KR102573493B1 - Kit for coating on a metal substrate and coated metal product - Google Patents
Kit for coating on a metal substrate and coated metal product Download PDFInfo
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- KR102573493B1 KR102573493B1 KR1020230035912A KR20230035912A KR102573493B1 KR 102573493 B1 KR102573493 B1 KR 102573493B1 KR 1020230035912 A KR1020230035912 A KR 1020230035912A KR 20230035912 A KR20230035912 A KR 20230035912A KR 102573493 B1 KR102573493 B1 KR 102573493B1
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- South Korea
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 title claims abstract description 60
- 239000011248 coating agent Substances 0.000 title claims abstract description 53
- 238000000576 coating method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 111
- 229920005989 resin Polymers 0.000 claims abstract description 111
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 97
- 239000007769 metal material Substances 0.000 claims abstract description 65
- 239000003381 stabilizer Substances 0.000 claims abstract description 49
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 26
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011256 inorganic filler Substances 0.000 claims abstract description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 22
- 229920000642 polymer Polymers 0.000 claims abstract description 22
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 13
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012963 UV stabilizer Substances 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 11
- 239000004014 plasticizer Substances 0.000 claims abstract description 11
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000314 lubricant Substances 0.000 claims abstract description 10
- 239000012760 heat stabilizer Substances 0.000 claims abstract description 8
- 239000005453 ketone based solvent Substances 0.000 claims abstract description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims abstract description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims abstract description 5
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims abstract description 5
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 78
- -1 adipate compound Chemical class 0.000 claims description 45
- 238000001125 extrusion Methods 0.000 claims description 28
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- 229910019142 PO4 Inorganic materials 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000010452 phosphate Substances 0.000 claims description 15
- 239000011247 coating layer Substances 0.000 claims description 14
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 12
- 235000006708 antioxidants Nutrition 0.000 claims description 12
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 12
- 239000000194 fatty acid Substances 0.000 claims description 12
- 229930195729 fatty acid Natural products 0.000 claims description 12
- 239000011593 sulfur Substances 0.000 claims description 12
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- GVJHHUAWPYXKBD-UHFFFAOYSA-N d-alpha-tocopherol Natural products OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 150000004665 fatty acids Chemical class 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 7
- 150000007524 organic acids Chemical class 0.000 claims description 7
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 6
- HNURKXXMYARGAY-UHFFFAOYSA-N 2,6-Di-tert-butyl-4-hydroxymethylphenol Chemical compound CC(C)(C)C1=CC(CO)=CC(C(C)(C)C)=C1O HNURKXXMYARGAY-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- AUZONCFQVSMFAP-UHFFFAOYSA-N disulfiram Chemical compound CCN(CC)C(=S)SSC(=S)N(CC)CC AUZONCFQVSMFAP-UHFFFAOYSA-N 0.000 claims description 6
- 150000003673 urethanes Polymers 0.000 claims description 6
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical group C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 5
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 claims description 5
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical group COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 5
- MEBJLVMIIRFIJS-UHFFFAOYSA-N hexanedioic acid;propane-1,2-diol Chemical compound CC(O)CO.OC(=O)CCCCC(O)=O MEBJLVMIIRFIJS-UHFFFAOYSA-N 0.000 claims description 5
- 150000004679 hydroxides Chemical class 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- 150000001247 metal acetylides Chemical class 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 5
- 241000894007 species Species 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- OLAQBFHDYFMSAJ-UHFFFAOYSA-L 1,2-bis(7-methyloctyl)cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCC1(C([O-])=O)CCCCC1(CCCCCCC(C)C)C([O-])=O OLAQBFHDYFMSAJ-UHFFFAOYSA-L 0.000 claims description 4
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 claims description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- JTNKWPDPEXRFOV-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphate Chemical compound CC(C)CCCCCCCOP(=O)(OCCCCCCCC(C)C)OC1=CC=CC=C1 JTNKWPDPEXRFOV-UHFFFAOYSA-N 0.000 claims description 4
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 4
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims description 4
- 235000013539 calcium stearate Nutrition 0.000 claims description 4
- 239000008116 calcium stearate Substances 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- OEIWPNWSDYFMIL-UHFFFAOYSA-N dioctyl benzene-1,4-dicarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C=C1 OEIWPNWSDYFMIL-UHFFFAOYSA-N 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- 229920005792 styrene-acrylic resin Polymers 0.000 claims description 4
- 150000003440 styrenes Chemical class 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- LFMQNMXVVXHZCC-UHFFFAOYSA-N 1,3-benzothiazol-2-yl n,n-diethylcarbamodithioate Chemical compound C1=CC=C2SC(SC(=S)N(CC)CC)=NC2=C1 LFMQNMXVVXHZCC-UHFFFAOYSA-N 0.000 claims description 3
- MQQKTNDBASEZSD-UHFFFAOYSA-N 1-(octadecyldisulfanyl)octadecane Chemical compound CCCCCCCCCCCCCCCCCCSSCCCCCCCCCCCCCCCCCC MQQKTNDBASEZSD-UHFFFAOYSA-N 0.000 claims description 3
- PFEFOYRSMXVNEL-UHFFFAOYSA-N 2,4,6-tritert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 PFEFOYRSMXVNEL-UHFFFAOYSA-N 0.000 claims description 3
- LKALLEFLBKHPTQ-UHFFFAOYSA-N 2,6-bis[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound OC=1C(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=CC(C)=CC=1CC1=CC(C)=CC(C(C)(C)C)=C1O LKALLEFLBKHPTQ-UHFFFAOYSA-N 0.000 claims description 3
- GSOYMOAPJZYXTB-UHFFFAOYSA-N 2,6-ditert-butyl-4-(3,5-ditert-butyl-4-hydroxyphenyl)phenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 GSOYMOAPJZYXTB-UHFFFAOYSA-N 0.000 claims description 3
- PHXLONCQBNATSL-UHFFFAOYSA-N 2-[[2-hydroxy-5-methyl-3-(1-methylcyclohexyl)phenyl]methyl]-4-methyl-6-(1-methylcyclohexyl)phenol Chemical compound OC=1C(C2(C)CCCCC2)=CC(C)=CC=1CC(C=1O)=CC(C)=CC=1C1(C)CCCCC1 PHXLONCQBNATSL-UHFFFAOYSA-N 0.000 claims description 3
- AKNMPWVTPUHKCG-UHFFFAOYSA-N 2-cyclohexyl-6-[(3-cyclohexyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound OC=1C(C2CCCCC2)=CC(C)=CC=1CC(C=1O)=CC(C)=CC=1C1CCCCC1 AKNMPWVTPUHKCG-UHFFFAOYSA-N 0.000 claims description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims description 3
- OCOUEOCPTQPXHR-UHFFFAOYSA-N 2-tert-butyl-4,6-dimethoxyphenol Chemical compound COC1=CC(OC)=C(O)C(C(C)(C)C)=C1 OCOUEOCPTQPXHR-UHFFFAOYSA-N 0.000 claims description 3
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 claims description 3
- BGWNOSDEHSHFFI-UHFFFAOYSA-N 2-tert-butyl-4-[(3-tert-butyl-4-hydroxy-5-methylphenyl)methylsulfanylmethyl]-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CSCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 BGWNOSDEHSHFFI-UHFFFAOYSA-N 0.000 claims description 3
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 claims description 3
- MQWCQFCZUNBTCM-UHFFFAOYSA-N 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylphenyl)sulfanyl-4-methylphenol Chemical compound CC(C)(C)C1=CC(C)=CC(SC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O MQWCQFCZUNBTCM-UHFFFAOYSA-N 0.000 claims description 3
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 claims description 3
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 claims description 3
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 claims description 3
- QEGAVCABINQYQC-UHFFFAOYSA-N 4-[6-benzyl-3,5-bis(3,5-ditert-butyl-4-hydroxyphenyl)-2,4,6-trimethylcyclohexa-2,4-dien-1-yl]-2,6-ditert-butylphenol Chemical compound C=1C=CC=CC=1CC1(C)C(C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 QEGAVCABINQYQC-UHFFFAOYSA-N 0.000 claims description 3
- RYUJRXVZSJCHDZ-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC(C)C)OC1=CC=CC=C1 RYUJRXVZSJCHDZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 3
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003508 Dilauryl thiodipropionate Substances 0.000 claims description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- FCSHMCFRCYZTRQ-UHFFFAOYSA-N N,N'-diphenylthiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=CC=CC=C1 FCSHMCFRCYZTRQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000007983 Tris buffer Substances 0.000 claims description 3
- 229930003427 Vitamin E Natural products 0.000 claims description 3
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 3
- 239000000440 bentonite Substances 0.000 claims description 3
- 229910000278 bentonite Inorganic materials 0.000 claims description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000378 calcium silicate Substances 0.000 claims description 3
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 3
- QAZYYQMPRQKMAC-FDGPNNRMSA-L calcium;(z)-4-oxopent-2-en-2-olate Chemical compound [Ca+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O QAZYYQMPRQKMAC-FDGPNNRMSA-L 0.000 claims description 3
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 3
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 3
- 150000003946 cyclohexylamines Chemical class 0.000 claims description 3
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- GIRSHSVIZQASRJ-UHFFFAOYSA-N ethyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCC GIRSHSVIZQASRJ-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
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- 238000000691 measurement method Methods 0.000 description 1
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- GSJFXBNYJCXDGI-UHFFFAOYSA-N methyl 2-hydroxyacetate Chemical compound COC(=O)CO GSJFXBNYJCXDGI-UHFFFAOYSA-N 0.000 description 1
- VBCSBEIIIFLVQV-UHFFFAOYSA-N methyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OC VBCSBEIIIFLVQV-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
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- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
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- 230000000379 polymerizing effect Effects 0.000 description 1
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
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- 235000019260 propionic acid Nutrition 0.000 description 1
- HNYIJJOTPSKGJM-UHFFFAOYSA-N propoxymethyl acetate Chemical compound CCCOCOC(C)=O HNYIJJOTPSKGJM-UHFFFAOYSA-N 0.000 description 1
- LVDAGIFABMFXSJ-UHFFFAOYSA-N propyl 2-butoxyacetate Chemical compound CCCCOCC(=O)OCCC LVDAGIFABMFXSJ-UHFFFAOYSA-N 0.000 description 1
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- BMVTVMIDGMNRRR-UHFFFAOYSA-N propyl 2-propoxyacetate Chemical compound CCCOCC(=O)OCCC BMVTVMIDGMNRRR-UHFFFAOYSA-N 0.000 description 1
- HJIYVZIALQOKQI-UHFFFAOYSA-N propyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCCC HJIYVZIALQOKQI-UHFFFAOYSA-N 0.000 description 1
- KNCDNPMGXGIVOM-UHFFFAOYSA-N propyl 3-hydroxypropanoate Chemical compound CCCOC(=O)CCO KNCDNPMGXGIVOM-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical class OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000001911 terphenyls Chemical class 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- NRINZBKAERVHFW-UHFFFAOYSA-L zinc;dicarbamate Chemical compound [Zn+2].NC([O-])=O.NC([O-])=O NRINZBKAERVHFW-UHFFFAOYSA-L 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D143/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Coating compositions based on derivatives of such polymers
- C09D143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/08—Copolymers of styrene
- C09D125/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/04—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09D127/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Paints Or Removers (AREA)
Abstract
본 발명은, 금속재 코팅 키트 및 금속 제품에 관한 것으로, 보다 구체적으로 변성 아크릴계 수지; 메틸벤젠; 2-부탄온, 아세톤, 메틸아밀케톤, 메틸이소부틸케톤 및 시클로헥사논 중 적어도 하나 이상의 케톤계 용제; 및 메탄올;을 포함하는 제1 제; PVC를 포함하는 제1 고분자, 아디페이트(Adipate)계 화합물을 포함하는 제2 고분자, 가소제, 안정제, 내열 안정제, 산화방지제, UV 안정제, 무기충전제 및 활제를 포함하는 제2 제; 및 아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체를 포함하는 수지 코팅제; 를 포함하는, 금속재 코팅 키트 및 이를 이용하여 제조된 금속 제품에 관한 것이다. The present invention relates to a metal material coating kit and a metal product, and more specifically to a modified acrylic resin; methylbenzene; at least one ketone-based solvent selected from 2-butanone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; and methanol; a first agent comprising; A first polymer containing PVC, a second polymer containing an adipate-based compound, a plasticizer, a stabilizer, a heat stabilizer, an antioxidant, a UV stabilizer, an inorganic filler, and a lubricant containing a second agent; and a resin coating agent comprising an acrylate compound-styrene-acrylonitrile copolymer; It relates to a metal material coating kit comprising a and a metal product manufactured using the same.
Description
본 발명은, 금속재 코팅 키트 및 금속 제품에 관한 것이다.The present invention relates to a metal material coating kit and a metal product.
아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체(acrylatestyrene-acrylonitrile; 이하, 'ASA 수지'라 함)는 산업계에서 많이 사용하는 스티렌계 삼원공중합체 수지이다. ASA 수지는 부타디엔 고무 대신에 에틸렌계 불포화기가 존재하지 않는 아크릴 고무를 포함하여 기계적 물성이 우수하고, 내후성, 내노화성, 내화학성, 강성, 내충격성 및 가공성을 두루 갖추고 있다. ASA 수지는 용도가 다양하여 자동차, 잡화, 전기/전자 부품, 건축자재, 자동차 내외장재, 선박 내외장재, 레져 용품, 원예용 물품 등에서 광범위하게 사용되고 있다. An acrylate compound-styrene-acrylonitrile copolymer (hereinafter referred to as 'ASA resin') is a styrene-based terpolymer resin widely used in the industry. ASA resin has excellent mechanical properties, including acrylic rubber with no ethylenically unsaturated group instead of butadiene rubber, and has weather resistance, aging resistance, chemical resistance, stiffness, impact resistance, and processability. ASA resin has various uses and is widely used in automobiles, miscellaneous goods, electrical/electronic parts, building materials, automobile interior and exterior materials, ship interior and exterior materials, leisure products, and gardening products.
그러나, ASA 수지는 다양한 용제 또는 화학 물질(chemicals)에 노출되는 경우 크랙이나 변색이 발생하고 물성이 저하되는 단점이 있고, 피복 과정에서 기재와 접착층이 낮아 스틸/플라스틱 공압출 용도로 사용하는데 어려움이 있다. 특히 ASA 수지로 금속관에 이중 압출을 하면 금속관과 ASA 수지가 붙지 않는 경우가 발생하고, 어느 정도의 기간이 지나면 ASA 수지의 깨짐 현상 또는 박리 현상이 발생한다. 이는 최종 제품의 크기가 커질수록 깨짐 현상이 심하게 발생할 수 있다. However, ASA resin has the disadvantage of cracking or discoloration and deterioration of physical properties when exposed to various solvents or chemicals, and it is difficult to use for steel/plastic co-extrusion applications due to the low adhesive layer between the substrate and the coating process. there is. In particular, when the metal tube is double-extruded with the ASA resin, the metal tube and the ASA resin may not adhere to each other, and after a certain period of time, the ASA resin cracks or peels off. As the size of the final product increases, the cracking phenomenon may occur severely.
이에 금속관 상에 ASA 수지의 피복시 금속관과 ASA 수지의 접착력을 개선시켜 공압출 공정이 가능하고, ASA 수지 피복의 안정성을 개선시킬 수 있는 피복 공정 및 재료의 개발이 필요하다. Therefore, it is necessary to develop a coating process and material capable of improving the adhesion between the metal tube and the ASA resin to enable a co-extrusion process and improving the stability of the ASA resin coating when the ASA resin is coated on the metal tube.
본 발명의 목적은 상기한 기술적 과제에 부응하기 위한 것으로서, 제2 제와 금속재 간의 우수한 접착 성능을 제공하고, 열에 안정적인 제1 제, 수지 피막의 수지(예: ASA 수지)와 상용성이 우수하고, 고내열성 특성이 우수한 열가소성 탄성체인 제2 제 및 금속재 상에 수지 피막을 위한 수지 코팅제를 포함하고, 공압출 공정이 가능한 금속재 코팅 키트를 제공하는 데 있다.An object of the present invention is to meet the above technical problems, to provide excellent adhesion performance between the second agent and the metal material, and to provide excellent compatibility with the heat-stable first agent and the resin (eg ASA resin) of the resin coating, It is to provide a metal material coating kit including a resin coating agent for a resin film on a metal material and a second agent, which is a thermoplastic elastomer having excellent high heat resistance characteristics, and capable of a co-extrusion process.
본 발명의 다른 목적은, 금속재 코팅 키트로 코팅되고, 공압출 공정에 의한 수지 피막의 균일한 막 형성, 및 접착성 및 열 안정성이 향상된 금속 제품을 제공하는 데 있다. Another object of the present invention is to provide a metal product coated with a metal material coating kit, uniform film formation of a resin film by a co-extrusion process, and improved adhesion and thermal stability.
상기한 목적을 달성하기 위한 수단으로서 본 발명의 금속재 코팅 키트는, 변성 아크릴계 수지; 메틸벤젠; 2-부탄온, 아세톤, 메틸아밀케톤, 메틸이소부틸케톤 및 시클로헥사논 중 적어도 하나 이상의 케톤계 용제; 및 메탄올을 포함하는 제1 제; PVC를 포함하는 제1 고분자, 아디페이트(Adipate)계 화합물을 포함하는 제2 고분자, 가소제, 안정제, 내열 안정제, 산화방지제, UV 안정제, 무기충전제 및 활제를 포함하는 제2 제; 및 아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체를 포함하는 수지 코팅제;를 포함할 수 있다. As a means for achieving the above object, the metal material coating kit of the present invention includes a modified acrylic resin; methylbenzene; at least one ketone-based solvent selected from 2-butanone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; and a first agent comprising methanol; A first polymer containing PVC, a second polymer containing an adipate-based compound, a plasticizer, a stabilizer, a heat stabilizer, an antioxidant, a UV stabilizer, an inorganic filler, and a lubricant containing a second agent; and a resin coating agent including an acrylate compound-styrene-acrylonitrile copolymer.
