimensional inspection section, a shearing cutting section, and a dry cleaning section.

(1) Slitting cutting process

As schematically illustrated in FIG. 2, the slitting cutting section includes a top knife, which is a circular knife with a diameter of 150 mm, and a bottom knife, which is a circular knife with a diameter of 150 mm, as a cutting rotary blade. The top knife is made of high-speed steel, the bottom knife is made of carbide, and the land values of the top knife and the bottom knife are each 0.2 mm.

A rolled composite sheet supplied from a cutting target material supply section was slit-cut simultaneously along both long sides in the longitudinal direction of the slitting cutting section, and cutting was performed so that the release layer of the FSPM sheet faced the top surface direction during cutting. In addition, the lateral pressure applied to the slitting cutting rotary blade was 1.0 kgf/㎠, and the depth of the rotary blade, which is the top surface based on the bottom surface, was 0.8 mm when cutting. In addition, the cut scrap was removed through a scrap winder.

(2) Shearing cutting process

After performing an automatic inspection to check the position value of the FSPM sheet that has undergone slitting cutting through a camera and perform dimensional correction, a shearing cutting process to cut the short side of the FSPM sheet was performed.

As schematically illustrated in FIGS. 3a and 3b, the shearing process is performed by cutting through the up-and-down movement of the upper blade. During the shearing cutting process, the gap between the lower blade and the upper blade is 5 μm, the blade angle (Slope) of the upper blade is 0.143°, and the lower blade has no angle (Slope). In addition, the material of the knife is a high-speed steel material for the upper blade and a carbide material for the lower blade. And, the cutting speed was 200 mm/Sec.

The SEM measurement image of the slit-cut cross-section (long side) of the manufactured encapsulating material for organic electronic devices is shown in Fig. 4.

Looking at the slit cut cross-section, a comb pattern is formed on the slit cut cross-section, which is believed to have been formed by the rotating blade.

And, the SEM measurement image of the shear-cut cross-section (bottom cut) of the manufactured organic electronic device packaging material is shown in Fig. 5a, and the SEM measurement images of the shear-cut bottom and top cut cross-sections are shown in Fig. 5b.

When manufacturing a sealing material by the SSC process of the present invention, when looking in the progress direction of the composite sheet (FSPM sheet), the front short side has a cut surface formed by the shearing cutting lower coating knife, and the rear short side has a cut surface formed by the shearing cutting upper coating knife. Therefore, looking at Fig. 5, unlike the slitting cut section, the shearing cut section does not have a comb-like pattern, and a line pattern is formed in the vertical direction. In addition, it can be confirmed that the cross-sectional shapes of the upper coating cut surface and the lower coating cut surface are different, and it can be confirmed that the lower coating cut surface of the short side has almost no off-set region, while the upper coating cut surface of the short side has a morphological difference in that the off-set region is somewhat generated.

Example 2: Manufacturing of organic electronic device encapsulation material through SSC process

An organic electronic device encapsulating material was manufactured through the SSC process in the same manner as in Example 1, but the rolled composite sheet of Preparation Example 3-2 was used instead of the rolled composite sheet of Preparation Example 3-1, and an organic electronic device encapsulating material was manufactured using an SSC automated machine.

Comparative Example 1

A composite sheet (FSPM sheet) identical to the rolled composite sheet of Preparation Example 3 was prepared.

Next, the composite sheet was first cut into the sealing resin layer and the release layer using a _CO2 laser cutting method.

Next, the metal layer of the composite sheet was cut a second time using a fiber laser to produce a sealing material manufactured using the laser cutting method.

At this time, the power of _CO2 laser cutting was about 140 W/ ^cm2 , and the power of fiber laser cutting was 170 W/ ^cm2 .

The SEM measurement photograph of the manufactured encapsulating material is shown in Fig. 6, and the conceptual diagram of the blunt formed at the end of the release layer, the residue existing in the release layer and the encapsulating resin layer, and the off-set region that can be confirmed from the SEM image is shown in Fig. 7.

