KR102549530B1 - Fabrication method of electric device and electric device - Google Patents

Abstract

An electronic device includes a first electronic component, a second electronic component provided on the first electronic component, and an anisotropic conductive layer. The first electronic component includes a first base substrate and a plurality of first pads provided on the first base substrate. The anisotropic conductive layer couples the first electronic component and the second electronic component to each other. The anisotropic conductive layer includes an adhesive layer including a first adhesive portion and a second adhesive portion and a plurality of conductive particles. The first bonding portion overlaps a corresponding first pad among the first pads on a plane. The second adhesive portion is adjacent to the first adhesive portion on a plane. The conductive particles are provided in the adhesive layer. The conductive particles include a plurality of active particles provided in the first adhesive portion and a plurality of inactive particles provided in the second adhesive portion and different from the active particles.

Description

Electronic device manufacturing method and electronic device {FABRICATION METHOD OF ELECTRIC DEVICE AND ELECTRIC DEVICE}

The present invention relates to a method for manufacturing an electronic device and an electronic device, and more particularly, to a method and electronic device for manufacturing an electronic device in which substrates are bonded by an anisotropic conductive film.

Generally, an electronic device includes two or more electronic components. For example, electronic devices such as mobile phones, notebook computers, and televisions include a display panel generating an image, a main wiring board, and a flexible wiring board.

The two electronic components are electrically connected to each other. Through the coupling of the pad parts, the two electronic components are electrically connected. A process of electrically connecting the pad parts of the two electronic components (hereinafter referred to as an bonding process) includes aligning and bonding the pad parts of the two electronic components.

An object of the present invention is to provide a manufacturing method of an electronic device in which electronic components are coupled by an anisotropic conductive film capable of reducing defects such as shorts occurring during manufacturing.

Another object of the present invention is to provide an electronic device in which electronic components are coupled by an anisotropic conductive film capable of reducing defects such as shorts occurring during manufacturing.

A manufacturing method of an electronic device according to an embodiment of the present invention includes preparing a first electronic component and a second electronic component, preparing an anisotropic conducting film (ACF), and applying the anisotropic conductive film to the first electronic component. Disposing on one electronic component and applying heat or pressure to the anisotropic conductive film so that the first electronic component and the second electronic component are coupled. The first electronic component includes a first base substrate and a plurality of first pads provided on the first base substrate. The anisotropic conductive film includes a base layer including a first portion and a second portion adjacent to the first portion, a plurality of active particles provided on the first portion, and a plurality of active particles provided on the second portion and It contains a plurality of different inert particles. In the disposing of the anisotropic conductive film, the first portion of the anisotropic conductive film overlaps with a corresponding first pad among the first pads, and the second portion of the anisotropic conductive film is disposed such that it does not overlap with the first pad. .

In the preparing of the anisotropic conductive film, the anisotropic conductive film includes preparing a base layer including the first portion and a second portion adjacent to the first portion and a plurality of conductive particles provided in the base layer; and It may be manufactured through a conductive particle etching step of etching the conductive particles provided in the second portion to form the inactive particles in the second portion.

In the manufacturing method of an electronic device according to an embodiment of the present invention, the conductive particle etching step is provided on the base layer, and a plurality of openings overlapping the second portion and not overlapping the first portion are defined. A step of providing a mask may be further included.

The etching of the conductive particles may be performed by dry etching using plasma or wet etching using an etching solution.

In the conductive particle etching step, the active particles are substantially spherical first metal particles, and each of the inactive particles is a second metal particle that is different from the first metal particle and does not have a substantially spherical shape. It may be a metal particle.

In the conductive particle etching step, each of the conductive particles includes a first core and a first metal shell entirely covering the first core, and each of the inactive particles includes a second core and at least a portion of the second core. It may include a second metal shell exposing to the outside.

In the providing of the conductive particles, each of the conductive particles may include a metal.

In the providing of the conductive particles, each of the conductive particles includes nickel (Ni), gold (Au), silver (Ag), cobalt (Co), chromium (Cr), iron (Fe), copper (Cu), aluminum It may include at least one of (Al), tin (Sn), and zinc (Zn).

In the step of providing the base layer, the base layer may include an epoxy resin, an acrylic resin, a phenol resin, a melamine resin, a diallylphthalate resin, a urea resin, a polyimide resin, a polystyrene resin, a polyurethane resin, a polyethylene resin, and a polyvinyl acetate resin. It may include at least one or more of them.

An electronic device according to an embodiment of the present invention includes a first electronic component, a second electronic component provided on the first electronic component, and an anisotropic conductive layer. The first electronic component includes a first base substrate and a plurality of first pads provided on the first base substrate. The anisotropic conductive layer couples the first electronic component and the second electronic component to each other. The anisotropic conductive layer includes an adhesive layer including a first adhesive portion and a second adhesive portion and a plurality of conductive particles. The first bonding portion overlaps a corresponding first pad among the first pads on a plane. The second adhesive portion is adjacent to the first adhesive portion on a plane. The conductive particles are provided in the adhesive layer. The conductive particles include a plurality of active particles provided in the first adhesive portion and a plurality of inactive particles provided in the second adhesive portion and different from the active particles.

The second electronic component may include a second base substrate and a plurality of second pads provided on the second base substrate.

The active particles electrically connect each of the first pads and the second pads to each other in the first adhesive portion, and the inactive particles pass between the first pads and the second pads in the second adhesive portion. can be insulated.

Each of the active particles may be a first metal particle having a substantially spherical shape, and each of the inactive particles may be a second metal particle that is different from the first metal particle and does not have a substantially spherical shape. there is.

