KR102539495B1 - Flexible display panel and flexible display device - Google Patents

Abstract

The present embodiments relate to a flexible display panel including a via hole in a non-display area of the flexible display panel and a flexible display device. In the present embodiments, a driver IC is connected to a via hole located in a non-display area of the flexible display panel, so that the driver IC is bonded to the rear surface of the flexible display panel, thereby realizing a thin bezel of the flexible display panel. let it be In addition, by bonding the driver integrated circuit through the via hole, the laser release process of separating the glass from the flexible substrate and the driver integrated circuit bonding process can be separated, thereby reducing the occurrence of defects due to the laser release process.

Description

Flexible display panel and flexible display device {FLEXIBLE DISPLAY PANEL AND FLEXIBLE DISPLAY DEVICE}

The present embodiments relate to a flexible display panel and a flexible display device including the same.

As the information society develops, demands for display devices for displaying images are increasing in various forms.

Accordingly, in recent years, various types of display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display device (OLED) are being used. there is.

Recently, a flexible display device that can be bent, bent, or rolled without special damage through a thin and flexible substrate like paper, unlike general flat panel display devices, has been developed.

Such a flexible display device can be used in a general TV as well as a mobile technology environment, and can be manufactured using clothing or textiles, so it can be used beyond the scope of application of existing flat panel display devices, such as electronic newspapers, e-books, computers, automobile-related displays, It can be used in various application fields such as wearable displays.

In the manufacturing process of the flexible display panel in such a flexible display device, a display material layer, a thin film transistor layer, a flexible substrate layer, which is a polyimide layer on which circuit elements are formed, a release layer (a-Si) and a carrier glass are formed from the top. It is formed and progressed sequentially.

Next, when laser is irradiated through the carrier glass, the release layer and the carrier glass layer are separated from the flexible substrate layer, thereby manufacturing a flexible display panel.

Meanwhile, a driver integrated circuit for driving the flexible display panel is attached to one side of the flexible display panel, and an anisotropic conductive film (hereinafter referred to as "ACF"), which is a conductive adhesive, is used between the flexible display panel and the driver integrated circuit. It can be attached by applying.

In this case, since the flexible display panel and the driver integrated circuit are attached using heat and pressure, the portion to which the driver integrated circuit is attached has higher energy density than the display area of the flexible display panel in the laser process, and thus process defects may occur.

In addition, since the driver integrated circuit is attached to the side of the flexible display panel, the width of the non-display area is widened, making it difficult to implement a flexible display device with a narrow bezel.

An object of the present embodiments is to provide a flexible display panel and a flexible display device having a structure capable of reducing defects occurring in a manufacturing process of the flexible display panel.

An object of the present embodiments is to provide a flexible display panel and a flexible display device in which a narrow bezel is implemented by reducing the width of a non-display area of the flexible display panel.

In one aspect, the present embodiments may provide a flexible display panel including a flexible substrate including a display area and a non-display area, and a pad part disposed in the non-display area on an upper surface of the flexible substrate.

In such a flexible display panel, the non-display area of the flexible substrate may include a via hole (first via hole) penetrating the flexible substrate.

Also, the pad part positioned on the upper surface of the flexible substrate may include a via hole (second via hole) at a position in contact with the first via hole of the flexible substrate.

In this case, the second via hole included in the pad part may have the same diameter as the diameter of the first via hole included in the flexible substrate and may have a depth smaller than the thickness of the pad part.

A driver integrated circuit for driving the flexible display panel may be disposed on the rear surface of the flexible display panel.

Here, the driver IC may be a source driver IC or a gate driver IC.

Such a driver integrated circuit may include a via hole (third via hole) at a position in contact with the first via hole included in the flexible substrate.

A first via hole included in the flexible substrate, a second via hole included in the pad part, and a third via hole included in the driver IC may be filled with a metal material, and the flexible substrate, the pad part, and the driver IC may fill the via holes. can be joined through

A flexible printed circuit board bonded to the driver integrated circuit may be disposed on the rear surface of the driver integrated circuit.

In this case, the driver IC and the flexible printed circuit board may be bonded to each other by another via hole disposed apart from the third via hole included in the driver IC.

Here, the driver integrated circuit and the flexible printed circuit board may be disposed inward from an outer surface of the flexible board.

