KR102553073B1 - Substrate cleaning device and substrate cleaning method - Google Patents

Abstract

The outer circumferential end of the substrate is held by the upper holding device at the first height position. At a second height position below the first height position, the lower surface central region of the substrate is adsorbed and held by the lower holding device, and the substrate is rotated about a vertical axis. The substrate is conveyed by the water transfer device between the first height position and the second height position. The cleaning tool is raised so as to come into contact with the lower surface of the substrate held by the upper holding device or the lower holding device, and the center area of the lower surface of the substrate or the outer area of the lower surface surrounding the lower surface center area is cleaned by the cleaning tool. When it is determined that the substrate is at the first height position when an abnormality occurs, a gas is supplied to a central region of the lower surface of the substrate held by the upper holding device by the gas ejection unit.

Description

Substrate cleaning device and substrate cleaning method {SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD}

The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate.

Substrates for FPD (Flat Panel Display) used in liquid crystal displays or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or In order to perform various treatments on various substrates such as substrates for solar cells, a substrate processing apparatus is used. To clean the substrate, a substrate cleaning apparatus is used.

A substrate cleaning apparatus disclosed in Japanese Patent No. 5904169 includes two suction pads holding the periphery of the back side of a wafer, a spin chuck holding the center portion of the back side of the wafer, and a brush for cleaning the back side of the wafer. Two suction pads move laterally while holding the wafer. In this state, the central portion of the back surface of the wafer is cleaned with a brush. After that, the spin chuck receives the wafer from the suction pad, and the spin chuck rotates while holding the central portion of the back surface of the wafer. In this state, the periphery of the back surface of the wafer is cleaned with a brush.

In the substrate cleaning apparatus, when an abnormality occurs, a countermeasure for the abnormality is performed after the substrate is recovered from the substrate cleaning apparatus. However, since substrates are transported to a plurality of positions in the above substrate cleaning apparatus, it is not easy to appropriately collect the substrates depending on the positions of the substrates. If the substrate is not properly retrieved, components of the substrate cleaning apparatus, such as the spin chuck, may be damaged.

An object of the present invention is to provide a substrate cleaning device and a substrate cleaning method capable of appropriately recovering a substrate when an abnormality occurs.

(1) A substrate cleaning apparatus according to one aspect of the present invention cleans a lower surface of a substrate, comprising: a first substrate holding portion holding an outer circumferential end of the substrate at a first height position; a second substrate holding unit that adsorbs and holds the center region of the lower surface of the substrate at a lower second height position and rotates the substrate around a vertical axis; and a substrate transport unit that transports the substrate at the first height position and the second height position; A cleaning tool that cleans the central region of the lower surface of the substrate or the outer region of the lower surface surrounding the central region of the lower surface, and a cleaning tool lifting unit that lifts the cleaning tool so as to come into contact with the lower surface of the substrate held by the first or second substrate holder. and a gas supply unit capable of discharging gas toward the lower surface of the substrate, a substrate position determination unit determining the position of the substrate, and a substrate position determination unit determining that the substrate is at the first height position when an abnormality occurs in the substrate cleaning apparatus. In this case, a control unit controlling the gas supply unit so that gas is supplied to a central region of the lower surface of the substrate held by the first substrate holding unit is provided.

In this substrate cleaning apparatus, substrates are conveyed by the substrate conveying unit at a first height position and a second height position below the first height position. At the first height position, the outer circumferential end of the substrate is held by the first substrate holding portion. At the second height position, the center region of the lower surface of the substrate is adsorbed and held by the second substrate holder, and the substrate is rotated around the vertical axis.

The cleaning tool is moved up and down by the cleaning tool lifting portion so as to be able to contact the lower surface of the substrate held by the first or second substrate holding portion. The central region of the lower surface of the substrate or the outer region of the lower surface surrounding the central region of the lower surface of the substrate is cleaned by the cleaning tool. The position of the substrate is determined by the substrate position determination unit. When it is determined that the substrate is at the first height position by the substrate position determining unit when an abnormality occurs in the substrate cleaning apparatus, gas is supplied by the gas supply unit to the central region of the lower surface of the substrate held by the first substrate holding unit.

According to this configuration, even when a liquid component adheres to the central region of the lower surface of the substrate held by the first substrate holding unit when an abnormality occurs in the substrate cleaning device, the central region of the lower surface of the substrate is exposed to the gas supplied by the gas supply unit. dried by Therefore, even when the substrate is conveyed to the second height position and is adsorbed and held by the second substrate holder, liquid components do not enter the adsorbing portion of the second substrate holder. This prevents the second substrate holding portion from being damaged. As a result, the substrate can be appropriately recovered from the substrate cleaning device when an abnormality occurs.

(2) The substrate cleaning apparatus further includes a processing liquid supply unit capable of supplying the processing liquid to the lower surface of the substrate, and the control unit determines that the substrate is at the first height position by the substrate position determining unit when an abnormality occurs in the substrate cleaning apparatus. If it is determined, the processing liquid supply unit is controlled so that the processing liquid is supplied to the central area of the lower surface of the substrate held by the first substrate holding unit, and after the supply of the processing liquid by the processing liquid supply unit is finished, the processing liquid is supplied to the central area of the lower surface of the substrate. The gas supply unit may be controlled so that gas is supplied.

In this case, when an abnormality occurs in the substrate cleaning apparatus, the processing liquid is supplied to the central region of the lower surface of the substrate held by the first substrate holding unit by the processing liquid supply unit. Therefore, even when a foreign material adheres to the central area of the lower surface of the substrate, the foreign material is removed from the substrate. Further, when the supply of the processing liquid by the processing liquid supply unit is finished, since the gas is supplied to the center region of the lower surface of the substrate by the gas supply unit, the substrate is conveyed to the second height position and held by the second substrate holding unit by suction. Even in this case, the liquid component does not penetrate into the adsorption part of the second substrate holding part. As a result, it is possible to recover the substrate more appropriately from the substrate cleaning device when an abnormality occurs.

(3) The control unit controls the substrate transport unit so that the substrate supplied with gas to the lower surface central region is held by the second substrate holder at the second height position, and controls the second substrate holder to rotate while holding the substrate; In addition, the processing liquid supply unit is controlled so that the processing liquid is supplied to the outer region of the lower surface of the substrate, and the processing liquid supply unit is controlled so that the supply of the processing liquid is stopped while controlling the second substrate holding unit so that the rotation of the substrate is maintained after a predetermined time. do.

In this case, in a state in which the substrate is held at the second height position by the second substrate holder and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate by the processing liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to more appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

(4) The control unit controls the second substrate holding unit to rotate while holding the substrate when it is determined by the substrate position determination unit that the substrate is at the second height position when an abnormality occurs in the substrate cleaning apparatus, and also controls the lower surface of the substrate. The processing liquid supply unit may be controlled so that the processing liquid is supplied to the outer region, and after a predetermined time, the processing liquid supply unit may be controlled so that the supply of the processing liquid is stopped while controlling the second substrate holding unit so that the rotation of the substrate is maintained.

According to this configuration, when the substrate is adsorbed and held by the second substrate holder when an abnormality occurs in the substrate cleaning apparatus, processing is performed on the area outside the lower surface of the substrate in a rotated state while being held by the second substrate holder. A liquid is supplied by a treatment liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

(5) The control unit, when it is determined that the substrate is between the first height position and the second height position by the substrate position determination unit when an abnormality occurs in the substrate cleaning apparatus, the substrate is moved to the second substrate holder at the second height position. In addition to controlling the second substrate holding part to rotate while holding the substrate, controlling the processing liquid supply unit to supply the processing liquid to an area outside the lower surface of the substrate, and rotating the substrate after a predetermined period of time. The processing liquid supply unit may be controlled such that the supply of the processing liquid is stopped while controlling the second substrate holding unit so as to maintain this.

