[go: up one dir, main page]

KR102636489B1 - Manufacturing method of disensing silling socketconnector - Google Patents

Manufacturing method of disensing silling socketconnector Download PDF

Info

Publication number
KR102636489B1
KR102636489B1 KR1020230126679A KR20230126679A KR102636489B1 KR 102636489 B1 KR102636489 B1 KR 102636489B1 KR 1020230126679 A KR1020230126679 A KR 1020230126679A KR 20230126679 A KR20230126679 A KR 20230126679A KR 102636489 B1 KR102636489 B1 KR 102636489B1
Authority
KR
South Korea
Prior art keywords
sealing
mold
housing
socket
fastening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230126679A
Other languages
Korean (ko)
Inventor
지형종
Original Assignee
(주)제이앤티씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)제이앤티씨 filed Critical (주)제이앤티씨
Priority to KR1020230126679A priority Critical patent/KR102636489B1/en
Application granted granted Critical
Publication of KR102636489B1 publication Critical patent/KR102636489B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

An objective of the present invention is to solve a problem of limiting a reduction in thickness of an electronic equipment to which a socket connector for the electronic equipment is applied due to a socket shell for inducing coupling and improving an operation of a plug connector wherein the socket connector for the electronic equipment is coupled to a contact end mold of a socket mold, thereby limiting the reduction in the overall thickness of the socket connector. A manufacturing method of the socket connector for a metal injection molding sealing mold housing type dispensing sealing electronic equipment comprises a socket mold molding process, a sealing mold housing processing process, a housing assembly process, a mold frame sealing process, a housing sealing process, and a dispensing sealing process.

Description

금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법{MANUFACTURING METHOD OF DISENSING SILLING SOCKETCONNECTOR}Manufacturing method of metal injection molding sealing mold housing type dispensing sealing socket connector for electronic devices {MANUFACTURING METHOD OF DISENSING SILLING SOCKETCONNECTOR}

본 발명은 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법에 관한 것으로서, 더욱 상세하게는 전자기기용 소켓커넥터의 제조방법에 있어서, 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정과 상기 단자가공과정을 통하여 가공된 접속단자를 인서트하여 소켓몰드를 사출성형하는 단계로 이루어진 소켓몰드성형과정, 금속소재로 금속사출성형을 통하여 소켓몰드의 접속단몰드부를 실링하고 솔더단몰드부 보호를 위한 소켓몰드가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임을 갖는 실링몰드하우징을 가공하는 단계로 이루어진 실링몰드하우징가공과정, 상기 실링몰드하우징가공과정을 통해 성형된 실링몰드하우징의 소켓몰드체결공간에 소켓몰드를 삽입 체결하는 단계로 이루어진 하우징조립과정, 상기 하우징조립과정을 통하여 조립된 실링몰드하우징의 실링부와 소켓몰드 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 몰드프레임실링과정, 상기 몰드프레임실링과정으로 수지 충전을 통하여 몰드프레임실링 성형이 완료된 상태에서 실링몰드하우징의 후방부를 마감판으로 밀폐하는 단계로 이루어진 하우징밀폐과정 및 상기 하우징밀폐과정을 통하여 실링몰드하우징의 후방부를 마감판으로 밀폐상태에서 실링몰드하우징의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 디스펜싱실링과정을 포함하여 이루어져 제조된 소켓커넥터의 소켓쉘이 삭제되고 실장기기의 몸체가 소켓쉘을 형성하도록 하여 소켓커넥터의 크기가 최소화되로고 함을 목적으로 한 것이다.The present invention relates to a method of manufacturing a metal injection molded sealing mold housing type dispensing sealing socket connector for electronic devices. More specifically, to a method of manufacturing a socket connector for electronic devices, the connection terminal is processed through cutting and bending of the terminal material. A terminal processing process consisting of the steps of inserting the connection terminal processed through the terminal processing process and injection molding a socket mold, and forming the connection end mold portion of the socket mold through metal injection molding with a metal material. A sealing mold housing processing process consisting of processing a sealing mold housing that seals and forms a socket mold fastening space into which a socket mold for protecting the solder end mold is inserted and fastened, and has a mounting frame for mounting electronic devices on both sides, the sealing A housing assembly process consisting of inserting and fastening the socket mold into the socket mold fastening space of the sealing mold housing formed through the mold housing processing process, and coupling between the sealing portion of the sealing mold housing assembled through the housing assembly process and the socket mold. A mold frame sealing process consisting of the step of filling resin for overwaterproofing, and a housing sealing process consisting of the step of sealing the rear portion of the sealing mold housing with a finishing plate when the mold frame sealing molding is completed through resin filling through the mold frame sealing process. Process and a dispensing sealing process consisting of forming a seal through dispensing on the sealing surface of the sealing portion of the sealing mold housing while sealing the rear portion of the sealing mold housing with a finishing plate through the housing sealing process. The purpose is to minimize the size of the socket connector by removing the socket shell of the socket connector and allowing the body of the mounting device to form the socket shell.