본 발명의 구성은, 상기 제1 제는 변성 아크릴계 수지 1 중량% 내지 20 중량%, 메틸벤젠 10 중량% 내지 40 중량%, 케톤계 용제 10 중량% 내지 30 중량%; 및 메탄올 10 중량% 내지 40 중량%를 포함하고, 상기 메틸벤젠: 상기 케톤계 용제의 질량비는 1 : 1.5 내지 1 : 4인 것일 수 있다. The composition of the present invention, the first agent is a modified acrylic resin 1% to 20% by weight, methylbenzene 10% to 40% by weight, ketone solvent 10% to 30% by weight; and 10% to 40% by weight of methanol, and the methylbenzene:mass ratio of the ketone-based solvent may be 1:1.5 to 1:4.
본 발명의 구성은, 상기 변성 아크릴계 수지는 에폭시 변성 스티렌 아크릴 수지, 에폭시 변성 아크릴 수지, 폴리에스테르 변성 아크릴 수지, 실리콘 변성 아크릴 수지, 폴리카보네이트 변성 아크릴 수지 및 불소 변성 아크릴 수지로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것일 수 있다. In the configuration of the present invention, the modified acrylic resin is one selected from the group consisting of an epoxy-modified styrene acrylic resin, an epoxy-modified acrylic resin, a polyester-modified acrylic resin, a silicone-modified acrylic resin, a polycarbonate-modified acrylic resin, and a fluorine-modified acrylic resin Or it may be one containing two or more kinds.
본 발명의 구성은, 상기 제1 제는 폴리에스테르 변성 우레탄 수지, 아크릴 변성 우레탄 수지 또는 이 둘 모두를 0.1 중량% 내지 10 중량%로 더 포함하는 것일 수 있다. According to the configuration of the present invention, the first agent may further include 0.1% to 10% by weight of a polyester-modified urethane resin, an acrylic-modified urethane resin, or both.
본 발명의 구성은, 상기 변성 아크릴계 수지는 메틸메타크릴레이트, 하이드록실 에틸메타크릴레이트, 시크로헥실 메타크릴레이트 및 이소부틸 메타크릴레이트로 이루어진 군에서 선택된 1종 또는 2종 이상의 아크릴레이트 모노머를 포함하는 것일 수 있다. The configuration of the present invention, the modified acrylic resin is one or two or more acrylate monomers selected from the group consisting of methyl methacrylate, hydroxyl ethyl methacrylate, cyclohexyl methacrylate and isobutyl methacrylate may include
본 발명의 구성은, 상기 제2 제는 상기 PVC를 포함하는 제1 고분자 40 중량% 내지 70 중량%, 상기 제2 고분자 10 중량% 내지 30 중량%, 상기 가소제 1 중량% 내지 10 중량%. 상기 안정제 1 중량% 내지 10 중량%, 상기 내열 안정제 0.1 중량% 내지 5 중량%, 상기 산화방지제 0.01 중량% 내지 2 중량%, 상기 UV 안정제 0.01 중량% 내지 1 중량%, 상기 무기충전제 5 중량%내지 20 중량%, 및 상기 활제 0.01 중량% 내지 2 중량%를 포함하는 것일 수 있다. According to the configuration of the present invention, the second agent comprises 40% to 70% by weight of the first polymer including the PVC, 10% to 30% by weight of the second polymer, and 1% to 10% by weight of the plasticizer. 1% to 10% by weight of the stabilizer, 0.1% to 5% by weight of the heat-resistant stabilizer, 0.01% to 2% by weight of the antioxidant, 0.01% to 1% by weight of the UV stabilizer, 5% to 5% by weight of the inorganic filler 20% by weight, and 0.01% to 2% by weight of the lubricant may be included.
본 발명의 구성은, 상기 내열 안정제는 페놀계 내열 안정제, 황계 내열 안정제 및 인산염계 내열 안정제로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고, 상기 페놀계 내열 안정제는 2-tert-부틸-4-메톡시페놀, 2-tert-부틸-4,6-디메톡시페놀, 3,5-디-tert-부틸-4-하이드록시톨루엔, 4-하이드록시메틸-2,6-디-tert-부틸페놀, 2,4,6-트리-tert-부틸페놀, 2,2'-메틸렌-비스(4-에틸-6-tert-부틸페놀), 4,4'-부틸리덴-비스(6-tert-부틸-m-크레졸), 2,2'-메틸렌-비스(4-메틸-6-시클로헥실페놀), 4,4'-비스(2,6-디-tert-부틸페놀), 2,2'-디하이드록시-3,3'-비스(α-메틸시클로헥실)-5,5'-디메틸디페닐메탄, 4,4'-메틸렌-비스(2,6-디-tert-부틸페놀), d,l-α-토코페롤(비타민E), 2,6-비스(2-하이드록시-3-tert-부틸-5-메틸벤질)-4-메틸페놀, 3-(4-하이드록시-3,5-디-tert-부틸페닐)프로피온산 n-옥타데실, 1,3,5-트리스(4-tert-부틸-3-하이드록시-2,6-디메틸벤질)-s-트리아진-2,4,6-(1H, 3H,5H)-트리온, 1,3,5-트리메틸-2,4,6-트리스(3,5-디-tert-부틸-4-하이드록시페닐)벤질벤젠, 1,3,5-트리스(4-하이드록시-3,5-디-tert-부틸벤질)-s-트리아진-2,4,6-(1H,3H,5H)-트리온, 테트라키스[메틸렌-3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오네이트]메탄, 데카메틸렌카복실산디살리실로일하이드라지드, N,N'-비스[3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오닐]하이드라진, 2,2'-옥시아미드-비스-에틸-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 4,4'-티오비스(3-메틸-6-tert-부틸페놀), 2,2'-티오비스(4-메틸-6-tert-부틸페놀), 비스(3-메틸-4-하이드록시-5-tert-부틸벤질)설피드, 4,4'-부틸리덴-비스(2-메틸-4-하이드록시-5-tert-부틸페닐)-2-라우릴티오에테르, 6-(4-하이드록시-3,5-디-tert-부틸아닐리노)-2,4-비스(옥틸티오)-1,3,5-트리아진 및 2,4-비스(4-하이드록시-3,5-디-tert-부틸아닐리노)-6-(n-옥틸티오)-1,3,5-트리아진으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것일 수 있다. In the configuration of the present invention, the heat-resistant stabilizer includes one or two or more selected from the group consisting of a phenol-based heat-resistant stabilizer, a sulfur-based heat-resistant stabilizer, and a phosphate-based heat-resistant stabilizer, and the phenol-based heat-resistant stabilizer is 2-tert-butyl- 4-methoxyphenol, 2-tert-butyl-4,6-dimethoxyphenol, 3,5-di-tert-butyl-4-hydroxytoluene, 4-hydroxymethyl-2,6-di-tert- Butylphenol, 2,4,6-tri-tert-butylphenol, 2,2'-methylene-bis(4-ethyl-6-tert-butylphenol), 4,4'-butylidene-bis(6- tert-butyl-m-cresol), 2,2'-methylene-bis(4-methyl-6-cyclohexylphenol), 4,4'-bis(2,6-di-tert-butylphenol), 2, 2'-dihydroxy-3,3'-bis(α-methylcyclohexyl)-5,5'-dimethyldiphenylmethane, 4,4'-methylene-bis(2,6-di-tert-butylphenol ), d,l-α-tocopherol (vitamin E), 2,6-bis(2-hydroxy-3-tert-butyl-5-methylbenzyl)-4-methylphenol, 3-(4-hydroxy- 3,5-di-tert-butylphenyl)propionic acid n-octadecyl, 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-s-triazine-2 ,4,6-(1H,3H,5H)-trione, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxyphenyl)benzylbenzene , 1,3,5-tris(4-hydroxy-3,5-di-tert-butylbenzyl)-s-triazine-2,4,6-(1H,3H,5H)-trione, tetrakis [Methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane, decamethylenecarboxylic acid disalicyloylhydrazide, N,N'-bis[3-(3 ,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hydrazine, 2,2'-oxyamide-bis-ethyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl ) Propionate, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), bis(3-methyl -4-hydroxy-5-tert-butylbenzyl) sulfide, 4,4'-butylidene-bis(2-methyl-4-hydroxy-5-tert-butylphenyl)-2-laurylthioether , 6-(4-hydroxy-3,5-di-tert-butylanilino)-2,4-bis(octylthio)-1,3,5-triazine and 2,4-bis(4-hydride) It may contain one or two or more selected from the group consisting of oxy-3,5-di-tert-butylanilino)-6-(n-octylthio)-1,3,5-triazine.
본 발명의 구성은, 상기 페놀계 내열 안정제 대 상기 황계 내열 안정제의 질량비는 1 : 0.1 내지 1 : 1 이고, 상기 황계 내열 안정제는, 2-머캅토벤즈이미다졸, N,N'-디페닐티오우레아, 테트라메틸티우람디설피드, N-옥시디에틸렌-2-벤조티아졸릴설펜아미드, N-시클로헥실-2-벤조티아졸릴설펜아미드, 2-머캅토벤조티아졸의 시클로헥실아민염, N,N-디이소프로필-2-벤조티아졸설펜아미드, 2-(N,N-디에틸티오카바모일티오)벤조티아졸, 테트라에틸티우람디설피드, 디벤조티아질디설피드, 디에틸디티오카바민산아연, 에틸페닐디티오카바민산아연, 디-n-부틸디티오카바민산아연, 디라우릴티오디프로피오네이트, 디라우릴티오디-1,1'-메틸부티레이트, 디미리스틸-3,3'-티오디프로피오네이트, 라우릴스테아릴티오디프로피오네이트, 디스테아릴티오디프로피오네이트, 디스테아릴티오디부티레이트 및 디옥타데실디설피드로 이루어진 군에서 선택된 선택된 1종 또는 2종 이상을 포함하고, 상기 인산염계 내열 안정제는, 페닐디이소데실 인산염, 디페닐 이소데실 인산염, 트리페닐 인산염, 트리노닐 페닐 인산염, 칼슘 아세틸아세토네이트, 디옥틸틴 말레인산염 및 인산염으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. According to the configuration of the present invention, the mass ratio of the phenol-based heat-resistant stabilizer to the sulfur-based heat-resistant stabilizer is 1:0.1 to 1:1, and the sulfur-based heat-resistant stabilizer is 2-mercaptobenzimidazole, N,N'-diphenylthio Urea, tetramethylthiuram disulfide, N-oxydiethylene-2-benzothiazolyl sulfenamide, N-cyclohexyl-2-benzothiazolyl sulfenamide, cyclohexylamine salt of 2-mercaptobenzothiazole, N ,N-diisopropyl-2-benzothiazolesulfenamide, 2-(N,N-diethylthiocarbamoylthio)benzothiazole, tetraethylthiuramdisulfide, dibenzothiazyldisulfide, diethyldity Zinc carbamate, zinc ethylphenyldithiocarbamate, zinc di-n-butyldithiocarbamate, dilaurylthiodipropionate, dilaurylthiodi-1,1'-methylbutyrate, dimyristyl-3 One or two selected from the group consisting of 3'-thiodipropionate, laurylstearylthiodipropionate, distearylthiodipropionate, distearylthiodibutyrate and dioctadecyldisulfide Including the above, the phosphate-based heat stabilizer is 1 selected from the group consisting of phenyl diisodecyl phosphate, diphenyl isodecyl phosphate, triphenyl phosphate, trinonyl phenyl phosphate, calcium acetylacetonate, dioctyltin maleate and phosphate It may include a species or two or more species.
본 발명의 구성은, 상기 안정제는 칼슘 스테아레이트(calcium stearate), 리시놀레산 칼슘염(ricinoleic acid Calcium Salt), 징크 스테아레이트(zinc stearate) 및 리시놀레산 아연염(zinc ricinoleate)로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고, 상기 산화 방지제는 힌더드 페놀, 힌더드 아민 및 디페닐 디설파이드 로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고, 상기 활제는 염화파라핀, 왁스, 지방산 에스테르, 지방산 아마이드, 에틸렌 비스 스테아마이드 및 지방산 아마이드로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것일 수 있다. In the composition of the present invention, the stabilizer is in the group consisting of calcium stearate, ricinoleic acid calcium salt, zinc stearate and zinc ricinoleate The antioxidant includes one or two or more selected from the group consisting of hindered phenol, hindered amine, and diphenyl disulfide, and the lubricant includes chlorinated paraffin, wax, fatty acid It may include one or two or more selected from the group consisting of esters, fatty acid amides, ethylene bis steamides, and fatty acid amides.
본 발명의 구성은, 상기 무기충전제는 비즈, 플레이크, 필라멘트, 섬유, 판상 및 분말 중 적어도 하나 이상의 형상을 포함하고, 상기 무기충전제는 0.1 ㎛ 내지 50 ㎛의 평균 크기를 갖는 입자를 포함하고, 상기 무기충전제는 유기산으로 표면처리된 입자를 더 포함할 수 있다. According to the configuration of the present invention, the inorganic filler includes at least one shape of beads, flakes, filaments, fibers, plates, and powders, and the inorganic filler includes particles having an average size of 0.1 μm to 50 μm, and the The inorganic filler may further include particles surface-treated with an organic acid.
본 발명의 구성은, 상기 무기충전제는 스테인리스강, 실리콘 카바이드, 그래핀, 그라파이트, 탈타늄 카바이드, 질화알루미늄, 침강 탄산칼슘, 고령토, 규산알루미늄, 실리카, 알루미나, 이산화 티타늄, 새틴 화이트(satin white), 돌로마이트(dolomite), 운모(mica), 알루미늄 플레이크류, 벤토나이트(bentonite), 금홍석(rutile), 수산화 마그네슘, 석고, 판상 규산염류(sheet silicates), 탈크(talcum), 규산 칼슘; 및 티타늄, 지르코늄 또는 하프늄의 산화물, 질화물, 수산화물 및 카바이드; 로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것일 수 있다. In the configuration of the present invention, the inorganic filler is stainless steel, silicon carbide, graphene, graphite, tartanium carbide, aluminum nitride, precipitated calcium carbonate, kaolin, aluminum silicate, silica, alumina, titanium dioxide, satin white , dolomite, mica, aluminum flakes, bentonite, rutile, magnesium hydroxide, gypsum, sheet silicates, talcum, calcium silicate; and oxides, nitrides, hydroxides and carbides of titanium, zirconium or hafnium; It may be one containing one or two or more selected from the group consisting of.
본 발명의 구성은, 상기 제2 고분자는 폴리디(2-에틸헥실)글리콜아디페이트(polydi(2-ethlhexyl)giycoladipate), 폴리(네오펜틸 글리콜 아디페이트)(poly(neopentyl glycol adipate)) 및 폴리(1,2-프로필렌글리콜 아디페이트)(poly(1,2-propylene glycol adipate))로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고, 상기 가소제는 금속 과염소산염, 구연산염, 폴리사이클로 펜타디엔, 수소화테르페닐, 폴리프로필렌옥사이드, 인산에스테르, 트리멜리테이트, 프탈레이트, 벤조에이트, 지방산 에스테르알코올, 다이머산에스테르, 그르타레이토, 디부틸 세바케이트(dibutyl Sebacate), 디옥틸 세바케이트, 디아이소프로필 세바케이트, 아크릴산에스테르, 에폭시화 지방산 에스테르, 에폭시화 대두유, 폴리에스테르, 아디핀산, 프탈레이트, 아제레이토, 다이옥틸 프탈레이트로, (디)아세틸화 모노글리세라이드, 디에틸1,4-사이클로헥산디카복실레이트, 디옥틸 테레프탈레이트 및 1,2-사이클로헥산 디카복실산 다이이소노닐에스터로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것일 수 있다. In the configuration of the present invention, the second polymer is polydi (2-ethylhexyl) glycol adipate (polydi (2-ethlhexyl) giycoladipate), poly (neopentyl glycol adipate) (poly (neopentyl glycol adipate)) and poly (1,2-propylene glycol adipate) (poly (1,2-propylene glycol adipate)), and the plasticizer is a metal perchlorate, citrate, polycyclopentadiene , hydrogenated terphenyl, polypropylene oxide, phosphoric acid ester, trimellitate, phthalate, benzoate, fatty acid ester alcohol, dimer acid ester, glutalate, dibutyl sebacate, dioctyl sebacate, diisopropyl As sebacate, acrylic acid ester, epoxidized fatty acid ester, epoxidized soybean oil, polyester, adipic acid, phthalate, azerato, dioctyl phthalate, (di)acetylated monoglyceride, diethyl 1,4-cyclohexanedicarboxylate It may contain one or two or more selected from the group consisting of latex, dioctyl terephthalate, and 1,2-cyclohexane dicarboxylic acid diisononyl ester.
상기한 목적을 달성하기 위한 수단으로서 본 발명의 금속제품은, 상기 금속 코팅 키트로 제조된 것으로서, 금속재; 상기 금속재 상에 제1 제를 코팅하여 형성된 제1 층; 및 상기 제1 층이 코팅된 금속재와 제2 제 및 수지 코팅제를 이중압출하여 상기 제1 층 상에 형성된 제2 층 및 상기 제2 층상에 형성된 수지 피막층; 을 포함할 수 있다. As a means for achieving the above object, the metal product of the present invention, as manufactured by the metal coating kit, includes a metal material; a first layer formed by coating a first agent on the metal material; and a second layer formed on the first layer by double-extruding the metal material coated with the first layer, the second agent, and the resin coating agent, and a resin film layer formed on the second layer. can include
본 발명의 구성은, 상기 제1 층이 코팅된 금속재를 고주파 가열기를 이용하여 120 ℃ 내지 300 ℃ 온도로 1차 가열한 이후 이중압출하고, 이중압출 이후에 80 ℃ 내지 150 ℃ 미만의 온도에서 2차 가열하여 제조된 것일 수 있다. In the configuration of the present invention, the metal material coated with the first layer is first heated at a temperature of 120 ° C to 300 ° C using a high-frequency heater, followed by double extrusion, and after double extrusion, at a temperature of 80 ° C to less than 150 ° C. It may be prepared by heating the car.