Each of the active particles includes a first core and a first metal shell entirely covering the first core, and each of the inactive particles is disposed such that at least a portion of the second core is exposed to the outside. A second metal shell may be included.

The manufacturing method of an electronic device according to an embodiment of the present invention can reduce defects such as short circuits occurring in the manufacturing process.

An electronic device according to an embodiment of the present invention can reduce defects such as a short circuit occurring during a manufacturing process.

1 is a plan view of an electronic device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line Ⅰ-' in FIG. 1 .
3A is a side view of a second electronic component according to an embodiment of the present invention.
3B is a plan view of a second electronic component according to an embodiment of the present invention.
FIG. 4A is a plan view illustrating separated pad parts of the two electronic components shown in FIG. 1 .
FIG. 4B is a plan view illustrating coupled pad parts of the two electronic components shown in FIG. 1 .
5 is a schematic cross-sectional view corresponding to line II-II' of FIG. 4B.
6A is a schematic cross-sectional view of an active particle according to an embodiment of the present invention.
Figure 6b is a schematic cross-sectional view of an inert particle according to an embodiment of the present invention.
7A is a schematic cross-sectional view of an active particle according to another embodiment of the present invention.
7B is a schematic cross-sectional view of an inert particle according to another embodiment of the present invention.
8A is a flowchart illustrating a method of manufacturing an electronic device according to an embodiment of the present invention.
8B is a flowchart illustrating a method of manufacturing an anisotropic conductive film according to an embodiment of the present invention.
9A to 9F show a method of manufacturing an electronic device for forming the structure shown in FIG. 5 step by step.

The above objects, other objects, features and advantages of the present invention will be easily understood through the following preferred embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content will be thorough and complete and the spirit of the present invention will be sufficiently conveyed to those skilled in the art.

Like reference numerals have been used for like elements throughout the description of each figure. In the accompanying drawings, the dimensions of the structures are shown enlarged than actual for clarity of the present invention. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded. In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where it is "directly on" the other part, but also the case where another part is present in the middle. Conversely, when a part such as a layer, film, region, plate, etc. is said to be "under" another part, this includes not only the case where it is "directly below" the other part, but also the case where another part is in the middle.

Hereinafter, an electronic device according to an embodiment of the present invention will be described.

1 is a plan view of an electronic device according to an embodiment of the present invention. FIG. 2A is a cross-sectional view taken along line II′ of FIG. 1 . 3A is a side view of a second electronic component according to an embodiment of the present invention. 3B is a plan view of a second electronic component according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , an electronic device 10 according to an embodiment of the present invention includes first to third electronic components 110 , 120 , and 130 . The first to third electronic components 110, 120 and 130 are electrically connected. In this embodiment, the first electronic component 110 may be an electro-optical panel, the second electronic component 120 may be a connection wiring board, and the third electronic component 130 may be a main circuit board. Although this embodiment shows the electronic device 10 including three second electronic components 120 as an example, the present invention is not limited thereto. Depending on the purpose or size, the electronic device 10 may include one or two second electronic components 120 or four or more second electronic components 120 .

As shown in FIG. 1 , the electro-optical panel 110 (hereinafter referred to as a display panel) may be a display panel that displays a desired image by applying a driving signal to a plurality of pixels PX. The plurality of pixels PX may be arranged in a matrix form along the orthogonal first and second directions DR1 and DR2 . In one embodiment of the present invention, each of the pixels PX may display at least one of red color, green color, and blue color. In one embodiment of the present invention, the pixels PX may display at least one of white color, cyan color, and magenta color. The pixels PX may be defined as the display portion of the display panel 110 .

Depending on the type of pixels PX, the display panel 110 may be any one of a liquid crystal display panel, an organic light emitting display panel, and an electrowetting display panel. Hereinafter, in this embodiment, the display panel 110 may be an organic light emitting display panel.

On a plane, the display panel 110 includes a display area DA in which a plurality of pixels PX are disposed, a non-display area BA surrounding the display area DA, and the second electronic component 120 are combined. It can be divided into a mounting area (MA). In one embodiment of the present invention, the non-display area BA and the mounting area MA may not be distinguished. The non-display area BA may be omitted, or the mounting area MA may be a part of the non-display area BA.

As shown in FIG. 2 , the display panel 110 includes a display substrate 112, a display element layer 114 disposed on the display substrate 112, and an encapsulation layer disposed on the display element layer 114 ( 116) may be included. The display substrate 112 may include a first base substrate (110-BS in FIG. 5) and a plurality of insulating layers, functional layers, and conductive layers constituting gate wires (not shown) and data wires (not shown). can The display device layer 114 may include a plurality of insulating layers, functional layers, and conductive layers constituting the plurality of pixels PX. The display element layer 114 may be a display unit that generates an image. The encapsulation layer 116 may be disposed on the display element layer 114 to protect the display element layer 114 .

A black matrix (not shown) may be disposed in the non-display area BA to block light. A gate driving circuit (not shown) may be provided in the non-display area BA to supply a gate signal to the plurality of pixels PX. In one embodiment of the present invention, a data driving circuit (not shown) may be provided in the non-display area BA. An input pad unit (IPP-110 in FIG. 4A ) for receiving a signal supplied from the second electronic component 120 is disposed in the mounting area MA. A plurality of input pads (IPD-110 in FIG. 4A) are disposed in the input pad unit. First signal wires (SL-110 in FIG. 5) may be connected to each of the input pads.

