KR102615664B1 - Organic light emitting display device - Google Patents

Abstract

The present invention relates to an organic light emitting display device. The organic light emitting display device according to an embodiment of the present invention includes a substrate, a thin film transistor on the substrate, a planarization film covering the thin film transistor, a UV blocking layer on the planarization film, and a UV blocking layer on the planarization film. It is disposed in and includes an organic light-emitting element including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer, and a UV blocking layer is formed on the planarization film to reduce UV incident on the planarization film to prevent UV rays from being incident on the planarization film by photodecomposition of the planarization film material. By reducing out-gassing, the UV lifespan of an organic light emitting display device can be improved.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device, and more specifically, to an organic light emitting display device with improved UV lifespan.

Organic light emitting display devices are self-emitting display devices, and unlike liquid crystal displays, they do not require a separate light source and can be manufactured in a lightweight and thin form. In addition, organic light emitting display devices are not only advantageous in terms of power consumption due to low voltage driving, but also have excellent color rendering, response speed, viewing angle, and contrast ratio (CR), and are being studied as next-generation displays.

Due to these advantages, the range of application of organic light emitting display devices is expanding, not only to computer monitors and TVs, but also to personal portable devices such as mobile phones, tablet PCs, and wearable watches. Unlike IT products that were previously mainly used internally, wearable products are frequently used outdoors, so protecting the organic film that covers the internal TFT by blocking UV rays is emerging as an important issue.

This is because when the organic film covering the TFT of an organic light emitting display device is exposed to UV for a long time, the organic material is photodecomposed and out-gassing occurs, and the generated out-gassing spreads to the organic light emitting device on the upper layer, leading to the deterioration of the organic light emitting device. This is because the UV lifespan of the organic light emitting display device is reduced due to shrinkage or photolysis.

Accordingly, research is required on new materials or new structures for TFT protection that can improve the UV lifespan or efficiency decline of organic light emitting display devices.

[Related technical literature]

1. Organic electroluminescent display panel and its manufacturing method (Patent Application No. 10-2011-0093718).

The problem to be solved by the present invention is to provide an organic light emitting display device with improved UV lifespan.

Another problem to be solved by the present invention is to provide an organic light emitting display device that can minimize efficiency degradation.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to solve the above-described problem, an organic light emitting display device according to an embodiment of the present invention includes a substrate, a thin film transistor on the substrate, a planarization film covering the thin film transistor, a UV blocking layer on the planarization film, and a UV blocking layer. It is disposed and includes an organic light-emitting device including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer. Therefore, the UV lifespan of the organic light emitting display device can be improved by forming a UV blocking layer on the planarization film to reduce UV incident on the planarization film and thereby reducing out-gassing due to photolysis of the planarization film material.

In order to solve the problems described above, an organic light emitting display device according to another embodiment of the present invention includes a substrate, a thin film transistor on the substrate, a planarization film covering the thin film transistor, a UV blocking metal layer disposed in a portion of the planarization film, and a UV blocking metal layer. It includes an insulating layer covering the blocking metal layer, and an organic light-emitting element disposed on the insulating layer and including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer. Therefore, the UV lifespan of the organic light emitting display device can be improved by forming a UV blocking metal layer on the planarization film to reduce UV incident on the planarization film and thereby reducing out-gassing due to photolysis of the planarization film material.

Specific details of other embodiments are included in the detailed description and drawings.

According to the present invention, a UV blocking layer or a UV blocking metal layer is formed on the planarization film to minimize outgassing caused by the planarization film material and at the same time delay the diffusion of the outgassing to the organic light emitting device, thereby improving the quality of the organic light emitting display device. UV life can be improved.

According to the present invention, an increase in resistance or the occurrence of a JV shift can be suppressed by minimizing outgassing in the planarization film and at the same time delaying the diffusion of outgassing.

According to the present invention, a decrease in efficiency of an organic light emitting display device can be suppressed by reducing luminance as the driving voltage increases.

The effects according to the present invention are not limited to the contents exemplified above, and further various effects are included in the present specification.

