KR102597468B1 - Apparatus for Plating of Electrolytic Copper Foil and Apparatus for Manufacturing of Electrolytic Copper Foil Having The Same - Google Patents

Abstract

The present invention provides a plating tank that provides a space for plating copper foil on a material to be plated, a plurality of energizing rolls for applying a negative potential to the material to be plated, and N for applying a positive potential to the material to be plated (N is an integer of 2 or more. ) first anodes, a first power unit for applying power to the first anodes, and N (N is an integer of 2 or more) first power units for supplying power generated from the first power unit to the first anodes. It relates to an electrolytic copper foil plating device including a bus bar and an electrolytic copper foil manufacturing device including the same.

Description

Electrolytic copper foil plating device and electrolytic copper foil manufacturing device including the same {Apparatus for Plating of Electrolytic Copper Foil and Apparatus for Manufacturing of Electrolytic Copper Foil Having The Same}

The present invention relates to an electrolytic copper foil plating device for plating copper foil on a material to be plated and an electrolytic copper foil manufacturing device including the same.

Copper foil is used to manufacture various products such as cathodes for secondary batteries and flexible printed circuit boards (FPCB). This copper foil is manufactured through an electroplating method that supplies an electrolyte between the anode and the cathode and then passes an electric current. In this way, in manufacturing copper foil through electroplating, an electrolytic copper foil manufacturing device is used. In addition, the electrolytic copper foil manufacturing device is equipment used for copper foil plating and may be equipped with an electrolytic copper foil plating device.

Figure 1 is a schematic side view of an electrolytic copper foil plating apparatus according to the prior art.

Referring to Figure 1, the electrolytic copper foil plating device 100 according to the prior art includes a plating bath 110, a plurality of energizing rolls 120, a plurality of anodes 130, a busbar 140, and a power supply unit ( 150).

The plating bath 110 provides a space for plating copper foil on the material to be plated (F). The plating tank 110 may contain a plating solution so that the material to be plated (F) is immersed in the plating solution. An inlet and an outlet may be formed in the plating tank 110 to allow the material to be plated (F) to enter and exit.

Each of the energizing rolls 120 is for applying a negative potential to the material to be plated (F). Each of the energization rolls 120 can rotate so that the plated material (F) can move along the moving direction.

The anodes 130 are used to apply positive potential to the material to be plated (F). The anodes 130 may be arranged to be spaced apart from each other along the moving direction.

The bus bar 140 is for supplying power generated from the power unit 150 to the anodes 130. The bus bar 140 may be electrically connected to the power supply unit 150 and the anodes 130, respectively.

The power supply unit 150 applies power to the anodes 130. The power unit 150 may supply power to the bus bar 140 through a cable 160. The cable 160 may be connected to the power supply unit 150 and the bus bar 140, respectively.

The material to be plated (F) is charged to a negative potential by the current conduction rolls 120 and thus is electrically conductive to the anodes 130 inside the plating bath 110. Accordingly, the material to be plated (F) can be plated by electrochemical reaction of metal ions contained in the plating solution.

Here, the electrolytic copper foil plating device 100 according to the prior art is implemented such that the anodes 130 have different distances from the connection point CP where the cable 160 and the bus bar 140 are connected. Accordingly, a small power is applied to the anode 130 located at a relatively long distance from the connection point (CP), and a large power is applied to the anode 130 located at a relatively short distance from the connection point (CP). approved. Therefore, the electrolytic copper foil plating apparatus 100 according to the prior art has a problem in that plating deviation of the material to be plated (F) occurs as power of different sizes is applied to the anodes 130.

The present invention was made to solve the problems described above, and is intended to provide an electrolytic copper foil plating device that can reduce the possibility of occurrence of plating deviation of the material to be plated, and an electrolytic copper foil manufacturing device including the same.

The present invention may include the following configuration to solve the above problems.

