KR102705615B1 - 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 - Google Patents
표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 Download PDFInfo
- Publication number
- KR102705615B1 KR102705615B1 KR1020190075896A KR20190075896A KR102705615B1 KR 102705615 B1 KR102705615 B1 KR 102705615B1 KR 1020190075896 A KR1020190075896 A KR 1020190075896A KR 20190075896 A KR20190075896 A KR 20190075896A KR 102705615 B1 KR102705615 B1 KR 102705615B1
- Authority
- KR
- South Korea
- Prior art keywords
- laser beam
- adhesive layer
- display
- protective film
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/144—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers using layers with different mechanical or chemical conditions or properties, e.g. layers with different thermal shrinkage, layers under tension during bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
도 2는 도 1의 모 패널에 포함된 표시 패널을 나타내는 평면도이다.
도 3은 도 2의 표시 패널을 나타내는 단면도이다.
도 4 및 도 5는 본 발명의 일 실시예에 따른 보호 필름을 부착하는 단계를 나타내는 도면들이다.
도 6 및 도 7은 본 발명의 일 실시예에 따른 보호 필름을 하프 커팅하는 단계를 나타내는 도면들이다.
도 8, 도 9, 도 10, 및 도 11은 본 발명의 일 실시예에 따른 보호 필름에 레이저 빔을 조사하는 단계를 나타내는 도면들이다.
도 12 및 도 13은 본 발명의 일 실시예에 적용 가능한 레이저 빔을 조사하는 레이저 장치를 나타내는 도면들이다.
도 14 및 도 15는 본 발명의 일 실시예에 따른 보호 필름을 박리하는 단계를 나타내는 도면들이다.
도 16은 본 발명의 일 실시예에 따른 모 패널을 절단하는 단계를 나타내는 평면도이다.
도 17, 도 18, 도 19, 및 도 20은 본 발명의 다른 실시예에 따른 표시 장치의 제조 방법을 나타내는 단면도들이다.
210: 기판 220: 표시부
230: 박막 봉지층 300: 보호 필름
310: 점착층 320: 보호층
400: 레이저 장치 410: 레이저 빔 발생기
420: 스테이지 430: 광학계
CL: 절단선 DA: 표시 영역
PDA: 패드 영역
Claims (20)
- 표시 영역 및 패드 영역을 갖는 표시 패널 상에 적층된 점착층 및 보호층을 포함하는 보호 필름을 부착하는 단계;
상기 표시 영역과 상기 패드 영역 사이에 대응하는 절단선을 따라 상기 보호층의 전체 두께 및 상기 점착층의 일부 두께가 절단되도록 상기 보호 필름을 하프 커팅하는 단계;
상기 절단선의 적어도 일부를 따라 상기 점착층의 절단되지 않은 나머지 두께를 갖는 부분에 레이저 빔을 조사하는 단계; 및
상기 절단선을 따라 상기 보호 필름의 상기 패드 영역에 대응하는 부분을 박리하는 단계를 포함하고,
상기 레이저 빔이 조사된 상기 점착층의 점착력은 상기 레이저 빔이 조사되지 않은 상기 점착층의 점착력보다 작은, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 레이저 빔의 파장은 200 nm 내지 300 nm인, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 점착층은 폴리우레탄 및 실리콘 중 적어도 하나를 포함하는, 표시 장치의 제조 방법. - 삭제
- 제1 항에 있어서,
상기 레이저 빔이 조사된 상기 점착층의 탄소의 원자 백분율은 상기 레이저 빔이 조사되지 않은 상기 점착층의 탄소의 원자 백분율보다 작고,
상기 레이저 빔이 조사된 상기 점착층의 산소의 원자 백분율은 상기 레이저 빔이 조사되지 않은 상기 점착층의 산소의 원자 백분율보다 큰, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 레이저 빔은 상기 절단선의 길이 방향을 따라 이동하면서 상기 절단선의 폭 방향을 따라 스윙하는, 표시 장치의 제조 방법. - 제6 항에 있어서,
상기 레이저 빔의 스윙폭은 상기 절단선의 폭보다 큰, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 점착층의 절단되지 않은 상기 나머지 두께는 40 ㎛ 내지 60 ㎛인, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 표시 패널은:
기판;
상기 기판 상의 상기 표시 영역에 배치되는 표시부; 및
상기 표시부를 덮는 박막 봉지층을 포함하는, 표시 장치의 제조 방법. - 제9 항에 있어서,
상기 기판은 가요성 유리를 포함하는, 표시 장치의 제조 방법. - 제9 항에 있어서,
상기 절단선은 상기 박막 봉지층과 중첩하는, 표시 장치의 제조 방법. - 제1 항에 있어서,
상기 보호 필름은 CO2 레이저 빔에 의해 하프 커팅되는, 표시 장치의 제조 방법. - 표시 영역 및 패드 영역을 각각 갖는 복수의 표시 패널들을 포함하는 모 패널 상에 적층된 점착층 및 보호층을 포함하는 보호 필름을 부착하는 단계;
상기 표시 패널들 각각의 상기 표시 영역과 상기 패드 영역 사이에 각각 대응하는 복수의 절단선들을 따라 상기 보호층의 전체 두께 및 상기 점착층의 일부 두께가 절단되도록 상기 보호 필름을 하프 커팅하는 단계;
상기 절단선들 각각의 적어도 일부를 따라 상기 점착층의 절단되지 않은 나머지 두께를 갖는 부분에 레이저 빔을 조사하는 단계; 및
상기 절단선들을 따라 상기 표시 패널들의 상기 패드 영역들에 각각 대응하는 상기 보호 필름의 부분들을 박리하는 단계를 포함하고,