일반적으로, 전자기기용 소켓커넥터는 전자기기에 실장되어서 플러그커넥터와 전기적 접속되어 충전 및 외부기기와의 데이터 전송이 이루어진도록 하는 것이다.Generally, a socket connector for an electronic device is mounted on an electronic device and electrically connected to a plug connector to enable charging and data transmission with an external device.

이상과 같은 전자기기용 소켓케넥터는 전기적 접속이 이루어진게 가공되어 구비되는 접속단자와 상기 접속단자가 인서트도어 사출성형되게 구비되는 소켓몰드, 상기 소켓몰드의 접속단몰드부에 결합되는 플러그커넥터의 결합유도 및 결합강성을 높일 수 있게 구비되는 소켓쉘 및 상기 소켓몰드의 솔더단몰드부에 결합되어 솔더단의 내구성을 높이고 소켓커넥터의 실장강도를 높일 수 있게 구비되는 소켓하우징으로 구성되는 것이다.The socket connector for electronic devices as described above includes a connection terminal in which electrical connection is made and provided, a socket mold in which the connection terminal is injection-molded with an insert door, and a plug connector coupled to the connection end mold portion of the socket mold. and a socket shell provided to increase coupling rigidity, and a socket housing coupled to the solder end mold portion of the socket mold to increase durability of the solder end and increase mounting strength of the socket connector.

이와 같은 전자기기용 소켓커넥터의 제조방법은 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정과 상기 단자가공과정을 통하여 가공된 접속단자를 인서트하여 소켓몰드를 사출성형하는 단계로 이루어진 소켓몰드성형과정, 금속소재의 절단 절곡 작업을 통하여 소켓몰드의 접속단몰드부 보호를 위한 소켓쉘을 가공하는 단계로 이루어진 소켓쉘가공과정, 금속소재의 절단 절곡 작업을 통하여 소켓몰드의 솔더단몰드부 보호를 위한 몰드하우징을 가공하는 단계로 이루어진 몰드하우징가공과정, 상기 소켓쉘가공과정을 통하여 가공된 소켓쉘을 조립하는 단계로 이루어진 소켓쉘조립과정 및 상기 몰드하우징가공과정을 통하여 가공된 몰드하우징을 조립하는 단계로 이루어진 몰드하우징조립과정으로 이루이지는 것이다.This method of manufacturing a socket connector for electronic devices includes a terminal processing process consisting of the steps of processing a connection terminal through cutting and bending the terminal material, and a step of injection molding a socket mold by inserting the connection terminal processed through the terminal processing process. Socket mold forming process, which consists of processing the socket shell to protect the connecting end mold part of the socket mold through cutting and bending of the metal material, and solder of the socket mold through cutting and bending of the metal material. A mold housing processing process consisting of the step of processing a mold housing to protect the end mold portion, a socket shell assembly process consisting of a step of assembling the socket shell processed through the socket shell processing process, and a socket shell assembly process consisting of the step of assembling the socket shell processed through the socket shell processing process. It is achieved through a mold housing assembly process consisting of the steps of assembling the mold housing.

그러나, 상기한 바와 같은 전자기기용 소켓커넥터는 소켓몰드의 접소단몰드에 결합되는 플러그커넥터의 결합유도 및 가동향상을 위한 소켓쉘로 인하여 소켓커넥터의 전체적인 두께의 축소가 한정되어 적용되는 전자기기의 두께 축소가 제한되는 문제점이 있었다.However, in the socket connector for electronic devices as described above, the reduction of the overall thickness of the socket connector is limited due to the socket shell for inducing coupling and improving operation of the plug connector coupled to the contact end mold of the socket mold, so that the thickness of the electronic device to which it is applied is limited. There was a problem that limited downsizing.

이에, 본 발명은 상기한 바와 같은 전자기기용 소켓커넥터가 소켓몰드의 접소단몰드에 결합되는 플러그커넥터의 결합유도 및 가동향상을 위한 소켓쉘로 인하여 소켓커넥터의 전체적인 두께의 축소가 한정되어 적용되는 전자기기의 두께 축소가 제한되는 문제점을 해결하고자 하는 것이다.Accordingly, the present invention is applied to electronic devices where the reduction in the overall thickness of the socket connector is limited due to the socket shell for inducing coupling and improving operation of the plug connector that is coupled to the contact end mold of the socket mold as described above. The goal is to solve the problem of limiting device thickness reduction.