As shown in FIGS. 1 and 2 , the second electronic component 120 may include a flexible wiring board 122 and a data driving circuit 125 . The data driving circuit 125 may include at least one driving chip. The data driving circuit 125 may be electrically connected to wires of the flexible wiring board 122 . The data driving circuit 125 and the flexible wiring board 122 may be electrically connected by the anisotropic conductive layer 140 .

When the second electronic component 120 includes the data driving circuit 125, the pad portion (not shown) of the display panel 110 includes data pad electrodes and control signal wires electrically connected to the data wires. Control signal pad electrodes electrically connected to each other may be included. Data lines may be connected to the pixels PX, and control signal lines may be connected to the gate driving circuit. In this embodiment, the second electronic component 120 has a chip on film structure, but is not limited thereto. For example, the second electronic component 120 may include only the flexible wiring board 122 without including the data driving circuit 125 . In this case, the data driving circuit 125 may be included in the mounting area MA of the first electronic component 110 or the third electronic component 130 .

3A and 3B, the flexible wiring board 122 includes an insulating layer (not shown), a plurality of pads (CPD, IPD-120, OPD-120) and a plurality of second signal wires (SL-120). include them The pads CPD, IPD-120, and OPD-120 and the second signal wires SL-120 may be disposed on the insulating layer. The insulating layer may include polyimide.

The pads CPD, IPD-120, and OPD-120 include connection pads CPD connected to connection terminals (not shown) of the data driving circuit 125 and input pads connected to the third electronic component 130. IPD-120, and output pads OPD-120 connected to the display panel 110. The input pads (IPD-120) are defined as input pad units (IPP-120) disposed on one side of the flexible wiring board 122, and the output pads (OPD-120) are on the other side of the flexible wiring board 122. It may be defined as the arranged output pad part OPP-120. In this embodiment, the connection pads CPD are aligned to overlap each other on both sides of the data driving circuit 125, but otherwise, the connection pads CPD are randomly arranged to correspond to the connection terminals of the data driving circuit 125. can be arranged

In this embodiment, an input pad unit (IPP-120) and an output pad unit (OPP-120) including one pad row are exemplarily illustrated. The pad row includes a plurality of pads arranged along the first direction DR1 . Although not shown, in another embodiment of the present invention, each of the input pad unit (IPP-120) and the output pad unit (OPP-120) may include a plurality of pad rows.

Some of the second signal wires SL-120 connect the connection pads CPD and the input pads IPD-120, and others connect the connection pads CPD and the output pads OPD-120. connect Although not shown, the second signal lines SL- 120 may directly connect some of the input pads IPD- 120 and some of the output pads OPD- 120.

The flexible wiring board 122 may include alignment marks AM2 and AM20 used in a component coupling process to be described later. 3B shows four first alignment marks AM2 spaced apart from the plurality of pads CPD, IPD-120, and OPD-120, input pads IPD-120, and output pads OPD-120. Four second alignment marks AM20 connected to are shown as an example. At least one of the first and second alignment marks AM2 and AM20 may be omitted.

In one embodiment of the present invention, the exposed surface of the input pads (IPD-120) and the output pads (OPD-120) is defined as a bonding surface (CS) of the flexible wiring board 122, and faces the bonding surface. The surface to be bonded is defined as the non-bonded surface (NCS). In this embodiment, the data driving circuit 125 is illustrated as being disposed on the coupling surface CS, but is not limited thereto, and the data driving circuit 125 may be disposed on the non-coupling surface NCS.

Referring back to FIGS. 1 and 2 , the third electronic component 130 provides image data, a control signal, a power supply voltage, and the like to the display panel 110 or the data driving circuit 125 . The third electronic component 130 is a wiring board different from the flexible wiring board 122 and may include active elements and passive elements. The third electronic component 130 is a flexible wiring board or a rigid wiring board, and includes a pad part (not shown) connected to the flexible wiring board 122 .

Referring to FIGS. 1 to 3B , the output pad part OPP- 120 of the flexible wiring board 122 and the pad part of the display panel 110 may be electrically connected by the anisotropic conductive layer 140 . The input pad part (IPP-120) of the flexible wiring board 122 and the pad part (not shown) of the third electronic component 130 may also be electrically connected by the anisotropic conductive layer 140.

The pad part of the display panel 110 may include pads corresponding to the output pads OPD-120 of the flexible wiring board 122 . Also, the pad part of the third electronic component 130 may include pads corresponding to the input pads IPD-120 of the flexible wiring board 122 .

Hereinafter, the electrical connection structure of the first to third electronic components 110, 120, and 130 will be described in more detail with reference to the pad portion of the display panel 110 and the output pad portion (OPP-120) of the flexible wiring board 122. Explain in detail. The electrical connection structure of the second electronic component 120 and the third electronic component 130 is an input pad portion (IPP-110) of the display panel 110 and an output pad portion (OPP-110) of the flexible wiring board 122, which will be described later. 120) may correspond to the electrical connection structure. The electrical connection structure of the flexible wiring board 122 and the data driving circuit 125 in the second electronic component 120 is also described below. It may correspond to the electrical connection structure of the output pad unit OPP-120. Although the electronic device 10 according to this embodiment has been described as including the first to third electronic components 110, 120, and 130, according to an embodiment of the present invention, the first electronic component 110 and Any one of the third electronic components 130 may be omitted.

FIG. 4A is a plan view illustrating separated pad parts of the two electronic components shown in FIG. 1 . FIG. 4B is a plan view illustrating coupled pad parts of the two electronic components shown in FIG. 1 .

