KR102573784B1 - 알루미늄합금-수지 복합체 및 그 제조방법 - Google Patents
알루미늄합금-수지 복합체 및 그 제조방법 Download PDFInfo
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- KR102573784B1 KR102573784B1 KR1020160018962A KR20160018962A KR102573784B1 KR 102573784 B1 KR102573784 B1 KR 102573784B1 KR 1020160018962 A KR1020160018962 A KR 1020160018962A KR 20160018962 A KR20160018962 A KR 20160018962A KR 102573784 B1 KR102573784 B1 KR 102573784B1
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- South Korea
- Prior art keywords
- triazine
- dithiol
- aluminum alloy
- monosodium
- adhesive layer
- Prior art date
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 70
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 239000000805 composite resin Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000004411 aluminium Substances 0.000 title 1
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 147
- 239000012790 adhesive layer Substances 0.000 claims abstract description 74
- -1 triazine thiol Chemical class 0.000 claims abstract description 67
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims abstract description 29
- 229910001593 boehmite Inorganic materials 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 48
- 239000007864 aqueous solution Substances 0.000 claims description 37
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims description 20
- WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical group S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 14
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 10
- 239000004954 Polyphthalamide Substances 0.000 claims description 10
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 10
- 229920006375 polyphtalamide Polymers 0.000 claims description 10
- FDQMTAGXHQQJJR-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1.OCCN(CCO)CCO FDQMTAGXHQQJJR-UHFFFAOYSA-N 0.000 claims description 8
- IXDGHAZCSMVIFX-UHFFFAOYSA-N 6-(dibutylamino)-1h-1,3,5-triazine-2,4-dithione Chemical compound CCCCN(CCCC)C1=NC(=S)NC(=S)N1 IXDGHAZCSMVIFX-UHFFFAOYSA-N 0.000 claims description 8
- MFQQOAQJUKMXAR-UHFFFAOYSA-N 6-(dibutylamino)-1h-1,3,5-triazine-2,4-dithione;sodium Chemical compound [Na].CCCCN(CCCC)C1=NC(=S)NC(=S)N1 MFQQOAQJUKMXAR-UHFFFAOYSA-N 0.000 claims description 8
- QREYIRLPVTXGHD-UHFFFAOYSA-N 6-(dibutylamino)-1h-1,3,5-triazine-2,4-dithione;tetrabutylazanium Chemical compound CCCCN(CCCC)C1=NC(=S)NC(=S)N1.CCCC[N+](CCCC)(CCCC)CCCC QREYIRLPVTXGHD-UHFFFAOYSA-N 0.000 claims description 8
- MHYXZOVTQGTECQ-UHFFFAOYSA-N 6-(octadecylamino)-1h-1,3,5-triazine-2,4-dithione Chemical compound CCCCCCCCCCCCCCCCCCNC1=NC(=S)NC(=S)N1 MHYXZOVTQGTECQ-UHFFFAOYSA-N 0.000 claims description 8
- ITXIFBLXMUEAKD-UHFFFAOYSA-N 6-(octadecylamino)-1h-1,3,5-triazine-2,4-dithione;potassium Chemical compound [K].CCCCCCCCCCCCCCCCCCNC1=NC(=S)NC(=S)N1 ITXIFBLXMUEAKD-UHFFFAOYSA-N 0.000 claims description 8