즉, 본 발명은 전자기기용 소켓커넥터의 제조방법에 있어서, 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정과 상기 단자가공과정을 통하여 가공된 접속단자를 인서트하여 소켓몰드를 사출성형하는 단계로 이루어진 소켓몰드성형과정, 금속소재로 금속사출성형을 통하여 소켓몰드의 접속단몰드부를 실링하고 솔더단몰드부 보호를 위한 소켓몰드가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임을 갖는 실링몰드하우징을 가공하는 단계로 이루어진 실링몰드하우징가공과정, 상기 실링몰드하우징가공과정을 통해 성형된 실링몰드하우징의 소켓몰드체결공간에 소켓몰드를 삽입 체결하는 단계로 이루어진 하우징조립과정, 상기 하우징조립과정을 통하여 조립된 실링몰드하우징의 실링부와 소켓몰드 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 몰드프레임실링과정, 상기 몰드프레임실링과정으로 수지 충전을 통하여 몰드프레임실링 성형이 완료된 상태에서 실링몰드하우징의 후방부를 마감판으로 밀폐하는 단계로 이루어진 하우징밀폐과정 및 상기 하우징밀폐과정을 통하여 실링몰드하우징의 후방부를 마감판으로 밀폐상태에서 실링몰드하우징의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 디스펜싱실링과정으로 이루어져진 것을 특징으로 하는 것이다.That is, the present invention relates to a method for manufacturing a socket connector for electronic devices, a terminal processing process consisting of the steps of processing a connection terminal through cutting and bending a terminal material, and inserting the connection terminal processed through the terminal processing process into a socket mold. The socket mold molding process consists of the step of injection molding, sealing the connection end mold part of the socket mold through metal injection molding with a metal material, forming a socket mold fastening space where the socket mold is inserted and fastened to protect the solder end mold part, and forming a socket mold fastening space on both sides. A sealing mold housing processing process consisting of the steps of processing a sealing mold housing with a mounting frame for mounting electronic devices, and inserting and fastening a socket mold into the socket mold fastening space of the sealing mold housing formed through the sealing mold housing processing process. A housing assembly process consisting of steps, a mold frame sealing process consisting of the step of filling resin for bonding and waterproofing between the sealing portion of the sealing mold housing assembled through the housing assembly process and the socket mold, and the mold frame sealing process comprising the step of filling resin A housing sealing process consisting of the step of sealing the rear portion of the sealing mold housing with a finishing plate in a state in which the mold frame sealing molding is completed through filling, and the sealing mold housing in a state in which the rear portion of the sealing mold housing is sealed with a finishing plate through the housing sealing process. It is characterized in that it consists of a dispensing sealing process consisting of the step of forming a seal through dispensing on the sealing surface of the sealing part of.

따라서, 본 발명은 전자기기용 소켓커넥터의 제조방법에 있어서, 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정과 상기 단자가공과정을 통하여 가공된 접속단자를 인서트하여 소켓몰드를 사출성형하는 단계로 이루어진 소켓몰드성형과정, 금속소재로 금속사출성형을 통하여 소켓몰드의 접속단몰드부를 실링하고 솔더단몰드부 보호를 위한 소켓몰드가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임을 갖는 실링몰드하우징을 가공하는 단계로 이루어진 실링몰드하우징가공과정, 상기 실링몰드하우징가공과정을 통해 성형된 실링몰드하우징의 소켓몰드체결공간에 소켓몰드를 삽입 체결하는 단계로 이루어진 하우징조립과정, 상기 하우징조립과정을 통하여 조립된 실링몰드하우징의 실링부와 소켓몰드 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 몰드프레임실링과정, 상기 몰드프레임실링과정으로 수지 충전을 통하여 몰드프레임실링 성형이 완료된 상태에서 실링몰드하우징의 후방부를 마감판으로 밀폐하는 단계로 이루어진 하우징밀폐과정 및 상기 하우징밀폐과정을 통하여 실링몰드하우징의 후방부를 마감판으로 밀폐상태에서 실링몰드하우징의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 디스펜싱실링과정을 포함하여 이루어짐으로써, 제조된 소켓커넥터의 소켓쉘이 삭제하고 실장기기의 몸체가 소켓쉘을 형성하여 소켓커넥터의 크기가 최소화되고 본 발명이 적용되는 전자기기의 두께도 최소화되는 효과를 갖는 것이다.Therefore, the present invention relates to a method for manufacturing a socket connector for electronic devices, a terminal processing process consisting of the steps of processing a connection terminal through cutting and bending a terminal material, and inserting the connection terminal processed through the terminal processing process into a socket mold. The socket mold molding process consists of the step of injection molding, sealing the connection end mold part of the socket mold through metal injection molding with a metal material, forming a socket mold fastening space where the socket mold is inserted and fastened to protect the solder end mold part, and forming a socket mold fastening space on both sides. A sealing mold housing processing process consisting of the steps of processing a sealing mold housing with a mounting frame for mounting electronic devices, and inserting and fastening a socket mold into the socket mold fastening space of the sealing mold housing formed through the sealing mold housing processing process. A housing assembly process consisting of steps, a mold frame sealing process consisting of the step of filling resin for bonding and waterproofing between the sealing portion of the sealing mold housing assembled through the housing assembly process and the socket mold, and the mold frame sealing process comprising the step of filling resin A housing sealing process consisting of the step of sealing the rear portion of the sealing mold housing with a finishing plate in a state in which the mold frame sealing molding is completed through filling, and the sealing mold housing in a state in which the rear portion of the sealing mold housing is sealed with a finishing plate through the housing sealing process. By including a dispensing sealing process consisting of the step of forming a seal through dispensing on the sealing surface of the sealing part, the socket shell of the manufactured socket connector is removed and the body of the mounting device forms a socket shell to form a socket shell of the socket connector. This has the effect of minimizing the size and the thickness of the electronic device to which the present invention is applied.