본 발명의 구성은, 상기 제2 층의 경도(로크웰 표면경도)는 80 이상이고, 상기 제2 층의 열팽창계수는, 50 ppm/℃ 이하이고, 상기 금속재와 상기 제2 층의 열팽창 계수(CTE)의 차이는 ± 20 ppm/℃ 이하인 것일 수 있다. In the configuration of the present invention, the hardness (Rockwell surface hardness) of the second layer is 80 or more, the thermal expansion coefficient of the second layer is 50 ppm / ° C or less, and the thermal expansion coefficient (CTE) of the metal material and the second layer ) may be less than ± 20 ppm / ° C.
본 발명의 구성은, 상기 제1 층의 두께는 0.5 ㎛ 내지 50 ㎛이고, 상기 제2 층의 두께는 0.5 ㎛ 내지 200 ㎛이고, 상기 수지 피막층의 두께는 0.5 ㎛ 내지 2000 ㎛인 것일 수 있다. In the configuration of the present invention, the thickness of the first layer is 0.5 μm to 50 μm, the thickness of the second layer is 0.5 μm to 200 μm, and the thickness of the resin film layer is 0.5 μm to 2000 μm.
본 발명은, 수지 코팅제(예: ASA 수지)와 상용성이 좋고, 우수한 고내열성을 갖는 탄성체인 제2 제, 상기 제2 제를 금속재 상에 부착시킬 수 있는 접착제인 제1 제를 포함하고, 열적 안정성 및 접착성이 향상된 금속재 코팅 키트를 제공할 수 있다. The present invention includes a second agent, which is an elastic material that is compatible with a resin coating agent (eg, ASA resin) and has excellent heat resistance, and a first agent that is an adhesive capable of attaching the second agent to a metal material, A metal material coating kit having improved thermal stability and adhesion may be provided.
본 발명은, 고온(예: 180 ℃ 이상)의 공압출(예: 이중압출 또는 삼중압출)으로 금속재 상에 수지 피막을 형성할 수 있는, 금속재 코팅 키트를 제공할 수 있다. The present invention can provide a metal material coating kit capable of forming a resin film on a metal material by co-extrusion (eg, double extrusion or triple extrusion) at a high temperature (eg, 180 ° C. or higher).
본 발명은, 본 발명의 금속재 코팅 키트를 이용하여 금속재와 수지 피막(예: ASA 수지 피막) 간의 열팽창 계수를 상쇄하여 금속재와 수지 피막 간의 접착력 및 안정성이 향상된 금속 제품을 제공할 수 있다. The present invention can provide a metal product with improved adhesion and stability between the metal material and the resin film by offsetting the thermal expansion coefficient between the metal material and the resin film (eg ASA resin film) using the metal material coating kit of the present invention.
이하 본 발명의 다양한 실시예들을 상세히 설명한다. 그리고, 본 발명의 실시예를 설명함에 있어서, 관련된 공지기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단된 경우 그 상세한 설명은 생략한다. 그리고 후술되는 용어들은 본 발명의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례 등에 따라 달라질 수 있다. 그러므로 그 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, various embodiments of the present invention will be described in detail. And, in describing the embodiments of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, terms to be described later are terms defined in consideration of functions of the present invention, which may vary according to the intention or custom of a user or operator. Therefore, the definition should be made based on the contents throughout this specification.
이하, 본 발명의 금속재 코팅 키트 및 금속 제품에 대하여 실시예를 참조하여 구체적으로 설명하도록 한다. 그러나, 본 발명이 이러한 실시예에 제한되는 것은 아니다. Hereinafter, the metal coating kit and the metal product of the present invention will be described in detail with reference to Examples. However, the present invention is not limited to these examples.
일 실시 예에 따른, 금속재 코팅 키트는 금속재 표면 처리 또는 수지 피막 형성을 위한 키트로서, 표면 접착제 또는 접착성 향상을 위한 표면 처리제로 이용되는 제1 제; 수지 피막의 접착성 또는 안정성 향상을 위한 열적 특성을 제어하기 위한 제2 제; 및 수지 코팅제;를 포함할 수 있다. According to one embodiment, a metal material coating kit is a kit for surface treatment of a metal material or formation of a resin film, and includes a first agent used as a surface treatment agent for improving surface adhesive or adhesion; A second agent for controlling the thermal properties to improve the adhesiveness or stability of the resin film; And a resin coating agent; may include.
일 실시 예에 따라, 상기 금속재는 금속 박막, 금속 스틱(예: 튜브, 봉 또는 다각형 튜브), 금속판, 금속 필름 등일 수 있으나, 이에 제한되지 않는다. 예를 들어, 상기 금속재는 금속(예: 알루미늄, 동, 철, 티탄, 마그네슘 등), 합금(예: 구리합금, 알루미늄 합금, 철 합금, 티탄 합금, 마그네슘 합금), 스테인리스 강(예: Austenite계 · Ferrite계 · Martensite계, Duplex계), 강철 등일 수 있으나, 이에 제한되지 않는다. 예를 들어, 철재, 강철, 구리(예: 동박), AZ91, AM60, ZK51, ZK61, AZ31, AZ61, ZK60, SUS 304, SUS 310, SUS 316, SUS 321, STS 410, STS 430, STS 304, STS 631 등일 수 있으나, 이에 제한되지 않는다. According to an embodiment, the metal material may be a metal thin film, a metal stick (eg, a tube, a rod, or a polygonal tube), a metal plate, or a metal film, but is not limited thereto. For example, the metal material may include metal (eg, aluminum, copper, iron, titanium, magnesium, etc.), alloy (eg, copper alloy, aluminum alloy, iron alloy, titanium alloy, magnesium alloy), stainless steel (eg, austenite-based). It may be Ferrite-based, Martensite-based, Duplex-based), steel, etc., but is not limited thereto. For example, steel, steel, copper (e.g. copper foil), AZ91, AM60, ZK51, ZK61, AZ31, AZ61, ZK60, SUS 304, SUS 310, SUS 316, SUS 321, STS 410, STS 430, STS 304, It may be STS 631 or the like, but is not limited thereto.
일 실시 예에 따라, 상기 금속재의 표면 조도(Ra)가 0.5 ㎛ 이상, 1.0 ㎛ 이상, 1.6 ㎛ 이상, 2.0 ㎛ 이상; 5.0 ㎛ 이하, 4.0 ㎛ 이하, 또는 3.0 ㎛ 이하일 수 있다(여기서 언급된 값에서 최소 및 최대 값을 선택할 수 있다.). 상기 금속재의 표면 조도를 조절하여 제1 제에 의한 피막 형성 및 접착성을 향상시킬 수 있다. According to one embodiment, the surface roughness (Ra) of the metal material is 0.5 μm or more, 1.0 μm or more, 1.6 μm or more, 2.0 μm or more; 5.0 μm or less, 4.0 μm or less, or 3.0 μm or less (the minimum and maximum values can be selected from the values mentioned here). By adjusting the surface roughness of the metal material, film formation and adhesion by the first agent may be improved.
일 실시 예에 따라, 상기 제1 제는 변성 아크릴계 수지 및 용제를 포함할 수 있다. 일 실시 예에 따라, 상기 변성 아크릴계 수지는 상기 제1 제 중 1 중량% 내지 20 중량%; 5 중량% 내지 20 중량%; 10 중량% 내지 18 중량%; 또는 12 중량% 내지 18 중량%일 수 있다. 상기 범위 내에 포함되면 접착성을 위한 아크릴계 1액형 접착제를 제공하고, 접착성 및 열적 안정성이 향상될 수 있다. According to one embodiment, the first agent may include a modified acrylic resin and a solvent. According to one embodiment, the modified acrylic resin is 1% to 20% by weight of the first agent; 5% to 20% by weight; 10% to 18% by weight; or 12% to 18% by weight. When included within the above range, an acrylic one-component adhesive for adhesiveness may be provided, and adhesiveness and thermal stability may be improved.
일 실시 예에 따라, 상기 변성 아크릴계 수지는 에폭시 변성 스티렌 아크릴 수지, 에폭시 변성 아크릴 수지, 폴리에스테르 변성 아크릴 수지, 실리콘 변성 아크릴 수지, 폴리카보네이트 변성 아크릴 수지 및 불소 변성 아크릴 수지로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 열적 안정성을 고려하여 에폭시 변성 스티렌 아크릴 수지, 에폭시 변성 아크릴 수지 및 실리콘 변성 아크릴 수지일 수 있다. According to one embodiment, the modified acrylic resin is one selected from the group consisting of an epoxy-modified styrene acrylic resin, an epoxy-modified acrylic resin, a polyester-modified acrylic resin, a silicone-modified acrylic resin, a polycarbonate-modified acrylic resin, and a fluorine-modified acrylic resin. Or two or more may be included. Preferably, it may be an epoxy-modified styrene acrylic resin, an epoxy-modified acrylic resin, and a silicone-modified acrylic resin in consideration of thermal stability.
일 실시 예에 따라, 상기 변성 아크릴계 수지는 메틸메타크릴레이트, 하이드록실 에틸메타크릴레이트, 시크로헥실 메타크릴레이트 및 이소부틸 메타크릴레이트로 이루어진 군에서 선택된 1종 또는 2종 이상의 아크릴레이트 모노머 또는 이들의 중합체를 포함할 수 있다. 예를 들어, 상기 실리콘 변성 아크릴 수지는 실리콘 아크릴레이트 모노머 10 중량% 내지 40 중량%(예: 바람직하게는 10 중량% 내지 15 중량%), 아크릴레이트 모노머 30 중량% 내지 70 중량%, 유기용제 10 중량% 내지 30 중량% 및 개시제 0.5 중량% 내지 5 중량%의 혼합물을 중합시켜 제조된 것일 수 있다. 여기서, 유기용제는 특별히 제한되지 않으나, 아세트산염 부틸, 크실렌 등에서 선택될 수 있다. 개시제는 특별히 제한되지 않으나, 아세토페논, 벤조페논, 크산톤, 벤조인 화합물 등과 같은 방향족 케톤; 트리에탄올아민, 메틸디에탄올아민 및 4-디메틸아미노벤조페논과 같은 3급 아민; 트리오가노벤조일디아릴포스핀 옥사이드, 트리오가노벤조일디오가노포스포네이트 및 트리오가노벤조일디아릴포스핀 설파이드를 포함하는 아실포스포러스 화합물; 과산화벤조일; 아조이소부틸로나이트릴; 등에서 선택될 수 있다. According to one embodiment, the modified acrylic resin is one or two or more acrylate monomers selected from the group consisting of methyl methacrylate, hydroxyl ethyl methacrylate, cyclohexyl methacrylate, and isobutyl methacrylate, or These polymers may be included. For example, the silicone-modified acrylic resin contains 10% to 40% by weight of a silicone acrylate monomer (e.g., preferably 10% to 15% by weight), 30% to 70% by weight of an acrylate monomer, and 10% by weight of an organic solvent. It may be prepared by polymerizing a mixture of 0.5 wt% to 5 wt% of an initiator and 0.5 wt% to 30 wt%. Here, the organic solvent is not particularly limited, but may be selected from butyl acetate, xylene, and the like. The initiator is not particularly limited, but aromatic ketones such as acetophenone, benzophenone, xanthone, benzoin compounds and the like; tertiary amines such as triethanolamine, methyldiethanolamine and 4-dimethylaminobenzophenone; acylphosphorous compounds including triorganobenzoyldiarylphosphine oxide, triorganobenzoyldiorganophosphonate and triorganobenzoyldiarylphosphine sulfide; benzoyl peroxide; azoisobutylonitrile; etc. can be selected.
일 실시 예에 따라, 상기 용제는 유기용제이며, 방향족 탄화수소계 용제, 케톤계 용제 및 알코올을 포함할 수 있다. 상기 용제는 상기 제1 제 중 잔량, 99 중량% 내지 80 중량%, 또는 90 중량% 내지 80 중량%; 또는 90 중량% 내지 84 중량%일 수 있다. 상기 범위 내에 포함되면 금속재 상에 균일하게 도포되고 제2 제와 금속재 간의 접착성을 향상시킬 수 있다. 예를 들어, 접착성 및 열적 안정성을 고려하여 상기 제1 제 중 방향족 탄화수소계 용제 10 중량% 내지 40 중량%, 케톤계 용제 10 중량% 내지 30 중량%; 및 알코올 10 중량% 내지 40 중량%를 포함할 수 있다. According to one embodiment, the solvent is an organic solvent and may include an aromatic hydrocarbon-based solvent, a ketone-based solvent, and alcohol. The solvent is the balance of the first agent, 99% to 80% by weight, or 90% to 80% by weight; or 90% to 84% by weight. When it is within the above range, it is uniformly applied on the metal material and adhesion between the second agent and the metal material can be improved. For example, 10 wt% to 40 wt% of an aromatic hydrocarbon-based solvent and 10 wt% to 30 wt% of a ketone-based solvent in the first agent in consideration of adhesiveness and thermal stability; and 10% to 40% by weight of alcohol.
일 실시 예에 따라, 상기 용제 중 상기 방향족 탄화수소계 용제 (예: 메틸벤젠) : 상기 케톤계 용제의 질량비(w/w)는 1 : 1.5 내지 1 : 4; 1 : 1.5 내지 1 : 3; 또는 1 : 1.5 내지 1 : 2.5;일 수 있다. 상기 질량비 범위 내에 포함되면 제1 제에 의한 균일한 표면 처리, 접착성 및 열적 안정성을 향상시킬 수 있다. According to one embodiment, the mass ratio (w / w) of the aromatic hydrocarbon-based solvent (eg, methylbenzene): the ketone-based solvent of the solvent is 1: 1.5 to 1: 4; 1:1.5 to 1:3; or 1: 1.5 to 1: 2.5; When included within the above mass ratio range, uniform surface treatment, adhesiveness, and thermal stability by the first agent may be improved.
일 실시 예에 따라, 상기 방향족 탄화수소계 용제는 벤젠, 톨루엔, 자일렌, 메시길래(mesitylene) 및 메틸벤젠(methyl benzene) 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 일 실시 예에 따라, 상기 케톤계 용제는 2-부탄온(즉, 메틸에틸케톤), 아세톤, 메틸아밀케톤, 메틸이소부틸케톤 및 시클로헥사논으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 일 실시 예에 따라, 상기 알코올은 탄소수 1 내지 3의 알코올에서 선택될 수 있다. 바람직하게는 상기 용제는 메틸벤젠, 2-부탄온 및 메탄올을 포함할 수 있다. 더 바람직하게는 상기 제1 제 중 메틸벤젠 25 중량% 내지 35 중량%, 케톤계 용제 15 중량% 내지 25 중량%, 및 메탄올 25 중량% 내지 35 중량%를 포함할 수 있다. 이는 제1 제에 의한 균일한 표면 처리, 접착성 및 열적 안정성을 향상시킬 수 있다. According to one embodiment, the aromatic hydrocarbon-based solvent may include one or two or more selected from the group consisting of benzene, toluene, xylene, mesitylene, and methyl benzene. According to one embodiment, the ketone-based solvent includes one or two or more selected from the group consisting of 2-butanone (ie, methyl ethyl ketone), acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone can do. According to one embodiment, the alcohol may be selected from alcohols having 1 to 3 carbon atoms. Preferably, the solvent may include methylbenzene, 2-butanone and methanol. More preferably, the first agent may include 25% to 35% by weight of methylbenzene, 15% to 25% by weight of a ketone solvent, and 25% to 35% by weight of methanol. This can improve uniform surface treatment, adhesion and thermal stability by the first agent.
일 실시 예에 따라, 상기 제1 제는, 폴리에스테르 변성 우레탄 수지, 아크릴 변성 우레탄 수지 또는 이 둘 모두를 더 포함할 수 있다. 이는 상기 제1 제 중 잔량 또는 0.1 중량% 내지 10 중량%; 0.1 중량% 내지 8 중량%; 0.5 중량% 내지 5 중량%; 또는 1 중량 % 내지 3 중량%일 수 있다. 상기 범위 내에 포함되면 제1 제에 의한 접착성 및 열적 안정성을 향상시킬 수 있다. According to one embodiment, the first agent may further include a polyester-modified urethane resin, an acrylic-modified urethane resin, or both. It is the balance or 0.1% to 10% by weight of the first agent; 0.1% to 8% by weight; 0.5% to 5% by weight; or 1% to 3% by weight. When included within the above range, adhesiveness and thermal stability by the first agent may be improved.
일 실시 예에 따라, 상기 제2 제는 PVC(Polyvinyl chloride)를 포함하는 제1 고분자, 아디페이트(adipate)계 화합물을 포함하는 제2 고분자, 가소제, 안정제, 내열 안정제, 산화방지제, UV 안정제, 무기충전제 및 활제를 포함할 수 있다. 상기 제2 제는 고온의 코팅 또는 압출 공정에서 내열성이 우수한 열가소성 고분자 탄성체이며, 금속재와 수지 코팅제(또는, 수지 피막층) 간의 열팽창 계수 차이를 낮추어 고온의 공압출 공정에 의한 수지 피막의 형성을 실현시키고, 수지 피막의 안정성을 확보할 수 있다. 즉, 금속재의 코팅에서 제1 제에 의한 박막과 수지 피막 사이에 중간층(예: 제2 층)을 형성하는 것으로, 고온에서 수지 피막층 과 금속재 간의 열팽창시 범퍼 역할을 제공할 수 있다. According to one embodiment, the second agent is a first polymer containing polyvinyl chloride (PVC), a second polymer containing an adipate-based compound, a plasticizer, a stabilizer, a heat-resistant stabilizer, an antioxidant, a UV stabilizer, Inorganic fillers and lubricants may be included. The second agent is a thermoplastic polymer elastomer with excellent heat resistance in a high-temperature coating or extrusion process, and realizes the formation of a resin film by a high-temperature co-extrusion process by lowering the difference in thermal expansion coefficient between the metal material and the resin coating agent (or resin film layer) , the stability of the resin film can be secured. That is, by forming an intermediate layer (eg, a second layer) between the thin film by the first agent and the resin film in the coating of the metal material, it can provide a bumper role during thermal expansion between the resin film layer and the metal material at high temperature.
일 실시 예에 따라, 상기 PVC를 포함하는 제1 고분자는 상기 제2 제 중 40 중량% 내지 70 중량%; 45 중량% 내지 60 중량%; 또는 50 중량% 내지 55 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제에 의한 중간층(예: 제2 층)에 탄성 및 유연성을 부여하고 수지 피막(예: ABS 수지)과 우수한 호환성을 제공하는 수지 매트릭스로 기능을 제공할 수 있다. According to one embodiment, the first polymer containing the PVC is 40% to 70% by weight of the second agent; 45% to 60% by weight; or 50% to 55% by weight. When included within the above range, it is possible to provide elasticity and flexibility to the intermediate layer (eg, the second layer) by the second agent, and to provide a resin matrix that provides excellent compatibility with a resin film (eg, ABS resin).