상기 레이저 빔이 조사된 상기 점착층의 점착력은 상기 레이저 빔이 조사되지 않은 상기 점착층의 점착력보다 작은, 표시 장치의 제조 방법. - 제13 항에 있어서,
상기 절단선들은 상기 표시 패널들의 상기 표시 영역들을 각각 둘러싸는, 표시 장치의 제조 방법. - 제14 항에 있어서,
상기 절단선들 각각은 평면상 사각 형상을 가지고,
상기 레이저 빔은 상기 절단선들 각각의 적어도 하나의 변에 조사되는, 표시 장치의 제조 방법. - 제13 항에 있어서,
상기 표시 패널들의 상기 패드 영역들에 각각 대응하는 상기 보호 필름의 상기 부분들은 동시에 박리되는, 표시 장치의 제조 방법. - 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190075896A KR102705615B1 (ko) | 2019-06-25 | 2019-06-25 | 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 |
US16/781,443 US11292083B2 (en) | 2019-06-25 | 2020-02-04 | Method of manufacturing display device and laser device used therein |
CN202010412968.0A CN112133724B (zh) | 2019-06-25 | 2020-05-15 | 制造显示装置的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190075896A KR102705615B1 (ko) | 2019-06-25 | 2019-06-25 | 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210000805A KR20210000805A (ko) | 2021-01-06 |
KR102705615B1 true KR102705615B1 (ko) | 2024-09-12 |
Family
ID=73851140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190075896A Active KR102705615B1 (ko) | 2019-06-25 | 2019-06-25 | 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11292083B2 (ko) |
KR (1) | KR102705615B1 (ko) |
CN (1) | CN112133724B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110707242A (zh) * | 2019-09-02 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板的制作方法 |
KR20220058688A (ko) | 2020-10-29 | 2022-05-10 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
KR20220063842A (ko) * | 2020-11-10 | 2022-05-18 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
CN114815407B (zh) * | 2021-01-28 | 2024-08-27 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板 |
KR102760397B1 (ko) * | 2021-02-24 | 2025-02-03 | 신메이 폰타나 홀딩(홍콩) 리미티드 | 폴더블 백플레이트 필름의 제조 방법 |
CN113031333B (zh) * | 2021-03-23 | 2022-08-16 | 滁州惠科光电科技有限公司 | 确定阵列基板的切割线的方法及装置 |
CN115768203A (zh) * | 2022-11-28 | 2023-03-07 | 武汉天马微电子有限公司 | 显示面板及显示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018120087A (ja) | 2017-01-25 | 2018-08-02 | 株式会社ジャパンディスプレイ | 表示装置の製造方法および表示装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4663047B2 (ja) * | 1998-07-13 | 2011-03-30 | 株式会社半導体エネルギー研究所 | レーザー照射装置及び半導体装置の作製方法 |
JP4109823B2 (ja) * | 2000-10-10 | 2008-07-02 | 株式会社東芝 | 半導体装置の製造方法 |
KR101911574B1 (ko) | 2011-04-15 | 2018-10-24 | 도요보 가부시키가이샤 | 적층체와 그 제조 방법 및 이 적층체를 이용한 디바이스 구조체의 작성 방법 |
KR101341430B1 (ko) * | 2012-03-30 | 2013-12-13 | 주식회사 에스에프에이 | 릴투패널 편광필름 부착 장치 |
KR101980230B1 (ko) * | 2012-10-09 | 2019-09-02 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치용 어레이 기판과, 이의 제조 방법 |
KR102117890B1 (ko) * | 2012-12-28 | 2020-06-02 | 엘지디스플레이 주식회사 | 플렉서블 표시 장치 및 플렉서블 표시 장치 제조 방법 |
CN106687893B (zh) * | 2014-12-26 | 2020-05-22 | 株式会社藤仓 | 布线体、布线基板、触摸传感器以及布线体的制造方法 |
DE102015204698B4 (de) * | 2015-03-16 | 2023-07-20 | Disco Corporation | Verfahren zum Teilen eines Wafers |
KR20160126175A (ko) * | 2015-04-22 | 2016-11-02 | 삼성디스플레이 주식회사 | 기판 절단 방법 및 표시 장치 제조 방법 |
KR102325211B1 (ko) | 2015-06-01 | 2021-11-12 | 삼성디스플레이 주식회사 | 플렉시블 디스플레이 장치 제조방법 |
CN105895573B (zh) * | 2016-04-18 | 2018-09-04 | 京东方科技集团股份有限公司 | 柔性基板的剥离方法 |
KR102542429B1 (ko) * | 2016-05-25 | 2023-06-13 | 엘지디스플레이 주식회사 | 유기발광 표시장치 및 그 제조방법 |
