KR102682920B1 - Power module cooling apparatus - Google Patents

Abstract

The present invention is a power module cooling device, comprising: a housing portion having an inlet portion through which a refrigerant flows in and an outlet portion through which a refrigerant flows out, and a flow space formed therein to allow the refrigerant to flow; a cover portion on one side of which is in direct or indirect contact with at least one heating element, and on the other side of which is coupled to the housing to seal the flow space; and a heat exchange part formed of a plurality of fins protruding from the other surface of the cover part and inserted into the flow space so that heat generated by the heating element can be transferred to the refrigerant, wherein the housing part or the heat exchange part includes the The cross-sectional area of the flow space may be formed to be small along the direction in which the refrigerant flows.

Description

Power module cooling apparatus {Power module cooling apparatus}

The present invention relates to a power module cooling device, and more specifically, to a cooling device for a motor control unit for an electric vehicle that can cool power semiconductors such as an inverter that supplies the motor of an electric vehicle.

In general, electric vehicles play a role as a next-generation means of transportation by ensuring quiet and environmentally friendly driving by driving a motor with battery power.

In order to solve the problem of overheating due to heat generation of component parts of existing electric vehicles, cooling devices including a cooling module consisting of a radiator and a cooling fan are applied to the driving motor, charger, inverter, and battery, which generate a lot of heat, to prevent overheating. It is being prevented.

The cooling system of electric vehicles is water-cooled, which cools by circulating low-temperature coolant using a cooling module consisting of a separate heat exchanger, a radiator, and a cooling fan, and a motor and fan are applied to each component to cool the air or wind from the main surface. It is classified into an air-cooled type that cools by forced suction, and the water-cooled type is usually applied.

The inverter of an electric vehicle is a type of power semiconductor that changes the DC power of the battery into AC power and supplies it to the motor of the electric vehicle. Since it is heated to a high temperature during operation, a separate heat dissipation module can be applied to the motor control unit where the inverter is installed. .

The heat dissipation module of the motor control unit for electric vehicles is a water-cooled heat dissipation structure that seals the cooling channel by welding a cooling plate with a power semiconductor installed on the opening of the heat dissipation module housing with a cooling channel formed inside, and then circulates refrigerant in the cooling channel. As a result, securing heat dissipation efficiency, that is, cooling performance, has emerged as an important technical task.

Conventional heat dissipation modules have the same length and structure of fins regardless of where the heating element or chip is mounted, resulting in a problem that creates an area where cooling is unnecessary. Additionally, as areas where cooling is unnecessary occur, cooling efficiency decreases depending on the flowing cooling fluid and time.

The idea of the present invention is to solve these problems, and to provide a power module cooling device that can minimize unnecessary cooling areas depending on the heating element, increase cooling performance, and ensure temperature uniformity of a plurality of heating elements. . However, these tasks are illustrative and do not limit the scope of the present invention.

A power module cooling device according to the technical idea of the present invention for solving the above problems includes: a housing portion having an inlet portion through which a refrigerant flows in and an outlet portion through which a refrigerant flows out, and a flow space formed therein so that the refrigerant can flow; a cover portion on one side of which is in direct or indirect contact with at least one heating element, and on the other side of which is coupled to the housing to seal the flow space; and a heat exchange part formed of a plurality of fins protruding from the other surface of the cover part and inserted into the flow space so that heat generated by the heating element can be transferred to the refrigerant, wherein the housing part or the heat exchange part includes the The cross-sectional area of the flow space may be formed to be small along the direction in which the refrigerant flows.

According to the technical idea of the present invention, the housing part may be formed so that one side wall of the flow space has a first angle with respect to the horizontal surface of the other side wall of the flow space based on the direction in which the refrigerant flows.

According to the technical idea of the present invention, the heat exchange unit includes a first connection line connecting a plurality of fins formed to correspond to one side wall of the flow space, and a second connection line connecting a plurality of fins formed to correspond to the other side wall of the flow space. It may be formed at the first angle with respect to the connection line.

