KR102643724B1 - Laser processing device - Google Patents

Abstract

One embodiment of the present invention is a laser irradiation module configured to irradiate a laser to one or more raw materials to perform a shape processing process including a cutting process on an area including at least the surface of the raw material, and to obtain three-dimensional information about the raw material. a three-dimensional information scanner, a stage formed to place the raw materials, a drive control unit configured to control the direction of movement of the laser irradiation module or the three-dimensional information scanner, and a stage formed to control the direction of movement of the stage. Disclosed is a laser processing device including a drive control unit.

Description

Laser processing device

The present invention relates to laser processing devices.

As technology advances, products of various sizes and shapes, such as parts or finished products, are being used in various fields.

There may be various types of methods for manufacturing these parts or finished products, and the types are increasing and developing.

As an example, a cutting process through direct contact can be used when manufacturing very small structures. However, there are limits to improving the precision and productivity of this contact cutting process using, for example, a sharp blade.

Meanwhile, with the development of technology using laser beams, machining processes including cutting using laser beams are being researched.

However, as the high energy of the laser beam makes it difficult to handle and the raw materials that need to be processed become smaller, there are limits to improving precise processing characteristics using the laser beam.

The present invention can provide a laser processing device that can improve precise processing characteristics for raw materials and improve laser processing efficiency.

One embodiment of the present invention is a laser irradiation module configured to irradiate a laser to one or more raw materials to perform a shape processing process including a cutting process on an area including at least the surface of the raw material, and to obtain three-dimensional information about the raw material. a three-dimensional information scanner, a stage formed to place the raw materials, a drive control unit configured to control the direction of movement of the laser irradiation module or the three-dimensional information scanner, and a stage formed to control the direction of movement of the stage. Disclosed is a laser processing device including a drive control unit.

In this embodiment, the driving control unit may include one configured to control the laser irradiation module or the 3D information scanner to move in a plurality of directions.

In this embodiment, the stage driving control unit may be configured to control the stage unit to move in a plurality of directions.

In this embodiment, the 3D information scanner may include one configured to acquire 3D information during or after the processing process for the raw material is completed.

In this embodiment, it can be formed to implement a three-dimensional result through a processing process for the raw materials.

Other aspects, features and advantages in addition to those described above will become apparent from the following drawings, claims and detailed description of the invention.

The laser processing device according to the present invention can improve precise processing characteristics of raw materials and improve laser processing efficiency.

1 is a schematic diagram showing a laser processing device according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating an alternative embodiment of the laser irradiation module of FIG. 1.
FIG. 3 is a diagram illustrating an optional embodiment of the laser control unit of FIG. 2.
FIG. 4 is a diagram illustrating an optional embodiment of the laser irradiation module driving control unit of FIG. 1.
FIG. 5 is a diagram illustrating an optional embodiment of the 3D information scanner driving control unit of FIG. 1.
FIG. 6 is a diagram illustrating an optional embodiment of the stage driving control unit of FIG. 1.
Figure 7 is a schematic diagram showing a laser processing device according to another embodiment of the present invention.
FIG. 8 is a diagram illustrating an example of use of the laser processing device of FIG. 7.
9 is an exemplary diagram for explaining the operation of a laser processing device according to an embodiment of the present invention.
FIG. 10 is a diagram showing a modified example of FIG. 9.
Figure 11 is a schematic diagram showing a laser processing device according to another embodiment of the present invention.
FIG. 12 is a diagram illustrating an optional embodiment of the analysis control unit of FIG. 11.
13 is an exemplary diagram of a laser processing device according to an embodiment of the present invention.
FIG. 14 is a plan view seen from direction K of FIG. 13.
FIG. 15 is a side view seen from the M direction of FIG. 13.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

If an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

1 is a schematic diagram showing a laser processing device according to an embodiment of the present invention.

Referring to FIG. 1, the laser processing device 100 includes a laser irradiation module 110, a 3D information scanner 120, a stage unit 130, a laser irradiation module driving control unit 150, and a 3D information scanner driving control unit 160. ) and a stage driving control unit 170.

The laser irradiation module 110 may be configured to irradiate a laser to the raw material disposed on the stage unit 130 to perform a shape processing process including a cutting process on an area including at least the surface of the raw material. Through this, the processing process can be performed on raw materials, for example, raw materials containing polyhedrons or curved bodies, to produce a result with a desired size and shape.

The laser irradiation module 110 may be formed in various shapes to irradiate laser.

FIG. 2 is a diagram illustrating an alternative embodiment of the laser irradiation module of FIG. 1.