Looking at Figures 4 and 5, unlike Example 1 in which there was no blunt edge and residue, and no or minimal off-set area, in Comparative Example 1 manufactured by laser cutting, it was confirmed that a blunt edge was formed on the upper surface of the release layer, residue was formed in the release layer and the encapsulating resin layer, and a large off-set area was formed. This is caused by thermal deformation of the release layer and the encapsulating resin layer due to heat generated during laser cutting.

Experimental Example 1: Taper Angle Measurement

(1) Measurement of taper angle of bag material manufactured by laser cutting method

After manufacturing a composite sheet having a thickness as shown in Table 1 below, a sealing material was manufactured by performing laser cutting using the same method as in Comparative Example 1. At this time, the composite sheet was manufactured by changing the thickness of the metal layer and the release layer, respectively.

And, the taper length is the difference in length between the end of the lowest surface of the metal layer of the cut surface and the end of the uppermost surface of the non-forming layer when viewed from the side direction of the cut surface to be measured for taper (the longest length of the off-set area).

In addition, the taper angle means the angle formed between the end of the lowest surface of the metal layer of the cut surface and the end of the uppermost surface of the heteromorphic layer of the cut surface when viewed from the side direction of the cut surface to be measured for taper, based on the lowest surface of the metal layer of the cut surface, and to help understanding, the taper length and taper angle expressions are schematically illustrated in Fig. 6 (Comparative Example 1) and Fig. 5b (top view shearing cut surface of Example 1).

In addition, 10 encapsulating materials manufactured by performing a laser process were randomly selected, and their average taper length and taper angle were measured, and the results are shown in Table 1 below.

Off-Set area according to
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
length 20㎛ 83.21 83.66 83.93 84.30 30㎛ 79.88 80.54 80.93 81.47 50㎛ 73.43 74.48 75.11 75.96 100㎛ 59.24 60.95 62.00 63.40 150㎛ 48.28 50.20 51.34 53.06 180㎛ 43.00 45.00 46.10 48.00 250㎛ 33.90 35.75 36.94 38.67 Average 111.4㎛ 60.13 61.51 62.34 63.55

Looking at Table 1 above, it can be confirmed that as the FSPM sheet thickness increases, the taper angle tends to increase, and as the taper length increases, the taper angle tends to decrease. In addition, it was confirmed that the encapsulating material using the laser cutting method had a taper angle in the range of 33.9˚ to 84.30˚ when the thickness of the encapsulating material was 168 to 200㎛.

(2) Measurement of taper angle of the sealing material of Example 1 manufactured by the SSC method

After manufacturing an FSPM sheet having a thickness as shown in Table 2 below, a sealing material was manufactured by performing slitting cutting and shearing cutting in the same manner as in Example 1. At this time, the FSPM sheet was manufactured by changing the thickness of the metal layer and the release layer, respectively. Then, the taper length and taper angle of the lower and upper cut surfaces of the shearing-cut short sides of the sealing material were measured in the same manner as in Table 1, and the results are shown in Table 2 below.

And, among the bag materials manufactured by performing the slitting cutting and shearing cutting processes as automatic processes, 10 were randomly selected, and the average taper length and taper angle of these were measured, and the results are shown in Tables 2 and 3 below.

According to sharing cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
length Short story
Hadoe cross section 10㎛ 86.59 86.82 86.96 87.14 20㎛ 83.21 83.66 83.93 84.29 30㎛ 79.88 80.54 80.93 81.47 40㎛ 76.60 77.47 77.99 78.69 50㎛ 73.43 74.48 75.11 75.96 Average 30㎛ 79.94 80.59 80.98 81.51 Short story
Cross section of the mountain -10㎛ 86.59 86.82 86.96 87.14 -20㎛ 83.21 83.66 83.93 84.29 -30㎛ 79.88 80.54 80.93 81.47 -40㎛ 76.60 77.47 77.99 78.69 -50㎛ 73.43 74.48 75.11 75.96 Average -30㎛ 79.94 80.59 80.98 81.51

According to slitting cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
length Long side
Hadoe cross section 0㎛ 90.00 90.00 90.00 90.00 10㎛ 86.59 86.82 86.96 87.14 20㎛ 83.21 83.66 83.93 84.29 Average 10㎛ 86.60 86.83 86.96 87.14

And, SEM measurement images of the side direction of the long side cross-section of the bag material manufactured in Example 1 and Comparative Example 1 are shown in FIG. 6 (Comparative Example 1) and FIG. 5 (Example 1), respectively.