As shown in FIG. 4A , the display panel 110 includes an input pad part (IPP- 110 ) corresponding to the output pad part (OPP- 120 ) of the flexible wiring board 122 . The input pad unit IPP-110 includes input pads IPD-110 corresponding to the output pads OPD-120 of the flexible wiring board 122. In this embodiment, the input pads (IPD-110) and the output pads (OPD-120) are illustrated as being in 1:1 correspondence, but are not limited thereto. In another embodiment of the present invention, the input pad unit IPP-110 and the output pad unit OPP-120 may include different numbers of pads and different numbers of pad rows.

The display panel 110 may include first and second alignment marks AM1 and AM10 corresponding to the first and second alignment marks AM2 and AM20 of the flexible wiring board 122 . Any one of the first and second alignment marks AM1 and AM10 may be omitted.

As shown in FIG. 4B , the output pads OPD-120 of the flexible wiring board 122 and the input pads IPD-110 of the display panel 110 are electrically connected with the anisotropic conductive layer 140 therebetween. connected to The first and second alignment marks AM2 and AM20 of the flexible wiring board 122 and the first and second alignment marks AM1 and AM10 of the display panel 110 are output in a component combining process described later. It is used to align the positions of the pad part OPP-120 and the input pad part IPP-110.

5 is a schematic cross-sectional view corresponding to line II-II' of FIG. 4B.

Referring to FIGS. 4A, 4B, and 5 , the first electronic component 110 is coupled to the second electronic component 120 with the anisotropic conductive layer 140 interposed therebetween. Specifically, the first pads of the first electronic component 110 and the second pads of the second electronic component 120 are coupled with the anisotropic conductive layer 140 interposed therebetween. In this embodiment, the input pad part (IPP- 110 ) of the display panel 110 and the output pad part (OPP- 120 ) of the flexible wiring board 122 may be coupled by the anisotropic conductive layer 140 .

The input pad part IPP- 110 of the display panel 110 may include a plurality of input pads IPD- 110, first signal lines SL- 110, and a first insulating layer 110-IL. . The first signal wires SL- 110 may be disposed on the first base substrate 110 -BS. The first insulating layer 110 -IL may be disposed on the first base substrate 110 -BS. The first insulating layer 110 -IL may include barrier layers and passivation layers. The input pads IPD-110 are disposed on the first insulating layer 110-IL, and the first signal wires are provided through the plurality of through holes 110-ILOP defined in the first insulating layer 110-IL. It can be connected to (SL-110). The first insulating layer 110 -IL may include polyimide.

Output pads OPD- 120 are disposed on the second insulating layer 120 -IL of the flexible wiring board 122 . Although not shown, second signal wires (SL-120 in FIG. 3B) and a solder resist layer (not shown) may be disposed on the second insulating layer 120-IL. The output pads OPD- 120 may be exposed through through-holes formed in the solder resist layer. The output pads OPD- 120 may be connected to the second signal wires. The second insulating layer 120 -IL may include polyimide. Although not shown, the flexible wiring board 122 may further include a second base substrate (not shown) on which the second insulating layer 120 -IL is disposed. Alternatively, the second insulating layer 120 -IL may correspond to the second base substrate.

The anisotropic conductive layer 140 includes a plurality of conductive particles 141 and an adhesive layer 142 . The adhesive layer 142 includes a first adhesive portion 142-1 overlapping the input pads IPD-110 of the display panel 110 on a flat surface and a second adhesive portion adjacent to the first adhesive portion 142-1 on a flat surface ( 142-2). Conductive particles 141 are disposed in the adhesive layer 142 . The conductive particles 141 include a plurality of active particles 141-1 disposed on the first adhesive portion 142-1 and a plurality of active particles 141-1 disposed on the second adhesive portion 142-2 and different from the active particles 141-1. of the inactive particles 141-2.

Each of the active particles 141-1 may have electrical conductivity. Each of the active particles 141-1 may be conductive particles. Each of the active particles 141-1 may include a metal. Specifically, each of the active particles 141-1 includes nickel (Ni), iron (Fe), copper (Cu), aluminum (Al), tin (Sn), zinc (Zn), chromium (Cr), cobalt ( Co), silver (Ag), or gold (Au) may include at least one or more. Each of the active particles 141-1 may be a spherical metal particle containing metal. Each of the active particles 141-1 may have a core-shell structure including a core and a shell surrounding the core.

Each of the inactive particles 141-2 may be non-conductive. Each of the inactive particles 141-2 may have a form in which conductivity is lost as a part of the active particles 141-1 are etched.

The adhesive layer 142 may include an insulating polymer. The adhesive layer 142 may include, for example, at least one of an epoxy resin, an acrylic resin, a phenol resin, a melamine resin, a diallylphthalate resin, a urea resin, a polyimide resin, a polystyrene resin, a polyurethane resin, a polyethylene resin, and a polyvinyl acetate resin. may contain more than In particular, the adhesive layer 142 may include at least one of an epoxy resin and an acrylic resin. The epoxy resin may be composed of a phenoxy polymer having a repeating structure of bisphenol A and ether (-C-O-C-) bonds and having an epoxy reactive group at a terminal portion. Acrylic resin has a urethane bond (-NHCO-O) connection structure, and acrylate or methacrylate reactive urethane (meta) acrylate polymer (urethane (meta) ) acrylate polymer).