The electrolytic copper foil plating apparatus according to the present invention includes a plating tank that provides a space for plating copper foil on a material to be plated, a plurality of energizing rolls that apply a negative potential to the material to be plated, and N (N) that applies a positive potential to the material to be plated. N is an integer of 2 or more) first anodes, a first power supply unit for applying power to the first anodes, and N (N is an integer of 2 or more) for supplying power generated from the first power unit to the first anodes. It may include an integer number of first bus bars.

The electrolytic copper foil manufacturing apparatus according to the present invention includes a plating tank that provides a space for plating copper foil on a material to be plated, a plurality of energizing rolls that apply a negative potential to the material to be plated, and N (N) that applies a positive potential to the material to be plated. N is an integer of 2 or more) first anodes, a first power supply unit for applying power to the first anodes, and N for supplying power generated from the first power unit to the first anodes (N is an integer of 2 or more) ) number of first bus bars, a supply unit for continuously supplying the plated material to the plating bath, a switching section for converting the movement of the plated material, and a recovery section for recovering the plated material plated with copper foil. .

According to the present invention, the following effects can be achieved.

The present invention can be implemented to reduce the size deviation of the power applied to the anodes, thereby improving the quality of the copper foil plated on the material to be plated.

1 is a schematic plan view of an electrolytic copper foil plating device according to the prior art.
Figure 2 is a schematic plan view of the electrolytic copper foil manufacturing apparatus according to the present invention.
Figure 3 is a schematic plan view illustrating the plating bath, energizing roll, first anodes, first power unit, and first bus bars in the electrolytic copper foil plating apparatus according to the present invention.
Figure 4 is a schematic side view of the electrolytic copper foil plating device according to the present invention.
Figure 5 is a schematic plan view showing that the first anodes of the electrolytic copper foil plating device according to the present invention are all equally spaced from the first bonding surface.
Figure 6 is a schematic plan view showing the first bus bars, the first power unit, and the first anode forming a first group in the electrolytic copper foil plating device according to the present invention.
Figure 7 is a schematic plan view for explaining the sensing unit and the control unit in the electrolytic copper foil plating device according to the present invention.
Figure 8 is a schematic plan view for explaining the second anodes, the second power unit, and the second bus bars in the electrolytic copper foil plating device according to the present invention.

Hereinafter, embodiments of the electrolytic copper foil plating apparatus and the electrolytic copper foil manufacturing apparatus according to the present invention will be described in detail with reference to the attached drawings. Since the electrolytic copper foil plating device according to the present invention can be included in the electrolytic copper foil manufacturing device according to the present invention, it will be described together with embodiments of the electrolytic copper foil manufacturing device according to the present invention. Additionally, the hatching shown in FIGS. 3 to 8 does not illustrate a cross-section of the configuration, but rather shows the configuration separately for understanding of the present invention.

Referring to Figure 2, the electrolytic copper foil manufacturing apparatus 10 (hereinafter shown in Figure 2) according to the present invention is a copper foil (used to manufacture various products such as cathodes for secondary batteries and flexible printed circuit boards (FPCB)). It is to manufacture copper products. To this end, the electrolytic copper foil manufacturing apparatus 10 according to the present invention may include a supply unit 20, a switching unit 30, and a recovery unit 40.

Referring to FIG. 2, the supply unit 20 continuously supplies the material F on which copper foil is to be plated to the plating tank 2. The supply unit 20 may continuously supply the material to be plated (F) to the plating tank 2 while rotating around the supply shaft. The supply unit 20 may continuously move the plated material F toward the recovery unit 40 while rotating around the supply shaft. The supply unit 20 may be formed in the form of a drum extending in the width direction (Y-axis direction) perpendicular to the moving direction (X-axis direction) in which the plated material (F) moves, but is not limited thereto. However, it may be formed in another form as long as the supply operation of supplying the plated material (F) to the supply unit 20 while rotating around the supply shaft can be continuously performed.

