KR102586832B1 - Method for manufacturing probe card - Google Patents

Abstract

The present invention relates to a method of manufacturing a probe card. In particular, the upper surface of a plate-shaped fixing jig can prevent misalignment of probe needles by minimizing thermal deformation occurring during the drying process and shorten the overall process time. A film setting step of attaching a coordinate film having a plurality of through holes formed in a working groove formed in the center; A support ring temporary fixing step of temporarily fixing a support ring in the form of a ring having a width larger than the working groove and having at least two seating grooves recessed from the upper surface to the upper surface of the fixing jig so that the center is located at the center of the working groove; A needle group is formed by arranging a plurality of probe needles so that one end is inserted into the through hole and the other end is located on the outside of the fixing jig while a part is placed in the seating groove. Then, adhesive is applied and cured to form an adhesive layer, thereby forming a plurality of probe needles. A probe needle fixing step of fixing the probe needle to the support ring; and a separation step of separating the support ring to which the plurality of probe needles are fixed from the fixing jig.

Description

Method for manufacturing probe card}

The present invention relates to a method of manufacturing a probe card, and in particular, to a method of manufacturing a probe card that can minimize thermal deformation occurring during the drying process and shorten the process time.

In general, semiconductor devices include a process of manufacturing a semiconductor wafer, a process of manufacturing a plurality of unit semiconductor chips from a semiconductor wafer, and a process of inspecting the electrical characteristics of the semiconductor chip to determine whether the semiconductor chip is defective (hereinafter referred to as 'inspection'). It is manufactured through a process (referred to as 'process'), and the inspection process uses a tester that generates an electrical signal and a probe card equipped with a plurality of needles to send the electrical signal from the tester to the electrode formed on the semiconductor chip on the wafer.

For this type of probe card, a punching film is set on a fixing jig, and the probe needles are fixed in multiple layers. After fixing the probe needles in one layer, epoxy is applied and dried. Afterwards, epoxy is applied to the upper side, a support ring made of ceramic or steel is attached, and the probe card is finally manufactured through a drying process.

After forming the resin layer through epoxy, a high temperature drying process must be performed. Thermal deformation due to shrinkage and expansion occurs during the drying process not only in the fixing stage of the probe needle but also in the attachment stage of the support ring, especially in the size of the probe card. If it is large, the position of the probe needles is distorted due to thermal deformation, and uniform contact resistance cannot be formed, so the probe card is being remanufactured. In addition, in order to attach the support ring, there is a problem that the process of applying and drying epoxy must be performed, which takes a considerable amount of time.

Republic of Korea Patent Publication No. 10-2009-0082735 ‘Method of fixing probe needle used in probe card and method of manufacturing probe card’

The purpose of the present invention is to solve the above problems, and to provide a method for manufacturing a probe card that can minimize thermal deformation occurring during the drying process, prevent the probe needles from being misaligned, and shorten the overall process time. there is.

The present inventor's method of manufacturing a probe card to achieve the above object includes a film setting step of attaching a coordinate film having a plurality of through holes formed in a working groove formed in the center of the upper surface of a plate-shaped fixing jig; A support ring temporary fixing step of temporarily fixing a support ring in the form of a ring having a width larger than the working groove and having at least two seating grooves recessed from the upper surface to the upper surface of the fixing jig so that the center is located at the center of the working groove; A needle group is formed by arranging a plurality of probe needles so that one end is inserted into the through hole and the other end is located on the outside of the fixing jig while a part is placed in the seating groove. Then, adhesive is applied and cured to form an adhesive layer, thereby forming a plurality of probe needles. A probe needle fixing step of fixing the probe needle to the support ring; and a separation step of separating the support ring to which the plurality of probe needles are fixed from the fixing jig.

In addition, the probe needle fixing step includes a needle bath forming step of forming a one-layer needle bath by arranging the plurality of probe needles, and at least one of the plurality of probe needles constituting the one-layer needle bath is placed in the seating groove. It includes an adhesive application step of applying adhesive to the part, and a curing step of hardening the adhesive to fix one layer of needle bath to the support ring, wherein the needle bath forming step, adhesive application step, and curing step are repeated multiple times. By performing this, the multi-layer needle tank can be fixed to the support ring.

