KR102629075B1 - Test apparatus for semiconductor package - Google Patents

Abstract

In the semiconductor package test device for testing a package-on-package type (POP) semiconductor package according to the present invention, the suction pad has a body portion made of silicon with a vacuum hole, a diameter larger than the body portion, and a vacuum hole and It is provided with contact holes at corresponding positions and includes a contact part made of either polyimide film, engineering plastic, or synthetic resin. The bottom of the contact part has a non-contact surface that does not contact the contact surface in contact with the lower semiconductor package at a certain level. It is characterized by reducing the contact area between the contact part and the lower semiconductor package by forming the gap.

Description

Test device for semiconductor package {TEST APPARATUS FOR SEMICONDUCTOR PACKAGE}

The present invention relates to testing of semiconductor packages, and more specifically, to a semiconductor package testing device for checking whether a semiconductor package of the package-on-package type (POP), in which a lower semiconductor package and an upper semiconductor package are stacked vertically, operates normally. It's about.

Semiconductor packages are formed by high-density integration of fine electronic circuits, and during the manufacturing process, each electronic circuit goes through a test process to determine whether it is normal. The test process is a process that tests whether the semiconductor package operates normally and selects good and defective products.

To test a semiconductor package, a test device is used to electrically connect a terminal of the semiconductor package to a tester that applies a test signal. Test devices have various structures depending on the type of semiconductor package being tested.

Recently, as the use of semiconductor packages in the form of package-on-package (POP), which minimizes component size and enables fast signal transmission, has increased, demand for test devices to test such semiconductor packages continues to grow.

As shown in FIG. 1, a conventional test device 100 for testing a semiconductor package in the package-on-package form includes a lower socket 40 and an upper socket 60 for transmitting electrical signals, and an upper socket on which the upper socket is mounted. It includes a pusher (50) and a suction pad (70) disposed on the upper socket (60) to suction the lower semiconductor package (10). The lower socket 40 is installed on the tester 30 to be electrically connected to the lower semiconductor package 10, and the upper semiconductor package 20 is mounted on top of the upper socket to be electrically connected to the upper socket 60.

In this test device, the pusher 50 is lowered and the lower semiconductor package 10 is placed on the lower socket 40 while the suction pad 70 picks the lower semiconductor package 10 to be inspected. After placing, the upper socket 60 presses the lower semiconductor package 10 by the pusher 50, thereby forming the second conductive portion 61 of the upper socket 60 and the lower semiconductor package ( By connecting the upper terminal 12 of 10), the tester 30, the lower socket 40, the lower semiconductor package 10, the upper socket 60, and the upper semiconductor package 20 are electrically connected to perform an electrical test. is in progress.

In a typical conventional semiconductor package test device, a picker picks the semiconductor package to be inspected and places it on the test socket, then the picker moves to pick up another semiconductor package, and a pusher Electrical tests are being conducted by pushing the semiconductor package located on the test socket. That is, in a typical conventional semiconductor package test device, the picker and pusher operate separately, and the picker only performs a pick and place role, so the picker only adsorbs the semiconductor package for a short period of time.

On the other hand, in a test device that tests semiconductor packages in the package-on-package form, the picker and pusher are formed as one piece, and the suction pad combined with the pusher picks and places the semiconductor package to be inspected. Since it also performs the role of pushing at the same time, the suction pad has a structure that is in contact with the semiconductor package for a long period of time. In particular, in the case of reliability testing, the suction pad remains in contact with the lower semiconductor package for a period of 1 to 2 weeks. This is the situation.

In a test device that tests a semiconductor package in the package-on-package form, the suction pad 70 is made of silicon to protect the semiconductor package and increase vacuum suction performance. Due to the characteristics of silicon, the lower semiconductor package adheres to the suction pad. Sticky phenomenon occurs. To prevent this sticky phenomenon, methods such as applying antistatic coating or special coating to the surface of the suction pad in close contact with the semiconductor package have been implemented, but the sticky phenomenon is still not improved.

Recently, as shown in (a) of FIG. 2, a polyimide film, engineering plastic, or synthetic resin is formed on the lower part of the body portion 710 of the suction pad 70 in close contact with the semiconductor package 10. An attempt is made to prevent the sticky phenomenon by forming a contact portion 720 using an anti-adhesion member and attaching the contact portion 720 made of an anti-adhesion member to the body portion 710.