According to the technical idea of the present invention, the housing unit may be formed so that at least a portion of one side wall of the flow space has a curved portion based on the direction in which the refrigerant flows.

According to the technical idea of the present invention, the first angle may be formed to be 1 degree to 1.5 degrees.

According to the technical idea of the present invention, the heat exchange part is formed as a wall on the other side of the cover part on the side of the plurality of fins and is inserted into the flow space so that the flow space can be narrowed along the direction in which the refrigerant flows. It may include a flow control unit.

According to the technical idea of the present invention, the flow control unit can be selectively coupled to the heat exchanger formed according to the contact position where the heating element is in contact with the cover part or the heating position where heat is generated from the heating element. The cover part may be formed to be attachable and detachable.

According to the technical idea of the present invention, the housing part may be formed so that the bottom surface of the flow space has a second angle with respect to the horizontal surface of the cover part based on the direction in which the refrigerant flows.

According to the technical idea of the present invention, the heat exchange part has an extension line connecting the ends of the plurality of fins based on a horizontal cross section in the direction in which the refrigerant flows, so as to correspond to the flow space formed in the housing part, on the horizontal surface of the cover part. It may be formed to have the second angle with respect to .

According to the technical idea of the present invention, the housing unit may be formed so that at least a portion of the bottom surface of the flow space has a curved surface based on the direction in which the refrigerant flows.

According to the technical idea of the present invention, the second angle may be formed to be 1 degree to 1.5 degrees.

According to the technical idea of the present invention, a joint formed to surround the cover part may be further included.

According to the technical idea of the present invention, the joint may be joined to a protrusion formed on at least a portion of the housing by welding using a laser welding method.

According to some embodiments of the present invention as described above, the length and structure of the fins are formed according to the location where the heating element or chip is mounted to minimize areas that do not require cooling, and to increase cooling efficiency by increasing the speed of the refrigerant. It is possible to increase the cooling efficiency according to the flowing cooling fluid and time.

In addition, it is possible to implement a power module cooling device that can equalize the temperature at which the plurality of heating elements or chips are cooled by controlling the flow speed of the refrigerant according to the positions of the plurality of heating elements or chips. Of course, the scope of the present invention is not limited by this effect.

1 is a perspective view showing a power module cooling device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a cross-section taken along line AA′ of the power module cooling device of FIG. 1.
FIG. 3 is a cross-sectional view showing a cross-section taken along line AA′ of the power module cooling device of FIG. 1.
FIG. 4 is a plan view showing the housing portion of the BB′ section of the power module cooling device of FIG. 1.
5 to 8 are cross-sectional views showing power module cooling devices according to various embodiments of the present invention.
Figure 9 is a table showing the temperature change of heating elements mounted at different positions according to the angles of the wall gradient and ceiling gradient of the power module cooling device according to an embodiment of the present invention.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified into various other forms, and the scope of the present invention is as follows. It is not limited to examples. Rather, these embodiments are provided to make the present disclosure more faithful and complete and to fully convey the spirit of the present invention to those skilled in the art. Additionally, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, the singular forms include the plural forms unless the context clearly indicates otherwise. Additionally, when used herein, “comprise” and/or “comprising” means specifying the presence of stated features, numbers, steps, operations, members, elements and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, numbers, operations, members, elements and/or groups.

Hereinafter, embodiments of the present invention will be described with reference to drawings that schematically show ideal embodiments of the present invention. In the drawings, variations of the depicted shape may be expected, for example, depending on manufacturing technology and/or tolerances. Accordingly, embodiments of the present invention should not be construed as being limited to the specific shape of the area shown in this specification, but should include, for example, changes in shape resulting from manufacturing.

