KR102712115B1 - Organic-inorganic hybrid layered adhesive Tape for Wafer Level Back Side and manufacturing method thereof - Google Patents

Abstract

A backside adhesive tape for wafer level according to one embodiment includes a plate-shaped substrate, an organic/inorganic black layer laminated on one side of the plate-shaped substrate to block ultraviolet rays and facilitate visibility of laser marking, a hot melt adhesive layer laminated on the other side of the plate-shaped substrate on which the organic/inorganic black layer is laminated, and a silicone low-adhesion carrier layer laminated on the organic/inorganic black layer to enable heat bonding.

Description

{Organic-inorganic hybrid layered adhesive tape for wafer level back side and manufacturing method thereof}

The disclosed embodiments relate to a backside inorganic layer adhesive tape for wafer level and a method for manufacturing the same, and more specifically, to a backside adhesive tape for wafer level which enables laser marking when applied to the wafer level, can withstand a dicing process, and can protect the back surface where the chip is exposed, and a method for manufacturing the same.

Wafer Level Package, or WLCSP (Wafer Level Chip Scale Package, hereinafter referred to as WLCSP), is a technology that performs the packaging process and testing all at once in the wafer state, and then cuts the chips to create a finished product, unlike the existing method of cutting chips one by one after wafer processing and packaging them. It is a chip-size packaging method that can implement the smallest size. WLCSP not only enables the implementation of a package size identical to the chip size, but also has excellent electrical characteristics and high price competitiveness, so demand in the mobile market is increasing further, and the applicable product group is also gradually expanding.

The backside coating tape used in the WLCSP process is one of them. The tape according to the prior art is a tape used in a process that replaces the molding process of wrapping a substrate on which chips are mounted with EMC materials during the WLCSP process.

To explain the existing process in more detail, the existing process for manufacturing WLCSP is to (1) form a circuit on the surface of the wafer, (2) grind the back surface of the wafer circuit surface to the required thickness through a back grinding process, (3) fix the wafer to a ring frame to which a dicing tape is attached, (4) cut/separate the wafer for the dicing saw process and place a semiconductor chip on it, (5) pick up the separated semiconductor chip and attach (mount) it on the substrate, (6) cover (PKG) it through a molding process using an encapsulating resin, i.e. EMC, to protect the open portion of the chip, (7) package saw the covered chip, and (8) perform a post-process such as laser marking. Here, the back grinding process of (2) above usually mechanically grinds the back surface of the wafer, so fine scratches occur on the back surface. These scratches cause cracks in the dicing saw process of (4) or the package saw process of (7), which requires a chemical etching process to remove the fine scratches, which increases equipment costs and equipment operating costs. Therefore, it has become necessary to develop a technology to replace mold contamination caused by EMC and a thinner and more uniform molding process.

In order to overcome such problems, the prior art provides a chip protective film forming sheet having a protective film forming layer composed of a thermosetting component and a binder polymer component. Compared with the molding process using EMC, (2) after backgrinding, a protective film forming sheet is attached to the back surface of the circuit and then heated to form a hardened protective film, and after laser marking on the surface of the laminated protective film, processes (3) to (5) described above are performed, and the molding process of (6) is not necessary, so it has the advantage of being simpler and less costly than the technology using EMC. However, the tape according to the prior art may cause problems such as cracks or chipping depending on the state of the resin being hardened during the dicing process, and there was a problem that the edge part of the hardened resin was broken in the reflow process and expanded into a crack, so that the entire surface of the wafer was contaminated with hardened resin powder.

Korean Patent No. 10-0681665 Korean Patent No. 10-1152452 Korean Patent Registration No. 10-1074571

The present embodiments introduce organic and inorganic layers to solve the above marking problems. Since the introduction of an organic layer involves a lot of carbonization processes and thus causes a lot of contamination, and inorganic resins have the disadvantage of causing cracks in the ROLL process, it is necessary to introduce organic and inorganic layers to reduce contamination during direct marking or stealth marking as well as secure marking depth and width.

In addition, direct marking marks directly on the surface of the base film or resin layer, and the existing wafer backside tape technology has a disadvantage in that it is difficult to secure sufficient laser processing depth due to networking of bisphenol (BISPHENOL) and epoxy, etc., when marking on epoxy. In addition, there is a problem that marking of a wafer backside tape with a dicing tape attached, which is a stealth marking, has worse performance than direct marking due to the condition of high energy absorption, and this needs to be solved.

The improvement of laser markability according to the present embodiments is achieved by increasing the composition ratio of crystalline polymers capable of absorbing laser light to increase the scattering absorption of the laser. In order to adjust the scattering and absorption of laser light, an organic/inorganic complex is formed on the functional groups of Silsesquioxane (POSS), TITANIUM SESQOIOXIDE, and ZIRCONIUM SESQUIOXANE to increase the crystallinity and roll coating properties, thereby providing a wafer backside tape with high laser markability.

