KR102563272B1 - 틸팅 스테이지 시스템 - Google Patents
틸팅 스테이지 시스템 Download PDFInfo
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- KR102563272B1 KR102563272B1 KR1020160109549A KR20160109549A KR102563272B1 KR 102563272 B1 KR102563272 B1 KR 102563272B1 KR 1020160109549 A KR1020160109549 A KR 1020160109549A KR 20160109549 A KR20160109549 A KR 20160109549A KR 102563272 B1 KR102563272 B1 KR 102563272B1
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- 229910000831 Steel Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 도 1에 도시된 제1 지지부 및 구동부를 보여주는 사시도이다.
도 3은 도 2에 도시된 제1 지지부 및 구동부를 보여주는 정면도이다.
도 4는 도 1에 도시된 이동부, 제1 틸팅구동부, 제2 틸팅구동부, 제1 스토퍼부 및 제2 스토퍼부를 보여주는 사시도이다.
도 5는 도 4에 도시된 제1 틸팅구동부를 보여주는 사시도이다.
도 6은 도 4에 도시된 제1 스토퍼부를 보여주는 사시도이다.
도 7은 도 1에 도시된 안착스테이지를 보여주는 사시도이다.
도 8은 도 7에 도시된 안착스테이지를 보여주는 단면도이다.
111: 제1 지지부
112: 제2 지지부
113: 승하강선형가이드부
120: 이동부
130: 구동부
140: 안착스테이지
150a: 제1 틸팅구동부
150b: 제2 틸팅구동부
160a: 제1 스토퍼부
160b: 제2 스토퍼부
171: 제1 틸팅감지부
172: 제2 틸팅감지부
181: 탄성부
182: 센서부
183: 리프트구동부
190: 리프트부
Claims (5)
- 제1 지지부;
상기 제1 지지부로부터 이격되도록 배치되는 제2 지지부;
상기 제1 지지부와 상기 제2 지지부를 연결하는 승하강선형가이드부;
상기 제1 지지부와 상기 제2 지지부 사이에 배치되며, 상기 승하강선형가이드부를 따라 운동 가능하도록 상기 승하강선형가이드부에 배치되는 이동부;
상기 제2 지지부의 내부에 배치되며, 중심에서 상기 이동부와 회전 가능하도록 연결되는 안착스테이지;
상기 이동부와 연결되어 상기 이동부를 제1 방향으로 이동시키는 구동부;
상기 이동부에 설치되어 상기 안착스테이지의 중심으로부터 편심된 상기 안착스테이지 제1 부분을 상기 제1 방향으로 가력하는 제1 틸팅구동부; 및
상기 제1 틸팅구동부와 일정 각도를 형성하도록 상기 이동부에 설치되며, 상기 안착스테이지의 중심으로부터 편심된 상기 안착스테이지 제2 부분을 상기 제1 방향으로 가력하는 제2 틸팅구동부;를 포함하는 틸팅 스테이지 시스템. - 제 1 항에 있어서,
상기 제1 틸팅구동부에 설치되며, 상기 제1 부분의 상기 제1 방향으로의 이동양을 측정하는 제1 틸팅감지부; 및
상기 제2 틸팅구동부에 설치되며, 상기 제2 부분의 상기 제1 방향으로의 이동양을 측정하는 제2 틸팅감지부;를 더 포함하는 틸팅 스테이지 시스템. - 제 2 항에 있어서,
상기 제1 틸팅구동부 및 상기 제2 틸팅구동부는 각각 상기 제1 틸팅감지부 및 상기 제2 틸팅감지부에서 측정된 값을 근거로 상기 안착스테이지를 틸팅시키도록 작동하는 틸팅 스테이지 시스템. - 제 1 항에 있어서,
상기 제1 틸팅구동부와 대향하도록 상기 이동부에 배치되는 제1 스토퍼부;를 더 포함하는 틸팅 스테이지 시스템. - 제 1 항에 있어서,
상기 제2 틸팅구동부와 대향하도록 상기 이동부에 배치되는 제2 스토퍼부;를 더 포함하는 틸팅 스테이지 시스템.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160109549A KR102563272B1 (ko) | 2016-08-26 | 2016-08-26 | 틸팅 스테이지 시스템 |
PCT/KR2017/000891 WO2018038334A1 (ko) | 2016-08-26 | 2017-01-25 | 틸팅 스테이지 시스템 |
CN201780052345.3A CN109643684B (zh) | 2016-08-26 | 2017-01-25 | 倾斜承载台系统 |
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KR1020160109549A KR102563272B1 (ko) | 2016-08-26 | 2016-08-26 | 틸팅 스테이지 시스템 |
Publications (2)
Publication Number | Publication Date |
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KR20180023739A KR20180023739A (ko) | 2018-03-07 |
KR102563272B1 true KR102563272B1 (ko) | 2023-08-03 |
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KR1020160109549A Active KR102563272B1 (ko) | 2016-08-26 | 2016-08-26 | 틸팅 스테이지 시스템 |
Country Status (3)
Country | Link |
