KR102671633B1 - Test socket and test apparatus having the same, manufacturing method for the test socket - Google Patents

Abstract

The present invention is intended to provide a test socket applicable to semiconductor packages and test boards having different pitches, a test device including the same, and a method of manufacturing the test socket. The test socket according to the present invention is a test socket that electrically mediates a test board and a device to be tested having different pitches, and includes first through holes formed at positions corresponding to terminals of the device to be tested, and corresponding to pads of the test board. A flexible circuit board having second through holes formed at each position, and having a wiring pattern formed therein so that the first through holes and the second through holes are connected to match each other, and a first conductive part formed in the first through holes. and an upper film hole is formed at each position corresponding to the second conductive part and the first conductive part formed in the second through hole, and includes an upper film of an insulating material coupled to the upper surface of the flexible circuit board.

Description

Test socket, test device including same, and method of manufacturing test socket {TEST SOCKET AND TEST APPARATUS HAVING THE SAME, MANUFACTURING METHOD FOR THE TEST SOCKET}

The present invention relates to a test socket, and more specifically, a test socket used to transmit an electrical signal by connecting a semiconductor package having different pitches and a test board of a tester, a test device including the same, and a method of manufacturing the test socket. It's about.

Currently, various types of test sockets are used to transmit electrical signals in various fields such as the electronics industry and the semiconductor industry.

As an example, a test socket is used in the testing process of a semiconductor device. Semiconductor device testing is conducted to determine whether the manufactured semiconductor device is defective. In the test process, a predetermined test signal is sent from the test device to the semiconductor device to determine whether the semiconductor device is short-circuited. These test devices and semiconductor devices are not directly connected to each other, but indirectly through test sockets.

Representative test sockets include pogo sockets and rubber sockets. In the case of a pogo socket, it is constructed by assembling individually manufactured pogo pins into a housing. Short circuits and leakages between pogo pins are less likely to occur, but this can be caused by damage to the package ball or increase in unit price. As a result, the demand for rubber sockets is increasing rather than Pogo sockets in the semiconductor test process.

A rubber socket has a structure in which a conductive part containing a large number of conductive particles is placed inside an elastic material such as silicon so as to be insulated from each other inside an insulating part made of an elastic material such as silicon. These rubber sockets have the characteristic of being conductive only in the thickness direction, and do not use mechanical means such as soldering or springs, so they are excellent in durability and have the advantage of being able to achieve simple electrical connections. Additionally, since it can absorb mechanical shock or deformation, it has the advantage of enabling smooth connection to semiconductor devices, etc.

Figure 1 schematically shows a test device 1000 having a test socket made of a conventional rubber socket used in a testing process of a device under test.

The test socket 20 shown in FIG. 1 includes a plurality of conductive parts 21 formed at positions corresponding to the terminals 11 of the device to be tested 10, and a plurality of conductive parts 21 that support the plurality of conductive parts 21 to be spaced apart from each other. Includes an insulating portion (22). The conductive portion 21 is made of a plurality of conductive particles contained within an elastic insulating material. The conventional test socket 20 is installed on a test board 30 mounted on a tester (not shown), and the upper end of the conductive part 21 is in contact with the terminal 11 of the device to be tested 10, and the lower end is in contact with the terminal 11 of the device to be tested 10. By contacting the pad 31 of the test board 30, the tester board 30 and the device under test 10 are electrically connected.

Since this conventional test socket 20 has the characteristic that the conductive portion 21 is formed in a pillar shape extending up and down, it is used when the pitch of the device under test 10 and the test board 30 are the same, and the test socket 20 is used when the pitch of the test board 30 is the same. There is a problem that it cannot be used when the test device 10 and the test board 30 have different pitches.

If the pitch of the terminal 11 of the device under test 10 is changed, the pitch of the pad 31 of the existing test board 30 must also be changed to have the same pitch as the pitch of the device under test 10. However, manufacturing a new test board 30 requires a lot of money and time, which inevitably increases test costs and reduces work efficiency.