Referring to FIG. 2, the laser irradiation module 110' may include a laser source unit 111' and a laser control unit 112'. The laser source unit 111' may include a laser source selectively determined according to the characteristics of the raw material and the shape or size of the result after processing among various types of lasers.

The laser control unit 112' may be formed to receive a laser beam from the laser source unit 111' and radiate a laser beam to the raw material, and may include a nozzle unit at an end. As an optional embodiment, the laser control unit 112' may include one or more optical modules to form and control a precise laser beam. For example, the laser control unit 112' may include a variable focus unit, an optical axis moving unit, or an optical axis driving unit.

As a specific example, the variable focus unit can change the focal length of the laser beam and may include a plurality of lenses whose distances between each other are variable. The optical axis moving unit is used to emit the laser beam by moving a predetermined distance with respect to the reference optical axis when the laser beam that has passed through the variable focus unit is incident. The path of the laser beam is changed as it passes through the optical axis moving unit and is refracted. At this time, as an optional embodiment, the optical axis moving unit may include a first wedge window and a second wedge window that are arranged to be spaced apart from each other and arranged upside down. The first wedge window can refract the incident laser beam, and the second wedge window can be arranged upside down with respect to the first wedge window. As a specific example, the second wedge window has an axisymmetric structure with respect to the first wedge window. can be placed. The laser beam that has passed through the first wedge window is secondarily refracted in the second wedge window, and the optical axis of the laser beam that has passed through the second wedge window is moved at a predetermined distance from the reference optical axis, thereby forming the path of the laser beam. may change. As an optional embodiment, an optical axis driving unit may be provided to rotate the optical axis moving unit. Through this, the optical axis of the laser beam can be rotated, and by continuously rotating the laser beam, the processing process can be easily performed while drawing a circle on the surface of the raw material.

FIG. 3 is a diagram illustrating an optional embodiment of the laser control unit of FIG. 2.

Referring to FIG. 3, the laser control unit 112" may include a laser precision path control member 112S" or a focusing lens unit 112F".

The path of the laser beam can be changed through the laser precision path control member (112S"), for example, in one direction and in a direction crossing this, and as a specific example, the beam can be moved in two axes. Optional. As an embodiment, when the laser irradiation module driving control unit 150 drives the laser irradiation module 110', it can separately irradiate a laser beam finely through the laser precision path control member 112S", thereby providing precise control of the laser beam. You can improve your abilities. As a specific example, the laser irradiation module drive control unit 150 and the laser precision path control member 112S" can be linked to each other to perform a precise and rapid raw material processing process through sequential operation or control of movement to compensate for differences in mutual unevenness. there is.

As an example, the laser precision path control member 112S" of the laser control unit 112' may include one or more mirrors, adjusts the position of the mirror, and synchronizes with the laser irradiation module driving control unit 150 as a specific example. It can be adjusted in real time to precisely control the position of the laser beam.

As an optional embodiment, the laser precision path control member 112S" may include a first mirror and a second mirror spaced apart from each other, and the first mirror and the second mirror may move angularly or rotationally by the driving member. Through this, the first mirror can move the laser beam in one direction. The second mirror reflects the laser beam and the second mirror can move angularly or rotationally by the driving member, and through this, the laser beam can move in the first direction. 1 Can be moved in a direction that intersects the direction by the mirror.

As an optional embodiment, it may further include a focusing lens unit 112F" that focuses the laser beam that has passed through the optical axis moving unit. For example, the laser precision path control member 112S" may be connected to the optical axis moving unit and the focusing lens unit 112F. ") can be provided between.

The 3D information scanner 120 may be configured to obtain 3D information about raw materials, for example, 3D image information. As a specific example, three-dimensional information can be obtained by irradiating a laser beam to raw materials through a laser irradiation module and scanning the results during or after processing the raw materials.

By acquiring three-dimensional information about the result, it is possible to easily determine the processing quality of the result and, for example, facilitate comparison with the desired design value. As an optional embodiment, the 3D information scanner 120 can acquire 3D information about the raw material being processed even during the processing process through laser beam irradiation, making it easy to monitor processing at least once and determine the processing degree during the processing process.

In addition, the 3D information about the raw material acquired by the 3D information scanner 120 can be linked with the laser irradiation module or the laser irradiation module driving control unit, for example, by feeding back mutual information in real time to determine the irradiation position of the laser beam, The intensity and time of irradiation can be precisely controlled.