In another aspect, the present embodiments include a flexible display panel including a display area and a non-display area and a via hole positioned in the non-display area, a plurality of gate driver integrated circuits positioned on the side or rear surface of the flexible display panel, and A flexible display device including a plurality of source driver integrated circuits may be provided.

In such a flexible display device, at least one driver integrated circuit of the gate driver integrated circuit and the source driver integrated circuit is located on the rear surface of the flexible display panel and is bonded to the flexible display panel by a via hole located in a non-display area of the flexible display panel. can

In addition, a flexible printed circuit board located on the rear surface of the driver integrated circuit and bonded to the driver integrated circuit by a via hole spaced apart from the via hole included in the driver integrated circuit may be further included.

According to the present embodiments, the occurrence of defects due to a laser process can be reduced by bonding a driver integrated circuit that drives the flexible display panel through a via hole located in a non-display area of the flexible display panel.

According to the present embodiments, the width of the non-display area is reduced and a narrow bezel is implemented by attaching a driver integrated circuit that drives the flexible display panel to the rear surface (rear surface) of the flexible display panel through a via hole included in the flexible display panel. It is possible to provide a flexible display panel and a flexible display device.

1 is a diagram showing a schematic configuration of a flexible display device according to the present embodiments.
2 is a diagram showing an example of a connection structure between a flexible display panel and a driver integrated circuit in a flexible display device according to the present embodiments.
FIG. 3 is a cross-sectional view of a connection structure between the flexible display panel of FIG. 2 and a driver integrated circuit.
4A and 4B are diagrams illustrating an example of a laser release process among manufacturing processes of a flexible display panel having the structure of FIG. 3 .
5A and 5B are diagrams illustrating another example of a connection structure between a flexible display panel and a driver integrated circuit in a flexible display device according to the present embodiments.
6 and 7 are views illustrating a cross-sectional example of a connection structure between the flexible display panel and the driver integrated circuit of FIG. 5B and a plan view of a pad unit.
FIG. 8 is a view showing another example of a cross section of a connection structure between the flexible display panel of FIG. 5B and a driver integrated circuit.
9A and 9B are diagrams illustrating examples of a laser release process and a driver integrated circuit bonding process among manufacturing processes of a flexible display panel having the structure of FIGS. 6 and 8 .
10A to 10D are diagrams showing examples of a manufacturing process of a flexible display panel according to the present embodiments in detail.
11A to 11D are diagrams showing in detail another example of a manufacturing process of a flexible display panel according to the present embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention are described in detail below with reference to exemplary drawings. In adding reference numerals to components of each drawing, the same components may have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, order, or number of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element is or may be directly connected to that other element, but intervenes between each element. It will be understood that may be "interposed", or each component may be "connected", "coupled" or "connected" through other components.

1 is a diagram showing a schematic configuration of a flexible display device 100 according to the present embodiments.

Referring to FIG. 1 , in the flexible display device 100 according to the present embodiments, a plurality of gate lines GL and a plurality of data lines DL are disposed, and the gate lines GL and data lines DL are A data voltage applied to the flexible display panel 110 including a plurality of pixels 200 disposed in an intersecting area, a gate driver 120 driving a plurality of gate lines GL, and a plurality of data lines DL It includes a data driver 130 that supplies , and a controller 140 that controls driving of the gate driver 120 and the data driver 130 .

The gate driver 120 sequentially drives the plurality of gate lines GL by sequentially supplying scan signals (gate signals) to the plurality of gate lines GL.

The data driver 130 drives the plurality of data lines DL by supplying data voltages to the plurality of data lines DL.

The controller 140 controls the gate driver 120 and the data driver 130 by supplying various control signals to the gate driver 120 and the data driver 130 .

The controller 140 starts scanning according to the timing implemented in each frame, converts input image data input from the outside to suit the data signal format used by the data driver 130, and outputs the converted image data. , data drive is controlled at an appropriate time according to the scan.

The gate driver 120 sequentially supplies a gate signal of an on voltage or an off voltage to the plurality of gate lines GL under the control of the controller 140 to operate the plurality of gate lines GL. run sequentially.

The gate driver 120 may be positioned on only one side of the flexible display panel 110 or on both sides of the flexible display panel 110 according to a driving method.

In addition, the gate driver 120 may include one or more gate driver integrated circuits.