In addition, the adhesive in the adhesive application step is a one-component epoxy resin, and in the curing step, the adhesive can be cured in an oven at 125°C.

In addition, a plurality of adhesive layers are formed by stacking the adhesive application step and the curing step, which are repeated multiple times. In the first adhesive application step, the adhesive is applied to the portion of the probe needle placed in the seating groove to form a first adhesive layer, In the adhesive application step after the first adhesive application step, adhesive is applied to include the portion of the probe needle placed in the seating groove as well as a portion of the probe needle protruding inward from the seating groove to form an nth adhesive layer (n is a natural number greater than 1). can be formed.

In addition, before the step of temporarily fixing the support ring, a support ring preparation step of manufacturing a support ring having a seating groove deeper than the height of the plurality of adhesive layers to be formed through the adhesive application step and curing step repeated multiple times. It may further include, after the probe needle fixing step, a finishing step of filling the remaining space of the seating groove with the upper side of the plurality of adhesive layers using a finishing agent whose strength is weaker than that of the adhesive when cured.

According to the present invention, the support ring is temporarily fixed to the upper surface of the fixing jig, and a plurality of probe needles are fixed using the seating groove formed in the support ring. Adhesive for attaching the support ring is applied and dried as in the prior art. Since there is no need to go through the process, the overall process time can be shortened, and since the adhesive is applied and dried while the plurality of probe needles are placed in the seating groove, the position of the probe needles is effectively prevented from being misaligned due to thermal deformation occurring during the drying process. It can be prevented.

1 is a flow chart showing the manufacturing method of the probe card of the present invention;
Figure 2 is a perspective view showing the structure of the fixing jig and support ring applied to the present invention;
Figure 3 is a cross-sectional view showing the structure of the fixing jig, coordinate film, support ring, and probe needle applied to the present invention;
Figure 4 is an illustration showing the film setting step in the method of manufacturing the probe card of the present invention;
Figure 5 is an example showing the step of temporarily fixing the support ring and the step of fixing the probe needle in the method of manufacturing the probe card of the present invention;
Figures 6 and 7 are illustrations showing the probe needle fixing step in the method of manufacturing the probe card of the present invention;
Figure 8 is an illustration showing the separation and finishing steps in the method of manufacturing the probe card of the present invention;
Figure 9 is an exemplary diagram showing another example of a finishing step in the method of manufacturing a probe card according to the present invention.

In the present invention, the thermal deformation occurring during the drying process can be minimized to prevent the probe needle from being misaligned and the overall process time can be shortened by forming a plurality of penetrations into the working groove formed in the center of the upper surface of the plate-shaped fixing jig. A film setting step of attaching a coordinate film in which a hole is formed; A support ring temporary fixing step of temporarily fixing a support ring in the form of a ring having a width larger than the working groove and having at least two seating grooves recessed from the upper surface to the upper surface of the fixing jig so that the center is located at the center of the working groove; A needle group is formed by arranging a plurality of probe needles so that one end is inserted into the through hole and the other end is located on the outside of the fixing jig while a part is placed in the seating groove. Then, adhesive is applied and cured to form an adhesive layer, thereby forming a plurality of probe needles. A probe needle fixing step of fixing the probe needle to the support ring; and a separation step of separating the support ring to which the plurality of probe needles are fixed from the fixing jig.

The scope of the present invention is not limited to the embodiments described below, and various modifications may be made by those skilled in the art without departing from the technical gist of the present invention.

Hereinafter, the method of manufacturing the probe card according to the present invention will be described in detail with reference to the attached FIGS. 1 to 9.

As shown in FIG. 1, the method of manufacturing the probe card of the present invention basically includes a film setting step (S30), a support ring temporary fixing step (S40), a probe needle fixing step (S50), and a separation step (S60). , it may further include at least one of a support ring preparation step (S10), a fixing jig assembly step (S20), and a finishing step (S70).