However, in a test device for testing a package-on-package type semiconductor package in which the suction pad 70 is connected to the lower semiconductor package for a long time, as shown in (b) of FIG. 2, the body portion of the suction pad 70 ( Since 710) is in a state of being compressed by vacuum pressure for a long time, silicone oil is eluted from the body made of silicon and flows down the side of the body 710 and the vacuum hole 711 as shown by arrow A, The flowing silicone oil flows between the suction pad and the lower semiconductor package, and silicone oil accumulates between the contact portion 720 of the suction pad 70 and the lower semiconductor package 10 (S is an example of accumulated silicone oil). There is a problem in which the sticky phenomenon in which the suction pad 70 and the lower semiconductor package 10 stick to each other occurs more frequently.

Public Patent Publication No. 2015-0106848 (2015. 9. 22.) Registered Patent Publication No. 10-1555965 (2015. 9. 25.)

The present invention was conceived in consideration of the above-described points, and its purpose is to provide a semiconductor package test device that can precisely test a semiconductor package in the form of a package-on-package that operates at high speed.

Another object of the present invention is to provide a test device for a semiconductor package that can completely prevent the sticking phenomenon of a semiconductor package sticking to a suction pad.

The test device for a semiconductor package according to the present invention for solving the above-described object is mounted on a pusher, has an upper socket mounted on the upper semiconductor package and connects to the lower semiconductor package placed below, and is mounted on the tester and is located on the upper side. A package on package including a lower socket connected to the placed lower semiconductor package, and a suction pad movably coupled to the pusher and capable of adsorbing and pressing the lower semiconductor package by receiving vacuum pressure through the pusher. In a semiconductor package test device for testing a type (POP) semiconductor package, the suction pad has a body portion made of silicon having a vacuum hole, a diameter larger than the body portion, and corresponds to the vacuum hole. It is provided with a contact hole at a position, and includes a contact part made of any one of polyimide film, engineering plastic, or synthetic resin, and a lower surface of the contact part has a contact surface in contact with the lower semiconductor package and a contact surface in contact with the lower semiconductor package. It is characterized by non-contact surfaces being formed at regular intervals.

The non-contact surface may be formed by a straight groove portion.

The non-contact surface may be formed by grid-shaped grooves.

The contact surface may be formed by a ring-shaped step portion that protrudes in the shape of a fence.

A plurality of ring-shaped step portions may be formed.

The area of the contact surface may be 30% to 70% of the area of the lower surface of the contact portion.

The thickness of the contact portion may be 5% to 10% of the thickness of the suction pad.

The test device for a semiconductor package according to the present invention is composed of a contact part of an adsorption pad that adsorbs the lower semiconductor package with an anti-adhesion material, an oil receiving part that contains silicone oil eluted from the body on the outside of the contact part, and a semiconductor part on the bottom of the contact part. By additionally forming a non-contact portion that does not contact the package, the sticky phenomenon in which the inspected lower semiconductor package sticks to the suction pad can be almost completely prevented.

In addition, in the semiconductor package testing device according to an embodiment of the present invention, the semiconductor package does not stick to the suction pad even when testing a semiconductor package in the package-on-package form, so that the inspected semiconductor package can be easily placed in the loading device after the test. This allows the entire testing process to proceed efficiently.

Figure 1 schematically shows a test device for a semiconductor package in the form of a package-on-package.
Figure 2 is for explaining the operation of a test device for a semiconductor package in the package-on-package form.
Figure 3 is a diagram showing that silicon is eluted from the suction pad and a sticky phenomenon occurs in a test device for a semiconductor package in the package-on-package type.
Figure 4 is a cross-sectional view and a perspective view showing the structure of a suction pad according to an embodiment of the present invention.
Figure 5 shows a groove formed on the lower surface of the contact part according to an embodiment of the present invention.
Figure 6 shows a step formed on the lower surface of the contact part according to an embodiment of the present invention.

Hereinafter, a test device for a semiconductor package according to the present invention will be described in detail with reference to the drawings.

Figure 1 schematically shows a test device for a semiconductor package in the package-on-package form, Figure 2 is for explaining the operation of the test device for a semiconductor package in the package-on-package form, and Figure 3 shows a semiconductor package in the package-on-package form. This is a diagram showing that silicone is eluted from the suction pad and a sticky phenomenon occurs in the test device, Figure 4 is a cross-sectional view and a perspective view showing the structure of the suction pad according to an embodiment of the present invention, and Figure 5 is an embodiment of the invention It shows that a groove is formed on the lower surface of the contact part according to an embodiment, and Figure 6 shows that a step part is formed on the lower surface of the contact part according to an embodiment of the present invention.

