KR102541682B1 - 산업용 표면보호 테이프 - Google Patents
산업용 표면보호 테이프 Download PDFInfo
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- KR102541682B1 KR102541682B1 KR1020220172908A KR20220172908A KR102541682B1 KR 102541682 B1 KR102541682 B1 KR 102541682B1 KR 1020220172908 A KR1020220172908 A KR 1020220172908A KR 20220172908 A KR20220172908 A KR 20220172908A KR 102541682 B1 KR102541682 B1 KR 102541682B1
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- KR
- South Korea
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- surface protection
- adhesive layer
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- Prior art date
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000002216 antistatic agent Substances 0.000 claims abstract description 12
- 125000005442 diisocyanate group Chemical group 0.000 claims abstract description 12
- 239000010419 fine particle Substances 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
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- 239000011777 magnesium Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
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- MMEJYPZZFYTVLJ-WAYWQWQTSA-N (z)-2-(2-prop-2-enoyloxyethyl)but-2-enedioic acid Chemical compound OC(=O)\C=C(C(O)=O)\CCOC(=O)C=C MMEJYPZZFYTVLJ-WAYWQWQTSA-N 0.000 description 1
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- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
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- 239000002253 acid Substances 0.000 description 1
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- 125000003118 aryl group Chemical group 0.000 description 1
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- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
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- NDOGLIPWGGRQCO-UHFFFAOYSA-N hexane-2,4-dione Chemical compound CCC(=O)CC(C)=O NDOGLIPWGGRQCO-UHFFFAOYSA-N 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C08K5/00—Use of organic ingredients
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
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Abstract
Description
구분 | 초기 점착력 (mm) |
점착력 (gf/inch) |
박리 후 피착제 오염성 | 점착성 유지력 (분) |
내구성 |
실시예 1 | 5.1 | 380 | ○ | 370 | ○ |
실시예 2 | 5.0 | 400 | ○ | 410 | ○ |
실시예 3 | 5.1 | 400 | ○ | 420 | ○ |
비교예 1 | 3.7 | 150 | × | 250 | × |
Claims (6)
- 투명 베이스 필름 및 상기 베이스 필름의 적어도 일면에 형성된 점착제층을 포함하는 산업용 표면보호 테이프로,
상기 점착제층은 아크릴계 공중합체 100중량부, 디이소시아네이트계 경화제 0.2~10중량부, 금속계 미립자 5~20중량부, 케토엔올 호변이성체 화합물 0.1~5중량부, 폴리에테르변성 실록산 화합물 1~10중량부, 대전방지제 0.1~10중량부 및 면섬유 분말 1~5중량부를 포함하고,
상기 면섬유 분말은 질산은으로 코팅된 것으로, 10~1,000nm의 평균 입경을 갖는 것을 특징으로 하는 산업용 표면보호 테이프.
- 제1항에 있어서,
상기 점착제층은,
판상 무기입자 1~5중량부를 더 포함하는 것을 특징으로 하는 산업용 표면보호 테이프.
- 제1항에 있어서,
상기 점착제층은,
주석계 촉매 1~5중량부를 더 포함하는 것을 특징으로 하는 산업용 표면보호 테이프.
- 제1항에 있어서,
상기 대전방지제는 Li[(FSO2)2N], Na[(FSO2)2N], K[(FSO2)2N], Ca[(FSO2)2N]2 및 Mg[(FSO2)2N]2로 구성된 군으로부터 선택된 1종 이상의 것임을 특징으로 하는 산업용 표면보호 테이프.
- 삭제
- 삭제
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Cited By (5)
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KR102647101B1 (ko) * | 2023-08-09 | 2024-03-13 | 주식회사 정석케미칼 | 신장률, 인장강도 및 접착강도가 향상된 아크릴 접착제 조성물 |
KR20250040767A (ko) | 2023-09-15 | 2025-03-25 | 주식회사 이노텍화학 | 산업용 보호필름 제조방법 |
KR20250042302A (ko) | 2023-09-20 | 2025-03-27 | 주식회사 이노텍화학 | 산업용 보호필름 원단 제조용 원료 조성물 |
KR20250042864A (ko) | 2023-09-20 | 2025-03-28 | 주식회사 이노텍화학 | 폴리에틸렌을 주재료로 하는 산업용 보호필름원단의 제조방법 |
KR20250042865A (ko) | 2023-09-20 | 2025-03-28 | 주식회사 이노텍화학 | 산업용 보호필름원단 제조용 제조설비 |
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KR102647101B1 (ko) * | 2023-08-09 | 2024-03-13 | 주식회사 정석케미칼 | 신장률, 인장강도 및 접착강도가 향상된 아크릴 접착제 조성물 |
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KR20250042864A (ko) | 2023-09-20 | 2025-03-28 | 주식회사 이노텍화학 | 폴리에틸렌을 주재료로 하는 산업용 보호필름원단의 제조방법 |
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