KR102660572B1 - Filter module and organometallic compound supply device including the same - Google Patents

Abstract

The present invention relates to a filter module capable of sublimating and removing filtered organometallic compound particles and an organometallic compound supply device including the same. The filter module according to the present invention is installed between discharge pipes through which the carrier gas containing the organometallic compound is discharged from the container, and filters the organometallic compound in the form of particles during the process of discharging the carrier gas containing the organometallic compound. Metal balls with good thermal conductivity are filled between the filter and the filter tube. Therefore, the organometallic compound particles filtered into the filter are sublimated by the heat transferred to the filter through the metal ball, thereby preventing the organometallic compounds in the form of filtered particles from accumulating on the filter, thereby preventing the organometallic compound particles in the form of filtered particles from accumulating on the filter, thereby producing an organometallic compound containing a stable concentration and vapor pressure. Carrier gas can be discharged.

Description

Filter module and organometallic compound supply device including the same}

The present invention relates to an organometallic compound supply device, and more specifically, to a device for filtering particulate organometallic compounds in the process of discharging a carrier gas containing organometallic compounds and effectively processing the filtered organometallic compound particles. It relates to a filter module and an organometallic compound supply device including the same.

Organometallic compounds are used as raw materials in the epitaxial growth of compound semiconductors. Organometallic compounds are often used in an organic metal vapor deposition (MOCVD) method with excellent mass production and controllability.

The organometallic compound supply device for supplying such organometallic compounds has a charging container in which the organometallic compounds are filled, and supplies a carrier gas to the filling container containing the organometallic compounds to generate a carrier gas containing the sublimated organometallic compounds. and supplied to the vapor phase growth device. That is, the organometallic compound is filled in a charging container and a carrier gas is flowing through it, so that the organometallic compound in contact with the carrier gas is introduced as vapor into the carrier gas, is taken out of the charging container along with the carrier gas, and is supplied to the vapor phase growth device. However, there was a problem in that the organometallic compounds in the form of particles were discharged together with the carrier gas containing the organometallic compounds.

To solve this problem, Korean Patent No. 10-1695356 discloses an organometallic compound supply device installed with a filter for filtering particulate organometallic compounds in a connecting passage.

The disclosed organometallic compound supply device is capable of filtering organometallic compounds in particle form through a filter, but as the filtered organometallic compounds in particle form accumulate on the filter, the carrier gas containing the organometallic compound having a stable concentration and vapor pressure There was a problem in that it could not be discharged.

Therefore, the purpose of the present invention is to filter organometallic compounds in the form of particles in the process of discharging the carrier gas containing organometallic compounds, and to supply a filter module for effectively processing the filtered organometallic compound particles and an organometallic compound containing the same. To provide a device.

In order to achieve the above object, the present invention is a filter module for an organometallic compound supply device installed between discharge pipes through which a carrier gas containing an organometallic compound is discharged from a container, one side of which is connected to a first discharge pipe close to the container, and , a filter pipe connected at the other end to a second discharge pipe distant from the vessel; A filter installed within the filter pipe and having an opening toward the second discharge pipe, the filter filtering out organometallic compounds in the form of particles during the discharge of a carrier gas containing an organometallic compound; and a metal ball filled between the filter tube and the filter and transferring heat to the filter to sublimate the organometallic compound particles filtered in the filter.

The filter pipe includes a main pipe in which the filter is installed; A first connection pipe installed on one side of the main pipe and to which the first discharge pipe is connected; and a second connection pipe installed on the other side of the main pipe and to which the second discharge pipe is connected.

The filter module according to the present invention may further include a connector on one side of which is connected to the first connector through a gasket, and on the other side of which the first discharge pipe is connected.

The filter has a cross-section shaped like the letter U, with the closed portion facing the first connector and the open portion facing the second connector.

The metal ball may be filled between the gasket, the first connector, the filter, and the main pipe.

The diameter of the metal ball is 0.5 mm to 1.5 mm.

