KR102524174B1 - 연마층용 폴리우레탄, 연마층 및 연마 패드 - Google Patents
연마층용 폴리우레탄, 연마층 및 연마 패드 Download PDFInfo
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B37/00—Lapping machines or devices; Accessories
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- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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- C—CHEMISTRY; METALLURGY
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
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- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
Description
도 2 는, 실시예 1 에서 제조한 연마 패드를 사용하여 CMP-MP-100C 로 8 시간 가속 드레스 시험을 행한 후의 연마 패드의 표면의 주사형 전자 현미경 (SEM) 사진이다.
도 3 은, 비교예 1 에서 제조한 연마 패드를 사용하여 CMP-MP-100C 로 8 시간 가속 드레스 시험을 행한 후의 연마 패드의 표면의 SEM 사진이다.
도 4 는, 실시예 1 에서 제조한 연마 패드를 사용하여 CMP-MP3-DMB101-100E 로 8 시간 가속 드레스 시험을 행한 후의 연마 패드의 표면의 SEM 사진이다.
도 5 는, 비교예 1 에서 제조한 연마 패드를 사용하여 CMP-MP3-DMB101-100E 로 8 시간 가속 드레스 시험을 행한 후의 연마 패드의 표면의 SEM 사진이다.
Claims (16)
- 고분자 디올과 유기 디이소시아네이트와 사슬 신장제를 함유하는 폴리우레탄 원료의 반응물인 열가소성 폴리우레탄으로서,
상기 사슬 신장제는, 탄소수 7 ∼ 12 의 직사슬 탄소 골격을 함유하는 제 1 사슬 신장제를 50 질량% 이상 함유하고,
시차 주사 열량 측정에 의한 DSC 곡선에 있어서, 100 ∼ 160 ℃ 의 범위에서 적어도 1 개의 흡열 피크를 갖는 연마층용 폴리우레탄. - 제 1 항에 있어서,
상기 사슬 신장제는, 상기 제 1 사슬 신장제를 80 질량% 이상 함유하는 연마층용 폴리우레탄. - 제 1 항에 있어서,
상기 사슬 신장제는, 비고리형 화합물만을 함유하는 연마층용 폴리우레탄. - 제 1 항에 있어서,
상기 제 1 사슬 신장제가, 1,7-헵탄디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,10-데칸디올, 및 1,12-도데칸디올로 이루어지는 군에서 선택되는 적어도 1 종의 화합물인 연마층용 폴리우레탄. - 제 1 항에 있어서,
시차 주사 열량 측정에 의한 DSC 곡선에 있어서, 100 ∼ 160 ℃ 의 범위에서 적어도 2 개의 흡열 피크를 갖는 연마층용 폴리우레탄. - 제 1 항에 있어서,
상기 흡열 피크는, 결정화 엔탈피 (ΔH) 의 총량이 10 J/g 이상인 연마층용 폴리우레탄. - 제 5 항에 있어서,
상기 흡열 피크는, 결정화 엔탈피 (ΔH) 의 총량이 10 J/g 이상인 연마층용 폴리우레탄. - 제 1 항에 있어서,
상기 고분자 디올은 수 평균 분자량 600 ∼ 1400 이고, 상기 유기 디이소시아네이트에서 유래하는 4.0 ∼ 6.0 질량% 의 질소를 함유하는 연마층용 폴리우레탄. - 제 1 항에 있어서,
두께 0.5 ㎜ 의 시트에 있어서, 660 ㎚ 의 레이저 파장에 대한 레이저 투과율이 70 % 이상인 연마층용 폴리우레탄. - 제 1 항에 있어서,
두께 0.3 ㎜ 의 시트에 있어서, 하기 식 : (1)
A/B × 100 …… (1)
(A 는 50 ℃ 의 온수로 포화 팽윤시킨 후의 21 ℃ 에 있어서의 저장 탄성률, B 는 물로 팽윤시키지 않았을 때의 21 ℃ 에 있어서의 저장 탄성률)
로부터 산출되는, 저장 탄성률의 수 포화 팽윤시 유지율이 55 % 이상인 연마층용 폴리우레탄. - 제 1 항에 있어서,
두께 0.3 ㎜ 의 시트에 있어서, 21 ℃ 에 있어서의 저장 탄성률 E'21 과 80 ℃ 에 있어서의 저장 탄성률 E'80 의 비율 (E'21/E'80) 이, 10 이하인 연마층용 폴리우레탄. - 제 1 항에 있어서,
두께 2 ㎜ 의 시트에 있어서, JIS-D 경도가 50 ∼ 70 인 연마층용 폴리우레탄. - 제 1 항 내지 제 12 항 중 어느 한 항에 기재된 연마층용 폴리우레탄의 성형체인 연마층.
- 제 13 항에 있어서,
비발포 성형체인 연마층. - 제 13 항에 기재된 연마층을 구비하는 연마 패드.
