KR102616190B1 - Method for cleaning head, method for cleaning nozzle plate and apparatus for substrate - Google Patents

Abstract

The present invention provides a method for cleaning a head equipped with at least one nozzle that discharges ink. The head cleaning method includes a curing step of curing the ink attached to the surrounding area of the nozzle; and a removal step of removing the cured ink from the nozzle plate by contacting a removal member, which is a tape, with the lower surface of the nozzle plate on which the nozzle is formed.

Description

Head cleaning method, nozzle plate cleaning method, and substrate processing device {METHOD FOR CLEANING HEAD, METHOD FOR CLEANING NOZZLE PLATE AND APPARATUS FOR SUBSTRATE}

The present invention relates to a head cleaning method, a nozzle cleaning method, and a substrate processing device.

Recently, display devices such as liquid crystal display devices and organic EL display devices are required to have high resolution. In order to manufacture a display device with high resolution, more pixels must be formed per unit area on the substrate, and it is important to accurately discharge a chemical solution such as ink into each of these densely arranged pixels. If this is not the case, the display element manufactured as a defect may be determined to be defective. Therefore, according to related technologies, in the manufacture of display elements, it is required to accurately manage the discharge point (eg, dot) of the chemical liquid discharged to each pixel and the discharge amount of the chemical liquid.

In order to accurately manage the ink discharge point and the ink discharge amount, it is important to properly remove ink attached to the nozzle that discharges ink and the nozzle plate on which the nozzle is formed. Recently, as the amount of ink ejected from each pixel decreases, the size of the nozzle also decreases. Accordingly, it is becoming difficult to remove ink attached to the inside of the nozzle. If the ink attached to the nozzle and the nozzle plate is not properly removed, the ink attached to the nozzle plate is transferred to the substrate to be processed and contaminates the substrate.
[Prior art literature]
(Patent Document 1) KR 2020-0108950 A

One object of the present invention is to provide a head cleaning method, a nozzle plate cleaning method, and a substrate processing device that can effectively perform maintenance on the head.

Another object of the present invention is to provide a head cleaning method, a nozzle plate cleaning method, and a substrate processing apparatus that can effectively remove processing liquid (eg, ink) attached to a head or nozzle plate.

Another object of the present invention is to provide a head cleaning method, a nozzle plate cleaning method, and a substrate processing device that can minimize impurities transferred to a substrate.

The object of the present invention is not limited here, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

The present invention provides a method for cleaning a head equipped with at least one nozzle that discharges ink. The head cleaning method includes a curing step of curing the ink attached to the surrounding area of the nozzle; and a removal step of removing the cured ink from the nozzle plate by contacting a removal member, which is a tape, with the lower surface of the nozzle plate on which the nozzle is formed.

According to one embodiment, in the curing step, the ink may be cured by irradiating light to the lower surface of the nozzle plate.

According to one embodiment, the light irradiated to the lower surface of the nozzle plate may include at least one of infrared light and ultraviolet light.

According to one embodiment, the removal member may be a non-adhesive tape.

According to one embodiment, the method may include an absorption step of cleaning the nozzle plate on which the ink remains by contacting an absorbing member capable of absorbing the ink with the lower surface of the nozzle plate on which the nozzle is formed. .

According to one embodiment, the absorption step may be performed before the curing step or after the removal step.

According to one embodiment, the removal step may be performed repeatedly multiple times.

Additionally, the present invention provides a method for cleaning a nozzle plate on which nozzles for discharging a processing liquid are formed. The nozzle plate cleaning method includes a curing step of curing the treatment liquid attached to the surrounding area of the nozzle by irradiating light to the lower surface of the nozzle plate; and a removal step of removing the hardened treatment liquid from the nozzle plate by contacting and separating a removal member, which is a tape, from the lower surface of the nozzle plate.

According to one embodiment, the light irradiated to the lower surface of the nozzle plate may include ultraviolet light.

According to one embodiment, the removal member may be a non-adhesive tape.

According to one embodiment, the method may include an absorption step of cleaning the nozzle plate on which the processing liquid remains by contacting an absorbing member capable of absorbing the processing liquid with the lower surface of the nozzle plate on which the nozzle is formed. You can.

According to one embodiment, the absorption step may be performed before the curing step or after the removal step.

According to one embodiment, the removal step may be performed repeatedly multiple times.

Additionally, the present invention provides an apparatus for processing a substrate. A substrate processing apparatus includes: a head unit that performs a printing process by ejecting ink onto a substrate and has a nozzle plate on which nozzles for discharging the ink are formed; an irradiation unit that irradiates light to a lower surface of the nozzle plate; and a removal unit attached to a peripheral area of the nozzle and removing the ink cured by the light from the nozzle plate by bringing a removal member, which is a tape, into contact with the nozzle plate.

According to one embodiment, the removal unit includes: a supply unit that supplies the removal member in contact with the lower surface of the nozzle plate; a recovery unit that recovers the removal member supplied by the supply unit; At least one support part disposed between the supply part and the recovery part and supporting the removal member; And it may include a body in which the supply part, the recovery part, and the support part are installed.

