KR102522215B1 - 에폭시-아크릴계 하이브리드 접착제 - Google Patents
에폭시-아크릴계 하이브리드 접착제 Download PDFInfo
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- KR102522215B1 KR102522215B1 KR1020197026463A KR20197026463A KR102522215B1 KR 102522215 B1 KR102522215 B1 KR 102522215B1 KR 1020197026463 A KR1020197026463 A KR 1020197026463A KR 20197026463 A KR20197026463 A KR 20197026463A KR 102522215 B1 KR102522215 B1 KR 102522215B1
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- acrylate
- adhesive
- acid
- epoxy
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 55
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 claims description 36
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- 239000003822 epoxy resin Substances 0.000 claims description 33
- 239000004814 polyurethane Substances 0.000 claims description 20
- 229920002635 polyurethane Polymers 0.000 claims description 20
- 150000003077 polyols Chemical class 0.000 claims description 16
- 229920005862 polyol Polymers 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 13
- 239000012948 isocyanate Substances 0.000 claims description 12
- 150000002513 isocyanates Chemical class 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 239000007800 oxidant agent Substances 0.000 claims description 8
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 7
- 150000001733 carboxylic acid esters Chemical class 0.000 claims description 7
- 229920000578 graft copolymer Polymers 0.000 claims description 7
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- 239000003381 stabilizer Substances 0.000 claims description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 6
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 150000005690 diesters Chemical class 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 125000000746 allylic group Chemical group 0.000 claims description 2
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- 239000005060 rubber Substances 0.000 abstract description 9
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 abstract description 7
- 230000001747 exhibiting effect Effects 0.000 abstract 1
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- 239000011347 resin Substances 0.000 description 12
- -1 β-methacryloyloxyethyl Chemical group 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
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- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
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- 238000002156 mixing Methods 0.000 description 7
- 150000008442 polyphenolic compounds Chemical class 0.000 description 7
- 239000004322 Butylated hydroxytoluene Substances 0.000 description 6
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical group CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
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- 150000002118 epoxides Chemical group 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000010456 wollastonite Substances 0.000 description 4
- 229910052882 wollastonite Inorganic materials 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
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- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DFPOZTRSOAQFIK-UHFFFAOYSA-N S,S-dimethyl-beta-propiothetin Chemical compound C[S+](C)CCC([O-])=O DFPOZTRSOAQFIK-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 239000003701 inert diluent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
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- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
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- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
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- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
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- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
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- 150000001735 carboxylic acids Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
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- 239000008358 core component Substances 0.000 description 2
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- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
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- NNGWQDJJNIZSPK-UHFFFAOYSA-N (3-amino-3-hydroxy-1-phosphonopropyl)phosphonic acid Chemical compound NC(O)CC(P(O)(O)=O)P(O)(O)=O NNGWQDJJNIZSPK-UHFFFAOYSA-N 0.000 description 1
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- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 1
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