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2018152144 | 2018-08-11 | ||
JPJP-P-2018-152144 | 2018-08-11 | ||
PCT/JP2019/028384 WO2020036038A1 (ja) | 2018-08-11 | 2019-07-19 | 研磨層用ポリウレタン、研磨層及び研磨パッド |
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KR20210021056A KR20210021056A (ko) | 2021-02-24 |
KR102524174B1 true KR102524174B1 (ko) | 2023-04-20 |
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US (1) | US12344702B2 (ko) |
EP (1) | EP3834987A4 (ko) |
JP (1) | JP6993513B2 (ko) |
KR (1) | KR102524174B1 (ko) |
CN (1) | CN112423933B (ko) |
SG (1) | SG11202100506RA (ko) |
TW (2) | TWI786029B (ko) |
WO (1) | WO2020036038A1 (ko) |
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JP7545225B2 (ja) | 2020-03-25 | 2024-09-04 | 株式会社タムラ製作所 | 伸び特性と透湿性を備えた硬化物の得られるフィルム用組成物、フィルム用組成物の硬化物であるフィルム、及びフィルムを使用した皮膚への貼付型センサデバイス |
KR20240087742A (ko) | 2021-09-30 | 2024-06-19 | 주식회사 쿠라레 | 연마층용 열가소성 폴리우레탄, 연마층, 및 연마 패드 |
CN116082600A (zh) * | 2022-12-30 | 2023-05-09 | 上海汇得科技股份有限公司 | 一种化学机械研磨用聚氨酯抛光垫基材及其制备方法 |
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WO2017054433A1 (zh) | 2015-09-30 | 2017-04-06 | 圆容生物医药无锡有限公司 | 弹性模量可调的聚氨酯组合物、支架复合物及其制备方法 |
WO2018021428A1 (ja) | 2016-07-29 | 2018-02-01 | 株式会社クラレ | 研磨パッドおよびそれを用いた研磨方法 |
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JP5193595B2 (ja) | 2005-09-22 | 2013-05-08 | 株式会社クラレ | 高分子材料、それから得られる発泡体及びこれらを用いた研磨パッド |
JP2007091898A (ja) * | 2005-09-29 | 2007-04-12 | Kuraray Co Ltd | 樹脂発泡体及びこれを用いた研磨パッド |
US8308527B2 (en) * | 2007-03-20 | 2012-11-13 | Kuraray Co., Ltd. | Metal film polishing pad and method for polishing metal film using the same |
MX305377B (es) * | 2008-01-24 | 2012-11-16 | Lubrizol Advanced Mat Inc | Composicion de elastomero termoplastico blanda. |
EP2444433A4 (en) | 2009-06-18 | 2014-06-11 | Jsr Corp | POLYURETHANE, COMPOSITION FOR THE FORMATION OF POLISHING LAYERS THEREFOR, CLOTH FOR CHEMICAL-MECHANICAL CLEANING AND CHEMICAL-MECHANICAL CLEANING PROCESS THEREWITH |
US9156125B2 (en) * | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
JP5997973B2 (ja) | 2012-08-14 | 2016-09-28 | 株式会社クラレ | 金属膜研磨用パッドおよびそれを用いた研磨方法 |
JP6184856B2 (ja) * | 2013-12-16 | 2017-08-23 | 株式会社クラレ | 研磨パッドの製造方法および該研磨パッドを用いる研磨方法 |
CN107073678B (zh) * | 2014-10-31 | 2019-11-19 | 株式会社可乐丽 | 抛光层用非多孔性成型体、抛光垫及抛光方法 |
EP3225357B1 (en) | 2014-11-28 | 2019-10-30 | Kuraray Co., Ltd. | Polishing-layer molded body, and polishing pad |
JP2018029142A (ja) * | 2016-08-18 | 2018-02-22 | 株式会社クラレ | 研磨パッド及びそれを用いた研磨方法 |
EP3623402A4 (en) | 2017-05-12 | 2021-06-23 | Kuraray Co., Ltd. | CHAIN EXTENSION, POLYURETHANE AND ITS MODIFICATION PROCESS, POLISHING LAYER, POLISHING PAD AND POLISHING PROCESS |
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WO2017054433A1 (zh) | 2015-09-30 | 2017-04-06 | 圆容生物医药无锡有限公司 | 弹性模量可调的聚氨酯组合物、支架复合物及其制备方法 |
WO2018021428A1 (ja) | 2016-07-29 | 2018-02-01 | 株式会社クラレ | 研磨パッドおよびそれを用いた研磨方法 |
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JPWO2020036038A1 (ja) | 2021-08-10 |
TW202014446A (zh) | 2020-04-16 |
CN112423933A (zh) | 2021-02-26 |
WO2020036038A1 (ja) | 2020-02-20 |
JP6993513B2 (ja) | 2022-01-13 |
TWI786029B (zh) | 2022-12-01 |
EP3834987A4 (en) | 2022-05-04 |
CN112423933B (zh) | 2023-02-17 |
US20210309794A1 (en) | 2021-10-07 |
TW202241982A (zh) | 2022-11-01 |
KR20210021056A (ko) | 2021-02-24 |
SG11202100506RA (en) | 2021-02-25 |
US12344702B2 (en) | 2025-07-01 |
EP3834987A1 (en) | 2021-06-16 |
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