KR102615186B1 - Plastic-based article, housing for electronic parts, electronics and method of preparing the same - Google Patents

Abstract

Disclosed are a plastic-based article, a housing for an electronic component, an electronic device, and a method for manufacturing the plastic-based article. The disclosed plastic-based article comprises: a plastic member; and a plurality of conductive members arranged to be separated from each other by penetrating the plastic member. Therefore, it is possible to provide a plastic-based article having excellent heat dissipation and electromagnetic wave shielding performance.

Description

Plastic-based article, housing for electronic parts, electronic device, and manufacturing method of plastic-based article {Plastic-based article, housing for electronic parts, electronics and method of preparing the same}

Disclosed are plastic-based articles, housings for electronic components, electronic devices, and methods for manufacturing plastic-based articles. More specifically, a method for manufacturing plastic-based articles with excellent heat dissipation and electromagnetic wave shielding performance, housings for electronic components, electronic devices, and plastic-based articles is disclosed.

Recently, the development of electronic devices that generate heat and electromagnetic waves, such as mobile communication devices and vehicle cameras, is accelerating, and the performance of such electronic devices is improving day by day, and the large amount of heat and electromagnetic waves generated therefrom are being addressed in the electronic device-related technology field. As it has emerged as an urgent task, there is also a demand for the development of electronic materials that have excellent heat dissipation and electromagnetic wave shielding performance while being light in weight and inexpensive.

One embodiment of the present invention provides a plastic-based article with excellent heat dissipation and electromagnetic wave shielding performance.

Another embodiment of the present invention provides a housing for electronic components including the plastic-based article.

Another embodiment of the present invention provides an electronic device including the housing for the electronic component.

Another embodiment of the present invention provides a method for manufacturing the above plastic-based article.

One aspect of the present invention is,

plastic member; and

A plastic-based article is provided including a plurality of conductive members spaced apart from each other through the plastic member.

The plastic-based article may be configured such that the plurality of conductive members are arranged to extend in a direction parallel to the direction of heat flow.

One end and the other end of each of the plastic member and the plurality of conductive members may be exposed to the outside.

The entire externally exposed surface of the plastic member may be plated with metal.

The metal may include copper, chromium, iron, silver, nickel, gold, zinc, aluminum, or combinations thereof.

Each of the conductive members may include aluminum, copper, chromium, iron, silver, nickel, gold, zinc, or a combination thereof.

Each of the conductive members may be configured in the shape of a flat plate, curved plate, straight pin, curved pin, or honeycomb structure.

The plastic-based article includes a plurality of first plastic members and a plurality of first conductive members, and each of the first plastic members may be arranged one by one alternately with each of the first conductive members.

The plastic-based article may include a second plastic member and a plurality of second conductive members disposed within an edge of the second plastic member and distributed in an island shape penetrating through the second plastic member.

Another aspect of the present invention is,

A housing for electronic components including the plastic-based article is provided.

Another aspect of the present invention is,

An electronic device including a housing for the electronic component is provided.

Another aspect of the present invention is,

Installing a conductive member in the injection mold (S10);

Filling the injection mold with a resin solution (S20);

Curing the resin solution (S30);

Taking out the plastic-based article on which the conductive member is mounted from the injection mold (S40); and

A method of manufacturing a plastic-based article is provided, including plating the surface of the plastic-based article on which the conductive member is mounted with metal (S50).

The step (S50) may be performed by electroplating using the conductive member as an electrode.

The step (S50) may be performed using an electroless plating method.

The plastic-based article according to one embodiment of the present invention has the advantage of being light in weight and inexpensive while providing excellent heat dissipation and electromagnetic wave shielding performance.

In addition, the method for manufacturing a plastic-based article according to an embodiment of the present invention has the advantage of a simple process and low manufacturing cost.