- MLZQBMZXBHDWJM-UHFFFAOYSA-N 6-anilino-1h-1,3,5-triazine-2,4-dithione Chemical compound N1C(=S)NC(=S)N=C1NC1=CC=CC=C1 MLZQBMZXBHDWJM-UHFFFAOYSA-N 0.000 claims description 8
- NBQIKAOXYCPYQX-UHFFFAOYSA-N 6-(didodecylamino)-1h-1,3,5-triazine-2,4-dithione Chemical compound CCCCCCCCCCCCN(CCCCCCCCCCCC)C1=NC(S)=NC(S)=N1 NBQIKAOXYCPYQX-UHFFFAOYSA-N 0.000 claims description 7
- PQUZZBINWOMZRK-UHFFFAOYSA-N [Na].CCCCCCCCCCCCN(CCCCCCCCCCCC)c1nc(S)nc(S)n1 Chemical compound [Na].CCCCCCCCCCCCN(CCCCCCCCCCCC)c1nc(S)nc(S)n1 PQUZZBINWOMZRK-UHFFFAOYSA-N 0.000 claims description 7
- VVDUGVQZSWCCKM-KTKRTIGZSA-N 6-[[(z)-octadec-9-enyl]amino]-1h-1,3,5-triazine-2,4-dithione Chemical compound CCCCCCCC\C=C/CCCCCCCCNC1=NC(S)=NC(S)=N1 VVDUGVQZSWCCKM-KTKRTIGZSA-N 0.000 claims description 6
- GQZAUMWATBTBLZ-KVVVOXFISA-N 6-[[(z)-octadec-9-enyl]amino]-1h-1,3,5-triazine-2,4-dithione;potassium Chemical compound [K].CCCCCCCC\C=C/CCCCCCCCNC1=NC(=S)NC(=S)N1 GQZAUMWATBTBLZ-KVVVOXFISA-N 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims 2
- 238000012360 testing method Methods 0.000 description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 239000000463 material Substances 0.000 description 16
- 239000000243 solution Substances 0.000 description 15
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 12
- 229910017604 nitric acid Inorganic materials 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005238 degreasing Methods 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000004381 surface treatment Methods 0.000 description 10
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000013527 degreasing agent Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- GIWYLXXUOJRNAJ-UHFFFAOYSA-N sodium;1,3,5-triazinane-2,4,6-trithione Chemical compound [Na].SC1=NC(S)=NC(S)=N1 GIWYLXXUOJRNAJ-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000005037 alkyl phenyl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004512 die casting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000003884 phenylalkyl group Chemical group 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000011260 aqueous acid Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 150000003573 thiols Chemical group 0.000 description 2
- KGMITOHCGDTWGV-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1.O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 KGMITOHCGDTWGV-UHFFFAOYSA-N 0.000 description 1
- QQLZTRHXUSFZOM-UHFFFAOYSA-N 6-amino-1h-1,3,5-triazine-2,4-dithione Chemical compound NC1=NC(=S)NC(=S)N1 QQLZTRHXUSFZOM-UHFFFAOYSA-N 0.000 description 1
- AMSNVAKJNUORGR-UHFFFAOYSA-N 6-amino-1h-1,3,5-triazine-2,4-dithione;sodium Chemical compound [Na].NC1=NC(=S)NC(=S)N1 AMSNVAKJNUORGR-UHFFFAOYSA-N 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- 229910017089 AlO(OH) Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- JGDITNMASUZKPW-UHFFFAOYSA-K aluminium trichloride hexahydrate Chemical compound O.O.O.O.O.O.Cl[Al](Cl)Cl JGDITNMASUZKPW-UHFFFAOYSA-K 0.000 description 1