Therefore, conventionally, in order to use the test board 30 as is, a pitch conversion printed circuit board 50 is formed on the lower socket 20 having the same pitch as the pitch of the test board 30, and the wiring pattern 51 with the pitch converted is formed on the lower socket 20 having the same pitch as the test board 30. ) is placed and the upper socket 40 having the same pitch as the tested device 10 is placed between the tested device 10 with a different pitch and the pitch conversion printed circuit board 50 to proceed with the test. is being considered.

FIG. 2 schematically shows a conventional test apparatus 2000 used in a test process of a test board and a device to be inspected having different pitches.

As shown in Figure 2, in order to connect the conductive portion 41 of the upper socket and the conductive portion 21 of the lower socket between the upper socket 40 and the lower socket 20 having different pitches, an upper pad 52 and A printed circuit board 50 for pitch conversion having a lower pad 53 is placed to electrically connect the terminal 11 of the test device 10 with a different pitch and the pad 31 of the test board 30. Conduct the test.

However, in the conventional test device 2000, signals are transmitted through the upper socket 40, the printed circuit board 50 for pitch conversion, and the lower socket 20, so the length of the signal transmission path that transmits the test signal is long, resulting in high speed. It has the problem of being difficult to apply to products that transmit signals.

In addition, the cost of separately manufacturing the upper socket 40 and the pitch conversion printed circuit board 50 increases, and work efficiency is reduced because testing is not performed during manufacturing time.

In addition, the printed circuit board 50 for pitch conversion has a problem in that the circuit for converting the pitch must be formed in multiple layers, so the thickness of the entire printed circuit board increases, and the cumulative tolerance increases accordingly.

In addition, since it must be manufactured with a multi-layer printed circuit board, there is a problem that the cost further increases.

Registered Patent Publication No. 10-1866427 (June 12, 2018)

The present invention was conceived in consideration of the above-described points, and its purpose is to provide a test socket applicable to semiconductor packages and test boards having different pitches, a test device including the same, and a method of manufacturing the test socket. .

The test socket according to the present invention for solving the above-described object is a test socket that electrically mediates a test board and a device to be tested having different pitches, wherein a test socket is formed at each position corresponding to a terminal of the device to be tested. A flexible circuit board having one through hole and second through holes formed at positions corresponding to pads of the test board, and having a wiring pattern formed therein to connect the first through holes and the second through holes to match each other. ; a first conductive portion formed in the first through hole and a second conductive portion formed in the second through hole; and an upper film of an insulating material in which an upper film hole is formed at each position corresponding to the first conductive portion and is coupled to the upper surface of the flexible circuit board.

The first conductive part and the second conductive part may be formed in an elastic insulating material in which a plurality of conductive particles are aligned in the thickness direction of the flexible circuit board.

Lower film holes are formed at positions corresponding to the first conductive portion and the second conductive portion, and may include a lower film of an insulating material coupled to the lower surface of the flexible circuit board.

The first conductive portion may have an upper bump of the first conductive portion that protrudes upward from the upper film.

The second conductive part may have a lower bump of the second conductive part protruding lower than the lower film.

A test device equipped with a test socket according to the present invention is a test device for testing a device under test by connecting a device under test with a different pitch to a test board, wherein a test signal from the test board is transmitted to the device under test. a test socket that electrically mediates the test board and the device to be tested so that the test board can be transmitted; and a socket housing that accommodates the test socket and guides the device to be tested to the test socket, wherein the test socket includes a first through hole formed at each position corresponding to a terminal of the device to be tested, and a flexible circuit board having second through holes formed at positions corresponding to pads of the test board, and having a wiring pattern formed therein to connect the first through holes and the second through holes to match each other; a first conductive portion formed in the first through hole and a second conductive portion formed in the second through hole; And an upper film hole is formed at each position corresponding to the first conductive part, and an upper film is coupled to the upper surface of the flexible circuit board; wherein the second conductive part and the pad are electrically connected to each other by the socket housing. It can be configured to maintain a connected state.