1 is a schematic cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.
FIGS. 2A and 2B are schematic plan views for explaining the arrangement of the UV blocking layer and anode of FIG. 1.
Figure 3 is a schematic cross-sectional view of an organic light emitting display device according to another embodiment of the present invention.
FIGS. 4A to 4C are schematic plan views for explaining the arrangement of the UV blocking metal layer, the insulating layer, and the anode of FIG. 3.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. In cases where a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting components, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

When an element or layer is referred to as being on another element or layer, it includes all cases where another layer or other element is interposed directly on or in the middle of another element.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, and as can be fully understood by those skilled in the art, various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other. It may be possible to conduct them together due to a related relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a schematic cross-sectional view of an organic light emitting display device according to an embodiment of the present invention, and FIGS. 2A and 2B are schematic plan views for explaining the arrangement of the UV blocking layer and the anode of FIG. 1.

Referring to FIG. 1, an organic light emitting display device 100 according to an embodiment of the present invention includes a substrate 110, a thin film transistor (TFT), a planarization film 150, a UV blocking layer 160, and an organic light emitting element ( 170).

The substrate 110 is a substrate for supporting and protecting various components of the organic light emitting display device 100. The substrate 110 may have flexible characteristics. For example, the substrate 110 may be made of glass or plastic.

The substrate 110 includes a display area and a non-display area. The display area is an area where an image is displayed in the organic light emitting display device 100. A thin film transistor (TFT) and an organic light emitting device 170 are disposed in the display area. The display area is disposed in the center of the substrate 110, and the non-display area is disposed to surround the display area. At this time, the non-display area may only partially surround the display area. Various wiring, circuits, and driving chips for driving the thin film transistor (TFT) and the organic light emitting device 170 may be placed in the non-display area. For convenience of explanation, Figure 1 shows only the display area where the thin film transistor (TFT) and the organic light emitting device 170 are arranged.

A thin film transistor (TFT) is disposed in the display area on the substrate 110 and includes an active layer 120, a gate electrode 130, a source electrode 140, and a drain electrode 145.

Specifically, an active layer 120 in which a channel of a thin film transistor (TFT) is formed is disposed on the substrate 110. A gate insulating layer 125 is disposed on the active layer 120 to insulate the active layer 120 and the gate electrode 130. The gate insulating layer 125 is made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), or a mixture thereof, and may be made of a single layer or multiple layers. A gate electrode 130 is disposed on the gate insulating layer 125. An interlayer insulating layer 135 is disposed on the gate electrode 130. The interlayer insulating layer 135 is configured to have a contact hole that opens a partial area of the active layer 120. The interlayer insulating layer 135 is made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), or a mixture thereof, and may be made of a single layer or multiple layers. A source electrode 140 and a drain electrode 145 are disposed on the interlayer insulating layer 135, and each of the source electrode 140 and the drain electrode 145 is electrically connected to the active layer 120 through a contact hole. . In Figure 1, for convenience of explanation, the thin film transistor (TFT) is shown as having a coplanar structure, but the thin film transistor (TFT) is not limited to this and may be formed in an inverted staggered structure. .

Meanwhile, a buffer layer (not shown) may be further disposed on the substrate 110, and in this case, the active layer 120 may be disposed on the buffer layer. The buffer layer is made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), or a mixture thereof, and may be made of a single layer or multiple layers.

A planarization film 150 is disposed on a thin film transistor (TFT). The planarization film 150 is an insulating layer for protecting the thin film transistor (TFT) and planarizing the top of the thin film transistor (TFT). The planarization film 150 includes a contact hole (CH) for electrically connecting the thin film transistor (TFT) and the anode 172 of the organic light emitting device 170. Specifically, the planarization film 150 includes a contact hole (CH) exposing either the source electrode 140 or the drain electrode 145 of the thin film transistor (TFT). Figure 1 shows a contact hole (CH) exposing the drain electrode 145. The planarization film 150 may be made of an organic insulating material.

A UV (ultra violet) blocking layer 160 is disposed on the planarization film 150. Referring to FIG. 2A, the UV blocking layer 160 is disposed on the planarization film 150 excluding the contact hole (CH).