- 229940009861 aluminum chloride hexahydrate Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
도 2는 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체가 적용된 전자제품의 다른 일 예를 도시한 도면
도 3은 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체를 형성하는 과정을 개략적으로 도시한 도면
도 4는 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 제조방법을 도시한 블록도
도 5는 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 인장강도를 보여주는 표
도 6은 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 접착층을 나타내는 SEM사진
도 7은 도 5의 제 1비교예의 접착층을 나타내는 SEM사진
도 8은 도 5의 제 3비교예의 접착층을 나타내는 SEM사진
도 9는 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 접착층 생성 온도 내지 시간에 따른 인장강도를 보여주는 표
도 10은 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 방수성능을 보여주는 표
도 11은 본 발명의 일 실시예에 따른 알루미늄합금-수지 복합체의 결합강도를 측정하기 위한 테스트용 알루미늄합금-수지 복합체를 도시한 도면
10: 알루미늄합금 20: 수지
30: 접착층 31: 보헤마이트 피막
32: 트리아진 티올계 유도체 100: 휴대전화
200: 디스플레이장치
Claims (15)
- 알루미늄합금;
보헤마이트 피막 및 트리아진 티올계 유도체의 화학적 결합에 의해 상기 알루미늄합금 표면의 적어도 일부에 형성되는 접착층; 및
상기 접착층과 화학적으로 결합하에 접착되는 수지;를 포함하고,
상기 접착층은 상기 알루미늄합금 표면의 적어도 일부에 상기 보헤마이트 피막이 형성됨과 동시에 상기 보헤마이트 피막 및 상기 트리아진 티올계 유도체의 결합에 의해 형성되고,
상기 트리아진 티올계 유도체는 1,3,5-triazine-2,4,6-trithiol(TT, 1,3,5-트리아진-2,4,6-트리티올), 1,3,5-triazine-2,4,6-trithiol triethanolamine(F-TEA, 1,3,5-트리아진-2,4,6-트리티올 트리에탄올아민), 6-anilino-1,3,5-triazine-2,4-dithiol(AF, 6-아닐리노-1,3,5-트리아진-2,4-디티올), 6-anylino-1,3,5-triazine-2,4-dithiol monosodium(AFN, -아닐리노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-dibutylamino-1,3,5-triazine-2,4-dithiol(DB, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올), 6-dibutylamino-1,3,5-triazine-2,4-dithiol monosodium(DBN, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-diallylamino-1,3,5-triazine-2,4-dithiol(DA, 6-디알릴아미노-1,3,5-트리아진-2,4-디티올), 6-diallylamino-1,3,5-triazine-2,4-dithiol monosodium(DAN, 6-디알릴아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 1,3,5-triazine-2,4,6-trithiol di(tetrabutylammonium salt)(F2A, 1,3,5-트리아진-2,4,6-트리티올 디(테트라부틸암모늄 염)), 6-dibutylamino-1,3,5-triazine-2,4-dithiol tetrabutylammonium salt(DBA, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올 테트라부틸암모늄염), 6-dithioctylamino-1,3,5-triazine-2,4-dithiol(DO, 6-디티옥틸아미노-1,3,5-트리아진-2,4-디티올), 6-dithioctylamino-1,3,5-triazine-2,4-dithiol monosodium(DON, 6-디티옥틸아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-dilaurylamino-1,3,5-triazine-2,4-dithiol(DL, 6-디라우릴아미노-1,3,5-트리아진-2,4-디티올), 6-dilaurylamino-1,3,5-triazine-2,4-dithiol monosodium(DLN, 6-디라우릴아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-stearylamino-1,3,5-triazine-2,4-dithiol(ST, 6-스테아릴아미노-1,3,5-트리아진-2,4-디티올), 6-stearylamino-1,3,5-triazine-2,4-dithiol monopotassium(STK, 6-스테아릴아미노-1,3,5-트리아진-2,4-디티올 모노칼륨), 6-oleilamino-1,3,5-triazine-2,4-dithiol(DL, 6-올레일아미노-1,3,5-트리아진-2,4-디티올) 및 6-oleilamino-1,3,5-triazine-2,4-dithiol monopotassium(OLK, 6-올레일아미노-1,3,5-트리아진-2,4-디티올 모노칼륨) 중에서 선택된 적어도 하나를 포함하는 알루미늄합금-수지 복합체. - 삭제