According to one embodiment, the support part supports a lower surface of the removal member and includes at least one support component made of a material containing silicon; and a support frame coupling the support component to the body.

According to one embodiment, the removal unit further includes a lifting unit that elevates at least one of the supply unit, the recovery unit, and the support unit so that the removal member supplied by the supply unit can contact the nozzle plate. It can be included.

According to one embodiment, the device further includes an absorption unit that cleans the nozzle plate on which the ink remains by contacting an absorption member capable of absorbing the ink with a lower surface of the nozzle plate, the absorption unit , a supply unit that supplies the absorbent member in contact with the lower surface of the nozzle plate; a recovery unit that recovers the absorbent member supplied by the supply unit; At least one support part disposed between the supply part and the recovery part and supporting the absorbent member; And it may include a body in which the supply part, the recovery part, and the support part are installed.

According to one embodiment, the device further includes a controller, wherein the irradiation unit irradiates the light to the lower surface of the nozzle plate to cure the ink attached to the peripheral area of the nozzle, The irradiation unit and the removal unit may be controlled to remove the hardened ink from the lower surface of the nozzle plate by bringing a removal member into contact with the lower surface of the nozzle plate.

According to one embodiment, the device further includes a controller, wherein the irradiation unit irradiates the light to the lower surface of the nozzle plate to cure the ink attached to the peripheral area of the nozzle, The cured ink is removed from the lower surface of the nozzle plate by contacting a removal member with the lower surface of the nozzle plate, before the irradiation unit irradiates the light to the lower surface of the nozzle plate, or when the removal member is brought into contact with the lower surface of the nozzle plate. The irradiation unit, the removal unit, and the absorption unit can be controlled to clean the nozzle plate by bringing the absorbing member into contact with the lower surface of the nozzle plate.

According to an embodiment of the present invention, maintenance on the head can be performed effectively.

Additionally, according to an embodiment of the present invention, processing liquid (eg, ink) attached to the head or nozzle plate can be effectively removed.

Additionally, according to an embodiment of the present invention, impurities transferred to the substrate can be minimized.

The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing the head unit, absorption unit, irradiation unit, and removal unit of FIG. 1.
Figure 3 is a diagram showing the nozzle plate of the head of Figure 2.
Figure 4 is a diagram showing a head cleaning method according to an embodiment of the present invention.
FIG. 5 is a diagram showing a substrate processing apparatus performing the absorption step of FIG. 4.
Figure 6 is a diagram showing the nozzle plate in a state in which the absorption step of Figure 4 has been performed.
FIG. 7 is a diagram showing a substrate processing device performing the curing step of FIG. 4.
FIG. 8 is a view showing the nozzle plate in a state in which the curing step of FIG. 4 has been performed.
FIG. 9 is a diagram showing a substrate processing apparatus performing the removal step of FIG. 4.
Figure 10 is a diagram showing the removal member in contact with the nozzle plate in the removal step of Figure 4.
FIG. 11 is a diagram showing the nozzle plate in a state in which the removal step of FIG. 4 has been performed.
12 and 13 are views showing the nozzle plate when the head cleaning method according to an embodiment of the present invention is not applied.
Figures 14 and 15 are views showing the nozzle plate when the head cleaning method according to an embodiment of the present invention is applied.
16 is a diagram showing a substrate processing apparatus according to another embodiment of the present invention.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Additionally, when describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same symbols are used throughout the drawings for parts that perform similar functions and actions.

'Including' a certain component does not mean excluding other components, but rather including other components, unless specifically stated to the contrary. Specifically, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to include one or more other features or It should be understood that this does not exclude in advance the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Additionally, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used for the purpose of distinguishing one component from another component. For example, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component without departing from the scope of the present invention.

When a component is said to be “connected” or “connected” to another component, it is understood that it may be directly connected to or connected to that other component, but that other components may also exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Other expressions that describe the relationship between components, such as "between" and "immediately between" or "neighboring" and "directly adjacent to" should be interpreted similarly.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted as having an ideal or excessively formal meaning. .

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 2 to 10.

1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, a substrate processing apparatus 100 according to an embodiment of the present invention may be an inkjet device that processes a substrate (S) by supplying a processing liquid such as ink (I) onto the substrate (S). For example, the substrate processing apparatus 100 may perform a printing process on the substrate S by discharging ink I on the substrate S. Additionally, the substrate S may be a glass substrate. However, it is not limited to this and the type of substrate S may be modified in various ways.

The substrate processing device 100 includes a printing area 10, a maintenance area 20, a gantry 30, a head unit 40, a nozzle alignment unit 50, a fourth vision unit 60, and an absorption unit ( 70), an irradiation unit 80, a removal unit 90, and a controller 200.

When viewed from the top, the printing area 10 may have a longitudinal direction in the first direction (X). Hereinafter, when viewed from the top, the direction perpendicular to the first direction (X) is referred to as the second direction (Y), and the direction perpendicular to the first direction (X) and the second direction (Y) is referred to as the third direction. It is called (Z). The third direction (Z) may be a direction perpendicular to the ground. Additionally, the first direction (X) may be a direction in which the substrate (S), which will be described later, is transported. In the printing area 10, the head unit 40, which will be described later, discharges ink to the substrate S to perform a printing process on the substrate S.