Each gate driver integrated circuit is connected to a bonding pad of the flexible display panel 110 by a tape automated bonding (TAB) method or a chip on glass (COG) method, or by GIP It is implemented as a (Gate In Panel) type and can be directly disposed on the flexible display panel 110 .

In addition, it may be integrated and disposed on the flexible display panel 110 or may be implemented in a chip on film (COF) method mounted on a film connected to the flexible display panel 110 .

When a specific gate line GL is opened, the data driver 130 converts the image data received from the controller 140 into an analog data voltage and supplies it to the plurality of data lines DL, thereby reducing the number of data lines DL. drive

The data driver 130 may include at least one source driver integrated circuit to drive a plurality of data lines DL.

Each source driver integrated circuit is connected to a bonding pad of the flexible display panel 110 by a tape automated bonding (TAB) method or a chip on glass (COG) method, or It may be directly disposed on the display panel 110 or may be integrated and disposed on the flexible display panel 110 .

In addition, each source driver integrated circuit may be implemented in a Chip On Film (COF) method. In this case, one end of each source driver integrated circuit is bonded to at least one source printed circuit board, and the other end is bonded to the flexible display panel 110 .

The controller 140 generates various timing signals including a vertical sync signal (Vsync), a horizontal sync signal (Hsync), an input data enable (DE) signal, and a clock signal (CLK) together with the input image data. Receive from outside (e.g. host system).

The controller 140 converts the input video data input from the outside to suit the data signal format used by the data driver 130 and outputs the converted video data, as well as the gate driver 120 and the data driver 130. In order to control the gate driver ( 120) and the data driver 130.

For example, in order to control the gate driver 120, the controller 140 includes a gate start pulse (GSP), a gate shift clock (GSC), and a gate output enable signal (GOE: It outputs various gate control signals (GCS: Gate Control Signal) including Gate Output Enable).

Here, the gate start pulse GSP controls the operation start timing of one or more gate driver integrated circuits constituting the gate driver 120 . The gate shift clock (GSC) is a clock signal commonly input to one or more gate driver integrated circuits, and controls the shift timing of the gate signal. The gate output enable signal GOE specifies timing information of one or more gate driver integrated circuits.

In addition, the controller 140, in order to control the data driver 130, a source start pulse (SSP: Source Start Pulse), a source sampling clock (SSC: Source Sampling Clock), a source output enable signal (SOE: Source Output It outputs various data control signals (DCS) including Enable) and the like.

Here, the source start pulse SSP controls data sampling start timing of one or more source driver integrated circuits constituting the data driver 130 . The source sampling clock (SSC) is a clock signal that controls sampling timing of data in each source driver integrated circuit. The source output enable signal SOE controls output timing of the data driver 130 .

The controller 140 is a source printed circuit board to which the source driver integrated circuit is bonded and a control printed circuit board connected through a connection medium such as a flexible flat cable (FFC) or a flexible printed circuit (FPC). (Control Printed Circuit Board).

The control printed circuit board further includes a power controller (not shown) that supplies various voltages or currents to the flexible display panel 110, the gate driver 120, and the data driver 130 or controls various voltages or currents to be supplied. can be placed. Such a power controller is also referred to as a power management IC.

The plurality of pixels 200 are disposed in an area where the gate line GL and the data line DL intersect, and data is output from the data driver 130 when a gate signal is output by the gate driver 120. It receives voltage and displays an image.

2 illustrates an example of a structure in which the flexible display panel 110 and the gate driver 120 or the data driver 130 are connected in the flexible display device 100 according to the present embodiments.

Referring to FIG. 2 , in the flexible display device 100 according to the present embodiments, the flexible display panel 110 is divided into a display area 111 displaying an image and a non-display area 112 not displaying an image. can

A plurality of gate lines GL and a plurality of data lines DL are disposed in the display area 111 , and a pixel 200 is disposed in an area where the gate lines GL and data lines DL intersect.

In the non-display area 112 , a pad unit connected to the gate driver 120 driving the plurality of gate lines GL or the data driver 130 driving the plurality of data lines DL may be disposed.

The gate driver 120 or the data driver 130 is disposed at one end of the flexible display panel 110, and the driver integrated circuit 151 such as a plurality of gate driver integrated circuits or a plurality of data driver integrated circuits and a flexible printed circuit A substrate 152 may be included.