Looking at Figure 6, in the case of Comparative Example 1 manufactured by laser cutting, it can be confirmed that burrs occur and an off-set region exists, whereas in the case of Example 1, not only is there no burr on the long side of the cut surface, it can be confirmed that there is no off-set region.

In addition, looking at Table 2 above, in the case of the encapsulating material manufactured by the SSC process, it can be confirmed that the taper length, which is the length of the offset region, of the cross-sections of the upper and lower coatings of the short sides is non-existent or very short, so that the taper angle is 73˚ to 90˚. Through this, it can be confirmed that the encapsulating material manufactured by the SSC process has a very low offset region, unlike the encapsulating material manufactured by the laser cutting process.

Also, looking at Fig. 7, the upper surface area of the long side cross-section is cut off, and the generated scrap is removed through a scrap winder, so that a bag material having a lower surface is created. The taper angle of the slitting cross-section is shown in Table 3 above. At this time, it was confirmed that the tolerance range was 83˚ to 90˚, which is a smaller taper angle than the short side.

(3) Measurement of taper angle of the sealing material of Example 2 manufactured by the SSC method

The taper angle was measured in the same manner as in (2) above, but the taper angle of the encapsulating material manufactured in Example 2 was measured instead of the encapsulating material of Example 1, and the results are shown in Table 4 below. In addition, 10 encapsulating materials manufactured by performing the slitting cutting and shearing cutting processes as automatic processes were randomly selected, and the average taper length and taper angle of these were measured, and the results are shown in Tables 4 to 5 below.

According to sharing cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
length Short story
Hadoe cross section 10㎛ 86.59 86.83 86.91 87.16 20㎛ 83.24 83.65 83.94 84.30 30㎛ 79.90 80.57 80.95 81.46 40㎛ 76.63 77.52 77.94 78.68 50㎛ 73.49 74.50 75.15 75.94 Average 30㎛ 79.97 80.61 80.98 81.51 Short story
Cross section of the mountain -10㎛ 86.66 86.86 86.97 87.12 -20㎛ 83.25 83.68 83.95 84.32 -30㎛ 79.94 80.55 80.96 81.50 -40㎛ 76.59 77.55 77.97 78.72 -50㎛ 73.46 74.49 75.18 75.95 Average -30㎛ 79.98 80.63 81.01 81.52

According to slitting cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 100㎛ 100㎛ 100㎛ Taper
length Long side
Hadoe cross section 0㎛ 90.00 90.00 90.00 90.00 10㎛ 86.62 86.85 86.94 87.24 20㎛ 83.26 83.69 83.90 84.34 Average 10㎛ 86.63 86.85 86.95 87.19

When examining the taper angle measurement results of Tables 4 and 5 above and the taper angle measurement results of Tables 2 and 3 above, they showed almost similar or identical results, and it was confirmed that when the sealing resin layer has the same thickness, the composition of the sealing sheet does not affect the taper angle.

(4) Example 1: Measurement of taper angle after removal of release sheet of bag material

After removing the release sheet of the sealing material manufactured and the taper angle measured in Example 1 above, the taper angle of the long and short side cut sections of the sealing material (metal sheet-sealing sheet) was measured, and the results are shown in Tables 6 and 7 below.