Additionally, the substrate S transferred from the printing area 10 may remain in a floating state. Accordingly, the printing area 10 may be provided with a levitation stage capable of levitating the substrate S when transferring the substrate S. Additionally, the printing area 10 may further include a transfer unit that grips and transfers one or both sides of the substrate S. The mentioned transfer unit may include a guide rail provided along one or both sides of the floating stage and a gripper that slides along the guide rail while holding one or both sides of the substrate (S). Additionally, the substrate S transferred from the printing area 10 may be transferred along the first direction (X).

In the maintenance area 20, maintenance can mainly be performed on the head unit 40, which will be described later. For example, in the maintenance area 20, the status of the head unit 40 may be checked or cleaning of the head unit 40 may be performed. When viewed from the top, the maintenance area 20 may have a longitudinal direction in the first direction (X). Additionally, the maintenance area 20 may be arranged parallel to the printing area 10. For example, the maintenance area 20 and the printing area 10 may be arranged side by side along the second direction (Y).

In addition, in the case of the maintenance area 20, ink (I) is used to correct the point of ink (I) ejected by the head unit 40, which will be described later, to adjust the volume of ink (I) droplets, and to control the amount of ink (I) discharged. Since ejection can occur, it can have a process environment that is the same or similar to the printing area 10.

The gantry 30 can be provided so that the head unit 40, which will be described later, or the fourth vision unit 60, which will be described later, can perform this straight reciprocating movement. The gantry 30 may include a first gantry 31, a second gantry 32, and a third gantry 33. The first gantry 31 and the second gantry 32 may be provided to have a structure extending along the printing area 10 and the maintenance area 20. Additionally, the first gantry 31 and the second gantry 32 may be arranged to be spaced apart from each other along the first direction (X). That is, the first gantry 31 and the second gantry 32 have a printing area 10 and a maintenance area 20 arranged so that the head unit 40, which will be described later, can move along the second direction (Y). It may be provided to have a structure extending along the second direction (Y).

Additionally, the third gantry 33 may be provided to have a structure extending along the printing area 10 in the second direction (Y). That is, the third gantry 33 may be provided to have a structure that extends so that the fourth vision unit 60 can move along the second direction (Y). The fourth vision unit 60 moves back and forth along the third gantry 33, and the head unit 40, which will be described later, discharges the ink (I) from the maintenance area (20). An image that can confirm the amount can be obtained. For example, the head unit 40 discharges ink (I) on a calibration board (not shown) that can be provided in the maintenance area 20, and the calibration board is moved to the lower area of the fourth vision unit 60, The fourth vision unit 60 can acquire an image of the calibration board on which ink (I) is discharged. The image acquired by the fourth vision unit 60 may be transmitted to the controller 200, which will be described later. The fourth vision unit 60 may be a camera including an image acquisition module.

FIG. 2 is a diagram schematically showing the head unit, absorption unit, irradiation unit, and removal unit of FIG. 1, and FIG. 3 is a diagram showing the nozzle plate of the head of FIG. 2.

Referring to FIGS. 1 to 3 , the head unit 40 may discharge ink (I) droplets onto the substrate (S). The head unit 40 may perform a printing process on the substrate S by discharging ink I onto the substrate S. For example, the head unit 40 may perform a printing process on the substrate S by discharging ink droplets I onto the substrate S while reciprocating along the second direction Y.

The head unit 40 may include a head 42, a head frame 44, a head interface board 45, a first vision unit 46, and a second vision unit 48.

The heads 42 may be provided in plural numbers. The plurality of heads 42 may be arranged side by side along the first direction (X). A plurality of heads 42 may be fitted into the head frame 44 . Additionally, the head 42 may include a nozzle plate 42a on which a plurality of nozzles 42b that discharge ink I are formed.

Additionally, a head interface board 45 may be installed on the head frame 44. The head interface board 45 can control the head 42 to control the ejection amount and/or ejection time of ink (I) ejected by the head 42. The head interface board 45 may receive a control signal from the controller 200, which will be described later, and control the heads 42 based on the received signal.

The first vision unit 46 and the second vision unit 48 may be installed on the head frame 44, which will be described later. Additionally, when viewed from the top, the first vision unit 46 and the second vision unit 48 may be coupled to one side of the head 42. The first vision unit 46 and the second vision unit 48 acquire images that allow the head unit 40 to confirm the dots of ink (I) ejected onto the substrate (S) and the amount of ink (I) ejected. can do. For example, when the head unit 40 discharges ink (I) onto the substrate (S) provided in the printing area (10), the first vision unit (46) and the second vision unit (48) The captured image may be transmitted to the controller 200, which will be described later. The user can determine the dots of the ink (I) discharged on the substrate (S) or the ink (I) through the images captured by the first vision unit (46) and the second vision unit (48) transmitted to the controller (200). You can check the discharge amount. The first vision unit 46 and the second vision unit 48 may be arranged side by side along the first direction (X). The first vision unit 46 and the second vision unit 48 may be cameras that can check the ink (I) ejected by the head 42.

