KR102653016B1 - 척 구동 장치 및 기판 처리 장치 - Google Patents
척 구동 장치 및 기판 처리 장치 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
Description
도 2a는 일부 실시예들에 따른 구동 장치를 설명하기 위한 사시도이다.
도 2b는 도 2a의 절단선 I-I'를 따라 취한 단면을 포함하는 사시도이다.
도 3은 일부 실시예들에 따른 자석 어셈블리에 포함된 자석 세트들을 설명하기 위한 단면도 들이다.
도 4a는 종래의 척 구동 장치의 문제점을 설명하기 위한 개략적인 개념도이다.
도 4b는 종래의 척 구동 장치의 문제점을 설명하기 위한 그래프이다.
도 5a는 일부 실시예들에 따른 척 구동 장치의 효과를 설명하기 위한 개략적인 개념도이다.
도 5b는 일부 실시예들에 따른 척 구동 장치의 효과를 설명하기 위한 그래프이다.
도 6은 일부 실시예들에 따른 기판 처리 장치를 설명하기 위한 개략적인 개념도이다.
131: 코일 베이스, 132: 코일, 133: 자석 어셈블리, 134: 자유단 지지 구조
150: 평행 판 스프링, 140: 고정단 지지 구조, 200: 가이드, 300: 슬라이더
Claims (10)
- 제1 및 제2 방향으로 연장되는 평판 형상의 베이스;
상기 베이스 상에 배치되고, 상기 제1 및 제2 방향에 수직한 제3 방향으로 이동할 수 있도록 구성된 슬라이더;
상기 베이스로부터 상기 제3 방향으로 돌출된 복수개의 고정단 지지 구조들;
상기 베이스 상에 배치되고 상기 슬라이더를 상기 제3 방향으로 지지하는 공압 실린더;
상기 베이스의 상면과 평행한 복수개의 평행 판 스프링들; 및
상기 베이스 상에 배치되고 상기 공압 실린더를 둘러싸며 상기 슬라이더를 제3 방향으로 구동시키는 모터 어셈블리를 포함하되,
상기 모터 어셈블리는,
상기 공압 실린더의 측면을 둘러싸는 중공을 갖는 평판 형태의 코일 베이스;
상기 코일 베이스 상에 배치되고, 상기 공압 실린더의 측면을 둘러싸는 코일 어셈블리; 및
상기 코일 어셈블리의 일부를 둘러싸는 자석 어셈블리;를 포함하고,
상기 코일 베이스는 상기 코일 베이스의 상면 및 하면으로부터 상기 제3 방향으로 돌출된 자유단 지지 구조들을 포함하고,
상기 복수개의 평행 판 스프링들은 각각 상기 자유단 지지 구조들과 상기 복수개의 고정단 지지 구조들을 연결시키는 것을 특징으로 하는 척 구동 장치. - 제1항에 있어서,
상기 코일 어셈블리는 상기 공압 실린더가 배치될 수 있는 내부 공간을 포함하는 코어 및 상기 코어 상에 감긴 도전성의 권선을 포함하는 것을 특징으로 하는 척 구동 장치. - 삭제
- 제1항에 있어서,
상기 복수개의 평행 판 스프링들은 로우패스 필터인 것을 특징으로 하는 척 구동 장치. - 제4항에 있어서,
상기 복수개의 평행 판 스프링들의 공진 주파수는 10Hz 내지 20Hz인 것을 특징으로 하는 척 구동 장치. - 제5항에 있어서,
상기 복수개의 평행 판 스프링들은 상기 코일 어셈블리를 둘러싸는 것을 특징으로 하는 척 구동 장치. - 제5항에 있어서,
상기 복수개의 평행 판 스프링들은 제1 방향 또는 제2 방향으로 길게 연장하는 평판 형상인 것을 특징으로 하는 척 구동 장치. - 제7항에 있어서,
상기 복수개의 평행 판 스프링들 중 일부는 상기 제3 방향으로 이격되고 상기 제3 방향으로 서로 중첩되도록 배치된 것을 특징으로 하는 척 구동 장치. - 삭제
- 제1항에 있어서,
상기 베이스 상에 배치되고, 상기 슬라이더를 둘러싸는 가이드를 더 포함하고, 상기 가이드는 에어 베어링에 의해 상기 슬라이더의 운동을 조절하도록 구성된 것을 특징으로 하는 척 구동 장치.