Hereinafter, a power module cooling device according to some embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a power module cooling device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A′ of the power module cooling device 1000 of FIG. 1, and FIG. 3 is a cross-sectional view taken along the line B-B′ of FIG. 1. It is a cross-sectional view showing a cut surface, and FIG. 4 is a plan view showing the housing portion 100 of FIG. 3.

As shown in FIGS. 1 to 3, the power module cooling device 1000 according to some embodiments of the present invention largely includes a housing portion 100, a cover portion 200, and a heat exchange portion 300. can do.

As shown in Figures 1 and 2, the housing portion 100 is formed with an inlet 110 through which the refrigerant flows in and an outlet 120 through which the refrigerant flows out, and has a flow space inside so that the refrigerant can flow. A) can be formed.

For example, the housing portion 100 may be an overall box-shaped cylindrical structure made of a thermally conductive material with an opening open on at least one side so that a flow space A through which the refrigerant circulates can be formed therein.

The housing portion 100 has a relatively three-dimensionally complex structure, and can be molded from a base material made of aluminum using a die casting method to reduce costs and be suitable for a complex structure.

More specifically, for example, the housing portion 100 includes a housing body and an inlet ( It may include a wall formed around the edge of the housing body so that the refrigerant flowing in from 110) can be circulated and discharged through the outlet 120.

The wall may include one side wall 131 formed on the side in the direction in which the refrigerant flows from the inlet 110 to the outlet 120, and the other side wall 132 corresponding to the one side wall 131.

However, the shape or manufacturing method of the housing portion 100 is not necessarily limited to the drawings, and in addition to the overall square box shape, a variety of three-dimensional solid bodies such as polygonal boxes, ring shapes, or cylindrical shapes can be manufactured by various methods. .

Hereinafter, in the description, as in FIG. 1, the direction in which the refrigerant flows from the inlet 110 to the outlet 120 is the X-axis direction, the width direction in the direction perpendicular to the direction in which the refrigerant flows is the Y-axis direction, The direction in which the heat exchanger 300 and the cover 200 are coupled to the housing 100 in a direction perpendicular to the direction in which the refrigerant flows will be described as the Z-axis direction.

As shown in Figures 1 and 2, one side of the cover part 200 is in direct or indirect contact with at least one heating element (PM), and the other side is the housing part so as to seal the flow space (A). It can be combined with (100).

The cover portion 200 may be an overall plate-shaped structure made of a thermally conductive material. For example, the cover portion 200 may include a plate-shaped plate body with both an outer surface formed on one side and an inner surface formed on the other side being flat.

The inner surface of the plate body may be installed to cover the flow space (A) so as to be in thermal contact with the refrigerant, and a heat exchange part 300 protruding in the direction of the flow space (A) may be formed.

The outer surface of the plate body may be formed with a seating portion on which at least one heating element (PM) can be seated.

The seating portion may be formed to protrude from the outer surface of the plate body to prevent bending when the heating element (PM) generates heat. Therefore, when the heating element (PM) mounted on the seating portion generates heat at a high temperature, the thickness of the plate body is relatively thin, so that bending can be induced into the plate body instead of the seating portion, thereby suppressing the bending phenomenon of the seating portion as much as possible. This can prevent poor contact or separation from the heating element (PM).

Meanwhile, the shape of the cover portion 200 is not necessarily limited to the drawings, and may be manufactured by various methods in a variety of shapes, such as a polygonal plate, a circular plate, and an elliptical plate, in addition to the overall square plate shape.

As shown in Figures 2 and 3, the heat exchange part 300 is formed with a plurality of fins protruding from the other surface of the cover part 200 so that heat generated from the heating element (PM) can be transferred to the refrigerant. It can be inserted into space (A).

Specifically, the heat exchange unit 300 may be formed with a plurality of fins formed in the shape of a cylinder or polygonal column and protruding from the other surface of the cover unit 200. Thus, the heat generated from the heating element (PM) is transferred to the refrigerant through the cover part 200, and the plurality of fins increase the contact area with the refrigerant, thereby increasing cooling efficiency.