The head 42 may be movably coupled to the first gantry 31 and the second gantry 32 via the head frame 44. For example, the head 42 may be provided to be movable along the second direction Y, which is the longitudinal direction of the first gantry 31 and the second gantry 32. In addition, the head 42 reciprocates in a straight line between the printing area 10 and the maintenance area 20 along the second direction (Y), which is the longitudinal direction of the first gantry 31 and the second gantry 32. You can move.

Referring again to FIG. 1, the nozzle alignment unit 50 may be provided in the maintenance area 20. The nozzle alignment unit 50 may be provided between the first gantry 31 and the second gantry 32 when viewed from the top. Accordingly, the nozzle aligner 50 can check the status of the nozzles 42b formed on the head 42. For example, the nozzle alignment unit 50 may include a moving rail 52 and a third vision unit 54. The moving rail 52 may have a longitudinal direction in the first direction (X). The third vision unit 54 can reciprocate in a straight line along the first direction (X), which is the longitudinal direction of the moving rail 52. The third vision unit 54 can image the nozzles 42b of the head 42 while moving along the longitudinal direction of the moving rail 52.

The absorption unit 70 can clean the nozzle plate 42a on which ink (I) remains by contacting the absorption member 71 capable of absorbing ink (I) with the lower surface of the nozzle plate (42a). The absorption unit 70 may be provided in the maintenance area 20 . The absorption unit 70 may be moved along the first direction (X) in the maintenance area 20 through a moving rail such as an LM guide. The specific structure of the absorption unit 70 will be described later.

The irradiation unit 80 may cure the ink (I) attached to the nozzle plate (42a) by irradiating light (L) to the lower surface of the nozzle plate (42a). The irradiation unit 80 may be provided in the maintenance area 20 . The irradiation unit 80 may be moved along the first direction (X) in the maintenance area 20 through a moving rail such as an LM guide. The specific structure of the absorption unit 70 will be described later.

The removal unit 90 is attached to the surrounding area of the nozzle 42b formed on the nozzle plate 42a, and removes the ink I cured by the light L irradiated by the irradiation unit 80 using a removal member such as a tape. Ink I that has passed from the nozzle plate 42a can be removed by contacting the nozzle plate 42a. The removal unit 90 may be provided in the maintenance area 20 . The removal unit 90 may be moved along the first direction (X) in the maintenance area 20 through a moving rail such as an LM guide. The specific structure of the removal unit 90 will be described later.

Additionally, the absorption unit 70, the irradiation unit 80, and the removal unit 90 may be sequentially arranged along the first direction (X). For example, the absorption unit 70, the irradiation unit 80, and the removal unit 90 may sequentially reach the lower area of the head unit 40 when moved. Units 90 may be sequentially arranged along the first direction (X).

The controller 200 may control the substrate processing apparatus 100 . The controller 200 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 can perform a printing process on the substrate S. In addition, the controller 200 operates the head unit 40 of the substrate processing apparatus 100 so that the head unit 40 can perform a printing process on the substrate S by discharging the ink I to the substrate S. can be controlled. Additionally, the controller 200 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 can perform maintenance on the head unit 40 . For example, the controller 200 may direct the absorption unit 70, the irradiation unit 80, and the removal unit 90 to clean the head 42. (90) can be controlled. In addition, the controller 200 operates the absorption unit 70, the irradiation unit 80, and the absorption unit 70 and the irradiation unit so that the control unit 90 can clean the nozzle plate 42a on which the nozzle 42b is formed. (80), and the removal unit (90) can be controlled. Additionally, the controller 200 operates the substrate processing apparatus 100 so that the substrate processing apparatus 100 can perform a head cleaning method (e.g., a cleaning method of the nozzle plate 42a on which the nozzle 42b is formed) described below. can be controlled.

In addition, the controller 200 includes a process controller consisting of a microprocessor (computer) that controls the substrate processing device 100, a keyboard through which the operator performs command input operations, etc. to manage the substrate processing device 100, A user interface consisting of a display that visualizes and displays the operating status of the substrate processing device 100, a control program for executing the processing performed in the substrate processing device 100 under the control of the process controller, and various data and processing conditions. Accordingly, each component may be provided with a storage unit in which a program for executing processing, that is, a processing recipe, is stored. Additionally, the user interface and storage may be connected to the process controller. The processing recipe may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or a semiconductor memory such as a flash memory.

Referring to FIG. 2, the absorption unit 70 includes a first supply unit 72, a first recovery unit 73, a 1-1 roller 74-1, a 1-2 roller 74-2, It may include a first support part 75, a first lifting part 76, and a first body 77. As described above, the absorption unit 70 can clean the nozzle plate 42a on which the ink (I) remains by contacting the absorption member 71, which absorbs the ink (I), with the lower surface of the nozzle plate (42a). . The absorbent member 71 may be made of cloth. Additionally, the absorbent member 71 may be made of a material containing polyester.