According to this configuration, when the substrate is between the first height position and the second height position when an abnormality occurs in the substrate cleaning apparatus, the substrate is conveyed to the second height position by the substrate transport unit so that the substrate is held by the second substrate holding unit. do. Thereafter, in a state in which the substrate is held at the second height position by the second substrate holder and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate by the processing liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

(6) A substrate cleaning method according to another aspect of the present invention is a substrate cleaning method in which a lower surface of a substrate is cleaned by a substrate cleaning device, wherein an outer circumferential end of the substrate is held by a first substrate holder at a first height position. and rotating the substrate around a vertical axis by adsorbing and holding the lower surface of the substrate at a second height position lower than the first height position by a second substrate holder, and rotating the substrate around a vertical axis at the first height position and the second height position. a step of conveying the substrate by the substrate conveying unit between the steps of moving the cleaning tool so as to come into contact with the lower surface of the substrate held by the first or second substrate holding unit; cleaning the outer region of the lower surface surrounding the substrate with a cleaning tool; determining the position of the substrate; and, if it is determined that the substrate is at the first height position when an error occurs in the substrate cleaning device, a first substrate holding unit. and supplying gas by a gas supply unit to a central region of the lower surface of the substrate held by the substrate.

According to this substrate cleaning method, even when a liquid component adheres to the central region of the lower surface of the substrate held by the first substrate holding unit when an abnormality occurs in the substrate cleaning apparatus, the central region of the lower surface of the substrate is supplied by the gas supply unit. dried by gas. Therefore, even when the substrate is conveyed to the second height position and is adsorbed and held by the second substrate holder, liquid components do not enter the adsorbing portion of the second substrate holder. This prevents the second substrate holding portion from being damaged. As a result, the substrate can be appropriately recovered from the substrate cleaning device when an abnormality occurs.

(7) The step of supplying the gas to the central region of the lower surface of the substrate by the gas supply unit includes supplying the processing liquid to the central region of the lower surface of the substrate held by the first substrate holding unit by the processing liquid supply unit, and It may also include supplying a gas to the center region of the lower surface of the substrate from a gas supply unit after the supply of the processing liquid by the .

In this case, when an abnormality occurs in the substrate cleaning apparatus, the processing liquid is supplied to the central region of the lower surface of the substrate held by the first substrate holding unit by the processing liquid supply unit. Therefore, even when a foreign material adheres to the central area of the lower surface of the substrate, the foreign material is removed from the substrate. Further, when the supply of the processing liquid by the processing liquid supply unit is finished, since the gas is supplied to the center region of the lower surface of the substrate by the gas supply unit, the substrate is conveyed to the second height position and held by the second substrate holding unit by suction. Even in this case, the liquid component does not penetrate into the adsorption part of the second substrate holding part. As a result, it is possible to recover the substrate more appropriately from the substrate cleaning device when an abnormality occurs.

(8) A substrate cleaning method includes the steps of holding a substrate supplied with gas to a central region of the lower surface by a second substrate holding part at a second height position, rotating the second substrate holding part holding the substrate, and 2 supplying a processing liquid from a processing liquid supply unit to an area outside the lower surface of the substrate rotating by the substrate holding unit, and supplying the processing liquid from the processing liquid supply unit to a second substrate holding unit after a predetermined time has elapsed. The method may further include a step of stopping the supply of the processing liquid by the processing liquid supply unit while maintaining the rotation of the substrate by the processing liquid.

In this case, in a state in which the substrate is held at the second height position by the second substrate holder and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate by the processing liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to more appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

(9) The substrate cleaning method includes, when it is determined that the substrate is at the second height position when an abnormality occurs in the substrate cleaning apparatus, rotating a second substrate holder holding the substrate; A step of supplying a processing liquid to an area outside the lower surface of the substrate by a processing liquid supply unit, and processing while maintaining rotation of the substrate by a second substrate holding unit after a predetermined time has elapsed since the supply of the processing liquid by the processing liquid supply unit has started. A step of stopping the supply of the treatment liquid by the liquid supply unit may be further included.

According to this configuration, when the substrate is adsorbed and held by the second substrate holder when an abnormality occurs in the substrate cleaning apparatus, processing is performed on the area outside the lower surface of the substrate in a rotated state while being held by the second substrate holder. A liquid is supplied by a treatment liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

(10) The substrate cleaning method includes, when it is determined that the substrate is between a first height position and a second height position when an abnormality occurs in the substrate cleaning apparatus, conveying the substrate to the second height position by a substrate transport unit; A step of holding the substrate at a second height position by a second substrate holding part, a step of rotating the second substrate holding part holding the substrate, and a processing liquid in a region outside the lower surface of the substrate rotated by the second substrate holding part. supplying the processing liquid by the supply unit, and supplying the processing liquid by the processing liquid supply unit while maintaining rotation of the substrate by the second substrate holding unit after a predetermined time has elapsed since the supply of the processing liquid by the processing liquid supply unit has started. It may further include the step of stopping.

According to this configuration, when the substrate is between the first height position and the second height position when an abnormality occurs in the substrate cleaning apparatus, the substrate is conveyed to the second height position by the substrate transport unit so that the substrate is held by the second substrate holding unit. do. Thereafter, in a state in which the substrate is held at the second height position by the second substrate holder and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate by the processing liquid supply unit. Therefore, even when a foreign substance adheres to the region outside the lower surface of the substrate, the foreign substance is removed from the substrate. In addition, since the rotation of the substrate is maintained after the supply of the processing liquid by the processing liquid supply unit is finished, the entire substrate is dried. Therefore, even when the substrate is unloaded from the substrate cleaning device, no liquid component adheres to the mechanism for unloading the substrate. This makes it possible to appropriately recover the substrate from the substrate cleaning device when an abnormality occurs.

1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention;
2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus of FIG. 1;
3 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus;
4 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
5 is a schematic diagram for explaining a normal operation of the substrate cleaning apparatus of FIG. 1;
6 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
7 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
8 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
9 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
10 is a schematic diagram for explaining a normal operation of the substrate cleaning apparatus of FIG. 1;
11 is a schematic diagram for explaining a normal operation of the substrate cleaning apparatus of FIG. 1;
12 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
13 is a schematic diagram for explaining a normal operation of the substrate cleaning apparatus of FIG. 1;
14 is a schematic diagram for explaining the normal operation of the substrate cleaning apparatus of FIG. 1;
15 is a schematic diagram for explaining a normal operation of the substrate cleaning apparatus of FIG. 1;
Fig. 16 is a flow chart showing a substrate recovery process by the control device of Fig. 3;
FIG. 17 is a flowchart showing a substrate recovery process performed by the control device in FIG. 3 .

Hereinafter, a substrate cleaning device and a substrate cleaning method according to an embodiment of the present invention will be described using drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for optical disks, a substrate for magnetic disks, and a magneto-optical disk. A substrate for a photomask, a substrate for a ceramic substrate, or a substrate for a solar cell. In this embodiment, the upper surface of the substrate is the circuit formation surface (surface), and the lower surface of the substrate is the surface opposite to the circuit formation surface (back surface). In this embodiment, the substrate has a circular shape except for the notch.

(1) Configuration of substrate processing apparatus

1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of FIG. 1 . In the substrate cleaning apparatus 1 according to the present embodiment, in order to clarify the positional relationship, the X direction, the Y direction, and the Z direction that are orthogonal to each other are defined. In the predetermined drawings after Figs. 1 and 2, the X direction, Y direction, and Z direction are appropriately indicated by arrows. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

As shown in FIG. 1 , the substrate cleaning device 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, and a water supply device 40. , bottom surface cleaning device 50, cup device 60, top surface cleaning device 70, edge cleaning device 80 and opening/closing device 90. These components are installed in the unit housing 2 . In Fig. 2, the unit housing 2 is indicated by dotted lines.

The unit housing 2 has a rectangular bottom portion 2a and four side wall portions 2b, 2c, 2d, and 2e extending upward from four sides of the bottom portion 2a. Side wall portions 2b and 2c are opposed to each other, and side wall portions 2d and 2e are opposed to each other. A rectangular opening is formed in the central portion of the side wall portion 2b. This opening is a loading/unloading port 2x of the substrate W, and is used at the time of loading and unloading the substrate W from the unit housing 2 . In Fig. 2, the carry-in/out port 2x is indicated by a thick dotted line. In the following description, the Y direction is the direction from the inside of the unit housing 2 to the outside of the unit housing 2 through the carry-in/out port 2x (from the side wall portion 2c to the side wall portion 2b). direction) is called forward, and the opposite direction (direction from side wall portion 2b to side wall portion 2c) is called rear.