The first conductive part and the second conductive part may be formed in an elastic insulating material in which a plurality of conductive particles are aligned in the thickness direction of the flexible circuit board.

Lower film holes are formed at positions corresponding to the first conductive portion and the second conductive portion, and may include a lower film coupled to the lower surface of the flexible circuit board.

A test socket according to the present invention can be manufactured as follows. A method of manufacturing a test socket that electrically connects a test board and a device having a different pitch, comprising: (a) a first through hole formed at each position corresponding to a terminal of the test device, a pad of the test board, and Preparing a flexible circuit board having second through holes formed at corresponding positions and forming a wiring pattern in which the first through holes and the second through holes are connected to match each other; (b) forming a first conductive part and a second conductive part in the first through hole and the second through hole in an elastic insulating material with a plurality of conductive particles aligned in the thickness direction of the flexible circuit board; (c) attaching an upper film with upper film holes formed at positions corresponding to the first conductive parts to the upper surface of the flexible circuit board.

And the step (b) includes filling the first through hole and the second through hole with a conductive particle mixture containing a plurality of conductive particles in an elastic insulating material, and filling the first through hole and the second through hole. Applying a magnetic field in the vertical direction to the filled conductive particle mixture so that a plurality of conductive particles in the elastic insulating material are aligned in the thickness direction of the flexible circuit board, and curing the conductive particle mixture in which the plurality of conductive particles are aligned. It can be included.

The test device according to an embodiment of the present invention has the advantage of being able to use an existing test board as is even if the pitch of the device under test is changed by using a test socket capable of pitch conversion.

In addition, the test device according to an embodiment of the present invention can test devices under test and test boards with different pitches using only test sockets, so the length of the signal transmission path that transmits the test signal can be reduced, thereby reducing the length of the signal transmission path that transmits the test signal. Applicable to products that transmit .

In addition, the test device according to an embodiment of the present invention does not require separately manufacturing a printed circuit board for pitch conversion and an upper socket, which were conventionally used to test devices to be inspected and test boards having different pitches, thereby reducing test costs. Saves money and improves work efficiency.

In addition, the test device according to an embodiment of the present invention enables testing of the test device 100 and the test board 300 having different pitches with only one test socket, which has the effect of reducing the overall thickness of the test device. There is.

In addition, the test device according to an embodiment of the present invention reduces the thickness of the test socket, reduces height tolerance, and shortens the length of the signal transmission path, enabling it to respond to high-speed signal transmission.

Figure 1 shows a test device with a conventional test socket.
Figure 2 shows a conventional test device used in the test process of a test board and a device under test having different pitches.
Figure 3 shows a test device with a test socket according to an embodiment of the present invention.
Figure 4 shows a test socket according to an embodiment of the present invention.
Figure 5 shows the process of manufacturing a test socket according to an embodiment of the present invention.

Hereinafter, a test socket according to the present invention, a test device including the same, and a method of manufacturing the test socket will be described in detail with reference to the drawings.

FIG. 3 shows a test device with a test socket according to an embodiment of the present invention, FIG. 4 shows a test socket according to an embodiment of the present invention, and FIG. 5 shows a test device according to an embodiment of the present invention. This shows the process of manufacturing a socket.

As shown in the drawing, the test device 3000 with the test socket 200 according to an embodiment of the present invention connects the test device 100 and the test board 300 with different pitches to the test device ( It is a test device for testing 100), and is a test socket ( 200) and a socket housing 400 that accommodates the test socket 200 and guides the device under test 100 to the test socket, and the test socket 200 corresponds to the terminal 101 of the device under test. It is provided with a first through hole 201 formed at each position and a second through hole 202 formed at each position corresponding to the pad 301 of the test board, and the first through hole 201 and the second through hole 201 are provided at each position. A flexible circuit board with a wiring pattern 230 formed inside the holes 202 to match each other, a first conductive portion 210 formed in the first through hole 201, and a second through hole 202. Upper film holes 242 are formed at positions corresponding to the second conductive portion 220 and the first conductive portion 210 formed in the upper film 240 of an insulating material coupled to the upper surface of the flexible circuit board. It is characterized in that the second conductive portion 220 and the pad 301 are maintained electrically connected by the socket housing 400.