In order to achieve the above technical problem, a wafer-level backside adhesive tape according to one embodiment comprises: a plate-shaped substrate; an organic/inorganic black layer laminated on one side of the plate-shaped substrate to block ultraviolet rays and facilitate visibility of laser marking; a hot melt adhesive layer laminated on the plate-shaped substrate on the other side of the one side on which the organic/inorganic black layer is laminated; and a silicone low-adhesion carrier layer laminated on the organic/inorganic black layer to enable heat bonding.

In one embodiment, the organic/inorganic black layer can have a thickness of 2 to 30 μm.

In one embodiment, the organic or inorganic black layer may include a pigment comprised of carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, or at least one mixture selected from these.

In one embodiment, the organic/inorganic black layer may include a pigment, an organic/inorganic composite binder resin, an organic solvent, and an additive.

In one embodiment, the backside adhesive tape for wafer level may include 3 to 25 wt% of the pigment, 3 to 30 wt% of the organic/inorganic composite binder resin, 45 to 80 wt% of the organic solvent, and 0.1 to 5 wt% of the additive, based on 100 wt% of the organic/inorganic black layer.

In one embodiment, the organic-inorganic composite binder resin may include an organic resin including a vinyl resin, an epoxy resin, an alkyd resin, an amide resin, an acrylic resin, acetyl cellulose, chlorinated polypropylene, an acrylic or urethane, and an organic-inorganic composite including siloxane, silsesquioxane, titanium, zirconium, a silicone polymer, or a mixture of at least one selected from these.

In one embodiment, the silicone low-adhesion carrier layer can have a thickness of 3 to 30 μm.

In one embodiment, the silicone low-adhesion carrier layer may include a hot melt resin, such as a polyamide-based resin, a polyimide-based resin, a polyester-based resin, an EVA-based resin, a polyacrylic resin, a polyurethane-based resin, or at least one mixture thereof.

In one embodiment, the silicone low-adhesion carrier layer can have an adhesion strength of 2 to 30 gf/25 mm at room temperature.

According to another embodiment, a method for manufacturing a backside adhesive tape for wafer level comprises the steps of: providing a plate-shaped substrate; providing an organic/inorganic black layer laminated on one side of the plate-shaped substrate to block ultraviolet rays and facilitate visibility of laser marking; providing a hot melt adhesive layer laminated on the plate-shaped substrate on the other side of the one side on which the organic/inorganic black layer is laminated; and providing a silicone low-adhesion carrier layer laminated on the organic/inorganic black layer to enable heat bonding.

A backside adhesive tape for wafer level according to an embodiment can be provided as a backside adhesive tape for wafer level including an organic/inorganic composite layer that can replace a conventional EMC (EPOXY MOLDING COMPOUND) and is attached to the backside of a wafer on which a pattern is laminated or a wafer on which electrodes such as bumps are laminated, thereby protecting the backside and enabling direct or stealth laser marking.

Figure 1 is a cross-sectional view showing a backside adhesive tape for wafer level according to a temporary example.
Figure 2 is a structural diagram of an organic-inorganic composite resin according to one embodiment.
Figure 3 is a structural diagram of a urethane hybrid according to one embodiment.
Figure 4 is a structural diagram of an acrylic hybrid resin according to one embodiment.
FIGS. 5A and 5B are depth comparison drawings of stealth laser marking performance according to one embodiment and stealth marking performance of a wafer backside tape according to the prior art.
FIGS. 6 and 7 are comparative drawings comparing the stealth marking performance of an inorganic coating layer according to one embodiment and an organic resin layer according to the prior art.

Hereinafter, the present invention will be described in detail with reference to the drawings so that those skilled in the art can easily practice the present invention. In describing the present invention, if it is judged that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

Also, in this application, the terms "include" or "have" etc. are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood as not excluding in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof. In this application, a singular expression may include a plural expression unless the context clearly indicates otherwise.

Hereinafter, a backside adhesive tape for wafer level and a method for manufacturing the same according to the present embodiments will be described in detail. However, the following embodiments are only intended to specifically illustrate the present invention and do not limit the scope of the present invention. That is, simple modifications or changes of the present invention can be easily implemented by a person skilled in the art to which the present invention belongs, and all such modifications or changes can be considered to be included in the scope of the present invention.

FIG. 1 is a cross-sectional view showing a backside adhesive tape for wafer level according to one embodiment.