As shown in FIG. 1, the package-on-package type semiconductor package testing device 100 is a package-on-package type (POP) test device that inspects the lower semiconductor package 10 using the upper semiconductor package 20 that has been previously selected as a good product. ) is used to test a semiconductor package, and can electrically communicate between the tester 30 that generates a test signal and the semiconductor package of the package-on-package type (POP).

The semiconductor package test device 100 includes a lower socket 40 mounted on the tester 30, a socket housing 111 and a guide housing 120 on which the lower socket 40 is mounted, and an upper socket 60. A pusher 50 that is mounted and can move by receiving a moving force from a driving unit (not shown), an upper socket 60 coupled to the pusher 50, and a pusher 50 to adsorb the lower semiconductor package 10. ) includes a suction pad 70 that is movably coupled to the.

The lower socket 40 is mounted on the tester 30 and electrically connects the tester 30 and the lower semiconductor package 10 located above. The lower socket 40 is disposed within the socket housing 111 and includes a first conductive portion 41 and an insulating portion 42.

The first conductive portion 41 may be in the form of conductive particles aligned within an elastic insulating material, or may be in the form of a pogo pin with a built-in spring.

The pusher 50 may receive a moving force from the driving unit to move closer to the lower socket 40 or move away from the lower socket 40. The pusher 50 is provided with a chamber 52 for accommodating the upper semiconductor package 20 inside and a vacuum passage 51 for transmitting vacuum pressure, and the vacuum passage 51 is provided with an external vacuum pressure generator ( (not shown) can transmit the vacuum pressure generated by the vacuum pressure generator to the adsorption pad 70.

The upper socket 60 is coupled to one side of the pusher 50 to seal the chamber 52. The upper socket 60 is equipped with an upper semiconductor package 20 placed in the chamber 52 (the upper semiconductor package may be a pre-selected good quality package), and during testing, a lower semiconductor package 10 placed below and are electrically connected. The upper socket 60 includes an insulating pad 62 covering the chamber 52 and a plurality of second conductive portions 61 supported by the insulating pad 62.

The insulating pad 62 may be made of an elastic insulating material or an inelastic insulating material. The insulating pad 62 made of a non-elastic insulating material is advantageous for pressing the lower semiconductor package 10 toward the lower socket 40 when the upper socket 60 is connected to the lower semiconductor package 10. When the insulating pad 62 of the inelastic insulating material stably presses the lower semiconductor package 10, the lower terminal 11 of the lower semiconductor package 10 is stably connected to the first conductive portion 41 of the lower socket 40. can be connected. Polyimide, engineering plastic, or various other non-elastic insulating materials may be used as such inelastic insulating materials. Alternatively, the insulating pad 62 may be made of an elastic insulating material, and a heat-resistant polymer material with a cross-linked structure, for example, silicone rubber, etc. may be used as the elastic insulating material.

The insulating pad 62 is provided with an insulating pad hole 63. The insulating pad hole 63 is connected to the vacuum passage 51 of the chamber 52 so that the vacuum pressure of the chamber 52 can be transmitted.

The second conductive portion 61 is formed to penetrate the insulating pad 62 in the thickness direction and is supported by the insulating pad 62. The second conductive portion 61 may be formed in an elastic insulating material containing a plurality of conductive particles, and the elastic insulating material constituting the second conductive portion 61 is the elastic insulating material of the insulating pad 62. The same material may be used.

Vacuum pressure or release pressure is transmitted to the suction pad 70 through the vacuum passage 51, chamber 52, and insulating pad hole 63 by the operation of the vacuum pressure generator. The suction pad 70 descends while maintaining a vacuum state to adsorb the lower semiconductor package 10 to be inspected, and when the pusher 50 presses the upper socket 60, the suction pad 70 is compressed and the lower semiconductor package ( 10) can be pressed or the vacuum state can be released to place the inspected lower semiconductor package 10 in a loading device (not shown).

Figure 2 is for explaining the operation of a test device for a semiconductor package in the package-on-package form.

As shown in (a) of FIG. 2, the pusher 50 is moved by the driving unit and the suction pad 70 is lowered to adsorb the lower semiconductor package 10, and then the suction pad 70 absorbs the lower semiconductor package. (10) is carried over the lower socket 40 so that the lower terminal 11 of the lower semiconductor package 10 is placed in contact with the first conductive portion 41 of the lower socket 40.