일 실시 예에 따라, 상기 제2 고분자는 제1 고분자와 혼련 및 컴파운딩되어 경도 및 내열성을 향상시킬 수 있다. 상기 제2 고분자는 상기 제2 제 중 10 중량% 내지 30 중량%; 15 중량% 내지 25 중량%; 또는 15 중량% 내지 20 중량%; 일 수 있다. 상기 범위 내에 포함되면 제2 제의 구성성분과 상용성(compatibility)이 우수하고, 제2 제의 탄성 및 유연성(flexibility) 및 경도를 향상시킬 수 있다. According to one embodiment, the second polymer may be kneaded and compounded with the first polymer to improve hardness and heat resistance. The second polymer is 10% to 30% by weight of the second agent; 15% to 25% by weight; or 15% to 20% by weight; can be When included within the above range, compatibility with the components of the second agent is excellent, and elasticity, flexibility, and hardness of the second agent can be improved.
일 실시 예에 따라, 상기 제2 고분자는 폴리디(2-에틸헥실)글리콜아디페이트(polydi(2-ethlhexyl)giycoladipate), 폴리(네오펜틸 글리콜 아디페이트)(poly(neopentyl glycol adipate)) 및 폴리(1,2-프로필렌글리콜 아디페이트)(poly(1,2-propylene glycol adipate))로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 폴리디(2-에틸헥실)글리콜아디페이트(polydi(2-ethlhexyl)giycoladipate) 및 폴리(네오펜틸 글리콜 아디페이트)(poly(neopentyl glycol adipate))일 수 있다. According to one embodiment, the second polymer is polydi (2-ethylhexyl) glycol adipate (polydi (2-ethlhexyl) giycoladipate), poly (neopentyl glycol adipate) (poly (neopentyl glycol adipate)) and poly It may include one or two or more selected from the group consisting of (1,2-propylene glycol adipate) (poly (1,2-propylene glycol adipate)). Preferably, it may be polydi(2-ethlhexyl)giycoladipate and poly(neopentyl glycol adipate).
일 실시 예에 따라, 상기 제2 고분자의 분자량(Mw)은 1000 내지 100,000; 5,000 내지 100,000; 10,000 내지 100,000; 10,000 내지 95,000; 또는 50,000 내지 95,000(g/mol)일 수 있다. 상기 분자량 범위 내에 포함되면 제2 제의 탄성 및 유연성을 향상시키고, 우수한 가공성을 제공할 수 있다. According to one embodiment, the molecular weight (Mw) of the second polymer is 1000 to 100,000; 5,000 to 100,000; 10,000 to 100,000; 10,000 to 95,000; or 50,000 to 95,000 (g/mol). When included within the above molecular weight range, elasticity and flexibility of the second agent may be improved, and excellent processability may be provided.
일 실시 예에 따라, 상기 가소제는 제2 제 중 1 중량% 내지 10 중량%; 2 중량% 내지 8 중량%; 또는 5 중량% 내지 8 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제의 가공성, 탄성 및 유연성을 향상시키고, 금속재 코팅 공정에서 수지 피막(예: ABS 수지)의 호환성을 향상시킬 수 있다. According to one embodiment, the plasticizer is 1% to 10% by weight of the second agent; 2% to 8% by weight; or 5% to 8% by weight. When included within the above range, processability, elasticity, and flexibility of the second agent may be improved, and compatibility of a resin film (eg, ABS resin) may be improved in a metal material coating process.
일 실시 예에 따라, 상기 가소제는 알칼리 금속, 알칼리토 금속, 알루미늄, 아연, 란탄 또는 세륨 금속 과염소산염의 금속 과염소산염; 방향족계유; 구연산염, 폴리사이클로 펜타디엔 등의 환상 올레핀; 폴리 알파 올레핀; 수소화 테르페닐 또는 다른 테르펜 유도체; 폴리프로필렌옥사이드, 인산에스테르; 트리멜리테이트; 프탈레이트; 벤조에이트; 지방산 에스테르알코올; 다이머산에스테르; 그르타레이토; 디부틸 세바케이트(dibutyl sebacate), 디옥틸 세바케이트, 디아이소프로필 세바케이트 등의 세바케이트; 아크릴산에스테르; 에폭시화 지방산 에스테르; 에폭시화 대두유(epoxidized soybean oil); 폴리에스테르; 아디핀산, 프탈레이트, 아제레이토 등의 폴리 에테르; 다이옥틸 프탈레이트로; (디)아세틸화 모노글리세라이드((di)acetylated monoglyceride); 디에틸1,4-사이클로헥산디카복실레이트(1,4-cyclohexanedicarboxylicacid, diethylester); 디옥틸 테레프탈레이트(dioctyl terephthalate); 및 1,2-사이클로헥산 디카복실산 다이이소노닐에스터(1,2-cyclohexane dicarboxylic acid diisononyl ester);로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 (디)아세틸화 모노글리세라이드((di)acetylated monoglyceride), 디에틸1,4-사이클로헥산디카복실레이트(1,4-cyclohexanedicarboxylicacid, diethylester) 및 디옥틸 테레프탈레이트(dioctyl terephthalate)에서 선택될 수 있다. According to one embodiment, the plasticizer is a metal perchlorate of alkali metal, alkaline earth metal, aluminum, zinc, lanthanum or cerium metal perchlorate; aromatic oil; cyclic olefins such as citrate and polycyclopentadiene; poly alpha olefins; hydrogenated terphenyls or other terpene derivatives; polypropylene oxide, phosphoric acid ester; trimellitate; phthalates; benzoate; fatty acid ester alcohol; dimer acid ester; grtarayto; sebacates such as dibutyl sebacate, dioctyl sebacate, and diisopropyl sebacate; acrylic acid ester; epoxidized fatty acid esters; epoxidized soybean oil; Polyester; polyethers such as adipic acid, phthalate, and azereto; as dioctyl phthalate; (di) acetylated monoglyceride; diethyl 1,4-cyclohexanedicarboxylic acid (diethylester); dioctyl terephthalate; And 1,2-cyclohexane dicarboxylic acid diisononyl ester (1,2-cyclohexane dicarboxylic acid diisononyl ester); may include one or two or more selected from the group consisting of. Preferably selected from (di)acetylated monoglyceride, 1,4-cyclohexanedicarboxylicacid (diethylester) and dioctyl terephthalate It can be.
일 실시 예에 따라, 상기 안정제는 상기 제2 제 중 1 중량% 내지 10 중량%; 1 중량% 내지 8 중량%; 1 중량% 내지 5 중량%; 또는 2 중량% 내지 3 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제에 적절한 점성을 제공하고, 제1 제와의 결합을 향상시킬 수 있다. According to one embodiment, the stabilizer is 1% to 10% by weight of the second agent; 1% to 8% by weight; 1% to 5% by weight; or 2% to 3% by weight. When contained within the above range, it is possible to provide appropriate viscosity to the second agent and improve bonding with the first agent.
일 실시 예에 따라, 상기 안정제는 칼슘 스테아레이트(calcium stearate), 리시놀레산 칼슘염(ricinoleic acid calcium salt), 징크 스테아레이트(zinc stearate) 및 리시놀레산 아연염(zinc ricinoleate)로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 칼슘 스테아레이트(calcium stearate)일 수 있다. According to one embodiment, the stabilizer is from the group consisting of calcium stearate, ricinoleic acid calcium salt, zinc stearate and zinc ricinoleate. One or two or more selected species may be included. Preferably, it may be calcium stearate.
일 실시 예에 따라, 상기 내열 안정제는 상기 제2 제 중 0.1 중량% 내지 5 중량%; 0.1 중량% 내지 3중량%; 0.1 중량% 내지 2.5 중량%; 0.5 중량% 내지 2.5 중량%; 또는 1 중량% 내지 2 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제와 수지 피막(예: ABS 수지)와의 호환성을 저하하지 않으면서 제2 제의 열적 특성 제어(예: 금속재와 수지 피막 간의 열팽창 계수 차이 저하)을 효과적으로 제어하고, 수지 피막의 안정성을 부여할 수 있다. According to one embodiment, the heat-resistant stabilizer is 0.1% to 5% by weight of the second agent; 0.1% to 3% by weight; 0.1% to 2.5% by weight; 0.5% to 2.5% by weight; or 1% to 2% by weight. When included within the above range, the thermal properties of the second agent are effectively controlled (eg, reduction in the thermal expansion coefficient difference between the metal material and the resin film) without deteriorating compatibility between the second agent and the resin film (eg, ABS resin), and the resin The stability of the film can be imparted.
일 실시 예에 따라, 상기 내열 안정제는 고내열 안정제이며, 예를 들어, 페놀계 내열 안정제, 황계 내열 안정제 및 인산염계 내열 안정제로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 상기 페놀계 내열 안정제 및 상기 황계 내열 안정제의 혼합물일 수 있다. 예를 들어, 상기 페놀계 내열 안정제 대 상기 황계 내열 안정제의 질량비는 1 : 0.1 내지 1 : 1; 1 : 0.3 내지 1 : 1; 또는 1 : 0.5 내지 1 : 0.8일 수 있다. 상기 질량비를 적용하여 제2 제와 수지 피막(예: ABS 수지)와의 호환성을 저하하지 않으면서 제2 제의 열적 특성 제어(예: 금속재와 수지 피막 간의 열팽창 계수 차이 저하)을 효과적으로 제어하고, 수지 피막의 안정성을 부여할 수 있다. 예를 들어, 바람직하게는 상기 페놀계 내열 안정제, 상기 황계 내열 안정제 및 인산염계 내열 안정제의 혼합물일 수 있다. 예를 들어, 상기 페놀계 내열 안정제 대 상기 황계 내열 안정제 대 인산염계 내열 안정제의 질량비는 1 : 0.1 내지 1 : 0.1 내지 1; 1 : 0.3 내지 1 : 0.3 내지 1; 또는 1 : 0.5 내지 0.8 : 0.5 내지 0.8일 수 있다. 상기 질량비를 적용하여 제2 제와 수지 피막(예: ABS 수지)와의 호환성을 저하하지 않으면서 제2 제의 열적 특성 제어(예: 금속재와 수지 피막 간의 열팽창 계수 차이 저하)을 효과적으로 제어하고, 수지 피막의 안정성을 부여할 수 있다. According to one embodiment, the heat-resistant stabilizer is a high heat-resistant stabilizer, and may include, for example, one or two or more selected from the group consisting of a phenol-based heat-resistant stabilizer, a sulfur-based heat-resistant stabilizer, and a phosphate-based heat-resistant stabilizer. Preferably, it may be a mixture of the phenol-based heat-resistant stabilizer and the sulfur-based heat-resistant stabilizer. For example, the mass ratio of the phenol-based heat-resistant stabilizer to the sulfur-based heat-resistant stabilizer is 1:0.1 to 1:1; 1:0.3 to 1:1; or 1:0.5 to 1:0.8. By applying the mass ratio, the thermal properties of the second agent are effectively controlled (eg, reduction in the thermal expansion coefficient difference between the metal material and the resin film) without degrading the compatibility between the second agent and the resin film (eg, ABS resin), and the resin The stability of the film can be imparted. For example, it may preferably be a mixture of the phenol-based heat-resistant stabilizer, the sulfur-based heat-resistant stabilizer, and the phosphate-based heat-resistant stabilizer. For example, the mass ratio of the phenol-based heat-resistant stabilizer to the sulfur-based heat-resistant stabilizer to the phosphate-based heat-resistant stabilizer is 1:0.1 to 1:0.1 to 1; 1 : 0.3 to 1 : 0.3 to 1; or 1:0.5 to 0.8:0.5 to 0.8. By applying the mass ratio, the thermal properties of the second agent are effectively controlled (eg, reduction in the thermal expansion coefficient difference between the metal material and the resin film) without degrading the compatibility between the second agent and the resin film (eg, ABS resin), and the resin The stability of the film can be imparted.
일 실시 예에 따라, 상기 페놀계 내열 안정제는 2-tert-부틸-4-메톡시페놀, 2-tert-부틸-4,6-디메톡시페놀, 3,5-디-tert-부틸-4-하이드록시톨루엔, 4-하이드록시메틸-2,6-디-tert-부틸페놀, 2,4,6-트리-tert-부틸페놀, 2,2'-메틸렌-비스(4-에틸-6-tert-부틸페놀), 4,4'-부틸리덴-비스(6-tert-부틸-m-크레졸), 2,2'-메틸렌-비스(4-메틸-6-시클로헥실페놀), 4,4'-비스(2,6-디-tert-부틸페놀), 2,2'-디하이드록시-3,3'-비스(α-메틸시클로헥실)-5,5'-디메틸디페닐메탄, 4,4'-메틸렌-비스(2,6-디-tert-부틸페놀), d,l-α-토코페롤(비타민E), 2,6-비스(2-하이드록시-3-tert-부틸-5-메틸벤질)-4-메틸페놀, 3-(4-하이드록시-3,5-디-tert-부틸페닐)프로피온산 n-옥타데실, 1,3,5-트리스(4-tert-부틸-3-하이드록시-2,6-디메틸벤질)-s-트리아진-2,4,6-(1H, 3H,5H)-트리온, 1,3,5-트리메틸-2,4,6-트리스(3,5-디-tert-부틸-4-하이드록시페닐)벤질벤젠, 1,3,5-트리스(4-하이드록시-3,5-디-tert-부틸벤질)-s-트리아진-2,4,6-(1H,3H,5H)-트리온, 테트라키스[메틸렌-3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오네이트]메탄, 데카메틸렌카복실산디살리실로일하이드라지드, N,N'-비스[3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오닐]하이드라진, 2,2'-옥시아미드-비스-에틸-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 4,4'-티오비스(3-메틸-6-tert-부틸페놀), 2,2'-티오비스(4-메틸-6-tert-부틸페놀), 비스(3-메틸-4-하이드록시-5-tert-부틸벤질)설피드, 4,4'-부틸리덴-비스(2-메틸-4-하이드록시-5-tert-부틸페닐)-2-라우릴티오에테르, 6-(4-하이드록시-3,5-디-tert-부틸아닐리노)-2,4-비스(옥틸티오)-1,3,5-트리아진 및 2,4-비스(4-하이드록시-3,5-디-tert-부틸아닐리노)-6-(n-옥틸티오)-1,3,5-트리아진으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. According to one embodiment, the phenolic heat-resistant stabilizer is 2-tert-butyl-4-methoxyphenol, 2-tert-butyl-4,6-dimethoxyphenol, 3,5-di-tert-butyl-4- Hydroxytoluene, 4-hydroxymethyl-2,6-di-tert-butylphenol, 2,4,6-tri-tert-butylphenol, 2,2'-methylene-bis(4-ethyl-6-tert -butylphenol), 4,4'-butylidene-bis(6-tert-butyl-m-cresol), 2,2'-methylene-bis(4-methyl-6-cyclohexylphenol), 4,4 '-bis(2,6-di-tert-butylphenol), 2,2'-dihydroxy-3,3'-bis(α-methylcyclohexyl)-5,5'-dimethyldiphenylmethane, 4 ,4'-methylene-bis(2,6-di-tert-butylphenol), d,l-α-tocopherol (vitamin E), 2,6-bis(2-hydroxy-3-tert-butyl-5 -Methylbenzyl)-4-methylphenol, 3-(4-hydroxy-3,5-di-tert-butylphenyl)propionic acid n-octadecyl, 1,3,5-tris(4-tert-butyl-3 -Hydroxy-2,6-dimethylbenzyl)-s-triazine-2,4,6-(1H, 3H,5H)-trione, 1,3,5-trimethyl-2,4,6-tris( 3,5-di-tert-butyl-4-hydroxyphenyl)benzylbenzene, 1,3,5-tris(4-hydroxy-3,5-di-tert-butylbenzyl)-s-triazine-2 ,4,6-(1H,3H,5H)-trione, tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane, decamethylenecarboxylic acid di Salicyloylhydrazide, N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hydrazine, 2,2'-oxyamide-bis-ethyl- 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-thiobis (4-methyl-6-tert-butylphenol), bis(3-methyl-4-hydroxy-5-tert-butylbenzyl)sulfide, 4,4'-butylidene-bis(2-methyl-4 -Hydroxy-5-tert-butylphenyl)-2-laurylthioether, 6-(4-hydroxy-3,5-di-tert-butylanilino)-2,4-bis(octylthio)- 1,3,5-triazine and 2,4-bis(4-hydroxy-3,5-di-tert-butylanilino)-6-(n-octylthio)-1,3,5-triazine It may include one or two or more selected from the group consisting of.
일 실시 예에 따라, 상기 황계 내열 안정제는, 2-머캅토벤즈이미다졸, N,N'-디페닐티오우레아, 테트라메틸티우람디설피드, N-옥시디에틸렌-2-벤조티아졸릴설펜아미드, N-시클로헥실-2-벤조티아졸릴설펜아미드, 2-머캅토벤조티아졸의 시클로헥실아민염, N,N-디이소프로필-2-벤조티아졸설펜아미드, 2-(N,N-디에틸티오카바모일티오)벤조티아졸, 테트라에틸티우람디설피드, 디벤조티아질디설피드, 디에틸디티오카바민산아연, 에틸페닐디티오카바민산아연, 디-n-부틸디티오카바민산아연, 디라우릴티오디프로피오네이트, 디라우릴티오디-1,1'-메틸부티레이트, 디미리스틸-3,3'-티오디프로피오네이트, 라우릴스테아릴티오디프로피오네이트, 디스테아릴티오디프로피오네이트, 디스테아릴티오디부티레이트 및 디옥타데실디설피드로 이루어진 군에서 선택된 선택된 1종 또는 2종 이상을 포함할 수 있다. According to one embodiment, the sulfur-based heat-resistant stabilizer is 2-mercaptobenzimidazole, N, N'-diphenylthiourea, tetramethylthiuram disulfide, N-oxydiethylene-2-benzothiazolyl sulfenamide , N-cyclohexyl-2-benzothiazolylsulfenamide, cyclohexylamine salt of 2-mercaptobenzothiazole, N,N-diisopropyl-2-benzothiazolesulfenamide, 2-(N,N- Diethylthiocarbamoylthio)benzothiazole, tetraethylthiuramdisulfide, dibenzothiazyldisulfide, zinc diethyldithiocarbamate, zinc ethylphenyldithiocarbamate, di-n-butyldithiocarbamic acid Zinc, dilaurylthiodipropionate, dilaurylthiodi-1,1'-methylbutyrate, dimyristyl-3,3'-thiodipropionate, laurylstearylthiodipropionate, distea It may include one or two or more selected from the group consisting of arylthiodipropionate, distearylthiodibutyrate, and dioctadecyldisulfide.