The material of the metal ball may include at least one of aluminum, aluminum alloy, and stainless steel.

The gasket is formed with a plurality of through holes through which a carrier gas containing an organometallic compound introduced through the first discharge pipe can pass, and the size of the through holes is smaller than that of the metal ball.

The present invention also provides a container containing an organometallic compound therein; a supply pipe supplying carrier gas through one side of the container; a discharge pipe located on the other side of the container and discharging a carrier gas containing an organometallic compound generated while passing through the container; and the filter module, which is installed between the discharge pipes and filters particulate organometallic compounds contained in the carrier gas containing the organometallic compounds.

The filter module according to the present invention filters organometallic compounds in the form of particles during the discharge of the carrier gas containing organometallic compounds, and effectively transfers heat to the filter through the built-in metal ball to remove the filtered organometallic compound particles. By sublimating, it is possible to prevent organometallic compounds in the form of filtered particles from accumulating on the filter, thereby discharging a carrier gas containing organometallic compounds with a stable concentration and vapor pressure.

1 is a perspective view showing an organometallic compound supply device including a filter module according to an embodiment of the present invention.
Figure 2 is a cross-sectional view showing the filter module of Figure 1.
Figure 3 is a plan view showing the gasket of Figure 2.

It should be noted that in the following description, only the parts necessary to understand the embodiments of the present invention will be described, and descriptions of other parts will be omitted without departing from the gist of the present invention.

The terms or words used in the specification and claims described below should not be construed as limited to their usual or dictionary meanings, and the inventor should use the concept of terminology appropriately to explain his/her invention in the best way. It must be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined clearly. Therefore, the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and do not represent the entire technical idea of the present invention, and therefore, various equivalents can be substituted for them at the time of filing the present application. It should be understood that there may be variations.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings.

1 is a perspective view showing an organometallic compound supply device including a filter module according to an embodiment of the present invention. Figure 2 is a cross-sectional view showing the filter module of Figure 1. And Figure 3 is a plan view showing the gasket of Figure 2.

1 to 3, the organometallic compound supply device 100 according to an embodiment of the present invention includes a container 10, a supply pipe 20, a discharge pipe 30, and a filter module 40.

The container 10 has a space formed therein to contain the solid organometallic compound, and the space contains the solid organometallic compound.

The container 10 is described as containing a solid organometallic compound in the internal space, but is not limited to this, and is divided into an outer container and an inner container, with the solid organometallic compound provided in the inner container, and a space between the outer container and the inner container. It may be filled with a filler made of metal with good thermal conductivity. At this time, the internal container may be formed in a form that connects the supply pipe 20 and the discharge pipe 30, and may be formed in series or in parallel.

Meanwhile, organometallic compounds include indium compounds, zinc compounds, aluminum compounds, gallium compounds, magnesium compounds, hafnium compounds, zirconium compounds, titanium compounds, barium compounds, lanthanum compounds, strontium compounds, tungsten compounds, ruthenium compounds, and tantalum compounds. Indium compounds include indium trichloride, indium trifluoride, indium iodide compounds, trimethylindium, dimethylchloroindium, cyclopentadienylindium, trimethylindium-trimethylarsine adduct, and trimethylindium-trimethylphosphine adduct. . Zinc compounds include ethylzinc iodide, ethylcyclopentadienylzinc, and cyclopentadienylzinc. Aluminum compounds include methyldichloroaluminum. Gallium compounds include gallium trichloride, methyldichlorogallium, dimethylchlorogallium, gallium triiodide, and dimethylbromogallium. Magnesium compounds include biscyclopentadienylmagnesium. Hafnium compounds include hafnium chloride and tetrakis(dimethylamino)hafnium. Zirconium compounds include zirconium chloride and tetrakis(dimethylamino)zirconium. Barium compounds include bis(2,2,6,6-tetramethyl-3,5-heptanedionato)barium. Lanthanum compounds include tris(bis(trimethylsilyl)amido)lanthanum, tris(isopropylcyclopentadienyl)lanthanum, tris(ethylcyclopentadienyl)lanthanum, and tris(cyclopentadienyl)lanthanum. Strontium compounds include bis(2,2,6,6-tetramethyl-3,5-heptandionato)strontium. Tungsten compounds include tungsten hexachloride and tungsten pentachloride. These organometallic compounds are only exemplified for explanation, and the organometallic compounds applicable to the present invention are not limited to these examples.