- 삭제
- 삭제
- 제 1 항에 있어서,
상기 접착층은 무전해 공정 하에서 형성되는 알루미늄합금-수지 복합체. - 제 1 항에 있어서,
상기 접착층은 60℃이상 100℃이하의 온도에서 형성되는 알루미늄합금-수지 복합체. - 제 1 항에 있어서,
상기 접착층은 상기 알루미늄합금을 상기 트리아진 티올계 유도체가 함유된 수용액에 30초이상 1200초이하 침지시키면 형성되는 알루미늄합금-수지 복합체. - 제 1 항에 있어서,
상기 수지는 열가소성 수지를 포함하는 알루미늄합금-수지 복합체. - 제 8 항에 있어서,
상기 열가소성 수지는 폴리부틸렌 테레프탈레이트(PBT), 폴리프탈아미드(PPA), 폴리페닐렌 설파이드(PPS), 아크릴로니트릴-부타디엔-스티렌(ABS) 및 폴리카보네이트(PC) 중에서 선택된 적어도 하나를 포함하는 알루미늄합금-수지 복합체. - 알루미늄합금을 트리아진 티올계 유도체가 함유된 수용액에 침지시켜 상기 알루미늄합금 표면의 적어도 일부에 접착층을 형성하고,
상기 접착층에 열가소성 수지를 사출 성형하여 알루미늄합금-수지 복합체를 형성하는 것을 포함하고,
상기 접착층은 상기 알루미늄합금 표면의 적어도 일부에 보헤마이트 피막이 형성됨과 동시에 상기 보헤마이트 피막 및 상기 트리아진 티올계 유도체의 화학적 결합에 의해 형성되고,
상기 트리아진 티올계 유도체는 1,3,5-triazine-2,4,6-trithiol(TT, 1,3,5-트리아진-2,4,6-트리티올), 1,3,5-triazine-2,4,6-trithiol triethanolamine(F-TEA, 1,3,5-트리아진-2,4,6-트리티올 트리에탄올아민), 6-anilino-1,3,5-triazine-2,4-dithiol(AF, 6-아닐리노-1,3,5-트리아진-2,4-디티올), 6-anylino-1,3,5-triazine-2,4-dithiol monosodium(AFN, -아닐리노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-dibutylamino-1,3,5-triazine-2,4-dithiol(DB, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올), 6-dibutylamino-1,3,5-triazine-2,4-dithiol monosodium(DBN, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-diallylamino-1,3,5-triazine-2,4-dithiol(DA, 6-디알릴아미노-1,3,5-트리아진-2,4-디티올), 6-diallylamino-1,3,5-triazine-2,4-dithiol monosodium(DAN, 6-디알릴아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 1,3,5-triazine-2,4,6-trithiol di(tetrabutylammonium salt)(F2A, 1,3,5-트리아진-2,4,6-트리티올 디(테트라부틸암모늄 염)), 6-dibutylamino-1,3,5-triazine-2,4-dithiol tetrabutylammonium salt(DBA, 6-디부틸아미노-1,3,5-트리아진-2,4-디티올 테트라부틸암모늄염), 6-dithioctylamino-1,3,5-triazine-2,4-dithiol(DO, 6-디티옥틸아미노-1,3,5-트리아진-2,4-디티올), 6-dithioctylamino-1,3,5-triazine-2,4-dithiol monosodium(DON, 6-디티옥틸아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-dilaurylamino-1,3,5-triazine-2,4-dithiol(DL, 6-디라우릴아미노-1,3,5-트리아진-2,4-디티올), 6-dilaurylamino-1,3,5-triazine-2,4-dithiol monosodium(DLN, 6-디라우릴아미노-1,3,5-트리아진-2,4-디티올 모노나트륨), 6-stearylamino-1,3,5-triazine-2,4-dithiol(ST, 6-스테아릴아미노-1,3,5-트리아진-2,4-디티올), 6-stearylamino-1,3,5-triazine-2,4-dithiol monopotassium(STK, 6-스테아릴아미노-1,3,5-트리아진-2,4-디티올 모노칼륨), 6-oleilamino-1,3,5-triazine-2,4-dithiol(DL, 6-올레일아미노-1,3,5-트리아진-2,4-디티올) 및 6-oleilamino-1,3,5-triazine-2,4-dithiol monopotassium(OLK, 6-올레일아미노-1,3,5-트리아진-2,4-디티올 모노칼륨) 중에서 선택된 적어도 하나를 포함하고,
상기 접착층은 무전해 공정 하에서 형성되는 알루미늄합금-수지 복합체의 제조방법. - 삭제
- 삭제
- 제 10 항에 있어서,
상기 접착층은 60℃이상 100℃이하의 온도에서 형성되는 알루미늄합금-수지 복합체의 제조방법. - 제 10 항에 있어서,
상기 접착층은 상기 알루미늄합금을 상기 트리아진 티올계 유도체가 함유된 수용액에 30초이상 1200초이하 침지시키면 형성되는 알루미늄합금-수지 복합체의 제조방법. - 제 10 항에 있어서,
상기 열가소성 수지는 폴리부틸렌 테레프탈레이트(PBT), 폴리프탈아미드(PPA), 폴리페닐렌 설파이드(PPS), 아크릴로니트릴-부타디엔-스티렌(ABS) 및 폴리카보네이트(PC) 중에서 선택된 적어도 하나를 포함하는 알루미늄합금-수지 복합체의 제조방법.
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