As illustrated in FIG. 1, a backside adhesive tape for wafer level includes a plate-shaped substrate (2), an organic/inorganic black layer (4) laminated on one side of the substrate (2) to facilitate visibility of laser marking, a hot melt adhesive layer (8) laminated on the other side of the substrate (2) on which the black layer (4) is laminated, and a silicone low-adhesion carrier layer (10) laminated on the organic/inorganic black layer (4) to enable heat bonding.

Since the substrate (2) according to the embodiment is attached to the device by heating during wafer processing, any material that has heat resistance that can withstand heating may be used. Preferably, a heat-resistant material that can withstand a temperature range of 90 to 180°C, for example, a material including at least one mixture selected from PP (polypropylene), PET (polyethylene terephthalate), PI (polyimide), PEN (polyethylene naphthalene), or these, for example, a film, may be used. More preferably, a PI film with good heat resistance and processability may be used.

According to the present embodiment, the organic and inorganic black layer (4) is laminated on one side of the substrate (2) to facilitate the visibility of laser marking and to improve the existing marking performance.

The preferred organic/inorganic black layer (4) is usually applied with a thickness of 1 to 1.5 ㎛ per printing when applying a black product to a transparent fabric, and considering the strength of the fabric and the permeability of the product, it is recommended to have a thickness of 2 to 30 ㎛.

For example, the organic/inorganic composite black layer (4) according to the present embodiment can be manufactured by drying and including a pigment, an organic/inorganic composite binder resin, an organic solvent, and/or an additive.

A desirable organic-inorganic composite black layer (4) contains 3 to 25 wt% of pigment, 3 to 30 wt% of organic-inorganic composite binder resin, 45 to 80 wt% of organic solvent, and 0.1 to 5 wt% of additives based on 100 wt% of the total organic-inorganic black layer, and is obtained by drying the same.

Here, the organic/inorganic black layer (4) is laminated on one side of the substrate (2) using a microgravure, comma, or slot die process. Any pigment commonly used in the art may be used as the pigment constituting the organic/inorganic black layer (4) according to the present embodiment, but it is preferable to use an organic or inorganic pigment and/or dye, and more preferably, considering electromagnetic wave or infrared shielding properties, laser marking properties, etc., it is preferable to use a black pigment.

Preferred black pigments include, but are not limited to, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, or at least one mixture selected from these, and from the viewpoint of increasing the reliability of semiconductor devices, it is more preferable to use carbon black. It is preferable to use a carbon black having a particle size of 1 to 500 nm.

The preferred amount of pigment to be used is 1 to 25 wt% based on 100 wt% of the total black layer (4).

Here, if the amount of the pigment used is less than 1 wt%, the color expressiveness deteriorates, making it difficult to properly express black, which is not desirable because the electromagnetic wave or infrared shielding properties and laser marking properties are poor. If the amount used exceeds 25 wt%, the manufacturing cost increases, reducing economic feasibility, and the printability and storage stability may deteriorate due to an increase in viscosity.

The binder resin constituting the above black layer (4) colors the pigment onto the printed material, thereby increasing the adhesion between the pigment and the printed material, and improving the quality of printing, for example, gravure printing, as well as complementing the shortcomings of existing laser marking.

It is preferable to use an organic resin such as a vinyl resin, epoxy resin, alkyd resin, amide resin, acrylic resin, acetyl cellulose, chlorinated polypropylene, acrylic, urethane, etc., and an inorganic composite material complexed with siloxane, silsesquioxane, titanium, zirconium, silicone polymer, etc., or a mixture of at least one selected from these, but it is more preferable to use an acrylic or urethane inorganic resin that has excellent compatibility with black pigment and excellent adhesion to various printed materials.

The preferred amount of binder resin to be used is 3 to 45 wt% based on 100 wt% of the total inorganic black layer (4).

The embodiments are very effective not only for direct marking of tape but also for stealth marking in a state where a dicing tape is attached, and this can improve marking properties including marking depth and width that could not be implemented in the prior art.

Here, if the amount of the binder resin used is less than 3 wt%, pigment precipitation may occur, which is undesirable as the printing performance deteriorates, resulting in a decrease in color expressivity and adhesion to the substrate. If the content exceeds 45 wt%, the manufacturing cost increases, which reduces economic feasibility. Additionally, due to the increase in the viscosity of the composition, there is a high possibility of contamination of the device during gravure printing, and problems such as a decrease in printability may occur.

The organic solvent constituting the organic/inorganic black layer (4) according to the present embodiment should be selected in consideration of compatibility with the pigment and solubility with the binder resin, and preferred organic solvents include aromatic hydrocarbons, ketones, alcohols, etc.

As the above aromatic hydrocarbon, it is preferable to use benzene, toluene, xylene, methyl ethyl ketone MIBK or at least one mixture selected from these, and as the alcohol, it is preferable to use ethanol, methanol, isopropyl alcohol or at least one mixture selected from these, and the above-mentioned substances can be used alone or in mixture with each other.