Referring to FIG. 2, the switching unit 30 switches the movement of the material to be plated (F). The switching unit 30 may be disposed on a movement path along which the material to be plated (F) moves. The switching unit 30 can change the movement of the plated material (F) in the switching direction (Z-axis direction). The switching direction (Z-axis direction) may be an axis direction perpendicular to each of the movement direction (X-axis direction) and the width direction (Y-axis direction). The switching unit 30 can continuously change the movement of the plated material (F) while rotating around the switching axis. The switching unit 30 may continuously move the plated material F toward the recovery unit 40 while rotating around the switching axis. The switching unit 30 may be formed in the form of a drum extending in the width direction (Y-axis direction), but is not limited thereto, and rotates around the switching axis to change the movement of the plated material (F). It can be formed in other forms as long as it can perform tasks continuously. Although two switching units 30 are shown in FIG. 2, this is an example, and the electrolytic copper foil manufacturing apparatus 10 according to the present invention may include one switching unit 30 or three or more switching units 30. there is.

Referring to FIG. 2, the recovery unit 40 recovers the plated material F on which copper foil has been plated. The recovery unit 40 can continuously recover the plated material (F) while rotating around the recovery axis. The recovery unit 40 may be formed in the form of a drum extending in the width direction (Y-axis direction), but is not limited thereto, and performs a recovery operation of recovering the plated material (F) while rotating around the recovery axis. If it is a form that can be performed, it may be formed in another form.

In this way, in order to plate copper foil on the plated material (F) supplied and recovered through the supply unit 20, the conversion unit 30, and the recovery unit 40, the electrolytic copper foil manufacturing apparatus according to the present invention (10) may include an electrolytic copper foil plating device (1).

Referring to Figures 3 to 8, the electrolytic copper foil plating apparatus 1 according to the present invention is for plating copper foil on the material to be plated (F). Copper foil manufactured through the electrolytic copper foil plating apparatus 1 according to the present invention can be recovered in the recovery unit 40.

The electrolytic copper foil plating apparatus (1) according to the present invention includes the plating bath (2) providing a space for plating copper foil on the material (F), and a plurality of electric currents for applying a negative potential to the material (F). A roll (3), N first anodes (4) (N is an integer of 2 or more) for applying a positive potential to the plated material (F), and a first power unit for applying power to the first anodes (4). (5), and N (N is an integer of 2 or more) number of first bus bars (6) for supplying power generated by the first power unit (5) to the first anodes (4). do. Accordingly, compared to the prior art in which one first bus bar 6 is implemented to distribute power to the first anodes 4, the electrolytic copper foil plating device 1 according to the present invention has the plurality of It is implemented to individually supply power to each of the first anodes (4) through the first bus bar (6). Therefore, the electrolytic copper foil plating device 1 according to the present invention is implemented so that the first power unit 5 can apply power of the same size to each of the first anodes 4, so that the first anodes 4 The uniformity of power applied to can be improved. Accordingly, the electrolytic copper foil plating apparatus 1 according to the present invention can improve the quality of the copper foil plated on the plated material (F) by reducing the plating deviation of the plated material (F).

Hereinafter, the plating tank 2, the energizing rolls 3, the first anodes 4, the first power unit 5, and the first bus bars 6 will be described in the attached drawings. This will be explained in detail with reference to .

Referring to Figures 3 and 4, the plating tank 2 provides a space for plating copper foil on the material to be plated (F). The plating tank 2 may be implemented as a device for plating copper foil on the material to be plated (F).

Referring to Figures 3 and 4, the plating tank 2 may include a plating body (2A), a receiving space (2B), an inlet (2C), an outlet (2D), and a plurality of blocking rolls (2E). there is.

The plating body 2A may function as the main body of the plating tank 2. The plating body 2A may be formed as a whole in a rectangular parallelepiped shape, but is not limited thereto, and may be formed in any other shape as long as it can function as the main body of the plating tank 2.

The accommodation space (2B) is for accommodating a plating solution for plating copper foil on the material to be plated (F). The receiving space 2B may be formed inside the plating body 2A. The material to be plated (F) can be immersed in the plating solution in the receiving space (2B). When the material to be plated (F) is immersed in the plating solution and an electric current flows through the first anodes 4, ions dissolved in the plating solution are formed on the material to be plated (F) through a chemical reaction. Can be plated on the surface.