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KR1020180111597A KR102653016B1 (ko) | 2018-09-18 | 2018-09-18 | 척 구동 장치 및 기판 처리 장치 |
US16/390,104 US10635006B2 (en) | 2018-09-18 | 2019-04-22 | Chuck-driving device and substrate-processing apparatus |
CN201910752569.6A CN110911296B (zh) | 2018-09-18 | 2019-08-15 | 卡盘驱动装置和基底处理设备 |
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KR1020180111597A KR102653016B1 (ko) | 2018-09-18 | 2018-09-18 | 척 구동 장치 및 기판 처리 장치 |
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KR102653016B1 true KR102653016B1 (ko) | 2024-03-29 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003058258A (ja) * | 2001-08-20 | 2003-02-28 | Canon Inc | 位置決め装置 |
US20100018950A1 (en) * | 2007-03-05 | 2010-01-28 | Nikon Corporation | Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method |
US20170274418A1 (en) * | 2016-03-22 | 2017-09-28 | Canon Kabushiki Kaisha | Imprint apparatus, operation method of imprint apparatus, and article manufacturing method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5959427A (en) | 1998-03-04 | 1999-09-28 | Nikon Corporation | Method and apparatus for compensating for reaction forces in a stage assembly |
JPH11294520A (ja) | 1998-04-08 | 1999-10-29 | Canon Inc | 除振装置、これを用いた露光装置およびデバイス製造方法、ならびに除振方法 |
JP2001267220A (ja) | 2000-03-17 | 2001-09-28 | Nikon Corp | ステージ装置および露光装置 |
JP2003022960A (ja) * | 2001-07-09 | 2003-01-24 | Canon Inc | ステージ装置及びその駆動方法 |
JP2006344685A (ja) | 2005-06-07 | 2006-12-21 | Canon Inc | 露光装置 |
JP4377424B2 (ja) | 2007-07-31 | 2009-12-02 | 住友重機械工業株式会社 | 反力処理装置 |
JP5573849B2 (ja) | 2009-08-20 | 2014-08-20 | 株式会社ニコン | 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 |
JP5504840B2 (ja) | 2009-11-18 | 2014-05-28 | 株式会社ニコン | 複数の基板を重ね合わせる重ね合わせ装置、重ね合わせ方法及びデバイスの製造方法 |
JPWO2011105461A1 (ja) * | 2010-02-24 | 2013-06-20 | Nskテクノロジー株式会社 | 露光装置用光照射装置、露光装置、露光方法、基板の製造方法、マスク、及び被露光基板 |
KR102105809B1 (ko) | 2011-08-30 | 2020-05-28 | 가부시키가이샤 니콘 | 기판 처리 장치 및 기판 처리 방법, 노광 방법 및 노광 장치 그리고 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법 |
WO2014063871A1 (en) * | 2012-10-23 | 2014-05-01 | Asml Netherlands B.V. | Patterning device manipulating system and lithographic apparatuses |
JP6575192B2 (ja) * | 2015-07-14 | 2019-09-18 | 株式会社ジェイテクト | 電磁チャック、及び電磁チャックを備えた複合研削盤 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003058258A (ja) * | 2001-08-20 | 2003-02-28 | Canon Inc | 位置決め装置 |
US20100018950A1 (en) * | 2007-03-05 | 2010-01-28 | Nikon Corporation | Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method |
US20170274418A1 (en) * | 2016-03-22 | 2017-09-28 | Canon Kabushiki Kaisha | Imprint apparatus, operation method of imprint apparatus, and article manufacturing method |
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KR20200032502A (ko) | 2020-03-26 |
US20200089123A1 (en) | 2020-03-19 |
CN110911296A (zh) | 2020-03-24 |
US10635006B2 (en) | 2020-04-28 |
CN110911296B (zh) | 2023-07-25 |
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