KR102662861B1 - Printed circuit board and battery module having the same - Google Patents

Abstract

A printed circuit board according to one aspect of the present invention includes an insulating layer; and a metal layer located inside the insulating layer, with an end protruding from one side of the insulating layer.

Description

Printed circuit board and battery module including the same {PRINTED CIRCUIT BOARD AND BATTERY MODULE HAVING THE SAME}

The present invention relates to a printed circuit board and a battery module including the same.

As technology development and demand for mobile devices increase, the demand for secondary batteries (rechargeable batteries) is also rapidly increasing. Unlike primary batteries, which cannot be recharged, secondary batteries are batteries that can be charged and discharged, and are used in various mobile devices as well as various devices. It is widely used as an energy source for electronic products.

Secondary batteries contain various combustible materials, and there is a risk of heat generation and explosion due to overcharge, overcurrent, and other physical external shocks, which has a major safety drawback. Therefore, such secondary batteries can be equipped with safety elements that can effectively control abnormal conditions such as overcharge and overcurrent.

Japanese Patent Publication No. 2014-007059 (published: 2014.01.16)

The purpose of the present invention is to provide a printed circuit board with improved reliability of metal tabs and a battery module including the same.

According to one aspect of the present invention, an insulating layer; And a printed circuit board including a metal layer located inside the insulating layer and an end protruding from one side of the insulating layer.

According to another aspect of the present invention, a battery cell including an electrode; and a printed circuit board coupled to the battery cell, wherein the printed circuit board includes: an insulating layer; and a metal layer located inside the insulating layer, an end of which protrudes beyond one side of the insulating layer, and an end of the metal layer protruding from one side of the insulating layer is electrically connected to an electrode of the battery cell. A battery module is provided.

1 is a diagram showing a printed circuit board according to an embodiment of the present invention.
Figure 2 is a view showing Figure 1 seen from another side.
Figure 3 is a diagram showing a printed circuit board according to an embodiment of the present invention.
Figure 4 is a diagram showing a printed circuit board according to an embodiment of the present invention.
Figure 5 is a diagram showing a printed circuit board according to an embodiment of the present invention.
6 to 8 are diagrams showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.
9 and 10 are diagrams showing a battery module according to an embodiment of the present invention.

Embodiments of a printed circuit board and a battery module including the same according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are assigned the same drawing numbers and Redundant explanations regarding this will be omitted.

In addition, terms such as first, second, etc. used below are merely identifiers to distinguish identical or corresponding components, and the same or corresponding components are not limited by terms such as first, second, etc. no.

In addition, coupling does not mean only the case of direct physical contact between each component in the contact relationship between each component, but also means that another component is interposed between each component, and the component is in that other component. It should be used as a concept that encompasses even the cases where each is in contact.

printed circuit board

1 is a diagram showing a printed circuit board according to an embodiment of the present invention. FIG. 2 is a view showing FIG. 1 viewed from another side. In particular, Figure 2(a) focuses on one side of Figure 1, Figure 2(b) shows Figure 1 as seen from the top, and Figure 2(c) shows the side view of Figure 2(b). Only the metal layer is shown.

Referring to Figures 1 and 2, a printed circuit board according to an embodiment of the present invention includes an insulating layer; and a metal layer 200 located inside the insulating layer, and an end of the metal layer 200 protrudes from one side of the insulating layer. Here, the end of the metal layer 200 protruding from one side of the insulating layer may be referred to as a 'metal tab 210'.

The insulating layer may include a first insulating layer 110 and a second insulating layer 120. The first insulating layer 110 is laminated on both sides of the metal layer 200, and the second insulating layer 120 is laminated on the first insulating layer 110.