도 1은 본 발명의 일 실시예를 도시한 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법의 예시도.
도 2는 본 발명의 일 실시예를 도시한 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법의 개요도.
도 3은 본 발명의 일 실시예를 도시한 소켓커넥터의 사시도.
도 4는 본 발명의 일 실시예를 도시한 소켓커넥터의 저면 사시도.1 is an exemplary diagram of a manufacturing method of a metal injection molded sealing mold housing type dispensing sealing socket connector for electronic devices showing an embodiment of the present invention.
Figure 2 is a schematic diagram of a manufacturing method of a metal injection molded sealing mold housing type dispensing sealing socket connector for electronic devices showing an embodiment of the present invention.
Figure 3 is a perspective view of a socket connector showing one embodiment of the present invention.
Figure 4 is a bottom perspective view of a socket connector showing an embodiment of the present invention.

이하, 첨부된 도면에 의하여 상세하게 설명하면 다음과 같다.Hereinafter, it will be described in detail with the accompanying drawings.

본 발명은 소켓커넥터의 두께를 최소화하여 적용되는 전자기기의 두께를 최소화할 수 있도록 한 것으로서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. The present invention is designed to minimize the thickness of the electronic device to which it is applied by minimizing the thickness of the socket connector, and the terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meaning. Based on the principle that the inventor can appropriately define the concept of the term in order to explain his or her invention in the best way, it must be interpreted as meaning and concept consistent with the technical idea of the present invention.

따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다.Therefore, the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention, and do not represent the entire technical idea of the present invention, so they can be replaced at the time of filing the present application. It should be understood that various equivalents and variations may exist.

즉, 본 발명은 전자기기용 소켓커넥터의 제조방법에 있어서, 단자가공과정(110)과 소켓몰드성형과정(120), 실링몰드하우징가공과정(130), 하우징조립과정(200), 몰드프레임실링과정(300), 하우징밀폐과정(400) 및 디스펜싱실링과정(500)으로 이루어진는 것이다.That is, the present invention relates to a method for manufacturing a socket connector for electronic devices, including a terminal processing process (110), a socket mold forming process (120), a sealing mold housing processing process (130), a housing assembly process (200), and a mold frame sealing process. It consists of (300), housing sealing process (400), and dispensing sealing process (500).

여기서, 상기 단자가공과정(110)은 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 것이다.Here, the terminal processing process 110 consists of processing the connection terminal through cutting and bending of the terminal material.

그리고, 상기 소켓몰드성형과정(120)은 상기 단자가공과정(110)을 통하여 가공된 접속단자를 인서트하여 소켓몰드(10)를 사출성형하는 단계로 이루어진 것이다.And, the socket mold forming process 120 consists of inserting the connection terminal processed through the terminal processing process 110 and injection molding the socket mold 10.

또한, 상기 실링몰드하우징가공과정(130)은 금속소재로 금속사출성형을 통하여 소켓몰드(10)의 접속단몰드부를 실링하고 솔더단몰드(12)를 보호를 위한 소켓몰드(10)가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임(22)을 갖는 실링몰드하우징(20)을 가공하는 단계로 이루어진 것이다.In addition, the sealing mold housing processing process 130 seals the connection end mold portion of the socket mold 10 through metal injection molding with a metal material, and the socket mold 10 for protecting the solder end mold 12 is inserted and fastened. It consists of processing a sealing mold housing (20) that forms a socket mold fastening space and has mounting frames (22) on both sides for mounting electronic devices.