The anisotropic conductive layer 140 couples the display panel 110 and the flexible wiring board 122 to each other. The anisotropic conductive layer 140 may couple the input pad part (IPP-110) of the display panel 110 and the output pad part (OPP-120) of the flexible wiring board 122 to each other. Specifically, the active particles 141-1 disposed in the first bonding portion 142-1 of the anisotropic conductive layer 140 connect each of the input pads IPD-110 and each of the output pads OPD-120 to each other. can be electrically connected. The active particles 141-1 may contact each of the input pads IPD-110 and the output pads OPD-120. Each of the active particles 141-1 has electrical conductivity, so that an electrical signal generated from each of the input pads (IPD-110) can be transmitted to each of the output pads (OPD-120). Alternatively, each of the active particles 141-1 may transfer an electric signal generated from each of the output pads OPD-120 to each of the input pads IPD-110. In this embodiment, the areas and positions of the input pads (IPD-110) and the output pads (OPD-120) are shown to correspond identically, but are not limited thereto, and the input pads (IPD-110) and the output pads (OPD-120) are not limited thereto. -120) may be provided in various forms electrically connected by the active particles 141-1.

The active particles 141-1 in the first adhesive part 142-1 are provided between the corresponding input pads IPD-110 and output pads OPD-120, respectively, so that the corresponding input pads IPD-120 respectively correspond to each other. 110) and the output pad (OPD-120) can be electrically connected. A second adhesive portion 142-2 is provided between the input pad (IPD-110) and the output pad (OPD-120) that do not correspond to each other. Here, the corresponding input pads (IPD-110) and output pads (OPD-120) may refer to input pads (IPD-110) and output pads (OPD-120) overlapping each other on a plane. Input pads (IPD-110) and output pads (OPD-120) that do not correspond to each other may refer to input pads (IPD-110) and output pads (OPD-120) that do not overlap each other on a plane. Since the inactive particles 141-2 in the second adhesive part 142-2 are non-conductive, they are not electrically connected between the input pad (IPD-110) and the output pad (OPD-120) that do not correspond to each other. Through this, defects due to shorts between the pads (IPD-110 and OPD-120) occurring in the manufacturing process can be prevented.

6A is a schematic cross-sectional view of an active particle according to an embodiment of the present invention. Figure 6b is a schematic cross-sectional view of an inert particle according to an embodiment of the present invention.

Referring to FIG. 6A , each of the conductive particles 141 may be a first metal particle having a substantially spherical shape. Among the conductive particles 141 , the active particles 141 - 1 disposed on the first adhesive portion 142 - 1 may have the same shape as the first metal particles. Each of the active particles 141-1 may have a spherical shape or an ellipsoid shape in which the spherical shape is pressed by pressure. In FIG. 6A, the conductive particles 141 are illustrated as having a spherical shape without protrusion on the surface, but are not limited thereto, and the conductive particles 141 may include various types of protrusions (not shown) on the surface. .

Referring to FIG. 6B , each of the conductive particles 141 may be a second metal particle that is different from the first metal particle and does not have a substantially spherical shape. Among the conductive particles 141 , the inactive particles 141 - 2 positioned on the second adhesive portion 142 - 2 may have the same shape as the second metal particles. Each of the inactive particles 141-2 has a shape different from that of the active particles 141-1. Here, the different shape means that it does not have a substantially spherical shape, and when it simply has a spherical shape with a reduced volume, it does not correspond to this in view of the similar shape. Illustratively, as shown in FIG. 6B , each of the inactive particles 141-2 may have a sphere cap shape in which only a lower part of the active particles 141-1 remains. However, it is not limited thereto, and may have various shapes in which a portion of the sphere is substantially lost. Each of the inactive particles 141-2 may have a plurality of irregularities on its surface. However, the shape of the inactive particles 141-2 is not limited thereto and may have various shapes. The volume of the inactive particles 141-2 may be greater than about 0% and less than about 50% of the volume of the active particles 141-1.

7A is a schematic cross-sectional view of an active particle according to another embodiment of the present invention. 7B is a schematic cross-sectional view of an inert particle according to another embodiment of the present invention.

Referring to FIG. 7A , each of the conductive particles 141 includes a core-shell including a first core 141-1C and a first metal shell 141-1S surrounding the first core 141-1C ( Core-Shell) structure. The first core 141-1C may be an insulating polymer such as polystyrene resin or acrylic resin. The first metal shell 141-1S may be coated with a conductive metal thin film such as nickel or gold. Among the conductive particles 141, the active particles 141-1 disposed on the first adhesive portion 142-1 may have a shape as shown in FIG. 7A. In FIG. 7A, the surface of the first metal shell 141-1S of the conductive particles 141 is illustrated as having a smooth shape without protrusion, but is not limited thereto, and the surface of the first metal shell 141-1S has various shapes. It may include a protrusion (not shown) of the form.

Referring to FIG. 7B , each of the conductive particles 141 includes a second core 141-2C and a second metal shell 141-2S disposed to expose at least a portion of the second core 141-2C. can do. Among the conductive particles 141, the inactive particles 141-2 positioned on the second adhesive portion 142-2 may have a shape as shown in FIG. 7B. In FIG. 7B, the second metal shell 141-2S covering the lower part of the inactive particle 141-2 is shown as an example, but is not limited thereto, and the second metal shell 141-2S has various shapes. It may or may not be partially disposed as . The second metal shell 141-2S may have a plurality of irregularities on its surface.

Hereinafter, a method of manufacturing an electronic device according to an embodiment of the present invention will be described.

8A is a flowchart illustrating a method of manufacturing an electronic device according to an embodiment of the present invention. 8B is a flowchart illustrating a method of manufacturing an anisotropic conductive film according to an embodiment of the present invention.