These insulating layers (each of the first insulating layer 110 and the second insulating layer 120) are made of an insulating material such as resin, and the resin of the insulating layer may be a variety of materials such as thermosetting resin and thermoplastic resin. Specifically, the resin of the insulating layer may be epoxy resin, polyimide, BT resin, etc. Here, the epoxy resin is, for example, naphthalene-based epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, novolak-based epoxy resin, cresol novolac-based epoxy resin, rubber-modified epoxy resin, and cyclic alipha. It may be a tick-based epoxy resin, a silicon-based epoxy resin, a nitrogen-based epoxy resin, or a phosphorus-based epoxy resin, but is not limited thereto.

The insulating layer includes the resin and a fiber reinforcement material such as glass cloth, and may be, for example, prepreg (PPG). Additionally, the insulating layer is a build-up film in which the resin is filled with an inorganic filler such as silica (SiO ₂ ), and may be, for example, Ajinomoto Build-up Film (ABF). As the inorganic filler, any one of silica (SiO ₂ ), barium sulfate (BaSO ₄ ), and alumina (Al ₂ O ₃ ) may be selected and used, or a combination of two or more may be used. Inorganic fillers include calcium carbonate, magnesium carbonate, fly ash, natural silica, synthetic silica, kaolin, clay, calcium oxide, magnesium oxide, titanium oxide, zinc oxide, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, talc, mica, and hydrotal. Site, aluminum silicate, magnesium silicate, calcium silicate, calcined talc, wollastonite, potassium titanate, magnesium sulfate, calcium sulfate, magnesium phosphate, etc. may be included, so the material is not limited.

The first insulating layer 110 and the second insulating layer 120 may be made of the same material, but are not limited thereto, and the first insulating layer 110 and the second insulating layer 120 may be made of different materials. there is.

The metal layer 200 is a plate-shaped structure made of metal such as nickel (Ni), copper (Cu), and aluminum (Al). The metal layer 200 is located inside the insulating layer. Specifically, the first insulating layer 110 is laminated on the upper and lower surfaces of the metal layer 200, and the second insulating layer 120 is laminated on the first insulating layer 110. This creates a sandwich structure in which the insulating layers 110 and 120 are stacked above and below the metal layer 200.

The metal layer 200 is formed over a large area within the insulating layer, and since metal has high thermal conductivity, the metal layer 200 can improve the heat dissipation function in the plane direction.

As shown in Figures 1 and 2, the end of the metal layer 200 protrudes beyond one side of the insulating layer. The end of the metal layer 200 that protrudes from one side of the insulating layer becomes a 'metal tab 210'. In the drawing, the length of the metal tab 210 portion is shown to be shorter than the length of the non-metal tab portion, but in reality, the length of the metal tab 210 portion may be longer.

A metal foil 220 may be provided on one side of the metal layer 200. The thickness of the metal foil 220 is smaller than the thickness of the metal layer 200. In addition, the metal forming the metal layer 200 and the metal forming the metal foil 220 may be different from each other. For example, the metal layer 200 may be made of nickel, and the metal foil 220 may be made of copper.

The metal foil 220 formed on one side of the metal layer 200 may be formed on the entire surface of the metal layer 200, including the metal tab 210 portion. In this case, the metal foil 220 along with the metal tab 210 also protrudes beyond one side of the insulating layer.

Cavities C1, C2, and C3 penetrating the upper and lower surfaces of the metal layer 200 may be formed in the metal layer 200. These cavities (C1, C2, C3) may penetrate the metal layer 200 and the first insulating layer 110 laminated on the upper and lower surfaces of the metal layer 200. That is, the cavities C1, C2, and C3 collectively penetrate the metal layer 200 and the first insulating layer 110 upward and downward.

Electronic components E1 and E2 may be inserted into some cavities C1 and C2, and through vias 430 may pass through other cavities C3. The electronic components E1 and E2 may be inserted into the cavities C1 and C2 so that they are biased downward. In this case, the lower surfaces of each of the electronic components E1 and E2 may be located on the lower surfaces of the cavities C1 and C2. The sizes (thicknesses) of the electronic components E1 and E2 may be different.

The size of the electronic components (E1, E2) may be smaller than the size of the cavity (C1, C2). After the electronic components E1 and E2 are inserted into the cavities C1 and C2, the remaining space of the cavities C1 and C2 may be filled with the second insulating layer 120.