일 실시 예에 따라, 상기 인산염계 내열 안정제는, 페닐디이소데실 인산염, 디페닐 이소데실 인산염, 트리페닐 인산염, 트리노닐 페닐 인산염, 칼슘 아세틸아세토네이트, 디옥틸틴 말레 인산염 및 인산염으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. According to one embodiment, the phosphate-based heat stabilizer is selected from the group consisting of phenyl diisodecyl phosphate, diphenyl isodecyl phosphate, triphenyl phosphate, trinonyl phenyl phosphate, calcium acetylacetonate, dioctyltin maleic phosphate and phosphoric acid salts. One type or two or more types may be included.
일 실시 예에 따라, 상기 산화 방지제는 상기 제2 제 중 0.01 중량% 내지 2 중량%; 0.01 중량% 내지 1.5 중량%; 0.01 중량% 내지 1 중량%; 0.05 중량% 내지 2 중량%; 0.1 중량% 내지 2 중량%; 0.2 중량% 내지 1 중량%; 0.2 중량% 내지 0.5 중량%; 일 수 있다. 상기 범위 내에 포함되면 피막의 열화를 방지하여 안정성을 향상시킬 수 있다. According to one embodiment, the antioxidant is 0.01% to 2% by weight of the second agent; 0.01% to 1.5% by weight; 0.01 wt % to 1 wt %; 0.05% to 2% by weight; 0.1% to 2% by weight; 0.2% to 1% by weight; 0.2% to 0.5% by weight; can be When included within the above range, it is possible to improve stability by preventing deterioration of the film.
일 실시 예에 따라, 상기 산화 방지제는 힌더드 페놀, 힌더드 아민 및 디페닐 디설파이드으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 예를 들어, 상기 힌더드 페놀은 BHT, 2,2'-메틸렌비스(4-메틸-6-tert-부틸페놀), 펜타에리트리톨테트라키스[3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트], 3,3',3",5,5',5"-헥사-tert-부틸-α,α',α"-(메시틸렌-2,4,6-트리일)트리-p-크레졸, 옥타데실-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 1,3,5-트리스[(4-tert-부틸-3-히드록시-2,6-크실릴)메틸]-1,3,5-트리아진-2,4,6(1H,3H,5H)-트리온, 1,3,5-트리스(3,5-디-tert-부틸-4-히드록시벤질)-1,3,5-트리아진-2,4,6(1H,3H,5H)-트리온, 칼슘 디에틸비스[{3, 5-나사(1,1-디메틸에틸)-4-히드록시페닐}메틸]포스포네이트, 비스(2,2'-디히드록시-3,3'-디-tert-부틸-5,5'-디메틸페닐)에탄, N,N'-헥산-1,6-디일비스[3-(3,5-디-tert-부틸)-4-히드록시페닐]프로피온아미드 등의 힌더드 페놀계 산화방지제를 포함할 수 있다. 예를 들어, 상기 산화 방지제는 Ciba(현재, BASF의 일부)(독일)의 "IRGANOX 1010" 및 Chemtura Europe, Ltd(영국)의 "NAUGARD 445"일 수 있다. 예를 들어, 상기 산화 방지제의 호환성을 확보하기 위해서 분자량(MW)이 200 내지 2,000(g/mol)일 수 있다. According to one embodiment, the antioxidant may include one or two or more selected from the group consisting of hindered phenols, hindered amines, and diphenyl disulfide. For example, the hindered phenol is BHT, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), pentaerythritol tetrakis[3-(3,5-di-tert-butyl- 4-hydroxyphenyl)propionate], 3,3',3",5,5',5"-hexa-tert-butyl-α,α',α"-(mesitylene-2,4,6 -triyl)tri-p-cresol, octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 1,3,5-tris[(4-tert-butyl -3-hydroxy-2,6-xylyl) methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris (3 ,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, calcium diethylbis[{3, 5 -Screw(1,1-dimethylethyl)-4-hydroxyphenyl}methyl]phosphonate, bis(2,2'-dihydroxy-3,3'-di-tert-butyl-5,5'- Hindered phenolic antioxidants such as dimethylphenyl)ethane, N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl)-4-hydroxyphenyl]propionamide, etc. For example, the antioxidant may be "IRGANOX 1010" from Ciba (now part of BASF) (Germany) and "NAUGARD 445" from Chemtura Europe, Ltd (UK). In order to ensure the compatibility of the antioxidant, the molecular weight (M W ) may be 200 to 2,000 (g/mol).
일 실시 예에 따라, 상기 UV 안정제 상기 제2 제 중 0.01 중량% 내지 1 중량%; 0.01 중량% 내지 0.8 중량%; 0.01 중량% 내지 0.5 중량%; 0.05 중량% 내지 1 중량%; 0.1 중량% 내지 0.5 중량%; 또는 0.2 중량% 내지 0.3 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제의 미세균열(예: 크랙) 형성, 박리 및 황변을 유발하는 자외선 열화(ultraviolet degradation)를 효과적으로 억제할 수 있다. 일 실시 예에 따라, 상기 UV 안정제는 유기 UV 안정제, 무기 UV 안정제 또는 이둘 모두 자외선(UV) 광 안정제를 포함할 수 있다. 예를 들어, 상기 유기 UV 안정제는 트리아진, 벤조트리아졸, 벤조옥사지논, 2-(4,6-디페닐-1,3,5-트리아진-2-일)-5-(헥실)옥시페놀(예: Tinuvin®1577), 2,2,6,6-테트라메틸피페리디닐 유도체(Tinuvin 123(BASF) 또는 Hostavin 3058(Clariant))일 수 있다. According to one embodiment, 0.01% to 1% by weight of the second agent of the UV stabilizer; 0.01% to 0.8% by weight; 0.01% to 0.5% by weight; 0.05% to 1% by weight; 0.1% to 0.5% by weight; or 0.2% to 0.3% by weight. When included within the above range, it is possible to effectively suppress ultraviolet degradation (ultraviolet degradation) causing the formation of microcracks (eg, cracks), exfoliation, and yellowing of the second agent. According to one embodiment, the UV stabilizer may include an organic UV stabilizer, an inorganic UV stabilizer, or both ultraviolet (UV) light stabilizers. For example, the organic UV stabilizer is triazine, benzotriazole, benzoxazinone, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyl)oxy phenols (eg Tinuvin® 1577), 2,2,6,6-tetramethylpiperidinyl derivatives (Tinuvin 123 (BASF) or Hostavin 3058 (Clariant)).
일 실시 예에 따라, 상기 활제는 압출 공정에서 용융물의 점도, 압출 및 사출 부하를 낮추는 것으로, 상기 제2 제 중 0.01 중량% 내지 2 중량%; 0.01 중량% 내지 1.5 중량%; 0.01 중량% 내지 1; 0.01 중량% 내지 0.5 중량%; 0.1 중량% 내지 0.5 중량%; 또는 0.2 중량% 내지 0.5 중량%일 수 있다. 상기 범위 내에 포함되면 공압출 공정에서 제1 제와 접착이 잘 이루어지고, 균일한 수지 피막(예: ABS 수지)을 형성시킬 수 있다. According to one embodiment, the lubricant is to lower the viscosity of the melt, extrusion and injection load in the extrusion process, 0.01% to 2% by weight of the second agent; 0.01% to 1.5% by weight; 0.01% by weight to 1; 0.01% to 0.5% by weight; 0.1% to 0.5% by weight; or 0.2% to 0.5% by weight. When included within the above range, adhesion with the first agent is well achieved in the co-extrusion process, and a uniform resin film (eg, ABS resin) can be formed.
일 실시 예에 따라, 상기 무기충전제는 상기 제2 제 중 5 중량% 내지 20 중량%; 5 중량% 내지 15 중량%; 또는 10 중량% 내지 15 중량%일 수 있다. 상기 범위 내에 포함되면 과량의 사용에 따른 외관 불량을 방지하고, 탄성 및 유연성을 향상시킬 수 있다. 또한, 금속재와 수지 피막 간의 열팽창시 범퍼 기능을 활성화시킬 수 있다. According to one embodiment, the inorganic filler is 5% to 20% by weight of the second agent; 5% to 15% by weight; or 10% to 15% by weight. When included within the above range, it is possible to prevent appearance defects due to excessive use and to improve elasticity and flexibility. In addition, the bumper function can be activated during thermal expansion between the metal material and the resin film.
일 실시 예에 따라, 상기 무기충전제는 비즈, 플레이크, 섬유, 필라멘트, 판상 및 분말 중 적어도 하나 이상의 형상을 포함하고, 상기 무기충전제는 0.1 ㎛ 내지 50 ㎛; 0.1 ㎛ 내지 35 ㎛; 0.1 ㎛ 내지 30 ㎛; 0.1 ㎛ 내지 20 ㎛; 0.3 ㎛ 내지 20 ㎛; 0.5 ㎛ 내지 10 ㎛의 평균 크기를 갖는 입자를 포함할 수 있다. 여기서 크기는 입자의 형태에 따라 길이, 두께, 직경, 반경 등일 수 있고, 예를 들어, 평균 입경일 수 있다. According to one embodiment, the inorganic filler includes at least one shape of beads, flakes, fibers, filaments, plates, and powders, and the inorganic filler has a thickness of 0.1 μm to 50 μm; 0.1 μm to 35 μm; 0.1 μm to 30 μm; 0.1 μm to 20 μm; 0.3 μm to 20 μm; It may include particles having an average size of 0.5 μm to 10 μm. Here, the size may be length, thickness, diameter, radius, etc. according to the shape of the particle, and may be, for example, an average particle diameter.
일 실시 예에 따라, 상기 무기충전제는 상기 제2 제 내에서 분산 안정성을 확보하기 위해서 유기산(organic acid), 실란(예: 알킬 실란), 아미노산(amino acids), 카르복실산(carboxylic acids), 폴리아민(polyamines), 암모니아계 화합물(ammonia based compounds) 및 제4 암모늄 화합물(quaternary ammonium compounds)으로 이루어진 군에서 선택된 적어도 1종 또는 2종 이상으로 표면 처리된 것일 수 있다. 바람직하게는 유기산으로 표면 처리된 입자를 포함할 수 있다. 예를 들어, 상기 유기산은 옥살산, 말산, 말레산, 말론산, 포름산, 락트산, 아세트산, 피콜린산, 시트르산, 숙신산, 타르타르산, 글루타르산, 글루타민산, 글리콜산, 프로피온산, 푸마르산, 살리실산, 피멜린산, 벤조산, 부티르산, 아스파라긴산, 술폰산 및 프탈산으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 바람직하게는 상기 유기산으로 표면 처리된 입자는 입자 100 중량부에 대해 0.01 중량부 내지 5 중량부; 0.01 중량부 내지 2 중량부; 또는 0.1 중량부 내지 1 중량부의 유기산을 포함할 수 있다. According to one embodiment, the inorganic filler may be selected from organic acids, silanes (eg, alkyl silanes), amino acids, carboxylic acids, It may be surface-treated with at least one or two or more selected from the group consisting of polyamines, ammonia based compounds, and quaternary ammonium compounds. Preferably, it may include particles surface-treated with an organic acid. For example, the organic acid is oxalic acid, malic acid, maleic acid, malonic acid, formic acid, lactic acid, acetic acid, picolinic acid, citric acid, succinic acid, tartaric acid, glutaric acid, glutamic acid, glycolic acid, propionic acid, fumaric acid, salicylic acid, pimelin It may include one or two or more selected from the group consisting of acid, benzoic acid, butyric acid, aspartic acid, sulfonic acid, and phthalic acid. Preferably, the surface-treated particles with the organic acid is 0.01 to 5 parts by weight based on 100 parts by weight of the particles; 0.01 parts by weight to 2 parts by weight; Alternatively, 0.1 part by weight to 1 part by weight of an organic acid may be included.
일 실시 예에 따라, 상기 무기충전제는 금속; 준금속; 금속, 준금속 또는 이 둘의 산화물, 질화물, 수산화물, 카바이드, 탄산염, 규산염, 수화물, 이산화물, 인산염 및 과산화물; 광물 및 합금 중 적어도 하나 이상을 포함할 수 있다. 예를 들어, 실리콘, 알루미늄, 갈륨, 주석, 코발트, 세륨, 철, 바륨, 게르늄, 마그네슘, 니켈, 구리, 아연, 바나듐, 칼슘, 티타늄, 망간, 지르코늄 및 하프늄 중 선택된 1종 이상의 산화물, 질화물, 수산화물 및 카바이드; 로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. 예를 들어, 상기 무기충전제는 스테인리스강, 실리콘 카바이드, 그래핀, 그라파이트, 탈타늄 카바이드, 질화알루미늄, 침강 탄산칼슘, 고령토, 규산알루미늄, 실리카, 알루미나, 세리아, 지르코니아, 티타니아, 바륨티타니아, 게르마니아, 망가니아, 마그네시아, 이산화 티타늄, 새틴 화이트(satin white), 돌로마이트(dolomite), 운모(mica), 알루미늄 플레이크류, 벤토나이트(bentonite), 금홍석(rutile), 수산화 마그네슘, 석고, 판상 규산염류(sheet silicates), 탈크(talcum), 규산 칼슘; 및 티타늄, 지르코늄 또는 하프늄의 산화물, 질화물, 수산화물 및 카바이드;로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함할 수 있다. According to one embodiment, the inorganic filler is a metal; metalloid; oxides, nitrides, hydroxides, carbides, carbonates, silicates, hydrates, dioxides, phosphates and peroxides of metals, metalloids or both; It may include at least one or more of a mineral and an alloy. For example, at least one oxide or nitride selected from among silicon, aluminum, gallium, tin, cobalt, cerium, iron, barium, germanium, magnesium, nickel, copper, zinc, vanadium, calcium, titanium, manganese, zirconium, and hafnium. , hydroxides and carbides; It may include one or two or more selected from the group consisting of. For example, the inorganic filler is stainless steel, silicon carbide, graphene, graphite, tartanium carbide, aluminum nitride, precipitated calcium carbonate, kaolin, aluminum silicate, silica, alumina, ceria, zirconia, titania, barium titania, germania, mangania, magnesia, titanium dioxide, satin white, dolomite, mica, aluminum flakes, bentonite, rutile, magnesium hydroxide, gypsum, sheet silicates ), talcum, calcium silicate; And titanium, zirconium or hafnium oxides, nitrides, hydroxides and carbides; may include one or more selected from the group consisting of.
일 실시 예에 따라, 상기 수지 코팅제는 아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체를 포함하고, 잔량의 용제 및 첨가제를 더 포함할 수 있다. 상기 아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체는 상기 수지 코팅제는 1 중량% 내지 99 중량%; 10 중량% 내지 95 중량%; 30 중량% 내지 90 중량%; 50 중량% 내지 90 중량%; 70 중량% 내지 90 중량%; 또는 80 중량% 내지 90 중량%일 수 있다. 상기 범위 내에 포함되면 제2 제와 호환성과 접착성이 좋고, 공압출 공정 이후에 외관 불량, 안정성이 저하되는 것을 방지할 수 있다. According to one embodiment, the resin coating agent may include an acrylate compound-styrene-acrylonitrile copolymer, and may further include a residual amount of a solvent and an additive. The acrylate compound-styrene-acrylonitrile copolymer is 1% to 99% by weight of the resin coating agent; 10% to 95% by weight; 30% to 90% by weight; 50% to 90% by weight; 70% to 90% by weight; or 80% to 90% by weight. When included within the above range, compatibility and adhesion with the second agent are good, and poor appearance and deterioration in stability after the co-extrusion process can be prevented.