Stainless steel (SUS) can be used as a material for the container 10, and it can be formed in a tube shape.

This container 10 includes a container body 11 and a cover plate 14.

The container body 11 has an open portion formed at the top, and a space for accommodating a solid organometallic compound is formed therein.

This container body 11 includes a main body 12 and a bottom plate 13.

The main body 12 is open on both sides and has a tube shape with a space formed inside, and a cover plate 14 is coupled to the top. And the bottom plate 13 is coupled to the open lower part of the main body 12. That is, the cover plate 14 is coupled to the upper part around the main body 12, and the bottom plate 13 is coupled to the lower part to seal the internal space. Here, the main body 12 and the bottom plate 13 may be formed as one piece.

The cover plate 14 seals the upper part of the container body 11 from the external environment. At this time, the cover plate 14 is used to connect the inside of the container body 11 and the outside of the container body 11 only through the supply pipe 20 and the discharge pipe 30 while completely blocking the container body 11 from the outside. You can.

The supply pipe 20 supplies carrier gas into the container body 11. And the supply pipe 20 is equipped with a supply valve 21 that controls the supply amount of the carrier gas. This supply pipe 20 may be formed on one side of the cover plate 14, and may supply carrier gas into the container body 11 through the cover plate 14.

And the discharge pipe 30 is connected to the container body 11 and discharges the carrier gas containing the organometallic compound generated while passing through the container body 11. And the discharge pipe 30 is equipped with a discharge valve 31 that controls the discharge amount of the carrier gas containing the organometallic compound. This discharge pipe 30 may be formed on the other side of the cover plate 14, and may discharge the carrier gas containing the organometallic compound generated while passing through the cover plate 14 and the container body 11. .

And the filter module 40 may be installed on the path of the discharge pipe 30. That is, the filter module 40 is installed on the discharge pipe 30 path between the container 10 and the vapor phase growth device (not shown), and the carrier gas flowing in from the supply pipe 20 is stored in the organometallic compound in the container body 11. While passing through, the carrier gas containing the organometallic compound is discharged through the discharge pipe 30, and the organometallic compound in the form of particles among the carrier gas containing the organometallic compound is filtered.

The filter module 40 is installed on the path of the discharge pipe 30 as described above. Here, the discharge pipe 30 includes a first discharge pipe 33 interposed between the container 10 and the filter module 40, and a second discharge pipe 35 interposed between the filter module 40 and the vapor phase growth device. .

This filter module 40 includes a filter tube 47, a filter 55, and a metal ball 57. The filter tube 47 is connected on one side to a first discharge pipe 33 close to the container 10, and on the other side is connected to a second discharge pipe 35 far from the container 10. The filter 55 is built into the filter pipe 47 and an opening is formed toward the second discharge pipe 35. The filter 55 filters organometallic compounds in the form of particles while the carrier gas containing the organometallic compounds is discharged. The metal ball 57 is filled between the filter tube 47 and the filter 55, and transfers heat to the filter 55 to sublimate the organometallic compound particles filtered in the filter 55.

Here, the filter tube 47 filters the organometallic compound particles and sublimates the filtered organometallic compound particles. This filter pipe 47 includes a main pipe 49, a first connection pipe 51, and a second connection pipe 53. The main pipe 49 has a filter 55 built into it. The first connection pipe 51 is installed on one side of the main pipe 49, and the first discharge pipe 33 is connected to it. And the second connection pipe 53 is installed on the other side of the main pipe 49, and the second discharge pipe 35 is connected to it.