Hereinafter, the test socket 200 according to an embodiment of the present invention is installed on the test board 300 to transmit an electrical signal between the test board 300 and the device under test 100 with different pitches. This is explained using an example. FIG. 3 illustrates a test apparatus 3000 including a test board 300 having a wide pitch interval and a test socket 200 used for a device under test 100 having a narrow pitch interval.

The test socket 200 has first through holes 201 formed at positions corresponding to the terminals 101 of the device under test, and second through holes 202 formed at positions corresponding to the pads 301 of the test board. ), and a flexible circuit board 250 formed therein with a wiring pattern 230 connected to match the first through hole 201 and the second through hole 202, respectively, and the first through hole 201 The first conductive part 210 formed in the second through hole 202, the second conductive part 220 formed in the second through hole 202, and upper film holes 242 are formed at positions corresponding to the first conductive part 210. and includes an upper film 240 coupled to the upper surface of the flexible circuit board.

The flexible circuit board 250 forms the body of the test socket 200 and may be composed of a flexible printed circuit board (Flexible Printed Circuit Board, hereinafter referred to as 'FPCB') capable of configuring a circuit therein.

Flexible Printed Circuit Board (FPCB) is an electronic component developed as the miniaturization and weight reduction of electronic products accelerates. It is a printed circuit board made using polyimide, a flexible material, as the main material. It has excellent workability, heat resistance, bending resistance, Because it has excellent chemical resistance and is heat resistant, it is widely used as a key component in all electronic products. These flexible printed circuit boards (FPCB) have the advantage of being thin and flexible, easy to stack, and capable of independent three-dimensional wiring.

As shown in (a) of FIG. 5, the flexible circuit board 250 is provided with a first through that penetrates in the thickness direction of the flexible circuit board 250 at each position corresponding to the terminal 101 of the device under test having a small pitch. A hole 201 is formed, and a second through hole 202 penetrating in the thickness direction of the flexible circuit board 250 is formed at each position corresponding to the pad 301 of the test board having a large pitch. The first through hole 201 and the second through hole 202 are areas where conductive parts, which will be described later, will be formed, and a plating layer 203 is formed on their inner walls using a metal material.

A wiring pattern 230 is formed inside the flexible circuit board 250 to connect the first through hole 201 and the second through hole 202 to match each other. That is, the wiring pattern is such that one first through hole 201 and one second through hole 202 are connected, and each first through hole 201 and second through hole 202 are connected to match each other. do. The wiring pattern 102 may be formed in the process of stacking multi-layer flexible printed circuit boards.

The first conductive portion 210 is disposed in the first through hole 201 formed at each position corresponding to the terminal 101 of the device under test, and the second through hole 201 is formed at each position corresponding to the pad 301 of the test board. A second conductive portion 220 is disposed in the hole 202. Accordingly, the first conductive portion 210 is connectable to the terminal 101 of the device under test, and the second conductive portion 220 is connectable to the pad 301 of the test board.

The first conductive portion 210 and the second conductive portion 220 are matched one-to-one and electrically connected by the wiring pattern 230. Therefore, the electrical signal transmitted to the first conductive portion 210 is transmitted as is to the second conductive portion 220, and the electrical signal transmitted to the second conductive portion 220 is transmitted as is to the first conductive portion 210. .

The first conductive portion 210 and the second conductive portion 220 may be formed in an elastic insulating material in which a plurality of conductive particles are aligned in the thickness direction of the flexible circuit board.

The elastic insulating material constituting the conductive part may be a heat-resistant polymer material with a cross-linked structure, for example, silicone rubber, etc., and the conductive particles constituting the conductive part may be magnetic so that they can react with a magnetic field. For example, particles of metal showing magnetic properties such as iron, nickel, cobalt, etc., or alloy particles thereof, or particles containing these metals, or these particles are used as core particles, and gold, silver, One plated with a metal with good conductivity, such as palladium or radium, can be used.