The 3D information scanner 120 can obtain 3D information about raw materials using various methods and forms. For example, the 3D information scanner 120 may irradiate a laser beam, as a specific example, a linear laser beam. When such a laser beam is irradiated to the raw material, an image acquisition member can acquire an image of the laser beam irradiated to the surface of the raw material. One or more processes may be performed on these images through an image processing member. For example, a height value is given to the point where the laser beam is irradiated compared to a preset reference line on the surface of the raw material, and three-dimensional information, for example, a three-dimensional image, can be obtained by using the overall combination of these height values. there is. At this time, the laser beam irradiation direction of the 3D information scanner 120 and the direction of the image acquisition member may be placed at a misaligned position rather than being parallel, and through this, a precise 3D image of the outer surface of the raw material can be obtained.

The stage unit 130 may be formed to place raw materials. Raw materials may include various types, and may contain, for example, inorganic materials, specifically ceramic-based materials. Additionally, the raw materials may contain organic materials and may contain resin-based materials. The raw material can be formed to contain a material that can be processed into a surface via a laser beam, and can be in the form of a single material or include a mixed or composite material structure.

Through processing of raw materials, it is possible to easily implement various fields, for example, artificial parts for teeth or structures for artificial teeth.

The laser irradiation module driving control unit 150 may transmit and control driving force to move the laser irradiation module 110 in multiple directions. Through this, the laser irradiation module 110 can proceed with the processing process while changing its relative position with respect to the raw material.

FIG. 4 is a diagram illustrating an optional embodiment of the laser irradiation module driving control unit of FIG. 1.

Referring to FIG. 4 , the laser irradiation module drive control unit 150' may include a first direction drive control unit 151' and a second direction drive control unit 152'.

The first direction drive control unit 151' can control the laser irradiation module to move in a first direction, for example, to move in one axis, or, as a specific example, to move in the X-axis direction.

The second direction drive control unit 152' may control the laser irradiation module to move in a second direction intersecting the first direction, for example, to move the laser irradiation module in a direction closer to or away from the raw material. You can control it. As a specific example, it can be controlled to move in the Z-axis direction in a direction perpendicular to the first direction.

The laser irradiation module drive control unit 150' can be driven through the first direction drive control unit 151' and the second direction drive control unit 152' using various drive members, including a motor member and a circuit member that controls the same. may be used, may include a motion state information sensing member connected thereto, and may include an encoder member as an optional embodiment.

Through this, the motion information of the first direction drive control unit 151' and the second direction drive control unit 152' of the laser irradiation module drive control unit 150' can be precisely sensed or controlled in real time, and this information can be transmitted to other devices. It can be used to move a member, for example, the stage unit 130, and as a specific example, it can be synchronized with the stage driving control unit 170 in real time to improve precise laser processing characteristics.

As an optional embodiment, the motion information of the first direction drive control unit 151' and the second direction drive control unit 152' of the laser irradiation module drive control unit 150' may be used to control the dimensional information scanner 120, Through this, if correction for additional processing is required as a result of identifying 3D image information about the result after processing the raw material, the laser irradiation module can be easily driven quickly to easily realize a laser processing result with the desired quality characteristics.

The 3D information scanner driving control unit 160 may transmit and control driving force to move the 3D information scanner 120 in multiple directions. Through this, the 3D information scanner 120 can easily obtain 3D information by scanning while changing the relative position of the raw material.

FIG. 5 is a diagram illustrating an optional embodiment of the 3D information scanner driving control unit of FIG. 1.

Referring to FIG. 5, the 3D information scanner drive control unit 160' may include a first direction drive control unit 161' and a second direction drive control unit 162'.

The first direction drive control unit 161' can control the three-dimensional information scanner to move in one direction, for example, the above-described first direction, or, as a specific example, to move in the X-axis direction.

The second direction drive control unit 162' may control the three-dimensional information scanner to move in a direction that intersects the drive direction of the first direction drive control unit 161', for example, the first direction intersects the first direction. As a second direction, as a specific example, it can be controlled to move in the Z-axis direction as a direction perpendicular to the first direction.

The three-dimensional information scanner drive control unit 160' can be driven through the first direction drive control unit 161' and the second direction drive control unit 162' using various drive members, including a motor member and a circuit that controls the same. The member may be used, may include a motion state information sensing member connected thereto, and, as an optional embodiment, may include an encoder member.

Through this, the motion information of the first direction drive control unit 161' and the second direction drive control unit 162' of the 3D information scanner drive control unit 160' can be precisely sensed or controlled in real time, and this information It can be used to move other members, for example, the stage unit 130, and as a specific example, it can be synchronized in real time with the stage driving control unit 170 to provide three-dimensional information about the result after processing precise raw materials or the state during processing. For example, 3D image information can be easily and precisely implemented.