The first supply unit 72 may supply the absorption member 71 in contact with the lower surface of the nozzle plate 42a. The first supply unit 72 may be a rotatable roller. The first recovery unit 73 can recover the absorbent member 71 supplied by the first supply unit 72. The first recovery unit 73 may be a rotatable roller. An absorbent member 71 may be wound around the first supply unit 72. When the first supply unit 72 rotates, the first recovery unit 73 may also rotate together. Accordingly, the absorption member 71 wound around the first supply unit 72 can be wound around the first recovery unit 73. Additionally, the first supply unit 72 and the first recovery unit 73 may be installed in the first body 77, which will be described later.

In addition, the 1-1 roller 74-1 and the 1-2 roller 74-2 are disposed outside the first supply unit 72 and the first recovery unit 73 when viewed from the top. It can be. The 1-1 roller 74-1 and the 1-2 roller 74-2 may be installed on the first body 77, which will be described later. Additionally, the 1-1 roller 74-1 and the 1-2 roller 74-2 may be disposed on the first supply unit 72 and the first recovery unit 73. The 1-1 roller 74-1 and the 1-2 roller 74-2 enable the absorption member 71 supported by the first support portion 75, which will be described later, to be tensioned.

The first support part 75 may be disposed between the first supply part 72 and the first recovery part 73 based on the path along which the absorbent member 71 moves. The first support part 75 can support the absorption member 71 supplied by the first supply part 72 and recovered by the first recovery part 73. The first support portion 75 may be installed on the first body 77, which will be described later. Additionally, the first support portion 75 may be disposed to face the lower surface of the nozzle plate 42a of the head 42. Additionally, the first support portion 75 may include a first support component 75-1 and a first support frame 75-2. The first support frame 75-2 may be installed on the first body 77, which will be described later, and the first support component 75-1 may be installed on the first support frame 75-2. At least one first support component 75-1 may be installed on the first support frame 75-2. For example, the first support component 75-1 may be provided in plural numbers. Additionally, the first support components 75-1 may be arranged in the same direction in which the head 42 is arranged. The first support component 75-1 may be made of an elastic material. For example, the first support component 75-1 may be provided from a material containing silicon. Additionally, the first support component 75-1 may have a rounded top shape. Accordingly, problems such as the absorption member 71 being torn or scratches occurring on the lower surface of the nozzle plate 42a can be minimized.

The first lifting part 76 includes a first supply part 72, a first recovery part 73, so that the absorption member 71 supplied by the first supply part 72 can contact the nozzle plate 42a. And at least one of the first support parts 75 can be raised and lowered. For example, the first lifting unit 76 includes a first supply unit 72 and a first recovery unit 73 so that the absorption member 71 supplied by the first supply unit 72 can contact the nozzle plate 42a. ), and the first support part 75 can be raised and lowered.

In addition, the first elevating part 76 includes a first supply part 72, a first recovery part 73, a 1-1 roller 74-1, a 1-2 roller 74-2, and a first roller 74-2. 1 It can be installed at the lower part of the first body 77 where the support part 75 is installed. For example, the first lifting unit 76 may include a first lifting plate 76-1 and a first driver 76-2. The first lifting plate 76-1 may be coupled to the lower surface of the first body 77. The first driver 76-2 can move the first lifting plate 76-1 in the vertical direction. The first driver 76-2 may be provided as one of a motor, pneumatic cylinder, and hydraulic cylinder. However, it is not limited to this, and the first driver 76-2 is a known device capable of moving the first lifting plate 76-1 in the vertical direction and can be modified in various ways.

The irradiation unit 80 may radiate light L to the lower surface of the nozzle plate 42a. The irradiation unit 80 can irradiate light L to the lower surface of the nozzle plate 42a to harden the ink I present in the nozzle plate 42a into a solid that is easy to remove. The irradiation unit 80 may include a light source 81 and an irradiation unit 83. The light L generated by the light source 81 may be transmitted to the irradiation unit 83 and transmitted to the lower surface of the nozzle plate 42a. Additionally, the light L emitted by the irradiation unit 80 may include at least one of infrared light having a wavelength in the infrared region and ultraviolet light having a wavelength in the ultraviolet region.

The removal unit 90 includes a second supply unit 92, a second recovery unit 93, a 2-1 roller (94-1), a 2-2 roller (94-2), and a second support unit (95). ), a second lifting part 96, and a second body 97. As described above, the removal unit 90 is attached to the surrounding area of the nozzle 42a of the nozzle plate 42a and removes the ink I cured by the light L irradiated by the irradiation unit 80. You can. The removal unit 90 may remove the cured ink I from the nozzle plate 42a by contacting the removal member 91, which is a tape, with the nozzle plate 42a.

The removal member 91 may be a tape as described above. The removal member 91 may be a non-adhesive tape with somewhat weak adhesive force. If the removal member 91 is a tape with strong adhesive force, the adhesive material provided to the removal member 91 may be transferred to the lower surface of the nozzle plate 42a, thereby re-contaminating the lower surface of the nozzle plate 42a. However, since the removal member 91 of the present invention is provided as a non-adhesive tape, the problem of contaminating the lower surface of the nozzle plate 42a can be minimized.