The support ring preparation step (S10) is a step of manufacturing the support ring 300 integral with the plurality of probe needles 400 in order to place the plurality of probe needles 400 constituting the probe card at a predetermined position. In the support ring preparation step (S10), the support ring 300 may be formed in a ring shape made of ceramic or steel material with low thermal deformation. For example, the support ring 300 may be formed so that the outer edge is circular and the inner edge is square, as shown in Figures 2 and 3, and the outer edge and the inner edge are spaced apart from each other by a predetermined distance. The upper and lower ends, where the seating groove 310, which will be described later, is not formed, may be formed to have a thickness that is spaced apart from each other. Specifically, the support ring 400 may be formed so that its outer edge has a larger width than the working groove 110 formed in the fixing jig 100 and its inner edge has a smaller width than the working groove 110.

In the support ring 300 described above in the support ring preparation step (S10), at least two seating grooves 310 are recessed from the upper surface as shown in FIGS. 2 and 3. The seating groove 310 may be formed from the outer edge to the inner edge of the support ring 300, and at least two seating grooves 310 are spaced apart from each other radially with respect to the center of the support ring 300. can be formed apart. These seating grooves 310 are parts of the probe needles 400 placed in the probe needle fixing step (S50), which will be described later. The number of the probe needles 400 can be determined according to the direction in which the probe needles 400 are placed, but various probes It may be formed in sufficient numbers to be used in cards. Additionally, the seating groove 310 may be formed deeper than the height of the plurality of adhesive layers to be formed through the adhesive application step (S52) and curing step (S53), which are repeated multiple times in the probe needle fixing step (S50).

The fixing jig assembly step (S20) involves assembling a fixing jig 100 that provides convenience in arranging the probe needles 400 to accurately arrange the plurality of probe needles 400 according to the coordinate values previously received from the customer. It's a step. The overall structure of the fixing jig 100 is in the form of a plate with a predetermined thickness, as shown in FIGS. 2 and 3, and a working groove 110 may be formed in the center of the upper surface. In addition, a needle fitting groove 111 having a width smaller than the working groove 110 may be formed on the bottom surface of the working groove 110, and the outer edge of the support ring 300 may be formed on the upper surface of the fixing jig 100. A ring fixing groove 120 corresponding to the width may be recessed, and the center of the ring fixing groove 120 may be formed to coincide with the center of the working groove 110.

Although not shown in the drawing, this fixing jig 100 can be divided into a plurality of pieces and assembled. In the fixing jig assembly step (S20), a plurality of pieces are assembled to form the fixing jig 100 as described above. . As an example, the fixing jig 100 may have a coordinate film 200 attached, a center jig whose upper surface is the bottom surface of the working groove 110 and a needle fitting groove 111 is formed, and a center jig radially centered on the center jig. It may include a plurality of side jigs arranged, and in the fixing jig assembly step (S20), a plurality of side jigs are arranged to surround the center jig, so that a ring fixing groove 120 is formed on the plurality of side jigs. In addition, the work groove 110 may be formed due to the height difference between the center jig and the plurality of side jigs.

The film setting step (S30) is a step of attaching the coordinate film 200 to the working groove 110 formed in the center of the upper surface of the plate-shaped fixing jig 100, as shown in FIG. 4. Here, the coordinate film 200 is (200) is in the form of a thin plate and has a plurality of through holes corresponding to the coordinate values of the plurality of probe needles (400) previously received from the customer. In the film setting step (S30), the coordinate film 200 is attached and fixed to the bottom surface of the work groove 110, and this film setting step (S30) can be performed while performing the fixing jig assembly step (S20) described above. there is. That is, before assembling the center jig and the plurality of side jigs, a film setting step (S30) of attaching the coordinate film 200 to the upper surface of the center jig may be performed.

The support ring temporary fixing step (S40) performed after the film setting step (S30) is performed by fixing the support ring 300 manufactured in the support ring preparation step (S10) so that the center is located at the center of the work groove 110. This is the step of temporarily fixing it to the upper surface of (100). At this time, the support ring 300 is temporarily fixed while seated in the ring fixing groove 120 formed on the upper surface of the fixing jig 100, as shown in Figure 5a, and the probe needle ( It is possible to prevent shaking when placing the probe needles 400 as well as when gluing the probe needles 400.