In general, the planarization film 150 may be made of an organic material depending on step coverage characteristics. When the planarization film 150 is formed of an organic material, the organic material that is the material of the planarization film 150 is photodecomposed by UV exposure for a long time, causing out-gassing, and the generated out-gassing causes the organic light emission of the upper layer. As it diffuses into the device 170, it causes shrinkage or photodecomposition of the organic light emitting device 170, causing a problem in that the UV lifespan of the organic light emitting display device 100 is reduced. In order to solve the above-mentioned problem, in the present invention, a UV blocking layer 160 was introduced on the planarization film 150, which will be described later.

Referring again to FIG. 1, the UV blocking layer 160 may include a material that reflects at least some UV of light incident from the outside. For example, the UV blocking layer 160 may include one or more types selected from silica-based, zirconium-based, titanium-based, aluminum-based, etc. For a specific example, the UV blocking layer 160 may include at least one of silica, zirconia (ZrO ₂ ), titania (TiO ₂ ), and alumina (Al ₂ O ₃ ).

This UV blocking layer 160 is formed to a thickness capable of reflecting at least some UV of light incident from the outside. For example, the UV blocking layer 160 may be formed to have a thickness of at least 100 ÅA or more. At this time, if the thickness of the UV blocking layer 160 is too thin, less than 100 ÅA, the UV blocking effect may be insufficient.

The organic light emitting device 170 is disposed on the UV blocking layer 160. The organic light emitting device 170 is driven by a thin film transistor (TFT) and includes an anode 172 and a cathode 176 facing each other, and an organic light emitting layer 174 interposed between them. . The emission area of the organic emission layer 174 may be defined by the bank 180 .

The organic light emitting device 170 may be configured to emit any one of red, green, and blue (RGB) light, or may be configured to emit white light. When the organic light emitting device 170 emits white light, the organic light emitting display device 100 may further include a color filter.

The anode 172 is electrically connected to a thin film transistor (TFT). Specifically, the anode 172 may be connected to either the source electrode 140 or the drain electrode 145 of the thin film transistor (TFT) through the contact hole (CH) formed in the planarization film 150. Figure 1 shows an example of an anode 172 electrically connected to the drain electrode 145 of a thin film transistor (TFT). In this case, an image signal for displaying an image signal is applied to the anode 172 through the drain electrode 145.

The anode 172 must supply holes to the organic light emitting layer 174, so it is made of a conductive material with a high work function. When the organic light emitting display device 100 has a top emission structure, the anode 172 includes a reflective electrode and a reflective electrode made of a highly reflective metal material to reflect the light emitted from the organic light emitting layer 174 upward. It may be composed of a transparent conductive layer disposed on the electrode and made of a conductive material with a high work function. However, the present invention is not limited to this, and the reflective electrode may be of a separate configuration from the anode 172.

For example, the transparent conductive layer may be made of a transparent conductive oxide (TCO) such as indium tin oxide (ITO), indium zinc oxide (IZO), etc. For example, the reflective electrode may be made of silver (Ag) or a silver alloy, and the silver alloy may be, for example, APC (Ag/Pd/Cu).

Additionally, the anode 172 may further include a transparent conductive layer below the reflective electrode to improve adhesion to the UV blocking layer 160.

As shown in FIG. 2B, the anode 172 is spaced apart for each pixel and disposed on the contact hole (CH) and some UV blocking layers 160. Figure 2b is only shown as an example to explain the arrangement of the UV blocking layer 160 and the anode 172, and the arrangement and shape of the anode 172 can be modified into various structures depending on the desired design. .

Referring again to FIG. 1, the organic light emitting layer 174 is disposed on the anode 172. The organic light-emitting layer 174 may be made of a phosphorescent or fluorescent material, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, if necessary. The organic light-emitting layer 174 may include a material that can emit light of a specific color. For example, the organic light-emitting layer 174 may include a light-emitting material that can emit any one of red, green, and blue (RGB) light. However, the organic light-emitting layer 174 is not limited thereto, and may include a light-emitting material capable of emitting light of different colors.