The second supply unit 92 may supply the removal member 91 in contact with the lower surface of the nozzle plate 42a. The second supply unit 92 may be a rotatable roller. The second recovery unit 93 can recover the removal member 91 supplied by the second supply unit 92. The second recovery unit 93 may be a rotatable roller. A removal member 91 may be wound around the second supply unit 92. When the second supply unit 92 rotates, the second recovery unit 93 may also rotate together. Accordingly, the removal member 91 wound around the second supply unit 92 can be wound around the second recovery unit 93. Additionally, the second supply unit 92 and the second recovery unit 93 may be installed in the second body 97, which will be described later.

In addition, the 2-1 roller 94-1 and the 2-2 roller 94-2 are disposed outside the second supply unit 92 and the second recovery unit 93 when viewed from the top. It can be. The 2-1 roller 94-1 and the 2-2 roller 94-2 may be installed in the second body 97, which will be described later. Additionally, the 2-1 roller 94-1 and the 2-2 roller 94-2 may be disposed on the second supply unit 92 and the second recovery unit 93. The 2-1 roller 94-1 and the 2-2 roller 94-2 allow the removal member 91 supported on the second support portion 95, which will be described later, to be tensioned.

The second support part 95 may be disposed between the second supply part 92 and the second recovery part 93 based on the path along which the removal member 91 moves. The second support part 95 can support the removal member 91 supplied by the second supply part 92 and recovered by the second recovery part 93. The second support portion 95 may be installed on the second body 97, which will be described later. Additionally, the second support portion 95 may be disposed to face the lower surface of the nozzle plate 42a of the head 42. Additionally, the second support portion 95 may include a second support component 95-1 and a second support frame 95-2. The second support frame 95-2 may be installed on the second body 97, which will be described later, and the second support component 95-1 may be installed on the second support frame 95-2. At least one second support component 95-1 may be installed on the second support frame 95-2. For example, the second support component 95-1 may be provided in plural numbers. Additionally, the second support components 95-1 may be arranged in the same direction in which the head 42 is arranged. The second support component 95-1 may be made of an elastic material. For example, the second support component 95-1 may be provided from a material containing silicon. Additionally, the second support component 95-1 may have a rounded top shape. Accordingly, problems such as tearing of the removal member 91 or scratches on the lower surface of the nozzle plate 42a can be minimized.

The second lifting part 96 includes a second supply part 92, a second recovery part 93, so that the removal member 91 supplied by the second supply part 92 can contact the nozzle plate 42a. And at least one of the second support parts 95 can be raised and lowered. For example, the second lifting unit 96 includes a second supply unit 92 and a second recovery unit 93 so that the removal member 91 supplied by the second supply unit 92 can contact the nozzle plate 42a. ), and the second support part 95 can be raised and lowered.

In addition, the second elevating part 96 includes a second supply part 92, a second recovery part 93, a 2-1 roller 94-1, a 2-2 roller 94-2, and a second roller 94-2. It can be installed at the lower part of the second body 97 where the second support part 95 is installed. For example, the second lifting unit 96 may include a second lifting plate 96-1 and a second driver 96-2. The second lifting plate 96-1 may be coupled to the lower surface of the second body 97. The second driver 96-2 can move the second lifting plate 96-1 in the vertical direction. The second driver 96-2 may be provided as one of a motor, pneumatic cylinder, and hydraulic cylinder. However, it is not limited to this, and the second driver 96-2 is a known device capable of moving the second lifting plate 96-1 in the vertical direction and can be modified in various ways.

Below, a method for cleaning the head 42 (or a method for cleaning the nozzle plate 42a) according to an embodiment of the present invention will be described. Figure 4 is a diagram showing a head cleaning method according to an embodiment of the present invention. Referring to FIG. 4, the head cleaning method according to an embodiment of the present invention may include an absorption step (S10), a curing step (S20), and a removal step (S30). The absorption step (S10), the curing step (S20), and the removal step (S30) may be performed sequentially.

In the absorption step (S10), the nozzle plate (42a) on which the ink (I) remains can be cleaned by contacting the absorption member (71) capable of absorbing the ink (I) with the lower surface of the nozzle plate (42a) (Figure 5). When the absorption step (S10) is performed, the ink (I) remaining on the nozzle plate 42a can be substantially removed from the nozzle plate 42a (see FIG. 6). That is, by performing the absorption step (S10) before the curing step (S20) described later, the time required for the curing step (S20) can be effectively shortened.

In the curing step (S20), ultraviolet light (L) having a wavelength in the ultraviolet region may be irradiated to the lower surface of the nozzle plate 42a (see FIG. 7). When ultraviolet light (L) is irradiated to the lower surface of the nozzle plate (42a), the ink (I) attached to the nozzle plate (42a) may be hardened. For example, the liquid ink (I) attached to the surrounding area of the nozzle 42b can be phase transformed into a solid state (see FIG. 8).