The probe needle fixing step (S50) performed after the support ring temporary fixing step (S40) is a step of arranging a plurality of probe needles 400 and fixing the probe needles 400 so as to form one body with the support ring 300. , the probe needles 400 in the present invention may be made of copper conductors to allow current to flow, and may be formed so that one end is bent with respect to the remaining portion, as shown in FIG. 3.

The probe needle fixing step (S50) may include a needle bath forming step (S51), an adhesive applying step (S52), and a curing step (S53). The needle tank forming step (S51) is to arrange a plurality of probe needles 400 as shown in FIGS. 5 to 7. Some of the probe needles 400 are placed in the seating groove 310 and one end is aligned with the coordinates. It is inserted into a through hole formed in the film 200 and the other end is positioned outside the fixing jig 100. A plurality of probe needles 400 placed to pass through the same seating groove 310 are arranged in parallel in the longitudinal direction on the same plane to form a one-layer needle group.

In the adhesive application step (S52), as shown in FIGS. 5 to 7, the adhesive 10 is applied to at least the portion placed in the seating groove 310 among the plurality of probe needles 400 constituting one layer of needle tank. Apply. The adhesive 10 here may be various types of organic adhesives, and for example, may be an epoxy resin adhesive. For example, the adhesive 10 may be a one-component epoxy resin that hardens by heating, has excellent heat resistance, and is easy to manage. In the curing step (S53), the adhesive 10 applied in the adhesive application step (S52) is cured to fix one layer of needle tank to the support ring 300. For example, if the adhesive 10 used in the adhesive application step (S52) is an epoxy resin-based adhesive, the adhesive 10 may be cured in an oven at 125°C. Through the above-described adhesive application step (S52) and curing step (S53), an adhesive layer is formed to integrate one layer of needle tank with the support ring 300.

In the probe needle fixing step (S50), as shown in FIGS. 5 to 7, the needle bath forming step (S51), the adhesive applying step (S52), and the curing step (53) are repeated multiple times to form a multi-layered needle bath. Can be fixed to the support ring 300. This is to achieve the arrangement of the probe needles 400 according to the coordinate values received from the customer through a multi-layer needle group if the arrangement is not achieved through a single-layer needle group. For example, when fixing an n-layer (n = natural number) needle bath to the support ring 300, the needle bath forming step (S51), the adhesive application step (S52), and the curing step (53) are sequentially performed n times. Proceed.

One end of the probe needle 400 is inserted from the through hole formed on the outside of the plurality of through holes formed in the coordinate film 200 to form a one-layer needle group, and the nth (n is a natural number greater than 1) needle group is n- The first (n is a natural number greater than 1) may be placed above the needle group. And, as the adhesive application step (S52) and the curing step (53) are repeatedly performed on the needle bath of each layer, a plurality of adhesive layers can be formed by stacking them. At this time, in the first adhesive application step (S52-1) for the first needle group, the adhesive 10 is applied to the portion of the probe needle 400 placed in the seating groove 310, as shown in FIG. 5, and the adhesive ( 10) is cured to form a first adhesive layer, and the adhesive application step (S52-n, natural number with n>1) after the first adhesive application step (S52-1) is seated as shown in FIGS. 6 and 7. Adhesive 10 is applied to include the portion of the probe needle 400 placed in the groove 310 as well as a portion of the probe needle 400 protruding inward from the seating groove 310, and the adhesive 10 is cured. An nth adhesive layer (n is a natural number greater than 1) can be formed. Here, as n in the nth adhesive layer increases, the length of the adhesive layer formed by applying it in the inner direction from the seating groove 310 gradually becomes longer, allowing contact with the plurality of probe needles 400 constituting the multi-layer needle group. It is desirable to ensure that the resistance is uniform.

The separation step (S60) performed after the probe needle fixing step (S50) is a step of separating the support ring 300 to which the plurality of probe needles 400 are fixed from the fixing jig 100, as shown in FIG. , and at this time, one end of the probe needle 400 is separated from the coordinate film 200.

On the other hand, when using the support ring 300 in which the seating groove 310 is recessed deeper than the height of the plurality of adhesive layers, it is necessary to close the remaining space of the seating groove 310 that is not filled by the plurality of adhesive layers. , may further include a finishing step (70).