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KR (1) | KR102563272B1 (ko) |
CN (1) | CN109643684B (ko) |
WO (1) | WO2018038334A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113629001B (zh) * | 2020-05-09 | 2024-05-14 | 长鑫存储技术有限公司 | 一种载台装置 |
CN113830700A (zh) * | 2020-06-24 | 2021-12-24 | 拓荆科技股份有限公司 | 水平自动调整的升降系统及方法 |
KR102600460B1 (ko) * | 2021-08-24 | 2023-11-10 | (주)에스에스피 | 캠 모듈을 이용하여 높이 조절이 가능한 웨이퍼 스테이지 장치 |
KR102422225B1 (ko) * | 2022-01-04 | 2022-07-18 | 주식회사 블루로봇 | 밸런스 스테이지 |
WO2024014847A1 (ko) * | 2022-07-12 | 2024-01-18 | 주식회사 블루로봇 | 밸런스 스테이지 |
KR102463976B1 (ko) | 2022-07-12 | 2022-11-07 | 주식회사 블루로봇 | 수동 조정 밸런스 스테이지 |
KR102454629B1 (ko) | 2022-07-12 | 2022-10-14 | 주식회사 블루로봇 | 자동 조정 밸런스 스테이지 |
Citations (1)
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JP2010034132A (ja) * | 2008-07-25 | 2010-02-12 | Bondtech Inc | 傾斜調整機構およびこの傾斜調整機構の制御方法 |
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NL7413514A (nl) * | 1974-10-15 | 1976-04-21 | Philips Nv | Inrichting voor het naar keuze realiseren van twee onderling komplementaire funkties. |
JPH0618168B2 (ja) * | 1985-02-27 | 1994-03-09 | 株式会社日立製作所 | 原画パターンを半導体ウエハ上面に露光する露光方法 |
JPH05291382A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Techno Eng Co Ltd | 薄板収納装置 |
JP3401769B2 (ja) * | 1993-12-28 | 2003-04-28 | 株式会社ニコン | 露光方法、ステージ装置、及び露光装置 |
KR100355878B1 (ko) * | 1999-12-31 | 2002-10-12 | 아남반도체 주식회사 | 레티클 스테이지의 자동 기울기 조정장치 |
JP4687624B2 (ja) * | 2006-09-29 | 2011-05-25 | オムロン株式会社 | 基板支持装置 |
US8220787B2 (en) * | 2008-09-19 | 2012-07-17 | Panasonic Corporation | Part mounting device |
KR101090333B1 (ko) * | 2009-06-03 | 2011-12-07 | 주식회사 쎄믹스 | 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법 |
KR101293273B1 (ko) * | 2013-05-21 | 2013-08-09 | 최대용 | 웨이퍼 프리얼라이너 |
KR20150089491A (ko) * | 2014-01-28 | 2015-08-05 | 세메스 주식회사 | 스테이지 유닛 및 이를 갖는 다이 본딩 장치 |
KR102238998B1 (ko) | 2014-07-22 | 2021-04-12 | 세메스 주식회사 | 스테이지 수평 조절 장치 |
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2016
- 2016-08-26 KR KR1020160109549A patent/KR102563272B1/ko active Active
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2017
- 2017-01-25 CN CN201780052345.3A patent/CN109643684B/zh active Active
- 2017-01-25 WO PCT/KR2017/000891 patent/WO2018038334A1/ko active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010034132A (ja) * | 2008-07-25 | 2010-02-12 | Bondtech Inc | 傾斜調整機構およびこの傾斜調整機構の制御方法 |
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Publication number | Publication date |
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WO2018038334A1 (ko) | 2018-03-01 |
CN109643684B (zh) | 2022-11-22 |
KR20180023739A (ko) | 2018-03-07 |
CN109643684A (zh) | 2019-04-16 |
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