As shown in FIG. 2, the metal layer 200 may be divided into two regions. That is, the metal layer 200 may be composed of two unit metal layers 200a and 200b, and the two unit metal layers 200a and 200b are insulated from each other. Each unit metal layer (200a, 200b) has respective metal tabs (210a, 210b), and in this case, as shown in FIG. 2(a), a pair of metal tabs (210a, 210b) of the insulating layer. It protrudes beyond one side. A pair of metal tabs 210a and 210b are spaced apart from each other.

A cavity C4 is formed between the two unit metal layers 200a and 200b, so that the two unit metal layers 200a and 200b can be spaced apart from each other and electrically insulated (Figure 2(b) shows cavities other than C4 ( C1 to C3) not shown). That is, the cavity C4 is formed to cross the metal layer 200 in a planar direction and penetrates the upper and lower surfaces of the metal layer 200.

Referring again to FIG. 1, a first circuit 310 may be formed on the outer surface of the first insulating layer 110, and a second circuit 320 may be formed on the outer surface of the second insulating layer 120. . The first circuit 310 and the second circuit 320 are patterned conductors. Meanwhile, the first circuit 310 and the second circuit 320 can transmit electrical signals. Additionally, the first circuit 310 and the second circuit 320 may function as a ground.

The first circuit 310 and the second circuit 320 are made of copper (Cu), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), and It may be made of metal such as platinum (Pt) or an alloy thereof.

The printed circuit board may further include vias. Specifically, the first via 410 connects the electronic components E1 and E2 and the second circuit 320. The second via 420 connects the metal layer 200 and the second circuit 320. The third via connects the second circuits 320 located on both outer sides of the second insulating layer 120 to each other. In addition, the printed circuit board includes vias connecting the first circuit 310 and the second circuit 320, and first circuits 310 located on both outer sides of the first insulating layer 110. Additional vias connecting each other may be formed.

The first via 410 penetrates the second insulating layer 120 to connect the electrodes of the electronic components E1 and E2 and the second circuit 320. The first via 410 may be in contact with the lower surfaces of the electrodes of the electronic components E1 and E2.

The second via 420 may penetrate the first insulating layer 110 and the second insulating layer 120 so as to contact the metal foil 220 of the metal layer 200. The metal foil 220 is formed on the lower surface of the metal layer 200, and the second via 420 can penetrate the first and second insulating layers 110 and 120 located below the metal layer 200. there is.

According to the above description, the first via 410 and the second via 420 may be located on the same side with respect to the metal layer 200. That is, as shown in FIG. 1, the first via 410 and the second via 420 may be located below the metal layer 200.

However, unlike what was described above with reference to FIG. 1, the first via 410 and the second via 420 may be located on the upper side of the metal layer 200, and in this case, the first via 410 is an electronic component. It may be in contact with the upper surface of the electrodes (E1, E2), and the metal foil 220 may be formed on the upper surface of the metal layer 200.

The through via 430 may penetrate the upper and lower surfaces of the insulating layer. A cavity C3 is formed in the metal layer 200 through which the through via 430 passes. That is, the through via 430 penetrates the first insulating layer 110, the second insulating layer 120, and the metal layer 200. Cavity C3 may penetrate the metal layer 200 and the first insulating layer 110. The second insulating layer 120 may flow into the cavity C3, and the through via 430 may flow into the cavity C3 as well as the second insulating layer 120 laminated on the first insulating layer 110. The second insulating layer 120 may also penetrate.

The through via 430 may be formed by plating the inner wall of the through hole. Unlike FIG. 1, the through via 430 may have the entire inside of the through hole plated.

The printed circuit board may further include solder resist 500. The solder resist 500 is laminated on both sides of the insulating layer. Specifically, the solder resist 500 is laminated on the second insulating layer 120 to protect the second circuit 320. Meanwhile, the solder resist 500 may be provided with an opening that exposes at least a portion of the second circuit 320. The exposed second circuit 320 may function as a pad for external connection.