One end of the driver integrated circuit 151 may be bonded to a pad portion located in the non-display area 112 of the flexible display panel 110, and the other end may be bonded to the flexible printed circuit board 152.

The driver IC 131 may be disposed on only one side of the flexible display panel 110 as shown in FIG. 2 , but may be disposed on both sides of the flexible display panel 110 .

In addition, although FIG. 2 shows only one arrangement structure of the driver integrated circuits 151 included in the gate driver 120 and the data driver 130, a plurality of driver integrated circuits 151 included in other drivers are also shown. The same structure may be disposed on one side or both sides of the flexible display panel 110 .

Hereinafter, a connection structure between the flexible display panel 110 and the driver integrated circuit 151 will be described in detail with reference to FIG. 3 .

FIG. 3 shows an example of a connection structure between the flexible display panel 110 and the driver integrated circuit 151 in the flexible display device 100 according to the present embodiments, and is a cross-sectional view of part 300 of FIG. 2 .

Referring to FIG. 3 , a flexible substrate 302 is disposed on glass 301 (carrier glass).

The flexible substrate 302 may be formed by coating a plastic material on glass, and for example, polyimide may be used.

Also, although not shown in FIG. 3 , a release layer (a-Si) for laser release may be further included between the glass 301 and the flexible substrate 302 .

An insulating layer (not shown) such as SiNx may be disposed on the flexible substrate 302 and a pixel layer 303 may be disposed on the insulating layer.

The pixel layer 303 may include a plurality of gate lines GL, a plurality of data lines DL, thin film transistors (TFTs), pixel electrodes, etc. disposed to cross each other.

In addition, a light emitting material layer such as an organic light emitting diode (OLED) may be formed using a laminating method.

Although an organic light emitting diode (OLED) is illustrated in FIG. 3, other light emitting material layers such as an electrophoretic film may be used.

In the non-display area 112 on the flexible substrate 302 where the pixel layer 303 is not disposed, a pad portion 304 for bonding with the driver integrated circuit 151 may be disposed.

In the process of bonding the driver integrated circuit 151 to the flexible display panel 110, the anisotropic conductive film 306 is placed on the pad part 304, and the driver integrated circuit 151 is placed on the anisotropic conductive film 306. to place

In addition, the anisotropic conductive film 306 is compressed and cured by applying heat and pressure using the bonding tool 308 so that the driver integrated circuit 151 is bonded to the pad portion 304 of the flexible display panel 110 .

Meanwhile, when the formation of each layer of the flexible display panel 110 is completed, the glass 301 is separated from the flexible substrate 302 by irradiating a laser to the rear surface of the glass 301 .

When a laser is irradiated to the rear surface of the glass 301, a gas is generated in the release layer (a-Si) disposed between the glass 301 and the flexible substrate 302 by the irradiated laser light, and the gas causes the glass to 301 is separated from the flexible substrate 302.

At this time, when the laser release of the flexible display panel 110 is performed, the energy density of the portion where the driver integrated circuit 151 bonded by heat and pressure is located is the display area 111 of the flexible display panel 110. ) is higher than

This causes defects in the laser release process for the flexible display panel 110 .

In order to solve this problem, as shown in FIGS. 4A and 4B, the laser release process for the display area 111 of the flexible display panel 110 and the non-display process where the pad part 304 is disposed are performed. The laser release process for region 112 can be performed in two stages.

That is, as shown in FIG. 4A, the laser release process is performed on the display area 111 of the flexible display panel 110, and the display area 111 is masked as shown in FIG. 4B. A laser release process may be performed on the non-display area 112 where the pad part 304 is disposed.

However, a large amount of ash may be generated by the two-step laser release process, which may cause driving defects.

In addition, in the above-described examples, there is a problem in that the driver integrated circuit 131 is bonded to the side of the flexible display panel 110 so that the bonded portion is highly likely to be damaged and the bezel of the flexible display panel 110 is widened.

The present embodiments reduce defects of the flexible display panel 110 according to the aforementioned laser release process and provide a flexible display panel 110 having a structure capable of realizing a narrow bezel and a flexible display device 100 including the same do.

Hereinafter, the structure and manufacturing process of the flexible display panel 110 capable of reducing defects due to the above-described laser release process and realizing a narrow bezel will be described.