일 실시 예에 따라, 상기 수지 코팅제는 잔량 또는 1 중량% 내지 99 중량%의 용제를 더 포함할 수 있다. 예를 들어, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노프로필에테르 및 에틸렌글리콜모노부틸에테르와 같은 에틸렌글리콜모노알킬에테르류; 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜디에틸에테르, 디에틸렌글리콜에틸메틸에테르, 디에틸렌글리콜디프로필에테르, 디에틸렌글리콜디부틸에테르 등의 디에틸렌글리콜디알킬에테르류; 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 에틸렌글리콜모노부틸에테르아세테이트, 에틸렌글리콜모노에틸에테르아세테이트 등의 에틸렌글리콜알킬에테르아세테이트류; 프로필렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노에틸에테르아세테이트, 프로필렌글리콜모노프로필에테르아세테이트, 메톡시부틸아세테이트, 메톡시펜틸아세테이트 등의 알킬렌글리콜알킬에테르아세테이트류; 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노에틸에테르, 프로필렌글리콜모노프로필에테르, 프로필렌글리콜모노부틸에테르 등의 프로필렌글리콜모노알킬에테르류; 프로필렌글리콜디메틸에테르, 프로필렌글리콜디에틸에테르, 프로필렌글리콜에틸메틸에테르, 프로필렌글리콜디프로필에테르프로필렌글리콜프로필메틸에테르, 프로필렌글리콜에틸프로필에테르 등의 프로필렌글리콜디알킬에테르류; 프로필렌글리콜메틸에테르프로피오네이트, 프로필렌글리콜에틸에테르프로피오네이트, 프로필렌글리콜프로필에테르프로피오네이트, 프로필렌글리콜부틸에테르프로피오네이트 등의 프로필렌글리콜알킬에테르프로피오네이트류; 메톡시부틸알코올, 에톡시부틸알코올, 프로폭시부틸알코올, 부톡시부틸알코올 등의 부틸디올모노알킬에테르류; 메톡시부틸아세테이트, 에톡시부틸아세테이트, 프로폭시부틸아세테이트, 부톡시부틸아세테이트 등의 부탄디올모노알킬에테르아세테이트류; 메톡시부틸프로피오네이트, 에톡시부틸프로피오네이트, 프로폭시부틸프로피오네이트, 부톡시부틸프로피오네이트 등의 부탄디올모노알킬에테르프로피오네이트류; 디프로필렌글리콜디메틸에테르, 디프로필렌글리콜디에틸에테르, 디프로필렌글리콜메틸에틸에테르 등의 디프로필렌글리콜디알킬에테르류; 벤젠, 톨루엔, 자일렌, 메시틸렌 등의 방향족 탄화수소류; 메틸에틸케톤, 아세톤, 메틸아밀케톤, 메틸이소부틸케톤, 시클로헥사논 등의 케톤류; 에탄올, 프로판올, 부탄올, 헥산올, 시클로헥산올, 에틸렌글리콜, 글리세린 등의 알코올류; 아세트산메틸, 아세트산에틸, 아세트산프로필, 아세트산부틸, 2-히드록시프로피온산에틸, 2-히드록시-2-메틸프로피온산메틸, 2-히드록시-2-메틸프로피온산에틸, 히드록시아세트산메틸, 히드록시아세트산에틸, 히드록시아세트산부틸, 락트산메틸, 락트산에틸, 락트산프로필, 락트산부틸, 3-히드록시프로피온산메틸, 3-히드록시프로피온산에틸, 3-히드록시프로피온산프로필, 3-히드록시프로피온산부틸, 2-히드록시-3-메틸부탄산메틸, 메톡시아세트산메틸, 메톡시아세트산에틸, 메톡시아세트산프로필, 메톡시아세트산부틸, 에톡시아세트산메틸, 에톡시아세트산에틸, 에톡시아세트산프로필, 에톡시아세트산부틸, 프로폭시아세트산메틸, 프로폭시아세트산에틸, 프로폭시아세트산프로필, 프로폭시아세트산부틸, 부톡시아세트산메틸, 부톡시아세트산에틸, 부톡시아세트산프로필, 부톡시아세트산부틸, 2-메톡시프로피온산메틸, 2-메톡시프로피온산에틸, 2-메톡시프로피온산프로필, 2-메톡시프로피온산부틸, 2-에톡시프로피온산메틸, 2-에톡시프로피온산에틸, 2-에톡시프로피온산프로필, 2-에톡시프로피온산부틸, 2-부톡시프로피온산메틸, 2-부톡시프로피온산에틸, 2-부톡시프로피온산프로필, 2-부톡시프로피온산부틸, 3-메톡시프로피온산메틸, 3-메톡시프로피온산에틸, 3-메톡시프로피온산프로필, 3-메톡시프로피온산부틸, 3-에톡시프로피온산메틸, 3-에톡시프로피온산에틸, 3-에톡시프로피온산프로필, 3-에톡시프로피온산부틸, 3-프로폭시프로피온산메틸, 3-프로폭시프로피온산에틸, 3-프로폭시프로피온산프로필, 3-프로폭시프로피온산부틸, 3-부톡시프로피온산메틸, 3-부톡시프로피온산에틸, 3-부톡시프로피온산프로필, 3-부톡시프로피온산부틸 등의 에스테르류; 테트라히드로푸란, 피란 등의 고리형 에테르류; 및 γ-부티로락톤 등의 고리형 에스테르류에서 선택된 1종 또는 2종 이상을 포함할 수 있다. According to one embodiment, the resin coating agent may further include a residual amount or 1% to 99% by weight of a solvent. ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dipropyl ether, and diethylene glycol dibutyl ether; ethylene glycol alkyl ether acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monoethyl ether acetate; alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether, propylene glycol propyl methyl ether, and propylene glycol ethyl propyl ether; propylene glycol alkyl ether propionates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, and propylene glycol butyl ether propionate; butyldiol monoalkyl ethers such as methoxybutyl alcohol, ethoxybutyl alcohol, propoxybutyl alcohol, and butoxybutyl alcohol; butanediol monoalkyl ether acetates such as methoxybutyl acetate, ethoxybutyl acetate, propoxybutyl acetate and butoxybutyl acetate; butanediol monoalkyl ether propionates such as methoxybutyl propionate, ethoxybutyl propionate, propoxybutyl propionate, and butoxybutyl propionate; dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, and dipropylene glycol methyl ethyl ether; Aromatic hydrocarbons, such as benzene, toluene, xylene, and mesitylene; ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin; Methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, 2-hydroxy-2-methylmethylpropionate, 2-hydroxy-2-methylethylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate , Butyl hydroxyacetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, 2-hydroxy -3-methylbutanoate, methoxymethylacetate, methoxyethylacetate, methoxyacetate propyl, methoxybutylacetate, ethoxymethylacetate, ethoxyethylacetate, ethoxyacetatepropyl, ethoxyacetatebutyl, propoxy Methyl acetate, ethyl propoxyacetate, propyl propoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, 2-methoxymethylpropionate, 2-methoxypropionic acid Ethyl, 2-methoxypropylpropionate, 2-methoxybutylpropionate, 2-ethoxymethylpropionate, 2-ethoxyethylpropionate, 2-ethoxypropylpropionate, 2-ethoxybutylpropionate, 2-butoxymethylpropionate , 2-butoxyethylpropionate, 2-butoxypropylpropionate, 2-butoxybutylpropionate, 3-methoxymethylpropionate, 3-methoxyethylpropionate, 3-methoxypropylpropionate, 3-methoxybutylpropionate, 3-ethoxymethylpropionate, 3-ethoxyethylpropionate, 3-ethoxypropylpropionate, 3-ethoxybutylpropionate, 3-propoxymethylpropionate, 3-propoxyethylpropionate, 3-propoxypropylpropionate, 3 -Esters such as butyl propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, and butyl 3-butoxypropionate; cyclic ethers such as tetrahydrofuran and pyran; And γ-butyrolactone may include one or more selected from cyclic esters.
일 실시 예에 따라, 상기 수지 코팅제는 필요에 따라 염료 등과 같은 기타 첨가제를 더 포함할 수 있으나, 본 문서에는 구체적으로 언급하지 않는다. According to one embodiment, the resin coating agent may further include other additives such as dyes as needed, but this document does not specifically mention them.
일 실시 예에 따라, 본 발명의 금속 제품은, 본 발명의 일 실시예 들에 따른, 금속재 코팅 키트로 제조된 것으로, 상기 금속 제품은 금속재; 상기 금속재 상에 상기 제1 제를 코팅하여 형성된 제1 층; 상기 제1 층 상에 제2 층; 및 상기 제2 층 상에 수지 피막층;을 포함할 수 있다. According to one embodiment, the metal product of the present invention is manufactured with a metal material coating kit according to one embodiment of the present invention, the metal product includes a metal material; a first layer formed by coating the first agent on the metal material; a second layer on the first layer; and a resin coating layer on the second layer.
일 실시 예에 따라, 상기 제1 층은 상기 금속재 상에 상기 제1 제를 도포(또는, 코팅)하여 형성된 것일 수 있다. 예를 들어, 분사 코팅(예: 초음파 분사), 스핀 코팅, 압출 등을 이용할 수 있다. 예를 들어, 상기 제1 층은 상기 제2 층과 상기 금속재을 안정적으로 결합시키고, 열적 안정성이 우수한 접착제층일 수 있다. According to one embodiment, the first layer may be formed by applying (or coating) the first agent on the metal material. For example, spray coating (eg, ultrasonic spray), spin coating, extrusion, and the like may be used. For example, the first layer may be an adhesive layer that stably bonds the second layer and the metal material and has excellent thermal stability.
일 실시 예에 따라, 상기 제1 층의 두께는, 0.5 ㎛ 내지 50 ㎛; 0.5 ㎛ 내지 30 ㎛; 0.5 ㎛ 내지 20 ㎛; 또는 1 ㎛ 내지 10 ㎛일 수 있다. 상기 두께 범위 내에 포함되면 금속재 상에 균일하게 도포되고 제2 제와 접착력을 향상시키면서 수지 피막의 안정성을 유지할 수 있다. According to one embodiment, the thickness of the first layer, 0.5 ㎛ to 50 ㎛; 0.5 μm to 30 μm; 0.5 μm to 20 μm; Or it may be 1 μm to 10 μm. When it is included within the above thickness range, it is uniformly applied on the metal material and the stability of the resin film can be maintained while improving the adhesion with the second agent.
일 실시 예에 따라, 상기 제1 제를 상기 금속재 표면 상에 도포(또는, 코팅)한 이후에 1차 가열할 수 있으며, 이는 하기에 보다 구체적으로 설명한다. 일 실시 예에 따라, 상기 제1 층이 코팅된 금속재를 압출기 내에서 제2 제 및 수지 코팅제를 공중압출(예: 이중압출)하여 상기 제1 층 상에 형성된 제2 층 및 상기 제2 층상에 형성된 수지 피막층을 형성할 수 있다. According to an embodiment, after applying (or coating) the first agent on the surface of the metal material, the first agent may be heated, which will be described in more detail below. According to an embodiment, the second layer formed on the first layer and the second layer formed on the second layer by air-extruding (eg, double extrusion) the second agent and the resin coating agent on the metal material coated with the first layer in an extruder. The formed resin film layer can be formed.
일 실시 예에 따라, 상기 제1 층이 코팅된 금속재를 고주파 가열기를 이용하여 120 ℃ 내지 300 ℃; 150 ℃ 내지 250 ℃; 또는 180 ℃ 내지 200 ℃ 온도로 가열할 수 있다. 또한, 상기 온도에서 1 분 내지 12 시간; 5 분 내지 10 시간; 또는 10 분 내지 5 시간 동안 1차 가열(또는, 유지)할 수 있다. 다음으로, 가열 처리된 상기 제1 층이 코팅된 금속재를 제2 제 및 수지 코팅제로 이중압출할 수 있다. 예를 들어, 이중압출 공정에서 온도(예, ASA의 가공 온도)는 상기 1차 가열 온도와 동일하거나 더 높을 수 있다. 예를 들어, 180 ℃ 이상; 또는 180 ℃ 내지 250 ℃일 수 있다. 다음으로, 이중압출 이후에 압출기에서 벗어난 금속재는 80 ℃ 내지 150 ℃ 미만; 80 ℃ 내지 140 ℃; 80 ℃ 내지 120 ℃; 80 ℃ 내지 100 ℃; 또는 90 ℃ 내지 100 ℃ 온도에서 10 분 이상; 30 분 이상; 1 시간 내지 12 시간; 1 시간 내지 10 시간; 또는 2 시간 내지 5 시간 동안 2차 가열(예: 유지)할 수 있다. 상기 1차 가열 온도는 상기 2차 가열 온도 보다 높을 수 있다. 상기 언급된 1차 가열 및 2차 가열을 적용하여 균일한 피막의 형성과 수지 피막의 공압출 공정을 원활하게 진행할 수 있다. 더욱이, 수지 피막의 벗겨짐, 갈라짐 등을 방지하여 막의 안정성을 확보할 수 있다. According to one embodiment, the metal material coated with the first layer is heated to 120 ° C to 300 ° C using a high-frequency heater; 150 °C to 250 °C; Alternatively, it may be heated to a temperature of 180 °C to 200 °C. Also, 1 minute to 12 hours at the above temperature; 5 minutes to 10 hours; Alternatively, it may be heated (or maintained) for 10 minutes to 5 hours. Next, the heat-treated metal material coated with the first layer may be double-extruded with a second agent and a resin coating agent. For example, the temperature (eg, processing temperature of ASA) in the double extrusion process may be the same as or higher than the first heating temperature. For example, 180 ° C or higher; or 180 °C to 250 °C. Next, the metal material coming out of the extruder after double extrusion has a temperature of 80 ° C to less than 150 ° C; 80 °C to 140 °C; 80 °C to 120 °C; 80 °C to 100 °C; or at least 10 minutes at a temperature of 90° C. to 100° C.; more than 30 minutes; 1 hour to 12 hours; 1 hour to 10 hours; Alternatively, secondary heating (eg, maintenance) may be performed for 2 to 5 hours. The first heating temperature may be higher than the second heating temperature. By applying the above-mentioned primary heating and secondary heating, the formation of a uniform film and the coextrusion process of the resin film can be smoothly performed. Moreover, it is possible to secure film stability by preventing peeling and cracking of the resin film.
일 실시 예에 따라, 일 실시 예에 따라, 상기 제2 층의 두께는 0.5 ㎛ 내지 200 ㎛; 1 ㎛ 내지 200 ㎛; 2 ㎛ 내지 150 ㎛; 5 ㎛ 내지 100 ㎛; 10 ㎛ 내지 90 ㎛; 또는 20 ㎛ 내지 60 ㎛이고, 상기 수지 피막층의 두께는, 0.5 ㎛ 이상; 0.5 ㎛ 내지 2,000 ㎛; 1 ㎛ 내지 2,000 ㎛; 5 ㎛ 내지 1,000 ㎛; 10 ㎛ 내지 900 ㎛; 20 ㎛ 내지 800 ㎛; 30 ㎛ 내지 700 ㎛; 30 ㎛ 내지 500 ㎛; 40 ㎛ 내지 300 ㎛; 40 ㎛ 내지 200 ㎛; 40 ㎛ 내지 100 ㎛; 또는 40 ㎛ 내지 60 ㎛일 수 있다. 상기 제1 층, 제2 층 및 수지 피막층은 동일하거나 상이한 두께를 형성할 수 있다. 예를 들어, 제1 층: 제2 층: 수지 피막층의 두께비는 1 : 1 내지 20 : 1 내지 200; 1 : 1 내지 5 : 5 내지 100; 또는 1 : 1 내지 3 : 10 내지 50일 수 있다. 상기 두께비 범위 내에 포함되면 제1 층에 의한 제2 층의 접착력이 향상되고, 제2 층과 수지 피막층 간의 호환성 및 열팽창시 버퍼 기능을 향상시킬 수 있다. According to one embodiment, according to one embodiment, the thickness of the second layer is 0.5 ㎛ to 200 ㎛; 1 μm to 200 μm; 2 μm to 150 μm; 5 μm to 100 μm; 10 μm to 90 μm; or 20 μm to 60 μm, and the thickness of the resin film layer is 0.5 μm or more; 0.5 μm to 2,000 μm; 1 μm to 2,000 μm; 5 μm to 1,000 μm; 10 μm to 900 μm; 20 μm to 800 μm; 30 μm to 700 μm; 30 μm to 500 μm; 40 μm to 300 μm; 40 μm to 200 μm; 40 μm to 100 μm; Or it may be 40 μm to 60 μm. The first layer, the second layer and the resin film layer may have the same or different thicknesses. For example, the thickness ratio of the first layer: the second layer: the resin coating layer is 1:1 to 20:1 to 200; 1:1 to 5:5 to 100; or 1:1 to 3:10 to 50. When included within the thickness ratio range, the adhesion of the second layer by the first layer may be improved, and compatibility between the second layer and the resin coating layer and a buffer function during thermal expansion may be improved.
일 실시 예에 따라, 상기 제2 층은 유연성 및 탄성을 가지면서 높은 경도 및 우수한 내열성을 가질 수 있다. 상기 제2 층의 경도는 80 이상; 85 이상; 또는 95 이상일 수 있다. 여기서, 경도는 로크웰 표면경도(Rockwell Superficial Hardness, 표준 측정 방법 적용, 15 N, 30 N 또는 45 N 기준)일 수 있다. According to one embodiment, the second layer may have high hardness and excellent heat resistance while having flexibility and elasticity. The hardness of the second layer is 80 or more; 85 or higher; or 95 or greater. Here, the hardness may be Rockwell Superficial Hardness (standard measurement method applied, based on 15 N, 30 N, or 45 N).
일 실시 예에 따라, 상기 제2 층의 열팽창계수는, 50 ppm/℃ 이하; 30 ppm/℃ 이하; 25 ppm/℃ 이하 또는 0 초과 내지 50 ppm/℃ (20 ℃ 내지 100 ℃)일 수 있다. 일 실시 예에 따라, 상기 금속재와 상기 제2 층의 열팽창 계수(CTE)의 차이는 ± 20 ppm/℃ 이하; ± 10 ppm/℃이하; ± 5 ppm/℃ 이하; 또는 ± 2 ppm/℃ 이하; ± 1 ppm/℃ 이하(20 ℃ 내지 100 ℃); 인 것일 수 있다. 상기 열팽창 계수 값 또는 열팽창 계수 차이에 의해서 수지 피막층의 고온의 공압출 공정에 의한 금속 제품의 제작이 가능하고, 수지 피막층의 접착 안정성을 향상시킬 수 있다. According to one embodiment, the thermal expansion coefficient of the second layer, 50 ppm / ℃ or less; 30 ppm/° C. or less; up to 25 ppm/°C or greater than 0 to 50 ppm/°C (20°C to 100°C). According to one embodiment, the difference between the coefficient of thermal expansion (CTE) of the metal material and the second layer is ± 20 ppm / ℃ or less; ± 10 ppm/°C or less; ± 5 ppm/° C. or less; or ± 2 ppm/° C. or less; ± 1 ppm/°C or less (20°C to 100°C); may be Due to the thermal expansion coefficient value or the difference in thermal expansion coefficient, it is possible to manufacture a metal product by a high-temperature co-extrusion process of the resin coating layer, and it is possible to improve the adhesion stability of the resin coating layer.
실시예Example
제조예 1Preparation Example 1
제1 제는 메틸벤젠(34 중량%), 2-부탄온(20 중량%), 메탄올(30 중량%) 및 변성 아크릴 폴리머(16 중량%, 실리콘 변성 아크릴 수지)를 혼합하여 제조하였다.The first agent was prepared by mixing methylbenzene (34% by weight), 2-butanone (20% by weight), methanol (30% by weight) and a modified acrylic polymer (16% by weight, silicone-modified acrylic resin).