The heating element (PM) is configured differently depending on the motor control method, and for example, multiple chips such as diodes and IGBTs may be mounted on the top surface.

The heating element (PM) is a type of power semiconductor supplied to the motor of an electric vehicle, specifically, a silicon controlled rectifier (SCR), a triode AC switch (TRIAC), a diode AC (DIAC), and a GTO inverter (Gate Turn- It can include power semiconductor chips such as Off Thyrister (SSS), SSS (Silicon Symmetrical Switch), MCT (Mos-Controlled Thyristo), IGBT (Insulated gate bipolar transistor), and MOSFET (Metal Oxide Semiconductor Field Effect Transistor). there is.

At this time, the chip (S) may be mounted in a structure eccentric in one direction rather than the center of the heating element (PM), a plurality of heating elements (PM) may be formed at different positions, and the The calorific value is different. Accordingly, the housing unit 100 or the heat exchange unit 300 may be formed so that the cross-sectional area of the flow space A is reduced along the direction in which the refrigerant flows.

For example, the housing part 100 has an internal space of the housing part 100 so that the cross-sectional area of the flow space A becomes smaller along the direction in which the refrigerant moves from the inlet part 110 to the outlet part 120 in the X-axis direction. It can be formed so that the width on both sides is narrow.

Specifically, the heating element (PM) is seated on one side and the contact position is on one side, or the heating element (PM) is seated in the center, but a chip (S) that generates heat formed in the heating element (PM) is formed on one side to generate heat. When the location is on one side, for example, when the contact location or the heating location is formed toward the other side wall 132, which is the upper part in FIG. 4, one side wall 131 of the housing portion 100 is gradually narrowed. can be formed.

At this time, the housing portion 100 may be formed so that one side wall 131 of the flow space A has a first angle θ1 with respect to the horizontal plane of the other side wall 132 based on the direction in which the refrigerant flows. .

Accordingly, as the refrigerant flows from the inlet 110 to the outlet 120, the flow rate of the refrigerant increases, and the outlet flows at a lower temperature than the temperature of the refrigerant flowing at the inlet 110. The cooling efficiency of the heating element (PM) seated on the outflow part 120 side can be increased with the refrigerant flowing from the part 120 side.

The heat exchange unit 300 may be formed to correspond to the flow space (A).

For example, as shown in FIG. 3, the heat exchanger 300 has a first connection line L1 connecting a plurality of fins formed to correspond to one side wall 131 of the flow space A to the other side wall 132. It may be formed to have the first angle θ1 with respect to the second connection line L2 connecting the plurality of pins formed to correspond. At this time, the first angle θ1 is formed to range from 1 degree to 1.5 degrees, so that when a plurality of heating elements PM are formed in the flow direction of the refrigerant, the first heating element PM1, the second heating element PM2, and the first heating element PM2 3 The temperature of the heating element (PM3) can be equalized.

Although not shown, the number of fins formed in the Y-axis direction in the width direction on the inlet 110 side of the heat exchange unit 300 is greater than the number of fins formed in the Y-axis direction on the outlet 120 side. A lot can be formed. That is, the first connection line L1 may be formed to be inclined as the number of fins decreases in the direction of flow of the refrigerant.

Alternatively, the number of fins formed in the Y-axis direction in the width direction on the inlet 110 side of the heat exchange unit 300 and the number of fins formed in the Y-axis direction on the outlet 120 side are the same. However, the spacing distance between the pins on the outlet 120 side may be narrower than the spacing distance between the pins on the inlet portion 110 side, so that the first connection line L1 may be formed to be inclined.

5 to 8 are cross-sectional views showing a power module cooling device 1000 according to various embodiments of the present invention.

As shown in FIG. 5, the housing portion 100 of the power module cooling device 1000 according to another embodiment of the present invention may include a curved portion 133.