5A and 5B are plan views illustrating the flexible display panel 110 according to the present embodiments. FIG. 5A shows the front side of the flexible display panel 110, and FIG. 5B shows the back side of the flexible display panel 110. it is shown

Referring to FIG. 5A , the flexible display panel 110 according to the present embodiments includes a display area 111 on which an image is displayed and a non-display area 112 on which an image is not displayed.

In the display area 111, a pixel layer 303 composed of a light emitting material layer such as a thin film transistor (TFT) or an organic light emitting diode (OLED) is disposed, and the gate driver 120 and the data driver 130 are driven. display the video accordingly.

The non-display area 112 is located around the display area 111 and includes a pad portion 304 to which the driver integrated circuit 151 and the like are bonded.

As shown in FIG. 5A, in the flexible display panel 110 according to the present embodiments, a driver integrated circuit 151 such as a gate driver integrated circuit or a source driver integrated circuit is not disposed on the side of the flexible display panel 110. don't

5B shows the rear side of the flexible display panel 110 according to the present embodiments. Referring to FIG. 5B, the driver integrated circuit 151 and the flexible printed circuit board 132 are shown on the rear side of the flexible display panel 110. this is placed

Although FIG. 5B shows a case in which one of the gate driver IC and the source driver IC is disposed as an example, another driver IC 151 may also be disposed on the rear surface of the flexible display panel 110 with the same structure. .

As shown in FIG. 5B, in the flexible display panel 110 according to the present embodiments, the driver integrated circuit 131 and the flexible printed circuit board 132 are disposed on the rear side of the flexible display panel 110, and the flexible display It is bonded to the pad part 304 through a via hole (not shown) located in the non-display area 112 of the panel 110 .

That is, in the flexible display panel 110 according to the present embodiments, the driver integrated circuit 151 is not bonded to the side surface of the flexible display panel 110, and a via hole is formed in the non-display area 112 of the flexible display panel 110. is formed and the driver integrated circuit 151 or the like can be bonded through the via hole.

By allowing the driver IC 151 to be bonded through the via hole located in the non-display area 112 of the flexible display panel 110, the laser release It helps to reduce the defects that occur in the process.

In addition, by arranging the gate driver integrated circuit or the source driver integrated circuit on the rear side of the flexible display panel 110, damage to the connection portion is prevented compared to the case where the driver integrated circuit 151 is disposed on the side of the flexible display panel 110. and to realize a narrow bezel.

FIG. 6 shows a cross-section of a connection structure between the flexible display panel 110 and the driver integrated circuit 151 in the flexible display panel 110 according to the present exemplary embodiments shown in FIG. is indicated by

Referring to FIG. 6 , a pixel layer 303 including a thin film transistor (TFT) and an organic light emitting diode (OLED) is disposed in the display area 111 on the flexible substrate 302 . A pad part 304 is disposed in the non-display area 112 on the flexible substrate 302 .

As shown in FIG. 6 , in the flexible display panel 110 according to the present exemplary embodiments, a via hole 601 is positioned in the non-display area 112 of the flexible substrate 302 .

In addition, a via hole 602 having the same diameter as the via hole 601 of the flexible substrate 302 is formed at a portion of the pad portion 304 disposed on the flexible substrate 302 that is in contact with the via hole 601 of the flexible substrate 302. ) is located.

In this case, the depth of the via hole 602 located in the pad part 304 may be smaller than the thickness of the pad part 304 .

The flexible substrate 302 and the pad portion 304 may be bonded to each other through a via hole 601 positioned in the non-display area 112 of the flexible substrate 302 and a via hole 602 positioned in the pad portion 304. there is.

A driver integrated circuit 151 such as a gate driver integrated circuit or a source driver integrated circuit is disposed on the rear surface of the flexible substrate 302 .

The driver integrated circuit 151 includes a via hole 603 at a position in contact with the via hole 601 included in the flexible substrate 302 .

The via hole 603 included in the driver IC 151 may have the same diameter as the diameter of the via hole 601 included in the flexible substrate 301, and may have a length smaller than the thickness of the driver IC 151. there is.

The via hole 601 located on the flexible substrate 302, the via hole 602 located on the pad part 304, and the via hole 603 located on the driver integrated circuit 151 may be filled with a metal material.

Therefore, the driver integrated circuit 151 passes through the via hole 601 of the flexible substrate 302, the via hole 602 of the pad part 304, and the via hole 603 of the driver integrated circuit 151. ) can be combined with

That is, the driver integrated circuit 151 can be bonded to the rear surface of the flexible substrate 302 rather than the side surface by the via hole 601 located in the non-display area 112 of the flexible substrate 302 .