Figure 1 is a perspective view of a plastic-based article according to a first embodiment of the invention.
Figure 2 is a perspective view of a housing for electronic components containing the plastic-based article of Figure 1;
Figure 3 is a perspective view of a plastic-based article according to a second embodiment of the invention.
Figure 4 is a perspective view of a housing for electronic components including the plastic-based article of Figure 3;
Figure 5 is a perspective view of a plastic-based article according to Reference Example 1.
Figure 6 is a perspective view of a plastic-based article according to Reference Example 2.
Figure 7 is a graph schematically showing the change in thermal conductivity according to the aluminum volume ratio of the plastic-based articles of Figures 1, 3, and 4.
Figure 8 is a flow chart showing a method of manufacturing a plastic-based article according to an embodiment of the present invention.

Hereinafter, a plastic-based article according to an embodiment of the present invention will be described in detail with reference to the drawings.

In this specification, “conductivity” means the property of having both thermal conductivity and electrical conductivity.

Plastic-based articles according to embodiments of the present invention include a plastic member and a plurality of conductive members.

The plastic member may include a thermosetting resin, but the present invention is not limited thereto.

The plurality of conductive members may be arranged to pass through the plastic member and be spaced apart from each other.

One end and the other end of each of the plastic member and the plurality of conductive members may be exposed to the outside.

Additionally, the entire externally exposed surface of the plastic member may be plated with metal.

The metal may include copper, chromium, iron, silver, nickel, gold, zinc, aluminum, or a combination thereof, but the present invention is not limited thereto.

The thickness of the plating layer formed on the surface of the plastic member may be 20 μm or less.

In addition, each of the above conductive members may include aluminum, copper, chromium, iron, silver, nickel, gold, zinc, or a combination thereof, but the present invention is not limited thereto, and any material having high thermal and electrical conductivity may be used. Any material is fine.

Additionally, each of the conductive members may be configured in the shape of a flat plate, curved plate, straight pin, curved pin, or honeycomb structure. As an example, when each conductive member has a flat shape, the conductive member appears as a line when viewed in a direction perpendicular to the direction of heat flow. As another example, when each conductive member is a straight pin, the conductive member appears as a dot when viewed in a direction perpendicular to the direction of heat flow. When viewed in a direction perpendicular to the direction of heat flow, each of the conductive members may not only include straight lines, but may also include multiple curves, one curve connected to each other, or a honeycomb structure. However, the present invention is not limited to this, and each of the conductive members may be configured in various other shapes as needed.

Hereinafter, the plastic-based articles 10 and 20 according to two embodiments of the present invention and housings for electronic components including each of them will be described in detail with reference to FIGS. 1 to 4.

Figure 1 is a perspective view of a plastic-based article 10 according to a first embodiment of the invention.

Referring to FIG. 1, the plastic-based article 10 according to the first embodiment of the present invention may include a plurality of first plastic members 11 and a plurality of first conductive members 12.

One end and the other end of each of the plurality of first plastic members 11 may be exposed to the outside.

Likewise, one end and the other end of each of the plurality of first conductive members 12 may be exposed to the outside.

Additionally, each first plastic member 11 may be alternately disposed with each first conductive member 12 one by one.

Additionally, the plastic-based article 10 may be arranged such that each first conductive member 12 extends in a direction parallel to the heat flow direction (Q _in → Q _out ). Here, Q _in refers to the heat generated by the electronic device (not shown), and Q _out is This refers to the heat released to the outside through the plastic-based article (10).

FIG. 2 is a perspective view of a housing HS1 for electronic components including the plastic-based article 10 of FIG. 1 .

Referring to FIG. 2 , the housing HS1 for electronic components may have a hollow hexahedral shape with an open top including the plastic-based article 10 of FIG. 1 as five walls. However, the present invention is not limited to this, and the housing HS1 for electronic components may have various other shapes.

Figure 3 is a perspective view of a plastic-based article 20 according to a second embodiment of the invention.

Referring to FIG. 3, the plastic-based article 20 according to the second embodiment of the present invention may include a second plastic member 21 and a plurality of second conductive members 22.

One end and the other end of each of the plurality of second plastic members 21 may be exposed to the outside.

Likewise, one end and the other end of each of the plurality of second conductive members 22 may be exposed to the outside.

The plurality of second conductive members 22 may be disposed within the edge of the second plastic member 21, and may be distributed and disposed in an island shape penetrating through the second plastic member 22.