또한, 상기 하우징조립과정(200)은 상기 실링몰드하우징가공과정(130)을 통해 성형된 실링몰드하우징(20)의 소켓몰드체결공간에 소켓몰드(10)를 삽입 체결하는 단계로 이루어진 것이다.In addition, the housing assembly process 200 consists of inserting and fastening the socket mold 10 into the socket mold fastening space of the sealing mold housing 20 formed through the sealing mold housing processing process 130.

상기 몰드프레임실링과정(300)은 상기 하우징조립과정(200)을 통하여 조립된 실링몰드하우징(20)의 실링부와 소켓몰드(10) 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 것이다. The mold frame sealing process 300 consists of filling resin for bonding and waterproofing between the sealing portion of the sealing mold housing 20 assembled through the housing assembly process 200 and the socket mold 10. .

또한, 상기 하우징밀폐과정(400)은 상기 몰드프레임실링과정(300)으로 수지 충전을 통하여 몰드프레임실링(15) 성형이 완료된 상태에서 실링몰드하우징(20)의 후방부를 마감판(21)으로 밀폐하는 단계로 이루어진 것이다.In addition, in the housing sealing process 400, the rear portion of the sealing mold housing 20 is sealed with the finishing plate 21 in a state in which mold frame sealing 15 is completed through resin filling in the mold frame sealing process 300. It is made up of steps.

또한, 상기 디스펜싱실링과정(500)은 상기 하우징밀폐과정(400)을 통하여 실링몰드하우징(20)의 후방부를 마감판(21)으로 밀폐상태에서 실링몰드하우징(20)의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 것이다.In addition, the dispensing sealing process 500 is performed by sealing the rear portion of the sealing mold housing 20 with the finishing plate 21 and sealing the sealing surface of the sealing portion of the sealing mold housing 20 through the housing sealing process 400. It consists of the step of forming the seal through dispensing.

상기와 같은 제조방법으로 이루어진 본 발명의 전자기기용 소켓커넥터는 다음과 같다.The socket connector for electronic devices of the present invention made using the above manufacturing method is as follows.

단자의 솔더단이 인서트 되는 솔더단몰드(12)와 접속단이 인서트되는 접속단몰드(11)로 구성되는 소켓몰드(10) 및 솔더단몰드(12)와 접속단몰드(11)에 사이에 구비되는 몰드프레임실링(15)와;A socket mold (10) consisting of a solder end mold (12) into which the solder end of the terminal is inserted and a connection end mold (11) into which the connection end is inserted, and between the solder end mold (12) and the connection end mold (11). A mold frame seal (15) provided;

상기 소켓몰드(10)의 솔더단몰드(12)를 전체 슬라이드 삽입하게되고, 접속단몰드(11)의 하우징스토퍼까지 삽입체결되는 실링몰드하우징(20)과;a sealing mold housing (20) into which the entire solder end mold (12) of the socket mold (10) is slide-inserted, and which is inserted and fastened to the housing stopper of the connection end mold (11);

상기 실링몰드하우징(20)은 내부가 관통되어 형성되고, 실링모드하우징(20)의 양 측으로 돌출되어 기판에 고정되는 장착프레임(22)과, 접속단몰드(11) 측으로 돌출되는 실링부(23) 및 실링부(23)에 형성되는 디스펜싱실링(30)과, 솔더단몰드(12)가 노출되지 않게 후방부를 밀폐결합되는 마감판(21)이 포함된다.The sealing mold housing 20 is formed with a penetrating interior, and includes a mounting frame 22 that protrudes on both sides of the sealing mold housing 20 and is fixed to the substrate, and a sealing portion 23 that protrudes toward the connection end mold 11. ) and a dispensing seal 30 formed on the sealing portion 23, and a finishing plate 21 hermetically coupled to the rear portion so that the solder end mold 12 is not exposed.

상기 실링몰드하우징(20)의 몸체 후방에는 마감판(21) 체결을 위한 체결홈(20a)이 형성되는 것이다.A fastening groove 20a for fastening the finishing plate 21 is formed at the rear of the body of the sealing mold housing 20.

상기 마감판(21)은 양 측에는 체결홈(20a)에 끼움되는 체결돌기(21a)가 형성되는 것이다.The finishing plate 21 has fastening protrusions 21a formed on both sides that fit into fastening grooves 20a.

상기 장착프레임(22)은 몸체 양 측면에 연장레그(22a)로 연장되게 형성되는 것이다.The mounting frame 22 is formed to extend with extension legs 22a on both sides of the body.