Figure 3 is a diagram showing a printed circuit board according to an embodiment of the present invention. Referring to FIG. 3, roughness may be formed on the outer surface of the second circuit 320. That is, the outer surface of the second circuit 320 may have irregularities. This roughness (irregularities) can improve the heat dissipation function of the printed circuit board.

The second circuit 320 having an illumination intensity may transmit an electrical signal or function as a ground. For example, of the second circuit 320, illumination may be formed in both the part that transmits electric signals and the part that functions as a ground. Additionally, illuminance may be formed only in a portion of the second circuit 320 that functions as a ground.

Additionally, the second circuit 320 having an illumination intensity may be placed near a hot spot where heat generation is concentrated, such as around the IC.

Figures 4 and 5 are diagrams showing a printed circuit board according to an embodiment of the present invention. Referring to Figure 4, the metal foil 220 is an end (metal tab) of the metal layer 200 that protrudes from one side of the insulating layer. (210)) may not be formed. Additionally, referring to Figure 5, the metal foil 220 is formed on both sides of the metal layer 200, and the metal foil 220 formed on both sides may protrude beyond one side of the insulating layer. Considering the electrical conductivity of the metal foil 220, the metal foil 220 may be configured in various forms other than those shown in FIGS. 4 and 5.

Printed circuit board manufacturing method

6 to 8 are diagrams showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 6(a), a metal layer 200 having a metal foil 220 on one side is provided.

Referring to FIG. 6(b), a first insulating layer 110 is laminated on both sides of the metal layer 200, and a layer M of a metal material may be provided on the outer surface of the first insulating layer 110. . In FIG. 6(b), the first insulating layer 110 and the metallic layer M are shown in a separated state, but the first insulating layer 110 and the metallic layer M are shown in a separated state, like a cross-section CCL (copper clad laminate). The layer (M) may be formed integrally.

Referring to FIG. 6(c), the first circuit 310 is formed from the metal layer M. The first circuit 310 may be formed using various methods such as SAP, MASP, tenting, etc. Meanwhile, the first circuit 310 is not formed where the cavity is to be formed.

Referring to FIG. 7(a), cavities C1, C2, and C3 are formed that collectively penetrate the metal layer 200 and the first insulating layer 110 upward and downward. Additionally, a cavity C4 crossing the metal layer 200 in the plane direction is also formed. Additionally, a cavity C5 for the metal tab 210 is also formed. Formation of the cavities (C1 to C5) can be achieved by various drills.

The shape of the metal layer 200 that has passed through the step of FIG. 7(a) is shown on the upper side of FIG. 7(a). The metal layer 200 is divided into two unit metal layers (200a, 200b), and the unit metal layers (200a, 200b) each have one metal tab (210a, 210b), so the metal layer 200 is a pair of metal tabs. We have (210a, 210b).

Referring to FIG. 7(b), electronic components E1 and E2 are inserted into some cavities C1 and C2. When inserting the electronic components E1 and E2, a tape may be temporarily attached to the lower surface of the first insulating layer 110 (lower surface of the first circuit 310), and the electronic components E1 and E2 It can be seated on the tape. In this case, one surface of the electronic components E1 and E2 may be located on the same plane.

Referring to FIG. 7(c), the second insulating layer 120 is stacked. The second insulating layer 120 may also include a layer M made of a metal material. The second insulating layer 120 may be filled (flowed) into the cavities C1, C2, and C3 that collectively penetrate the metal layer 200 and the first insulating layer 110 upward and downward. Additionally, the second insulating layer 120 may also be filled (flowed) into the cavity C4 across the metal layer 200 and the cavity C5 for forming the metal tab 210.

Referring to FIG. 8(a), the second circuit 320 is formed from the metal layer M. The second circuit 320 may be formed using various methods such as SAP, MASP, tenting, etc. Additionally, roughness is formed on the outer surface of the second circuit 320. That is, the outer surface of the second circuit 320 may have irregularities. The unevenness of the outer surface of the second circuit 320 may be formed by etching.