In the removal step (S30), the second lifting part 96 lifts the second body 97, and the removal member 91, which is a non-adhesive tape, can be brought into contact with the lower surface of the nozzle plate 42a (see Figure 9). ). In addition, in the removal step (S30), the removal member 91 moves upward and comes into contact with the lower surface of the nozzle plate 42a (see FIG. 10), and then the removal member 91 moves downward to contact the nozzle plate ( It can be spaced apart from the lower surface of 42a) (see FIG. 11). In this case, the removal member 91, which is a non-adhesive tape, can separate the cured ink (I) from the nozzle plate 42a in the curing step (S20). Additionally, the removal step (S30) may be repeated multiple times. That is, the removal member 91 can repeatedly move in the up and down directions to remove the solidified ink (I) from the nozzle plate (42a).

Ink or foreign substances remaining on the nozzle plate 42a block the nozzle 42b or change its surface characteristics. This affects the ink (I) ejection performance of the head 42. In addition, if ink (I) remains in the nozzle (42b), when changing the type of ink (I), a problem may occur where the ink (I) remaining in the nozzle (42b) and the changed ink (I) are mixed. You can. To solve this problem, the existing head cleaning method is to chemically dissolve the ink (I) remaining in the nozzle (42b) using an organic solvent such as ethanol, or to clean the head (42) by rubbing it with a wiper or hand. Wash. However, this method is not suitable for removing the fine ink (I) remaining in the nozzle (42b) as the diameter of the nozzle (42b) gradually decreases, and the method of rubbing with a wiper or hand is not suitable for removing the fine ink (I) remaining in the nozzle (42b). There is a very high possibility of re-contamination (see Figures 12 and 13). Additionally, the method of rubbing with a wiper or by hand causes the problem that the degree of cleaning varies depending on the operator.

However, according to one embodiment of the present invention, the ink (I) is cured by irradiating ultraviolet light (L), and the cured ink (I) is removed through the removal member 91, which is a non-adhesive tape. As the ink (I) hardens, the total volume of the ink (I) decreases. In addition, as the removal member 91 removes the hardened ink (I), the ink (I) remaining in the nozzle (42b) can be effectively removed even if the nozzle (42b) has a fine size (FIG. 14, and see Figure 15).

In the above example, the absorption step (S10) is performed before the curing step (S20), but it is not limited thereto. For example, as shown in FIG. 16, the irradiation unit 80, the removal unit 90, and the absorption unit 70 may be sequentially arranged along the first direction (X). In this case, the absorption step (S10) may be performed after the removal step (S30). When the absorption step (S10) is performed after the removal step (S30), the cleaning efficiency for the head 42 can be increased by absorbing the ink (I) that was not yet removed in the removal step (S30).

In addition, in the above-described example, irradiation of light L to the lower surface of the nozzle plate 42a in the curing step S20 has been described as an example, but the present invention is not limited thereto. For example, the curing step (S20) may be performed by natural volatilization of the ink (I), or may be performed by spraying a gas that promotes volatilization of the ink (I) on the lower surface of the nozzle plate (42a).

In addition, in the above-described example, the removal member 91 is described as an example of a non-adhesive tape, but it is not limited to this. For example, the removal member 91 may be provided with a tape other than a non-adhesive tape. In this case, since the adhesive component of the removal member 91 may be transferred to the nozzle plate 42a, it is recommended that the removal member 91 use a tape whose adhesive component is soluble in an organic solvent or alkaline solution. It is appropriate.

The above detailed description is illustrative of the present invention. Additionally, the foregoing is intended to illustrate preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in this specification, a scope equivalent to the written disclosure, and/or within the scope of technology or knowledge in the art. The written examples illustrate the best state for implementing the technical idea of the present invention, and various changes required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other embodiments as well.

Substrate processing units: 100
Head unit: 40
Nozzle plate: 42a
Nozzle: 42b
Absorption units: 70
Absorbent member: 71
1st supply section: 72
Part 1: 73
1-1 roller: 74-1
1st-2nd roller: 74-2
First support: 75
First support component: 75-1
First support frame: 75-2
1st elevator section: 76
1st lifting plate: 76-1
1st actuator: 76-2
First body: 77
Investigation units: 80
Light Source: 81
Investigation Department: 83
Light: L
Removal Units: 90
Removal member: 91
Second supply section: 92
Second recovery part: 93
2-1 roller: 94-1
2-2 roller: 94-2
Second support part: 95
Second support component: 95-1
Second support frame: 95-2
2nd lift section: 96
Second lifting plate: 96-1
Second actuator: 96-2
2nd body: 97
Absorption stage: S10
Curing stage: S20
Removal Steps: S30

Claims (20)