According to sharing cutting
Change in taper angle (˚) Encapsulation thickness (without release layer) 130㎛ 150㎛ Envelope sheet thickness 50㎛ 50㎛ Metal sheet thickness 80㎛ 100㎛ Taper
length Short story
Hadoe cross section 10㎛ 85.60 86.19 20㎛ 81.25 82.40 30㎛ 77.01 78.69 40㎛ 72.90 75.07 50㎛ 68.96 71.57 Average 30㎛ 77.67 78.96 Short story
Cross section of the mountain -10㎛ 85.60 86.19 -20㎛ 81.25 82.40 -30㎛ 77.01 78.69 -40㎛ 72.90 75.07 -50㎛ 68.96 71.57 Average -30㎛ 77.14 78.78

According to slitting cutting
Change in taper angle (˚) Encapsulation thickness (without the release layer) 130㎛ 150㎛ Envelope sheet thickness 50㎛ 50㎛ Metal sheet thickness 80㎛ 100㎛ Taper
length Long side
Hadoe cross section 0㎛ 90.00 90.00 10㎛ 85.60 86.19 20㎛ 81.25 82.40 Average 10㎛ 85.62 86.20

Comparing the taper angles of Tables 6 and 7 above with those of Tables 2 to 5 above, it can be confirmed that the taper angle tends to decrease somewhat due to the removal of the heteromorphic sheet.

In addition, it was confirmed that the taper angle of the sharing cutting surface was 67˚ to 90˚, and the taper angle of the slitting cutting surface was 80˚ to 90˚.

Experimental Example 2: Measurement of the initial peel strength of the heteromorphic layer

Composite sheets (FSPM sheets) manufactured in Example 1 and Comparative Example 1 were prepared respectively.

Next, the initial peel strength of the liner film at each of the four corners of the FSPM sheets of Example 1 and Comparative Example 1 was measured through a probe tack test using UTM.

The measurement method was a jig lowering speed and rising speed of 1.0 mm/sec, a dwell force of 800 gf, and a dwell time of 10 seconds.

The equipment used in the experiment and the photographs of the experiment are shown in Figs. 8A and 8B, and Fig. 8C shows a schematic diagram of a ball-shaped jig approaching a sheet edge, maintaining contact, and separating a release layer. In addition, the results of measuring the initial peeling force of Example 1 and Comparative Example 1 are shown in Figs. 9A and B, and Fig. 12C shows the average value of the initial peeling force (gf). In Figs. 9A and 9B, L/C-1 to L/C-5 and SSC-1 to SSC-5 represent encapsulating materials manufactured in Example 1 and/or Comparative Example 1, respectively, for which the initial peeling force was measured.

As shown in FIG. 9, in the case of the encapsulating material manufactured by the laser cutting processing method (Comparative Example 1), the initial peeling force for the encapsulating resin layer of the release layer was 500 to 500 gf, whereas in the case of the encapsulating material manufactured by the SSC processing method (Example 1), the initial peeling force for the encapsulating resin layer of the release layer was 300 to 350 gf, showing a significantly lower initial peeling force. This difference is because in the case of Comparative Example 1, thermal deformation occurred in the release layer and/or the encapsulating resin layer during laser cutting, which formed residue on the cut surfaces of the release layer and the encapsulating resin layer, which acted as a factor in increasing the initial peeling force.

Comparative Example 2: Slitting Cutting - Manufacturing of Slitting Cut Bag Material

The FSPM sheet having the three-layer structure (metal layer (80 μm) - sealing resin layer (50 μm) - release layer (38 μm)) of the above Preparation Example 3-1 was slit-cut along the long side (length direction) of the FSPM sheet under the same conditions and method as Example 1, and then the short side was also slit-cut under the same conditions and method, thereby manufacturing a sealing material in which both the long side and the short side were slit-cut.

Compared with Example 1, the manufactured bag had poor tension, had a part where a bend occurred in the initial cut portion, and, compared with Example 1, the production speed was slow.

Comparative Example 3: Sharing Cutting - Manufacturing of Sharing Cut Bag Material

The FSPM sheet having the three-layer structure (metal layer (80 μm) - sealing resin layer (50 μm) - release layer (38 μm)) of the above Preparation Example 3-1 was shear-cut along the long side (length direction) of the FSPM sheet under the same conditions and method as Example 1, and then the short side was also slit-cut under the same conditions and method to manufacture a sealing material in which both the long side and the short side were shear-cut.