In addition, the upper film 240 made of an insulating material with upper film holes 242 formed at positions corresponding to the first conductive portion 210 may be coupled to the upper surface of the flexible circuit board 250. Here, the upper surface of the flexible circuit board 250 refers to the side of the device under test 10, and the lower side refers to the side of the test board 30. The upper film 240 insulates between the conductive parts and prevents the terminal 101 of the device under test from contacting the plating layer 203 formed on the inner surface of the first through hole 201 where the first conductive part 210 is disposed. It supports the upper bump 211 of the first conductive part, which will be described later, and performs the function of insulating between the second conductive part 220 and the socket housing 400.

The first conductive portion 210 may include a first conductive portion upper bump 211 that protrudes upward from the upper film. The upper bump 211 of the first conductive part protrudes above the upper film 240 and serves to easily contact the terminal 101 of the device under test.

Additionally, the first conductive portion 210 may include a lower bump 212 of the first conductive portion that protrudes downward from the flexible circuit board 250 . The lower bump 212 of the first conductive part is supported on the test board 300 when the device under test 100 is pressed and can prevent the test socket 200 from bending.

The first conductive portion 210 may have a structure without the first conductive portion upper bump 211 and the first conductive portion lower bump 212, and may include the first conductive portion upper bump 211 and the first conductive portion lower bump 212. The structure may have only one of (212), or it may have a structure having both the upper bump 211 of the first conductive part and the lower bump 212 of the first conductive part.

And a lower film 241 made of an insulating material with lower film holes 243 formed at positions corresponding to the first conductive portion 210 and the second conductive portion 220 is coupled to the lower surface of the flexible circuit board 250. You can. The lower film 241 insulates between the conductive parts and prevents the pad 301 of the test board from contacting the plating layer 203 formed on the inner surface of the second through hole 202 where the second conductive part 220 is disposed. And, when the first conductive part lower bump 212 or the second conductive part lower bump 222 is formed, it functions to support them.

The second conductive portion 220 may include a lower second conductive portion bump 222 that protrudes downward from the lower film 241 . The lower bump 222 of the second conductive part protrudes lower than the lower film and serves to easily contact the pad 301 by pressing it against the pad 301 of the test board.

The test device 3000 according to an embodiment of the present invention includes a socket housing 400 that accommodates the test socket 200 and guides the device under test 100 to the test socket 200.

The socket housing 400 is coupled to the test board 300, accommodates the test socket 200 therein, and has a first conductive portion that contacts the terminal 101 of the device under test 100 of the test socket 200. The upper surface of the portion where (210) is placed has an open shape. A guide portion 402 that guides the device under test 100 toward the test socket 200 and a seating portion 401 on which the device under test 100 is seated are formed in the open portion of the socket housing 400.

The socket housing 400 presses the portion where the second conductive portion 220 of the test socket 200 is formed to connect the second conductive portion 220 of the test socket 200 to the pad 301 of the test board 300. It is coupled to the test board 300 in a compressed state. Accordingly, the second conductive portion 220 and the pad 301 remain electrically connected by the socket housing 400. This is shown in an enlarged view in FIG. 3.

In this way, coupling the socket housing 400 to the test board 300 in a state in which the second conductive portion 220 of the test socket 200 is pressed to the pad 301 of the test board 300 is used during testing. 1 The terminal 101 of the device to be inspected presses the first conductive portion 210 at the top of the portion where the conductive portion 210 is disposed, so that the terminal 101 of the device to be inspected and the first conductive portion 210 are electrically connected. Even if connected, the pressing force does not reach the second conductive part 220, so the second conductive part 220 and the pad 301 are maintained in a state of constant connection in advance by the socket housing 400.

A test device according to one embodiment of the present invention operates as follows.