As shown in FIG. 8A , a method of manufacturing an electronic device according to an embodiment of the present invention includes preparing a first electronic component and a second electronic component including a plurality of first pads ( S100 ), a first part and preparing an anisotropic conducting film (ACF) including a base layer including a second portion, a plurality of active particles provided on the first portion, and a plurality of inactive particles provided on the second portion ( S200), disposing the anisotropic conductive film such that the first portion overlaps the corresponding first pad and the second portion does not overlap the first pad (S300), and the first electronic component and the second and applying heat or pressure to the anisotropic conductive film to couple the electronic components (S400). As shown in FIG. 8B, in the step of preparing an anisotropic conductive film (S300), the anisotropic conductive film is a step of preparing a base layer and a plurality of conductive particles provided in the base layer (S210), inactive particles in the second part and a conductive particle etching step ( S220 ) of etching the conductive particles provided to the second portion to form.

9A to 9F show a method of manufacturing an electronic device for forming the structure shown in FIG. 5 step by step.

Referring to FIGS. 1 and 9A to 9F , in this embodiment, the first electronic component 110 may be an electro-optical panel (hereinafter referred to as a display panel), and the second electronic component 120 may be a connection wiring board. The second electronic component 120 may include a flexible wiring board 122 and a data driving circuit 125 . The plurality of first pads included in the first electronic component 110 may be a plurality of input pads (IPD-110) included in the display panel 110 . The plurality of second pads included in the second electronic component 120 may be a plurality of output pads OPD- 120 included in the flexible wiring board 122 .

9A to 9C describe a method of manufacturing the anisotropic conductive film 140' in the step of preparing the anisotropic conductive film (S200) according to an embodiment of the present invention.

8B and 9A, in the manufacturing method of the anisotropic conductive film 140' according to an embodiment of the present invention, a base layer 142' and a plurality of conductive particles 141 disposed in the base layer 142' ) are prepared (S210).

The base layer 142' includes a first portion 142'-1 and a second portion 142'-2 adjacent to the first portion 142'-1. The base layer 142' may include an insulating polymer. The base layer 142 ′ may include, for example, at least one of an epoxy resin, an acrylic resin, a urea resin, a polyimide resin, a polystyrene resin, a polyurethane resin, a polyethylene resin, and a polyvinyl acetate resin. In particular, the base layer 142' may include at least one of an epoxy resin and an acrylic resin. The epoxy resin may be composed of a phenoxy polymer having a repeating structure of bisphenol A and ether (-C-O-C-) bonds and having an epoxy reactive group at a terminal portion. Acrylic resin has a urethane bond (-NHCO-O) connection structure, and acrylate or methacrylate reactive urethane (meta) acrylate polymer (urethane (meta) ) acrylate polymer).

A plurality of conductive particles 141 are provided in the base layer 142'. Although not shown, the step of preparing the base layer 142' and the conductive particles 141 (S210) further includes mixing the plurality of conductive particles 141 with the insulating polymer constituting the base layer 142'. can do.

Each of the conductive particles 141 may include a conductive material. Each of the conductive particles 141 may include a metal. Specifically, each of the conductive particles 141 includes nickel (Ni), iron (Fe), copper (Cu), aluminum (Al), tin (Sn), zinc (Zn), chromium (Cr), or cobalt (Co). , silver (Ag), or gold (Au).

Referring to FIGS. 8B, 9B, and 9C, a method of manufacturing an anisotropic conductive film 140' according to an embodiment of the present invention is provided to a second portion 142'-2 of conductive particles 141. Etching the conductive particles (S220) is included.

The conductive particle etching step ( S220 ) may be performed by dry etching or wet etching. Dry etching may be performed by volatilizing the conductive material of the conductive particles 141 through plasma. Wet etching may be performed by dissolving the conductive material of the conductive particles 141 through an etching solution (EM), which is a soluble chemical. In FIGS. 9B and 9C , the wet etching through the etching solution (EM) is illustratively illustrated, but the conductive particle etching step ( S220 ) may be performed by various methods, such as dry etching, without being limited thereto.

In the conductive particle etching step (S220), the conductive particles 141 provided to the first portion 142'-1 are not etched, and only the conductive particles 141 provided to the second portion 142'-2 are selectively is etched into In order to selectively etch only the conductive particles 141 provided to the second portion 142'-2, in the case of dry etching, a plasma treatment time interval is provided so that the second portion 142'-2 is provided with Conductive particles 141 are etched. In the case of wet etching, the etching solution (EM) is selectively applied to the second portion 142'-2 so that the conductive particles 141 provided on the second portion 142'-2 are etched. Alternatively, as shown in FIG. 6C, a mask including a plurality of openings MS-OP defined to overlap the second portion 142'-2 without overlapping the first portion 142'-1 ( MS) may be provided to block the plasma or etching solution (EM) from reaching the conductive particles 141 provided in the first portion 142'-1 in the conductive particle etching step (S220).

9D to 9F sequentially illustrate a manufacturing method of an electronic device according to an embodiment of the present invention.

8A and 9D , the manufacturing method of an electronic device according to an embodiment of the present invention includes preparing a display panel and a flexible wiring board (S100), preparing an anisotropic conductive film (S200), and anisotropic conductive An anisotropic conductive film such that the first portion 142'-1 of the film overlaps the input pad IPD-110 of the display panel and the second portion 142'-2 does not overlap the input pad IPD-110. and disposing on the display panel 110 (S300).