제2 제는 PVC 52.8 중량%, 제2 고분자 20 중량%(폴리디(2-에틸헥실)글리콜아디페이트; MW 95,000), 가소제 7.5 중량%(폴리사이클로 펜타디엔), 안정제 2.5 중량%(리시놀레산 칼슘염), 고내열 안정제 1.5 중량%(2-머캅토벤즈이미다졸), 산화방지제 0.25 중량%(2,2'-메틸렌비스(4-메틸-6-tert-부틸페놀), UV 안정제 0.3 중량%(벤조트리아졸), 무기충전제 15 중량%(질화알루미늄) 및 활제 0.15 중량%(염화파라핀)를 컴파운딩하여 제조하였다. The second agent is PVC 52.8% by weight, second polymer 20% by weight (polydi (2-ethylhexyl) glycol adipate; MW 95,000), plasticizer 7.5% by weight (polycyclopentadiene), stabilizer 2.5% by weight (lysi oleic acid calcium salt), high heat-resistant stabilizer 1.5% by weight (2-mercaptobenzimidazole), antioxidant 0.25% by weight (2,2'-methylenebis (4-methyl-6-tert-butylphenol), UV stabilizer It was prepared by compounding 0.3% by weight (benzotriazole), 15% by weight (aluminum nitride) of an inorganic filler and 0.15% by weight (chlorinated paraffin) of a lubricant.
제조예 2Preparation Example 2
고내열 안정제로 2-tert-부틸-4-메톡시페놀을 이용한 것 외에는 제조예 1과 동일하게 제1 제 및 제2 제를 제조하였다.A first agent and a second agent were prepared in the same manner as in Preparation Example 1, except that 2-tert-butyl-4-methoxyphenol was used as a high heat-resistant stabilizer.
제조예 3Preparation Example 3
고내열 안정제로 2-tert-부틸-4-메톡시페놀 : 2-머캅토벤즈이미다졸 : 페닐디이소데실 인산염(1 : 0.1: 0.5 질량비)를 적용한 것 외에는 제조예 1과 동일하게 제1 제 및 제2 제를 제작하였다.The first agent was prepared in the same manner as in Preparation Example 1 except that 2-tert-butyl-4-methoxyphenol: 2-mercaptobenzimidazole: phenyldiisodecyl phosphate (1: 0.1: 0.5 mass ratio) was applied as a high heat-resistant stabilizer. and a second agent were prepared.
제조예 4 Production Example 4
무기충전제를 피콜린산(0.1 중량%)로 표면 코팅된 티타니아를 적용한 것 외에는 제조예 1과 동일하게 제1 제 및 제2 제를 제작하였다.A first agent and a second agent were prepared in the same manner as in Preparation Example 1, except that titania surface-coated with picolinic acid (0.1% by weight) was applied as the inorganic filler.
(실시예 1)(Example 1)
금속관 코팅 제품의 제작 Production of metal pipe coating products
제조예 1의 제1 제 및 제2 제를 이용하고, ASA 수지(단독 구성)을 이용하여 금속관에 공압출하여 금속 제품을 제작하였다. A metal product was produced by co-extruding the first agent and the second agent of Production Example 1 into a metal pipe using an ASA resin (single component).
금속관(스레인리스 강, KS(JIS) 301, 열팽창 계수: 16.9 ~ 17.0 x 10-6/℃ (20 ℃ 내지 100 ℃)을 준비하였다. A metal tube (stainless steel, KS (JIS) 301, coefficient of thermal expansion: 16.9 to 17.0 x 10 −6 /° C. (20° C. to 100° C.) was prepared.
압출기 시스템에서 금속관을 인출기를 이용하여 이송하여 세척하고 제1 제(접착제)를 분사 코팅하였다. 다음으로, 고주파 가열기를 이용하여 금속관을 120 ℃ 온도 이상으로 예열하고 금형에 삽입하였다. 압출 금형에는 제2 제(중간층) 압출기 및 ASA 수지 압출기가 연결되어 있고, ASA 수지의 가공 온도인 180 ℃ 이상에서 중간층 및 ASA 수지층을 이중압출하였다. In the extruder system, the metal tube was transported using an extractor, washed, and spray-coated with a first agent (adhesive). Next, the metal tube was preheated to a temperature of 120° C. or higher using a high-frequency heater and inserted into a mold. A second (intermediate layer) extruder and an ASA resin extruder were connected to the extrusion mold, and the middle layer and the ASA resin layer were double-extruded at 180° C. or higher, which is the processing temperature of the ASA resin.
금속 제품은 제1층 1 ㎛, 제2층 100 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다. The metal product was formed with a thickness of 1 μm for the first layer, 100 μm for the second layer, and 200 μm for the resin coating layer.
(실시예 2) (Example 2)
제조예 2의 제1 제 및 제2 제를 이용한 것 외에는 실시예 1과 동일한 방법으로 금속 제품을 제조하였다. 금속 제품은 제1 층 1 ㎛, 제2 층 100 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다. A metal product was manufactured in the same manner as in Example 1 except for using the first and second agents of Preparation Example 2. The metal product was formed with a first layer of 1 μm, a second layer of 100 μm, and a resin coating layer of 200 μm.
(실시예 3) (Example 3)
제조예 3의 제1 제 및 제2 제를 이용한 것 외에는 실시예 1과 동일한 방법으로 금속 제품을 제조하였다. 금속 제품은 제1 층 1 ㎛, 제2 층 100 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다. A metal product was manufactured in the same manner as in Example 1 except for using the first and second agents of Preparation Example 3. The metal product was formed with a first layer of 1 μm, a second layer of 100 μm, and a resin coating layer of 200 μm.
(실시예 4)(Example 4)
제조예 4의 제1 제 및 제2 제를 이용한 것 외에는 실시예 1과 동일한 방법으로 금속 제품을 제조하였다. 금속 제품은 제1 층 1 ㎛, 제2 층 100 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다. A metal product was manufactured in the same manner as in Example 1 except for using the first and second agents of Preparation Example 4. The metal product was formed with a first layer of 1 μm, a second layer of 100 μm, and a resin coating layer of 200 μm.
(비교예 1)(Comparative Example 1)
제1 제를 적용하지 않을 뿐 실시예 1과 동일한 방법으로 금속관에 수지 피막층을 형성하여 금속 제품을 제조하였다. 금속 제품은 제2 층 100 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다.A metal product was manufactured by forming a resin coating layer on a metal pipe in the same manner as in Example 1, except that the first agent was not applied. The metal product was formed with a second layer of 100 μm and a resin coating layer of 200 μm.
(비교예 2)(Comparative Example 2)
제2 제를 적용하지 않을 뿐 실시예 1과 동일한 방법으로 금속관에 수지 피막층을 형성하여 금속 제품을 제조하였다. 금속 제품은 제1 층 1 ㎛ 및 수지 피막층 200 ㎛ 두께로 형성하였다.A metal product was manufactured by forming a resin coating layer on a metal pipe in the same manner as in Example 1, except that the second agent was not applied. The metal product was formed with a first layer of 1 μm and a resin film layer of 200 μm in thickness.
열팽창 계수(CTE)의 측정Measurement of Coefficient of Thermal Expansion (CTE)
본 기술분야에서 알려진 표준 방법으로 이용하여 측정할 수 있다. 예를 들어, 평가용 제2 제의 경화된 필름을 폭 약 5 mm, 길이 약 15 mm로 절단하여, 시험편을 얻었다. 시험편에 대해, 열 기계 분석 장치(리가쿠사 제조 「Thermo Plus TMA8310」)를 사용하여, 인장 가중법으로 열 기계 분석을 행하였다. 상세하게는, 시험편을 상기 열 기계 분석 장치에 장착한 후, 하중 1g, 승온 속도 5℃/분의 측정 조건으로 연속하여 2회 열팽창율을 측정하였다. 다은으로, 2회째의 측정 결과에 기초하여, 25℃(298K)에서 150℃(423K)까지의 범위에서의 열팽창 계수 α(ppm/℃)를 산출하였다. 제조예 1 내지 제조예 4의 제2 제의 샘플은 약 20 내지 23 (ppm/℃)의 열팽창 계수를 획득하였다. It can be measured using a standard method known in the art. For example, the cured film of the second agent for evaluation was cut to a width of about 5 mm and a length of about 15 mm to obtain a test piece. About the test piece, thermomechanical analysis was performed by the tensile weighting method using the thermomechanical analyzer ("Thermo Plus TMA8310" by Rigaku). Specifically, after the test piece was mounted in the thermomechanical analyzer, the coefficient of thermal expansion was measured twice continuously under the measurement conditions of a load of 1 g and a heating rate of 5°C/min. Next, based on the second measurement result, the thermal expansion coefficient α (ppm/°C) in the range from 25°C (298K) to 150°C (423K) was calculated. The second samples of Production Examples 1 to 4 obtained thermal expansion coefficients of about 20 to 23 (ppm/°C).
고온저장시험(HTS ((High Thermal Storage test) 시험) High Thermal Storage test (HTS (High Thermal Storage test))
본 기술분야에서 알려진 표준 방법을 이용하여 고온저장시험을 진행하였다. A high temperature storage test was performed using a standard method known in the art.
실시예 1 내지 실시예 4 및 비교예 1 내지 비교예 2의 금속 제품의 시편을 제작하고 HTS 시험(High Thermal Storage test)에 제공하였다. 기본적으로 150 ℃ /1000 h 조건을 기준으로 평가하였다. Specimens of the metal products of Examples 1 to 4 and Comparative Examples 1 to 2 were prepared and submitted to the HTS test (High Thermal Storage test). Basically, it was evaluated based on the 150 ° C. / 1000 h condition.
균열 내성 시험 crack resistance test
실시예 1 내지 실시예 4 및 비교예 1 내지 비교예 2의 금속 제품의 시편을 제작하고, 시험편을, -30 ℃ 30분/(상온; 25 ℃)/150 ℃ 30분을 1 사이클로서 1,000 사이클 반복 후, 외관을 육안으로 관찰하고, 이하의 기준으로 평가하였다. Specimens of the metal products of Examples 1 to 4 and Comparative Examples 1 to 2 were prepared, and the test pieces were subjected to 1,000 cycles of -30 ° C. 30 minutes / (room temperature; 25 ° C.) / 150 ° C. 30 minutes as one cycle. After repetition, the appearance was visually observed and evaluated according to the following criteria.
제조된 금속 제품은 균열 내성 실험에서 수지 코팅막의 상태(벗겨짐, 크랙) 등을 육안 및 광학현미경으로 관찰하였다. The manufactured metal products were observed with the naked eye and an optical microscope for the state (peeling, cracks) of the resin coating film in the crack resistance test.
본 발명에 따른 제1 제 및 제2 제를 사용하여 수지 피막을 공압출할 경우 제조된 금속 제품에서 수지 피막의 벗겨짐, 크랙, 깨짐이 발생되지 않았으나, 비교예 1 및 비교예 2의 제품은 수지 피막이 균일하지 않거나 외관이 불량하였다. When the resin film was co-extruded using the first agent and the second agent according to the present invention, peeling, cracking, or cracking of the resin film did not occur in the manufactured metal product, but the products of Comparative Examples 1 and 2 were made of resin. The film was not uniform or the appearance was poor.
또한, 고온저장시험 및 균열 내성 시험 결과 실시예 1 내지 실시예 4는 외관 관찰에서 벗겨짐, 크랙, 깨짐 발생이 관찰되지 않았다. 즉, 냉/내열 안정성이 우수하다. 하지만, 비교예 1 및 비교예 2의 제품은 고온저장시험에서 벗겨진 부분이 많고, 균열 내성 시험에서 영하 30 ℃에서 상온까지 4 싸이클 만에 깨짐 및 벗겨짐이 발생하였다. In addition, as a result of the high-temperature storage test and the crack resistance test, Examples 1 to 4 did not observe peeling, cracking, or cracking in appearance observation. That is, it has excellent cold/heat resistance stability. However, the products of Comparative Example 1 and Comparative Example 2 had many peeling parts in the high temperature storage test, and in the crack resistance test, cracking and peeling occurred in 4 cycles from -30 ° C. to room temperature.
즉, 비교예 1은 중간층의 접착성이 약하여 어느 정도의 기간이 지나면 수지 피막이 떨어지며 ASA 수지의 깨짐현상이 발생한 것이다. 또한, 비교예 2는 제1 제의 접착제를 이용한 금속관에 ASA 수지의 이중압출 공정을 진행하였으나, 두 재료의 열팽창 개수가 상이하여 어느 정도의 기간이 지나면 수지 피막 떨어지며 ASA 수지의 깨짐 현상이 발생한 것이다. That is, in Comparative Example 1, the adhesiveness of the intermediate layer was weak, and after a certain period of time, the resin film fell off and the ASA resin cracked. In Comparative Example 2, the double extrusion process of the ASA resin was performed on the metal tube using the adhesive of the first agent, but the number of thermal expansions of the two materials was different, so after a certain period of time, the resin film fell off and the ASA resin cracked. .
이에 제1 제에 의한 우수한 접착 성능으로 고온 환경(예: 고온 공압출 환경)에서 수지 피막의 벗겨짐, 크랙, 깨짐 발생을 방지할 뿐만 아니라 제2 제에 의한 금속재와 수지 피막 간의 열팽창 차이를 완화하여 수지 피막을 고르게 형성시키고 고온 환경(예: 고온 공압출 환경)에서 수지 피막의 우수한 안정성을 제공할 수 있다. Therefore, the excellent adhesive performance by the first agent not only prevents peeling, cracks, and cracking of the resin film in a high-temperature environment (eg, high-temperature co-extrusion environment), but also relieves the difference in thermal expansion between the metal material and the resin film by the second agent. It is possible to evenly form a resin film and provide excellent stability of the resin film in a high-temperature environment (eg, a high-temperature co-extrusion environment).
본 발명은, 제2 제(예: 중간층 수지)와 금속재가 안정적으로 결합할 수 있는 접착제로 활용될 수 있는 제1 제; 및 수지 피막(예: ASA 수지)과 호환 가능하고 내열 안정성이 높은 제2 제(예: 중간층 수지)를 제공할 수 있다. 또한, 제2 제(예: 중간층 수지)는 열가소성 탄성체로서, 수지 피막(예: ASA 수지)과 호환성이 좋으며 고내열 안정성을 제공할 수 있다. 즉, 금소재와 수지 피막(예: ASA 수지) 간의 열팽창 계수를 상쇄시키고, 공압출 공정(예: 2중 또는 3중 압출 공정)에 의한 접착성이 우수한 수지 피막(예: ASA 수지) 형성을 실현시킬 수 있다. The present invention, a first agent that can be utilized as an adhesive capable of stably bonding the second agent (eg, intermediate layer resin) and the metal material; and a second agent (eg, intermediate layer resin) that is compatible with the resin coating (eg, ASA resin) and has high heat resistance stability. In addition, the second agent (eg, intermediate layer resin) is a thermoplastic elastomer, and is compatible with a resin film (eg, ASA resin) and can provide high heat resistance stability. That is, it offsets the coefficient of thermal expansion between the gold material and the resin film (eg ASA resin), and forms a resin film (eg ASA resin) with excellent adhesion by a co-extrusion process (eg double or triple extrusion process). can be realized
이상 본 발명의 실시예들을 더욱 상세하게 설명하였으나, 본 발명은 반드시 이러한 실시예로 국한되는 것은 아니고, 본 발명의 기술사상을 벗어나지 않는 범위 내에서 다양하게 변형 실시될 수 있다. 따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 제한하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 제한되는 것은 아니다. 그러므로, 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 제한적이 아닌 것으로 이해해야만 한다. 본 발명의 보호 범위는 아래의 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다. Although the embodiments of the present invention have been described in more detail above, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.
Claims (15)
PVC를 포함하는 제1 고분자, 아디페이트(adipate)계 화합물을 포함하는 제2 고분자, 가소제, 안정제, 내열 안정제, 산화방지제, UV 안정제, 무기충전제 및 활제를 포함하는 제2 제; 및
아크릴레이트 화합물-스티렌-아크릴로니트릴 공중합체를 포함하는 수지 코팅제;
를 포함하는, 금속재 코팅 키트. Modified acrylic resin; methylbenzene; at least one ketone-based solvent selected from 2-butanone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; and a first agent comprising methanol;
a first polymer including PVC, a second polymer including an adipate compound, a second agent including a plasticizer, a stabilizer, a heat stabilizer, an antioxidant, a UV stabilizer, an inorganic filler, and a lubricant; and
a resin coating agent containing an acrylate compound-styrene-acrylonitrile copolymer;
Containing, a metal material coating kit.
상기 제1 제는,
변성 아크릴계 수지 1 중량% 내지 20 중량%,
메틸벤젠 10 중량% 내지 40 중량%,
케톤계 용제 10 중량% 내지 30 중량%; 및
메탄올 10 중량% 내지 40 중량%
를 포함하고,
상기 메틸벤젠 : 상기 케톤계 용제의 질량비는 1 : 1.5 내지 1 : 4인 것인,
금속재 코팅 키트. According to claim 1,
The first agent,
1% to 20% by weight of a modified acrylic resin;
10% to 40% by weight of methylbenzene;
10% to 30% by weight of a ketone solvent; and
10% to 40% by weight of methanol
including,
The methylbenzene: the mass ratio of the ketone solvent is 1: 1.5 to 1: 4,
Metallic coating kit.
상기 변성 아크릴계 수지는 에폭시 변성 스티렌 아크릴 수지, 에폭시 변성 아크릴 수지, 폴리에스테르 변성 아크릴 수지, 실리콘 변성 아크릴 수지, 폴리카보네이트 변성 아크릴 수지 및 불소 변성 아크릴 수지로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트. According to claim 1,
The modified acrylic resin includes one or more selected from the group consisting of an epoxy-modified styrene acrylic resin, an epoxy-modified acrylic resin, a polyester-modified acrylic resin, a silicone-modified acrylic resin, a polycarbonate-modified acrylic resin, and a fluorine-modified acrylic resin. To do, a metal material coating kit.
상기 제1 제는 폴리에스테르 변성 우레탄 수지, 아크릴 변성 우레탄 수지 또는 이 둘 모두를 0.1 중량% 내지 10 중량%로 더 포함하는 것인, 금속재 코팅 키트. According to claim 1,
The first agent further comprises a polyester-modified urethane resin, an acrylic-modified urethane resin, or both at 0.1% to 10% by weight, the metal material coating kit.