Meanwhile, as an organic solvent according to the present embodiment, an aromatic hydrocarbon basically serves to dissolve pigments, for example, black pigments, or organic/inorganic binder resins, and an alcohol improves drying properties after printing.

Accordingly, the organic solvent according to the present embodiment can be a mixture of 35 to 70 wt% of methyl ethyl ketone, an aromatic hydrocarbon, and 30 to 65 wt% of isopropyl alcohol.

The preferred amount of organic solvent to be used is 45 to 85 wt% based on 100 wt% of the total organic/inorganic black layer (4).

Any additives that are common in the art may be used as the additives constituting the organic/inorganic black layer (4) according to the present embodiment, but preferably, a dispersant, a slip agent, and an adhesion promoter may be used alone or in combination.

Here, it is preferable to use a dispersant selected from the group consisting of organic acids, aromatic oils, aliphatic oils, animal or vegetable oils, castor oil, cottonseed oil, mineral oil, and mixtures thereof, and it is preferable to use a slip agent under the product name BYK-333, and the adhesion promoter may use hydroxyethyl acryloyl phosphate, hydroxyethyl methacrylate phosphate, or at least one mixture selected from these, or a product name BYK-4500.

The preferred amount of additive to be used is 0.1 to 5 wt% based on 100 wt% of the total inorganic black layer (4).

If the amount of the above additive is less than 0.1 wt%, the wetting property of the pigment and binder resin is reduced, which reduces the physical properties of the composition, and as a result, color expression ability and storage stability may be reduced, and blocking, in which the printed surface is partially washed out during printing, may occur, and the adhesion or slipperiness between the pigment and the printed material may be reduced, which is not preferable.

In addition, if the amount of the additive used exceeds 5 wt%, the manufacturing cost increases, the smoothness of the printed film increases excessively, which may cause poor adhesion to the printed body, and the compatibility between the additive and the binder resin may deteriorate, which is not preferable.

The hot melt adhesive layer (8) according to the present embodiment is formed by laminating the other side of the substrate (2) on which the organic/inorganic black layer (4) is laminated.

The thickness of the hot melt adhesive layer (8) according to the present embodiment is preferably 3 to 30 ㎛.

If the above thickness is less than 3㎛, the adhesion may be reduced due to lifting when attaching the wafer, and the adherend and the product may become separated when heated.

In addition, if the thickness is 30㎛ or more, the degree of attachment to the wafer is good, but burrs and/or cracks may occur during the sawing process, and the adhesive component of the adhesive layer may contaminate the sawing blade, which may have a negative effect on the process.

It is preferable that the hot melt adhesive layer (8) according to the present embodiment is laminated by coating on one side of the substrate (2) using a T-die, slot die, or coma coating method.

In a specific embodiment, the hot melt adhesive layer (8) according to the present embodiment may include a base resin, a tackifying resin, a solvent, and/or a matting agent, and the composition ratio thereof is preferably 10 to 20 wt% of the base resin, 10 to 20 wt% of the tackifying resin, 64 to 78 wt% of the solvent, and/or 2 to 10 wt% of the matting agent based on 100 wt% of the total hot melt adhesive layer (8).

The physical properties of the adhesive layer, such as adhesive strength, cohesion, wetting, and/or durability, can be controlled depending on the type, molecular weight, and/or mixing ratio of the base resin.

It is preferable to use a polyamide-based resin, a polyester-based resin, an EVA-based resin, an acrylic, a urethane hybrid-based resin, or at least one mixture selected from these as the base resin, but it is recommended to use an acrylic or urethane hybrid resin that has excellent adhesiveness and compatibility, adhesiveness even at low temperatures (60°C), and good moisture resistance, chemical resistance, and durability, and the amount used is preferably 10 to 40 wt% based on 100 wt% of the total hot melt adhesive layer (8).

The tackifying resin according to the present embodiment is used as an auxiliary agent to improve adhesion when the base resin alone does not exhibit sufficient adhesive performance. Any conventional tackifying resin having this purpose in the art may be used. However, it is preferable to use a hydride resin of a petroleum resin, a hydride resin of a terpene resin, a natural resin, a modified resin, or a derivative of a natural resin or a modified resin, and the resin may be used alone or in combination. However, it is preferable to use a hydride resin of a petroleum resin, and the amount used may be 10 to 40 wt% based on 100 wt% of the total hot melt adhesive layer (8).

The solvent according to the present embodiment is used to dissolve the base resin and the adhesive-providing resin in a liquid state. Any solvent conventional in the art for this purpose may be used. However, toluene, DMF (N,N-Dimethylformamide), MEK (Methyl ethyl ketone), or a mixture thereof is preferably used. More preferably, DMF and MEK can be mixed in a weight ratio of 1:1.