The inlet 2C is for introducing the plated material F into the receiving space 2B. The inlet 2C may be disposed on the movement path of the material to be plated (F). The inlet 2C may be formed entirely as a groove for introducing the plated material F into the receiving space 2B. The inlet 2C may be formed along the moving direction (X-axis direction) on one side of the plating body 2A.

The outlet (2D) is for pulling out the plated material (F) out of the receiving space (2B). The outlet (2D) may be arranged on the movement path of the material to be plated (F). The outlet (2D) may be formed as a groove for drawing the plated material (F) out of the receiving space (2B). The outlet 2D may be formed along the moving direction (X-axis direction) on the other side of the plating body 2A.

The blocking rolls 2E are used to prevent the plating solution contained in the receiving space 2B from leaking out. The blocking rolls 2E may be disposed on the movement path of the plated material F, and may be disposed outside the plating body 2A toward the inlet 2C and the outlet 2D, respectively.

Each of the blocking rolls 2E may continuously move the plated material F toward the recovery unit 40 while rotating around the blocking axis. Each of the blocking rolls 2E may be formed of an insulator to prevent ions contained in the plating solution from being plated. For example, each of the blocking rolls 2E may be made of a material such as rubber. Each of the blocking rolls 2E may be formed in a drum shape extending in the width direction (Y-axis direction), but is not limited thereto, and may prevent the plating solution contained in the receiving space 2B from leaking to the outside. If there is, it may be formed in a different form.

Although the description above is based on one plating tank 2, this is an example, and the electrolytic copper foil plating device 1 according to the present invention may include a plurality of plating tanks 2. In this case, each of the plating baths 2 may be implemented to be approximately identical to each other. In Figure 2, six plating baths (2) are shown, but this is an example, and the electrolytic copper foil plating apparatus (1) according to the present invention has two to five plating baths (2) or seven or more plating baths (2). ) may include.

Referring to Figure 3, the energizing rolls 3 are for applying a negative potential to the material to be plated (F). Each of the energizing rolls 3 may function as a cathode for performing a plating operation of plating copper foil on the material to be plated (F). Each of the energization rolls 3 may be disposed on the movement path of the material to be plated (F) and may be disposed outside the plating bath (2). The material to be plated (F) charged to a negative potential by the current-carrying rolls (3) may be connected to the first anodes (4) inside the plating bath (2). Accordingly, copper foil may be plated on the material to be plated (F). In Figure 3, it is shown that one energizing roll (3) is disposed on the inlet (2C) and the outlet (2D), but this is an example, and two energizing rolls (3) are placed on the inlet (2C) and the outlet (2D), respectively. More than one energizing roll 3 may be arranged.

Each of the energization rolls 3 may continuously move the plated material F toward the recovery unit 40 while rotating about the energization axis. Each of the energizing rolls 3 may be formed as a whole in a drum shape extending in the width direction (Y-axis direction), but is not limited thereto, and may apply a negative potential to the material to be plated (F). It may be formed in other shapes as long as the material to be plated (F) can be moved.

Referring to Figures 3 to 8, the first anodes 4 are used to apply a positive potential to the material to be plated (F). The first anodes 4 may be implemented in N numbers (N is an integer equal to or greater than 2). In this case, the first anodes 4 may be implemented to be approximately identical to each other. Each of the first anodes 4 may function as an anode for performing a plating operation of plating copper foil on the material to be plated (F). Each of the first anodes 4 may be disposed inside the plating bath 2.

The first anodes 4 may be arranged to be spaced apart from each other along the moving direction (X-axis direction) inside the plating bath 2. Each of the first anodes 4 may be arranged to be spaced apart from the plated material F. Each of the first anodes 4 may be electrically connected to the plated material F while being spaced apart from the plated material F. Each of the first anodes 4 may be formed in an overall rectangular shape, but is not limited thereto, and may be formed in another shape such as a cylindrical shape as long as a positive potential can be applied to the plated material F. In Figure 3, six first anodes 4 are shown, but this is an example, and the electrolytic copper foil plating device 1 according to the present invention includes 2 to 5 first anodes 4, or 7 or more. It may also include first anodes (4).