Referring to FIGS. 9C and 9D , in the conductive particle etching step (S220), a plurality of inactive particles 141-2 that lose conductivity may be provided to the second portion 142'-2 through etching. Since the conductive particles 141 provided to the first portion 142'-1 are not etched in the conductive particle etching step (S220), the plurality of active particles 141-1 having conductivity are included in the first portion 142'-1. 1) may be provided.

The active particles 141-1 may have electrical conductivity. Each of the active particles 141-1 may be a metal particle having a substantially spherical shape. Each of the active particles 141-1 may have a spherical shape or an elliptical sphere pressed by pressure. Alternatively, each of the active particles 141-1 may have a core-shell structure including a core and a metal shell surrounding the core. Each of the active particles 141-1 may be filled with a conductive material or have a metal shell to have conductivity and electrically connect between the input pad (IPD-110) and the output pad (OPD-120).

In each of the inactive particles 141-2, at least a portion of the active particle 141-1 may be etched to insulate between the input pad (IPD-110) and the output pad (OPD-120). For example, each of the inactive particles 141-2 may have a sphere cap shape in which an upper part of the metal sphere-shaped active particle 141-1 is etched. Each of the inactive particles 141-2 may have a volume greater than about 0% and less than or equal to 50% of the volume of the active particle 141-1. Alternatively, in each of the inactive particles 141-2, the metal shell of the active particle 141-1 having a core-shell structure is etched and at least a portion of the insulating core is exposed, so that the input pad (IPD-1) 110) and the output pad (OPD-120) can be insulated. Although not shown, a plurality of irregularities may be formed on the surface of the inactive particles 141-2 by an etching process.

Referring back to FIGS. 8A and 9D , in the manufacturing method of an electronic device according to an embodiment of the present invention, the first part 142'-1 of the anisotropic conductive film 140' is connected to the input pad IPD-110. The anisotropic conductive film 140' is disposed on the display panel 110 so that it overlaps and the second part 142'-2 does not overlap the input pad IPD-110 (S300). Accordingly, the active particles 141-1 provided on the first portion 142'-1 also overlap the input pad IPD-110, and the inactive particles provided on the second portion 142'-2 141-2 is arranged so as not to overlap with the input pad (IPD-110). Although not shown, a flexible wiring board 122 may be prepared on the display panel 110 and the anisotropic conductive film 140'.

Referring to FIGS. 8A, 9E, and 9F, the manufacturing method of an electronic device according to an embodiment of the present invention includes a step (S400) of combining a display panel 110 and a flexible wiring board (122 in FIG. 5). do.

Referring to FIGS. 8A and 9E , the component bonding step ( S400 ) is performed by forming an anisotropic conductive layer ( 300 in FIG. 5 ) by applying heat or pressure to the anisotropic conductive film 140'. When heat or pressure is applied to the anisotropic conductive film 140', the active particles 141-1 provided in the first part 142'-1 are compressed to the input pads IPD-110, thereby generating an external electrical signal. It can be transmitted to the input pads (IPD-110). In the case of the portion of the first base substrate 110-BS where the input pad (IPD-110) is not provided, the second portion 142'-2 is filled and cured by heat or pressure to form a flexible wiring board (FIG. 5). 122). Although not shown, after the flexible wiring board 122 is disposed on the anisotropic conductive film 140 ′, heat or pressure may be applied to couple the display panel 110 and the flexible wiring board 122 .

Referring to FIGS. 8A and 9F , the display panel 110 and the flexible wiring board 122 are coupled to each other with the anisotropic conductive layer 140 interposed therebetween through a component bonding step (S400). Accordingly, a structure as shown in FIG. 5 may be formed. The flexible wiring board 122 may include a plurality of output pads OPD-120. The anisotropic conductive layer 140 includes an adhesive layer 142 including a first adhesive portion 142-1 and a second adhesive portion 142-2, and a plurality of conductive particles 141 provided in the adhesive layer 142. . The conductive particles 141 include a plurality of active particles 141-1 provided in the first adhesive portion 142-1 and a plurality of inactive particles 141-2 provided in the second adhesive portion 142-2. can do. The input pads IPD-110 may be coupled to the output pads OPD-120 by the anisotropic conductive layer 140. Specifically, the input pads IPD-110 may be combined with the output pads OPD-120 by the first adhesive portion 142-1 of the adhesive layer 142. The active particles 141-1 provided in the first adhesive portion 142-1 may electrically connect the input pads IPD-110 and the output pads OPD-120 to each other. The active particles 141-1 may contact both the input pad (IPD-110) and the output pad (OPD-120), respectively. Since each of the inactive particles 141-2 provided in the second adhesive part 142-2 has non-conductive properties, each of the inactive particles 141-2 is input pad (IPD-110) and output pad (OPD-110). -120) are not electrically connected.