Thereafter, as shown in (b) of FIG. 2, when the pusher 50 moves toward the lower socket 40, the suction pad 70 is compressed and pressurizes the lower semiconductor package 10. The lower terminal 11 of the lower socket 40 is connected to the first conductive portion 41, and by moving the pusher 50, the second conductive portion 61 of the upper socket 60 is connected to the lower semiconductor package ( It is connected to the upper terminal 12 of 10). At this time, the pressing force of the pusher 50 is transmitted to the lower semiconductor package 10 through the upper socket 60, so that the tester 30, the lower socket 40, the lower semiconductor package 10, and the upper socket 60 ) and the upper semiconductor package 20 are electrically connected. In this state, the test signal generated from the tester 30 is transmitted to the lower semiconductor package 10 and the upper semiconductor package 20 to determine whether the lower semiconductor package 10 is operating normally and whether the upper semiconductor package 10 is in operation. An electrical test can be performed to determine whether it is properly matched to (20).

After the test is completed, the suction pad 70 of the vacuum picker rises, and the lower semiconductor package 10 adsorbed on the suction pad 70 is unloaded from the lower socket 40 according to the movement of the pusher 50 and loaded. It may be transferred to a device (not shown).

In this way, in the package-on-package (POP) type semiconductor package test device that tests the upper semiconductor package and the lower semiconductor package, the suction pad 70 plays the role of adsorbing (picking) and loading (place) the semiconductor package. It has a structure that serves to push the semiconductor package into the silicone rubber socket and is in contact with the lower semiconductor package for a long period of time. In particular, in the case of reliability testing, the suction pad is in contact with the lower semiconductor package for a period of 1 to 2 weeks. In order to solve the problem that the semiconductor package that has been inspected is not properly seated on the loading device due to the sticky phenomenon in which the semiconductor package sticks to the suction pad 70 due to the silicone oil eluted from the suction pad 70, the adsorption method of the present invention is used. The pad (700) was developed.

Figure 4 is a cross-sectional view and a perspective view showing the structure of a suction pad according to an embodiment of the present invention, Figure 5 shows a groove formed on the lower surface of the contact part according to an embodiment of the present invention, and Figure 6 is an embodiment of the present invention. This shows that a step is formed on the lower surface of the contact part according to the embodiment.

As shown in the drawing, the suction pad 700 according to an embodiment of the present invention has a vacuum hole 711, a body portion 710 made of silicon material, and a diameter larger than the body portion 710, It is provided with a contact hole 721 at a position corresponding to the vacuum hole 711, and includes a contact portion 720 made of any one of polyimide film, engineering plastic, or synthetic resin, and the upper surface of the contact portion 720 A body portion 710 is attached at the center, and on the lower surface 722 of the contact portion 720, a contact surface 730 that is in contact with the lower semiconductor package 10 and a non-contact surface 740 that is not in contact with the lower semiconductor package are spaced at regular intervals. It is formed by

The body portion 710 forms the body of the suction pad 700, and has a vacuum hole 711 formed through it in the center. The vacuum pressure or release pressure provided by the operation of the vacuum pressure generator is transmitted to the vacuum hole 711 through the vacuum passage 51 of the pusher, the chamber 52, and the insulating pad hole 63. This body portion 710 is made of silicone material to increase vacuum adsorption performance.

The contact portion 720 is formed at a portion that is in direct contact with the semiconductor package, and may be made of a hard anti-adhesion material such as polyimide film, engineering plastic, or synthetic resin. Therefore, since the part of the suction pad 700 that is in close contact with the semiconductor package is made of an anti-adhesion material, it is possible to prevent the semiconductor package from sticking to the suction pad 700.

A contact hole 721 is formed in the contact portion 720 at a position corresponding to the vacuum hole 711 of the body portion 710. The semiconductor package is adsorbed by the vacuum pressure transmitted through the contact hole 721 that is in communication with the vacuum hole 711.

The contact portion 720 has a larger diameter than the body portion 710, and the body portion 710 is attached to the central portion of the upper surface, and the body portion is attached to the outer circumference of the upper surface of the contact portion 720 to which the body portion 710 is not attached. An oil receiving portion 712 is formed to accommodate silicone oil eluted from the outside of the portion 710.