In a method of cleaning a head provided with at least one nozzle that discharges ink,
A curing step of curing the ink attached to the peripheral area of the nozzle; and
A removal step of removing the cured ink from the nozzle plate by contacting a removal member, which is a tape, with the lower surface of the nozzle plate on which the nozzle is formed,
In the curing step,
A head cleaning method of curing the ink by irradiating light to the lower surface of the nozzle plate. delete According to paragraph 1,
The light irradiated to the lower surface of the nozzle plate,
A head cleaning method comprising at least one of infrared light and ultraviolet light. In a method of cleaning a head provided with at least one nozzle that discharges ink,
A curing step of curing the ink attached to the peripheral area of the nozzle; and
A removal step of removing the cured ink from the nozzle plate by contacting a removal member, which is a tape, with a lower surface of the nozzle plate on which the nozzle is formed,
The removal member is,
How to clean the non-adhesive tape head. In a method of cleaning a head provided with at least one nozzle that discharges ink,
A curing step of curing the ink attached to the peripheral area of the nozzle; and
A removal step of removing the cured ink from the nozzle plate by contacting a removal member, which is a tape, with the lower surface of the nozzle plate on which the nozzle is formed,
The method includes an absorption step of cleaning the nozzle plate on which the ink remains by contacting an absorbing member capable of absorbing the ink with the lower surface of the nozzle plate where the nozzles are formed. According to clause 5,
The absorption step is,
A head cleaning method performed before said curing step or after said removing step. According to any one of paragraphs 1 and 3,
The removal step is,
A head cleaning method that is repeated multiple times. In a method of cleaning a nozzle plate on which a nozzle for discharging a treatment liquid is formed,
A curing step of curing the treatment liquid attached to the surrounding area of the nozzle by irradiating light to the lower surface of the nozzle plate; and
A nozzle plate cleaning method comprising a removal step of contacting and separating a removal member, which is a tape, from a lower surface of the nozzle plate to remove the cured treatment liquid from the nozzle plate. According to clause 8,
The light irradiated to the lower surface of the nozzle plate,
A nozzle plate cleaning method comprising ultraviolet light. According to clause 8 or 9,
The removal member is,
How to clean the nozzle plate with non-adhesive tape. According to clause 8 or 9,
The above method is,
A nozzle plate cleaning method comprising an absorption step of cleaning the nozzle plate in which the processing liquid remains by contacting an absorbing member capable of absorbing the processing liquid with a lower surface of the nozzle plate where the nozzles are formed. According to clause 11,
The absorption step is,
A nozzle plate cleaning method performed before the curing step or after the removing step. According to clause 8 or 9,
The removal step is,
A nozzle plate cleaning method performed multiple times. In a device for processing a substrate,
A head unit that performs a printing process by ejecting ink onto a substrate and has a nozzle plate on which nozzles for ejecting the ink are formed;
an irradiation unit that irradiates light to a lower surface of the nozzle plate; and
A substrate processing apparatus including a removal unit attached to a peripheral area of the nozzle and removing the ink cured by the light from the nozzle plate by contacting a removal member, which is a tape, with the nozzle plate. According to clause 14,
The removal unit,
a supply unit that supplies the removal member in contact with the lower surface of the nozzle plate;
a recovery unit that recovers the removal member supplied by the supply unit;
At least one support part disposed between the supply part and the recovery part and supporting the removal member; and
A substrate processing device including a body in which the supply unit, the recovery unit, and the support unit are installed. According to clause 15,
The support part is,
At least one support component supporting a lower surface of the removal member and made of a material containing silicon; and
A substrate processing apparatus comprising a support frame coupling the support component to the body. According to clause 15,
The removal unit,
The substrate processing apparatus further includes a lifting part that elevates at least one of the supply part, the recovery part, and the support part so that the removal member supplied by the supply part can come into contact with the nozzle plate. According to clause 14,
The device is,
It further comprises an absorption unit that cleans the nozzle plate on which the ink remains by contacting an absorption member capable of absorbing the ink with a lower surface of the nozzle plate,
The absorption unit is,
a supply unit that supplies the absorbing member in contact with the lower surface of the nozzle plate;
a recovery unit that recovers the absorbent member supplied by the supply unit;
At least one support part disposed between the supply part and the recovery part and supporting the absorbent member; and
A substrate processing device including a body in which the supply unit, the recovery unit, and the support unit are installed. According to any one of claims 14 to 18,
The device is,
further comprising a controller,
The controller is,
The irradiation unit irradiates the light to the lower surface of the nozzle plate to harden the ink attached to the surrounding area of the nozzle,
A substrate processing apparatus that controls the irradiation unit and the removal unit to remove the hardened ink from the lower surface of the nozzle plate by bringing the removal member into contact with the lower surface of the nozzle plate. According to clause 18,
The device is,
further comprising a controller,
The controller is,
The irradiation unit irradiates the light to the lower surface of the nozzle plate to harden the ink attached to the surrounding area of the nozzle,
The cured ink is removed from the lower surface of the nozzle plate by contacting the removal member with the lower surface of the nozzle plate,
Before the irradiation unit irradiates the light to the lower surface of the nozzle plate, or after the removal member contacts the lower surface of the nozzle plate, the absorbing member is brought into contact with the lower surface of the nozzle plate to clean the nozzle plate. A substrate processing device that controls the irradiation unit, the removal unit, and the absorption unit.

Images