The cathode 176 is disposed opposite to the anode 172 with the organic light emitting layer 174 interposed therebetween. The cathode 176 supplies electrons to the organic light emitting layer 174. For example, the cathode 176 may be made of a very thin metallic material with a low work function of 100 Å to 200 Å. For example, the cathode 176 may be made of a metallic material with a low work function, such as a metal alloy such as MgAg or a metal alloy containing ytterbium (Yb). When the organic light emitting display device 100 has a top emission structure, the cathode 176 is composed of a translucent metal film that transmits at least a portion of the light emitted from the organic light emitting layer 174. A common voltage (Vss) is applied to the cathode 176.

A bank 180 is disposed on the anode 172 and the UV blocking layer 160. The bank 180 divides adjacent sub-pixel areas. Additionally, the bank 180 may divide a pixel area comprised of a plurality of sub-pixel areas. The bank 180 is disposed in a non-emission area between each pixel and has a tapered shape. The bank 180 is configured to overlap at least a portion of the edge portion of the anode 172.

Spacer 190 is disposed on bank 180. Specifically, spacer 190 is interposed below cathode 176 on bank 180. The spacer 190 can protect the organic light emitting device 170 from damage that may be caused by a fine metal mask (FMM) used when patterning the organic light emitting layer 174. However, the spacer 190 is not an absolutely necessary component and may be omitted depending on the type of the organic light-emitting layer 174 of the organic light-emitting device 170.

As described above, when the planarization film 150 is made of an organic material, when exposed to UV for a long time, the organic material is photodecomposed and outgassing occurs, and the generated outgassing diffuses into the organic light-emitting layer 174, thereby forming the organic light-emitting device 170. This causes deterioration or gradual photodecomposition, thereby reducing the lifespan of the organic light emitting display device 100. According to the structure of the organic light emitting display device 100 of the present invention, the UV blocking layer 160 is disposed on the planarization film 150, so that UV incident on the planarization film 150 can be reduced, and the incident UV As a result, outgassing of the planarization film 150 can be suppressed. Through this, deterioration or photodecomposition of the organic light emitting device 170 can be suppressed and the lifespan of the organic light emitting display device 100 against UV can be improved.

Generally, diffusion of outgassing generated in the planarization film progresses rapidly along the interface of the layer, resulting in rapid deterioration or photodecomposition of the organic light emitting device. According to the structure of the organic light emitting display device 100 of the present invention, even if outgassing occurs in the planarization film 150, the path of outgassing to the organic light emitting device is lengthened by the UV blocking layer 160, so that the organic light emitting device 170 ), the rate of deterioration or photodecomposition is slowed, so the UV lifespan of the organic light emitting display device 100 can be further improved.

In addition, diffusion of outgassing caused by the planarization film causes deterioration or photodecomposition of the organic light-emitting layer and ultimately causes oxidation of the cathode. As a result, the resistance of the organic light emitting display device increases and a JV shift occurs, thereby reducing luminance through an increase in driving voltage. According to the present invention, the UV lifespan of the organic light emitting display device 100 is improved by minimizing outgassing in the planarization film 150 and simultaneously slowing the diffusion of the outgassing, and in addition, the organic light emitting display device 100 Deterioration in efficiency can be minimized. Accordingly, the organic light emitting display device 100 of the present invention is suitable for use in electronic products that are frequently used outdoors.

Furthermore, according to the present invention, the UV blocking layer 160 is formed using existing materials rather than introducing new materials into the planarization film 150, thereby improving the UV lifespan of the organic light emitting display device 100, thereby reducing material development costs. You can.

FIG. 3 is a schematic cross-sectional view of an organic light emitting display device according to another embodiment of the present invention, and FIGS. 4A to 4C are schematic plan views for explaining the arrangement of the UV blocking metal layer, insulating layer, and anode of FIG. 3. . Compared to the organic light emitting display device 100 shown in FIGS. 1, 2A, and 2B, the organic light emitting display device 300 shown in FIGS. 3 and 4A to 4C has a UV blocking metal layer 355 and an insulating layer. Only 360 and the first and second holes H1 and H2 are changed, and other components are substantially the same, so redundant description will be omitted.

Referring to FIG. 3, the organic light emitting display device 300 includes a substrate 110, a thin film transistor (TFT), a planarization film 150, a UV blocking metal layer 355, an insulating layer 360, and an organic light emitting element 170. Includes.