The plastic-based article 20 of FIG. 3 has a different configuration from the plastic-based article 10 of FIG. 1 in that each conductive member 22 is arranged to extend in a direction parallel to the heat flow direction (not shown). same.

FIG. 4 is a perspective view of a housing HS2 for electronic components including the plastic-based article 20 of FIG. 3 .

Referring to FIG. 4 , the housing HS2 for electronic components may have a hollow hexahedral shape with an open top including the plastic-based article 20 of FIG. 3 as five walls. However, the present invention is not limited to this, and the housing HS2 for electronic components may have various other shapes.

Figure 5 is a perspective view of a plastic-based article 30 according to Reference Example 1.

Referring to FIG. 5 , the plastic-based article 30 according to Reference Example 1 may include a third plastic member 31 and a plurality of third conductive members 32.

The plurality of third conductive members 32 may be randomly distributed and disposed in the form of particles on the third plastic member 31.

The plastic-based article 30 of FIG. 5 not only has a completely different configuration from the plastic-based article 10 of FIG. 1 and the plastic-based article 20 of FIG. 3, but also each conductive member 32 has a heat flow direction (Q). The difference is that it is randomly arranged regardless of _(in → Q _out ).

Figure 6 is a perspective view of a plastic-based article 40 according to Reference Example 2.

Referring to FIG. 6, the plastic-based article 40 according to Reference Example 2 may include a plurality of plastic members 41 and a plurality of conductive members 42.

One end and the other end of each of the plurality of plastic members 41 may be exposed to the outside.

Likewise, one end and the other end of each of the plurality of conductive members 42 may be exposed to the outside.

Additionally, each plastic member 41 may be alternately arranged with each conductive member 42 one by one.

The plastic-based article 40 of FIG. 6 has a similar configuration to the plastic-based article 10 of FIG. 1, but with each conductive member 42 extending in a direction perpendicular to the heat flow direction (Q _in → Q _out ). There is a difference in the way it is placed.

Another aspect of the present invention provides an electronic device including the housings HS1 and HS2 for electronic components described above.

The electronic devices may include mobile phones, cameras, computers, servers, or other heat and electromagnetic wave generating devices.

Figure 7 is a graph schematically showing the change in thermal conductivity according to the aluminum volume ratio of the plastic-based articles of Figures 1, 5, and 6.

The thermal conductivity of a plastic-based article including a plastic member and a conductive member with excellent thermal conductivity is expressed in any one of Equations 1 to 3 below depending on the arrangement state of the plastic-based article (specifically, the conductive member). It can be calculated accordingly. In Equations 1 to 3 below, P refers to thermal conductivity, Φ refers to the volume fraction, A refers to the area ratio, t refers to the thickness ratio, the subscript d refers to the conductive member, and the subscript m refers to the plastic member.

As an example, as shown in Figure 1, when the plastic-based article 10 is configured such that the plurality of conductive members 12 are arranged to extend in a direction parallel to the heat flow direction (Q _in → Q _out ), the thermal conductivity ( P) can be calculated according to Equation 1 below.

[Equation 1]

P = Φ _d P _d + Φ _m P _m = A _d P _d + A _m P _m

In Equation 1, since the thicknesses of the plastic member 11 and the conductive member 12 are constant, Φ _d = A _d , Φ _m = A _m , and Φ _d + Φ _m = A _d + A _m = 1. .

As another example, as shown in Figure 5, when the plastic-based article 30 is configured such that a plurality of conductive members 32 are randomly arranged in particle form regardless of the heat flow direction (Q _in → Q _out ), Thermal conductivity (P) can be calculated according to Equation 2 below.

[Equation 2]

As another example, as shown in FIG. 6, when the plastic-based article 40 is configured such that the plurality of conductive members 42 are arranged to extend in a direction perpendicular to the heat flow direction (Q _in → Q _out ), Thermal conductivity (P) can be calculated according to Equation 3 below.

[Equation 3]

In Equation 3, since the areas of the plastic member 41 and the conductive member 42 are constant, Φ _d = t _d , Φ _m = t _m , and Φ _d + Φ _m = t _d + t _m = 1. .