With the formation of the second circuit 320, the first via 410, the second via 420, and the through via 430 are formed. The first via 410 may be formed by plating the inside of a via hole penetrating the second insulating layer 120 to connect to the electrodes of the electronic components E1 and E2. The second via 420 may be formed by plating the inside of a via hole penetrating the first insulating layer 110 and the second insulating layer 120 to be connected to the metal foil 220. The through via 430 may pass through the cavity C3 and may penetrate the second insulating layer 120 introduced into the cavity C3.

Referring to FIG. 8(b), solder resist 500 is stacked on the second insulating layer 120. If necessary, an opening may be formed in the solder resist 500 to expose a portion of the second circuit 320.

Referring to FIG. 8(c), the first insulating layer 110 and the second insulating layer 120 are partially removed to expose the metal tab 210. Removal of the first insulating layer 110 and the second insulating layer 120 may be performed by blast or laser.

Afterwards, the exposed metal foil 220 can be removed by etching, if necessary. When the metal layer 200 and the metal foil 220 are made of different metals, only the metal foil 220 can be selectively removed by etching.

battery module

The printed circuit board described with reference to FIGS. 1 to 5 may be a protection circuit module (PCM) board coupled to a battery cell. This PCM substrate may include elements that can prevent abnormal conditions such as overcharging and overcurrent of battery cells.

Meanwhile, the battery module may be connected to the main board through a printed circuit board. Here, a connector board may be additionally coupled between the printed circuit board and the main board, or a part of the printed circuit board may serve as a board for the connector.

9 and 10 are diagrams showing a battery module according to an embodiment of the present invention.

Referring to Figure 9, the battery module includes a battery cell 10 including an electrode 11; and a printed circuit board (20) for PCM coupled to the battery cell (10). The printed circuit board 20 may be implemented in various forms as described with reference to FIGS. 1 to 5 . The metal tab 210 is electrically connected to the electrode 11 of the battery cell 10. The exposed metal tab 210 may be bonded to the electrode 11 of the battery cell 10 using solder (S).

The electrode 11 of the battery cell 10 includes a positive electrode and a negative electrode, and a pair of metal tabs 210 are joined to each of the positive and negative electrodes.

Meanwhile, referring to FIG. 10, the metal tab 210 can be bent, and the printed circuit board 20 can be shaped to surround the electrode.

Although the embodiments of the present invention have been described above, those skilled in the art will be able to understand the addition, change, deletion or addition of components without departing from the spirit of the present invention as set forth in the patent claims. The present invention can be modified and changed in various ways, and this will also be included within the scope of the rights of the present invention.

110: first insulating layer
120: second insulating layer
200: metal layer
210: Metal tab
220: Metal foil
310: first circuit
320: second circuit
410: first via
420: second via
430: Through via
500: solder resist
C1, C2, C3, C4, C5: Cavity
E1, E2: Electronic components
10: battery cell
11: electrode
20: printed circuit board
S: Solder

Claims (31)