As shown in FIG. 5, the housing portion 100 may be formed so that at least a portion of one side wall 131 of the flow space A has a curved portion 133 based on the direction in which the refrigerant flows. .

For example, the housing portion 100 includes a straight section formed as the width of the flow space A gradually decreases, and the width of the flow space A decreases sharply in the direction of the outlet portion 120, As shown in FIG. 5, it may include a curved section 133 that is reduced to a curve on a plane.

As shown in FIG. 6 , the heat exchange unit 300 of the power module cooling device 1000 according to another embodiment of the present invention may include a flow control unit 320.

The flow regulator 320 is formed as a wall on the side of the plurality of fins 310 on the other side of the cover 200 so that the flow space A can be narrowed along the direction in which the refrigerant flows. ) can be inserted into.

The flow control unit 320 may be formed to be thicker in the direction of the outlet 120 than in the direction of the inlet 110 so that the cross-sectional area of the flow space A is reduced along the direction in which the refrigerant flows. .

For example, as shown in FIG. 6, the thickness of the flow control unit 320 may be formed to increase according to the flow direction (F) in which the refrigerant flows, and the flow control unit 320 may be formed to be larger than the housing unit 100. As it is combined, the cross-sectional area of the flow space (A) narrows, making it possible to control the flow speed of the refrigerant.

At this time, the flow control unit 320 selectively corresponds to the heat exchange unit 300 formed according to the contact position where the heating element (PM) contacts the cover part 200 or the heat generating position where heat is generated from the heating element (PM). It may be formed to be attachable and detachable to the cover portion 200 so that it can be coupled.

The flow control unit 320 may be coupled to the housing unit 100 by selecting the heat exchanger 300 according to the position of the chip S mounted on the heating element PM. Additionally, the flow control unit 320 It may be selected and coupled to the cover part 100 and the housing part 100.

In other words, various types of heat exchange unit 300 and flow control unit 320 can be selectively used depending on the contact position of the heating element (PM) or the heating position where heat is generated from the heating element (PM), and the housing unit can be used selectively. (100) is formed to accommodate both the heat exchange part 300 and the flow control part 320 of various shapes, making it easy to manufacture the housing part 100, the heat exchange part 300, and the flow control part 320. Cost reduction is possible.

The shape of the flow control unit 320 is not necessarily limited to the drawing, and may be formed in various shapes in which the cross-sectional area of the flow space A is reduced.

As shown in FIG. 7, the housing portion 100 of the power module cooling device 1000 according to another embodiment of the present invention may include an inclined bottom surface 134.

The height of the flow space A may be narrowed so that the cross-sectional area of the flow space A decreases along the direction in which the refrigerant moves from the inlet 110 to the outlet 120 in the X-axis direction.

Specifically, the bottom surface 134 is formed to increase in height from the inlet 110 to the outlet 120 of the housing unit 100, so that the flow space A may become relatively narrow. At this time, the bottom surface 134 may be formed at a second angle θ2 with respect to the horizontal surface of the cover part 200.

Accordingly, as the refrigerant flows from the inlet 110 to the outlet 120, the flow rate of the refrigerant increases, and the outlet flows at a lower temperature than the temperature of the refrigerant flowing at the inlet 110. The cooling efficiency of the heating element (PM) seated on the outflow part 120 side can be increased with the refrigerant flowing from the part 120 side.

The heat exchange unit 300 may be formed to correspond to the bottom surface 134.

For example, as shown in FIG. 3, the heat exchange unit 300 corresponds to the flow space A formed in the housing unit 100, based on the vertical cross section in the Y-axis direction, which is the width direction of the flow space A. An extension line L3 connecting the ends of the plurality of pins may be formed at a second angle θ2 with respect to the horizontal surface of the cover portion 200.