상기 연장레그(22a)는 후방에서 전방측으로 방사 돌출되게 형성하여 수평으로 가해지는 힘에 대해 강성 향상을 갖도록 형성되는 것이다.The extension leg 22a is formed to radially protrude from the rear to the front to improve rigidity against a horizontally applied force.

상기 마감판(21)은 실링몰드하우징(20) 후방에 삽입하여 결합 된다.The finishing plate 21 is inserted and coupled to the rear of the sealing mold housing 20.

상기 실링부(23)는 내측으로 실링의 접촉면적이 넓게되는 결합홈(24)이 형성된다.The sealing portion 23 is formed with a coupling groove 24 on the inside that increases the contact area of the seal.

이하, 본 발명의 적용실시에 따른 작용효과에 대하여 설명하면 다음과 같다.Hereinafter, the effects of applying the present invention will be described as follows.

상기한 바와 즉, 본 발명은 전자기기용 소켓커넥터의 제조방법에 있어서, 단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정(110)과 상기 단자가공과정(110)을 통하여 가공된 접속단자를 인서트하여 소켓몰드(10)를 사출성형하는 단계로 이루어진 소켓몰드성형과정(120), 금속소재로 금속사출성형을 통하여 소켓몰드(10)의 접속단몰드부를 실링하고 솔더단몰드(12)부 보호를 위한 소켓몰드(10)가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임(22)을 갖는 실링몰드하우징(20)을 가공하는 단계로 이루어진 실링몰드하우징가공과정(130), 상기 실링몰드하우징가공과정(130)을 통해 성형된 실링몰드하우징(20)의 소켓몰드체결공간에 소켓몰드(10)를 삽입 체결하는 단계로 이루어진 하우징조립과정(200), 상기 하우징조립과정(200)을 통하여 조립된 실링몰드하우징(20)의 실링부와 소켓몰드(10) 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 몰드프레임실링과정(300), 상기 몰드프레임실링과정(300)으로 수지 충전을 통하여 몰드프레임실링 성형이 완료된 상태에서 실링몰드하우징(20)의 후방부를 마감판(21)으로 밀폐하는 단계로 이루어진 하우징밀폐과정(400) 및 상기 하우징밀폐과정(400)을 통하여 실링몰드하우징(20)의 후방부를 마감판(21)으로 밀폐상태에서 실링몰드하우징(20)의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 디스펜싱실링과정(500)으로 이루어진 본 발명을 적용하여 실시하게 되면, 제조된 소켓커넥터의 소켓쉘이 삭제되어 소켓커넥터의 두께가 최소화되고, 실장기기의 몸체가 소켓쉘을 형성하므로써 본 발명이 적용을 통하여 전자기기의 두께도 최소화되는 것이다.As described above, the present invention is a method of manufacturing a socket connector for electronic devices, through a terminal processing process 110 consisting of the step of processing a connection terminal through cutting and bending a terminal material and the terminal processing process 110. The socket mold forming process 120 consists of inserting the processed connection terminal and injection molding the socket mold 10, sealing the connection end mold portion of the socket mold 10 through metal injection molding with a metal material, and solder end mold. (12) Sealing consisting of the step of processing the sealing mold housing (20), which forms a socket mold fastening space into which the socket mold (10) for protecting the part is inserted and fastened, and has mounting frames (22) for mounting electronic devices on both sides. A housing assembly process (200) consisting of a mold housing processing process (130) and inserting and fastening the socket mold (10) into the socket mold fastening space of the sealing mold housing (20) formed through the sealing mold housing processing process (130). ), a mold frame sealing process (300) consisting of the step of filling resin for coupling and waterproofing between the sealing portion of the sealing mold housing (20) assembled through the housing assembly process (200) and the socket mold (10), A housing sealing process (400) consisting of the step of sealing the rear portion of the sealing mold housing (20) with a finishing plate (21) in a state in which the mold frame sealing molding is completed through resin filling in the mold frame sealing process (300), and the housing Dispensing consists of forming a seal by dispensing on the sealing surface of the sealing part of the sealing mold housing 20 while sealing the rear portion of the sealing mold housing 20 with the finishing plate 21 through the sealing process 400. When the present invention, which consists of the sealing process 500, is applied and implemented, the socket shell of the manufactured socket connector is deleted, the thickness of the socket connector is minimized, and the body of the mounting device forms the socket shell, so that the present invention can be applied through application. The thickness of electronic devices is also minimized.