상기 변성 아크릴계 수지는 메틸메타크릴레이트, 하이드록실 에틸메타크릴레이트, 시크로헥실 메타크릴레이트 및 이소부틸 메타크릴레이트로 이루어진 군에서 선택된 1종 또는 2종 이상의 아크릴레이트 모노머를 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The modified acrylic resin comprises one or two or more acrylate monomers selected from the group consisting of methyl methacrylate, hydroxyl ethyl methacrylate, cyclohexyl methacrylate and isobutyl methacrylate, a metal material coating kit.
상기 제2 제는,
상기 PVC를 포함하는 제1 고분자 40 중량% 내지 70 중량%,
상기 제2 고분자 10 중량% 내지 30 중량%,
상기 가소제 1 중량% 내지 10 중량%,
상기 안정제 1 중량% 내지 10 중량%,
상기 내열 안정제 0.1 중량% 내지 5 중량%,
상기 산화방지제 0.01 중량% 내지 2 중량%,
상기 UV 안정제 0.01 중량% 내지 1 중량%,
상기 무기충전제 5 중량%내지 20 중량%, 및
상기 활제 0.01 중량% 내지 2 중량%
를 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The second agent,
40% to 70% by weight of the first polymer containing the PVC;
10% to 30% by weight of the second polymer,
1% to 10% by weight of the plasticizer,
1% to 10% by weight of the stabilizer,
0.1% to 5% by weight of the heat-resistant stabilizer;
0.01% to 2% by weight of the antioxidant,
0.01% to 1% by weight of the UV stabilizer;
5% to 20% by weight of the inorganic filler, and
0.01% to 2% by weight of the lubricant
A metal material coating kit comprising a.
상기 내열 안정제는 페놀계 내열 안정제, 황계 내열 안정제 및 인산염계 내열 안정제로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고,
상기 페놀계 내열 안정제는 2-tert-부틸-4-메톡시페놀, 2-tert-부틸-4,6-디메톡시페놀, 3,5-디-tert-부틸-4-하이드록시톨루엔, 4-하이드록시메틸-2,6-디-tert-부틸페놀, 2,4,6-트리-tert-부틸페놀, 2,2'-메틸렌-비스(4-에틸-6-tert-부틸페놀), 4,4'-부틸리덴-비스(6-tert-부틸-m-크레졸), 2,2'-메틸렌-비스(4-메틸-6-시클로헥실페놀), 4,4'-비스(2,6-디-tert-부틸페놀), 2,2'-디하이드록시-3,3'-비스(α-메틸시클로헥실)-5,5'-디메틸디페닐메탄, 4,4'-메틸렌-비스(2,6-디-tert-부틸페놀), d,l-α-토코페롤(비타민E), 2,6-비스(2-하이드록시-3-tert-부틸-5-메틸벤질)-4-메틸페놀, 3-(4-하이드록시-3,5-디-tert-부틸페닐)프로피온산 n-옥타데실, 1,3,5-트리스(4-tert-부틸-3-하이드록시-2,6-디메틸벤질)-s-트리아진-2,4,6-(1H, 3H,5H)-트리온, 1,3,5-트리메틸-2,4,6-트리스(3,5-디-tert-부틸-4-하이드록시페닐)벤질벤젠, 1,3,5-트리스(4-하이드록시-3,5-디-tert-부틸벤질)-s-트리아진-2,4,6-(1H,3H,5H)-트리온, 테트라키스[메틸렌-3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오네이트]메탄, 데카메틸렌 카복실산 디살리실로일 하이드라지드, N,N'-비스[3-(3,5-디-tert-부틸-4-하이드록시페닐)프로피오닐]하이드라진, 2,2'-옥시아미드-비스-에틸-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 4,4'-티오비스(3-메틸-6-tert-부틸페놀), 2,2'-티오비스(4-메틸-6-tert-부틸페놀), 비스(3-메틸-4-하이드록시-5-tert-부틸벤질)설피드, 4,4'-부틸리덴-비스(2-메틸-4-하이드록시-5-tert-부틸페닐)-2-라우릴티오에테르, 6-(4-하이드록시-3,5-디-tert-부틸아닐리노)-2,4-비스(옥틸티오)-1,3,5-트리아진 및 2,4-비스(4-하이드록시-3,5-디-tert-부틸아닐리노)-6-(n-옥틸티오)-1,3,5-트리아진으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The heat-resistant stabilizer includes one or two or more selected from the group consisting of a phenol-based heat-resistant stabilizer, a sulfur-based heat-resistant stabilizer, and a phosphate-based heat-resistant stabilizer,
The phenolic heat stabilizer is 2-tert-butyl-4-methoxyphenol, 2-tert-butyl-4,6-dimethoxyphenol, 3,5-di-tert-butyl-4-hydroxytoluene, 4- Hydroxymethyl-2,6-di-tert-butylphenol, 2,4,6-tri-tert-butylphenol, 2,2'-methylene-bis(4-ethyl-6-tert-butylphenol), 4 ,4'-butylidene-bis(6-tert-butyl-m-cresol), 2,2'-methylene-bis(4-methyl-6-cyclohexylphenol), 4,4'-bis(2, 6-di-tert-butylphenol), 2,2'-dihydroxy-3,3'-bis(α-methylcyclohexyl)-5,5'-dimethyldiphenylmethane, 4,4'-methylene- Bis(2,6-di-tert-butylphenol), d,l-α-tocopherol (vitamin E), 2,6-bis(2-hydroxy-3-tert-butyl-5-methylbenzyl)-4 -Methylphenol, 3-(4-hydroxy-3,5-di-tert-butylphenyl)propionic acid n-octadecyl, 1,3,5-tris(4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl)-s-triazine-2,4,6-(1H, 3H,5H)-trione, 1,3,5-trimethyl-2,4,6-tris(3,5-di- tert-butyl-4-hydroxyphenyl)benzylbenzene, 1,3,5-tris(4-hydroxy-3,5-di-tert-butylbenzyl)-s-triazine-2,4,6-( 1H,3H,5H)-trione, tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane, decamethylene carboxylic acid disalicyloyl hydrazide , N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hydrazine, 2,2'-oxyamide-bis-ethyl-3-(3,5 -Di-tert-butyl-4-hydroxyphenyl)propionate, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-thiobis(4-methyl-6 -tert-butylphenol), bis(3-methyl-4-hydroxy-5-tert-butylbenzyl) sulfide, 4,4'-butylidene-bis(2-methyl-4-hydroxy-5- tert-butylphenyl)-2-laurylthioether, 6-(4-hydroxy-3,5-di-tert-butylanilino)-2,4-bis(octylthio)-1,3,5- 1 selected from the group consisting of triazine and 2,4-bis(4-hydroxy-3,5-di-tert-butylanilino)-6-(n-octylthio)-1,3,5-triazine A metal material coating kit comprising a species or two or more species.
상기 페놀계 내열 안정제 대 상기 황계 내열 안정제의 질량비는 1 : 0.1 내지 1 : 1 이고,
상기 황계 내열 안정제는, 2-머캅토벤즈이미다졸, N,N'-디페닐티오우레아, 테트라메틸티우람디설피드, N-옥시디에틸렌-2-벤조티아졸릴설펜아미드, N-시클로헥실-2-벤조티아졸릴설펜아미드, 2-머캅토벤조티아졸의 시클로헥실아민염, N,N-디이소프로필-2-벤조티아졸설펜아미드, 2-(N,N-디에틸티오카바모일티오)벤조티아졸, 테트라에틸티우람디설피드, 디벤조티아질디설피드, 디에틸디티오카바민산아연, 에틸페닐디티오카바민산아연, 디-n-부틸디티오카바민산아연, 디라우릴티오디프로피오네이트, 디라우릴티오디-1,1'-메틸부티레이트, 디미리스틸-3,3'-티오디프로피오네이트, 라우릴스테아릴티오디프로피오네이트, 디스테아릴티오디프로피오네이트, 디스테아릴티오디부티레이트 및 디옥타데실디설피드로 이루어진 군에서 선택된 선택된 1종 또는 2종 이상을 포함하고,
상기 인산염계 내열 안정제는, 페닐디이소데실 인산염, 디페닐 이소데실 인산염, 트리페닐 인산염, 트리노닐 페닐 인산염, 칼슘 아세틸아세토네이트, 디옥틸틴 말레인산염 및 인산염으로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트.According to claim 7,
The mass ratio of the phenol-based heat-resistant stabilizer to the sulfur-based heat-resistant stabilizer is 1: 0.1 to 1: 1,
The sulfur-based heat stabilizer is 2-mercaptobenzimidazole, N, N'-diphenylthiourea, tetramethylthiuram disulfide, N-oxydiethylene-2-benzothiazolyl sulfenamide, N-cyclohexyl- 2-Benzothiazolylsulfenamide, cyclohexylamine salt of 2-mercaptobenzothiazole, N,N-diisopropyl-2-benzothiazolesulfenamide, 2-(N,N-diethylthiocarbamoylthio ) Benzothiazole, tetraethylthiuram disulfide, dibenzothiazyl disulfide, zinc diethyldithiocarbamate, zinc ethylphenyldithiocarbamate, zinc di-n-butyldithiocarbamate, dilaurylthiodi Propionate, dilaurylthiodi-1,1'-methylbutyrate, dimyristyl-3,3'-thiodipropionate, laurylstearylthiodipropionate, distearylthiodipropionate, Containing one or two or more selected from the group consisting of distearylthiodibutyrate and dioctadecyldisulfide;
The phosphate-based heat stabilizer is one or two or more selected from the group consisting of phenyl diisodecyl phosphate, diphenyl isodecyl phosphate, triphenyl phosphate, trinonyl phenyl phosphate, calcium acetylacetonate, dioctyltin maleate, and phosphate. A metal material coating kit comprising a.
상기 안정제는 칼슘 스테아레이트(calcium stearate), 리시놀레산 칼슘염(ricinoleic acid Calcium Salt), 징크 스테아레이트(Zinc stearate) 및 리시놀레산 아연염(zinc ricinoleate)로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고,
상기 산화 방지제는 힌더드 페놀, 힌더드 아민 및 디페닐 디설파이드로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고,
상기 활제는 염화파라핀, 왁스, 지방산 에스테르, 지방산 아마이드, 에틸렌 비스 스테아마이드 및 지방산 아마이드로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The stabilizer is one or two selected from the group consisting of calcium stearate, ricinoleic acid calcium salt, zinc stearate and zinc ricinoleate including more than
The antioxidant includes one or two or more selected from the group consisting of hindered phenols, hindered amines, and diphenyl disulfide,
The lubricant is a metal material coating kit comprising one or more selected from the group consisting of chlorinated paraffin, wax, fatty acid ester, fatty acid amide, ethylene bis steamide and fatty acid amide.
상기 무기충전제는 비즈, 플레이크, 섬유, 필라멘트, 판상 및 분말 중 적어도 하나 이상의 형상을 포함하고, 상기 무기충전제는 0.1 ㎛ 내지 50 ㎛의 평균 크기를 갖는 입자를 포함하고, 상기 무기충전제는 유기산으로 표면처리된 입자를 더 포함하고,
상기 무기충전제는 스테인리스강, 실리콘 카바이드, 그래핀, 그라파이트, 탈타늄 카바이드, 질화알루미늄, 침강 탄산칼슘, 고령토, 규산알루미늄, 실리카, 알루미나, 이산화 티타늄, 새틴 화이트(satin white), 돌로마이트(dolomite), 운모(mica), 알루미늄 플레이크류, 벤토나이트(bentonite), 금홍석(rutile), 수산화 마그네슘, 석고, 판상 규산염류(sheet silicates), 탈크(talcum), 규산 칼슘; 및 티타늄, 지르코늄 또는 하프늄의 산화물, 질화물, 수산화물 및 카바이드; 로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The inorganic filler has a shape of at least one of beads, flakes, fibers, filaments, plates, and powders, the inorganic filler includes particles having an average size of 0.1 μm to 50 μm, and the inorganic filler is surface treated with an organic acid. Further comprising treated particles,
The inorganic filler is stainless steel, silicon carbide, graphene, graphite, tartanium carbide, aluminum nitride, precipitated calcium carbonate, kaolin, aluminum silicate, silica, alumina, titanium dioxide, satin white, dolomite, mica, aluminum flakes, bentonite, rutile, magnesium hydroxide, gypsum, sheet silicates, talcum, calcium silicate; and oxides, nitrides, hydroxides and carbides of titanium, zirconium or hafnium; A metal material coating kit comprising one or two or more selected from the group consisting of.
상기 제2 고분자는 폴리디(2-에틸헥실)글리콜아디페이트(Polydi(2-ethlhexyl)giycoladipate), 폴리(네오펜틸 글리콜 아디페이트)(Poly(neopentyl glycol adipate)) 및 폴리(1,2-프로필렌글리콜 아디페이트)(Poly(1,2-propylene glycol adipate))로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하고,
상기 가소제는 금속 과염소산염, 구연산염, 폴리사이클로 펜타디엔, 수소화테르페닐, 폴리프로필렌옥사이드, 인산에스테르, 트리멜리테이트, 프탈레이트, 벤조에이트, 지방산 에스테르알코올, 다이머산에스테르, 그르타레이토, 디부틸 세바케이트(dibutyl sebacate), 디옥틸 세바케이트, 디아이소프로필 세바케이트, 아크릴산에스테르, 에폭시화 지방산 에스테르, 에폭시화 대두유, 폴리에스테르, 아디핀산, 프탈레이트, 아제레이토, 다이옥틸 프탈레이트로, (디)아세틸화 모노글리세라이드, 디에틸1,4-사이클로헥산디카복실레이트, 디옥틸 테레프탈레이트 및 1,2-사이클로헥산 디카복실산 다이이소노닐에스터로 이루어진 군에서 선택된 1종 또는 2종 이상을 포함하는 것인, 금속재 코팅 키트.According to claim 1,
The second polymer is polydi (2-ethlhexyl) giycoladipate, poly (neopentyl glycol adipate) and poly (1,2-propylene). Contains one or two or more selected from the group consisting of glycol adipate (Poly (1,2-propylene glycol adipate)),
The plasticizer is a metal perchlorate, citrate, polycyclopentadiene, hydrogenated terphenyl, polypropylene oxide, phosphate ester, trimellitate, phthalate, benzoate, fatty acid ester alcohol, dimer acid ester, glutarate, dibutyl sebacate (dibutyl sebacate), dioctyl sebacate, diisopropyl sebacate, acrylic acid ester, epoxidized fatty acid ester, epoxidized soybean oil, polyester, adipic acid, phthalate, azerato, dioctyl phthalate, (di)acetylated mono A metal material comprising one or two or more selected from the group consisting of glyceride, diethyl 1,4-cyclohexanedicarboxylate, dioctyl terephthalate, and 1,2-cyclohexane dicarboxylic acid diisononyl ester coating kit.
상기 금속 제품은,
금속재;
상기 금속재 상에 제1 제를 코팅하여 형성된 제1 층; 및
상기 제1 층이 코팅된 금속재와 제2 제 및 수지 코팅제를 이중압출하여 상기 제1 층 상에 형성된 제2 층 및 상기 제2 층상에 형성된 수지 피막층;
을 포함하는, 금속 제품. A metal product manufactured with the metal coating kit of claim 1,
The metal product,
metal material;
a first layer formed by coating a first agent on the metal material; and
a second layer formed on the first layer and a resin coating layer formed on the second layer by double extruding the metal material coated with the first layer, the second agent, and the resin coating agent;
Including, metal products.
상기 제1 층이 코팅된 금속재를 고주파 가열기를 이용하여 120 ℃ 내지 300 ℃ 온도로 1차 가열한 이후 이중압출하고, 이중압출 이후에 80 ℃ 내지 150 ℃ 미만의 온도에서 2차 가열하여 제조된 것인, 금속 제품. According to claim 12,
A metal material coated with the first layer is first heated at a temperature of 120 ° C to 300 ° C using a high-frequency heater, followed by double extrusion, and manufactured by secondary heating at a temperature of 80 ° C to less than 150 ° C after double extrusion. phosphorus, metal products.
상기 제2 층의 경도(로크웰 표면경도)는 80 이상이고,
상기 제2 층의 열팽창계수는, 50 ppm/℃ 이하이고,
상기 금속재와 상기 제2 층의 열팽창 계수(CTE)의 차이는 ± 20 ppm/℃ 이하인 것인, 금속 제품.According to claim 12,
The hardness (Rockwell surface hardness) of the second layer is 80 or more,
The thermal expansion coefficient of the second layer is 50 ppm / ° C or less,
The difference between the coefficient of thermal expansion (CTE) of the metal material and the second layer is ± 20 ppm / ℃ or less, the metal product.
상기 제1 층의 두께는 0.5 ㎛ 내지 50 ㎛이고,
상기 제2 층의 두께는 0.5 ㎛ 내지 200 ㎛이고,
상기 수지 피막층의 두께는 0.5 ㎛ 내지 2,000 ㎛인 것인,
금속 제품.According to claim 12,
The thickness of the first layer is 0.5 μm to 50 μm,
The second layer has a thickness of 0.5 μm to 200 μm,
The thickness of the resin coating layer is 0.5 μm to 2,000 μm,
metal products.
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Citations (3)
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---|---|---|---|---|
KR20080049057A (en) * | 2005-09-22 | 2008-06-03 | 시바 홀딩 인코포레이티드 | Scratch Resistant Polymers and Coating Compositions |
KR20120030544A (en) * | 2002-07-23 | 2012-03-28 | 바스프 에스이 | Radiation-curable paint systems having a lower layer with low-temperature elasticity |
KR102478502B1 (en) | 2020-12-08 | 2022-12-19 | 주식회사 뉴보텍 | Method for manufacturing metal resin composite pipe and metal resin composite pipe manufactured thereby |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20120030544A (en) * | 2002-07-23 | 2012-03-28 | 바스프 에스이 | Radiation-curable paint systems having a lower layer with low-temperature elasticity |
KR20080049057A (en) * | 2005-09-22 | 2008-06-03 | 시바 홀딩 인코포레이티드 | Scratch Resistant Polymers and Coating Compositions |
KR102478502B1 (en) | 2020-12-08 | 2022-12-19 | 주식회사 뉴보텍 | Method for manufacturing metal resin composite pipe and metal resin composite pipe manufactured thereby |
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