By bonding the driver IC 151 through the via hole 601 of the flexible substrate 302, a laser release process of separating the glass 301 is performed, and then a process of bonding the driver IC 151 and the like is performed.

Therefore, unlike the method of bonding the driver integrated circuit 151 by applying heat and pressure, defects that occur during the laser release process are prevented from occurring.

Meanwhile, a flexible printed circuit board 152 may be disposed on the rear surface of the driver integrated circuit 151, and the driver integrated circuit 151 and the flexible printed circuit board 152 may be electrically connected through junctions 701 and 702. can

In this case, the driver integrated circuit 151 and the flexible printed circuit board 152 may be disposed from the outer surface of the flexible board 302 toward the inside.

That is, the driver integrated circuit 151 and the flexible printed circuit board 152 are disposed on the rear surface (rear surface) of the flexible substrate 302 and disposed in the inner direction of the flexible substrate 302, so that the side surface of the flexible substrate 302 Compared to the case where the driver integrated circuit 151 and the flexible printed circuit board 152 are disposed, a narrower bezel can be realized.

FIG. 7 shows a plane of the pad unit 304 in the flexible display panel 110 shown in FIG. 6, and shows a portion 700 of FIG.

Referring to FIG. 7 , the pad part 304 disposed in the non-display area 112 of the flexible display panel 110 includes a via hole 602 at a position where a signal wire is disposed.

The via hole 602 included in the pad portion 304 is bonded to the via hole 601 included in the flexible substrate 302, and the via hole 601 of the flexible substrate 302 and the via hole 602 of the pad portion 304 A metal material may be filled in.

Similarly, a metal material may be filled in the via hole 603 of the driver integrated circuit 151 disposed on the rear surface of the flexible substrate 302 .

Therefore, the via hole 602 of the driver integrated circuit 151 and the pad part 304 disposed on the rear surface of the flexible substrate 302, the via hole 601 of the flexible substrate 302, and the via hole of the driver integrated circuit 151 It can be electrically connected through the metal material filled in 603.

FIG. 8 shows another example of a connection structure between the flexible substrate 302 and the driver integrated circuit 151 in the flexible display panel 110 according to the present embodiments, and specifically shows another example of part 600 of FIG. 5B. it is a cross section

Referring to FIG. 8 , a pixel layer 303 including thin film transistors (TFTs) and organic light emitting diodes (OLEDs) is disposed in the display area 111 of the flexible substrate 302, and in the non-display area 112 A pad portion 304 is disposed.

Via holes 601 and 602 are formed in the flexible substrate 302 and the pad part 304 so as to contact each other, and on the rear surface of the flexible substrate 302, a via hole 603 is formed at a position in contact with the via hole 601 of the flexible substrate 302. A driver integrated circuit 151 including ) is bonded.

The via hole 601 of the flexible substrate 302, the via hole 602 of the pad part 304, and the via hole 603 of the driver integrated circuit 151 are filled with a metal material.

Accordingly, the driver integrated circuit 151 is electrically connected to the pad part 304 through metal materials filled in the respective via holes 601 , 602 , and 603 .

A flexible printed circuit board 152 may be disposed on the rear surface of the driver integrated circuit 151 .

In this case, the driver integrated circuit 151 and the flexible printed circuit board 152 may be electrically connected to each other through another via hole 604 disposed apart from the via hole 603 included in the driver integrated circuit 151 .

That is, the driver integrated circuit 151 and the flexible printed circuit board 152 may be electrically connected through junctions 701 and 702, but via holes, like the way in which the driver integrated circuit 151 and the flexible board 302 are connected. 604 may be connected.

The via hole 604 connecting the driver integrated circuit 151 and the flexible printed circuit board 152 is disposed so that the driver integrated circuit 151 is spaced apart from the via hole 603 connected to the flexible board 302, so that the driver integrated circuit 151 The driver integrated circuit 151 and the flexible printed circuit board 152 can be connected to each other without affecting the bonding between the circuit 151 and the flexible board 302 .

The driver integrated circuit 151 and the flexible printed circuit board 152 may be disposed from an outer surface of the flexible substrate 302 to an inward direction, thereby enabling the flexible display panel 110 to have a thin bezel.