Each of the first anodes 4 may be disposed closer to the first bus bars 6 than the plated material F. Accordingly, the electrolytic copper foil plating device 1 according to the present invention is applied to each of the first anodes 4 as the separation distance between the first bus bars 6 and the first anodes 4 is reduced. It can be implemented to increase the amount of power that reaches it. Therefore, the electrolytic copper foil plating device 1 according to the present invention can improve the efficiency of plating work using the first anodes 4.

Referring to Figures 3 and 8, the first power supply unit 5 is for applying power to the first anodes 4. As the first power supply unit 5 applies power to the first anodes 4, each of the first anodes 4 may be connected to the plated material F. The first power supply unit 5 may be disposed outside the plating bath 2.

Referring to FIG. 3, the electrolytic copper foil plating device 1 according to the present invention may include a plurality of first cables 5A.

The first cables 5A are for electrically connecting the first power unit 5 and the first bus bars 6. Each of the first cables 5A may be connected together to the first power unit 5 and the first bus bar 6. The first power unit 5 can apply power to the first anodes 4 by being electrically connected to the first bus bars 6 through the first cables 5A. The first cables 5A may be implemented as N (N is an integer of 2 or more). As shown in FIG. 3, the first cables 5A may be implemented in the same number as the first anodes 4 and the first bus bars 6. Each of the first cables 5A may be implemented as a conductive wire for electrically connecting the first power unit 5 and the first bus bars 6.

Referring to FIGS. 3 to 8, the first bus bars 6 are for supplying power generated from the first power unit 5 to the first anodes 4. The first bus bars 6 may be implemented in N numbers (N is an integer equal to or greater than 2). Accordingly, compared to the prior art in which one first bus bar 6 is implemented to distribute power to the first anodes 4, the electrolytic copper foil plating device 1 according to the present invention has the plurality of It can be implemented to individually supply power to each of the first anodes 4 through the first bus bar 6. Therefore, the electrolytic copper foil plating device 1 according to the present invention is implemented so that the first power unit 5 can apply power of the same size to each of the first anodes 4, so that the first anodes 4 The uniformity of power applied to can be improved. As the first bus bars 6 are electrically connected to the first anodes 4, they can supply power generated from the first power unit 5 to the first anodes 4. The first bus bars 6 may be implemented with the same number as the first anodes 4. For example, as shown in FIG. 3, one first bus bar 6 may be electrically connected to one first anode 4.

Each of the first bus bars 6 is coupled to the plating bath 2. Each of the first bus bars 6 may be coupled to the plating body 2A. Each of the first bus bars 6 may be formed as a whole in a rectangular parallelepiped shape, but is not limited thereto, as long as it can supply power to the first anodes 4 and be coupled to the plating tank 2. It may be formed in other forms. In FIG. 3, six first bus bars 6 are shown, but this is an example, and the electrolytic copper foil plating device 1 according to the present invention includes 2 or more and 5 or less first bus bars 6, or 7. It may include one or more first bus bars (6).

The first bus bars 6 may be coupled to the first coupling surface 21 of the plating bath 2 so as to be spaced apart from each other along the moving direction (X-axis direction). The first coupling surface 21 is formed on the plating body 2A. The first coupling surface 21 may correspond to one surface of the plating tank 2 facing toward the side where the first bus bars 6 are arranged. The first anodes 4 may be disposed in a first direction from the plated material F toward the first coupling surface 21.

Referring to Figure 5, the electrolytic copper foil plating device 1 according to the present invention can be implemented so that each of the first anodes 4 is spaced from the first coupling surface 21 by the same first separation distance L1. there is. Accordingly, the electrolytic copper foil plating device 1 according to the present invention is implemented so that the first power unit 5 can apply power of the same size to each of the first anodes 4, so that the first anode 4 ) can improve the uniformity of power applied to the devices. The arrow shown as a dotted line in FIG. 5 schematically shows the direction in which power is applied. 3 to 8 show that the first anode 4 is spaced apart from the first bus bar 6, but the first anode 4 may be in contact with the first bus bar 6. .