An opening/closing device 90 is provided in the formation portion of the carry-in/out port 2x in the side wall portion 2b and in an area near it. The opening/closing device 90 includes a shutter 91 configured to be able to open and close the carry-in/out port 2x, and a shutter drive unit 92 that drives the shutter 91 . In Fig. 2, the shutter 91 is indicated by a thick dotted-dashed line. The shutter drive unit 92 drives the shutter 91 to open the loading/unloading port 2x at the time of loading and unloading of the substrate W from the substrate cleaning device 1 . Further, the shutter drive unit 92 drives the shutter 91 to close the carry-in/out port 2x when the substrate W is cleaned in the substrate cleaning device 1 .

A pedestal device 30 is installed in the central portion of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal driving unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in plan view. On the two rails of the linear guide 31, the movable pedestal 32 is installed so that a movement in the Y direction is possible. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31 .

On the movable pedestal 32, the lower holding device 20 and the lower surface cleaning device 50 are installed so as to line up in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22 . The suction holding unit 21 is a so-called spin chuck, has a circular suction surface capable of suction holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). . In the following description, when the substrate W is adsorbed and held by the adsorption holder 21, the area to be adsorbed by the adsorption surface of the adsorption holder 21 among the lower surfaces of the substrate W is referred to as the lower surface center region. . Meanwhile, a region surrounding the central region of the lower surface of the lower surface of the substrate W is referred to as an outer region.

The suction holding driving unit 22 includes a motor. The motor of the suction holding driving unit 22 is installed on the movable pedestal 32 so that the rotating shaft protrudes upward. The suction holding unit 21 is attached to the upper end of the rotating shaft of the suction holding driving unit 22 . Further, a suction path for adsorbing and holding the substrate W by the adsorption holding unit 21 is formed on the rotating shaft of the adsorption holding drive unit 22 . The suction path is connected to an intake device not shown. The suction holding drive unit 22 rotates the suction holding unit 21 around the rotation shaft.

On the movable pedestal 32 , a water supply device 40 is further installed near the lower holding device 20 . The water supply device 40 includes a plurality of (three in this example) support pins 41 , a pin connecting member 42 and a pin lifting driver 43 . The pin connection member 42 is formed so as to surround the suction holding portion 21 in plan view, and connects the plurality of support pins 41 . The plurality of support pins 41 extend upward by a certain length from the pin connecting member 42 in a state of being connected to each other by the pin connecting member 42 . The pin lifting driver 43 lifts the pin connecting member 42 on the movable pedestal 32 . Thereby, the plurality of support pins 41 move up and down relatively with respect to the suction holding part 21 .

The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, and a lower surface. It includes a brush elevation drive unit 55b and a lower surface brush movement drive unit 55c. The movable support part 55 is installed so as to be movable in the Y direction with respect to the lower holding device 20 within a certain area on the movable pedestal 32 . As shown in FIG. 2, on the movable support part 55, the lifting support part 54 is installed so that it can move up and down. The elevating support part 54 has an upper surface 54u inclined downward obliquely in the direction away from the suction holding part 21 (backward in this example).

As shown in FIG. 1 , the lower surface brush 51 has a circular cleaning surface capable of contacting the lower surface of the substrate W. Further, the lower surface brush 51 is mounted on the upper surface 54u of the elevating support portion 54 so that the cleaning surface faces upward and the cleaning surface is rotatable around an axis extending in the vertical direction passing through the center of the cleaning surface. attached. The area of the cleaning surface of the lower surface brush 51 is larger than the area of the suction surface of the suction holder 21 .

Each of the two liquid nozzles 52 is located near the lower surface brush 51 and is mounted on the upper surface 54u of the elevating support portion 54 so that the liquid discharge port faces upward. The liquid nozzle 52 is connected to a lower surface cleaning liquid supply unit 56 (FIG. 3). The lower surface washing liquid supply unit 56 supplies the washing liquid to the liquid nozzle 52 . The liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 to the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52 .

The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas blowing part 53 is located between the bottom brush 51 and the adsorbing holding part 21 in plan view, and is attached to the upper surface 54u of the lifting support part 54 so that the gas blowing port faces upward. there is. The gas ejection part 53 is connected to the ejection gas supply part 57 (FIG. 3). The blowing gas supply unit 57 supplies gas to the gas blowing unit 53 . In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection unit 53 . When the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, the gas blowing unit 53 supplies the gas supplied from the blowing gas supply unit 57 to the substrate W ) is sprayed on the underside of the In this case, a belt-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding portion 21 .

The lower brush rotation driving unit 55a includes a motor and rotates the lower brush 51 at the time of cleaning the substrate W by the lower brush 51 . The lower brush lifting driving unit 55b includes a stepping motor or an air cylinder, and lifts the lifting support unit 54 relative to the moving support unit 55 . The lower brush movement driving unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable pedestal 32 . Here, the position of the lower holding device 20 in the movable pedestal 32 is fixed. Therefore, when the moving support part 55 moves in the Y direction by the lower brush driving part 55c, the moving support part 55 moves relatively with respect to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable pedestal 32 is referred to as an approaching position, and from the lower holding device 20 on the movable pedestal 32. The position of the lower surface cleaning device 50 when it is furthest away is called a separation position.

A cup device 60 is further provided in the central portion of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup driving unit 62 . The cup 61 is installed so that it can raise and lower so that it may surround the lower holding device 20 and the pedestal device 30 in planar view. In Fig. 2, the cup 61 is indicated by dotted lines. The cup driving unit 62 moves the cup 61 between a lower cup position and an upper cup position according to which part of the lower surface of the substrate W is cleaned by the lower surface brush 51 . The lower cup position is a height position at which the upper end of the cup 61 is lower than the substrate W adsorbed and held by the suction holder 21 . In addition, the upper cup position is a height position where the upper end of the cup 61 is above the suction holding portion 21 .

At a height position above the cup 61, a pair of upper holding devices 10A and 10B are provided so as to face each other with the pedestal device 30 interposed therebetween in plan view. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B and an upper chuck driving unit 14B.

The lower chucks 11A, 11B are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holder 21 when viewed from above, and are movable in the X direction within a common horizontal plane. it is installed Each of the lower chucks 11A and 11B has two support pieces capable of supporting the periphery of the lower surface of the substrate W from below the substrate W. The lower chuck driving units 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B come closer to each other or so that the lower chucks 11A and 11B move away from each other.

The upper chucks 12A and 12B, like the lower chucks 11A and 11B, are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holder 21 in plan view, It is installed so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces configured to hold the outer circumferential end of the substrate W by abutting against the two parts of the outer circumferential end of the substrate W. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B so that the upper chucks 12A and 12B come closer to each other or so that the upper chucks 12A and 12B move away from each other.

In the unit housing 2, a sensor device 15 for detecting whether or not the substrate W is held by the upper holding devices 10A and 10B is provided. In this example, the sensor device 15 is attached to the upper holding device 10A, but the embodiment is not limited to this. The sensor device 15 may be attached to the upper holding devices 10B, may be attached to both of the upper holding devices 10A and 10B, or may be disposed separately from the upper holding devices 10A and 10B.

The sensor device 15 is, for example, a non-contact type sensor including a light transmitting unit and a light receiving unit. The light emitter emits light, and the light receiver outputs a light reception signal when receiving the light emitted from the light emitter. The light transmitting unit and the light receiving unit are arranged to face each other with the substrate W interposed therebetween when the upper holding devices 10A and 10B hold the substrate W. In this arrangement, a light reception signal is output from the sensor device 15 when the upper holding devices 10A and 10B are not holding the substrate W. When the upper holding devices 10A and 10B are holding the substrate W, no light receiving signal is output from the sensor device 15 .

Further, even if the light transmitting unit and the light receiving unit are arranged such that light emitted by the light transmitting unit and reflected by the substrate W is received by the light receiving unit when the upper holding devices 10A and 10B are holding the substrate W. do. In this arrangement, a light reception signal is output from the sensor device 15 when the upper holding devices 10A and 10B hold the substrate W. When the upper holding devices 10A and 10B do not hold the substrate W, no light receiving signal is output from the sensor device 15 . In addition, the sensor device 15 may not be a non-contact sensor, but a contact sensor that detects the substrate W by physical contact.

As shown in Fig. 1, on one side of the cup 61, an upper surface cleaning device 70 is installed so as to be located near the upper holding device 10B in plan view. The top surface cleaning device 70 includes a rotation support shaft 71 , an arm 72 , a spray nozzle 73 and a top surface cleaning driving unit 74 .