The main pipe 49 is in the form of a cylindrical pipe with both sides open, and first and second connection pipes 51 and 53 are coupled to both sides.

A connector 41 is connected to the first connector 51 via a gasket 43. That is, one side of the connector 41 is connected to the first connector 51 through a gasket 43, and the other side is connected to the first discharge pipe 33. The carrier gas containing the organometallic compound that has passed through the first discharge pipe 33 is injected into the filter pipe 49 through the gasket 43 of the connector 41.

The filter 55 has a U-shaped cross-section and is installed in the filter tube 49 with the closed portion facing the first connecting pipe 51 and the open portion facing the second connecting pipe 53. A space is formed between the filter 55 and the main pipe 49, and a carrier gas containing an organometallic compound passes through the space and is filtered.

Although not shown, a heating member is installed on the outside of the filter tube 47 to sublimate the organometallic compound particles filtered in the filter 55.

However, the open portion of the filter 55 is in contact with the filter tube 47, but since a space is formed between the filter 55 and the main tube 49, heat is distributed throughout the filter through the main tube 49. This may not be delivered evenly.

However, in the filter module 40 according to this embodiment, metal balls 57 are filled between the filter 55 and the filter tube 47. That is, the metal ball 57 is filled between the gasket 43, the first connector 51, the filter 55, and the main pipe 49. Therefore, when heat is applied to the filter tube 47 through the heating member, the heat can be transferred to the filter 55 through the metal ball 57 filled between the filter 55 and the filter tube 47. As a result, the organometallic compound particles filtered in the filter 55 can be effectively sublimated.

The diameter of the metal ball 57 is 0.5 mm to 1.5 mm. If smaller than 0.5 mm, the metal balls 57 may impede the movement of the carrier gas containing the organometallic compound. Conversely, if it is larger than 1.5 mm, the heat transferred to the filter 55 through the metal ball 57 may decrease, and the filling ratio between the filter 55 and the filter tube 47 may decrease.

The material of the metal ball 57 is a metal material with good thermal conductivity, for example, at least one of aluminum, aluminum alloy, and stainless steel may be used.

In addition, the gasket 43 is formed with a plurality of through holes 45 through which the carrier gas containing the organometallic compound introduced through the first discharge pipe 33 can pass. Since the metal ball 57 is filled inside the gasket 45, the through hole 45 is prevented from falling out toward the first discharge pipe 33 through the through hole 45 of the gasket 43. The size is smaller than the metal ball (57).

In this way, the filter module 40 according to the present embodiment filters the organometallic compounds in the form of particles in the process of discharging the carrier gas containing the organometallic compounds, and filters the organometallic compounds in the form of particles to the filter 55 through the built-in metal ball 57. By effectively transferring heat to sublimate the filtered organometallic compound particles, it prevents the organometallic compounds in the form of filtered particles from accumulating in the filter 55, thereby discharging a carrier gas containing the organometallic compound with a stable concentration and vapor pressure. can do.

Meanwhile, the embodiments disclosed in the specification and drawings are merely provided as specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is obvious to those skilled in the art that in addition to the embodiments disclosed herein, other modifications based on the technical idea of the present invention can be implemented.

10: container
11: container body
12: main body
13: Bottom plate
14: cover plate
20: supply pipe
21: supply valve
30: discharge pipe
31: discharge valve
33: first discharge pipe
35: second discharge pipe
40: Filter module
41: connector
43: gasket
45: Through hole
47: filter tube
49: Main hall
51: first connector
53: second connector
55: filter
57: metal ball
59: Temperature sensor
100: Organometallic compound supply device

Claims (15)