또한, 상기 실링몰드하우징(20)이 금속사출성형을 통하여 실링부와 하우징부를 일체로 형성하여 그 내구성과 생산원가 절감 및 생산성이 향상되는 것이다.In addition, the sealing mold housing 20 is formed as a single body through metal injection molding, thereby improving durability, reducing production costs, and improving productivity.

10 : 소켓몰드
11 : 접속단몰드 12 : 솔더단몰드
15 : 몰드프레임실링
20 : 실링몰드하우징 21 : 마감판
22 : 장착프레임 23 : 실링부
24 : 결합홈
30 : 디스펜싱실링
110 : 단자가공과정
120 : 소켓몰드성형과정
130 : 실링몰드하우징가공과정
200 : 하우징조립과정
300 : 몰드프레임실링과정
400 : 하우징밀폐과정
500 : 디스펜싱실링과정10: Socket mold
11: connection end mold 12: solder end mold
15: Mold frame sealing
20: Sealing mold housing 21: Finishing plate
22: Mounting frame 23: Sealing part
24: Combining groove
30: Dispensing sealing
110: Terminal processing process
120: Socket mold forming process
130: Sealing mold housing processing process
200: Housing assembly process
300: Mold frame sealing process
400: Housing sealing process
500: Dispensing sealing process

Claims (3)

전자기기용 소켓커넥터의 제조방법에 있어서,
단자소재를 절단 절곡 작업을 통하여 접속단자를 가공하는 단계로 이루어진 단자가공과정과 상기 단자가공과정을 통하여 가공된 접속단자를 인서트하여 소켓몰드를 사출성형하는 단계로 이루어진 소켓몰드성형과정, 금속소재로 금속사출성형을 통하여 소켓몰드의 접속단몰드를 실링하고 솔더단몰드 보호를 위한 소켓몰드가 삽입체결되는 소켓몰드체결공간을 형성하며 양측으로 전자기기장착을 위한 장착프레임과 실링부를 갖는 실링몰드하우징을 가공하는 단계로 이루어진 실링몰드하우징가공과정, 상기 실링몰드하우징가공과정을 통해 성형된 실링몰드하우징의 소켓몰드체결공간에 소켓몰드를 삽입 체결하는 단계로 이루어진 하우징조립과정, 상기 하우징조립과정을 통하여 조립된 실링몰드하우징의 실링부와 소켓몰드 사이에 결합과 방수를 위하여 수지를 충전하는 단계로 이루어진 몰드프레임실링과정, 상기 몰드프레임실링과정으로 수지 충전을 통하여 몰드프레임실링 성형이 완료된 상태에서 실링몰드하우징의 후방부를 마감판으로 밀폐하는 단계로 이루어진 하우징밀폐과정 및 상기 하우징밀폐과정을 통하여 실링몰드하우징의 후방부를 마감판으로 밀폐상태에서 실링몰드하우징의 실링부의 실링면에 디스펜싱을 통하여 실링을 성형하는 단계로 이루어진 디스펜싱실링과정으로 이루어진 것을 특징으로 하는 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법.In the method of manufacturing a socket connector for electronic devices,
A terminal processing process consisting of the step of processing a connection terminal through cutting and bending of the terminal material, a socket mold forming process consisting of a step of injection molding a socket mold by inserting the connection terminal processed through the terminal processing process, and a metal material. Through metal injection molding, the connection end mold of the socket mold is sealed, a socket mold fastening space is formed into which the socket mold is inserted to protect the solder end mold, and a sealing mold housing is provided with a mounting frame and sealing portion on both sides for mounting electronic devices. A sealing mold housing processing process consisting of a processing step, a housing assembly process consisting of a step of inserting and fastening a socket mold into the socket mold fastening space of the sealing mold housing formed through the sealing mold housing processing process, and assembling through the housing assembly process. A mold frame sealing process consisting of the step of filling resin for bonding and waterproofing between the sealing portion of the sealing mold housing and the socket mold, and sealing mold housing in a state in which mold frame sealing molding is completed through resin filling through the mold frame sealing process. A housing sealing process consisting of the step of sealing the rear part of the sealing mold housing with a finishing plate and forming a seal through dispensing on the sealing surface of the sealing part of the sealing mold housing in a state where the rear part of the sealing mold housing is sealed with a finishing plate through the housing sealing process. A method of manufacturing a metal injection molded sealing mold housing type dispensing sealing socket connector for electronic devices, characterized in that it consists of a dispensing sealing process consisting of steps. 제 1항에 있어서,
실링몰드하우징가공과정은
상기 실링몰드하우징의 몸체 후방에는 마감판 체결을 위한 체결홈이 형성되고, 마감판은 양 측에는 체결홈에 끼움되는 체결돌기가 형성되어 체결 구성되며, 장착프레임은 몸체 양 측면 후방에서 전방측으로 방사 돌출되게 형성하여 수평으로 가해지는 힘에 대해 강성 향상을 갖는 연장레그로 연장되게 형성되는 실링몰드하우징가공과정으로 이루어짐을 특징으로 하는 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법.
According to clause 1,
The sealing mold housing processing process is
A fastening groove for fastening the finishing plate is formed at the rear of the body of the sealing mold housing, and the finishing plate is fastened with fastening protrusions that fit into the fastening grooves on both sides, and the mounting frame protrudes radially from the rear on both sides of the body to the front. A method of manufacturing a socket connector for a metal injection molded sealing mold housing type dispensing sealing electronic device, characterized in that it is formed by processing a sealing mold housing that is formed to extend with an extension leg that has improved rigidity against a horizontally applied force.
 제 1항에 있어서,
상기 실링몰드하우징의 후방부 양 측에는 마감판 체결을 위한 체결홈이 형성되고, 상기 마감판 양측에는 체결홈에 끼움되어 체결되는 체결돌기가 형성되어 마감판의 견고한 결합이 이루어지도록 밀폐 마감하는 단계로 이루어진 하우징밀폐과정으로 이루어짐을 특징으로 하는 금속사출성형 실링몰드하우징형 디스펜싱실링 전자기기용 소켓커넥터의 제조방법.
According to clause 1,
Fastening grooves for fastening the finishing plate are formed on both sides of the rear part of the sealing mold housing, and fastening protrusions that fit into the fastening grooves are formed on both sides of the finishing plate to seal and close the finishing plate to ensure a firm connection. A method of manufacturing a socket connector for a metal injection molded sealing mold housing type dispensing sealing electronic device, characterized by a housing sealing process.
KR1020230126679A 2023-09-21 2023-09-21 Manufacturing method of disensing silling socketconnector Active KR102636489B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020230126679A KR102636489B1 (en) 2023-09-21 2023-09-21 Manufacturing method of disensing silling socketconnector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020230126679A KR102636489B1 (en) 2023-09-21 2023-09-21 Manufacturing method of disensing silling socketconnector