As an optional embodiment, the motion information of the first direction drive control unit 161' and the second direction drive control unit 162' of the 3D information scanner drive control unit 160' may also be used to control the laser irradiation module 110. , through this, as a result of identifying 3D image information about the result after processing the raw material, if correction for additional processing is required, the laser irradiation module can be easily driven quickly to easily realize the laser processing result with the desired quality characteristics.

The stage unit drive control unit 170 may transmit and control driving force to move the stage unit 130 in multiple directions. For example, the stage unit drive control unit 170 may control the stage unit 130 to make angular or rotational movements in at least one direction.

FIG. 6 is a diagram illustrating an optional embodiment of the stage driving control unit of FIG. 1.

Referring to FIG. 6, the stage drive control unit 170' may include a third direction drive control unit 171', a fourth direction drive control unit 172', and a fifth direction drive control unit 173'.

The third direction drive control unit 171' may cause the stage unit to move in one direction, for example, in a third direction different from the above-described first and second directions, and in a third direction different from the above-described first and second directions. As a crossing or perpendicular direction, as a specific example, it can be controlled to move in the Y-axis direction.

The fourth direction drive control unit 172' may be formed to rotate or at least angularly move the stage unit in one direction, for example, may control the angular or rotational movement about an axis that intersects the third direction. there is.

As a specific example, the fourth direction drive control unit 172' may control the stage unit to move in the X-axis direction, which is the first direction, as a rotation axis.

The fifth direction drive control unit 173' may be formed to rotate or at least angularly move the stage unit in one direction, for example, control the angular or rotational movement about an axis that intersects the third direction. As a specific example, the rotational movement may be controlled in a direction different from the control direction of the fourth direction drive control unit 172', and may be in a direction that intersects each other.

As an optional embodiment, the fifth direction drive control unit 173' may control the stage unit to move in the Z-axis direction, which is the second direction, as a rotation axis.

The stage unit drive control unit 170' can be driven through the third direction drive control unit 171', fourth direction drive control unit 172', and fifth direction drive control unit 173' using various drive members. , a motor member and a circuit member that controls the same may be used, a motion state information sensing member connected thereto may be used, and, as an optional embodiment, an encoder member may be included.

Through this, the motion information of the third direction drive control unit 171', fourth direction drive control unit 172', and fifth direction drive control unit 173' can be precisely sensed or controlled in real time, and this information can be transmitted to other devices. It can be used to move a member, for example, the laser irradiation module 110, and as a specific example, it can easily process precise raw materials by synchronizing it with the laser irradiation module driving control unit in real time.

As an optional embodiment, the motion information of the third direction drive control unit 171', fourth direction drive control unit 172', and fifth direction drive control unit 173' can be used to control the three-dimensional information scanner 120. , through this, it is possible to precisely understand the 3D image information about the result after processing the raw materials, and through this, make a precise comparison with the desired design level, identify the level of difference accordingly, and when correction such as additional processing is necessary. By quickly driving the laser irradiation module, you can easily achieve laser processing results with desired quality characteristics.

This embodiment includes a laser irradiation module, a 3D information scanner, and a stage unit, and may include respective drive control units. Through this, it is possible to more easily perform precise machining through various processing of raw materials, for example, more precise and efficient machining than cutting tools such as physical cutting.

In addition, motion state information can be identified during each drive, each state information can be communicated with each other, the laser irradiation module and the stage unit or 3D information scanner can be linked, and synchronized when necessary.

Through this, a quick and precise machining process can be carried out. In addition, the speed and accuracy of information identification through a 3D information scanner can be improved, making it easy to determine the accuracy of processing of the result. In addition, during the processing of the resulting product, the information captured by the 3D information scanner, the processing process information of the laser irradiation module, and the original data are compared in real time to facilitate real-time monitoring and real-time laser beam correction process, thereby improving the laser processing process. Efficiency and precision can be increased, and the quality of results can be easily improved.

As a specific example, even when the original data is a three-dimensional structure with a small and complex shape, the processing process for the raw materials can be easily performed, accurately implementing the results corresponding to the original data, and improving the efficiency of the processing process. .

These small results can be applied to various fields, and when necessary, they can be usefully applied to the medical field, for example, fields applied to the human body, and as a specific example, to the dental field.

Figure 7 is a schematic diagram showing a laser processing device according to another embodiment of the present invention.

Figure 7 is a schematic diagram showing a laser processing device according to another embodiment of the present invention.