The preferred amount of solvent used can be changed according to the user's choice, but is preferably 60 to 80 wt% based on 100 wt% of the entire hot melt adhesive layer (8).

The matting agent according to the present embodiment prevents the base resin and the adhesive-providing resin from settling when the hot melt adhesive layer (8) is in a liquid state, and prevents the hot melt adhesive layer (8) from sticking to the back surface of the substrate (2), for example, a substrate (2) made of a PI film, when rolled up during application and drying (anti-blocking). Any matting agent conventional in the art having this purpose may be used, but it is preferably an aerosol or a polyacrylate copolymer, and the amount used may be 2 to 10 wt% based on 100 wt% of the total hot melt adhesive layer (8).

The silicone low-adhesion carrier layer (10) according to the present embodiment is laminated on the organic/inorganic black layer (4) to enable thermal adhesion. Any silicone low-adhesion carrier layer (10) conventional in the art with this purpose may be used.

In particular, the silicone low-adhesion carrier layer (10) according to the present embodiment is configured in a form in which a silicone layer (not shown) made of a silicone-based adhesive is coated on a carrier film (12), preferably a PI carrier film (12) having a thickness of 2 to 7 ㎛, preferably about 5 ㎛, on one side facing the inorganic black layer (4).

Here, the thickness of the silicon layer (14) constituting the silicon low-adhesion carrier layer (10) can be formed to a thickness of 3 to 30 ㎛ depending on the user's choice, but considering the adhesiveness and thickness dependency, it is useful in terms of peeling strength and bonding strength to form it to a thickness of about 10 ㎛.

The silicone low-adhesion carrier layer (10) according to the present embodiment should maintain an adhesive strength of about 2 to 100 gf/25 mm and leave no residue on the adherend at a temperature of 100 to 180°C, preferably 110 to 150°C.

Therefore, the adhesive strength of the silicone low-adhesion carrier layer (10) according to the present embodiment is suitably 2 to 100 gf/25 mm at room temperature and after oven curing, and most preferably 2 to 30 gf/25 mm.

Meanwhile, the silicon layer (14) constituting the silicon low-adhesion carrier layer (10) according to the present embodiment includes an adhesive.

In a specific aspect, the adhesive tape according to the present embodiment can further include a liner (16) laminated on the other side of the hot melt adhesive layer (8), preferably the hot melt adhesive layer (8) laminated on one side of the substrate (2), thereby preventing the adhesive tape from being damaged during transport, use, and/or storage, and facilitating use.

A preferred liner (16) may use PET film.

The wafer-level backside adhesive tape according to the present embodiment having such a configuration is manufactured by fixing a silicone low-adhesion carrier layer (10) composed of a PI film coated with a silicone release agent to a first shaft using a lamination M/C or a bonding machine (two or more shafts), fixing a tape coated with a urethane adhesive on a carbon black PI film to an intermediate shaft (Top_ carbon black, Bottom_ liner), and then passing the two films between rolls to which pressure is applied to unify them, thereby manufacturing a single adhesive tape.

At this time, the manufactured adhesive tape is aged in a maturing room at a temperature range of 45 to 55°C for 45 to 50 hours to manufacture the adhesive tape as a final product.

Hereinafter, the present invention will be specifically described through examples. However, the following examples are only intended to specifically describe the present invention and the scope of the present invention is not limited by these examples.

[Reference Example 1]

The organic and inorganic resins are applied to the tape using the resins in the previously disclosed 10-2312935, such as polyester organic and inorganic resins, polyurethane organic and inorganic resins, and acrylic organic and inorganic resins.

[Example 1]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic/inorganic black layer coating solution containing 5 g of carbon black, 15 g of polyacrylic inorganic hybrid resin, 77 g of an organic solvent consisting of 52 g of methyl ethyl ketone and 25 g of isopropyl alcohol, and 3 g of BYK-4500 as an adhesion promoter was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic/inorganic black layer with a thickness of approximately 3.5 μm.

[Example 2]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic/inorganic black layer coating solution containing 7 g of carbon black, 15 g of polyurethane organic/inorganic hybrid resin, 75 g of an organic solvent consisting of 50 g of methyl ethyl ketone and 25 g of isopropyl alcohol, and 3 g of BYK-4500 as an adhesion promoter was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic/inorganic black layer with a thickness of approximately 3.5 μm.

[Example 3]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic-inorganic black layer coating solution containing 5 g of activated carbon, 25 g of polyester organic-inorganic hybrid resin, 67 g of an organic solvent consisting of 40 g of methyl ethyl ketone and 27 g of isopropyl alcohol, and 3 g of BYK-4500 as an adhesion promoter was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic-inorganic black layer with a thickness of approximately 3.5 μm.