The UV blocking metal layer 355 is disposed on the planarization film 150. The UV blocking metal layer 355 may include a metal material that reflects at least some UV of light incident from the outside. Specifically, the UV blocking metal layer 355 may be made of a reflective metal, a metal alloy, or a combination thereof. For example, the UV blocking metal layer 355 may be made of a metal such as Mo, Ti, Al, Ag, Mg, or a metal alloy containing these metals, but is not necessarily limited thereto, and may be a conventional metal material that can be deposited. Can be employed without restrictions.

In addition, the UV blocking metal layer 355 is made of a reflective electrode of the anode 172, and may further include a transparent conductive oxide (TCO) layer on the reflective electrode.

The UV blocking metal layer 355 is formed to have a thickness capable of reflecting at least some UV of light incident from the outside. For example, the UV blocking metal layer 355 may be formed to have a thickness of at least 100Å or more. At this time, if the thickness of the UV blocking metal layer 355 is too thin, less than 100 Å, the UV blocking effect may be insufficient.

The insulating layer 360 is a layer to prevent short circuit between the UV blocking metal layer 355 and the anode 172, and is formed by flattening the UV blocking metal layer 355 to cover the top and sides of the UV blocking metal layer 355. It is disposed on the membrane 150. As a result, the UV blocking metal layer 355 is surrounded by the planarization film 350 and the insulating layer 360. Referring to FIGS. 4A and 4B, the UV blocking metal layer 355 is disposed on the planarization film 150 excluding the first hole H1 exposing the drain electrode 145, and the insulating layer 360 is the first hole H1. It is disposed on the UV blocking metal layer 355 except for the second hole (H2) having a smaller size than the hole (H1).

From the viewpoint of improving prevention of short circuit between the UV blocking metal layer 355 and the anode 172, the thickness of the insulating layer 360 may be thicker than the thickness of the UV blocking metal layer 355.

The insulating layer 360 includes at least one of an inorganic insulating material and an organic insulating material, and may be made of a single layer or multiple layers. For example, the insulating layer 360 may be composed of a plurality of inorganic films, a plurality of organic films, or a mixture of a plurality of inorganic films and organic films. When the insulating layer 360 is composed of a mixed film of a plurality of inorganic films and organic films, the inorganic film, which has relatively better outgassing prevention performance than the organic film, may be disposed on the outermost layer.

Referring again to FIG. 3, the anode 172 is disposed on the insulating layer 360. Referring to FIG. 4C, the anode 172 is disposed on the first and second holes H1 and H2 and a portion of the insulating layer 360 to be spaced apart for each pixel. Figure 4c is only shown as an example to explain the arrangement of the UV blocking metal layer 355, the insulating layer 360, and the anode 172, and the arrangement and shape of the anode 172 can vary depending on the desired design. The structure can be transformed.

Meanwhile, although not shown in the drawing, the organic light emitting display device 300 further includes a common voltage line (Vss) electrically connected to the cathode 176, and the UV blocking metal layer 355 is connected to the common voltage line (Vss). It can also be electrically connected to shield DC.

The organic light emitting display device 300 of this configuration also includes a UV blocking metal layer 355, and can have the same effect of improving UV lifespan and suppressing efficiency degradation by the same principle as the organic light emitting display device 100 described above. .

Exemplary embodiments of the present invention may be described as follows.

In order to solve the above-described problem, an organic light emitting display device according to an embodiment of the present invention includes a substrate, a thin film transistor on the substrate, a planarization film covering the thin film transistor, a UV blocking layer on the planarization film, and a UV blocking layer. It is disposed and includes an organic light-emitting device including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer.

According to another feature of the present invention, the UV blocking layer is characterized in that it includes at least one of silica (Silica), zirconia (ZrO ₂ ), titania (TiO ₂ ), and alumina (Al ₂ O ₃ ).

According to another feature of the present invention, the UV blocking layer is characterized by having a thickness of at least 100 Å or more.

According to another feature of the present invention, the planarization film includes a contact hole exposing the source electrode or drain electrode of the thin film transistor, and the UV blocking layer is disposed on the planarization film excluding the contact hole.