The length of the plurality of fins is from the fins formed on the inlet 110 side to the fins formed on the outlet 120 side so that the heat exchange unit 300 can correspond to the bottom surface 131 of the flow space A. It can be formed as it gradually decreases.

As the extension line L3 connecting the ends of the plurality of fins is inclined with a second angle θ2, the bottom surface 134 is formed to be inclined with a second angle θ2 with respect to the cover portion 200. It can be. Accordingly, the refrigerant can flow at a faster flow rate in the outlet portion 120 than in the inlet portion 110 in the flow space A, and can achieve temperature uniformity of the plurality of heating elements (PM), and achieve cooling. It can have high performance effects.

Preferably, the second angle θ2 may be formed to range from 1 degree to 1.5 degrees.

As shown in FIG. 8, the housing portion 100 may be formed so that at least a portion of the bottom surface 134 of the flow space A has a curved portion 135 based on the direction in which the refrigerant flows. .

For example, the housing portion 100 includes a straight section formed as the height of the flow space A gradually decreases, and the height of the flow space A decreases sharply in the direction of the outlet portion 120, As shown in FIG. 8, it may include a curved section 135 that decreases to a curve on the vertical cross section of the Y-axis.

The shape of the heat exchange unit 300 and the bottom surface 134 is not necessarily limited to the drawing, and is located at a contact position where the heating element (PM) contacts the cover part 200 or a heating position where heat is generated from the heating element (PM). Accordingly, it can be formed in various forms.

As shown in FIG. 2, the power module cooling device 1000 according to an embodiment of the present invention may further include a joint 400.

The joint portion 400 may include a welding portion and a sealing portion for coupling the housing portion 100 and the cover portion 200.

The joint portion 400 may be formed to at least partially surround the edge portion of the cover portion 200.

The joint 400 is made of engineering plastic (EP), a high-performance plastic material that has excellent strength and elasticity and can withstand high temperature conditions, and is formed by the coolant whose temperature rises during the cooling process of the heating element (PM). Deformation and damage can be prevented.

The joint 400 may be formed of a transparent plastic material with a transmission layer that transmits the laser beam. Specifically, the joint portion 400 formed around the cover portion 200 is formed by melting the protrusion formed on the housing portion 100 and the surface in contact with the protrusion through a laser beam irradiated from a laser welding device to form a cover portion. It can be conjugated with (200).

At this time, it may be desirable to compress the housing portion 100 and the cover portion 200 with a predetermined pressure using a compression device so that the cover portion 200 and the protrusion portion can be bonded.

Additionally, the joint 400 may include a sealing member formed around the welded portion to prevent leakage of the refrigerant due to voids generated in the process of forming the welded portion. Accordingly, after welding the housing portion 100 and the cover portion 200, the sealing member made of adhesive is formed on the formed welded portion to improve sealing properties to prevent refrigerant leakage and improve cooling performance. You can.

The sealing member may be made of a polymeric adhesive material that can be combined with a volatile organic solvent and hardened after volatilization or heating. However, it is not necessarily limited thereto, and a wide variety of adhesive materials may be applied.

FIG. 9 is a table showing temperature changes of heating elements mounted at different positions according to the angles of the wall and ceiling gradients of the power module cooling device 1000 according to an embodiment of the present invention.

9, a wall gradient power module cooling device in which one side wall 131 of the heat exchange unit 300 is inclined at a first angle θ1, and the bottom surface 134 is formed at a second angle θ2. The change in temperature according to the position of the heating element (PM) of the ceiling gradient module cooling device formed to be slanted was computer simulated and presented in a table.

At this time, the wall gradient power module cooling device includes a first heating element (PM1), a second heating element (PM2), and a third heating element (PM3) in order from the inlet 110 to the outlet 120, as shown in FIG. In the seated state, the heat generation location is 8.4mm to the left of the center. The height of the basic fin is 11.3 mm, and the first angle θ1 of one side wall 131 is the highest of the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3) at 1 degree and 1.5 degrees, respectively. The temperature was simulated.