In order to test devices under test 100 having different pitches, a picker (not shown) adsorbs the device under test 100 to the upper side of the test socket 200 where the first conductive portion 210 in the socket housing 400 is disposed. Located in . At this time, the guide part 402 guides the device under test 100 onto the test socket 200 and is seated in a fixed position by the seating part 401. Next, when a pusher (not shown) presses the device to be inspected 100, the terminal 101 of the device to be inspected and the first conductive portion 210 are electrically connected, and the first conductive portion 210 and the wiring pattern ( It is electrically connected to the pad 301 of the test board through the second conductive portions 220 that are respectively connected to each other in a matching manner 230. That is, since the second conductive portion 220 and the pad 301 are previously connected, the test board 300 and the device under test 100 are electrically connected by pressing the device under test 100 to the test socket 200. It is connected to.

When the test board 300 and the device under test 100 are electrically connected, the test signal from the test board 300 is transmitted to the device under test 100, and a test for defects in the device under test 100 is conducted. do.

As described above, the test device according to an embodiment of the present invention uses a test socket capable of pitch conversion, so that the existing test board 300 can be used as is even if the pitch of the device under test 100 is changed. There is.

In addition, since the device under test 100 and the test board 300 having different pitches can be tested using only the test socket 200, the length of the signal transmission path that transmits the test signal can be reduced, allowing high-speed signal transmission. There is an effect that can be applied to products that use

In addition, since there is no need to separately manufacture a printed circuit board for pitch conversion and an upper socket to test the device under test 100 and the test board 300 having different pitches, test costs are reduced and work efficiency is improved. It works.

In addition, the device under test 100 and the test board 300 having different pitches can be tested using only one test socket, which has the effect of reducing the overall thickness of the test device.

In addition, the thickness of the test socket is reduced, reducing height tolerance, and the length of the signal transmission path is shortened, making it possible to respond to high-speed signal transmission.

Figure 5 shows the process of manufacturing a test socket according to an embodiment of the present invention.

As shown in the drawing, a test socket that electrically connects a device under test with a different pitch and a test board according to an embodiment of the present invention can be manufactured in the following manner.

First, as shown in (a) of FIG. 5, first through holes 201 are formed at each position corresponding to the terminal 101 of the device under test, and are formed at each position corresponding to the pad 301 of the test board. A flexible circuit board 250 is prepared, which is provided with a second through hole 202 and on which a wiring pattern 230 is formed in which the first through hole 201 and the second through hole 202 are connected in a matching manner.

Next, as shown in (b) of FIG. 5, a plurality of conductive particles are aligned in the first through hole 201 and the second through hole 202 in the elastic insulating material in the thickness direction of the flexible circuit board. A first conductive portion 210 and a second conductive portion 220 are formed, respectively.

In this step, a conductive particle mixture containing a plurality of conductive particles in an elastic insulating material is connected to the flexible circuit board 250 with the first through hole 201 and the second through hole 202 filled with the first through hole 201. and placing the magnetic pole in a mold formed at a position corresponding to the second through hole 202, and applying a magnetic field to the magnetic pole so that a magnetic field is formed in the vertical direction in the conductive particle mixture filled in the first through hole and the second through hole, The first conductive portion 210 and the 2 Form the conductive portion 220 and remove the mold.

Next, as shown in (c) of FIG. 5, the upper film 240 in which the upper film holes 242 are formed at each position corresponding to the first conductive portion 210 is attached to the upper surface of the flexible circuit board.

At this stage, as shown in (c) of FIG. 5, the lower film 241 in which lower film holes 243 are formed at positions corresponding to the first and second conductive parts 210 and 220 is connected to the flexible circuit. The test socket 200 can also be completed by attaching it to the bottom of the board.

Although the present invention has been described above with preferred examples, the scope of the present invention is not limited to the form described and shown above.

For example, in the present invention, the case where the pitch between the terminals of the device under test is smaller than the pitch between the pads of the test board is exemplarily explained, but when the pitch between the terminals of the device under test is greater than the pitch between the pads of the test board. It can also be applied.