According to another feature of the present invention, the anode is connected to the source electrode or drain electrode of the thin film transistor through a contact hole.

In order to solve the problems described above, an organic light emitting display device according to another embodiment of the present invention includes a substrate, a thin film transistor on the substrate, a planarization film covering the thin film transistor, a UV blocking metal layer disposed in a portion of the planarization film, and a UV blocking metal layer. It includes an insulating layer covering the blocking metal layer, and an organic light-emitting element disposed on the insulating layer and including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer.

According to another feature of the present invention, the insulating layer covers the side surface of the UV blocking metal layer.

According to another feature of the present invention, the planarization film includes a contact hole exposing the source electrode or drain electrode of the thin film transistor, the insulating layer is disposed on the planarization film excluding the contact hole, and the UV blocking metal layer is formed on the planarization film and the insulating film. It is characterized by being surrounded by layers.

According to another feature of the present invention, the UV blocking metal layer is made of a reflective electrode of the anode, and further includes a transparent conductive oxide layer on the reflective electrode.

According to another feature of the present invention, the thickness of the insulating layer is thicker than the thickness of the UV blocking metal layer.

According to another feature of the present invention, the insulating layer includes at least one of an inorganic insulating material and an organic insulating material.

According to another feature of the present invention, the insulating layer is characterized by being composed of a plurality of layers.

According to another feature of the present invention, it further includes a common voltage line electrically connected to the cathode, and the UV blocking metal layer is connected to the common voltage line.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100, 300: organic light emitting display device 110: substrate
120: active layer 125: gate insulating layer
130: Gate electrode 135: Interlayer insulating layer
140: source electrode 145: drain electrode
150: Flattening film 160: UV blocking layer
170: Organic light emitting device 172: Anode
174: organic light emitting layer 176: cathode
180: Bank 190: Spacer
355: UV blocking metal layer 360: Insulating layer
TFT: Thin film transistor CH: Contact hole
H2: 1st hole H2: 2nd hole

Claims (13)

Board;
a thin film transistor on the substrate;
a planarization film covering the thin film transistor;
a UV blocking layer on the planarization film;
an organic light-emitting device disposed on the UV blocking layer and including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer; and
Includes a common voltage line electrically connected to the cathode,
The UV blocking layer is connected to the common voltage line. According to paragraph 1,
The UV blocking layer includes at least one of silica, zirconia (ZrO ₂ ), titania (TiO ₂ ), and alumina (Al ₂ O ₃ ). According to paragraph 1,
The organic light emitting display device wherein the UV blocking layer has a thickness of at least 100 Å or more. According to paragraph 1,
The planarization film includes a contact hole exposing the source electrode or drain electrode of the thin film transistor,
The UV blocking layer is disposed on the planarization film excluding the contact hole. According to paragraph 4,
The anode is connected to a source electrode or a drain electrode of the thin film transistor through the contact hole. Board;
a thin film transistor on the substrate;
a planarization film covering the thin film transistor;
a UV blocking metal layer disposed in a portion of the planarization film;
an insulating layer covering the UV blocking metal layer;
an organic light-emitting device disposed on the insulating layer and including an anode, an organic light-emitting layer on the anode, and a cathode on the organic light-emitting layer; and
Includes a common voltage line electrically connected to the cathode,
The UV blocking metal layer is connected to the common voltage line. According to clause 6,
The insulating layer covers a side of the UV blocking metal layer. According to clause 6,
The planarization film includes a contact hole exposing the source electrode or drain electrode of the thin film transistor,
The insulating layer is disposed on the planarization film excluding the contact hole,
The UV blocking metal layer is surrounded by the planarization film and the insulating layer. According to clause 6,
The UV blocking metal layer is made of a reflective electrode of the anode,
The organic light emitting display device further includes a transparent conductive oxide layer on the reflective electrode. According to clause 6,
The thickness of the insulating layer is thicker than the thickness of the UV blocking metal layer. According to clause 6,
The insulating layer includes at least one of an inorganic insulating material and an organic insulating material. According to clause 11,
An organic light emitting display device, wherein the insulating layer is made of a plurality of layers. delete

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