The rotational support shaft 71 is supported by the upper face cleaning drive unit 74 so as to extend vertically and to be able to move up and down and rotate on the bottom face portion 2a. As shown in FIG. 2 , the arm 72 is installed so as to extend horizontally from the upper end of the rotation support shaft 71 at a position above the upper holding device 10B. A spray nozzle 73 is attached to the distal end of the arm 72 .

To the spray nozzle 73, an upper surface cleaning fluid supply unit 75 (FIG. 3) is connected. The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73 . In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

The upper surface cleaning drive unit 74 includes one or a plurality of pulse motors, air cylinders, and the like, and moves the rotation support shaft 71 up and down while rotating the rotation support shaft 71 . According to the above configuration, the entire upper surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W that is adsorbed and held by the suction holding unit 21 and rotated. there is.

As shown in Fig. 1, on the other side of the cup 61, an edge cleaning device 80 is provided so as to be located near the upper holding device 10A in plan view. The edge cleaning device 80 includes a rotation support shaft 81 , an arm 82 , a bevel brush 83 and a bevel brush driving unit 84 .

The rotational support shaft 81 is supported by the bevel brush drive unit 84 so as to extend in the vertical direction, to be able to move up and down, and to be rotatable on the bottom surface portion 2a. As shown in FIG. 2 , the arm 82 is installed so as to extend horizontally from the upper end of the rotation support shaft 81 at a position above the upper holding device 10A. At the distal end of the arm 82, a bevel brush 83 is provided so as to protrude downward and to be rotatable around an axis in the vertical direction.

The bevel brush 83 has an upper half of an inverted truncated cone shape and a lower half of a truncated cone shape. According to this bevel brush 83, the outer circumferential edge of the substrate W can be cleaned at the central portion of the outer circumferential surface in the vertical direction.

The bevel brush drive unit 84 includes one or a plurality of pulse motors, air cylinders, and the like, and raises and lowers the rotation support shaft 81 and rotates the rotation support shaft 81 . According to the above configuration, the entire outer peripheral end of the substrate W is removed by contacting the central portion of the outer peripheral surface of the bevel brush 83 with the outer peripheral end of the substrate W that is adsorbed and held by the suction holding portion 21 and rotated. can be cleaned

Here, the bevel brush drive unit 84 further includes a motor built into the arm 82 . The motor rotates the bevel brush 83 attached to the distal end of the arm 82 around an axis in the vertical direction. Therefore, when cleaning the outer circumferential end of the substrate W, the bevel brush 83 rotates, thereby improving the cleaning power of the bevel brush 83 at the outer circumferential end of the substrate W.

3 is a block diagram showing the configuration of the control system of the substrate cleaning apparatus 1 . The control unit 9 in FIG. 3 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. RAM is used as a work area of the CPU. ROM stores system programs. The storage device stores a substrate cleaning program for causing the CPU to execute a normal operation described later. The substrate cleaning program includes a substrate recovery program for causing the CPU to execute a recovery operation described later.

As shown in FIG. 3 , the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a pedestal control unit 9C, a water supply control unit 9D, a lower surface cleaning control unit 9E, It includes a cup control section 9F, an upper surface cleaning control section 9G, a bevel washing control section 9H, a carry-in/out control section 9I, and a substrate position determination section 9J. The functional part of the control device 9 is realized by the CPU executing the substrate cleaning program stored in the storage device on the RAM. Some or all of the functional units of the control device 9 may be realized by hardware such as electronic circuits.

The chuck control unit 9A includes the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B to receive the substrate W carried into the substrate cleaning apparatus 1 and hold it at the first height position. to control The adsorption control unit 9B adsorbs and holds the substrate W by the adsorption holding unit 21 at the second height position below the first height position and rotates the adsorption-held substrate W. Controls the drive unit 22. When the substrate W is suction-held by the suction-holding unit 21, the suction-holding driver 22 outputs a suction signal indicating that the substrate W is suction-held.

The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The water supply control unit 9D controls the position between the first height position of the substrate W held by the upper holding devices 10A and 10B and the second height position of the substrate W held by the suction holder 21. In order to move the substrate W, the pin lifting driver 43 is controlled.

In order to clean the lower surface of the substrate W, the lower surface cleaning control unit 9E includes a lower surface brush rotation drive unit 55a, a lower surface brush elevation drive unit 55b, a lower surface brush movement drive unit 55c, a lower surface cleaning liquid supply unit 56, and The ejection gas supply unit 57 is controlled. The cup control unit 9F uses the cup drive unit 62 to receive the cleaning liquid splashing from the substrate W into the cup 61 when the substrate W adsorbed and held by the suction holding unit 21 is cleaned. Control.

The upper surface cleaning control unit 9G controls the upper surface cleaning driving unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21 . The bevel cleaning control unit 9H controls the bevel brush driving unit 84 to clean the outer peripheral end of the substrate W adsorbed and held by the adsorption holding unit 21 . The carry-in/out control unit 9I operates a shutter drive unit 92 to open and close the carry-in/out port 2x of the unit housing 2 at the time of loading and unloading of the substrate W in the substrate cleaning device 1. to control

The substrate position determining unit 9J determines the position of the substrate W based on the light receiving signal output from the sensor device 15 and the suction signal output from the suction holding driving unit 22 . In this example, when the light reception signal is not output from the sensor device 15, it is determined that the substrate W is in the first height position. When a suction signal is output from the suction holding driver 22, it is determined that the substrate W is at the second height position. If it is not determined that the substrate W is at either of the first and second height positions, it is determined that the substrate W is between the first height position and the second height position.

(2) Normal operation of the substrate cleaning device

4 to 15 are schematic diagrams for explaining the normal operation of the substrate cleaning apparatus 1 of FIG. 1 . In each of FIGS. 4 to 15 , a plan view of the substrate cleaning device 1 is shown on the upper stage. In addition, the middle part shows a side view of the lower holding device 20 and its periphery as seen along the Y direction, and the lower part shows a side view of the lower holding device 20 and its periphery as seen along the X direction. The side view of the middle part corresponds to the side view of line A-A in FIG. 1, and the side view of the lower part corresponds to the side view of line B-B of FIG. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, between the top plan view and the middle and bottom side views, the expansion ratio of some components (擴縮)率) is different. In addition, in FIGS. 4-15, while the cup 61 is shown by the two-dot chain line, the external shape of the board|substrate W is shown by the thick one-dot chain line.

In the initial state before the substrate W is loaded into the substrate cleaning device 1, the shutter 91 of the opening/closing device 90 closes the loading/unloading port 2x. Further, as shown in FIG. 1 , the lower chucks 11A and 11B are maintained in such a state that the distance between them is sufficiently greater than the diameter of the substrate W. Further, the upper chucks 12A and 12B are also maintained in such a state that their distance from each other is sufficiently greater than the diameter of the substrate W. Moreover, the movable pedestal 32 of the pedestal apparatus 30 is arrange|positioned so that the center of the suction holding part 21 may be located in the center of the cup 61 in planar view. Further, on the movable pedestal 32, the lower surface cleaning device 50 is disposed in an approaching position. In addition, the elevating support portion 54 of the lower surface cleaning device 50 is in a state where the cleaning surface (upper portion) of the lower surface brush 51 is located below the suction holding portion 21 . In addition, in the water supply device 40, the plurality of support pins 41 are in a state located below the suction holding portion 21. Also, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 when seen from a plane is referred to as a plane reference position rp. In addition, the position of the movable pedestal 32 on the bottom surface part 2a when the center of the suction holding part 21 exists in the plane reference position rp in planar view is called a 1st horizontal position.

A substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1 . Specifically, immediately before loading of the substrate W, the shutter 91 opens the loading/unloading port 2x. After that, as indicated by the thick solid line arrow a1 in FIG. 4 , the hand (substrate holding unit) RH of the substrate transfer robot (not shown) passes through the loading/unloading port 2x at approximately the center of the unit housing 2. The substrate W is carried into the position. At this time, the substrate W held by the hand RH is between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B, as shown in FIG. 4 . Located.

Next, as indicated by the thick solid line arrow a2 in FIG. 5 , the lower chucks 11A and 11B are mutually positioned so that the plurality of support pieces of the lower chucks 11A and 11B are located below the periphery of the lower surface of the substrate W. getting closer In this state, the hand RH descends and leaves the carry-in/out port 2x. Thereby, a plurality of portions of the lower surface periphery of the substrate W held by the hand RH are supported by the plurality of support pieces of the lower chucks 11A and 11B. After the hand RH is withdrawn, the shutter 91 closes the carry-in/out port 2x.