Referring to FIG. 7, the laser processing device 200 may include a laser irradiation module 210, a three-dimensional information scanner 220, a stage unit 230, a common drive control unit 250, and a stage unit drive control unit 270. You can.

For convenience of explanation, the description will focus on differences from the above-described embodiment.

The laser irradiation module 210, the 3D information scanner 220, the stage unit 230, and the stage unit driving control unit 270 are the laser irradiation module 110, the 3D information scanner 120, and the stage unit of the above-described embodiment. Since it is the same as 130 and the stage driving control unit 170 or can be modified and applied at a similar level if necessary, detailed description will be omitted.

The common drive control unit 250 may transmit and control driving force to move the laser irradiation module 210 and the 3D information scanner 220 in multiple directions.

For example, the common driving control unit 250 may cause the laser irradiation module 210 and the 3D information scanner 220 to move in one direction and a direction intersecting therewith, and as a specific example, the first direction ( It can be controlled to move in a second direction (e.g., X-axis direction) and a second direction (e.g., Z-axis direction).

Through the common driving control unit 250, the driving of the laser irradiation module 210 and the 3D information scanner 220, which are spaced apart from and facing the stage part 230 on which the raw materials are placed, can be controlled integrally, and thus the driving of the stage part 230 is possible. Convenience is improved, and information on the mutual movements of the laser irradiation module 210 and the 3D information scanner 220 can be easily communicated and linked or synchronized as needed.

FIG. 8 is a diagram illustrating an example of use of the laser processing device of FIG. 7.

Referring to FIG. 8, a laser irradiation member (LS) and a 3D scanner unit (SC) are disposed in the base unit (BP).

The laser irradiation member LS may correspond to the laser irradiation module 210 or may correspond to an area of the laser irradiation module 210, for example, an area including the laser irradiation nozzle portion.

The 3D scanner unit (SC) may correspond to the 3D information scanner 220 or may correspond to an area of the 3D information scanner 220.

The laser irradiation member (LS) and the 3D scanner unit (SC) are disposed on the base part (BP), and the laser irradiation member (LS) and the 3D scanner unit (SC) are simultaneously driven through the movement of the base part (BP). can do.

For example, the base part BP can be moved by being connected to the first direction guide part XG and the second direction guide part ZG.

As a specific example, the base part BP may move in the second direction (DZ, for example, Z-axis direction) along the second direction guide part ZG. Additionally, the base portion BP may move in the first direction (DX, for example, the X-axis direction) along the first direction guide portion (XG).

As an optional embodiment, the first direction guide unit (XG) and the second direction guide unit (ZG) are connected to each other, and one of them can move. For example, the second direction guide unit (ZG) may move in the first direction (DX, for example, the X-axis direction) while being connected to the first direction guide unit (XG). Through the movement of the second direction guide part ZG, the base part BP connected to the second direction guide part ZG may also move in the first direction (DX, for example, the X-axis direction).

Through this, the movement of the laser irradiation member (LS) and the 3D scanner unit (SC) in the first and second directions can be precisely controlled, and problems such as vibration or path deviation during movement can be easily reduced or prevented. can do.

9 is an exemplary diagram for explaining the operation of a laser processing device according to an embodiment of the present invention.

Referring to FIG. 9, an exercise state information detection member (EN) is shown, and this exercise state information detection member (EN) includes a laser irradiation module drive control unit 150, a 3D information scanner drive control unit 160, and a stage drive control unit. It is connected to (170).

Movement state information is easily detected and selectively implemented when driving the laser irradiation module drive control unit 150, the 3D information scanner drive control unit 160, and the stage drive control unit 170 through the exercise state information detection member (EN). For example, it can be arranged to communicate information to each other in real time. Although not shown, the exercise state information sensing member EN is configured as shown in each of the optional embodiments and modified examples of the laser irradiation module driving control unit 150, the 3D information scanner driving control unit 160, and the stage driving control unit 170. It can also be connected.

Additionally, of course, the exercise state information sensing member EN may also be connected to the common drive control unit 250 of FIG. 7 .

Through the exercise state information detection member (EN), the exercise information during exercise can be easily obtained through drive control for each of the laser irradiation module, 3D information scanner, and stage unit, and for example, the distance and speed of exercise can be determined. You can.

In addition, the laser irradiation module drive control unit 150, the 3D information scanner drive control unit 160, or the stage drive control unit 170 may each receive this information back through the exercise state information detection member EN, and as a specific example As such, the laser irradiation module driving control unit 150 can easily check the movement state of the laser irradiation module in real time and facilitate precise control of the laser irradiation module.