insulating layer;
a metal layer located inside the insulating layer, the end of which protrudes from one side of the insulating layer in contact with the upper and lower sides; and
A metal foil disposed on at least a portion of one surface of the metal layer and having a thickness smaller than the thickness of the metal layer; A printed circuit board containing a.
According to paragraph 1,
The insulating layer is,
a first insulating layer laminated on both sides of the metal layer; and
A printed circuit board including a second insulating layer laminated on the first insulating layer.
According to paragraph 2,
A printed circuit board in which a cavity is formed in the metal layer and the first insulating layer, collectively penetrating the metal layer and the first insulating layer upward and downward.
According to paragraph 3,
A printed circuit board further comprising electronic components inserted into the cavity.
According to paragraph 4,
a first circuit formed on an outer surface of the first insulating layer; and
Further comprising a second circuit formed on the outer surface of the second insulating layer,
A printed circuit board further comprising a via that electrically connects the electronic component and the second circuit.
According to paragraph 1,
A printed circuit board in which a cavity is formed in the metal layer to cross the metal layer in a plane direction so that the metal layer is separated into two regions.
delete According to paragraph 1,
A printed circuit board in which the metal foil is not formed on an end of the metal layer that protrudes beyond one side of the insulating layer.
According to paragraph 2,
a first circuit formed on an outer surface of the first insulating layer; and
A printed circuit board further comprising a second circuit formed on an outer surface of the second insulating layer.
According to clause 9,
A printed circuit board wherein the roughness of the outer surface of the second circuit is greater than the roughness of the inner surface of the second circuit.
According to clause 9,
A metal foil having a thickness smaller than the thickness of the metal layer is formed on one surface of the metal layer,
A printed circuit board having a via connecting the metal foil and the second circuit.
According to paragraph 1,
Further comprising a through via penetrating the upper and lower surfaces of the insulating layer,
A printed circuit board having a cavity formed in the metal layer for the through via to pass through.
According to paragraph 1,
A printed circuit board further comprising solder resist laminated on both sides of the insulating layer.
According to paragraph 1,
A printed circuit board having a pair of ends of the metal layer that protrude from one side of the insulating layer.
According to paragraph 1,
The metal layer is a printed circuit board made of a metal containing nickel.
a battery cell including electrodes; and
Includes a printed circuit board coupled to the battery cell,
The printed circuit board is,
insulating layer;
a metal layer located inside the insulating layer, the end of which protrudes from one side of the insulating layer in contact with the upper and lower sides; and
A metal foil disposed on at least a portion of one surface of the metal layer and having a thickness smaller than the thickness of the metal layer; Including,
A battery module in which an end of the metal layer protruding from one side of the insulating layer is electrically connected to an electrode of the battery cell.
According to clause 16,
A battery module in which an end of the metal layer protruding from one side of the insulating layer and an electrode of the battery cell are soldered.
According to clause 16,
The insulating layer is,
a first insulating layer laminated on both sides of the metal layer; and
A battery module including a second insulating layer stacked on the first insulating layer.
According to clause 18,
A battery module in which a cavity is formed in the metal layer and the first insulating layer, collectively penetrating the metal layer and the first insulating layer upward and downward.
According to clause 19,
The battery module wherein the printed circuit board further includes electronic components inserted into the cavity.
According to clause 20,
The printed circuit board is,
a first circuit formed on an outer surface of the first insulating layer; and
Further comprising a second circuit formed on the outer surface of the second insulating layer,
A battery module further comprising a via that electrically connects the electronic component and the second circuit.
According to clause 16,
A battery module in which a cavity is formed in the metal layer to cross the metal layer in a plane direction so that the metal layer is separated into two regions.
delete According to clause 16,
A battery module in which the metal foil is not formed at an end of the metal layer that protrudes beyond one side of the insulating layer.
According to clause 18,
The printed circuit board is,
a first circuit formed on an outer surface of the first insulating layer; and
A battery module further comprising a second circuit formed on an outer surface of the second insulating layer.
According to clause 25,
A battery module wherein the illuminance of the outer surface of the second circuit is greater than the illuminance of the inner surface of the second circuit.
According to clause 26,
A metal foil having a thickness smaller than the thickness of the metal layer is formed on one surface of the metal layer,
A battery module in which a via is formed to connect the metal foil and the second circuit.
According to clause 16,
The printed circuit board is,
Further comprising a through via penetrating the upper and lower surfaces of the insulating layer,
A battery module in which a cavity is formed in the metal layer for the through via to pass through.
According to clause 16,
The printed circuit board is,
A battery module further comprising solder resist laminated on both sides of the insulating layer.
According to clause 16,
The battery module includes a pair of ends of the metal layer that protrude from one side of the insulating layer.
According to clause 16,
The metal layer is a battery module made of a metal containing nickel.

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