[Example 4]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic-inorganic black layer coating solution consisting of 15 g of aniline black, 5 g of polyacrylic organic-inorganic hybrid resin, 5 g of polyurethane silicone resin, 46 g of methyl ethyl ketone, 31 g of isopropyl alcohol, 77 g of an organic solvent, and 3 g of BYK-4500, an adhesion promoter, was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic-inorganic black layer with a thickness of approximately 3.5 μm.

[Example 5]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic-inorganic black layer coating solution consisting of 15 g of iron oxide, 10 g of acrylic silicone resin, 15 g of polyurethane organic-inorganic hybrid resin, 67 g of an organic solvent consisting of 40 g of methyl ethyl ketone and 37 g of isopropyl alcohol, and 3 g of BYK-4500, an adhesion promoter, was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic-inorganic black layer with a thickness of approximately 3.5 ㎛.

[Example 6]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic-inorganic black layer coating solution consisting of 15 g of manganese dioxide, 5 g of polyacrylic resin, 20 g of polyester inorganic hybrid resin, 57 g of an organic solvent consisting of 34 g of methyl ethyl ketone and 23 g of isopropyl alcohol, and 3 g of BYK-4500 as an adhesion promoter was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic-inorganic black layer having a thickness of approximately 3.5 ㎛.

[Example 7]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic-inorganic black layer coating solution consisting of 25 g of carbon black, 3 g of polyacrylic silicone resin, 3 g of polyester organic-inorganic hybrid resin, 69 g of an organic solvent consisting of 41 g of methyl ethyl ketone and 28 g of isopropyl alcohol, and 3 g of BYK-4500, an adhesion promoter, was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic-inorganic black layer with a thickness of approximately 3.5 μm.

[Example 8]

A PI film with a thickness of 12 μm was prepared by corona-treating one side of the PI film.

Next, an organic and inorganic black layer coating solution consisting of 25 g of aniline black, 5 g of polyurethane silicone resin, 15 g of polyester-containing hybrid resin, 57 g of an organic solvent consisting of 34 g of methyl ethyl ketone and 23 g of isopropyl alcohol, and 3 g of BYK-4500 as an adhesion promoter was coated on one side of the corona-treated PI film using a gravure printing method to manufacture a PI film having an organic and inorganic black layer with a thickness of approximately 3.5 μm.

[Experiment 1]

The printability and ultraviolet ray blocking properties of the organic and inorganic black layers manufactured according to Examples 1 to 8 were measured and shown in Table 1 below.

division Organic/inorganic black layer (composition unit: g) BASE FILM
Adhesiveness BASE FILM
WETTING PENCIL
HARDNESS TAPE
CRACK
(ROLL production) Example 1 ○ ○ 5H △~○ Example 2 ○ ○ 6H △ Example 3 ○ ◎ 6H △ Example 4 ◎ △ 3H △ Example 5 ○ △ 3H ◎ Example 6 ○ △ 3H ○ Example 7 △ ○ 4H △ Example 8 ○ △ 3H ○

Here, △ in Table 1 above indicates average, ○ indicates good, and ◎ indicates very good.

[Example 9]

After the coating treatment of Example 1, a hot melt adhesive layer coating solution containing 10 g of polyester hot melt resin, 10 g of petroleum resin hydride, 76 g of a solvent consisting of 38 g of DMF (N,N-Dimethylformamide) and 38 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PET release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 10]

After the coating treatment of Example 2, a hot melt adhesive layer coating solution containing 10 g of polyamide hot melt resin, 15 g of petroleum resin hydride, 71 g of a solvent consisting of 36 g of DMF (N,N-Dimethylformamide) and 35 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 11]

After the coating treatment of Example 3, a hot melt adhesive layer coating solution containing 10 g of SIS/SBS hot melt resin, 10 g of petroleum resin hydride, 76 g of a solvent consisting of 38 g of DMF (N,N-Dimethylformamide) and 38 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 12]

After the coating treatment of Example 4, a hot melt adhesive layer coating solution containing 15 g of polyimide hot melt resin, 10 g of petroleum resin hydride, 71 g of a solvent consisting of 36 g of DMF (N,N-Dimethylformamide) and 35 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 13]

After the coating treatment of Example 5, a hot melt adhesive layer coating solution containing 15 g of polyurethane hot melt resin, 15 g of petroleum resin hydride, 66 g of a solvent consisting of 33 g of DMF (N,N-Dimethylformamide) and 33 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 14]

After the coating treatment of Example 6, a hot melt adhesive layer coating solution containing 15 g of EVA hot melt resin, 20 g of petroleum resin hydride, 61 g of a solvent consisting of 31 g of DMF (N,N-Dimethylformamide) and 30 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 15]