Compared to Example 1, the manufactured bag material had a problem in that the process for cutting the long side was complicated, which slowed down the production speed, making it practically difficult to apply shear cutting and shear cutting as an automated process.

Example 3

(1) In the same manner as in Example 1, the rolled composite sheet (FSPM sheet) of Preparation Example 3-1 was used to manufacture an organic electronic device encapsulating material using an SSC (Slitting & Shearing Cutting) automated machine. However, as shown in Table 8 below, the lateral pressure and the insertion depth of the top knife were varied during the slitting cutting to perform slitting cutting on the long side of the composite sheet, and the SEM measurement photographs of the cross-section of the slitting-cut long side are shown in FIGS. 10a to 10f. The alphabet symbols in Table 5 below indicate the optical microscope measurement images of FIG. 10. At this time, the lower layer in the image of FIG. 10 is a metal layer.

division Knife pressure (kgf/㎠) 0.5 1.0 2.0 2.5 2.7 highway
knife
insertion
depth
(mm) 0.3 A B C D E 1.0 F G H I J 1.5 K L M N O 2.0 P Q R S T 2.2 U V W X Y

Looking at FIGS. 10a to 10f, it can be seen that when the insertion depth of the top knife exceeds 2.0 mm and is 2.2 mm, the pressure-sensitive adhesive layer collapses and the distinction between each layer is unclear, resulting in poor cutting quality. In addition, it can be seen that when the lateral pressure applied to the top knife exceeds 2.5 kgf and is 2.7 kgf, excessive taper occurs and there is a problem of poor quality due to poor uniformity.

(2) Taper angle according to the knife conditions

The taper angle of the slit-cut section for the lower cut surface was measured according to the upper cut knife insertion depth and lateral pressure conditions of Table 8 above, and the results are shown in Table 9 below. The alphabets in Table 9 below indicate the upper cut knife conditions of Table 8.

According to slitting cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ A 88.98 89.05 89.39 89.42 B 88.64 88.73 88.78 88.85 C 88.30 88.41 88.78 88.85 D 84.90 85.24 85.74 85.43 E 79.88 79.00 78.58 78.14 F 88.64 89.05 88.78 88.85 G 88.64 88.41 88.48 88.85 H 88.30 88.41 88.17 88.85 I 84.90 84.92 85.44 85.43 J 78.56 78.08 77.99 77.59 K 88.64 89.05 88.78 88.85 L 88.64 88.41 88.48 88.85 M 88.30 88.41 88.17 88.85 N 84.90 84.92 85.44 85.43 O 77.58 77.77 77.70 76.78 P 88.98 89.05 88.78 88.85 Q 88.64 88.41 88.48 88.85 R 88.30 88.41 88.17 88.85 S 84.90 84.92 85.44 85.43 T 82.87 83.03 83.03 82.87 U 82.54 82.72 82.43 82.03 V 81.87 81.78 81.23 80.35 W 81.53 80.85 80.64 80.07 X 79.88 78.38 76.54 76.23 Y 77.25 76.86 75.96 75.96

Looking at Table 9 above, it can be confirmed that when the insertion depth of the top knife exceeds 2.0 mm, that is, 2.2 mm, or when the lateral pressure applied to the top knife exceeds 2.5 kgf, the taper length (off-set area) increases and the taper angle tends to decrease.

Example 4

(1) In the same manner as in Example 1, the rolled composite sheet (FSPM sheet) of Preparation Example 3-1 was used to manufacture an organic electronic device encapsulating material using an SSC (Slitting & Shearing Cutting) automated machine. However, the gaps between the upper and lower knives were set to 5 ㎛, 12.5 ㎛, 25 ㎛, and 50 ㎛ when performing shearing cutting on the short side, and the optical microscope measurement image of the cut surface by the lower knife in the shearing cutting is shown in Fig. 11a, and the optical microscope measurement image for whether or not PET was lifted of the composite sheet is shown in Fig. 11b. The Avg. (Average) value in Fig. 14b means the average value of the amount of PET lifting that occurs in the inward direction from the end of the release sheet, and the occurrence of the lifting phenomenon was checked under a microscope on the cut FSPM sheet on the release layer. Looking at Figure 11b, it was confirmed that as the gap distance between the upper and lower knives increased, the area where the lifting phenomenon of the heteromorphic sheet occurred tended to increase (see Table 10).