A filter module for an organometallic compound supply device installed between discharge pipes through which a carrier gas containing an organometallic compound is discharged from a container, comprising:
a filter tube connected on one side to a first discharge pipe close to the container and on the other side connected to a second discharge pipe distant from the container;
A filter installed within the filter pipe and having an opening toward the second discharge pipe, the filter filtering out organometallic compounds in the form of particles during the discharge of a carrier gas containing an organometallic compound; and
a metal ball filled between the filter tube and the filter and transferring heat to the filter to sublimate the organometallic compound particles filtered in the filter;
A filter module for an organometallic compound supply device comprising a. The method of claim 1, wherein the filter tube is:
a main pipe in which the filter is installed;
A first connection pipe installed on one side of the main pipe and to which the first discharge pipe is connected; and
a second connection pipe installed on the other side of the main pipe and to which the second discharge pipe is connected;
A filter module for an organometallic compound supply device comprising a. According to paragraph 2,
a connector on one side of which is connected to the first connection pipe through a gasket, and on the other side of which the first discharge pipe is connected;
A filter module for an organometallic compound supply device, further comprising: The method of claim 3, wherein the filter:
A filter module for an organometallic compound supply device, characterized in that the cross-section is in the shape of the English letter U, the closed portion faces the first connector, and the open portion faces the second connector. The method of claim 4, wherein the metal ball is:
A filter module for an organometallic compound supply device, characterized in that it is filled between the gasket, the first connector, the filter, and the main pipe. According to clause 5,
A filter module for an organometallic compound supply device, characterized in that the diameter of the metal ball is 0.5 mm to 1.5 mm. According to clause 6,
A filter module for an organometallic compound supply device, characterized in that the material of the metal ball includes at least one of aluminum, aluminum alloy, and stainless steel. The method of claim 6, wherein the gasket is:
An organometallic compound supply device characterized in that a plurality of through holes are formed to allow the carrier gas containing the organometallic compound introduced through the first discharge pipe to pass through, and the size of the through holes is smaller than the metal ball. For filter module. A container containing an organometallic compound therein;
a supply pipe supplying carrier gas through one side of the container;
a discharge pipe located on the other side of the container and discharging a carrier gas containing an organometallic compound generated while passing through the container; and
A filter module is installed between the discharge pipes and filters particulate organometallic compounds contained in the carrier gas containing the organometallic compounds,
The filter module is,
a filter tube connected on one side to a first discharge pipe close to the container and on the other side connected to a second discharge pipe distant from the container;
A filter installed within the filter pipe and having an opening toward the second discharge pipe, the filter filtering out organometallic compounds in the form of particles during the discharge of a carrier gas containing an organometallic compound; and
a metal ball filled between the filter tube and the filter and transferring heat to the filter to sublimate the organometallic compound particles filtered in the filter;
An organometallic compound supply device comprising a. The method of claim 9, wherein the filter tube is:
a main pipe in which the filter is installed;
A first connection pipe installed on one side of the main pipe and to which the first discharge pipe is connected; and
a second connection pipe installed on the other side of the main pipe and to which the second discharge pipe is connected;
An organometallic compound supply device comprising: The method of claim 10, wherein the filter module:
A connector on one side of which is connected to the first connection pipe through a gasket and on the other side of which the first discharge pipe is connected;
An organometallic compound supply device further comprising: The method of claim 11, wherein the filter:
An organometallic compound supply device, characterized in that the cross section is shaped like the letter U, the closed portion faces the second connection pipe, and the open portion faces the first connection pipe. The method of claim 12, wherein the metal ball is:
An organometallic compound supply device, characterized in that the space between the gasket, the first connection pipe, the filter, and the main pipe is filled. According to clause 13,
The diameter of the metal ball is 0.5 mm to 1.5 mm,
An organometallic compound supply device, characterized in that the material of the metal ball includes at least one of aluminum, aluminum alloy, and stainless steel. The method of claim 13, wherein the gasket is:
An organometallic compound supply device characterized in that a plurality of through holes are formed to allow the carrier gas containing the organometallic compound introduced through the first discharge pipe to pass through, and the size of the through holes is smaller than the metal ball. .

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