Although the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, those skilled in the art will be able to understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

100: Device to be tested 101: Terminal
200: test socket 201: first through hole
202: second through hole 210: first conductive portion
211: upper bump of the first conductive part 212: lower bump of the first conductive part
220: second conductive part 222: second conductive part lower bump
230: Wiring pattern 240: Upper film
241: lower film 242: upper film hole
243: lower film hole 250: flexible circuit board
300: test board 301: pad
400: Socket housing 401: Seating part
402: Guide unit 1000, 2000, 3000: Test device

Claims (10)

In a test socket that electrically connects a device under test with a different pitch and a test board,
a first through hole formed at each position corresponding to a terminal of the device to be inspected, and a second through hole formed at each position corresponding to a pad of the test board, wherein the first through hole and the second through hole are A flexible circuit board with wiring patterns formed therein that are connected to match each other;
a first conductive portion formed in the first through hole and a second conductive portion formed in the second through hole; and
An upper film hole is formed at each position corresponding to the first conductive part, and an upper film of an insulating material is coupled to the upper surface of the flexible circuit board,
A test socket, wherein the first conductive part and the second conductive part are formed in an elastic insulating material with a plurality of conductive particles aligned in the thickness direction of the flexible circuit board. delete According to claim 1,
A test socket comprising a lower film hole formed at each position corresponding to the first conductive part and the second conductive part, and a lower film made of an insulating material coupled to the lower surface of the flexible circuit board. According to claim 3,
A test socket, wherein the first conductive portion has an upper bump that protrudes upward from the upper film. According to claim 3,
A test socket, wherein the second conductive portion has a lower bump protruding downward from the lower film. In a test device for testing a device under test by connecting a device under test with a different pitch to a test board,
a test socket that electrically mediates the test board and the tested device so that the test signal of the test board can be transmitted to the tested device; and
A socket housing that accommodates the test socket and guides the device to be tested to the test socket,
The test socket is,
a first through hole formed at each position corresponding to a terminal of the device to be inspected, and a second through hole formed at each position corresponding to a pad of the test board, wherein the first through hole and the second through hole are A flexible circuit board with wiring patterns formed therein that are connected to match each other;
a first conductive portion formed in the first through hole and a second conductive portion formed in the second through hole; and
an upper film hole is formed at each position corresponding to the first conductive part, and an upper film is coupled to the upper surface of the flexible circuit board;
The second conductive portion and the pad are maintained electrically connected by the socket housing,
A test device characterized in that the first conductive part and the second conductive part are formed in an elastic insulating material with a plurality of conductive particles aligned in the thickness direction of the flexible circuit board. delete According to claim 6,
A test device comprising a lower film hole formed at each position corresponding to the first conductive part and the second conductive part, and a lower film coupled to the lower surface of the flexible circuit board. In the method of manufacturing a test socket that electrically connects a test board and a device to be inspected with different pitches,
(a) provided with first through holes formed at positions corresponding to terminals of the device to be inspected, and second through holes formed at positions corresponding to pads of the test board, wherein the first through holes and the second through holes are formed at positions corresponding to the terminals of the test board. Preparing a flexible circuit board on which a wiring pattern is formed in which through holes are connected in a matching manner;
(b) forming a first conductive part and a second conductive part in the first through hole and the second through hole in an elastic insulating material with a plurality of conductive particles aligned in the thickness direction of the flexible circuit board;
(c) attaching an upper film with upper film holes formed at positions corresponding to the first conductive parts to the upper surface of the flexible circuit board,
In step (b),
filling the first through hole and the second through hole with a conductive particle mixture containing a plurality of conductive particles in an elastic insulating material;
Applying a magnetic field in the vertical direction to the conductive particle mixture filled in the first through hole and the second through hole so that a plurality of conductive particles in the elastic insulating material are aligned in the thickness direction of the flexible circuit board;
A method of manufacturing a test socket, comprising the step of curing the conductive particle mixture in which the plurality of conductive particles are aligned. delete

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