Referring to FIG. 6, the plurality of first groups G1 consisting of the first bus bars 6, the first anodes 4, and the first power unit 5 are aligned in the moving direction (X axis). direction) can be arranged to be spaced apart from each other. In this case, each of the first groups G1 includes at least two first bus bars 6, at least two first anodes 4, and at least one first power unit 5. can do. In Figure 6, two first groups (G1, G1') are shown, but this is an example, and the electrolytic copper foil plating device (1) according to the present invention includes three or more first groups (G1) in the moving direction (X). They may be implemented to be spaced apart from each other along the axial direction.

Referring to FIG. 8, the second anodes 7 are used to apply a positive potential to the material to be plated (F). The second anodes 7 may be implemented as M (M is an integer of 2 or more). In this case, the second anodes 7 may be implemented to be approximately identical to each other. Each of the second anodes 7 may function as an anode for performing a plating operation of plating copper foil on the material to be plated (F). Each of the second anodes 7 may be disposed inside the plating bath 2.

The second anodes 7 may be arranged to be spaced apart from each other along the moving direction (X-axis direction) inside the plating bath 2. Each of the second anodes 7 may be arranged to be spaced apart from the material to be plated (F). Each of the second anodes 7 may be connected to the plated material F while being spaced apart from the plated material F. Each of the second anodes 7 may be formed in an overall rectangular shape, but is not limited thereto, and may be formed in another shape such as a cylindrical shape as long as a positive potential can be applied to the plated material F. In Figure 8, six second anodes 7 are shown, but this is an example, and the electrolytic copper foil plating device 1 according to the present invention includes two to five second anodes 7, or seven or more. It may also include second anodes (7).

The second anodes 7 are arranged to be spaced apart from the first anodes 4. The second anodes 7 and the first anode 4 may apply positive potential to different parts of the material to be plated (F). Accordingly, the electrolytic copper foil plating apparatus 1 according to the present invention can increase the scope of the plating operation for plating the copper foil on the plated material F. When the second anodes (7) apply a positive potential to one side of the plated material (F), the first anodes (4) apply a positive potential to the other side of the plated material (F). Positive potential can be applied. The second anodes 7 may be arranged to be spaced apart from the first anodes 4 based on the switching direction (Z-axis direction). Each of the second anodes 7 may be arranged to be spaced apart from the plated material (F) at the same distance as the distance between the first anodes 4 from the plated material (F). Each of the second anodes 7 may be implemented in approximately the same way as the first anode 4.

Each of the second anodes 7 may be disposed closer to the second bus bars 9 than the plated material F. Accordingly, the electrolytic copper foil plating device 1 according to the present invention is applied to each of the second anodes 7 as the separation distance between the second bus bars 9 and the second anodes 7 is reduced. It can be implemented to increase the amount of power that reaches it. Therefore, the electrolytic copper foil plating device 1 according to the present invention can improve the efficiency of plating work using the second anodes 7.

Referring to FIG. 8, the second power supply unit 8 is used to apply power to the second anodes 7. As the second power supply unit 8 applies power to the second anodes 7, each of the second anodes 7 may be connected to the plated material F. The second power supply unit 8 may be disposed outside the plating bath 2. The second power unit 8 may be disposed at a location spaced apart from the first power unit 5. The second power unit 8 may be implemented in approximately the same way as the first power unit 5.

Referring to FIG. 8, the second power unit 8 may include a plurality of second cables 8A.

The second cables (8A) are for electrically connecting the second power unit (8) and the second bus bars (9). Each of the second cables (8A) may be connected together to the second power unit (8) and the second bus bar (9). The second power unit 8 can apply power to the second anodes 7 by being electrically connected to the second bus bars 9 through the second cables 8A. The second cables 8A may be implemented as M (M is an integer of 2 or more). As shown in FIG. 8, the second cables 8A may be implemented in the same number as the second anodes 7 and the second bus bars 9. Each of the second cables 8A may be implemented as a conductive wire for electrically connecting the second power unit 8 and the second bus bar 9.