The active particles 141-1 in the first adhesive part 142-1 are provided between the corresponding input pads IPD-110 and output pads OPD-120, respectively, so that the corresponding input pads IPD-120 respectively correspond to each other. 110) and the output pad (OPD-120) are electrically connected. A second adhesive portion 142-2 is provided between the input pad (IPD-110) and the output pad (OPD-120) that do not correspond to each other. Here, the corresponding input pads (IPD-110) and output pads (OPD-120) may refer to input pads (IPD-110) and output pads (OPD-120) overlapping each other on a plane. Input pads (IPD-110) and output pads (OPD-120) that do not correspond to each other may refer to input pads (IPD-110) and output pads (OPD-120) that do not overlap each other on a plane. Since the inactive particles 141-2 in the second adhesive part 142-2 have non-conductive properties, there is no electrical connection between the input pad (IPD-110) and the output pad (OPD-120) that do not correspond to each other. Through this, defects due to shorts between the pads (IPD-110 and OPD-120) occurring in the manufacturing process can be prevented.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art can implement the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

10: electronic device 110: first electronic component
120: second electronic component 130: third electronic component
140: anisotropic conductive layer 141: conductive particles
141-1: active particles 141-2: inactive particles
142: adhesive layer 142-1: first adhesive portion
142-2: second adhesive part IPD-110: input pad
OPD-120: Output Pad

Claims (16)

preparing a first electronic component and a second electronic component including a first base substrate and a plurality of first pads provided on the first base substrate;
A base layer comprising a first portion and a second portion adjacent to the first portion, a plurality of active particles provided in the first portion, and a plurality of inactive particles provided in the second portion and different from the active particles preparing an anisotropic conducting film (ACF) containing them;
disposing the anisotropic conductive film on the first electronic component such that the first portion overlaps a corresponding first one of the first pads and the second portion does not overlap the first pad; and
and applying at least one of heat and pressure to the anisotropic conductive film so that the first electronic component and the second electronic component are coupled. According to claim 1,
In the step of preparing the anisotropic conductive film
The anisotropic conductive film
preparing a base layer including the first portion and a second portion adjacent to the first portion and a plurality of conductive particles provided in the base layer; and
A method of manufacturing an electronic device manufactured through a conductive particle etching step of etching conductive particles provided in the second portion to form the inactive particles in the second portion. According to claim 2,
The conductive particle etching step
Provided on the base layer,
The method of manufacturing an electronic device further comprising providing a mask defining a plurality of openings overlapping the second portion and not overlapping the first portion. According to claim 2,
The conductive particle etching step
A method of manufacturing an electronic device performed by dry etching using plasma or wet etching using an etching solution. According to claim 2,
In the conductive particle etching step
Each of the active particles is
A first metal particle having a substantially spherical shape,
Each of the inert particles is
A method of manufacturing an electronic device, wherein the second metal particle is different from the first metal particle and does not have a substantially spherical shape. According to claim 2,
In the conductive particle etching step
Each of the active particles is
a first core; and
Including a first metal shell entirely covering the first core,
Each of the inert particles is
a second core; and
A method of manufacturing an electronic device including a second metal shell exposing at least a portion of the second core to the outside. According to claim 2,
In the step of providing the conductive particles
Each of the conductive particles is
A method of manufacturing an electronic device containing metal. According to claim 7,
In the step of providing the conductive particles
Each of the conductive particles is
Among nickel (Ni), gold (Au), silver (Ag), cobalt (Co), chromium (Cr), iron (Fe), copper (Cu), aluminum (Al), tin (Sn) and zinc (Zn) A method of manufacturing an electronic device including at least one of the above. According to claim 2,
In the step of providing the base layer
the base layer
Method for manufacturing an electronic device comprising at least one of an epoxy resin, an acrylic resin, a phenol resin, a melamine resin, a diallylphthalate resin, a urea resin, a polyimide resin, a polystyrene resin, a polyurethane resin, a polyethylene resin, and a polyvinyl acetate resin . a first electronic component including a first base substrate and a plurality of first pads provided on the first base substrate;
a second electronic component provided on the first electronic component; and
an anisotropic conductive layer coupling the first electronic component and the second electronic component to each other;
The anisotropic conductive layer is
an adhesive layer including a first adhesive portion overlapping a corresponding one of the first pads on a plane and a second adhesive portion non-overlapping the first pad on a plane; and
Including a plurality of conductive particles provided in the adhesive layer,
The conductive particles are
a plurality of active particles provided on the first adhesive portion; and
Provided in the second adhesive portion and comprising a plurality of inactive particles different from the active particles,
Each of the active particles is
a first core; and
Including a first metal shell entirely covering the first core,
Each of the inert particles is
a second core; and
An electronic device comprising a second metal shell disposed to expose at least a portion of the second core to the outside. According to claim 10,
The second electronic component
a second base substrate; and
An electronic device comprising a plurality of second pads provided on the second base substrate. According to claim 11,
The active particles are
electrically connecting a second pad overlapping the first pad on a plane among the first pad and the second pad in the first adhesive part to each other;
The inert particles are
The electronic device that insulates between the first pad and a second pad that does not overlap the first pad on a plane among the second pads in the second adhesive part. a first electronic component including a first base substrate and a plurality of first pads provided on the first base substrate;
a second electronic component provided on the first electronic component; and
an anisotropic conductive layer coupling the first electronic component and the second electronic component to each other;
The anisotropic conductive layer
an adhesive layer including a first adhesive portion overlapping a corresponding one of the first pads on a plane and a second adhesive portion non-overlapping the first pad on a plane; and
Including a plurality of conductive particles provided in the adhesive layer,
The conductive particles are
a plurality of active particles provided on the first adhesive portion; and
Provided in the second adhesive portion and comprising a plurality of inactive particles different from the active particles,
Each of the active particles is
A first metal particle having a substantially spherical shape,
Each of the inert particles is
An electronic device that is a second metal particle that is different from the first metal particle and does not have a substantially spherical shape. delete According to claim 10,
The first electronic component is
a display panel for displaying an image;
The second electronic component
An electronic device including at least one of a flexible wiring board and a data driving circuit. According to claim 10,
The first electronic component is
A main circuit board providing image data, control signals, or power supply voltage to the display panel;
The second electronic component
An electronic device including at least one of a flexible wiring board and a data driving circuit.

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