Next, as indicated by the thick solid arrow a3 in FIG. 6 , the upper chucks 12A and 12B are brought closer to each other so that the plurality of holding pieces of the upper chucks 12A and 12B come into contact with the outer circumferential end of the substrate W. . The plurality of holding pieces of the upper chucks 12A and 12B abut against a plurality of portions of the outer circumferential end of the substrate W, so that the substrate W supported by the lower chucks 11A and 11B is moved to the upper chucks 12A and 12B. ) is further maintained by In addition, as shown by the thick solid line arrow a4 in FIG. 6, the center of the lower surface brush 51 is positioned at the plane reference position rp as the adsorption holder 21 deviates a predetermined distance from the plane reference position rp. To do so, the movable pedestal 32 moves forward from the first horizontal position. At this time, the position of the movable pedestal 32 located on the bottom surface portion 2a is called a second horizontal position.

Next, as indicated by the thick solid line arrow a5 in FIG. 7 , the elevating support portion 54 is raised so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W at the first height position. . Further, as indicated by the thick solid line arrow a6 in FIG. 7 , the lower surface brush 51 rotates (rotates) around an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51 .

At the bottom of FIG. 7 , an enlarged side view of a portion where the lower surface brush 51 contacts the lower surface of the substrate W is shown in the enlarged view. As shown in the balloon, in a state where the lower surface brush 51 is in contact with the substrate W, the liquid nozzle 52 and the gas blowing part 53 are held at positions close to the lower surface of the substrate W. do. At this time, the liquid nozzle 52 discharges the cleaning liquid toward the lower surface of the substrate W from a position near the lower surface brush 51, as indicated by the white arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, so that the lower surface brush 51 removes the liquid from the lower surface of the substrate W. The removed contaminants are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is attached to the elevating support portion 54 together with the lower surface brush 51. As a result, the cleaning liquid can be efficiently supplied to the cleaning portion of the lower surface of the substrate W by the lower surface brush 51 . Accordingly, consumption of the washing liquid is reduced, and excessive scattering of the washing liquid is suppressed.

Here, the upper surface 54u of the lifting support part 54 inclines obliquely downward in the direction away from the adsorption holding part 21. As shown in FIG. In this case, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the elevating support portion 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding portion 21. do.

In addition, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas blowing portion 53 adsorbs and holds the lower surface brush 51 as indicated by the white arrow a52 in the enlarged view of FIG. 7 . Gas is injected toward the lower surface of the substrate W at a position between the portions 21 . In this embodiment, the gas blowing part 53 is attached on the elevating support part 54 so that the gas blowing port may extend in the X direction. In this case, when gas is blown from the gas blowout part 53 to the lower surface of the substrate W, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21. . Accordingly, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from scattering toward the suction holding portion 21. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holder 21, and the suction surface of the suction holder 21 is cleaned. are kept

In the example of FIG. 7 , the gas blowing portion 53 injects gas obliquely upward from the gas blowing portion 53 toward the lower surface brush 51, as indicated by the white arrow a52, but the present invention Not limited. The gas blowing part 53 may blow gas from the gas blowing part 53 toward the lower surface brush 51 so as to follow the Z direction.

Next, in the state of FIG. 7 , when the cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the cleaning surface of the lower surface brush 51 moves away from the substrate W at a predetermined distance. To be spaced apart, the elevating support portion 54 descends. In addition, discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped. At this time, the injection of gas from the gas ejection unit 53 to the substrate W continues.

Then, as shown by the thick solid arrow a7 in FIG. 8 , the movable pedestal 32 is moved backward so that the suction holder 21 is positioned at the plane reference position rp. That is, the movable pedestal 32 moves from the second horizontal position to the first horizontal position. At this time, as the injection of gas from the gas ejection unit 53 to the substrate W continues, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

Next, as indicated by the thick solid line arrow a8 in FIG. 9 , the elevating support portion 54 is lowered so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding portion 21. do. Further, as indicated by the thick solid arrow a9 in FIG. 9 , the upper chucks 12A and 12B are separated from each other so that the plurality of holding pieces of the upper chucks 12A and 12B are separated from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

Then, as indicated by the thick solid arrow a10 in FIG. 9 , the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are located slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41 .

Next, as indicated by the thick solid arrow a11 in Fig. 10, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A and 11B move to a position where they do not overlap the substrate W supported by the plurality of support pins 41 in plan view. As a result, both of the upper holding devices 10A and 10B return to their initial states.

Next, as indicated by the thick solid arrow a12 in FIG. 11 , the pin connecting member 42 descends so that the upper ends of the plurality of support pins 41 are located below the suction holding portion 21 . As a result, the substrate W supported on the plurality of support pins 41 is received by the suction holding portion 21 . In this state, the suction holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Simultaneously with the lowering of the pin connecting member 42 or after completion of the lowering of the pin connecting member 42, the cup 61 rises from the lower cup position to the upper cup position, as indicated by the thick solid line arrow a13 in FIG. 11 . .

Next, as indicated by the thick solid arrow a14 in FIG. 12 , the suction holding portion 21 rotates around an axis in the vertical direction (the shaft center of the rotating shaft of the suction holding driving portion 22). As a result, the substrate W adsorbed and held by the adsorption holder 21 is rotated in a horizontal posture.

Next, the rotation support shaft 71 of the top surface cleaning device 70 rotates and descends. As a result, as indicated by the thick solid arrow a15 in FIG. 12 , the spray nozzle 73 moves to a position above the substrate W, and the distance between the spray nozzle 73 and the substrate W is predetermined. Descend to the distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. Also, the rotation support shaft 71 rotates. As a result, as indicated by the thick solid line arrow a16 in FIG. 12 , the spray nozzle 73 moves from a position above the rotating substrate W. By spraying the mixed fluid on the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

Further, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotation support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential end of the substrate W, as indicated by the thick solid line arrow a17 in FIG. 12 . Further, the central portion of the outer circumferential surface of the bevel brush 83 descends so as to contact the outer circumferential end of the substrate W. In this state, the bevel brush 83 rotates (rotates) around an axis in the vertical direction. As a result, contaminants adhering to the outer circumferential end of the substrate W are physically peeled off by the bevel brush 83 . Contaminants exfoliated from the outer circumferential end of the substrate W are washed off by the cleaning liquid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73 .

In addition, when cleaning the upper surface of the substrate W by the spray nozzle 73, the lifting support 54 so that the cleaning surface of the lower surface brush 51 comes into contact with the outer area of the lower surface of the substrate W at the second height position. ) rises. Further, as indicated by a thick solid line arrow a18 in FIG. 12 , the lower surface brush 51 rotates (rotates) around an axis in the vertical direction. In addition, the liquid nozzle 52 discharges the cleaning liquid toward the lower surface of the substrate W, and the gas ejection unit 53 injects gas toward the lower surface of the substrate W. In this state, as further indicated by the thick solid line arrow a19 in FIG. 12 , the movable support portion 55 advances and retreats between the approach position and the separation position on the movable pedestal 32 . As a result, the area outside the lower surface of the substrate W, which is adsorbed and held by the suction holding portion 21 and rotated, is cleaned by the lower surface brush 51 over the entire area.

Next, when the cleaning of the upper surface, the outer circumferential end, and the outer area of the lower surface of the substrate W is completed, spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Further, as indicated by the thick solid line arrow a20 in FIG. 13 , the spray nozzle 73 moves to a position on one side of the cup 61 (position in an initial state). Further, as indicated by the thick solid line arrow a21 in FIG. 13 , the bevel brush 83 moves to the position on the other side of the cup 61 (position in the initial state). Further, the rotation of the lower brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower brush 51 is separated from the substrate W by a predetermined distance. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W and the injection of the gas from the gas ejection unit 53 to the substrate W are stopped. In this state, when the adsorption holder 21 rotates at high speed, the cleaning liquid adhering to the substrate W is removed and the entire substrate W is dried.

Next, as indicated by the thick solid arrow a22 in Fig. 14, the cup 61 descends from the upper cup position to the lower cup position. Further, in preparation for a new substrate W being loaded into the unit housing 2, as indicated by the thick solid line arrow a23 in FIG. get closer to each other

Finally, the substrate W is carried out from within the unit housing 2 of the substrate cleaning apparatus 1 . Specifically, the shutter 91 opens the carry-in/out port 2x immediately before carrying out the substrate W. After that, as indicated by the thick solid arrow a24 in FIG. 15 , the hand (substrate holding unit) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the loading/unloading port 2x. Subsequently, the hand RH receives the substrate W on the suction holding unit 21 and removes it from the carry-in/out port 2x. After the hand RH is withdrawn, the shutter 91 closes the carry-in/out port 2x.