Publications (1)

Publication Number Publication Date
KR102636489B1 true KR102636489B1 (en) 2024-02-21

Family

ID=90052670

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230126679A Active KR102636489B1 (en) 2023-09-21 2023-09-21 Manufacturing method of disensing silling socketconnector

Country Status (1)

Country Link
KR (1) KR102636489B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160050458A (en) * 2014-10-29 2016-05-11 한국단자공업 주식회사 Micro usb plug connecter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160050458A (en) * 2014-10-29 2016-05-11 한국단자공업 주식회사 Micro usb plug connecter

Similar Documents

Publication Publication Date Title
US9711910B2 (en) Waterproof electrical connector assembly and method of manufacturing same
US9761988B1 (en) Waterproof electric connector assembly
KR101301982B1 (en) Waterproof type receptacle connector
GB2257579A (en) Pin-header.
US20170294738A1 (en) Electrical connector having a tongue portion extending beyond a metallic shell
US10074930B2 (en) Electrical connector having excellent waterproof property
US20150263458A1 (en) Electrical connector providing protection to soldering portions of the contacts
CN102474035B (en) Connecting component for electrical conductors and method for sheathing such connecting component
CN108319925A (en) Fingerprint module and mobile terminal with it
US5980329A (en) Electrical component and a housing for use therewith
CN107658630A (en) Electric connector
CN102025072B (en) Cable connector
US6913493B2 (en) Sealed electrical connector assembly and method of fabricating same
KR101951498B1 (en) Waterproof type micro USB receptacle connector
KR102636489B1 (en) Manufacturing method of disensing silling socketconnector
CN206178867U (en) Fingerprint module and have its mobile terminal
JP2019053943A (en) Connector for module
CN209313047U (en) electrical connector
US9415534B2 (en) Waterproof electrical connector
CN117134146A (en) Covered energy storage connector and preparation method thereof
KR101355581B1 (en) Waterproof type receptacle connector
KR102627621B1 (en) Menufacturing method for socketshellless-type soketconnector
KR102679404B1 (en) Menufacturing method for socketshellless-type soketconnector
JP4942541B2 (en) Electrical and electronic module and manufacturing method thereof
CN106255028A (en) For manufacturing method and the microphone unit of microphone unit

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20230921

PA0201 Request for examination
PA0302 Request for accelerated examination

Patent event date: 20231026

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20230921

Patent event code: PA03021R01I

Comment text: Patent Application

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240130

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20240131

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20240207

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20240208

End annual number: 3

Start annual number: 1

PG1601 Publication of registration