Referring to FIG. 8, the second bus bars 9 are for supplying power generated from the second power unit 8 to the second anodes 7. The second bus bars 9 may be implemented as M (M is an integer of 2 or more). Accordingly, compared to the prior art in which one second bus bar 9 is implemented to distribute power to the second anodes 7, the electrolytic copper foil plating device 1 according to the present invention has the plurality of It can be implemented to individually supply power to each of the second anodes 7 through the second bus bar 9. Therefore, the electrolytic copper foil plating device 1 according to the present invention is implemented so that the second power unit 8 can apply power of the same size to each of the second anodes 7, so that the second anodes 7 The uniformity of power applied to can be improved. As the second bus bars 9 are electrically connected to the second anodes 7, they can supply power generated from the second power unit 8 to the second anodes 7. The second bus bars 9 may be implemented with the same number as the second anodes 7. For example, as shown in FIG. 8, one second bus bar 9 may be electrically connected to one second anode 7.

The second bus bars 9 are coupled to the plating tank 2. Each of the second bus bars 9 may be coupled to the plating body 2A. Each of the second bus bars 9 may be formed as a whole in a rectangular parallelepiped shape, but is not limited thereto, as long as it can supply power to the second anodes 7 and be coupled to the plating tank 2. It may be formed in other forms. In Figure 8, six second bus bars (9) are shown, but this is an example, and the electrolytic copper foil plating device (1) according to the present invention has two to five second bus bars (9), or seven. It may include more than two second bus bars (9). Each of the second bus bars 9 may be implemented in approximately the same way as the first bus bar 6.

The second bus bars 9 may be coupled to the second coupling surface 22 of the plating bath 2 so as to be spaced apart from each other along the moving direction (X-axis direction). The second coupling surface 22 is formed on the plating body 2A. The second coupling surface 22 may correspond to the other surface of the plating tank 2 facing toward the side where the second bus bars 9 are disposed. The second anodes 7 may be disposed in a second direction from the plated material F toward the second coupling surface 22.

The electrolytic copper foil plating device 1 according to the present invention can be implemented so that each of the second anodes 7 is spaced from the second coupling surface 22 by the same second separation distance. Accordingly, the electrolytic copper foil plating device 1 according to the present invention is implemented so that the second power unit 8 can apply power of the same size to each of the second anodes 7, so that the second anode 7 ) can improve the uniformity of power applied to the devices. In FIG. 8, the second anode 7 is shown spaced apart from the second bus bar 9, but the second anode 7 may be in contact with the second bus bar 9.

The plurality of second groups consisting of the second bus bars 9, the second anodes 7, and the second power unit 8 are arranged to be spaced apart from each other along the moving direction (X-axis direction). You can. In this case, one second group may include at least two second bus bars 9, at least two second anodes 7, and at least one second power unit 8. The electrolytic copper foil plating apparatus 1 according to the present invention may be implemented so that at least two or more second groups are arranged to be spaced apart from each other along the moving direction (X-axis direction).

Referring to FIG. 7, the electrolytic copper foil plating device 1 according to the present invention may include a sensing unit 10A and a control unit 10B.

The detection unit 10A detects the level of power applied to each of the first anodes 4. The sensing unit 10A may be coupled to each of the first anodes 4. The control unit 10B may be coupled to each of the first bus bars 6.

The control unit 10B controls the first power unit 5 to change the size of power supplied to each of the first bus bars 6. When the detection unit 10A detects that power of different sizes is applied to each of the first anodes 4, the control unit 10B supplies power to each of the first bus bars 6. The first power unit 5 can be controlled to change its size. Accordingly, the electrolytic copper foil plating device 1 according to the present invention can reduce the size deviation of the power applied to each of the first anodes 4 through the control unit 10B. For example, when the detection unit 10A detects the first anode 4 to which a relatively small size of power is applied among the first anodes 4, the control unit 10B detects the first power unit 5 ) By adjusting , high power can be applied to the first anode 4 to which a relatively small amount of power is applied. In this way, the electrolytic copper foil plating device 1 according to the present invention is implemented to control the amount of power applied to each of the first anodes 4 through the control unit 10B, so that the first anode 4 ) can improve the ease of work by reducing the size deviation of the power applied to the devices. The control unit 10B may be coupled to the first power unit 5.