Sharing Cutting Liner PET Lifting Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 50㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Up and down
knife
interval 0.5㎛ 0.2mm 0.3mm 0.2mm 0.3mm 2 ㎛ 0.4mm 0.5mm 0.5mm 0.7mm 5 ㎛ 0.7mm 1.0mm 1.0mm 1.5mm 10 ㎛ 1.2mm 1.7mm 1.2mm 2.0mm 25 ㎛ 2.0mm 3.0mm 2.5mm 3.5mm 50 ㎛ 3.5mm 4.5mm 3.0mm 5.0mm

(3) When cutting with a shear, the taper angle of the cutting surface of the shear cutting according to the blade angle of the shear knife

In the same manner as in Example 1, the rolled composite sheet (FSPM sheet) of Preparation Example 3-1 was used to manufacture an organic electronic device encapsulating material using an SSC (Slitting & Shearing Cutting) automated machine. However, when performing shearing cutting on the short side, the blade angle of the shearing knife was changed to perform shearing cutting. The results of measuring the taper angle of the short side shearing-cut section are shown in Table 11 below.

According to sharing cutting
Change in taper angle (˚) Thickness of bag material 168㎛ 180㎛ 188㎛ 200㎛ Thickness of the heteromorphic sheet 38㎛ 38㎛ 38㎛ 50㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 92㎛ 100㎛ 100㎛ highway
knife
Blade angle 0.135* 76.61 76.87 76.83 77.05 0.143* 82.54 82.72 82.73 82.88 0.215* 84.22 84.29 83.93 84.00 0.285* 85.58 85.55 85.44 85.43 0.316* 75.00 75.07 74.54 75.14

(4) When cutting with a shear, the taper angle of the cutting surface of the shear cutting according to the land value of the shear knife

1) In the same manner as in Example 1, an organic electronic device encapsulating material was manufactured using an SSC (Slitting & Shearing Cutting) automated machine on the rolled composite sheet (FSPM sheet) of Preparation Example 3-1. However, when performing shearing cutting on the short side, the land value of the top knife was changed, and after performing shearing cutting, the taper angle of the short side top cut surface after shearing cutting was measured. The results are shown in Table 12 below. At this time, the land value of the bottom knife was fixed to 0.50 mm.

2) Measuring the durability of the sharing knife

The shearing knife applied in the actual cutting process cuts composite sheets containing high-strength metal sheets tens to millions of times, so the long-term durability of the knife is very important.

Since the durability of a shearing knife cannot be measured by actually cutting it tens to millions of times, the durability of the shearing knife was measured by replacing the composite sheet of the present invention with a sheet having high mechanical strength as the cutting target.

Specifically, a sheet of SUS431, a martensitic stainless steel having a hardness 2.5 to 3 times higher than that of the metal sheet of Preparation Example 2 (thickness 80 ㎛, Vickers hardness 200 HV) (100 ㎛, Brinell hardness approximately 400 to 400 Hb), was prepared, and then shearing cutting was performed on the sheet using a shearing cutter configured with different surface knives having land values as shown in Table 12 below in the same manner as in (3) above.

In addition, durability was evaluated by shearing the SUS431 sheet 10,000 times and examining whether micro cracks occurred on the blade surface of the sandpaper knife using a scanning electron microscope.