(3) Recovery operation of the substrate cleaning device

In the normal operation of the substrate cleaning apparatus 1 described above, when an abnormality occurs in the substrate cleaning apparatus 1, the normal operation is stopped and the position of the substrate W is determined by the substrate position determining unit 9J. do. Further, a recovery operation for recovering the substrate W from the unit housing 2 is executed. The recovery operation of the substrate cleaning apparatus 1 differs depending on the position of the substrate W determined by the substrate position determination unit 9J.

In addition, one or more liquid leakage sensors (not shown) are installed in the substrate cleaning apparatus 1 . In addition, an encoder (not shown) that detects the driving amount of an actuator such as a motor or a cylinder is installed in the substrate cleaning apparatus 1 . Substrate cleaning device (1) ) is determined to have occurred.

In the recovery operation of the substrate cleaning device 1, when it is determined that the substrate W is at the first height position, as shown in FIG. 6, the substrate W is held by the upper holding devices 10A and 10B. In addition to being held, the movable pedestal 32 is in the second horizontal position. In this case, as shown in FIG. 7 , the elevating support part 54 is lifted so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W at the first height position, thereby removing the liquid nozzle 52. and the gas blowing portion 53 is maintained at a position close to the lower surface of the substrate W.

In this state, the processing liquid is supplied by the liquid nozzle 52 to the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B. As a result, the central region of the lower surface of the substrate W is cleaned. Here, cleaning of the central region of the lower surface of the substrate W by the lower surface brush 51 may be further performed. After the supply of the processing liquid by the liquid nozzle 52 is finished, gas is supplied to the central region of the lower surface of the substrate W by the gas ejection unit 53 . Next, as shown in Fig. 8, the movable pedestal 32 moves to the first horizontal position. At this time, as the injection of gas from the gas ejection unit 53 to the substrate W continues, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

After that, as shown in FIGS. 9 and 10 , the elevating support portion 54 descends. Further, when the plurality of support pins 41 rise, the substrate W supported by the upper holding devices 10A and 10B is received by the plurality of support pins 41 . Next, as shown in FIG. 11 , when the plurality of support pins 41 descend, the substrate W supported on the plurality of support pins 41 is received by the lower holding device 20 . As a result, the center region of the lower surface of the substrate W is adsorbed and held by the lower holding device 20 . Also, the cup 61 rises to the upper cup position.

Subsequently, as shown in FIG. 12 , the substrate W is rotated by the lower holding device 20 . Further, the elevating support portion 54 is raised so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W at the second height position. In this state, the processing liquid is supplied from the liquid nozzle 52 to the outer region of the lower surface of the substrate W. As a result, the outer region of the lower surface of the substrate W is cleaned. Here, cleaning of the outer region of the lower surface of the substrate W by the lower surface brush 51 may be further performed.

After a predetermined period of time, while the rotation of the substrate W by the lower holding device 20 is maintained, the supply of the processing liquid by the liquid nozzle 52 is stopped. In this case, the cleaning liquid adhering to the substrate W is removed, so that the entire substrate W is dried. After the substrate W is dried, rotation of the substrate W by the lower holding device 20 is stopped. Moreover, as shown in FIG. 13, the elevating support part 54 descends. Further, as shown in Fig. 14, the cup 61 descends to the lower cup position.

After that, as shown in FIG. 15 , when the loading/unloading port 2x is opened, the substrate W is moved from the unit housing 2 by the hand RH of the substrate transfer robot through the loading/unloading port 2x. are taken out After the hand RH is pulled out, the carry-in/out port 2x is closed by the shutter 91, and the recovery operation of the substrate cleaning device 1 is ended.

In the recovery operation of the substrate cleaning device 1, when it is determined that the substrate W is at the second height position, as shown in FIG. 11, the substrate W is held by the lower holding device 20, In addition to being present, the movable pedestal 32 is in the first horizontal position. Also, the cup 61 is in the upper cup position. In this case, as shown in FIG. 12 , the substrate W is rotated by the lower holding device 20 . Further, the elevating support portion 54 is raised so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W at the second height position. In this state, the processing liquid is supplied from the liquid nozzle 52 to the outer region of the lower surface of the substrate W. As a result, the outer region of the lower surface of the substrate W is cleaned. Here, cleaning of the outer region of the lower surface of the substrate W by the lower surface brush 51 may be further performed.

After a predetermined period of time, while the rotation of the substrate W by the lower holding device 20 is maintained, the supply of the processing liquid by the liquid nozzle 52 is stopped. In this case, the cleaning liquid adhering to the substrate W is removed, so that the entire substrate W is dried. After the substrate W is dried, rotation of the substrate W by the lower holding device 20 is stopped. Moreover, as shown in FIG. 13, the elevating support part 54 descends. Further, as shown in Fig. 14, the cup 61 descends to the lower cup position.

After that, as shown in FIG. 15 , when the loading/unloading port 2x is opened, the substrate W is moved from the unit housing 2 by the hand RH of the substrate transfer robot through the loading/unloading port 2x. are taken out After the hand RH is pulled out, the carry-in/out port 2x is closed by the shutter 91, and the recovery operation of the substrate cleaning device 1 is ended.

In the recovery operation of the substrate cleaning apparatus 1, when it is determined that the substrate W is between the first height position and the second height position, as shown in FIG. 10, the substrate W has a plurality of support pins. In addition to being held by 41, the movable pedestal 32 is in the first horizontal position. In this case, as shown in FIG. 11 , when the plurality of support pins 41 descend, the substrate W supported on the plurality of support pins 41 is received by the lower holding device 20 . As a result, the center region of the lower surface of the substrate W is adsorbed and held by the lower holding device 20 . Also, the cup 61 rises to the upper cup position.

Subsequently, as shown in FIG. 12 , the substrate W is rotated by the lower holding device 20 . Further, the elevating support portion 54 is raised so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W at the second height position. In this state, the processing liquid is supplied from the liquid nozzle 52 to the outer region of the lower surface of the substrate W. As a result, the outer region of the lower surface of the substrate W is cleaned. Here, cleaning of the outer region of the lower surface of the substrate W by the lower surface brush 51 may be further performed.

After a predetermined period of time, while the rotation of the substrate W by the lower holding device 20 is maintained, the supply of the processing liquid by the liquid nozzle 52 is stopped. In this case, the cleaning liquid adhering to the substrate W is removed, so that the entire substrate W is dried. After the substrate W is dried, rotation of the substrate W by the lower holding device 20 is stopped. Moreover, as shown in FIG. 13, the elevating support part 54 descends. Further, as shown in Fig. 14, the cup 61 descends to the lower cup position.

After that, as shown in FIG. 15 , when the loading/unloading port 2x is opened, the substrate W is moved from the unit housing 2 by the hand RH of the substrate transfer robot through the loading/unloading port 2x. are taken out After the hand RH is pulled out, the carry-in/out port 2x is closed by the shutter 91, and the recovery operation of the substrate cleaning device 1 is ended.

(4) Substrate recovery process

16 and 17 are flowcharts showing a substrate recovery process by the controller 9 in FIG. 3 . The substrate recovery processing in FIGS. 16 and 17 is performed by the CPU of the control device 9 executing the substrate recovery program stored in the storage device on the RAM. The substrate recovery process is performed in parallel with the substrate cleaning process for causing the substrate cleaning apparatus 1 to perform the normal operation of FIGS. 4 to 15 . Hereinafter, the substrate recovery process will be described using the control device 9 of FIG. 3 and the flow charts of FIGS. 16 and 17 .

First, the substrate position determination unit 9J determines whether an abnormality has occurred in the substrate cleaning apparatus 1 (step S1). When no abnormality occurs in the substrate cleaning apparatus 1, it waits until an abnormality occurs in the substrate cleaning apparatus 1. When an abnormality occurs in the substrate cleaning apparatus 1, the substrate position determination unit 9J determines whether or not the substrate W is at the first height position (step S2). At this time, the substrate cleaning process is stopped. When the substrate W is at the first height position, the lower surface cleaning control unit 9E moves the lifting and lowering support unit 54 so that the cleaning surface of the lower surface brush 51 comes into contact with the lower surface central region of the substrate W at the first height position. ) is raised (step S3).