In the above description, the detection unit 10A detects the level of power applied to each of the first anodes 4 and the control unit 10B controls the first power unit 5, but it is limited to this. Alternatively, the detection unit 10A may be implemented to detect the level of power applied to each of the second anodes 7 and the control unit 10B may be implemented to control the size of the second power unit 8. .

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is commonly known in the technical field to which the present invention pertains that various substitutions, modifications and changes can be made without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of.

1: Electrolytic copper foil plating device 2: Plating tank
3: energizing roll 4: first anode
5: first power unit 6: first bus bar
7: second anode 8: second power unit
9: 2nd bus bar 10A: detection unit
10B: Control unit 10: Electrolytic copper foil manufacturing device
20: supply unit 30: conversion unit
40: Recovery part F: Material to be plated

Claims (8)

A plating tank (2) providing a space for plating copper foil on the material to be plated (F);
A plurality of energizing rolls (3) for applying a negative potential to the plated material (F);
N (N is an integer of 2 or more) first anodes 4 that apply a positive potential to one surface of the material to be plated (F);
A first power supply unit (5) that applies power to the first anodes (4);
N (N is an integer of 2 or more) number of first bus bars (6) for supplying power generated from the first power unit (5) to the first anodes (4);
M (M is an integer of 2 or more) second anodes (7) arranged to be spaced apart from the first anodes (4) and applying a positive potential to the other surface of the plated material (F);
a second power supply unit (8) for applying power to the second anodes (7); and
It includes M (M is an integer of 2 or more) second bus bars (9) for supplying power generated from the second power unit (8) to the second anodes (7),
The first group (G1) consisting of the first bus bars (6), the first anodes (4), and the first power supply unit (5) is disposed in the moving direction (X-axis direction) of the plated material (F). ) are arranged to be spaced apart from each other and a positive potential is applied to one surface of the plated material (F),
The second group consisting of the second bus bars 9, the second anodes 7, and the second power unit 8 is formed along the moving direction (X-axis direction) of the plated material F. An electrolytic copper foil plating device, wherein a plurality of units are arranged to be spaced apart from each other and a positive potential is applied to the other surface of the material to be plated (F). According to paragraph 1,
The plating bath 2 includes a first coupling surface 21 where the first bus bars 6 are coupled to be spaced apart from each other along the moving direction (X-axis direction) of the plated material F,
Electrolytic copper foil plating device, characterized in that each of the first anodes (4) is spaced apart from the first coupling surface (21) at the same first distance. According to paragraph 1,
An electrolytic copper foil plating device, characterized in that each of the first anodes (4) is disposed closer to the first bus bars (6) than the material to be plated (F). According to paragraph 1,
An electrolytic copper foil plating device, characterized in that the second anodes (7) and the first anodes (4) apply positive potentials to different parts of the material to be plated (F). According to paragraph 1,
The plating tank 2 includes a second engaging surface 22 where the second bus bars 9 are coupled to be spaced apart from each other along the moving direction (X-axis direction) of the plated material F,
An electrolytic copper foil plating device, characterized in that each of the second anodes (7) is spaced apart from the second coupling surface (22) at the same distance. According to paragraph 1,
A detection unit (10A) that detects the level of power applied to each of the first anodes (4); and
When the detection unit 10A detects that different sizes of power are applied to each of the first anodes 4, the size of the power supplied to each of the first bus bars 6 is changed. An electrolytic copper foil plating device further comprising a control unit (10B) that controls the first power supply unit (5). delete Electrolytic copper foil plating device according to any one of claims 1 to 6;
A supply unit 20 that continuously supplies the material to be plated (F) to the plating tank 2;
A switching unit 30 that switches the movement of the plated material (F); and
An electrolytic copper foil manufacturing apparatus further comprising a recovery unit 40 for recovering the copper foil-plated material (F).

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