In addition, as an optional embodiment, the laser irradiation module driving control unit 150 may receive movement state information for the 3D information scanner driving control unit 160 or the stage driving control unit 170, and through this, the 3D information scanner or raw material The laser irradiation module can be controlled while synchronizing with the movement of the arranged stage, and through this, the desired precise control of the laser beam irradiation to the raw material can be easily performed.

Likewise, the 3D information scanner driving control unit 160 can receive movement state information about the laser irradiation module driving control unit 150 or the stage driving control unit 170, and the stage driving control unit 170 is the laser irradiation module driving control unit. (150) Alternatively, movement state information for the 3D information scanner driving control unit 160 may be received.

FIG. 10 is a diagram showing a modified example of FIG. 9.

Referring to FIG. 10, a plurality of motion state information sensing members (XEN, YEN, ZEN, AEN CEN) are shown, each of which is connected to a distribution unit (BU), and the distribution unit (BU) is a motion driving control unit (MTU). ), can be connected to the laser control unit (LSD) and scanner control unit (IS).

The plurality of exercise state information sensing members (XEN, YEN, ZEN, AEN CEN) may each sense different types of exercise state information.

Specifically, a first direction motion state information sensing member (XEN) detects motion state information in a first direction (eg, X-axis direction), and detects motion state information in a second direction (eg, Z-axis direction). a second direction motion state information sensing member (ZEN), a third direction motion state information sensing member (YEN) detecting motion state information in a third direction (e.g., Y-axis direction), and a rotational motion in a fourth direction. For example, a fourth direction motion state information sensing member (AEN) detecting angular motion state information with the first direction (e.g., X-axis direction) as the rotation axis and a rotational motion in the fifth direction, for example, It may include a fifth direction motion state information sensing member (CEN) that detects angular motion state information with the second direction (eg, Y-axis direction) as the rotation axis.

The plurality of motion state information sensing members (XEN, YEN, ZEN, AEN CEN) are each connected to a motion driving control unit (MTU). The motion driving control unit (MTU) may be connected to a driving unit that controls driving of the laser irradiation module, the three-dimensional information scanner, and the stage in the first, second, third, fourth, and fifth directions, For example, it may be connected to the laser irradiation module driving control unit 150, the 3D information scanner driving control unit 160, and the stage driving control unit 170.

Additionally, the plurality of motion state information sensing members (XEN, YEN, ZEN, AEN CEN) may each be connected to a laser control unit (LSD). The laser control unit (LSD) can selectively drive the laser irradiation module independently of the laser irradiation module driving control unit 150, and for example, controls the driving more precisely than the driving of the laser irradiation module driving control unit 150, and provides specific examples. It may correspond to the laser control unit 112' of FIG. 2.

Additionally, the plurality of exercise state information sensing members (XEN, YEN, ZEN, AEN CEN) may each be connected to the scanner control unit (IS). The scanner control unit (IS) may optionally control the operation of the 3D information scanner independently of the 3D information scanner driving control unit 160, for example, as a member of the 3D scanner driving control unit 160, as a specific example. Precise drive control of the linear laser beam and precise drive control of the image acquisition member can be performed.

In an optional embodiment, the distribution unit (BU) is disposed between the plurality of motion state information sensing members (XEN, YEN, ZEN, AEN CEN), the motion drive control unit (MTU), the laser control unit (LSD), and the scanner control unit (IS). It can be. The motion state information handled by the plurality of motion state information sensing members (XEN, YEN, ZEN, AEN CEN) is transmitted to the motion drive control unit (MTU), laser control unit (LSD), and scanner control unit (IS) through the distribution unit (BU). They can be transmitted independently or communicate with each other to correspond to each other, and if necessary, the form of the motion state information can be changed to be necessary for communication with the motion drive control unit (MTU), laser control unit (LSD), and scanner control unit (IS).

Figure 11 is a schematic diagram showing a laser processing device according to another embodiment of the present invention.

Referring to FIG. 11, the laser processing device 300 includes a laser irradiation module 310, a 3D information scanner 320, a stage unit 330, a laser irradiation module driving control unit 350, and a 3D information scanner driving control unit 360. ), a stage driving control unit 370, and an analysis control unit 390.

In addition, although not shown, the common driving control unit 250 of the embodiment of FIG. 7 described above may be applied.

For convenience of explanation, the description will focus on differences from the above-described embodiment.