Next, the lower surface cleaning control unit 9E supplies the processing liquid to the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B through the liquid nozzle 52 (step S4). After a predetermined period of time, the lower surface cleaning controller 9E stops the supply of the treatment liquid through the liquid nozzle 52 (step S5). Further, the lower surface cleaning control unit 9E supplies gas to the central region of the lower surface of the substrate W through the gas blowing unit 53 (step S6).

Subsequently, the pedestal control unit 9C moves the movable pedestal 32 to the first horizontal position (step S7). After that, the lower surface cleaning control unit 9E stops the gas supply by the gas blowing unit 53 (step S8). Further, the lower surface cleaning control unit 9E lowers the elevating support unit 54 (step S9). Next, the water supply controller 9D raises and then lowers the plurality of support pins 41 to convey the substrate W from the first height position to the second height position (step S10).

Subsequently, the adsorption control unit 9B holds the substrate W conveyed in step S10 by the lower holding device 20 (step S11). Furthermore, the cup control part 9F raises the cup 61 to the upper cup position (step S12). After that, the adsorption control unit 9B rotates the substrate W by the lower holding device 20 (step S13). Next, the lower surface cleaning control unit 9E raises the elevation support portion 54 so that the cleaning surface of the lower surface brush 51 contacts the lower surface outer region of the substrate W at the second height position (step S14).

Subsequently, the lower surface cleaning controller 9E supplies the treatment liquid to the outer region of the lower surface of the substrate W through the liquid nozzle 52 (step S15). After a predetermined period of time, the lower surface cleaning controller 9E stops the supply of the treatment liquid through the liquid nozzle 52 (step S16). In this case, the entire substrate W is dried by rotation of the substrate W. After the substrate W is dried, the lower surface cleaning control unit 9E stops the rotation of the substrate W by the lower holding device 20 (Step S17). Further, the lower surface cleaning control unit 9E lowers the elevating support unit 54 (step S18). Moreover, the cup control part 9F lowers the cup 61 to the lower cup position (step S19).

After that, the carry-in/out control unit 9I opens the carry-in/out port 2x (step S20). After the substrate W is carried out of the unit housing 2 by the hand RH of the substrate transfer robot through the carry-in/out port 2x, the carry-in/out control unit 9I operates the carry-in/out port by the shutter 91. (2x) is closed (step S21).

When the substrate W is not at the first height position in step S2, the substrate position determination unit 9J determines whether or not the substrate W is at the second height position (step S22). When the substrate W is at the second height position, the substrate position determination section 9J proceeds to step S12. In this case, steps S12 to S21 are executed. On the other hand, if the substrate W is not at the second height position, the substrate position determination unit 9J proceeds to step S10. Thereby, steps S10 to S21 are executed. After step S21 is executed, the substrate recovery process ends.

(5) effect

In the substrate cleaning apparatus 1 according to the present embodiment, the substrate W is conveyed by the transfer device 40 at the first height position and the second height position. At the first height position, the outer peripheral end of the substrate W is held by the upper holding devices 10A and 10B. At the second height position, the central region of the lower surface of the substrate W is adsorbed and held by the lower holding device 20, and the substrate W is rotated around the vertical axis.

When contact is made with the lower surface of the substrate W held by the upper holding device 10A, 10B or the lower holding device 20, the brush 51 is moved up and down by the brush elevating driver 55b. The central region or the outer region of the lower surface of the substrate W is cleaned by the brush 51 on the lower surface. The position of the substrate W is determined by the substrate position determination section 9J.

When it is determined that the substrate W is at the first height position when an abnormality occurs in the substrate cleaning apparatus 1, the processing liquid is liquid in the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B. It is supplied by nozzle 52. Therefore, even when foreign matter adheres to the central region of the lower surface of the substrate W, the foreign matter is removed from the substrate W. Further, after the supply of the processing liquid by the liquid nozzle 52 is finished, the gas is supplied to the central region of the lower surface of the substrate W by the gas ejection unit 53 . Therefore, even when the substrate W is conveyed to the second height position and is adsorbed and held by the lower holding device 20, the liquid component does not penetrate into the adsorbing portion of the lower holding device 20.

Then, the board|substrate W is conveyed to the 2nd height position by the water transfer device 40 so that it may be held by the lower holding device 20. Then, while the substrate W is held at the second height position by the lower holding device 20 and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate W by the liquid nozzle 52 . Therefore, even when foreign matter adheres to the region outside the lower surface of the substrate W, the foreign matter is removed from the substrate W. In addition, since the rotation of the substrate W is maintained after the supply of the processing liquid by the liquid nozzle 52 is finished, the entire substrate W is dried. Therefore, even when the substrate W is unloaded from the substrate cleaning device 1, no liquid component adheres to the hand RH of the substrate carrying robot.

When it is determined that the substrate W is at the second height position when an abnormality occurs in the substrate cleaning apparatus 1, in a state in which the substrate W is rotated while being held by the lower holding device 20, the The treatment liquid is supplied to the outer region of the lower surface by the liquid nozzle 52 . Therefore, even when foreign matter adheres to the region outside the lower surface of the substrate W, the foreign matter is removed from the substrate W. In addition, since the rotation of the substrate W is maintained after the supply of the processing liquid by the liquid nozzle 52 is finished, the entire substrate W is dried. Therefore, even when the substrate W is unloaded from the substrate cleaning device 1, no liquid component adheres to the hand RH of the substrate carrying robot.

When it is determined that the substrate W is between the first height position and the second height position when an abnormality occurs in the substrate cleaning device 1, the substrate W is held by the lower holding device 20. 40) to convey to the second height position. Then, while the substrate W is held at the second height position by the lower holding device 20 and rotated, the processing liquid is supplied to the outer region of the lower surface of the substrate W by the liquid nozzle 52 . Therefore, even when foreign matter adheres to the region outside the lower surface of the substrate W, the foreign matter is removed from the substrate W. In addition, since the rotation of the substrate W is maintained after the supply of the processing liquid by the liquid nozzle 52 is finished, the entire substrate W is dried. Therefore, even when the substrate W is unloaded from the substrate cleaning device 1, no liquid component adheres to the hand RH of the substrate carrying robot.

As a result of these substrate recovery processes, the substrate W can be appropriately recovered from the substrate cleaning device 1 when an abnormality occurs.

(6) other embodiments

(a) In the above embodiment, in the normal operation of the substrate cleaning apparatus 1, the cleaning liquid is supplied to the lower surface of the substrate W from the liquid nozzle 52 when cleaning the central region of the lower surface of the substrate W; Embodiment is not limited to this. Instead of supplying the cleaning liquid to the lower surface of the substrate W from the liquid nozzle 52, the lower surface brush 51 may be impregnated with a certain amount of cleaning liquid before cleaning the central region of the lower surface of the substrate W. In this case, the liquid nozzle 52 does not need to be installed in the substrate cleaning apparatus 1 .

Further, in the configuration in which the liquid nozzle 52 is not provided in the substrate cleaning device 1, when it is determined that the substrate W is at the first height position when an abnormality occurs in the substrate cleaning device 1, the upper holding device The processing liquid is not supplied to the central region of the lower surface of the substrate W held by 10A and 10B. Also in this configuration, when a liquid component adheres to the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B when an abnormality occurs in the substrate cleaning device 1, the lower surface of the substrate W The central area is dried by the gas supplied by the gas supply.

Therefore, even when the substrate W, to which gas has been supplied to the lower surface central region, is transported to the second height position and held by the lower holding device 20 by adsorption, the liquid component remains in the adsorption portion of the lower holding device 20. there is no intrusion This prevents the lower retaining device 20 from being damaged. As a result, the substrate W can be appropriately recovered from the substrate cleaning device 1 when an abnormality occurs.

(b) In the above embodiment, the transfer device 40 is a substrate conveying unit and conveys the substrate W at the first height position and the second height position, but the embodiment is not limited to this. When at least one of the upper holding devices 10A and 10B and the lower holding device 20 is configured to be able to move up and down, the water supply device 40 does not need to be installed. In this case, at least one of the upper holding devices 10A and 10B and the lower holding device 20 is a substrate transport unit, and the substrate W moves between the first height position and the second height position by moving the substrate transport unit up and down. is returned

(c) In the above embodiment, in the normal operation of the substrate cleaning apparatus 1, after the central region of the lower surface of the substrate W is cleaned, the outer region of the lower surface of the substrate W is cleaned, but the embodiment is not limited to this. don't In the normal operation of the substrate cleaning apparatus 1, the central region of the lower surface of the substrate W may be cleaned after the outer region of the lower surface of the substrate W is cleaned.