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- STHCTMWQPJVCGN-UHFFFAOYSA-N 2-[[2-[1,1,2-tris[2-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1CC(C=1C(=CC=CC=1)OCC1OC1)(C=1C(=CC=CC=1)OCC1OC1)C1=CC=CC=C1OCC1CO1 STHCTMWQPJVCGN-UHFFFAOYSA-N 0.000 description 1
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- OGWZVZSVQQBXJD-UHFFFAOYSA-N 2-[ethoxy(hydroxy)phosphoryl]oxyethyl 2-methylprop-2-enoate Chemical compound CCOP(O)(=O)OCCOC(=O)C(C)=C OGWZVZSVQQBXJD-UHFFFAOYSA-N 0.000 description 1
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- DLRWTPMKTXWFNM-UHFFFAOYSA-N 2-[hydroxy(2-methylpropoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound CC(C)COP(O)(=O)OCCOC(=O)C=C DLRWTPMKTXWFNM-UHFFFAOYSA-N 0.000 description 1
- WAJJFPMYKWCDNI-UHFFFAOYSA-N 2-[hydroxy(2-prop-2-enoyloxyethoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OCCOC(=O)C=C WAJJFPMYKWCDNI-UHFFFAOYSA-N 0.000 description 1
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- SILWEVCKWYUWDG-UHFFFAOYSA-N 2-[hydroxy(octan-3-yloxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound CCCCCC(CC)OP(O)(=O)OCCOC(=O)C=C SILWEVCKWYUWDG-UHFFFAOYSA-N 0.000 description 1
- PMNWMMSRPJZCRM-UHFFFAOYSA-N 2-[hydroxy(propoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound CCCOP(O)(=O)OCCOC(=O)C=C PMNWMMSRPJZCRM-UHFFFAOYSA-N 0.000 description 1
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- ONPJWQSDZCGSQM-UHFFFAOYSA-N 2-phenylprop-2-enoic acid Chemical compound OC(=O)C(=C)C1=CC=CC=C1 ONPJWQSDZCGSQM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
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- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
비교예 A | 비교예 B | 실시예 1 | |
A-면 | 중량% | 중량% | 중량% |
MMA | 53.0 | 58.0 | 48.0 |
CN9009 | 2.5 | 15.0 | 15.0 |
CN9782 | 2.5 | 15.0 | 15.0 |
MBS | 30.0 | 0.0 | 10 |
MMA | 2.5 | 2.5 | 2.5 |
DMPT | 2.5 | 2.5 | 2.5 |
QM 1326AP | 3.0 | 3.0 | 3.0 |
TS720 | 4.0 | 4.0 | 4.0 |
합계 | 100.00 | 100.00 | 100.00 |
B-면 | |||
AFR40 | 7.5 | 7.5 | 7.5 |
TS720 | 1.00 | 1.00 | 1.00 |
월라스토나이트 | 46.25 | 46.25 | 46.25 |
D.E.R. 331 | 45.00 | 45.00 | 45.00 |
BHT | 0.25 | 0.25 | 0.25 |
합계 | 100.00 | 100.00 | 100.00 |
파괴 모드 | T-박리(pli) | |
비교예 A | CF - 경화되지 않음 | 0 |
비교예 B | TFCF - 느린 경화 | 1.4 |
실시예 1 | CF | 39.7 |
파괴 모드 | T-박리(pli) | |
비교예 A | CF - 경화되지 않음 | 0 |
비교예 B | TFCF/CF - 느린 경화 | 11.9 |
실시예 1 | CF | 51.9 |
Claims (5)
- A-면 및 B-면을 포함하는 2-성분 접착제 조성물로서,
A) 하기를 포함하는 A-면:
i) a) 20℃ 이상의 Tg를 갖는 아크릴레이트-캡핑된 폴리우레탄,
i) b) -20℃ 이하의 Tg를 갖는 아크릴레이트-캡핑된 폴리우레탄,
ii) 코어/쉘 그래프트 공중합체,
iii) 존재하는 비닐 또는 알릴성 불포화 단위가 1개인 포스폰산의 모노에스테르 또는 포스폰산 및 인산의 모노에스테르 및 디에스테르를 갖는 인 화합물,
iv) 올레핀계 불포화 카르복실산,
v) 올레핀계 불포화 카르복실산 에스테르,
및
vi) 환원제
및
B) 하기를 포함하는 B-면:
i) 에폭시 수지
ii) 산화제,
iii) 안정화제,
및
iv) 충전제,를 포함하고,
상기 아크릴레이트-캡핑된 폴리우레탄 A) i) a) 및 A) i) b)는 각각 독립적으로 A-면의 총 중량을 기준으로 5 중량% 이상의 양으로 상기 A-면에 존재하는, 2-성분 접착제 조성물. - 제1항에 있어서,
vii) A-면, B-면 또는 A-면 및 B-면 모두에 레올로지 개질제를 더 포함하는 접착제 조성물. - 제1항에 있어서,
상기 아크릴레이트-캡핑된 폴리우레탄 A) i)은 다작용성 이소시아네이트의 반응이 완료될 때까지 폴리올을 상기 다작용성 이소시아네이트와 반응시켜 예비중합체를 수득하고, 상기 예비중합체를 아크릴레이트기로 캡핑함으로써 수득되는 접착제 조성물. - 제1항에 있어서,
상기 에폭시 수지 B) i)는 액체 에폭시 수지를 포함하는 접착제 조성물. - 하기 단계를 포함하는 두 표면의 접합 방법으로서,
a) 제1항 내지 제4항 중 어느 한 항의 접착제 조성물의 A-면 및 B-면을 조합하여 미경화 접착제를 형성하는 단계;
b) 상기 미경화 접착제를 제1 표면 및 제2 표면과 접촉하도록 도포하는 단계; 및
c) 상기 미경화 접착제를 경화시키는 단계,를 포함하는 접합 방법.
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US201762472905P | 2017-03-17 | 2017-03-17 | |
US62/472,905 | 2017-03-17 | ||
PCT/US2018/015639 WO2018169609A1 (en) | 2017-03-17 | 2018-01-29 | Epoxy-acrylic hybrid adhesive |
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KR102136705B1 (ko) * | 2017-06-02 | 2020-07-22 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
US12054572B2 (en) * | 2018-11-15 | 2024-08-06 | Denka Company Limited | Composition |
EP3835378A1 (en) * | 2019-12-13 | 2021-06-16 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
EP3835386B8 (en) * | 2019-12-13 | 2024-01-10 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
KR20220097640A (ko) | 2020-12-30 | 2022-07-08 | 삼성디스플레이 주식회사 | 수지 조성물 및 수지 조성물로부터 형성된 접착층을 포함하는 표시 장치 |
CN115044342B (zh) * | 2021-03-09 | 2024-03-26 | 3M创新有限公司 | 双组分胶粘剂组合物 |
CN115044303B (zh) * | 2021-03-09 | 2024-06-11 | 3M创新有限公司 | 双组分粘合剂组合物 |
CN114133899B (zh) * | 2021-12-07 | 2023-07-14 | 上海永冠众诚新材料科技(集团)股份有限公司 | 车用环氧-丙烯酸杂化双组分折边胶、其制备方法及使用方法 |
EP4554993A1 (en) * | 2022-07-14 | 2025-05-21 | DDP Specialty Electronic Materials US, LLC | Adhesive composition |
KR20250036806A (ko) * | 2022-07-14 | 2025-03-14 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | 접착제 조성물 |
CN116622320B (zh) * | 2023-07-25 | 2023-10-10 | 广州硅芯材料科技有限公司 | 一种Mini LED屏封装胶膜、制备方法及封装方法 |
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