According to sharing cutting
Change in taper angle (˚) Thickness of bag material durability
measurement 168㎛ 180㎛ 200㎛ 188㎛ Thickness of the heteromorphic sheet 38㎛ 38㎛ 50㎛ 38㎛ Envelope sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 92㎛ 100㎛ 100㎛ highway
knife
Land value 0.08mm 88.30 86.57 87.77 87.56 Crack occurrence 0.12mm 86.59 85.14 85.87 85.44 Crack X 0.80mm 85.91 85.55 85.14 85.28 Crack X 1.20mm 84.22 82.88 83.97 83.63 Crack X 1.80mm 77.26 77.05 76.87 76.83 Crack X 2.20mm 71.26 72.78 71.85 72.02 Crack X

Looking at Table 12 above, it was confirmed that as the land value of the cutting knife increases, the taper angle decreases. In the case of a cutting knife with a land value of 2.2 mm, which exceeds 2.0 mm, there was a problem that the taper angle was less than 73˚, and in the case of a cutting knife with a land value of 0.08 mm, which is less than 0.10 mm, there was a high taper angle. However, in the case of a cutting knife with a land value of 0.08 mm, although the cutting power is excellent, it was confirmed that there is a problem that the blade durability is weak, making it unsuitable for use as a shearing cutting knife for composite sheets including metal sheets.

Through the above examples and experimental examples, it was confirmed that the present invention can provide an encapsulating material for organic electronic devices, which solves the problems of encapsulating materials manufactured by conventional laser methods, such as the occurrence of blunt edges on the cut surface of the release layer, the occurrence of residues and burrs on the cut surface, and the occurrence of a large amount of off-set areas.

Claims (11)

Step 1: preparing a composite sheet including a metal layer, a sealing resin layer, and a release layer;
Step 2: performing slitting cutting on both long sides of the composite sheet; and
A process including three steps of performing shearing cutting in the short-side direction on a composite sheet that has undergone slitting cutting is performed.
The above steps 2 and 3 are continuous processes,
The above sharing cutting is performed using a sharing cutting machine equipped with an upper knife and a lower knife.
The land value of the above-mentioned knife is characterized by being 0.10 to 2.0 mm. A method for manufacturing a sealing material for organic electronic devices.
In the first paragraph, the slitting cutting is performed by a slitting cutting machine in which the upper knife is a circular knife and the lower knife has an insertion portion formed into which the upper knife is inserted.
A method for manufacturing a sealing material for an organic electronic device, characterized in that the lateral pressure applied to a slitting knife during cutting is 0.5 to 2.5 kgf/cm2.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in the first paragraph, the upper knife and the lower knife each independently have a land value of 0.10 to 0.30 mm during the slitting cutting.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in the first paragraph, the shearing cutting is performed using a shearing cutting machine equipped with the upper knife having a blade angle (slope) of 0.140° to 0.300° and the lower knife having a blade angle of 0.005° or less.
delete A method for manufacturing a sealing material for an organic electronic device, characterized in that in claim 4, the gap between the upper knife and the lower knife during sharing cutting is 0.5 ㎛ to 50 ㎛.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in the first paragraph, the cutting speed during the sharing cutting is 150 to 300 mm/sec.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in the first paragraph, after the slitting cutting in the second step, a process of continuously wet cleaning the slitting-cut long side portion of the composite sheet is further performed.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in the first paragraph, the third step further comprises performing a dry surface cleaning process on the composite sheet that has been continuously shear-cut after shear-cutting.
A method for manufacturing a sealing material for an organic electronic device, characterized in that in claim 1, the long-side cut surface of the slitting-cut composite sheet and the short-side cut surface of the shearing-cut composite sheet have a taper angle satisfying the following equation 1;
[Equation 1]
Average taper angle of short-side cross-section ≤ Average taper angle of long-side cross-section
In Equation 1, the taper angle refers to the angle formed between the lowermost surface end of the lowermost layer of the cut surface and the uppermost surface end of the uppermost layer of the cut surface when viewed from the side direction of the cut surface to be measured for taper.
In the first paragraph, the short-side cut surface of the shared-cut composite sheet includes a first short-side cut surface and a second short-side cut surface,
In the case of a composite sheet including a metal layer, a sealing resin layer, and a release layer, the first short-side cut surface and the second short-side cut surface have a taper angle of 73˚ to 90˚.
A method for manufacturing a sealing material for an organic electronic device, wherein, in the case of a composite sheet including a metal layer and a sealing resin layer from which a heterogeneous layer has been removed, the first short-side cut surface and the second short-side cut surface have a taper angle of 67˚ to 90˚.