The body portion 710 is made of a silicon material. When the semiconductor package is adsorbed and pressed, vacuum pressure is transmitted to the body portion 710 of the suction pad 700 and is in a compressed state. In this compressed state, the silicon Due to the nature of the material, it has a structure in which silicone oil cannot but be leached.

Moreover, as in a package-on-package type semiconductor package test device, when the suction pad 700 is pressed while adsorbing and pressing the semiconductor package for a long period of time, silicone oil eluted from the body portion 710 of the suction pad 700. The amount increases. Since the suction pad 700 of the present invention has a structure in which the contact portion 720 has a larger diameter than the body portion 710 and is provided with an oil receiving portion 712, the oil eluted from the body portion 710 is stored in the oil receiving portion. Since it accumulates at 712 and then moves to the lower surface of the contact portion 720, it is possible to prevent the semiconductor package from sticking to the suction pad 700.

In addition, as the thickness (a) of the body portion 710 made of silicone increases, the amount of silicone oil eluted increases, and as the thickness (b) of the contact portion 720 made of a hard anti-adhesion material increases, the entire suction pad Since the load may increase and cause damage to the semiconductor package, the thickness (b) of the contact portion 720 should be formed to have a thickness of about 5% to 10% of the total thickness (h) of the suction pad 700. desirable.

In addition, as shown in FIGS. 5 and 6, the lower surface 722 of the contact portion 720 facing the lower semiconductor package has a contact surface 730 that is in contact with the lower semiconductor package 10 and a non-contact surface that does not contact the lower semiconductor package. By forming the surfaces 740 at regular intervals so that only the contact surface 730 of the lower surface 722 of the contact part 720 is in contact with the lower semiconductor package 10, the area where the contact part 720 and the lower semiconductor package 10 are in contact By reducing , the semiconductor package can be prevented from sticking to the suction pad 700.

As shown in (a) of FIG. 5, straight grooves 723 are formed at regular intervals on the lower surface 722 of the contact portion, so that the non-contact surface 740 formed by the straight groove portion 723 and the contact portion are separated. A contact surface 730 may be formed on the lower surface 722 on which the groove is not formed. The cross-sectional shape of the linear groove 723 is preferably square, but it may also be a tapered shape with a diameter gradually decreasing from the bottom of the contact portion, and may be formed in various shapes depending on the method of forming the groove. Figure 5(c) exemplarily shows that the cross-sectional shape of the groove portion is square.

In addition, as shown in Figure 5(b), another straight groove 724 has the same shape as the straight groove 723 in Figure 5(a) and is orthogonal to the straight groove 723. It is also possible to form grid-shaped grooves 723 and 724 on the lower surface 722 of the contact part at regular intervals. The non-contact surface 740, which is not in contact with the lower semiconductor package, is formed by grooves in the form of a grid pattern, and the contact surface 730, which is in contact with the lower semiconductor package, is formed by grooves in the form of a grid pattern on the lower surface 722 of the contact part. It can be formed on the surface.

The groove formed on the lower surface 722 of the contact portion shown in FIG. 5 can be formed using a laser and can be formed by various methods, such as etching with a cutting tool.

In addition, as shown in (a) of FIG. 6, a step portion 725 protruding in the shape of a fence is formed at the center portion of the lower surface of the contact portion 720 formed in a ring shape. The step portion 725 has a ring shape and is disposed concentrically with the contact portion 720 at the center portion of the lower surface of the contact portion 720. The cross-sectional shape of the step portion 725 may be square or an equilateral trapezoidal shape, and a contact surface 730 that contacts the lower semiconductor package is formed on the upper surface of the step portion 725. Accordingly, the lower surface of the contact portion where the step portion 725 is not formed corresponds to the non-contact surface 740 that does not contact the lower semiconductor package. Figure 6(c) exemplarily shows that the cross-sectional shape of the step portion is square.

In (a) of FIG. 6, one step portion 725 is formed, but as in (b) of FIG. 6, two step portions 725 can be formed, and although not shown, it is also possible to form three or more step portions 725.

In the present invention, the area of the contact surface 730 formed on the lower surface 722 of the contact part is preferably 30% to 70% of the area of the lower surface of the contact part 720. If the area of the contact surface 730 is less than 30% of the area of the bottom of the contact portion 720, it may be difficult to stably support the semiconductor package during the process of picking and loading the semiconductor package, and the contact surface 730 ) If the area of the semiconductor package is larger than 70% of the bottom area of the contact portion 720, it may be difficult to sufficiently prevent the sticky phenomenon in which the inspected semiconductor package sticks to the contact portion 720 and is difficult to place in the loading device.