9A and 9B show an example of a manufacturing process in the case of bonding the driver integrated circuit 151 through the via hole 601 of the flexible substrate 302 according to the present embodiments.

Referring to FIG. 9A , a laser release process is performed in a state where the driver integrated circuit 151 or the flexible printed circuit board 152 is not bonded to the flexible display panel 110 .

The glass 301 located on the rear surface of the flexible substrate 302 is separated by the laser release process.

When the glass 301 is separated from the flexible substrate 302, via holes 601 and 602 are formed in the flexible substrate 302 and the pad part 304, and the via holes 601 and 602 are filled with a metal material.

At this time, the glass 301 may be separated by forming the via holes 601 and 602 before separating the glass 301 and then performing a laser release process.

A process of bonding the driver integrated circuit 151 and the flexible printed circuit board 152 to the rear surface of the flexible substrate 302 when the metal filling is completed in the via holes 601 and 602 of the flexible substrate 302 and the pad portion 304 do

9B shows a structure in which the driver integrated circuit 151 and the flexible printed circuit board 152 are attached to the rear surface of the flexible board 302 .

When the glass 301 is separated from the flexible substrate 302 and the metal material is filled in the via hole 601 of the flexible substrate 302, the metal material is filled in the via hole 603 of the driver integrated circuit 151 and the flexible substrate ( 302).

A flexible printed circuit board 152 is bonded to the rear surface of the driver integrated circuit 151, and the driver integrated circuit 151 and the flexible printed circuit board 152 are electrically connected through junctions 701 and 702 or via other via holes ( 604) can be electrically connected.

Accordingly, according to the present exemplary embodiments, the via hole 601 is formed in the flexible display panel 110 and the driver integrated circuit 151 can be bonded through the via hole 601 .

Through this, a process of bonding the driver integrated circuit 151 can be performed after the laser release process for the flexible display panel 110, and defects due to the laser release process can be prevented from occurring.

10A to 10D are views specifically illustrating examples of a manufacturing process of the flexible display panel 110 according to the present embodiments.

Referring to FIG. 10A , a flexible substrate 302 made of polyimide or the like is disposed on glass 301 .

On the upper surface of the flexible substrate 302, a pixel layer 303 such as a thin film transistor (TFT) or organic light emitting diode (OLED) is disposed in the display area 111, and a driver integrated circuit 151 is disposed in the non-display area 112. and a pad portion 304 for bonding is disposed.

Referring to FIG. 10B , when the formation of the layer on the flexible substrate 302 is completed, the glass 301 is separated from the flexible substrate 302 through a laser release process in which a laser is irradiated to the rear surface of the glass 301 .

Referring to FIG. 10C , when the glass 301 is separated from the flexible substrate 302 , via holes 601 and 602 connected to each other are formed between the flexible substrate 302 and the pad portion 304 .

The via hole 601 of the flexible substrate 302 and the via hole 602 of the pad part 304 are filled with a metal material.

Referring to FIG. 10D, when via holes 601 and 602 are formed in the flexible substrate 302 and the pad portion 304 and filled with a metal material, the driver integrated circuit 151 and the like are placed on the rear surface of the flexible substrate 302. join to

In the driver integrated circuit 151, a via hole 603 is formed at a portion of the flexible substrate 302 in contact with the via hole 601, and the formed via hole 603 is filled with a metal material.

Therefore, the pad part 304 and the driver IC 151 are formed by the via hole 602 of the pad part 304, the via hole 601 of the flexible substrate 302, and the via hole 603 of the driver IC 151. to be able to connect.

The flexible printed circuit board 152 is bonded to the rear surface of the driver integrated circuit 151, and the via hole 603 and other via holes ( 604).

11A to 11D show another example of a manufacturing process of the flexible display panel 110 according to the present embodiments, in which a via hole 601 is formed in the flexible substrate 302 before a laser release process. .

Referring to FIG. 11A , a flexible substrate 302 is disposed on a glass 301 , and a pixel layer 303 and a pad portion 304 are disposed on the flexible substrate 302 .

Referring to FIG. 11B, in a state in which glass 301 is attached to the flexible substrate 302, via holes 601 and 602 are formed in the flexible substrate 302 and the pad portion 304, and the formed via holes 601 and 602 to fill with metal material.