After the coating treatment of Example 7, a hot melt adhesive layer coating solution containing 20 g of polyacrylic, urethane hybrid hot melt resin, 10 g of petroleum resin hydride, 66 g of a solvent consisting of 33 g of DMF (N,N-Dimethylformamide) and 33 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Example 16]

After the coating treatment of Example 8, a hot melt adhesive layer coating solution containing 20 g of polyester hot melt resin, 15 g of petroleum resin hydride, 61 g of a solvent consisting of 31 g of DMF (N,N-Dimethylformamide) and 30 g of methyl ethyl ketone, and 4 g of an aerosol matting agent was slot die-coated on one side of the corona-treated PI film to a thickness of about 5 μm, and then a PI release film was laminated onto the hot melt adhesive layer surface to manufacture a film having a hot melt adhesive layer formed thereon.

[Comparative Example 1]

Testing of wafer backside tape based on epoxy functional group (Prior technology, epoxy-based tape)

[Comparative Example 2]

Test of a tape marked on a base film layer without a separate coating layer (Prior art, No. 10-1936873)

[Experiment 2]

The hot melt adhesive workability and adhesive strength of the products manufactured according to Examples 9 to 16 were measured and shown in Table 2 below.

division Hot melt
division Hot melt adhesive layer performance test division Hot melt
division REWORKability TAPE CUTTING LASER MARKING
(DIRECT) LASER MARKING
(STEALTH) Workability Adhesive female Example 9 polyester ○ △ ○ ○ ○ ○ Example 10 polyamide ○ ○ ○ ○ △ △ Example 11 SIS/SBS HOTMELT ○ ◎ ○ ◎ △~○ ○ Example 12 Polyimide ◎ △ ◎ △ △~○ ○ Example 13 Polyurethane ○ ◎ ○ △ △~○ △ Example 14 EVA system ○ ◎ ○ △ △~○ ○ Example 15 Poly
Acryl urethane △ ◎ △ ○ △~○ ○ Example 16 Polyester ○ △ ○ △ ○ △ Comparative Example 1 (Epoxy based TAPE layer) - X ◎ X~△ X~△ ○ ○ Comparative Example 2 (10-1936873) poly
urethane ○ △ △ △ ○ △

Here, △ in Table 2 above indicates average, ○ indicates good, and ◎ indicates very good.

[Reworkability Evaluation]

After removing the liner protecting the adhesive of the adhesive tape cut into a shape similar to a silicon wafer with a thickness of 200 ㎛ and an outer diameter of 8 inches, lamination was performed at 60°C using a roll lamination machine, and manually checking whether there were any problems with peeling between the wafer and the adhesive tape, and also observing using a microscope level to check for adhesive residues on the wafer.

[Laser Markability Evaluation]

The 'wafer level backside adhesive tape' was cut into a shape similar to a silicon wafer with a thickness of 200 ㎛ and an outer diameter of 8 inches, and the liner protecting the adhesive was removed. The tape was then laminated at 60°C using a roll lamination machine, and then heated and cured in an oven at 140°C for 1 hour and 30 minutes to produce a wafer with the adhesive tape attached.

After removing the carrier film of the low-adhesion silicone carrier layer protecting the black printing surface of the wafer to which the adhesive tape was attached, the black printing surface was marked using a laser marking machine, and then the cyanoacrylate property was observed.

[Sawing Evaluation]

After removing the liner protecting the adhesive of the adhesive tape cut into a shape similar to a silicon wafer with a thickness of 200 ㎛ and an outer diameter of 8 inches, lamination was performed at 60°C using a roll lamination machine, and then heating and curing in an oven at 140°C for 1 hour and 30 minutes was performed to produce a wafer with the adhesive tape attached.

After removing the carrier film of the low-adhesion silicone carrier layer protecting the black-printed side of the wafer to which the adhesive tape was attached, a dicing tape for dicing was attached using a roll lamination machine so that the black-printed side and the adhesive side of the dicing tape faced each other, and was attached together with the wafer ring.

Using sawing equipment (DISCO, DFD 6340), sawing was performed to form chips measuring 5 mm x 5 mm.

As a result, the wafer cut surface was confirmed at a microscope level.

FIGS. 5A and 5B are depth comparison drawings of stealth laser marking performance according to one embodiment and stealth marking performance of a wafer backside tape according to the prior art.

FIG. 5a shows the depth of stealth laser marking for a PI-based film tape according to a prior art, and FIG. 5b shows the depth of stealth laser marking for a tape to which an organic/inorganic black layer is applied according to an embodiment.

FIGS. 6 and 7 are comparative drawings comparing the stealth marking performance of an inorganic coating layer according to one embodiment and an organic resin layer according to the prior art.