At this time, the ceiling gradient power module cooling device has a heating position at the center when the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3) are seated. The height of the basic fin is 11.3 mm, and the second angle θ2 of the bottom 134 is 0.5 degrees, 1 degree, and 1.5 degrees, respectively, for the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3). ) was simulated.

Based on the experiment, when the height of the fins of the heat exchanger 300 is 11.3 mm, the highest temperatures of the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3) are 118.26°C and 121.2°C, respectively. , it was found to be 123.3℃.

In the wall gradient power module cooling device, when the first angle θ1 at which one side wall 131 of the heat exchanger 300 is inclined is 1 degree, the temperatures of the heating elements PM1, PM2, and PM3 are 118.19°C and 120.76°C, respectively. ℃, 122.43℃, compared to the above experimental standard, the temperature showed a slight decrease of -0.06%, -0.36%, and -0.71%.

Under the same conditions, when the first angle (θ1) is 1.5 degrees, the temperatures of the heating elements (PM1, PM2, PM3) are 118.33℃, 120.55℃, and 121.99℃, respectively, which is -0.06% and -0.54% compared to the above experimental standard. %, -1.06%, showing that the temperature is decreasing.

As shown in the experiment, as the first angle θ1 increases and the flow speed of the refrigerant C from the first heating element PM1 to the third heating element PM3 increases, the rate at which the temperature of the heating element on the outlet side decreases increases. Therefore, the cooling performance is effectively increased on the outlet side, and the cooling performance is significantly shown in the third heating element (PM3). As a result, the temperature uniformity of the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3) is also improved. It appears to be highly effective.

Preferably, the first angle θ1 is set to 1 degree to 1.5 degrees to most efficiently improve cooling performance.

In the ceiling gradient power module cooling device, when the second angle θ2 at which the bottom surface 134 of the heat exchanger 300 is inclined is 0.5 degrees, the temperatures of the heating elements PM1, PM2, and PM3 are 118.98°C and 121.59°C, respectively. ℃, 121.9℃, and compared to the above experimental standard, the temperature showed a slight increase of 0.61%, 0.32%, and -0.04%.

Under the same conditions, when the second angle (θ2) is 1 degree, the temperatures of the heating elements (PM1, PM2, PM3) are 118.58℃, 120.59℃, and 121.7℃, respectively, which is -0.27% and -0.5% compared to the above experimental standard. %, -1.3%, showing that the temperature decreases except for the first heating element (PM1).

Under the same conditions, when the second angle (θ2) is 1.5 degrees, the temperatures of the heating elements (PM1, PM2, PM3) are 118.17℃, 119.5℃, and 119.7℃, respectively, which is -0.08% and -1.40% compared to the above experimental standard. %, -2.92%, showing that the temperature of the heating elements (PM1, PM2, PM3) is decreasing.

As shown in the experiment, when the second angle (θ2) is 0.5 degrees, only the temperature of the third heating element (PM3) close to the outlet side decreases, and when it is 1 degree, the temperature of the second heating element (PM2) and the third heating element ( The temperature of PM3) decreased, and when it was 1.5 degrees, the temperature of all heating elements (PM1, PM2, PM3) decreased.

In particular, the slope of the bottom 134 is formed at 1.5 degrees, and as the flow speed of the refrigerant (C) from the first heating element (PM1) to the third heating element (PM3) increases, the rate at which the temperature of the heating element on the outlet side decreases increases. Therefore, the cooling performance is effectively increased on the outlet side, and the temperature of the third heating element (PM3) is significantly reduced, which shows that the temperature uniformity of the first heating element (PM1), the second heating element (PM2), and the third heating element (PM3) is also improved. It appears to be highly effective.

That is, the second angle θ2 is formed at 1 degree to 1.5 degrees to most efficiently improve cooling performance.