Referring to FIG. 11C , the formation of via holes 601 and 602 in the flexible substrate 302 and the pad portion 304 is completed, and laser is irradiated on the rear surface of the glass 301 to form the flexible substrate 302. ) is separated from

That is, the order of the laser release process and the process of forming the via hole 601 on the flexible substrate 302 may be different, and the present embodiments are capable of separating the laser release process and the driver integrated circuit 151 bonding process. The point has a feature.

Referring to FIG. 11D, when the glass 301 is separated from the flexible substrate 302, a driver integrated circuit 151 and a flexible printed circuit board 152 are attached to the rear surface of the flexible substrate 302 to form a flexible display panel ( 110) is completed.

According to the present embodiments, a via hole 601 is formed in the non-display area 112 of the flexible substrate 302, and the driver integrated circuit 151 and the pad located in the non-display area 112 are connected through the formed via hole 601. Allow section 304 to be connected.

By connecting the driver IC 151 with this structure, it is possible to bond the driver IC 151 after the laser release process of separating the glass 301 from the flexible substrate 302, thereby reducing defects that occur during the laser release process. make it possible to reduce

In addition, the driver integrated circuit 151 and the flexible printed circuit board 152 are connected to the flexible substrate 302 by connecting the pad unit 304 and the driver integrated circuit 151 through the via hole 601 formed in the flexible substrate 302. so that it can be placed on the back (back) of the

At this time, by disposing the driver integrated circuit 151 and the flexible printed circuit board 152 inward from the outer surface of the flexible substrate 302, the width of the side of the flexible display panel 110 is reduced and a narrow bezel is realized. The flexible display panel 110 and the flexible display device 100 can be provided.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. In addition, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, so the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: flexible display device 110: flexible display panel
111: display area 112: non-display area
120: gate driver 130: data driver
140: controller
151: driver integrated circuit 152: flexible printed circuit board
601, 602, 603, 604: via hole 701, 702: junction

Claims (12)

a flexible substrate including a display area and a non-display area and including a first via hole located in the non-display area;
a pad part disposed in the non-display area on the upper surface of the flexible substrate and including a second via hole at a position in contact with the first via hole; and
A driver integrated circuit located on the rear surface of the flexible substrate and including a third via hole at a position in contact with the first via hole.
A flexible display panel comprising a.
According to claim 1,
The first via hole included in the flexible substrate penetrates the flexible display panel.
According to claim 1,
The second via hole included in the pad part has a diameter identical to that of the first via hole and a depth less than a thickness of the pad part.
According to claim 1,
The third via hole included in the driver integrated circuit has the same diameter as the first via hole and has a depth smaller than the thickness of the driver integrated circuit.
According to claim 1,
The flexible display panel further includes a flexible printed circuit board positioned on a rear surface of the driver integrated circuit and bonded to the driver integrated circuit.
According to claim 5,
The flexible display panel of claim 1 , wherein the driver integrated circuit and the flexible printed circuit board are bonded to each other by another via hole spaced apart from the third via hole.
According to claim 5,
The flexible display panel of claim 1 , wherein the driver integrated circuit and the flexible printed circuit board are disposed in an inward direction from an outer surface of the flexible substrate.
According to claim 1,
The first via hole, the second via hole, and the third via hole are filled with a metal material.
a flexible display panel including a display area and a non-display area and including a via hole located in the non-display area; and
a gate driver integrated circuit and a source driver integrated circuit positioned on a side or rear surface of the flexible display panel;
At least one driver integrated circuit of the gate driver integrated circuit and the source driver integrated circuit is located on the rear surface of the flexible display panel, has another via hole at a position in contact with the via hole included in the flexible display panel, and the via hole and A flexible display device connected to the flexible display panel through the other via hole.
According to claim 9,
The flexible display device further comprises a flexible printed circuit board positioned on a rear surface of the driver integrated circuit located on a rear surface of the flexible display panel and bonded to the driver integrated circuit.
According to claim 10,
The flexible display device of claim 1 , wherein the driver integrated circuit and the flexible printed circuit board are bonded to each other by the via hole to which the flexible display panel and the driver integrated circuit are bonded and another via hole spaced apart from the other via hole.
According to claim 10,
The flexible display device of claim 1 , wherein the driver integrated circuit and the flexible printed circuit board are disposed in an inward direction from an outer surface of the flexible display panel.

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