KR102741535B1 (ko) | 2016-09-13 | 2024-12-10 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
KR102327991B1 (ko) * | 2016-12-16 | 2021-11-18 | 삼성디스플레이 주식회사 | 디스플레이 장치의 제조방법 |
JP6826881B2 (ja) * | 2016-12-22 | 2021-02-10 | 株式会社ジャパンディスプレイ | 保護部材、表示装置および表示装置の製造方法 |
KR101960267B1 (ko) * | 2017-05-12 | 2019-03-21 | (주)제이스텍 | 플렉시블 디스플레이 벤딩을 위한 필름 박리방법 |
KR101854282B1 (ko) | 2017-06-29 | 2018-05-04 | 삼성디스플레이 주식회사 | 기판 절단 방법 및 표시 장치 제조 방법 |
KR102322135B1 (ko) * | 2017-09-15 | 2021-11-08 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법 |
KR102424743B1 (ko) * | 2017-10-13 | 2022-07-26 | 삼성디스플레이 주식회사 | 보호 필름 박리 장치 및 보호 필름 박리 방법 |
CN109599427B (zh) * | 2018-12-14 | 2021-05-14 | 京东方科技集团股份有限公司 | 显示基板的制备方法、显示面板及显示装置 |
-
2019
- 2019-06-25 KR KR1020190075896A patent/KR102705615B1/ko active Active
-
2020
- 2020-02-04 US US16/781,443 patent/US11292083B2/en active Active
- 2020-05-15 CN CN202010412968.0A patent/CN112133724B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018120087A (ja) | 2017-01-25 | 2018-08-02 | 株式会社ジャパンディスプレイ | 表示装置の製造方法および表示装置 |
Also Published As
Publication number | Publication date |
---|---|
US20200406397A1 (en) | 2020-12-31 |
US11292083B2 (en) | 2022-04-05 |
CN112133724B (zh) | 2025-02-07 |
CN112133724A (zh) | 2020-12-25 |
KR20210000805A (ko) | 2021-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102705615B1 (ko) | 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치 | |
US20200209925A1 (en) | Flexible display apparatus and electronic device comprising the same | |
US10882221B2 (en) | Peeling method of flexible substrate | |
JP2018120087A (ja) | 表示装置の製造方法および表示装置 | |
CN105319778B (zh) | 显示设备及其制造方法 | |
US10754211B2 (en) | Display device and manufacturing method thereof | |
KR20180059645A (ko) | 표시 장치 및 이의 제조 방법 | |
US20200203396A1 (en) | Method for manufacturing display apparatus, display apparatus, and terminal | |
KR20180068382A (ko) | 표시 장치 및 표시 장치의 제조 방법 | |
KR102065370B1 (ko) | 기판 박리 방법 및 기판 박리 장치 | |
EP3439054A1 (en) | Display device and method for manufacturing the same | |
US9746599B2 (en) | Display device and method of fabricating the same | |
KR102734428B1 (ko) | 가이드 필름, 가이드 필름의 제조 방법, 표시 장치의 제조 장치, 및 표시 장치의 제조 방법 | |
KR102674786B1 (ko) | 멀티스크린 표시장치 및 이의 제조방법 | |
JP6664229B2 (ja) | 導光ブロックを有する表示装置 | |
KR20180058091A (ko) | 액정 표시 장치 | |
US20240281036A1 (en) | Display device and method for manufacturing the same | |
KR20140085031A (ko) | 플렉서블 표시장치와 이의 제조방법 | |
CN109727892B (zh) | 用于使窗面板循环的设备 | |
KR20230019326A (ko) | 표시 장치 및 이의 제조 방법 | |
KR20180054335A (ko) | 액정 표시 장치 | |
JP6817278B2 (ja) | バックライトユニット及びこれを含む表示装置 | |
US20220143757A1 (en) | Apparatus for manufacturing a display device and a method for manufacturing the display device | |
KR102462654B1 (ko) | 표시 장치 | |
JP6324020B2 (ja) | 表示装置の製造方法および製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20190625 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20220428 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20190625 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20231222 Patent event code: PE09021S01D |
|
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20240626 |
|
PG1601 | Publication of registration |