The power module cooling device 1000 according to various embodiments of the present invention is formed to reduce the cross-sectional area of the flow space A through which the refrigerant flows, increases cooling efficiency by increasing the speed of the refrigerant, and has a plurality of heating elements (PM). ) temperature uniformity can be maintained.

In addition, the heat exchange unit 300 is formed to correspond to the flow space A, so that the refrigerant flows faster in the heat exchange unit 300 formed at the contact position or the heat generating position, thereby enabling faster heat exchange with the heat exchange unit 300. By doing this, the temperature at which the plurality of heating elements (PM) are cooled can be uniformized, and cooling performance can be improved.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims.

A: Flow space
C: refrigerant
S: Chip
L1, L2, L3: Extension lines
PM: heating element
100: Housing part
110: inlet
120: outlet
130: bottom part
131: One side wall
132: Other side wall
133, 135: curved part
134: bottom surface
200: cover part
300: heat exchange unit
310: Multiple pins
320: Flow control unit
400: joint
1000: Power module cooling device

Claims (13)

a housing portion having an inlet portion through which the refrigerant flows in and an outlet portion through which the refrigerant flows out, and a flow space formed therein to allow the refrigerant to flow;
a cover portion on one side of which is in direct or indirect contact with at least one heating element, and on the other side of which is coupled to the housing to seal the flow space; and
a heat exchange unit formed by a plurality of fins protruding from the other surface of the cover unit and inserted into the flow space so that heat generated from the heating element can be transferred to the refrigerant;
Including,
The housing portion or the heat exchange portion,
The cross-sectional area of the flow space is formed to decrease along the direction in which the refrigerant flows,
The heat exchange part,
A wall is formed on the side of the plurality of fins on the other side of the cover portion so that the flow space can be narrowed along the direction in which the refrigerant flows, and is inserted into the flow space, so that heat is dissipated at the contact position of the heating element or in the heating element. A flow control unit selectively formed depending on the location of heat generation;
Power module cooling device, including. According to claim 1,
The housing part,
A power module cooling device wherein one side wall of the flow space is formed at a first angle with respect to the horizontal plane of the other side wall of the flow space based on the direction in which the refrigerant flows. According to claim 2,
The heat exchange part,
A first connection line connecting a plurality of pins formed to correspond to one side wall of the flow space is formed at the first angle with respect to a second connection line connecting a plurality of pins formed to correspond to the other side wall of the flow space, Power module cooling unit. According to claim 2,
The housing part,
A power module cooling device wherein at least a portion of one side wall of the flow space is formed to have a curved portion based on the direction in which the refrigerant flows. According to claim 2,
The power module cooling device wherein the first angle is formed at 1 degree to 1.5 degrees. delete According to claim 1,
The flow control unit,
A power module that is detachably formed on the cover so that it can be selectively coupled to the heat exchanger formed according to a contact position where the heating element is in contact with the cover or a heating position where heat is generated from the heating element. Cooling device. According to claim 1,
The housing part,
A power module cooling device wherein the bottom surface of the flow space is formed at a second angle with respect to the horizontal surface of the cover part based on the direction in which the refrigerant flows. According to claim 8,
The heat exchange part,
An extension line connecting the ends of the plurality of fins based on a horizontal cross-section in the direction in which the refrigerant flows is formed at the second angle with respect to the horizontal surface of the cover part to correspond to the flow space formed in the housing part. Modular cooling unit. According to claim 8,
The housing part,
A power module cooling device wherein at least a portion of the bottom surface of the flow space is formed to have a curved surface based on the direction in which the refrigerant flows. According to claim 8,
The power module cooling device wherein the second angle is formed at 1 degree to 1.5 degrees. According to claim 1,
a joint formed to surround the cover portion;
A power module cooling device further comprising a. According to claim 12,
The joint is,
A power module cooling device that is welded and joined to a protrusion formed on at least a portion of the housing using a laser welding method.

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