The laser irradiation module 310, the 3D information scanner 320, the stage unit 330, the laser irradiation module driving control unit 350, the 3D information scanner driving control unit 360, and the stage unit driving control unit 370 are as described above. The laser irradiation module 110, the 3D information scanner 120, the stage unit 130, the laser irradiation module driving control unit 150, the 3D information scanner driving control unit 160, and the stage unit driving control unit 170 of the embodiment. Since it is the same or can be modified and applied at a similar level if necessary, detailed explanations are omitted.

The analysis control unit 390 irradiates a laser beam to the raw material through a laser irradiation module, and the 3D information scanner 320 obtains the result after performing a processing process, for example, a process including a cutting process in at least one area. Using 3D information, as a specific example, 3D image information, it is possible to compare with original data and quantitatively analyze the identity information of the original data.

As an optional embodiment, the original data may have information corresponding to the blueprint of the desired result, may be a digitally converted value of coordinate values as 3D information, or may include information in the form of an image.

Through the analysis control unit 390, the quality characteristics of the processing stage of the result can be evaluated, and additionally, the post-processing process for the result can be controlled according to the evaluation result.

FIG. 12 is a diagram illustrating an optional embodiment of the analysis control unit of FIG. 11.

Referring to FIG. 12 , the analysis control unit 390' may include a comparison information generation unit 391', a laser post-processing information generation unit 395', or an operation start control unit 399'.

Through the comparison information generation unit 391', the differences between the original data and the actual results after processing can be analyzed and the degree of these differences can be quantified. For example, the similarity in overall shape can be divided into 0 to 100 and displayed. Furthermore, the similarity for each area can be divided into 0 to 100 and displayed.

The laser post-processing processing information generation unit 395' compares the information about the difference generated by the comparison information generation unit 391' with predetermined setting conditions, and determines that post-processing is necessary if it corresponds to the setting conditions, Post-processing, that is, additional processing information can be generated through a laser beam. For example, additional processing information is location information that indicates the location of an area where additional cutting using a laser beam is to be performed. As a specific example, it can be obtained as coordinate values or determined as a location in the form of an image. And, from such position information, processing information using a laser beam, for example, information such as thickness, width, or length that needs to be further cut, can be calculated.

The operation start control unit 399' may start or end the operation of the laser irradiation module, and start or maintain the operation of the laser irradiation module in response to the additional processing information calculated by the laser post-processing information generation unit 395'. When the processing process corresponding to the additional processing information is completed, the operation of the laser irradiation module can be controlled to end.

FIG. 13 is an exemplary diagram of a laser processing device according to an embodiment of the present invention, FIG. 14 is a plan view viewed from the K direction of FIG. 13, and FIG. 15 is a side view viewed from the M direction of FIG. 13.

13 to 15, a laser irradiation member (LS) and a three-dimensional scanner unit (SC) are disposed, and are connected to the first direction guide part (XG) and the second direction guide part (ZG) to operate in the first direction. (DX, for example, in the X-axis direction) and a second direction (DZ, for example in the Z-axis direction). The movements and specific details of the laser irradiation member (LS) and the 3D scanner unit (SC) are the same as those in the case of FIG. 8 described above or may be modified and applied as necessary, so further detailed descriptions are omitted.

Raw material (RS) may be placed in one or more stages. For example, the raw material (RS) can be placed on the second stage (STG2) and can move angularly or rotationally along the rotational direction (CR) about an axis (CX, for example parallel to the Z axis). . At this time, the raw material (RS) can move together through the movement of the second stage (STG2).

As an optional embodiment, the second stage STG2 may be connected to the third stage STG3, for example, using a connecting member STG3B. Additionally, the connecting member (STG3B) may perform angular or rotational movement about an axis (AX, for example, parallel to the Y axis) along the rotation direction (AR) while being connected to the third stage (STG3). Through this, the second stage (STG2) connected to the connecting member (STG3B) can perform angular or rotational movement and, as a result, can move together with the raw material (RS).

As an optional embodiment, the third stage (STG3) may be connected to the first stage (STG1), and the first stage (STG1) may be connected to the third direction guide unit (YG) to move, and as a specific example, the third stage (STG1) may be connected to the third stage (STG1). It can move in a third direction (DY, for example, Y-axis direction) along the direction guide unit (YG). As a result, the raw material (RS) can move in the third direction.

Through this structure, the raw materials can make angular or rotational movements in different directions around a plurality of axes and can make one-way or reciprocating movements in a third direction. In addition, the laser irradiation module and the 3D information scanner can easily move in the first and second directions intersecting the third direction.