In this way, the suction pad 700 of the present invention changes the shape of the lower surface of the contact part 720 in contact with the lower semiconductor package to form a non-contact surface that does not contact the lower semiconductor package 10 on the lower surface 722 of the contact part 720. By reducing the contact area between the contact portion 720 and the lower semiconductor package 10 by forming 740, the lower semiconductor package 10 can be prevented from sticking to the contact portion 720.

In the package-on-package (POP) type semiconductor package test device for testing the upper and lower semiconductor packages of the present invention, the suction pad 700 plays the role of adsorbing (picking) and loading (place) the semiconductor package. It also plays the role of pushing the semiconductor package into the silicone rubber socket, and since it is a structure that compresses the semiconductor package for a long time during testing, a contact portion 720 made of an anti-adhesion member is located at the bottom of the body portion 710 made of an elastic material such as silicon. ) Even if the suction pad 700 is attached to the bottom of the body portion 710, the silicone oil is eluted from the body portion 710 of the suction pad 700 and the eluted oil is collected at the bottom of the contact portion 720 to form a semiconductor material. A sticky phenomenon may occur where the package sticks to the contact portion 720 of the suction pad 700, but in the present invention, an oil container that can accommodate the oil eluted from the body portion 710 of the suction pad 700 is used. A non-contact part is formed on the lower surface of the contact part 720 of the suction pad 700 to reduce the contact area between the contact part 720 and the semiconductor package, thereby causing a sticky phenomenon in which the semiconductor package sticks to the suction pad 700. This can be completely prevented from occurring.

In addition, the semiconductor package testing device 100 according to an embodiment of the present invention is a device for loading the semiconductor package that has been inspected after the test because the semiconductor package does not stick to the suction pad even when testing a semiconductor package in the package-on-package form. It can be easily positioned, which has the effect of efficiently carrying out the entire testing process.

Although the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, those skilled in the art will understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

10: lower semiconductor package 11: lower terminal
12: upper terminal 20: upper semiconductor package
21: upper semiconductor package terminal 30: tester
40: lower socket 41: first conductive portion
50: Pusher 51: Vacuum passage
52: Chamber 60: Upper socket
61: second conductive portion 62: insulating pad
63: Insulating pad hole 70, 700: Suction pad
100: Test device for semiconductor package
710: Body 711: Vacuum hole
712: Oil receiving part 720: Contact part
721: contact hole 722: lower surface
723, 724: groove part 725: step part
730: contact surface 740: non-contact surface

Claims (7)

An upper socket mounted on a pusher, mounted on an upper semiconductor package and connected to a lower semiconductor package placed on the lower side, and a lower socket connected to the lower semiconductor package mounted on a tester and placed on the upper side, are movably coupled to the pusher, In the semiconductor package test device for testing a package-on-package type (POP) semiconductor package, including an adsorption pad capable of adsorbing and pressurizing the lower semiconductor package by receiving vacuum pressure through the pusher,
The suction pad includes a body made of silicone having a vacuum hole,
It has a diameter larger than that of the body, has a contact hole at a position corresponding to the vacuum hole, and includes a contact portion made of any one of polyimide film, engineering plastic, and synthetic resin,
A test device for a semiconductor package, characterized in that a contact surface in contact with the lower semiconductor package and a non-contact surface not in contact with the lower semiconductor package are formed on the lower surface of the contact portion at regular intervals. According to paragraph 1,
A test device for a semiconductor package, wherein the non-contact surface is formed by a straight groove portion. According to paragraph 1,
A test device for a semiconductor package, wherein the non-contact surface is formed by grid-shaped grooves. According to paragraph 1,
A test device for a semiconductor package, wherein the contact surface is formed by a ring-shaped step portion that protrudes in the shape of a fence. According to clause 4,
A test device for a semiconductor package, characterized in that a plurality of the ring-shaped step portions are formed. According to any one of claims 1 to 5,
A test device for a semiconductor package, characterized in that the area of the contact surface is 30% to 70% of the area of the lower surface of the contact portion. According to any one of claims 1 to 5,
A test device for a semiconductor package, characterized in that the thickness of the contact portion is 5% to 10% of the thickness of the suction pad.

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