The finishing step (70) is performed after the probe needle fixing step (S50), and is performed after the separation step (S60) as shown in FIG. 8, or before the separation step (S60) as shown in FIG. 9. It can proceed. For example, in the finishing step (S70), the remaining space of the seating groove 310 is placed on the upper side of the plurality of adhesive layers using a finishing agent (20) with a weaker strength than the adhesive (10) used in the probe needle fixing step (S50) during curing. can be filled.

As described above, the method of manufacturing the probe card according to the present invention involves temporarily fixing the support ring 300 to the upper surface of the fixing jig 100 and using the seating groove 310 formed on the support ring 300 to form a plurality of By fixing the probe needle 400, there is no need to go through adhesive application and drying processes to attach the support ring 300 as in the past, so the overall process time can be shortened. In addition, since the adhesive is applied and dried while the plurality of probe needles 400 are placed in the seating groove 310, it is possible to effectively prevent the probe needles 400 from being misaligned due to thermal deformation occurring during the drying process. there is.

10: Adhesive 20: Finishing agent
100: Fixed jig 110: Work groove
111: Needle fitting groove 120: Ring fixing groove
200: Coordinate film
300: Support ring 310: Seating groove
400: probe needle

Claims (5)

A film setting step (S30) of attaching a coordinate film 200 having a plurality of through holes formed in a work groove 110 formed in the center of the upper surface of the plate-shaped fixing jig 100;
The support ring 300, which has a width larger than the working groove 110 and is in the form of a ring with at least two seating grooves 310 recessed from the upper surface, is provided with a fixing jig (100) so that the center is located at the center of the working groove 110. ) Temporarily fixing the support ring on the upper surface (S40);
After forming a needle group by arranging a plurality of probe needles 400 so that a portion is placed in the seating groove 310, one end is inserted into the through hole, and the other end is located outside the fixing jig 100, the adhesive (10 ) is applied and cured to form an adhesive layer to secure the plurality of probe needles 400 to the support ring 300 (S50); and
A separation step (S60) of separating the support ring 300 to which the plurality of probe needles 400 are fixed from the fixing jig 100;
A method of manufacturing a probe card comprising: The method of claim 1, wherein the probe needle fixing step (S50),
A needle bath forming step (S51) of forming a one-layer needle bath by arranging the plurality of probe needles 400;
An adhesive application step (S52) of applying adhesive 10 to at least the portion placed in the seating groove 310 among the plurality of probe needles 400 constituting the one-layer needle tank;
It includes a curing step (S53) of curing the adhesive 10 to fix one layer of needle bath to the support ring 300,
A method of manufacturing a probe card, characterized in that the needle bath forming step (S51), the adhesive application step (S52), and the curing step (S53) are repeated multiple times to fix the multi-layer needle bath to the support ring 300. . According to paragraph 2,
The adhesive 10 in the adhesive application step (S52) is a one-component epoxy resin,
The curing step (S53) is a method of manufacturing a probe card, characterized in that the adhesive 10 is cured in an oven at 125°C. According to paragraph 2,
Through the adhesive application step (S52) and curing step (S53), which are repeated multiple times, a plurality of adhesive layers are formed by stacking,
In the first adhesive application step (S52-1), the adhesive 10 is applied to the area of the probe needle 400 placed in the seating groove 310 to form a first adhesive layer,
The adhesive application step (S52-n, a natural number with n>1) after the first adhesive application step (S52-1) is performed on the inside from the seating groove 310 along with the probe needle 400 portion placed in the seating groove 310. A method of manufacturing a probe card, characterized in that forming an nth adhesive layer (n is a natural number greater than 1) by applying an adhesive 10 to include a portion of the probe needle 400 protruding. According to clause 4,
Before the support ring temporary fixing step (S40), the support is formed with a seating groove 310 deeper than the height of the plurality of adhesive layers to be formed through the adhesive application step (S52) and curing step (S53), which are repeated multiple times. It further includes a support ring preparation step (S10) for manufacturing the ring 300,
After the probe needle fixing step (S50), a finishing step (S70) of filling the remaining space of the seating groove 310 with the upper side of the plurality of adhesive layers using a finishing agent (20) whose strength is weaker than that of the adhesive (10) when cured; A method of manufacturing a probe card further comprising:

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