As a result, the processing process can be carried out precisely and quickly in the desired form by precisely radiating the laser beam from various positions in various directions to the raw materials, and processing evaluation analysis using a 3D scanner can be performed on the results during or after processing. It can be done easily. In addition, if necessary, the post-processing process can be carried out quickly and precisely to improve the speed and precision of the process of obtaining results for raw materials.

As such, the present invention has been described with reference to the embodiments shown in the drawings, but these are merely illustrative, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. . Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims.

An embodiment may be represented by functional block configurations and various processing steps. These functional blocks may be implemented in various numbers of hardware or/and software configurations that execute specific functions. For example, embodiments include integrated circuit configurations such as memory, processing, logic, look-up tables, etc. that can execute various functions under the control of one or more microprocessors or other control devices. can be hired.

Similar to how the components of the invention may be implemented as software programming or software elements, embodiments may include various algorithms implemented as combinations of data structures, processes, routines or other programming constructs, such as C, C++, , may be implemented in a programming or scripting language such as Java, assembler, etc. Functional aspects may be implemented as algorithms running on one or more processors. Additionally, embodiments may employ conventional technologies for electronic environment settings, signal processing, and/or data processing. Terms such as “mechanism,” “element,” “means,” and “configuration” may be used broadly and are not limited to mechanical and physical configurations. The term may include the meaning of a series of software routines in connection with a processor, etc.

Specific implementations described in the embodiments are examples and do not limit the scope of the embodiments in any way. For the sake of brevity of the specification, descriptions of conventional electronic configurations, control methods, software, and other functional aspects of the methods may be omitted. In addition, the connections or connection members of lines between components shown in the drawings exemplify functional connections and/or physical or circuit connections, and in actual devices, various functional connections or physical connections may be replaced or added. Can be represented as connections, or circuit connections. Additionally, if there is no specific mention such as “essential,” “important,” etc., it may not be a necessary component for the application of the present invention.

In the specification of the embodiment (particularly in the claims), the use of the term “above” and similar referential terms may refer to both the singular and the plural. In addition, when a range is described in an example, the invention includes the application of individual values within the range (unless there is a statement to the contrary), and is the same as describing each individual value constituting the range in the detailed description. . Lastly, unless the order of the steps constituting the method according to the embodiment is explicitly stated or there is no description to the contrary, the steps may be performed in an appropriate order. The embodiments are not necessarily limited by the order of description of the steps above. The use of any examples or illustrative terms (e.g., etc.) in the embodiments is merely for describing the embodiments in detail, and unless limited by the claims, the scope of the embodiments is not limited by the examples or illustrative terms. That is not the case. Additionally, those skilled in the art will recognize that various modifications, combinations and changes may be made according to design conditions and factors within the scope of the appended claims or their equivalents.

100, 200, 300: Laser processing device
110, 210, 310: Laser irradiation module
120, 220, 320: 3D image scan control unit
130, 230, 330: Stage part

Claims (5)

A laser irradiation module configured to irradiate a laser to one or more raw materials to perform a shape processing process including a cutting process on an area including at least the surface of the raw material;
A 3D information scanner configured to obtain 3D information about the raw material;
A stage portion formed to place the raw materials;
a driving control unit configured to control a movement direction of the laser irradiation module or the 3D information scanner; and
A stage driving control unit configured to control the direction of movement of the stage unit,
During laser irradiation through the laser irradiation module or scanning by the 3D information scanner, through the stage driving control unit,
The raw material is disposed on the stage unit and is formed to rotate around a first axis parallel to a direction from the stage unit to the laser irradiation module,
The raw material is formed to rotate around a second axis that intersects the first axis while being disposed on the stage,
The raw material is disposed on the stage and is formed to move linearly or reciprocally in a direction intersecting the first axis and the second axis,
The drive control unit includes a 3D information scanner drive control unit that transmits and controls driving force to move the 3D information scanner in a plurality of directions,
When driving the 3D information scanner through the 3D information scanner driving control unit, movement information of the 3D information scanner driving control unit is detected in real time,
A laser processing device comprising: the motion information of the three-dimensional information scanner driving control unit sensed in real time is synchronized with the stage driving control unit in real time, and a laser irradiation process for the raw material is performed. According to claim 1,
The drive control unit is configured to control the laser irradiation module or the three-dimensional information scanner to move in a plurality of directions. According to claim 1,
The stage driving control unit is configured to control the stage unit to move in a plurality of directions. According to claim 1,
The 3D information scanner is a laser processing device configured to acquire 3D information during or after processing the raw material. According to claim 1,
A laser processing device formed to implement a three-dimensional result through a processing process for the raw material.

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