In this case, the substrate W carried into the substrate cleaning device 1 is initially adsorbed and held by the lower holding device 20, and the lower surface central region, outer circumferential end and upper surface thereof are cleaned. After that, the substrate W held by the lower holding device 20 is received and held by the upper holding devices 10A and 10B. In this state, the central region of the lower surface of the substrate W is cleaned. The substrate W after washing is carried out of the unit housing 2 from the upper holding devices 10A and 10B.

Alternatively, in the normal operation of the substrate cleaning apparatus 1, after the cleaning of the central region of the lower surface of the substrate W and the outer region of the lower surface of the substrate W are sequentially performed, the central region of the lower surface of the substrate W is cleaned again. It can be.

(d) In the above embodiment, the substrate recovery process is performed in parallel with the substrate cleaning process, but the embodiment is not limited to this. The substrate recovery process may be executed in response to a user's start command. In this case, step S1 in the substrate recovery process of FIG. 16 is omitted.

(7) Correspondence between each element of the claim and each part of the embodiment

Hereinafter, examples of correspondence between each constituent element of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. As each element of the claim, various other elements having the constitution or function described in the claim may be used.

In the above embodiment, the substrate W is an example of the substrate, the substrate cleaning device 1 is an example of the substrate cleaning device, and the upper holding devices 10A and 10B are examples of the first substrate holding portion. The lower holding device 20 is an example of the second substrate holding unit, the water supply device 40 is an example of the substrate conveying unit, the lower surface brush 51 is an example of the cleaning tool, and the lower brush lifting driver 55b is the cleaning tool lifting unit. Yes. The liquid nozzle 52 is an example of the processing liquid supply unit, the gas blowing unit 53 is an example of the gas supply unit, the substrate position determination unit 9J is an example of the substrate position determination unit, and the control device 9 is an example of the control unit. Yes.

Claims (10)

As a substrate cleaning device for cleaning the lower surface of the substrate,
a first substrate holding portion holding an outer circumferential end of the substrate at a first height position;
a second substrate holder for adsorbing and holding a central region of the lower surface of the substrate at a second height position below the first height position to rotate the substrate around a vertical axis;
a substrate conveying unit for conveying the substrate at the first height position and the second height position;
A cleaning tool for cleaning a central region of the lower surface of the substrate or an outer region of the lower surface surrounding the central region of the lower surface of the substrate;
a cleaning tool elevating portion for elevating the cleaning tool so as to be in contact with the lower surface of the substrate held by the first or second substrate holding portion;
a gas supply unit capable of discharging gas toward the lower surface of the substrate;
a substrate position determination unit for determining the position of the substrate;
When it is determined that the substrate is at the first height position by the substrate position determination unit when an abnormality occurs in the substrate cleaning apparatus, gas is supplied to the central region of the lower surface of the substrate held by the first substrate holding unit. A substrate cleaning apparatus comprising a control unit for controlling the gas supply unit as much as possible. The method of claim 1,
A processing liquid supply unit capable of supplying a processing liquid toward the lower surface of the substrate is further provided;
The control unit may, when it is determined by the substrate position determination unit that the substrate is at the first height position when an abnormality occurs in the substrate cleaning apparatus, the center region of the lower surface of the substrate held by the first substrate holding unit. and controls the gas supply unit to supply gas to a central region of the lower surface of the substrate after supply of the processing liquid by the processing liquid supply unit is finished. . The method of claim 2,
The control unit may control the substrate carrying unit so that the substrate, to which gas is supplied to the central region of the lower surface, is held at the second height position by the second substrate holding unit, and rotate the second substrate while holding the substrate. In addition to controlling the holding unit, the processing liquid supply unit is controlled so that the processing liquid is supplied to an area outside the lower surface of the substrate, and the second substrate holding unit is controlled so that the rotation of the substrate is maintained after a predetermined period of time. A substrate cleaning device that controls the treatment liquid supply unit so that supply is stopped. According to claim 2 or claim 3,
The control unit controls the second substrate holding unit to rotate while holding the substrate when it is determined by the substrate position determining unit that the substrate is at the second height position when an abnormality occurs in the substrate cleaning apparatus. , Controlling the processing liquid supply unit so that the processing liquid is supplied to an area outside the lower surface of the substrate, and controlling the second substrate holding unit so that the rotation of the substrate is maintained after a predetermined time, so that the supply of the processing liquid is stopped A substrate cleaning device that controls a liquid supply unit. According to claim 2 or claim 3,
The control unit determines that the substrate is positioned at the second height position when it is determined by the substrate position determining unit that the substrate is between the first height position and the second height position when an abnormality occurs in the substrate cleaning apparatus. Controlling the substrate carrying unit to be held by the second substrate holding unit and controlling the second substrate holding unit to rotate while holding the substrate, and supplying the processing liquid to an area outside the lower surface of the substrate A substrate cleaning apparatus comprising: controlling a supply unit, and controlling the processing liquid supply unit to stop supply of the processing liquid while controlling the second substrate holding unit so that rotation of the substrate is maintained after a predetermined period of time. A substrate cleaning method for cleaning the lower surface of a substrate by a substrate cleaning device, comprising:
holding an outer circumferential end of the substrate by a first substrate holder at a first height position;
rotating the substrate about a vertical axis by adsorbing and holding a central region of the lower surface of the substrate by a second substrate holder at a second height position below the first height position;
conveying the substrate by a substrate conveying unit between the first height position and the second height position;
elevating the cleaning tool so as to come into contact with the lower surface of the substrate held by the first or second substrate holding part;
cleaning a central region of the lower surface of the substrate or an outer region of the lower surface surrounding the central region of the lower surface by the cleaning tool;
determining the position of the substrate;
supplying gas by a gas supply unit to a central region of the lower surface of the substrate held by the first substrate holding unit when it is determined that the substrate is at the first height position when an abnormality of the substrate cleaning device occurs; Including, a substrate cleaning method. The method of claim 6,
The step of supplying gas to the central region of the lower surface of the substrate by a gas supply unit,
supplying a processing liquid by a processing liquid supply unit to a central region of the lower surface of the substrate held by the first substrate holding unit;
and supplying gas from the gas supply unit to a central region of the lower surface of the substrate after the supply of the processing liquid by the processing liquid supply unit ends. The method of claim 7,
holding the substrate supplied with gas to a central region of the lower surface at the second height position by the second substrate holder;
rotating the second substrate holding portion holding the substrate;
supplying a processing liquid by the processing liquid supply unit to an outer region of the lower surface of the substrate rotated by the second substrate holding unit;
A step of stopping the supply of the processing liquid by the processing liquid supply unit while maintaining the rotation of the substrate by the second substrate holding unit after a predetermined time after the supply of the processing liquid by the processing liquid supply unit is started; To, a substrate cleaning method. According to claim 7 or claim 8,
rotating the second substrate holding portion holding the substrate when it is determined that the substrate is at the second height position when an abnormality of the substrate cleaning device occurs;
supplying a processing liquid by the processing liquid supply unit to an outer region of the lower surface of the substrate rotated by the second substrate holding unit;
A step of stopping the supply of the processing liquid by the processing liquid supply unit while maintaining the rotation of the substrate by the second substrate holding unit after a predetermined time after the supply of the processing liquid by the processing liquid supply unit is started; To, a substrate cleaning method. According to claim 7 or claim 8,
conveying the substrate to the second height position by the substrate conveying unit when it is determined that the substrate is between the first height position and the second height position when an abnormality of the substrate cleaning device occurs;
holding the substrate at the second height position by the second substrate holder;
rotating the second substrate holding portion holding the substrate;
supplying a processing liquid by the processing liquid supply unit to an outer region of the lower surface of the substrate rotated by the second substrate holding unit;
A step of stopping the supply of the processing liquid by the processing liquid supply unit while maintaining the rotation of the substrate by the second substrate holding unit after a predetermined time after the supply of the processing liquid by the processing liquid supply unit is started; To, a substrate cleaning method.

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