FIG. 6a is a drawing illustrating stealth laser marking performance to which an organic coating layer according to a conventional technique is applied, and FIG. 6b is a drawing illustrating stealth laser marking performance to which an organic coating layer according to an embodiment is applied.

FIG. 7a is a drawing illustrating stealth laser marking performance to which an organic coating layer according to a conventional technique is applied, and FIG. 7b is a drawing illustrating stealth laser marking performance to which an organic and inorganic coating layer according to an embodiment is applied.

Referring to FIGS. 6 and 7, compared to a tape to which an organic or inorganic coating layer is applied according to an embodiment, it is possible to confirm a portion of the tape to which an organic layer is applied that has insufficient marking visibility (FIG. 6a) and contamination (FIG. 7a).

The backside adhesive tape for wafer level according to the embodiment can replace the existing EMC and be attached to the backside of a wafer on which a pattern is laminated or a wafer on which electrodes such as bumps are laminated for wafer level use, thereby protecting the backside and improving the performance of stealth laser marking.

The above description is merely an example of the technical idea of the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Accordingly, the embodiments described in the present invention are intended to explain the technical idea of the present invention, and the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the rights of the present invention.

[Explanation of symbols in the drawing]

2: Base film

4: Organic and inorganic black layer

8: Hot melt adhesive layer

10: Silicone low adhesion layer

12: Carrier Film

16: Liner

Claims (10)

Plate-shaped substrate;
An organic or inorganic black layer laminated on one side of the above plate-shaped substrate to block ultraviolet rays and facilitate the visibility of laser marking;
A hot melt adhesive layer laminated on the plate-shaped substrate on one side of which the organic and inorganic black layer is laminated; and
It includes a silicone low-adhesion carrier layer laminated on the above-mentioned inorganic black layer to enable heat adhesion,
The above organic and inorganic black layer comprises an organic and inorganic composite binder resin,
The above organic/inorganic composite binder resin is,
A backside adhesive tape for wafer level, comprising an organic resin including vinyl resin, epoxy resin, alkyd resin, amide resin, acrylic resin, acetyl cellulose, chlorinated polypropylene, acrylic or urethane, and an inorganic organic composite comprising siloxane, silsesquioxane, titanium, zirconium, silicone polymer, or at least one mixture selected from these. In the first paragraph,
The above organic and inorganic black layer is,
A backside adhesive tape for wafer level, having a thickness of 2 to 30 μm. In paragraph 1,
The above organic and inorganic black layer is,
A backside adhesive tape for wafer level, comprising a pigment comprising carbon black, iron oxide, manganese dioxide, aniline black, activated carbon or at least one mixture selected from these. In the first paragraph,
The above organic and inorganic black layer is,
A backside adhesive tape for wafer level, comprising pigments, organic solvents and additives. In paragraph 4,
A backside adhesive tape for wafer level, comprising 3 to 25 wt% of the pigment, 3 to 30 wt% of the organic/inorganic composite binder resin, 45 to 80 wt% of the organic solvent, and 0.1 to 5 wt% of the additive, based on 100 wt% of the organic/inorganic black layer. delete In paragraph 1,
The above silicone low-adhesion carrier layer is,
A backside adhesive tape for wafer level, having a thickness of 3 to 30 μm. In paragraph 1,
The above silicone low-adhesion carrier layer is,
A backside adhesive tape for wafer level, comprising a hot melt resin, such as a polyamide-based resin, a polyimide-based resin, a polyester-based resin, an EVA-based resin, a polyacrylic resin, a polyurethane-based resin, or at least one mixture selected from these. In paragraph 1,
The above silicone low-adhesion carrier layer is,
A backside adhesive tape for wafer level use having an adhesive strength of 2 to 30 gf/25 mm at room temperature. A step of providing a plate-shaped substrate;
A step of providing an organic/inorganic black layer laminated on one side of the above plate-shaped substrate to block ultraviolet rays and facilitate the visibility of laser marking;
A step of providing a hot melt adhesive layer laminated on the other side of the plate-shaped substrate on which the organic and inorganic black layer is laminated; and
It comprises a step of providing a silicone low-adhesion carrier layer laminated on the above-mentioned inorganic black layer to enable heat adhesion,
The above organic and inorganic black layer comprises an organic and inorganic composite binder resin,
The above organic/inorganic composite binder resin is,
A method for manufacturing a backside adhesive tape for wafer level, comprising an organic resin including vinyl resin, epoxy resin, alkyd resin, amide resin, acrylic resin, acetyl cellulose, chlorinated polypropylene, acrylic or urethane, and an organic-inorganic composite complexed with siloxane, silsesquioxane, titanium, zirconium, silicone polymer, or at least one mixture selected from these.