Referring to FIG. 7, the plastic-based article 10 is arranged such that a plurality of conductive members 12 (specifically, 10% by volume metal aluminum fins) extend in a direction parallel to the heat flow direction (Q _in → Q _out ). It can be seen that if configured as possible, a thermal conductivity of 24W/mK can be achieved. For example, 1 cm ² of plastic with a thermal conductivity of 0.3 W/mK If four aluminum fins with a diameter of 2 mm are inserted into a plate, the volume ratio occupied by the aluminum fins is 12.6%, and the plastic-based article consisting of a plastic member and a conductive member (i.e., aluminum fin) showing a thermal conductivity of 28.7 W/mK (10) can be configured.

Referring again to FIG. 7, the plastic-based article 10 of FIG. 1 has a significantly higher thermal conductivity increase rate with an increase in the aluminum volume ratio compared to the plastic-based article 30 of FIG. 5 and the plastic-based article 40 of FIG. 6. You can know the facts.

Figure 8 is a flow chart showing a method of manufacturing a plastic-based article according to an embodiment of the present invention.

Referring to FIG. 8, the method of manufacturing a plastic-based article according to an embodiment of the present invention includes installing a conductive member in an injection mold (S10), filling the injection mold with a resin solution (S20), and the resin. Hardening the liquid (S30), taking out the plastic-based article on which the conductive member is mounted from the injection mold (S40), and plating the surface of the plastic-based article on which the conductive member is mounted with metal ( S50).

As an example, step S50 may be performed using an electroplating method using the conductive member as an electrode.

As another example, step (S50) may be performed using an electroless plating method.

In the above, a preferred embodiment according to the present invention has been described with reference to the drawings, but this is merely an example, and those skilled in the art will understand that various modifications and other equivalent embodiments are possible. There will be. Therefore, the scope of protection of the present invention should be determined by the appended claims.

10, 20, 30, 40: Plastic-based article 11, 21, 31, 41: Plastic member
12, 22, 32, 42: Conductive member Q _in : Heat generated
Q _out : Heat emission HS1, HS2: Housing for electronic components

Claims (25)

delete delete delete delete delete delete delete delete delete delete delete Installing a conductive member in the injection mold (S10);
Filling the injection mold with a resin solution (S20);
Curing the resin solution (S30);
Taking out the plastic-based article on which the conductive member is mounted from the injection mold (S40); and
A method of manufacturing a plastic-based article comprising plating a surface of the plastic-based article on which the conductive member is mounted with metal (S50). According to clause 12,
The step (S50) is a method of manufacturing a plastic-based article performed by electroplating using the conductive member as an electrode. According to clause 12,
The step (S50) is a method of manufacturing a plastic-based article performed by electroless plating.
A plastic-based article manufactured by the method for producing a plastic-based article according to any one of claims 12 to 14,
plastic member; and
A plastic-based article comprising a plurality of conductive members spaced apart from each other through the plastic member. According to clause 15,
The plastic-based article is configured such that the plurality of conductive members are arranged to extend in a direction parallel to the direction of heat flow. According to clause 15,
A plastic-based article in which one end and the other end of each of the plastic member and the plurality of conductive members are exposed to the outside. According to clause 17,
The plastic member is a plastic-based article in which the entire externally exposed surface is plated with metal. According to clause 18,
A plastic-based article wherein the metal includes copper, chromium, iron, silver, nickel, gold, zinc, aluminum, or combinations thereof. According to clause 15,
A plastic-based article, wherein each conductive member comprises aluminum, copper, chromium, iron, silver, nickel, gold, zinc, or combinations thereof. According to clause 15,
Each of the conductive members is a plastic-based article configured in the shape of a flat plate, curved plate, straight pin, curved pin, or honeycomb structure. According to clause 15,
a plurality of first plastic members; and
Comprising a plurality of first conductive members,
A plastic-based article, wherein each first plastic member is arranged one after another with each first conductive member. According to clause 15,
a second plastic member; and
A plastic-based article comprising a plurality of second conductive members disposed within an edge of the second plastic member and distributed in an island shape penetrating through the second plastic member. A housing for electronic components comprising a plastic-based article according to claim 15. An electronic device including a housing for electronic components according to paragraph 24.

Images